CN104613437A - Anti-corrosion LED radiator - Google Patents
Anti-corrosion LED radiator Download PDFInfo
- Publication number
- CN104613437A CN104613437A CN201510070226.3A CN201510070226A CN104613437A CN 104613437 A CN104613437 A CN 104613437A CN 201510070226 A CN201510070226 A CN 201510070226A CN 104613437 A CN104613437 A CN 104613437A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating shell
- outer radiating
- etch
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005260 corrosion Methods 0.000 title abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 8
- 238000005286 illumination Methods 0.000 abstract description 6
- 238000004880 explosion Methods 0.000 abstract 2
- 230000002265 prevention Effects 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000003337 fertilizer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an anti-corrosion LED radiator, and belongs to the technical field of LED illumination lamps. The anti-corrosion LED radiator comprises an anti-corrosion outer radiating shell, an inner heat conduction substrate used for mounting of an LED light source and a cover body connected to the outer radiating shell, wherein the inner heat conduction substrate is mounted on the outer radiating shell. A closed radiating cavity is defined among the outer radiating shell, the inner heat conduction substrate and the cover body, a heat conduction device is arranged in the radiating cavity, and the heat conduction device is in contact connection with the outer radiating shell/inner heat conduction substrate. The anti-corrosion LED radiator solves the technical problems that an existing LED radiating device is poor in anti-corrosion performance, and can not achieve an explosion prevention effect and a good radiating effect at the same time, and has the advantages of being high in anti-corrosion performance and capable of achieving explosion prevention and good radiation at the same time.
Description
Technical field
The invention belongs to LED illumination lamp field, particularly the etch-proof LED radiator of one.
Background technology
LED is a kind of novel semi-conductor solid state light emitter, significant advantages such as having that luminous efficiency is high, long service life, energy saving, environmental protection, safe, nontoxic, the shockproof waterproof of low consumption, volume are little, lightweight, long service life, easily light modulation, maintenance are few, become the desirable substitute products of the light sources such as conventional light source incandescent lamp, fluorescent lamp, high/low pressure sodium lamp, gas-discharge lamp, mercury lamp, Halogen lamp LED, be acknowledged as the lighting source of energy-conserving and environment-protective.
The shell of current LED lamp is make with light metal material mostly, and anticorrosive property is poor, especially there is the place of acid, alkali, salt and salt fog strong corrosive material, needs etch-proof LED lamp outer shell.
The stainless steel material that the phosphorus content of anti-severe corrosive is extremely low or corrosion resistant nonmetallic materials heat conductivility poor, unfavorable to the heat radiation of LED chip and driving power, one of key issue that etch-proof LED lamp outer shell will solve is lamp outer casing not only anticorrosion but also solve the heat dissipation problem of LED chip.
Chinese patent literature CN101307891A discloses a kind of LED lamp of high efficiency and heat radiation, comprise lamp body, lamp body is provided with the LED electrical device chamber be connected in order, open heat dissipation cavity, LED illumination chamber, and open heat dissipation cavity is the space that there are many in picturesque disorder grid-like heat conduction ribs on open radiator top and are formed.The heat radiation of described LED lamp is realized by open heat dissipation cavity, described open heat dissipation cavity is directly exposed in outside air, extraneous natural wind realizes hot-air in open heat-dissipating cavity and extraneous cold air convection by the space between the many grid-like heat conduction ribs on open radiator top, the heat that LED light source produces is distributed, thus realizes efficient radiating effect.Disclosed in above-mentioned patent document during LED lamp heat radiation, open heat dissipation cavity is needed directly to be exposed in outside air, hot-air in open heat-dissipating cavity and extraneous cold air convection is realized by the space between many grid-like heat conduction ribs by extraneous natural wind, and then realize good heat radiation, therefore require that described LED lamp can not be airtight, thus can not be applicable to require explosion-proof situation, and the demand of corrosivity place to illumination cannot be met.
Summary of the invention
For this reason, technical problem to be solved by this invention is that existing LED heat abstractor corrosion resistance is poor, and explosion-proof and good radiating effect can not be realized simultaneously, thus provide a kind of corrosion resistance strong, have the etch-proof LED radiator of one that is explosion-proof and great heat radiation effect concurrently.
