CN104506154A - Conductive adhesive curing design method for improving frequency stability of quartz crystal resonator - Google Patents
Conductive adhesive curing design method for improving frequency stability of quartz crystal resonator Download PDFInfo
- Publication number
- CN104506154A CN104506154A CN201410755788.7A CN201410755788A CN104506154A CN 104506154 A CN104506154 A CN 104506154A CN 201410755788 A CN201410755788 A CN 201410755788A CN 104506154 A CN104506154 A CN 104506154A
- Authority
- CN
- China
- Prior art keywords
- conducting resinl
- conductive adhesive
- crystal resonator
- quartz crystal
- frequency stability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000010453 quartz Substances 0.000 title claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 title abstract description 13
- 230000001070 adhesive effect Effects 0.000 title abstract description 13
- 238000013461 design Methods 0.000 title abstract description 7
- 230000000694 effects Effects 0.000 claims description 13
- 238000007711 solidification Methods 0.000 claims description 10
- 230000008023 solidification Effects 0.000 claims description 10
- 239000013557 residual solvent Substances 0.000 claims description 8
- 238000000137 annealing Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 230000002045 lasting effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001723 curing Methods 0.000 description 13
- 230000009931 harmful effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to a conductive adhesive curing design method for improving the frequency stability of a quartz crystal resonator. The conductive adhesive curing design method is characterized by comprising the following step of in a quartz crystal resonator manufacturing process, adopting a specially-designed curing temperature curve for conductive adhesive for quartz crystal wafer bonding to realize a purpose of improving the frequency stability of the quartz crystal resonator. A high temperature segment is designed in the conductive adhesive curing temperature curve, so that in comparison with the existing method of adopting the conductive adhesive curing temperature curve, the problem that the frequency of the conventional quartz crystal resonator is unstable as stress between the conductive adhesive and the quartz crystal wafer as well as part of residual components of the conductive adhesive are released in the later stage is effectively solved, and a generalized value for improving the frequency stability of similar products is achieved.
Description
Technical field
The present invention relates to a kind of conducting resinl solidification method for designing improving quartz-crystal resonator frequency stability, belong to components and parts and manufacture field.
Background technology
In quartz-crystal resonator manufacture process, need quartz wafer to be connected with outer base or support conducting resinl, fix to realize quartz wafer and be electrically connected.Conducting resinl is made up of flake silver powder and organic bond, solvent.After conducting resinl has been coated with by assigned position and size, needs that workpiece is put into high temperature tunnel furnace and process has been cured to conducting resinl, with the connection of stable quartz wafer and outer base or support, to have made in conducting resinl solvent evaporates out simultaneously.Find in practice, by the curing that conducting resinl manufacturer is recommended, although above object can be realized, but because curing temperature is not high enough, cause between conducting resinl and quartz wafer, there is larger stress, and residual solvents etc. in conducting resinl, and the harmful effect of stress and remnant confrontation quartz-crystal resonator frequency stability or can with the whole life cycle of quartz-crystal resonator.Design high temperature tunnel furnace conducting resinl curing temperature curve, after making conducting resinl experience primary solidification process, temperature curve has a high temperature to rise to and keeps a lasting platform, play high annealing effect and reduce stress and residual solvents effect in the conducting resinl that thoroughly volatilizees between conducting resinl and quartz wafer, the quartz-crystal resonator that manufactures of conducting resinl curing technology is because of the minimizing of residual solvents in Stress Release between conducting resinl and quartz wafer and conducting resinl thus, quartz-crystal resonator frequency stability be improved significantly.
Summary of the invention
What the present invention proposed is a kind of conducting resinl solidification method for designing improving quartz-crystal resonator frequency stability, its object is to change traditional conducting resinl curing, this method for designing can play high annealing effect and reduce stress and residual solvents effect in the conducting resinl that thoroughly volatilizees between conducting resinl and quartz wafer, quartz-crystal resonator is reduced the harmful effect of its frequency stability because of residual solvents effect in stress between conducting resinl and quartz wafer and conducting resinl, improves product reliability.
Technical solution of the present invention: the conducting resinl solidification method for designing improving quartz-crystal resonator frequency stability, comprises the steps:
1) high temperature tunnel furnace conducting resinl curing temperature curve is designed, after making conducting resinl experience primary solidification process, temperature curve has a high temperature to rise to and keeps a lasting platform, play high annealing effect, reduce stress and residual solvents effect in the conducting resinl that thoroughly volatilizees between conducting resinl and quartz wafer;
2) heating rate risen to according to conducting resinl model clear stipulaties temperature curve high temperature, maximum temperature and high temperature platform duration, the sex change avoiding electric glue experience to exceed it allowing maximum temperature to cause.
Compare conventional conductive adhesive curing method, processing technology does not need other to adjust.Compare the product that conventional conductive adhesive curing method manufactures, using method is the same.
