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CN104570239A - Single-fiber multidirection optical component - Google Patents

Single-fiber multidirection optical component Download PDF

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Publication number
CN104570239A
CN104570239A CN201410835041.2A CN201410835041A CN104570239A CN 104570239 A CN104570239 A CN 104570239A CN 201410835041 A CN201410835041 A CN 201410835041A CN 104570239 A CN104570239 A CN 104570239A
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optical
optical fiber
lens
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end lens
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CN104570239B (en
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陈敏
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4278Electrical aspects related to pluggable or demountable opto-electronic or electronic elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本发明公开了一种单纤多向光组件,其包括一侧带有通光孔的壳体、设置在壳体外侧且对准通光孔的光接口部件、固定于壳体内的基座、设置于所述基座上的激光收/发装置和芯片端透镜;所述激光收/发装置为探测器芯片及其辅助电路或激光器芯片及其辅助电路,所述芯片端透镜的光轴与每个所述激光收/发装置同轴设置,所述芯片端透镜之间设有分光元件,所述通光孔与光接口部件同轴设置;所述光接口部件包括光纤端透镜和光纤套筒;所述光纤端透镜位于光纤套筒一端和壳体的通光孔之间;所述分光元件包括分光通道和设置在分光通道内的滤光片;所述基座上设置有通电接口。本发明的优点是耦合效率高、灵敏度高、方便插拔、可多向导光且易于自动化制造。

The invention discloses a single-fiber multi-directional optical component, which comprises a casing with a light hole on one side, an optical interface component arranged outside the casing and aligned with the light hole, a base fixed in the casing, The laser receiving/sending device and the chip-side lens arranged on the base; the laser receiving/sending device is a detector chip and its auxiliary circuit or a laser chip and its auxiliary circuit, and the optical axis of the chip-side lens is in line with the Each of the laser receiving/transmitting devices is coaxially arranged, a light splitting element is arranged between the chip end lenses, and the optical hole is arranged coaxially with the optical interface part; the optical interface part includes a fiber end lens and a fiber sleeve barrel; the fiber end lens is located between one end of the fiber sleeve and the light hole of the casing; the light splitting element includes a light splitting channel and a filter set in the light splitting channel; the base is provided with an electrical interface. The invention has the advantages of high coupling efficiency, high sensitivity, convenient plugging and unplugging, multiple light guides and easy automatic manufacture.

Description

一种单纤多向光组件A single-fiber multi-directional optical component

技术领域 technical field

本发明涉及了一种单纤多向光组件,属于光学元件领域。 The invention relates to a single-fiber multi-directional optical component, which belongs to the field of optical elements.

背景技术 Background technique

根据目前公知的组件构造可知,一般的光组件是将芯片与光学元件进行同轴封装,即TO封装(Transistor-Outline),TO封装与光纤进行耦合,利用金属部件,通过激光焊接或胶粘,将TO封装与光纤固定在一起,做成光组件。在这种组件中存在以下缺点: According to the currently known component structure, the general optical component is to package the chip and the optical element coaxially, that is, the TO package (Transistor-Outline). Fix the TO package and the optical fiber together to make an optical component. The following disadvantages exist in this type of assembly:

(1)    对于直径1.5毫米的BK7玻璃球透镜的TO封装,激光器芯片发射的激光光束耦合到光纤中,即发射耦合,耦合效率低,一般效率低于15%; (1) For the TO package of BK7 glass ball lens with a diameter of 1.5 mm, the laser beam emitted by the laser chip is coupled into the optical fiber, that is, emission coupling, and the coupling efficiency is low, generally less than 15%;

(2)    光纤传输过来的激光光束,聚焦到探测器芯片的光敏面,即接收耦合,最小光斑直径达到50微米,非常不利于耦合; (2) The laser beam transmitted by the optical fiber is focused on the photosensitive surface of the detector chip, that is, receiving coupling, and the minimum spot diameter reaches 50 microns, which is very unfavorable for coupling;

(3)    TO封装结构复杂,成本高,自动化生产的难度大、投资成本也很高; (3) The structure of TO packaging is complex, the cost is high, the difficulty of automatic production is high, and the investment cost is also high;

(4)    芯片与光学元件之间的位置由TO管座、TO管帽及衬底的尺寸决定,实时调节难度大,导致耦合效率的进一步降低、耦合工艺难度增加; (4) The position between the chip and the optical element is determined by the size of the TO tube base, TO tube cap, and substrate, and it is difficult to adjust in real time, resulting in a further decrease in coupling efficiency and an increase in the difficulty of the coupling process;

(5)    TO封装的管脚结构,使客户使用困难,自动焊接的难度大; (5) The pin structure of the TO package makes it difficult for customers to use and automatic welding is difficult;

另外,在现有产品中,只有单一方向的光组件已经远远不能满足工业需要,例如仅发射激光光束或仅接收激光光束的光组件不能适应需要多方向收发激光光束的需求,给使用造成了极大不便。 In addition, in existing products, optical components with only a single direction are far from meeting industrial needs. For example, optical components that only emit laser beams or only receive laser beams cannot meet the needs of multi-directional transmission and reception of laser beams. Great inconvenience.

发明内容 Contents of the invention

本发明所要解决的技术问题是提供了一种耦合效率高、灵敏度高、方便插拔、、可多向导光且易于自动化制造的一种单纤多向光组件。 The technical problem to be solved by the present invention is to provide a single-fiber multi-directional optical component with high coupling efficiency, high sensitivity, convenient plug-in, multiple light guides and easy automatic manufacture.

本发明的技术方案如下: Technical scheme of the present invention is as follows:

一种单纤多向光组件,其包括一侧带有通光孔的壳体、设置在壳体外侧且对准通光孔的光接口部件、固定于壳体内的基座、设置于所述基座上的激光收/发装置和芯片端透镜; A single-fiber multi-directional optical component, which includes a housing with a light hole on one side, an optical interface component arranged outside the housing and aligned with the light hole, a base fixed in the housing, and placed on the Laser receiving/transmitting device and chip-side lens on the base;

所述激光收/发装置为探测器芯片及其辅助电路或激光器芯片及其辅助电路,所述激光收/发装置至少2个;所述芯片端透镜的数量和位置与所述探测器芯片或激光器芯片一一对应,所述芯片端透镜位于所述探测器芯片的光敏面或激光器芯片前,且所述芯片端透镜的光轴与所述探测器芯片的光敏面或激光器芯片同轴对应; The laser receiving/sending device is a detector chip and its auxiliary circuit or a laser chip and its auxiliary circuit, and there are at least two laser receiving/sending devices; The laser chips correspond one by one, the chip-side lens is located in front of the photosensitive surface of the detector chip or the laser chip, and the optical axis of the chip-side lens corresponds to the photosensitive surface of the detector chip or the laser chip coaxially;

所述芯片端透镜的光轴与每个所述激光收/发装置同轴设置,所述芯片端透镜之间设有分光元件,所述通光孔与光接口部件同轴设置; The optical axis of the chip-side lens is set coaxially with each of the laser receiving/transmitting devices, a light splitting element is arranged between the chip-side lenses, and the optical hole is set coaxially with the optical interface component;

所述光接口部件包括光纤端透镜和光纤套筒;所述光纤端透镜位于光纤套筒一端和壳体的通光孔之间; The optical interface component includes an optical fiber end lens and an optical fiber sleeve; the optical fiber end lens is located between one end of the optical fiber sleeve and the light-through hole of the housing;

所述分光元件包括分光通道和设置在分光通道内的滤光片;所述分光通道上设有通道口,所述通道口分别对准每个所述芯片端透镜的光轴和通光孔,所述滤光片对准通道口倾斜放置,其倾斜角度为与通道水平方向呈45度角;所述滤光片根据需要,对特定波长的激光光束进行透射或发射; The light-splitting element includes a light-splitting channel and a filter arranged in the light-splitting channel; a channel opening is provided on the light-splitting channel, and the channel opening is respectively aligned with the optical axis and the light-through hole of each of the chip end lenses, The optical filter is placed obliquely to the channel opening, and its inclination angle is 45 degrees to the horizontal direction of the channel; the optical filter transmits or emits the laser beam of a specific wavelength as required;

所述基座包括主基座和芯片支撑基座,所述芯片支撑基座焊接或粘接在主基座上;所述激光收/发装置烧结或粘接在所述芯片支撑基座上; The base includes a main base and a chip support base, the chip support base is welded or bonded on the main base; the laser receiving/transmitting device is sintered or bonded on the chip support base;