For solving the problems of the technologies described above, the etch-proof LED radiator of one of the present invention, comprise etch-proof outer radiating shell, for installing heat-conducting substrate in LED light source, described interior heat-conducting substrate is installed on described outer radiating shell, and the lid be connected on described outer radiating shell, the heat dissipation cavity of sealing is surrounded between described outer radiating shell and described interior heat-conducting substrate and described lid, arrange heat-transfer device in described heat dissipation cavity, described heat-transfer device contacts connect with described outer radiating shell/described interior heat-conducting substrate.
Described heat-transfer device extends along the length direction of described outer radiating shell, or described heat-transfer device extends along the length direction of described outer radiating shell and the plate face of described interior heat-conducting substrate.
Described heat-transfer device is at least one heat-conducting copper pipe.
Described interior heat-conducting substrate offers heat-conducting substrate groove at least one, the corresponding described interior heat-conducting substrate groove place of inwall of described outer radiating shell offers outer radiating shell groove, and described heat-conducting copper pipe is placed in described interior heat-conducting substrate groove and described outer radiating shell groove.
Be provided with the inner edge extended to the inside on the downside of described outer radiating shell, described interior heat-conducting substrate is installed on the upside of described inner edge.
Be provided with outward extending outer rim on the downside of described outer radiating shell, described interior heat-conducting substrate is installed on the bottom surface of described outer rim.
Described outer radiating shell periphery wall arranges at least one radiating fin.
Described heat-transfer device is the heat conducting film being arranged at described heat dissipation cavity inwall.
Described outer radiating shell be etch-proof non-metallic material or phosphorus content lower than 0.03% stainless steel, described interior heat-conducting substrate is that Heat Conduction Material is made, described Heat Conduction Material be in heat-conducting metal, heat-conducting plastic, conductive graphite, heat conducting nanometer material, thermal conductive ceramic material any one.
Install LED drive power in described heat dissipation cavity, be provided with power outlet hole in the middle of described interior heat-conducting substrate, described power outlet hole is communicated with described heat dissipation cavity, described lid is offered cable leading string holes.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) etch-proof LED radiator of the present invention, comprise etch-proof outer radiating shell, for installing heat-conducting substrate in LED light source, described interior heat-conducting substrate is installed on described outer radiating shell, and the lid be removably connected on described outer radiating shell, the heat dissipation cavity of sealing is surrounded between described outer radiating shell and described interior heat-conducting substrate and described lid, arrange heat-transfer device in described heat dissipation cavity, described heat-transfer device contacts connect with described outer radiating shell/described interior heat-conducting substrate.The heat that interior heat-conducting substrate can be made to produce that arranges of above-mentioned heat-transfer device quickly move through annular seal space and outer radiating shell and upper cover body in time and passes to outside air, and then under making it remain on lower temperature state, guarantee that the temperature of LED chip is lower, extend its service life; Secondly, described outer radiating shell and lid adopt anticorrosion material, there is while making LED lamp realize quick heat radiating the Corrosion Protection to acid, alkali, salt and salt fog strong corrosive material etc., the demand of the corrosivity workplaces such as oil, chemical industry, chemical fertilizer, production platform, port and pier, marine ships salt fog to illumination can be met.In addition, described lid can coordinate described outer radiating shell, described interior heat-conducting substrate makes described heat dissipation cavity form annular seal space, prevents outside air from entering, makes this radiator can be applied to explosion-proof occasion.
(2) etch-proof LED radiator of the present invention, described heat-transfer device extends along the length direction of described outer radiating shell, or described heat-transfer device extends along the length direction of described outer radiating shell and the plate face of described interior heat-conducting substrate, heat in described interior heat-conducting substrate can be passed to top by bottom described outer radiating shell fast, heat is made to realize the quick conductive of solid space, spread heat evenly, improve the radiating efficiency of this LED radiator.
(3) etch-proof LED radiator of the present invention, described outer radiating shell periphery wall arranges at least one radiating fin, heat on described outer radiating shell can fully be contacted with outside air fast radially, quick formation cross-ventilation, reaches timely and the effect of quick heat radiating.