Good effect of the present invention: during the quartz-crystal resonator that the present invention makes uses, when quartz-crystal resonator is subject to temperature shock (as the welding process be welded on circuit) or in later stage work, frequency stabilization can be ensured, ensure that the natural frequency reliability of product, thus the problem that the frequency drift that occurs in these cases of the product solving the manufacture of conventional conductive adhesive curing method is larger.Computer-Assisted Design, Manufacture And Test qualification rate, low scrappage are improved to this series products, and the frequency stability, reliability etc. when guarantee quartz crystal components and parts use all there is the value of popularization.
Accompanying drawing explanation
Fig. 1 is piezoelectric quartz crystal plate point glue schematic diagram.
Fig. 2 is conventional conductive adhesive curing temperature profile.
Fig. 3 is the conducting resinl curing temperature curve chart improved.
Embodiment
Improve the conducting resinl solidification method for designing of quartz-crystal resonator frequency stability, comprise the steps:
1) high temperature tunnel furnace conducting resinl curing temperature curve is designed, after making conducting resinl experience primary solidification process, temperature curve has a high temperature to rise to and keeps a lasting platform, play high annealing effect, reduce stress and residual solvents effect in the conducting resinl that thoroughly volatilizees between conducting resinl and quartz wafer;
2) heating rate risen to according to conducting resinl model clear stipulaties temperature curve high temperature, maximum temperature and high temperature platform duration, the sex change avoiding electric glue experience to exceed it allowing maximum temperature to cause,
The present invention innovates conventional conductive adhesive curing condition, makes the quartz-crystal resonator of this method for designing manufacture obtain changing effective control because conducting resinl solidifies the frequency drift caused.
When designing conducting resinl cure profile, high temperature platform area Design and implementation (containing temperature ramp rate, platform area maximum temperature and duration) can not exceed conducting resinl and bear the limit (the highest bearing temperature of various conducting resinl is variant).
The present invention confirms the design of conducting resinl cure profile and test, and difficulty requires not harsh, is easy to promote, and has significant effect, have the value of popularization to solution quartz-crystal resonator frequency stabilization.
Claims (1)
1. improve the conducting resinl solidification method for designing of quartz-crystal resonator frequency stability, comprise the steps:
1) high temperature tunnel furnace conducting resinl curing temperature curve is designed, after making conducting resinl experience primary solidification process, temperature curve has a high temperature to rise to and keeps a lasting platform, play high annealing effect, reduce stress and residual solvents effect in the conducting resinl that thoroughly volatilizees between conducting resinl and quartz wafer;
2) heating rate risen to according to conducting resinl model clear stipulaties temperature curve high temperature, maximum temperature and high temperature platform duration, the sex change avoiding electric glue experience to exceed it allowing maximum temperature to cause.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755788.7A CN104506154A (en) | 2014-12-11 | 2014-12-11 | Conductive adhesive curing design method for improving frequency stability of quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755788.7A CN104506154A (en) | 2014-12-11 | 2014-12-11 | Conductive adhesive curing design method for improving frequency stability of quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104506154A true CN104506154A (en) | 2015-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410755788.7A Pending CN104506154A (en) | 2014-12-11 | 2014-12-11 | Conductive adhesive curing design method for improving frequency stability of quartz crystal resonator |
Country Status (1)
| Country | Link |
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| CN (1) | CN104506154A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115491133A (en) * | 2022-10-10 | 2022-12-20 | 北京无线电计量测试研究所 | Two-component conductive adhesive curing method and resonator for quartz wafer bonding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090236950A1 (en) * | 2006-10-10 | 2009-09-24 | Nihon Dempa Kogyo Co., Ltd. | Manufacturing method of tuning-fork type quartz crystal resonator |
| CN102832902A (en) * | 2012-09-21 | 2012-12-19 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and processing method thereof |
| CN103078601A (en) * | 2012-12-28 | 2013-05-01 | 北京无线电计量测试研究所 | Metal bonding method for quartz wafer |
| US8572824B2 (en) * | 2002-04-23 | 2013-11-05 | Piedek Technical Laboratory | Method for manufacturing quartz crystal unit and quartz crystal oscillator having the quartz crystal unit |
-
2014
- 2014-12-11 CN CN201410755788.7A patent/CN104506154A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8572824B2 (en) * | 2002-04-23 | 2013-11-05 | Piedek Technical Laboratory | Method for manufacturing quartz crystal unit and quartz crystal oscillator having the quartz crystal unit |
| US20090236950A1 (en) * | 2006-10-10 | 2009-09-24 | Nihon Dempa Kogyo Co., Ltd. | Manufacturing method of tuning-fork type quartz crystal resonator |
| CN102832902A (en) * | 2012-09-21 | 2012-12-19 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and processing method thereof |
| CN103078601A (en) * | 2012-12-28 | 2013-05-01 | 北京无线电计量测试研究所 | Metal bonding method for quartz wafer |
Non-Patent Citations (1)
| Title |
|---|
| 刘运吉等: "固化工艺参数对导电胶导电性的影响", 《电子元件与材料》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115491133A (en) * | 2022-10-10 | 2022-12-20 | 北京无线电计量测试研究所 | Two-component conductive adhesive curing method and resonator for quartz wafer bonding |
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Application publication date: 20150408 |
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