每个所述激光收/发装置与其对应匹配的芯片端透镜组成一组,每组之间由电磁屏蔽板间隔开;所述探测器芯片及其辅助电路和其对应匹配的芯片端透镜一组,由电磁屏蔽板间隔开组成激光接收腔;所述激光器芯片及其辅助电路和其对应匹配的芯片端透镜一组,由电磁屏蔽板间隔开组成激光发射腔; Each of the laser receiving/transmitting devices and its corresponding matching chip end lens form a group, and each group is separated by an electromagnetic shielding plate; the detector chip and its auxiliary circuit and its corresponding matching chip end lens form a group , forming a laser receiving cavity separated by electromagnetic shielding plates; the laser chip and its auxiliary circuit and its corresponding matching chip end lens group, separated by electromagnetic shielding plates to form a laser emitting cavity;

所述基座上还设置有通电接口,通过键合线与过孔与所述激光收/发装置进行所需的电连通,所述通电接口伸出壳体与外界电信号连通,所述通电接口与壳体之间通过密封胶进行气密性密封; The base is also provided with an electrical interface, which is electrically connected to the laser receiving/transmitting device through bonding wires and via holes, and the electrical interface extends out of the housing to communicate with external electrical signals. The interface and the shell are airtightly sealed by sealant;

所述激光收/发装置的收/发激光光束经所述壳体的通光孔和分光通道出入。 The receiving/emitting laser beam of the laser receiving/emitting device enters and exits through the light hole and the light splitting channel of the housing.

进一步的,所述芯片端透镜和光纤端透镜为球透镜、非球透镜、平凸透镜或柱状透镜。 Further, the chip-side lens and the fiber-side lens are ball lenses, aspheric lenses, plano-convex lenses or cylindrical lenses.

进一步的,所述主基座和芯片支撑基座为单面/双面金属化的陶瓷基板、常规PCB板、铝基PCB板、铜基PCB板或内含金属布线的注塑件。 Further, the main base and the chip support base are single-side/double-side metallized ceramic substrates, conventional PCB boards, aluminum-based PCB boards, copper-based PCB boards, or injection molded parts containing metal wiring.

进一步的,所述通电接口设置在所述主基座上,所述通电接口采用在主基座上布线生成金手指或排针。 Further, the power interface is arranged on the main base, and the power interface adopts wiring on the main base to form gold fingers or pin headers.

进一步的,所述光纤套筒为插拔式光纤套筒或尾纤式光纤套筒; Further, the optical fiber sleeve is a pluggable optical fiber sleeve or a pigtail type optical fiber sleeve;

当所述光纤套筒为插拔式光纤套筒时,所述光纤套筒包括套筒壳体和侧面开有裂缝的插芯筒;所述插芯筒内套在套筒壳体中,所述插芯筒上裂缝对侧的外壁与套筒壳体内壁焊接;跳线插芯作为外接物,内插在插芯筒中; When the optical fiber sleeve is a pluggable optical fiber sleeve, the optical fiber sleeve includes a sleeve housing and a ferrule with a slit on the side; the ferrule is sleeved in the sleeve housing, so The outer wall on the opposite side of the slit on the ferrule barrel is welded to the inner wall of the sleeve shell; the jumper ferrule is used as an external connection and inserted into the ferrule barrel;

当所述光纤套筒为尾纤式光纤套筒时,所述光纤套筒包括尾胶套、尾纤插芯筒和跳线插芯;所述跳线插芯焊接在尾纤插芯筒内,所述尾纤插芯筒外套设有尾胶套。 When the optical fiber sleeve is a pigtail type optical fiber sleeve, the optical fiber sleeve includes a rubber tail sleeve, a pigtail ferrule and a jumper ferrule; the jumper ferrule is welded in the pigtail ferrule , the outer casing of the pigtail ferrule is provided with a rubber tail sleeve.

进一步的,所述光接口部件还包括中间带孔的挡台,所述光纤端透镜、挡台和跳线插芯中的光纤三者之间依次同轴无缝接触。 Further, the optical interface component also includes a stop with a hole in the middle, and the optical fiber end lens, the stop and the optical fiber in the jumper ferrule are sequentially coaxial and seamlessly contacted.

进一步的,一种单纤多向光组件还包括芯片端透镜支撑座和光纤端透镜支撑座;所述芯片端透镜支撑座2和光纤端透镜支撑座上均设有透光孔; Further, a single-fiber multi-directional optical component also includes a chip-end lens support seat and a fiber-end lens support seat; the chip-end lens support seat 2 and the fiber-end lens support seat are both provided with light-transmitting holes;

所述芯片端透镜固定在芯片端透镜支撑座中,所述芯片端透镜通过芯片端透镜支撑座焊接或粘接在主基座上,所述芯片端透镜的光轴与芯片端透镜支撑座上的透光孔同轴对应;所述探测器芯片的光敏面或激光器芯片与芯片端透镜的光轴对应; The chip-side lens is fixed in the chip-side lens support seat, and the chip-side lens is welded or bonded on the main base through the chip-side lens support seat, and the optical axis of the chip-side lens is connected to the chip-side lens support seat. The light-transmitting hole is coaxially corresponding; the photosensitive surface of the detector chip or the laser chip is corresponding to the optical axis of the chip end lens;

所述光纤端透镜固定在光纤端透镜支撑座中,所述光纤端透镜通过光纤端透镜支撑座焊接或粘接在光纤套筒一端和壳体的通光孔之间,所述壳体的通光孔、光纤端透镜支撑座上的透光孔、光纤端透镜的光轴与跳线插芯中光纤的光轴同轴对应。 The fiber end lens is fixed in the fiber end lens support seat, and the fiber end lens is welded or bonded between one end of the fiber sleeve and the light passage hole of the housing through the fiber end lens support seat. The light hole, the light transmission hole on the fiber end lens support seat, and the optical axis of the fiber end lens are coaxially corresponding to the optical axis of the optical fiber in the jumper ferrule.

进一步的,所述挡台和光纤端透镜支撑座固定连接,所述光纤端透镜支撑座为一端设有V型槽的筒体,所述光纤端透镜通过光纤端透镜支撑座一端的V型槽紧密嵌入在其中,所述光纤端透镜通过所述挡台紧密固定在光纤端透镜支撑座中。 Further, the stopper is fixedly connected to the fiber end lens support seat, the fiber end lens support seat is a cylinder with a V-shaped groove at one end, and the fiber end lens passes through the V-shaped groove at one end of the fiber end lens support seat Tightly embedded therein, the fiber end lens is tightly fixed in the fiber end lens support seat through the stopper.

进一步的,所述光纤端透镜与光纤端透镜支撑座之间通过密封胶进行气密性密封。 Further, the air-tight sealing is performed between the optical fiber end lens and the optical fiber end lens support seat through a sealant.

进一步的,所述激光收/发装置为激光器芯片和探测器芯片等光电二极管及其辅助电路,其辅助电路为常规电路。 Further, the laser transmitting/receiving device is a photodiode such as a laser chip and a detector chip and its auxiliary circuit, and the auxiliary circuit is a conventional circuit.

进一步的,所述激光收/发装置的收/发激光光束依次经所述芯片端透镜的光轴、分光通道、壳体上的通光孔、光纤端透镜的光轴、挡台中间的孔与跳线插芯中的光纤出入。 Further, the receiving/sending laser beam of the laser receiving/sending device sequentially passes through the optical axis of the lens at the chip end, the light splitting channel, the light-through hole on the housing, the optical axis of the lens at the fiber end, and the hole in the middle of the block Access to the fiber in the jumper ferrule.

进一步的,所述插芯筒自然状态下的内径小于或等于跳线插芯的直径。 Further, the inner diameter of the ferrule barrel in a natural state is smaller than or equal to the diameter of the jumper ferrule.

进一步的,所述尾纤插芯筒侧面开有裂缝,所述跳线插芯插入尾纤插芯筒中,所述尾纤插芯筒自然状态下的内径小于或等于跳线插芯的直径,所述尾纤插芯筒中的跳线插芯通过密封胶将尾纤固定在跳线插芯中,所述尾纤为光纤的一种形式。 Further, there is a crack on the side of the pigtail ferrule, the jumper ferrule is inserted into the pigtail ferrule, and the inner diameter of the pigtail ferrule in a natural state is less than or equal to the diameter of the jumper ferrule, The jumper ferrule in the pigtail ferrule barrel fixes the pigtail in the jumper ferrule through a sealant, and the pigtail is a form of optical fiber.