(4) etch-proof LED radiator of the present invention, described heat-transfer device is the heat conducting film being arranged at described heat dissipation cavity inwall, make the heat of interior heat-conducting substrate can transmit by heat conducting film the inner peripheral surface spread to whole outer radiating shell fast, and then realize whole outer radiating shell from all angles outside quick heat radiating radially, effectively accelerate radiating efficiency.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the sectional view of the etch-proof LED radiator of embodiment 1;
Fig. 2 is the sectional view that the etch-proof LED radiator of embodiment 1 does not comprise heat-conducting copper pipe;
Fig. 3 is the top view of the etch-proof LED radiator of embodiment 1;
Fig. 4 is the top view that the etch-proof LED radiator of embodiment 1 does not comprise heat-conducting copper pipe;
Fig. 5 is the top view of heat-conducting substrate in embodiment 1;
Fig. 6 is the sectional view of heat-conducting substrate in embodiment 1;
Fig. 7 is the top view of the etch-proof LED radiator of embodiment 2.
Fig. 8 is the sectional view of the etch-proof LED radiator of embodiment 3.
In figure, Reference numeral is expressed as: the outer radiating shell of 1-, the outer radiating shell groove of 11-, 12-inner edge, 13-outer rim, heat-conducting substrate in 2-, heat-conducting substrate groove in 21-, 22-power outlet hole, 3-lid, 31-cable leading string holes, 4-heat dissipation cavity, 5-heat-conducting copper pipe, 51-VERTICAL TUBE, 52-horizontal tube, 6-radiating fin, 7-heat conducting film, 100-LED light source.
Detailed description of the invention
Below with reference to accompanying drawing, following examples are used to be further elaborated the present invention.
Embodiment 1
Consult Fig. 1 and Fig. 2, the present embodiment provides a kind of etch-proof LED radiator, comprise etch-proof outer radiating shell 1, for installing heat-conducting substrate 2 in LED light source 100, described interior heat-conducting substrate 2 is installed on described outer radiating shell 1, and the lid 3 be connected on described outer radiating shell 1, the heat dissipation cavity 4 of sealing is surrounded between described outer radiating shell 1 and described interior heat-conducting substrate 2 and described lid 3, arrange heat-transfer device in described heat dissipation cavity 4, described heat-transfer device contacts connection with described outer radiating shell 1 and described interior heat-conducting substrate 2 simultaneously.
Etch-proof LED radiator of the present invention applies in LED lamp, by LED light source 100 to be arranged on described interior heat-conducting substrate 2 and to be connected with power electric, when in the use procedure in LED lamp, when LED light source 100 sends a large amount of heats, heat can directly be dispersed on the described interior heat-conducting substrate 2 that directly contacts with LED light source 100, then be delivered on described outer radiating shell 1 rapidly by described heat-transfer device, heat simultaneously on described interior heat-conducting substrate 2 also can spill into whole described heat dissipation cavity 4 from bottom gradually, heat in described heat dissipation cavity 4 also can be delivered on described outer radiating shell 1, finally, heat is passed in outside air by described outer radiating shell 1 again, realize the heat loss through convection of air, can ensure that the heat on interior heat-conducting substrate 2 passes to outside air in time like this, and then under making it remain on lower temperature state, guarantee that the temperature of LED chip is lower, extend its service life.
In addition, described outer radiating shell 1 and lid 3 adopt anticorrosion material, there is while making LED lamp realize quick heat radiating the Corrosion Protection to acid, alkali, salt and salt fog strong corrosive material etc., the demand of the corrosivity workplaces such as oil, chemical industry, chemical fertilizer, production platform, port and pier, marine ships salt fog to illumination can be met.In the present embodiment, the material of preferred described outer radiating shell 1 and lid 3 be etch-proof non-metallic material or phosphorus content lower than 0.03% stainless steel, described interior heat-conducting substrate 2 and described heat-transfer device are that Heat Conduction Material is made, and described Heat Conduction Material to be specifically as follows in heat-conducting metal, heat-conducting plastic, conductive graphite, heat conducting nanometer material, thermal conductive ceramic material any one.
Described lid 3 coordinates described outer radiating shell 1, described interior heat-conducting substrate 2 makes described heat dissipation cavity 4 form annular seal space, prevents outside air from entering, makes this heat sink applications in explosion-proof place.