进一步的,所述挡台和光纤端透镜支撑座固定连接,通过挡台将所述光纤端透镜紧密固定在光纤端透镜支撑座的V型槽内,通过密封胶沿光纤端透镜边缘进行密封,除加固的作用外,将V型槽与光纤端透镜接触外边沿密封确保湿气或其他灰尘不能通过通光孔进入壳体污染或腐蚀其内部的激光收/发装置、芯片端透镜和其他元器件,造成精度失准或使用寿命缩短。本申请中采用密封胶进行固定和密封均是为了达到上述目的和效果。 Further, the stopper is fixedly connected to the fiber end lens support seat, the fiber end lens is tightly fixed in the V-shaped groove of the fiber end lens support seat through the stopper, and the sealant is used to seal along the edge of the fiber end lens, In addition to the role of reinforcement, the outer edge of the contact between the V-groove and the fiber end lens is sealed to ensure that moisture or other dust cannot enter the housing through the light hole to contaminate or corrode the internal laser receiving/transmitting device, chip end lens and other components. device, resulting in inaccurate accuracy or shortened service life. In this application, the use of sealant for fixing and sealing is to achieve the above purpose and effect.

进一步的,所述插拔式光纤套筒还包括套筒环,所述套筒环套接在光纤端透镜支撑座外,或套接在套筒壳体外;或者套筒环与光纤端透镜支撑座制作成一体,或者套筒环与套筒壳体制作成一体,套筒环在使用中,用于固定光接口。 Further, the pluggable optical fiber sleeve also includes a sleeve ring, and the sleeve ring is sleeved outside the optical fiber end lens support seat, or sleeved outside the sleeve housing; or the sleeve ring is supported by the optical fiber end lens The seat is integrated, or the sleeve ring is integrated with the sleeve housing, and the sleeve ring is used to fix the optical interface in use.

进一步的,所述挡台位于光纤端透镜和跳线插芯之间;所述挡台的厚度决定跳线插芯中光纤到光纤端透镜的距离。 Further, the stopper is located between the fiber end lens and the jumper ferrule; the thickness of the stopper determines the distance from the optical fiber in the jumper ferrule to the fiber end lens.

进一步的,所述光纤分为APC型和UPC型,根据使用的光纤类型不同,相应挡台的形状也不同,但只要挡台中心的孔和光纤中心对准即可。 Further, the optical fiber is divided into APC type and UPC type. According to the type of optical fiber used, the shape of the corresponding block is also different, but as long as the hole in the center of the block is aligned with the center of the optical fiber.

进一步的,所述激光收/发装置为激光器芯片时,所述激光收/发装置还包括背光探测器,所述背光探测器烧结或粘接在芯片支撑基座上,所述芯片支撑基座焊接或粘接在主基座上,所述背光探测器的位置以其光敏面能接收到激光器芯片发的光且与激光器芯片成约8到15度的角度为准,所述背光探测器的光敏面接收激光器芯片发的光后将光强信号转换成电信号后反馈给控制光强度的控制器件,该控制器件发出控制信号调节激光器芯片的发射的光强度。 Further, when the laser receiving/transmitting device is a laser chip, the laser receiving/transmitting device also includes a backlight detector, the backlight detector is sintered or bonded on the chip support base, and the chip support base Welded or bonded on the main base, the position of the backlight detector is based on the fact that its photosensitive surface can receive the light emitted by the laser chip and form an angle of about 8 to 15 degrees with the laser chip. After receiving the light from the laser chip, the photosensitive surface converts the light intensity signal into an electrical signal and feeds it back to the control device for controlling the light intensity. The control device sends a control signal to adjust the light intensity emitted by the laser chip.

进一步的,所述激光收/发装置为探测器芯片时,所述激光收/发装置还包括跨阻放大器芯片和相关滤波电容,所述跨阻放大器芯片和相关滤波电容烧结或粘接在芯片支撑基座上,所述芯片支撑基座焊接或粘接在主基座上,所述探测器芯片将光信号转换成电信号后由跨阻放大器芯片对该电信号进行放大后输出。 Further, when the laser receiving/transmitting device is a detector chip, the laser receiving/transmitting device also includes a transimpedance amplifier chip and related filter capacitors, and the transimpedance amplifier chip and related filter capacitors are sintered or bonded on the chip On the support base, the chip support base is welded or glued on the main base, the detector chip converts the optical signal into an electrical signal, and the transimpedance amplifier chip amplifies the electrical signal before outputting it.

进一步的,根据所述排针伸出壳体的方向可以是侧排针、底部排针、上排针或其他不同方向的排针。 Further, according to the direction in which the pin headers protrude from the housing, it can be side pin headers, bottom pin headers, upper pin headers or other pin headers in different directions.

进一步的,所述主基座上覆盖有导热胶,有利于光组件内部各器件扩大散热面积,加快散热速度。 Further, the main base is covered with heat-conducting glue, which is beneficial to expand the heat dissipation area of each device inside the optical component and accelerate the heat dissipation speed.

进一步的,在所述壳体内的侧板上敷设有密封胶,进行气密性封装。 Further, a sealant is laid on the side panels inside the housing for airtight packaging.

本发明的有益效果是: The beneficial effects of the present invention are:

(1)本发明通过设置分光元件,将多个激光器芯片发射的激光耦合进入同一根光纤,或将同一根光纤传输来的激光分别耦合到多个探测器芯片上,或二者混合进行;且根据设置的激光收/发装置的位置和数量,可作为单纤双向收发光组件或单纤多向收发光组件,适用范围广,使用方便。 (1) The present invention couples the laser light emitted by multiple laser chips into the same optical fiber by setting the light splitting element, or couples the laser light transmitted from the same optical fiber to multiple detector chips, or a mixture of the two; and According to the location and quantity of the laser receiving/transmitting devices, it can be used as a single-fiber bi-directional receiving and receiving light assembly or a single-fiber multi-directional receiving and receiving light assembly, which has a wide range of applications and is easy to use.

(2)本发明通过电磁屏蔽板将各个激光收/发装置隔离成单独的激光接收腔或激光发射腔,避免产生的电磁信号相互干扰,确保精度和稳定性。 (2) The present invention isolates each laser transmitting/receiving device into a separate laser receiving cavity or laser emitting cavity through an electromagnetic shielding plate, so as to avoid mutual interference of generated electromagnetic signals and ensure accuracy and stability.

(3)本发明在光接口部件中加入光纤端透镜,形成二次聚光,提高了光聚合度,提高了发射耦合效率与接收耦合的灵敏度; (3) In the present invention, an optical fiber end lens is added to the optical interface components to form secondary light concentration, which improves the degree of photopolymerization, and improves the efficiency of emission coupling and the sensitivity of reception coupling;

当激光收/发装置为激光器芯片及其辅助电路时,能减小发射耦合的最小光斑直径,从而使得跳线插芯中的光纤的横截面相对于该光斑更大,更易准确接收到发射耦合的光斑,使得对其在光纤套筒中安装位置精确度的要求降低了,从而简化了光纤套筒内部结构,节约了技术成本和时间成本; When the laser receiving/transmitting device is a laser chip and its auxiliary circuit, the minimum spot diameter of the launch coupling can be reduced, so that the cross-section of the optical fiber in the jumper ferrule is larger relative to the spot, and it is easier to accurately receive the launch coupling. The light spot reduces the requirements for the accuracy of its installation position in the fiber optic sleeve, thus simplifying the internal structure of the fiber sleeve and saving technical and time costs;

当激光收/发装置为探测器芯片及其辅助电路时,能减小接收耦合的最小光斑直径,从而使得探测器芯片的光敏面相对于该光斑更大,更易准确接收到接收耦合的光斑。 When the laser receiving/transmitting device is a detector chip and its auxiliary circuit, the minimum spot diameter for receiving coupling can be reduced, so that the photosensitive surface of the detector chip is larger relative to the spot, and it is easier to accurately receive the receiving coupling spot.

(4)本发明主基座和芯片支撑基座为规则结构,易于在其平面上贴片和键合,解决了原来TO管座形状高低突起不同,导致的贴片和键合效率低且在自动化生产过程中不好夹持的问题,通过先将激光收/发装置的芯片平面贴片在芯片支撑基座上并进行键合,再将芯片支撑基座焊接或粘接在主基座上,使得结构简单,安装方便,易于自动化生产,实现完全自动化操作。 (4) The main base and the chip support base of the present invention have regular structures, which are easy to mount and bond on their planes, and solve the problem of low mounting and bonding efficiency caused by the difference in height and protrusion of the original TO socket. For the problem of poor clamping in the automated production process, the chip plane of the laser receiving/transmitting device is first mounted on the chip support base and bonded, and then the chip support base is welded or bonded on the main base , making the structure simple, easy to install, easy to automate production, and realize fully automated operation.

(5)本发明的光接口部件设置有中间带孔的挡台,确保跳线插芯的位置不会前移,且挡抬的厚度能够精确控制跳线插芯前端到光纤端透镜的距离。 (5) The optical interface component of the present invention is provided with a stopper with a hole in the middle to ensure that the position of the jumper ferrule will not move forward, and the thickness of the stopper can accurately control the distance from the front end of the jumper ferrule to the lens at the fiber end.

(6)本发明中采用的光纤套筒为插拔式光纤套时,其插芯筒的侧面开设裂缝,使得其横截面呈C字型,采用弹性材料具有一定弹性,使其内径可调,便于放入跳线插芯,易于组装和更换跳线插芯,而插芯筒在自然状态下的内径小于或等于跳线插芯的直径,使跳线插芯插入插芯筒后能够紧密固定,且可以保持一定的插拔力; (6) When the optical fiber sleeve used in the present invention is a plug-in optical fiber sleeve, cracks are opened on the side of the ferrule so that its cross section is C-shaped, and the elastic material has a certain elasticity so that its inner diameter can be adjusted. It is easy to put in the jumper ferrule, easy to assemble and replace the jumper ferrule, and the inner diameter of the ferrule barrel in the natural state is less than or equal to the diameter of the jumper ferrule, so that the jumper ferrule can be tightly fixed after being inserted into the ferrule barrel , and can maintain a certain insertion force;

本发明采用的光纤套筒为尾纤式光纤套筒时,一体成型,激光收/发装置和这两种光纤套筒类型可根据需要自由组合,适应多种场合。 When the optical fiber sleeve used in the present invention is a pigtail type optical fiber sleeve, it is integrally formed, and the laser transmitting/receiving device and the two types of optical fiber sleeves can be combined freely according to needs, and are suitable for various occasions.

(7)本发明采用多种通电接口,例如金手指或排针,适用范围广,便于推广使用。 (7) The present invention adopts a variety of electrical interfaces, such as gold fingers or pin headers, which have a wide range of applications and are easy to promote and use.

附图说明 Description of drawings

图1为本发明实施例1的结构示意图。 Fig. 1 is a schematic structural diagram of Embodiment 1 of the present invention.

图2为本发明实施例2的结构示意图。 Fig. 2 is a schematic structural diagram of Embodiment 2 of the present invention.

图3为本发明中插拔式光纤套筒的剖视图。 Fig. 3 is a cross-sectional view of the pluggable optical fiber sleeve in the present invention.

图4为本发明中尾纤式光纤套筒的剖视图。 Fig. 4 is a cross-sectional view of a pigtailed fiber optic sleeve in the present invention.

图5为本发明中插拔式光纤套筒的整体结构示意图。 Fig. 5 is a schematic diagram of the overall structure of the pluggable optical fiber sleeve in the present invention.

图6为本发明中挡台的位置关系示意图。 Fig. 6 is a schematic diagram of the positional relationship of the blocking platform in the present invention.

图7为本发明中激光发射腔内部结构示意图。 Fig. 7 is a schematic diagram of the internal structure of the laser emitting cavity in the present invention.

其中,1壳体、2主基座、3芯片支撑基座、4通电接口、5激光收/发装置、6通光孔、7-1芯片端透镜、7-2芯片端透镜支撑座、8-1光纤端透镜、8-2光纤端透镜支撑座、9光纤套筒、9-1-1套筒壳体、9-1-2插芯筒、9-1-3裂缝、9-2-1尾胶套、9-2-2尾纤插芯筒、10挡台、11滤光片、12分光通道、13电磁屏蔽板、14背光探测芯片、15套筒环、16 V型槽、17跳线插芯、18光纤、19密封胶、20焊接处、21导热胶。 Among them, 1 shell, 2 main base, 3 chip support base, 4 power interface, 5 laser receiving/transmitting device, 6 optical hole, 7-1 chip end lens, 7-2 chip end lens support seat, 8 -1 fiber end lens, 8-2 fiber end lens support seat, 9 fiber optic sleeve, 9-1-1 sleeve shell, 9-1-2 ferrule barrel, 9-1-3 crack, 9-2- 1 rubber tail sleeve, 9-2-2 pigtail ferrule, 10 block, 11 optical filter, 12 light splitting channel, 13 electromagnetic shielding plate, 14 backlight detection chip, 15 sleeve ring, 16 V groove, 17 Jumper ferrule, 18 optical fiber, 19 sealant, 20 welding, 21 heat conduction glue.

具体实施方式 Detailed ways

为使本发明要解决的技术问题、技术方案和有益效果更加清楚,下面将结合附图和具体实施例进行详细描述。 In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

如图1和图3~7所示,实施例1:其包括壳体1、设置在壳体1上的光接口部件、固定于壳体1内的主基座2和芯片支撑基座3、分别设置于两个所述芯片支撑基座3上的探测器芯片及其辅助电路和激光器芯片及其辅助电路以及对应设置于主基座2上的两个芯片端透镜7-1;所述壳体1一侧带有通光孔6,所述光接口部件对准壳体1上的通光孔6;所述芯片支撑基座3焊接或粘接在主基座2上; As shown in Figure 1 and Figures 3 to 7, Embodiment 1: it includes a housing 1, an optical interface component arranged on the housing 1, a main base 2 and a chip support base 3 fixed in the housing 1, The detector chip and its auxiliary circuit, the laser chip and its auxiliary circuit respectively arranged on the two chip supporting bases 3, and the two chip end lenses 7-1 correspondingly arranged on the main base 2; There is a light hole 6 on one side of the body 1, and the optical interface part is aligned with the light hole 6 on the housing 1; the chip support base 3 is welded or glued on the main base 2;

两个所述芯片端透镜7-1分别在所述探测器芯片的光敏面和激光器芯片前端,且两个所述芯片端透镜7-1的光轴与所述芯片同轴对应;两个所述芯片端透镜7-1之间设有分光元件;如图1所示,所述分光元件包括分光通道12和设置在分光通道12内的两片滤光片11;所述分光通道12上设有3个通道口,其中2个通道口各对准一个芯片端透镜7-1的光轴,另一个通道口对准通光孔6,所述分光通道12内有两个弯折,两片所述滤光片11分别位于分光通道12内的两个弯折处,且对准两个通道口倾斜放置,其倾斜角度与分光通道12呈45度;所述滤光片11将特定波长的激光进行透射或发射; The two chip-side lenses 7-1 are respectively on the photosensitive surface of the detector chip and the front end of the laser chip, and the optical axes of the two chip-side lenses 7-1 are coaxially corresponding to the chip; A light-splitting element is provided between the chip end lenses 7-1; as shown in Figure 1, the light-splitting element includes a light-splitting channel 12 and two optical filters 11 arranged in the light-splitting channel 12; There are 3 channel openings, 2 of which are aligned with the optical axis of a chip-end lens 7-1, and the other channel opening is aligned with the light hole 6. There are two bends in the light splitting channel 12, and two The optical filter 11 is respectively located at two bends in the light splitting channel 12, and is placed obliquely in alignment with the two channel openings, and its inclination angle is 45 degrees with the light splitting channel 12; Laser transmission or emission;

在图1中,壳体1被中间的电磁屏蔽板13分隔成两个腔室,上面的腔室中的激光收/发装置5为激光器芯片及其辅助电路,下面的腔室中的激光收/发装置5为探测器芯片及其辅助电路;所述激光器芯片发光经其腔室中的芯片端透镜7-1后穿过滤光片11,经过滤光片11透射通过通光孔6发出,经过光纤端透镜8-1耦合进入光纤套筒9中跳线插芯17的光纤18中;由光纤18中传输而来的激光,进入光纤端透镜8-1后再经通光孔6进入分光元件,经两片滤光片11的反射后从通道口射出,通过芯片端透镜7-1耦合至探测器芯片的光敏面。 In Fig. 1, the housing 1 is divided into two chambers by the electromagnetic shielding plate 13 in the middle, the laser receiving/transmitting device 5 in the upper chamber is a laser chip and its auxiliary circuit, and the laser receiving/transmitting device 5 in the lower chamber is The emitting device 5 is a detector chip and its auxiliary circuit; the laser chip emits light through the chip end lens 7-1 in its chamber and then passes through the optical filter 11, and is transmitted through the optical hole 6 through the optical filter 11 to emit , coupled into the optical fiber 18 of the jumper ferrule 17 in the fiber sleeve 9 through the optical fiber end lens 8-1; the laser light transmitted from the optical fiber 18 enters the optical fiber end lens 8-1 and then enters through the light hole 6 The spectroscopic element emits from the channel port after being reflected by two optical filters 11, and is coupled to the photosensitive surface of the detector chip through the chip end lens 7-1.