The concrete form of described heat-transfer device has multiple, consult Fig. 1 to Fig. 4, the present embodiment is preferably heat-conducting copper pipe 5, comprise the VERTICAL TUBE 51 that the length direction along described outer radiating shell 1 extends, the quantity of described heat-conducting copper pipe 5 is unrestricted, be 4 in the present embodiment, and be uniformly distributed on described heat dissipation cavity wall and described outer radiating shell 1 inwall.Described VERTICAL TUBE 51, heat in described interior heat-conducting substrate 2 can be passed to top by bottom described outer radiating shell 1 fast, make heat realize the quick conductive of solid space, spread heat evenly, more accelerate the heat radiation of described outer radiating shell 1 and LED lamp.
More preferably, described heat-conducting copper pipe 5 also comprises the horizontal tube 52 that the plate face along described interior heat-conducting substrate 2 extends.Described horizontal tube 52 is one-body molded with described VERTICAL TUBE 51, and extend near described LED light source by described VERTICAL TUBE 51, make the heat near described LED light source 100 directly can be delivered to described VERTICAL TUBE 51 fast by described horizontal tube 52, realize transmitting more fast, more timely of heat, be more conducive to follow-up heat radiation.
Coordinate and consult Fig. 5 and Fig. 6, the conveniently installation location of above-mentioned heat-conducting copper pipe 5, described interior heat-conducting substrate 2 offers heat-conducting substrate groove 21 at least one, corresponding described interior heat-conducting substrate groove 21 place of inwall of described outer radiating shell 1 offers outer radiating shell groove 11, and described heat-conducting copper pipe 5 is placed in described interior heat-conducting substrate groove 21 and described outer radiating shell groove 11.In the present embodiment, described VERTICAL TUBE 51 to be placed in described outer radiating shell groove 11 and to contact with described outer radiating shell 1, and described horizontal tube 52 to be placed in described interior heat-conducting substrate groove 21 and to contact with described interior heat-conducting substrate 2.
Consult Fig. 1, the mode that described interior heat-conducting substrate 2 is installed on described outer radiating shell 1 has multiple, and be provided with the inner edge 12 extended to the inside on the downside of the preferred described outer radiating shell 1 of the present embodiment, described interior heat-conducting substrate 2 is installed on the upside of described inner edge 12.Further, described inner edge 12 ringwise.
In order to improve radiating efficiency further, as shown in figures 1 and 3, the outer wall side face of the described outer radiating shell 1 of the present embodiment arranges radiating fin 6, described radiating fin 6 distributes radially at the outer peripheral face of described outer radiating shell 1, the material of described radiating fin 6 preferentially adopts anticorrosive to make, such as stainless steel material, nonmetallic materials etc., as long as can prevent acid, the other materials of alkali and salt corrosion all can prepare radiating fin 6.More preferably, the preferred described radiating fin 6 of the present embodiment adopts identical material one-body molded with described outer radiating shell 1.The setting of described radiating fin 6, makes the heat on described outer radiating shell 1 fully to contact with outside air radially fast, forms cross-ventilation fast, reach timely and the effect of quick heat radiating.
Install LED drive power in described heat dissipation cavity 4, be provided with power outlet hole 22 in the middle of described interior heat-conducting substrate 2, described power outlet hole 22 is communicated with described heat dissipation cavity 4, and described lid 3 offers cable leading string holes 31.Described cable leading string holes 31 is communicated with described heat dissipation cavity 4, cable connects and LED driving light source through cable leading string holes 31, and be connected to external power supply through power outlet hole 22, realize LED light source 5 luminous, make whole LED lamp structure compact simultaneously, also the heat being convenient to LED driving light source to give out passes to outer radiating shell 1 through interior heat-conducting substrate 2, so with outside air heat loss through convection.
Described etch-proof LED radiator of the present invention, can be applied in the LED lamp comprising general LED light source, also can be applied to and comprise in the LED lamp of explosion-proof LED light source.Time in the LED lamp being applied to explosion-proof LED light source, described heat dissipation cavity 4 must be annular seal space, prevents from drawing with contacting external air, avoids the situation of exploding to occur.In order to obtain better explosion-proof and sealing effectiveness, further fluid sealant can be set in the contact position of described heat dissipation cavity 4 inwall and described outer radiating shell 1, be formed and connecting sealing surface.
Embodiment 2
The present embodiment is substantially identical with embodiment 1, and difference is: described heat-transfer device is the heat conducting film 7 being arranged at described heat dissipation cavity 4 inwall.Consult Fig. 7, the present embodiment preferably arranges described heat conducting film 7 on the basis of heat-conducting copper pipe 5 being provided with embodiment 1 simultaneously, described heat conducting film 7 sticks the internal perisporium of described heat dissipation cavity 4, make the heat of described interior heat-conducting substrate 2 can transmit by described heat conducting film 7 inner peripheral surface spread to whole outer radiating shell 1 fast, and then realize whole outer radiating shell from all angles outside quick heat radiating radially, more effectively accelerate radiating effect.
Embodiment 3
Consult Fig. 8, the present embodiment is substantially identical with embodiment 1, and difference is: be provided with outward extending outer rim 13 on the downside of described outer radiating shell 1, and described interior heat-conducting substrate 2 is installed on the bottom surface of described outer rim 13.Described heat-conducting copper pipe 5 is fitted and connected in the vertical inner wall and diapire of described heat dissipation cavity 4, is namely fitted and connected on the upper face of described interior heat-conducting substrate 2 and the madial wall of described outer radiating shell 1.In order to improve the area of dissipation of heat-transfer device, described heat-conducting copper pipe 5 is shaped to the form of coil pipe.
When LED light source 100 dispels the heat, the heat part that it distributes directly passes to described VERTICAL TUBE 51 by the described horizontal tube 52 of the heat-conducting copper pipe 5 contacted with described interior heat-conducting substrate 2, another part heat is first delivered in heat dissipation cavity 4, be delivered to the described VERTICAL TUBE 51 with the heat-conducting copper pipe 5 of the contact internal walls of outer radiating shell 1 vertical direction again through heat dissipation cavity 4, and then realize dispelling the heat fast and efficiently.
In other embodiments, described heat-transfer device can also separately with described outer radiating shell 1 or contact separately with described interior heat-conducting substrate 2 and connect, and said structure can improve the radiating effect of LED radiator equally.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (10)
1. an etch-proof LED radiator, it is characterized in that: comprise etch-proof outer radiating shell (1), for installing the interior heat-conducting substrate (2) of LED light source (100), described interior heat-conducting substrate (2) is installed on described outer radiating shell (1), and the etch-proof lid (3) be connected on described outer radiating shell (1), the heat dissipation cavity (4) of sealing is surrounded between described outer radiating shell (1) and described interior heat-conducting substrate (2) and described lid (3), described heat dissipation cavity arranges heat-transfer device in (4), described heat-transfer device contacts connect with described outer radiating shell (1)/described interior heat-conducting substrate (2).
2. the etch-proof LED radiator of one according to claim 1, it is characterized in that: described heat-transfer device extends along the length direction of described outer radiating shell (1), or described heat-transfer device extends along the length direction of described outer radiating shell (1) and the plate face of described interior heat-conducting substrate (2).
3. the etch-proof LED radiator of one according to claim 1 and 2, is characterized in that: described heat-transfer device is at least one heat-conducting copper pipe (5).
4. the etch-proof LED radiator of one according to claim 3, it is characterized in that: described interior heat-conducting substrate (2) offers heat-conducting substrate groove (21) at least one, corresponding described interior heat-conducting substrate groove (21) place of inwall of described outer radiating shell (1) offers outer radiating shell groove (11), and described heat-conducting copper pipe (5) is placed in described interior heat-conducting substrate groove (21) and described outer radiating shell groove (11).
5. the etch-proof LED radiator of one according to claim 4, it is characterized in that: described outer radiating shell (1) downside is provided with the inner edge (12) extended to the inside, and described interior heat-conducting substrate (2) is installed on the upside of described inner edge (12).
6. the etch-proof LED radiator of one according to claim 4, it is characterized in that: described outer radiating shell (1) downside is provided with outward extending outer rim (13), and described interior heat-conducting substrate (2) is installed on the bottom surface of described outer rim (13).
7. the etch-proof LED radiator of one according to claim 1 and 2, is characterized in that: described heat-transfer device is for being arranged at the heat conducting film (7) of described heat dissipation cavity (4) inwall.