当分光通道12内的弯折为不同角度时,滤光片11的倾斜角度也要做适应性调整,以保证分光元件能将两个腔室内的光分别与通光孔6相通。 When the bending in the light-splitting channel 12 is at different angles, the inclination angle of the filter 11 should also be adjusted adaptively, so as to ensure that the light-splitting element can communicate the light in the two chambers with the light-through hole 6 respectively.

所述光接口部件包括光纤端透镜8-1和光纤套筒9;所述光纤端透镜8-1位于光纤套筒9一端和壳体1的通光孔6之间; The optical interface component includes an optical fiber end lens 8-1 and an optical fiber sleeve 9; the optical fiber end lens 8-1 is located between one end of the optical fiber sleeve 9 and the optical hole 6 of the housing 1;

所述激光器芯片及其辅助电路和其前侧的芯片端透镜7-1组成一组,所述探测器芯片及其辅助电路和其光敏面前侧的芯片端透镜7-1组成一组,两组之间由电磁屏蔽板13间隔开,故形成激光发射腔和激光接收腔。 The laser chip and its auxiliary circuit and the chip end lens 7-1 on the front side form a group, the detector chip and its auxiliary circuit and the chip end lens 7-1 on the photosensitive front side form a group, two groups The electromagnetic shielding plates 13 are spaced between them, so a laser emitting cavity and a laser receiving cavity are formed.

所述基座上还设置有通电接口4,通过键合线与过孔与所述激光收/发装置5进行所需的电连通,所述通电接口4伸出壳体1与外界电信号连通,所述通电接口4与壳体1之间通过密封胶19进行气密性密封; The base is also provided with an electrical interface 4, which is electrically connected to the laser receiving/transmitting device 5 through bonding wires and via holes, and the electrical interface 4 extends out of the housing 1 to communicate with external electrical signals , the airtight seal between the power interface 4 and the housing 1 is performed by a sealant 19;

所述激光收/发装置5的收/发激光光束经所述壳体1的通光孔6出入。 The receiving/emitting laser beam of the laser receiving/emitting device 5 enters and exits through the light hole 6 of the housing 1 .

进一步的,所述芯片端透镜7-1和光纤端透镜8-1为球透镜、非球透镜、平凸透镜或柱状透镜。 Further, the chip-end lens 7-1 and the fiber-end lens 8-1 are ball lenses, aspheric lenses, plano-convex lenses or cylindrical lenses.

进一步的,所述主基座2和芯片支撑基座3为单面/双面金属化的陶瓷基板、常规PCB板、铝基PCB板、铜基PCB板或内含金属布线的注塑件。 Further, the main base 2 and the chip supporting base 3 are single-side/double-side metallized ceramic substrates, conventional PCB boards, aluminum-based PCB boards, copper-based PCB boards, or injection molded parts containing metal wiring.

进一步的,所述通电接口4设置在所述主基座2上,所述通电接口4采用在主基座2上布线生成金手指或排针。 Further, the power supply interface 4 is arranged on the main base 2, and the power supply interface 4 adopts wiring on the main base 2 to form golden fingers or pin headers.

进一步的,所述光纤套筒9为插拔式光纤套筒或尾纤式光纤套筒; Further, the optical fiber sleeve 9 is a pluggable optical fiber sleeve or a pigtailed optical fiber sleeve;

当所述光纤套筒9为插拔式光纤套筒时,所述光纤套筒9包括套筒壳体9-1-1和侧面开有裂缝9-1-3的插芯筒9-1-2;所述插芯筒9-1-2内套在套筒壳体9-1-1中,所述插芯筒9-1-2上裂缝9-1-3对侧的外壁与套筒壳体9-1-1内壁焊接,形成焊接处20;跳线插芯17作为外接物,内插在插芯筒9-1-2中; When the optical fiber sleeve 9 is a pluggable optical fiber sleeve, the optical fiber sleeve 9 includes a sleeve housing 9-1-1 and a ferrule 9-1-1 with a crack 9-1-3 on the side 2. The ferrule barrel 9-1-2 is set inside the sleeve shell 9-1-1, and the outer wall on the opposite side of the crack 9-1-3 on the ferrule barrel 9-1-2 and the sleeve The inner wall of the shell 9-1-1 is welded to form a welding place 20; the jumper ferrule 17 is used as an external connection, and is inserted in the ferrule barrel 9-1-2;

当所述光纤套筒9为尾纤式光纤套筒时,所述光纤套筒9包括尾胶套9-2-1、尾纤插芯筒9-2-2和跳线插芯17;所述跳线插芯17焊接在尾纤插芯筒9-2-2内,所述尾纤插芯筒9-2-2外套设有尾胶套9-2-1。 When the optical fiber sleeve 9 is a pigtailed optical fiber sleeve, the optical fiber sleeve 9 includes a rubber tail sleeve 9-2-1, a pigtail ferrule 9-2-2 and a jumper ferrule 17; The jumper ferrule 17 is welded in the pigtail ferrule 9-2-2, and the pigtail ferrule 9-2-2 is covered with a rubber tail sleeve 9-2-1.

进一步的,所述光接口部件还包括中间带孔的挡台10,所述光纤端透镜8-1、挡台10和跳线插芯17中的光纤18三者之间依次同轴无缝接触。 Further, the optical interface component also includes a blocking platform 10 with a hole in the middle, and the optical fiber end lens 8-1, the blocking platform 10 and the optical fiber 18 in the jumper ferrule 17 are sequentially in coaxial and seamless contact .

进一步的,一种单纤多向光组件还包括芯片端透镜支撑座7-2和光纤端透镜支撑座8-2;所述芯片端透镜支撑座7-2和光纤端透镜支撑座8-2上均设有透光孔; Further, a single-fiber multi-directional optical component also includes a chip end lens support seat 7-2 and a fiber end lens support seat 8-2; the chip end lens support seat 7-2 and the fiber end lens support seat 8-2 There are light-transmitting holes on them;

所述芯片端透镜7-1固定在芯片端透镜支撑座7-2中,所述芯片端透镜7-1通过芯片端透镜支撑座7-2焊接或粘接在主基座2上,所述芯片端透镜7-1的光轴与芯片端透镜支撑座7-2上的透光孔同轴对应;所述探测器芯片的光敏面或激光器芯片与芯片端透镜7-1的光轴对应; The chip-side lens 7-1 is fixed in the chip-side lens support seat 7-2, and the chip-side lens 7-1 is welded or bonded to the main base 2 through the chip-side lens support seat 7-2. The optical axis of the chip-side lens 7-1 corresponds coaxially to the light transmission hole on the chip-side lens support seat 7-2; the photosensitive surface of the detector chip or the laser chip corresponds to the optical axis of the chip-side lens 7-1;

所述光纤端透镜8-1固定在光纤端透镜支撑座8-2中,所述光纤端透镜8-1通过光纤端透镜支撑座8-2焊接或粘接在光纤套筒9一端和壳体1的通光孔6之间,所述壳体1的通光孔6、光纤端透镜支撑座上8-2的透光孔、光纤端透镜8-1的光轴与跳线插芯17中光纤18的光轴同轴对应。 The fiber end lens 8-1 is fixed in the fiber end lens support seat 8-2, and the fiber end lens 8-1 is welded or bonded to one end of the fiber optic sleeve 9 and the housing through the fiber end lens support seat 8-2 Between the light hole 6 of 1, the light hole 6 of the housing 1, the light hole 8-2 on the fiber end lens support seat, the optical axis of the fiber end lens 8-1 and the jumper ferrule 17 The optical axes of the optical fibers 18 correspond coaxially.

进一步的,所述挡台10和光纤端透镜支撑座8-2固定连接,所述光纤端透镜支撑座8-2为一端设有V型槽16的筒体,所述光纤端透镜8-1通过光纤端透镜支撑座8-2一端的V型槽16紧密嵌入在其中,所述光纤端透镜8-1通过所述挡台10紧密固定在光纤端透镜支撑座8-2中。 Further, the stopper 10 is fixedly connected to the fiber end lens support seat 8-2, the fiber end lens support seat 8-2 is a cylinder with a V-shaped groove 16 at one end, and the fiber end lens 8-1 The V-groove 16 at one end of the fiber end lens support seat 8 - 2 is tightly embedded therein, and the fiber end lens 8 - 1 is tightly fixed in the fiber end lens support seat 8 - 2 through the stopper 10 .

进一步的,所述光纤端透镜8-1与光纤端透镜支撑座8-2之间通过密封胶19进行气密性密封。 Further, the airtight seal between the optical fiber end lens 8 - 1 and the optical fiber end lens support seat 8 - 2 is performed by a sealant 19 .