8., according to the arbitrary described etch-proof LED radiator of one of claim 1-7, it is characterized in that: described outer radiating shell (1) periphery wall arranges at least one radiating fin (6).
9. according to the arbitrary described etch-proof LED radiator of one of claim 1-8, it is characterized in that: described outer radiating shell (1), described lid (3) and described radiating fin (6) for etch-proof non-metallic material or phosphorus content lower than 0.03% stainless steel make, described interior heat-conducting substrate (2) is made for Heat Conduction Material, described Heat Conduction Material be in heat-conducting metal, heat-conducting plastic, conductive graphite, heat conducting nanometer material, thermal conductive ceramic material any one.
10. according to the arbitrary described etch-proof LED radiator of one of claim 1-9, it is characterized in that: in described heat dissipation cavity (4), LED drive power is installed, power outlet hole (22) is provided with in the middle of described interior heat-conducting substrate (2), described power outlet hole (22) is communicated with described heat dissipation cavity (4), described lid (3) is offered cable leading string holes (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070226.3A CN104613437A (en) | 2015-02-10 | 2015-02-10 | Anti-corrosion LED radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070226.3A CN104613437A (en) | 2015-02-10 | 2015-02-10 | Anti-corrosion LED radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104613437A true CN104613437A (en) | 2015-05-13 |
Family
ID=53148015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510070226.3A Pending CN104613437A (en) | 2015-02-10 | 2015-02-10 | Anti-corrosion LED radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104613437A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1966754A (en) * | 2004-11-19 | 2007-05-23 | 株式会社神户制钢所 | Highly corrosion resistant steel |
| CN201187752Y (en) * | 2007-12-28 | 2009-01-28 | 丽鸿科技股份有限公司 | Improved structure of LED explosion-proof lamp |
| CN101666477A (en) * | 2008-09-02 | 2010-03-10 | 白豪 | LED lamp and heat conduction structure thereof |
| CN201589110U (en) * | 2010-01-09 | 2010-09-22 | 沙振春 | LED lamp with magnesium alloy radiator structure |
| CN201636587U (en) * | 2010-01-29 | 2010-11-17 | 上海亮硕光电子科技有限公司 | LED (Light Emitting Diode) embedded cylindrical lamp |
| CN201652278U (en) * | 2010-04-28 | 2010-11-24 | 常州创能电子有限公司 | Electric box for electrodeless lamp |
| CN101994918A (en) * | 2009-08-12 | 2011-03-30 | 杨朔 | LED explosion-proof lamp |
| CN202209582U (en) * | 2011-05-11 | 2012-05-02 | 陕西斯达煤矿安全装备有限公司 | Flame-proof type LED roadway lamp |
| CN102705759A (en) * | 2012-05-28 | 2012-10-03 | 江苏好的节能光电科技有限公司 | LED (light-emitting diode) bright-light explosion-proof mining lamp |
| CN102829353A (en) * | 2012-08-20 | 2012-12-19 | 安徽皖投新辉光电科技有限公司 | Flame-proof type LED (Light Emitting Diode) explosive-proof lamp |
| CN103411191A (en) * | 2013-08-08 | 2013-11-27 | 南通恺誉照明科技有限公司 | Self-control adjusting heat storage type radiating LED (light-emitting diode) street light |
| US20140063806A1 (en) * | 2012-08-28 | 2014-03-06 | David Huang | Heat-Dissipating Structure for an LED Lamp |
| CN104132261A (en) * | 2014-04-28 | 2014-11-05 | 上虞市宝之能照明电器有限公司 | Efficient radiating type LED lamp |
| CN204372863U (en) * | 2015-02-10 | 2015-06-03 | 浙江兰普防爆照明有限公司 | A kind of etch-proof LED radiator |
-
2015
- 2015-02-10 CN CN201510070226.3A patent/CN104613437A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1966754A (en) * | 2004-11-19 | 2007-05-23 | 株式会社神户制钢所 | Highly corrosion resistant steel |