进一步的,所述激光收/发装置5为激光器芯片和探测器芯片等光电二极管及其辅助电路,其辅助电路为常规电路。 Further, the laser transmitting/receiving device 5 is a photodiode such as a laser chip and a detector chip and its auxiliary circuit, and the auxiliary circuit is a conventional circuit.

进一步的,所述激光收/发装置5的收/发激光光束依次经所述芯片端透镜7-1的光轴、分光通道、壳体1上的通光孔6、光纤端透镜7-1的光轴、挡台10中间的孔与跳线插芯17中的光纤18出入。 Further, the receiving/sending laser beams of the laser receiving/sending device 5 sequentially pass through the optical axis of the chip end lens 7-1, the light splitting channel, the optical hole 6 on the housing 1, and the fiber end lens 7-1. The optical axis of the optical axis, the hole in the middle of the blocking platform 10 and the optical fiber 18 in the jumper ferrule 17 come in and out.

进一步的,所述插芯筒9-1-2自然状态下的内径小于或等于跳线插芯17的直径。 Further, the inner diameter of the ferrule barrel 9 - 1 - 2 in a natural state is smaller than or equal to the diameter of the jumper ferrule 17 .

进一步的,所述尾纤插芯筒9-2-2侧面开有裂缝9-1-3,所述跳线插芯17插入尾纤插芯筒9-2-2中,所述尾纤插芯筒9-2-2自然状态下的内径小于或等于跳线插芯17的直径,所述尾纤插芯筒9-2-2中的跳线插芯17通过密封胶19将尾纤固定在跳线插芯17中,所述尾纤为光纤18的一种形式。 Further, there is a slit 9-1-3 on the side of the pigtail ferrule 9-2-2, the jumper ferrule 17 is inserted into the pigtail ferrule 9-2-2, and the pigtail ferrule The inner diameter of the core barrel 9-2-2 in a natural state is less than or equal to the diameter of the jumper ferrule 17, and the jumper ferrule 17 in the pigtail ferrule 9-2-2 is fixed by a sealant 19 In the jumper ferrule 17 , the pigtail is a form of optical fiber 18 .

进一步的,所述挡台10和光纤端透镜支撑座8-2固定连接,通过挡台10将所述光纤端透镜8-1紧密固定在光纤端透镜支撑座8-2的V型槽16内,通过密封胶19沿光纤端透镜8-1边缘进行密封,除加固的作用外,将V型槽16与光纤端透镜8-1接触外边沿密封确保湿气或其他灰尘不能通过通光孔6进入壳体1污染或腐蚀其内部的激光收/发装置5、芯片端透镜7-1和其他元器件,造成精度失准或使用寿命缩短。本申请中采用密封胶19进行固定和密封均是为了达到上述目的和效果。 Further, the block 10 is fixedly connected to the fiber end lens support seat 8-2, and the fiber end lens 8-1 is tightly fixed in the V-shaped groove 16 of the fiber end lens support seat 8-2 through the block block 10 , through the sealant 19 to seal along the edge of the fiber end lens 8-1, in addition to the role of reinforcement, the V-shaped groove 16 is sealed with the outer edge of the fiber end lens 8-1 to ensure that moisture or other dust cannot pass through the light hole 6 If it enters the housing 1, it will pollute or corrode the laser receiving/transmitting device 5, the chip-side lens 7-1 and other components, resulting in misalignment of precision or shortened service life. In this application, the use of sealant 19 for fixing and sealing is to achieve the above purpose and effect.

进一步的,所述插拔式光纤套筒9还包括套筒环15,所述套筒环15套接在光纤端透镜支撑座8-2外,或套接在套筒壳体9-1-1外;或者套筒环15与光纤端透镜支撑座8-2制作成一体,或者套筒环15与套筒壳体9-1-1制作成一体,套筒环15在使用中,用于固定光接口。 Further, the pluggable optical fiber sleeve 9 also includes a sleeve ring 15, and the sleeve ring 15 is sleeved outside the optical fiber end lens support seat 8-2, or sleeved on the sleeve housing 9-1- 1 outside; or the sleeve ring 15 is made into one with the fiber end lens support seat 8-2, or the sleeve ring 15 is made into one with the sleeve housing 9-1-1, and the sleeve ring 15 is used for Fixed optical interface.

进一步的,所述挡台10位于光纤端透镜8-1和跳线插芯17之间;所述挡台10的厚度决定跳线插芯17中光纤18到光纤端透镜8-1的距离。 Further, the stopper 10 is located between the fiber end lens 8-1 and the jumper ferrule 17; the thickness of the stopper 10 determines the distance from the optical fiber 18 in the jumper ferrule 17 to the fiber end lens 8-1.

进一步的,所述光纤18分为APC型和UPC型,根据使用的光纤18类型不同,相应挡台10的形状也不同,但只要挡台10中心的孔和光纤18中心对准即可。 Further, the optical fiber 18 is divided into APC type and UPC type. According to different types of optical fiber 18 used, the shape of the corresponding block 10 is also different, but as long as the hole in the center of the block 10 is aligned with the center of the optical fiber 18.

进一步的,所述激光收/发装置5为激光器芯片及其辅助电路时,所述激光收/发装置5还包括背光探测器14,所述背光探测器14烧结或粘接在芯片支撑基座3上,所述芯片支撑基座3焊接或粘接在主基座2上,所述背光探测器14的位置以其光敏面能接收到激光器芯片发的光且与激光器芯片成约8到15度的角度为准,所述背光探测器14的光敏面接收激光器芯片发的光后将光强信号转换成电信号后反馈给控制光强度的控制器件,该控制器件发出控制信号调节激光器芯片的发射的光强度。 Further, when the laser receiving/sending device 5 is a laser chip and its auxiliary circuit, the laser receiving/sending device 5 also includes a backlight detector 14, and the backlight detector 14 is sintered or bonded on the chip support base 3, the chip support base 3 is welded or bonded on the main base 2, the position of the backlight detector 14 can receive the light emitted by the laser chip with its photosensitive surface and the distance between the laser chip and the laser chip is about 8 to 15. The photosensitive surface of the backlight detector 14 receives the light emitted by the laser chip and converts the light intensity signal into an electrical signal and then feeds it back to the control device for controlling the light intensity. The control device sends a control signal to adjust the laser chip. The emitted light intensity.

进一步的,所述激光收/发装置5为探测器芯片及其辅助电路时,所述激光收/发装置还包括跨阻放大器芯片和相关滤波电容,所述跨阻放大器芯片和相关滤波电容烧结或粘接在芯片支撑基座3上,所述芯片支撑基座3焊接或粘接在主基座2上,所述探测器芯片将光信号转换成电信号后由跨阻放大器芯片对该电信号进行放大后输出。 Further, when the laser receiving/sending device 5 is a detector chip and its auxiliary circuit, the laser receiving/sending device also includes a transimpedance amplifier chip and related filter capacitors, and the transimpedance amplifier chip and related filter capacitors are sintered Or bonded on the chip support base 3, the chip support base 3 is welded or bonded on the main base 2, and the detector chip converts the optical signal into an electrical signal by the transimpedance amplifier chip to the electrical signal. The signal is amplified and output.

进一步的,根据所述排针伸出壳体的方向可以是侧排针、底部排针、上排针或其他不同方向的排针。 Further, according to the direction in which the pin headers protrude from the housing, it can be side pin headers, bottom pin headers, upper pin headers or other pin headers in different directions.

进一步的,所述主基座2上覆盖有导热胶21,有利于光组件内部各器件扩大散热面积,加快散热速度。 Further, the main base 2 is covered with thermally conductive glue 21, which is beneficial to expand the heat dissipation area of each device inside the optical component and accelerate the heat dissipation speed.

进一步的,在所述壳体1内的侧板上敷设有密封胶19,进行气密性封装。 Further, a sealant 19 is laid on the side panels inside the housing 1 for airtight packaging.

如图2~7所示,实施例2中包括壳体1、设置在壳体1上的光接口部件、固定于壳体1内的主基座2和N个芯片支撑基座3;所述芯片支撑基座3焊接或粘接在主基座2上;N大于2。 As shown in Figures 2 to 7, Embodiment 2 includes a housing 1, an optical interface component disposed on the housing 1, a main base 2 fixed in the housing 1, and N chip support bases 3; The chip supporting base 3 is welded or bonded on the main base 2; N is greater than 2.

每个芯片支撑基座3上分别设置有激光收/发装置5,参见图2中,芯片支撑基座3上焊接或粘接的激光收/发装置5可以是探测器芯片及其辅助电路,也可以是激光器芯片及其辅助电路,每个探测器芯片和激光器芯片前匹配有芯片端透镜7-1,所述壳体1一侧带有通光孔6,实施例2还包括光接口部件,所述光接口部件对准壳体1上的通光孔6。 Each chip support base 3 is respectively provided with a laser receiving/sending device 5, referring to Fig. 2, the laser receiving/sending device 5 welded or bonded on the chip support base 3 can be a detector chip and its auxiliary circuit, It can also be a laser chip and its auxiliary circuit. Each detector chip and the laser chip are matched with a chip-side lens 7-1. One side of the housing 1 has an optical hole 6. Embodiment 2 also includes an optical interface component. , the optical interface component is aligned with the light hole 6 on the casing 1 .

如图2所示,每个激光收/发装置5和其前匹配的芯片端透镜7-1为一组,通过电磁屏蔽板13将各组分隔成一个个独立的小腔体,避免内部激光光束互扰及损耗,有利于提高精度,也同样降低外部进入的光线干扰。 As shown in Figure 2, each laser receiving/transmitting device 5 and its front matching chip-end lens 7-1 form a group, and each group is separated into independent small cavities by an electromagnetic shielding plate 13 to avoid internal laser The mutual interference and loss of light beams are beneficial to improve the accuracy, and also reduce the interference of external light.

所述芯片端透镜7-1分别在各个探测器芯片和激光器芯片的光敏面前端,且各个芯片端透镜7-1的光轴与所述光敏面同轴对应;各个芯片端透镜7-1之间设有分光元件;如图2示,所述分光元件包括分光通道12和设置在分光通道12内的多个滤光片11;所述分光通道12上设有与滤光片11对应的通道口,其中每个通道口对准一个芯片端透镜7-1的光轴,还有一个通道口对准通光孔66,所述滤光片11的数量与分光通道12内需要分出的光束数量相匹配,分出光束相当于将光束进行反射,所述滤光片11分别位于分光通道12内需要分光处,且对准每个通道口倾斜放置,其倾斜角度与分光通道12呈45度;所述滤光片11对特定波长的激光进行透射或发射; The chip-side lens 7-1 is respectively at the front end of the photosensitive surface of each detector chip and laser chip, and the optical axis of each chip-side lens 7-1 is coaxially corresponding to the photosensitive surface; each chip-side lens 7-1 A light-splitting element is provided between them; as shown in Figure 2, the light-splitting element includes a light-splitting channel 12 and a plurality of filters 11 arranged in the light-splitting channel 12; the light-splitting channel 12 is provided with a channel corresponding to the light filter 11 mouth, wherein each channel mouth is aligned with the optical axis of a chip end lens 7-1, and another channel mouth is aligned with the light-through hole 66, and the number of the optical filter 11 is the same as the light beam that needs to be separated in the light splitting channel 12 If the quantity matches, splitting the light beam is equivalent to reflecting the light beam. The optical filters 11 are respectively located in the light splitting channel 12 where light splitting is required, and are placed obliquely at each channel opening. The inclination angle is 45 degrees to the light splitting channel 12. ; The filter 11 transmits or emits laser light of a specific wavelength;

在图2中,壳体1被中间的电磁屏蔽板13分隔成各个腔室,每个腔室中的激光收/发装置5有的为激光器芯片及其辅助电路,有的为探测器芯片及其辅助电路。 In Fig. 2, housing 1 is separated into each chamber by electromagnetic shielding plate 13 in the middle, and the laser sending/receiving device 5 in each chamber has laser chip and auxiliary circuit thereof, and what have is detector chip and its auxiliary circuit.

本实施例的工作过程如下: The working process of this embodiment is as follows:

所述激光器芯片发光经其腔室中的芯片端透镜7-1后,经过滤光片11透射或发射通过通光孔6发出,经过光纤端透镜8-1耦合进入光纤套筒9中跳线插芯17的光纤18中;由光纤18中传输而来的激光,入光纤端透镜8-1后再经通光孔6进入分光元件,经相应的滤光片11透射或反射后从通道口射出,通过芯片端透镜7-1耦合至相应的探测器芯片的光敏面。 After the laser chip emits light through the chip end lens 7-1 in its chamber, it is transmitted or emitted through the optical filter 11 and emitted through the light hole 6, and then coupled into the optical fiber sleeve 9 through the fiber end lens 8-1 to jumper In the optical fiber 18 of the ferrule 17; the laser light transmitted from the optical fiber 18 enters the optical fiber end lens 8-1 and then enters the spectroscopic element through the optical hole 6, and is transmitted or reflected by the corresponding optical filter 11 and then passes through the channel port. The output is coupled to the photosensitive surface of the corresponding detector chip through the chip-side lens 7-1.

当分光通道12内的弯折为不同角度时,滤光片11的倾斜角度也要做适应性调整,以保证分光元件能将各个腔室内的激光光束分别与通光孔6相通。 When the bends in the light-splitting channel 12 are at different angles, the inclination angle of the filter 11 should also be adjusted adaptively, so as to ensure that the light-splitting element can communicate the laser beams in each chamber with the light-through hole 6 respectively.

所述光接口部件包括光纤端透镜8-1和光纤套筒9;所述光纤端透镜8-1位于光纤套筒9一端和壳体1的通光孔6之间; The optical interface component includes an optical fiber end lens 8-1 and an optical fiber sleeve 9; the optical fiber end lens 8-1 is located between one end of the optical fiber sleeve 9 and the optical hole 6 of the housing 1;

所述激光器芯片及其辅助电路和其前侧的芯片端透镜7-1组成一组,所述探测器芯片及其辅助电路和其光敏面前侧的芯片端透镜7-1组成一组,两组之间由电磁屏蔽板13间隔开,故形成激光发射腔和激光接收腔。 The laser chip and its auxiliary circuit and the chip end lens 7-1 on the front side form a group, the detector chip and its auxiliary circuit and the chip end lens 7-1 on the photosensitive front side form a group, two groups The electromagnetic shielding plates 13 are spaced between them, so a laser emitting cavity and a laser receiving cavity are formed.

所述基座上还设置有通电接口4,通过键合线与过孔与所述激光收/发装置5进行所需的电连通,所述通电接口4伸出壳体1与外界电信号连通,所述通电接口4与壳体1之间通过密封胶19进行气密性密封; The base is also provided with an electrical interface 4, which is electrically connected to the laser receiving/transmitting device 5 through bonding wires and via holes, and the electrical interface 4 extends out of the housing 1 to communicate with external electrical signals , the airtight seal between the power interface 4 and the housing 1 is performed by a sealant 19;

所述激光收/发装置5的收/发激光光束经所述壳体1的通光孔6出入。 The receiving/emitting laser beam of the laser receiving/emitting device 5 enters and exits through the light hole 6 of the housing 1 .

除上述特征外,实施例2的其他特征与实施例1相同。 Other features of Embodiment 2 are the same as Embodiment 1 except for the above-mentioned features.

本发明结构简单、规则,采用平面贴片和键合,根据激光收/发装置5的排布需要将芯片支撑基座焊接或粘接在主基座上,形状规则,便于夹持,可使用常规的贴片设备和键合设备即可完成,无需专用定制设备,提高了生产和贴片封装的效率,且大大降低了制作本发明的人力成本和时间成本。 The present invention has a simple and regular structure, adopts planar patching and bonding, and welds or bonds the chip support base on the main base according to the arrangement of the laser receiving/transmitting device 5. The shape is regular, easy to clamp, and can be used Conventional SMT equipment and bonding equipment can be completed without special customized equipment, which improves the efficiency of production and SMT packaging, and greatly reduces the labor cost and time cost of making the present invention.

本发明设置两个聚光元件,加大聚光效果,提高了发射耦合效率与接收耦合的灵敏度,结构简单,利于自动化操作;采用插拔式电接口,利于使用。 The invention arranges two light-gathering elements, increases the light-gathering effect, improves the emission coupling efficiency and the sensitivity of the receiving coupling, has a simple structure, and is beneficial to automatic operation; adopts a plug-in electrical interface, and is convenient to use.

以上所述实施方式仅为本发明的优选实施例,而并非本发明可行实施的穷举。对于本领域一般技术人员而言,在不背离本发明原理和精神的前提下对其所作出的任何显而易见的改动,都应当被认为包含在本发明的权利要求保护范围之内。 The implementation manners described above are only preferred embodiments of the present invention, rather than an exhaustive list of feasible implementations of the present invention. For those skilled in the art, any obvious changes made without departing from the principle and spirit of the present invention should be considered to be included in the protection scope of the claims of the present invention.