| CN201187752Y (en) * | 2007-12-28 | 2009-01-28 | 丽鸿科技股份有限公司 | Improved structure of LED explosion-proof lamp |
| CN101666477A (en) * | 2008-09-02 | 2010-03-10 | 白豪 | LED lamp and heat conduction structure thereof |
| CN101994918A (en) * | 2009-08-12 | 2011-03-30 | 杨朔 | LED explosion-proof lamp |
| CN201589110U (en) * | 2010-01-09 | 2010-09-22 | 沙振春 | LED lamp with magnesium alloy radiator structure |
| CN201636587U (en) * | 2010-01-29 | 2010-11-17 | 上海亮硕光电子科技有限公司 | LED (Light Emitting Diode) embedded cylindrical lamp |
| CN201652278U (en) * | 2010-04-28 | 2010-11-24 | 常州创能电子有限公司 | Electric box for electrodeless lamp |
| CN202209582U (en) * | 2011-05-11 | 2012-05-02 | 陕西斯达煤矿安全装备有限公司 | Flame-proof type LED roadway lamp |
| CN102705759A (en) * | 2012-05-28 | 2012-10-03 | 江苏好的节能光电科技有限公司 | LED (light-emitting diode) bright-light explosion-proof mining lamp |
| CN102829353A (en) * | 2012-08-20 | 2012-12-19 | 安徽皖投新辉光电科技有限公司 | Flame-proof type LED (Light Emitting Diode) explosive-proof lamp |
| US20140063806A1 (en) * | 2012-08-28 | 2014-03-06 | David Huang | Heat-Dissipating Structure for an LED Lamp |
| CN103411191A (en) * | 2013-08-08 | 2013-11-27 | 南通恺誉照明科技有限公司 | Self-control adjusting heat storage type radiating LED (light-emitting diode) street light |
| CN104132261A (en) * | 2014-04-28 | 2014-11-05 | 上虞市宝之能照明电器有限公司 | Efficient radiating type LED lamp |
| CN204372863U (en) * | 2015-02-10 | 2015-06-03 | 浙江兰普防爆照明有限公司 | A kind of etch-proof LED radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10584863B1 (en) | Light emitting diode luminaire | |
| KR101157065B1 (en) | Led lamp with waterproof and radiating structure | |
| CN201443739U (en) | LED explosion proof lamp | |
| CN202432348U (en) | LED explosion-proof mining lamp | |
| US20100309671A1 (en) | Led lamp heat dissipating module | |
| CN101865395A (en) | LED Lighting Fixtures | |
| CN203489111U (en) | LED (light emitting diode) tube-type mining lamp | |
| CN104565961B (en) | Anti-corrosion LED (Light Emitting Diode) lamp | |
| CN203052596U (en) | Radiator | |
| CN203298086U (en) | High-luminance LED spot lamp | |
| CN202303024U (en) | LED (light-emitting diode) outdoor lamp | |
| CN201858575U (en) | LED ceiling lamp for ships | |
| CN204372863U (en) | A kind of etch-proof LED radiator | |
| CN104613437A (en) | Anti-corrosion LED radiator | |
| CN204534188U (en) | A kind of erosion-resisting LED lamp | |
| KR101530611B1 (en) | Method of attaching heat pipe and led module for led cooling apparutus | |
| CN201585166U (en) | Oil cooling power supply for LED lamp | |
| CN101975341A (en) | High-power LED energy-saving lighting fixtures | |
| CN206361537U (en) | LED underwater lamps | |
| CN204879747U (en) | Waterproof illumination lamps and lanterns of freezer | |
| CN203628368U (en) | LED lamp housing and LED bulb lamp | |
| CN204285396U (en) | A kind of LED radiator | |
| CN203784684U (en) | led light bulb | |
| CN207378636U (en) | AC circuit anti-explosion LED lamps | |
| CN201541362U (en) | Power supply structure for high-power LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Hu Daoping Inventor before: Hu Daoping Inventor before: Wang Zhongmei |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171117 Address after: No. 222, Central Avenue, Yueqing Economic Development Zone, Zhejiang Province, Zhejiang Applicant after: LANP Electric Co., Ltd. Address before: 325600 Central Avenue, Yueqing Economic Development Zone, Wenzhou, Zhejiang Province, No. 222 Applicant before: ZHEJIANG LANPU EXPLOSION-PROOF LIGHTING CO., LTD. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150513 |
|
| RJ01 | Rejection of invention patent application after publication |