Claims (10)

1. the multidirectional optical assembly of single fiber, is characterized in that: it comprises side with the housing (1) of light hole (6), the pedestal be fixed in described housing (1), at least 2 the laser receiving/transmitting devices (5) be arranged on described pedestal, the die terminals lens (7-1), beam splitter described die terminals lens (7-1) between and with described light hole (6) the coaxial optical interface parts that arrange that arrange coaxial with each described laser receiving/transmitting device (5);
Described optical interface parts comprise optical fiber end lens (8-1) and optical fiber sleeve (9); Described optical fiber end lens (8-1) are positioned between the light hole (6) of optical fiber sleeve (9) one end and housing (1);
Described beam splitter comprises a point optical channel (12) and is arranged on the optical filter (11) in a point optical channel (12);
Described laser receiving/transmitting device (5) is detector chip and auxiliary circuit thereof or chip of laser and auxiliary circuit thereof, and described laser receiving/transmitting device (5) sinters or be bonded on described pedestal;
Each described laser receiving/transmitting device (5) forms one group with the die terminals lens (7-1) of its Corresponding matching, often spaced apart by electromagnetic shielding plate (13) between group;
Described pedestal is also provided with energising interface (4), described energising interface (4) is stretched out housing (1) and is communicated with extraneous electric signal.
2. the multidirectional optical assembly of a kind of single fiber according to claim 1, is characterized in that: described pedestal comprises main basal base (2) and die support pad (3), and described die support pad (3) is arranged on main basal base (2); Described laser receiving/transmitting device (5) is arranged on die support pad (3).
3. a kind of optical assembly for optical-fibre communications according to claim 2, is characterized in that: the ceramic substrate that described main basal base (2) and die support pad (3) are one-sided metallic, the ceramic substrate of two-sided metallization, conventional pcb board, aluminum base PCB plate, copper base pcb board or include the moulding of metal line.
4. the multidirectional optical assembly of a kind of single fiber according to claim 2, is characterized in that: described energising interface (4) is arranged on described main basal base (2), and described energising interface (4) adopts and generates golden finger or row's pin in the upper wiring of main basal base (2).
5. the multidirectional optical assembly of a kind of single fiber according to claim 1, is characterized in that: described optical fiber sleeve (9) is plug-in optical fiber sleeve or tail-fiber type optical fiber sleeve;
Described plug-in optical fiber sleeve comprises cover cylinder shell (9-1-1) and side has the lock pin cylinder (9-1-2) in crack (9-1-3); Be enclosed within described lock pin cylinder (9-1-2) in sleeve housing (9-1-1), the outer wall of upper crack (9-1-3) offside of described lock pin cylinder (9-1-2) welds with cover cylinder shell (9-1-1) inwall, is inserted in lock pin cylinder (9-1-2) in external wire jumper lock pin (17);
Described tail-fiber type optical fiber sleeve comprises tail gum cover (9-2-1), tail optical fiber lock pin cylinder (9-2-2) and wire jumper lock pin (17); Described wire jumper lock pin (17) is welded in tail optical fiber lock pin cylinder (9-2-2), is arranged with tail gum cover (9-2-1) outside described tail optical fiber lock pin cylinder (9-2-2).
6. the multidirectional optical assembly of a kind of single fiber according to claim 1, it is characterized in that: described optical interface parts also comprise the gear platform (10) of middle with hole, coaxial seamless contact successively between optical fiber (18) three in described optical fiber end lens (8-1), gear platform (10) and wire jumper lock pin (17).
7. the multidirectional optical assembly of a kind of single fiber according to claim 1 or 6, is characterized in that: it also comprises die terminals lens supports seat (7-2) and optical fiber end lens supports seat (8-2); Described die terminals lens supports seat (7-2) and optical fiber end lens supports seat (8-2) are equipped with light hole;
Described die terminals lens (7-1) are fixed in die terminals lens supports seat (7-2), described die terminals lens (7-1) weld or are bonded on main basal base (2) by die terminals lens supports seat (7-2), and the optical axis of described die terminals lens (7-1) is coaxially corresponding with the light hole on die terminals lens supports seat (7-2); The photosurface of described detector chip or chip of laser corresponding with the optical axis of die terminals lens (7-1);
Described optical fiber end lens (8-1) are fixed in optical fiber end lens supports seat (8-2), described optical fiber end lens (8-1) weld or are bonded between the light hole (6) of optical fiber sleeve (7) one end and housing (1) by optical fiber end lens supports seat (8-2), and the light hole on the light hole (6) of described housing (1), optical fiber end lens supports seat (8-2), the optical axis of optical fiber end lens (8-1) are corresponding with the light shaft coaxle in wire jumper lock pin (14).
8. the multidirectional optical assembly of a kind of single fiber according to claim 7, it is characterized in that: described optical fiber end lens supports seat (8-2) is provided with the cylindrical shell of V-type groove (16) for one end, and described optical fiber end lens (8-1) are closely embedded in wherein by the V-type groove (16) of optical fiber end lens supports seat (8-2) one end.
9. the multidirectional optical assembly of a kind of single fiber according to claim 1, it is characterized in that: point optical channel (12) in described beam splitter is provided with passway, described passway aims at optical axis and the light hole (6) of each described die terminals lens (7-1) respectively, described optical filter (11) aligned with channel mouth slant setting.
10. the multidirectional optical assembly of a kind of single fiber according to claim 1, is characterized in that: described die terminals lens (7-1) and optical fiber end lens (8-1) are globe lens, non-globe lens, plano-convex lens or lens pillar.
CN201410835041.2A 2014-12-30 2014-12-30 A single-fiber multi-directional optical component Expired - Fee Related CN104570239B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107462956A (en) * 2017-08-14 2017-12-12 青岛海信宽带多媒体技术有限公司 Light-receiving secondary module and optical module
CN110310465A (en) * 2019-06-17 2019-10-08 深圳晶点光科有限公司 A kind of band light splitting optical fiber does the optical fiber manual fire alarm call point of signal designation
CN111830642A (en) * 2019-04-23 2020-10-27 和硕联合科技股份有限公司 Light Emitting Receiver Component Shielding Structure
CN112578507A (en) * 2019-09-29 2021-03-30 苏州旭创科技有限公司 Optical interface assembly and optical module
JP2022094172A (en) * 2020-12-14 2022-06-24 パナソニックIpマネジメント株式会社 Light emitting device, manufacturing method, and waveguide structure
CN115857115A (en) * 2022-09-26 2023-03-28 北京大学长三角光电科学研究院 A kind of packaging method of optical module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553082A (en) * 1991-08-29 1993-03-05 Nec Corp Semiconductor laser module
TW517473B (en) * 2000-09-05 2003-01-11 Zonu Inc Optical networking unit employing optimized optical packaging
US7013069B1 (en) * 2004-07-06 2006-03-14 Alliance Fiber Optic Products, Inc. Method and apparatus for separating channel signals
CN103048745A (en) * 2012-12-21 2013-04-17 深圳市易飞扬通信技术有限公司 Bidirectional optical subassembly and SFP (Small Form-factor Pluggable) optical transceiver module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553082A (en) * 1991-08-29 1993-03-05 Nec Corp Semiconductor laser module
TW517473B (en) * 2000-09-05 2003-01-11 Zonu Inc Optical networking unit employing optimized optical packaging
US7013069B1 (en) * 2004-07-06 2006-03-14 Alliance Fiber Optic Products, Inc. Method and apparatus for separating channel signals
CN103048745A (en) * 2012-12-21 2013-04-17 深圳市易飞扬通信技术有限公司 Bidirectional optical subassembly and SFP (Small Form-factor Pluggable) optical transceiver module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107462956A (en) * 2017-08-14 2017-12-12 青岛海信宽带多媒体技术有限公司 Light-receiving secondary module and optical module
CN107462956B (en) * 2017-08-14 2019-09-10 青岛海信宽带多媒体技术有限公司 Light-receiving secondary module and optical module
CN111830642A (en) * 2019-04-23 2020-10-27 和硕联合科技股份有限公司 Light Emitting Receiver Component Shielding Structure
CN110310465A (en) * 2019-06-17 2019-10-08 深圳晶点光科有限公司 A kind of band light splitting optical fiber does the optical fiber manual fire alarm call point of signal designation
CN110310465B (en) * 2019-06-17 2024-04-19 浙江东方职业技术学院 Optical fiber manual fire alarm button with light splitting optical fiber as signal indication
CN112578507A (en) * 2019-09-29 2021-03-30 苏州旭创科技有限公司 Optical interface assembly and optical module
JP2022094172A (en) * 2020-12-14 2022-06-24 パナソニックIpマネジメント株式会社 Light emitting device, manufacturing method, and waveguide structure
CN115857115A (en) * 2022-09-26 2023-03-28 北京大学长三角光电科学研究院 A kind of packaging method of optical module

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