CN104676540B - L ED radiator - Google Patents

Abstract

A L ED radiator comprises a body, and a radiating assembly, a light source module, a side cover, a diffusion sheet and a cover plate which are sequentially connected to the body, wherein a mounting position is arranged on the body and used for mounting the radiating assembly, the radiating assembly is connected with the light source module, the light source module comprises a PCB and a plurality of L ED chips, the L ED chips are distributed on the PCB in a matrix arrangement mode, the side cover is arranged around the light source module and fixed on the light source module, the diffusion sheet is fixed at one end, far away from the light source module, of the side cover, and the radiating assembly, the light source module, the side cover and the diffusion sheet are arranged between the cover plate and the body.

Description

LED radiator

technical field

The invention relates to heat dissipation technology of electronic components, in particular to an LED radiator.

Background technique

LED is the abbreviation of light emitting diode in English. Its basic structure is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connected to the chip and circuit board with silver or gold wires. , and then around the lamp body sealed with epoxy resin. Because LEDs have excellent performances that many incandescent lamps or energy-saving lamps do not have, such as energy saving, environmental protection, working under low thermal voltage, safety and reliability, etc., they are being developed with each passing day.

However, the luminous efficiency of traditional LED lamps is low, and in the process of converting electrical energy into light energy, 80% of the electrical energy is converted into heat energy. The heat energy reacts to affect the luminescence of the LED lamp, so it is necessary to design a new heat sink that can quickly transfer the heat accumulated in the LED to the surrounding environment.

Contents of the invention

Based on this, it is necessary to provide an LED heat sink for the problem of how to dissipate heat quickly.

An LED heat sink, including a body and a heat dissipation component sequentially connected to the body, a light source module, a side cover, a diffusion sheet and a cover plate, the body is provided with a mounting position for installing the heat dissipation component; The heat dissipation component is connected to the light source module; the light source module includes a PCB board and a plurality of LED chips, and each of the LED chips is arranged in a matrix and distributed on the PCB board; the side cover is arranged and fixed around the light source module on the light source module; the diffuser is fixed on the end of the side cover away from the light source module; the heat dissipation assembly, the light source module, the side cover and the diffuser are arranged on Between the cover plate and the body.

In one of the embodiments, the body is a square or circular frame structure.

In one of the embodiments, installation positions are provided around the same side of the body for installing the heat dissipation assembly.

In one of the embodiments, the installation positions are arranged in different directions on the same side of the body.

In one of the embodiments, the installation positions are four inner screw holes.

In one of the embodiments, the side cover is hollow square or cylindrical.

In one of the embodiments, the side cover is made of hard heat-conducting plastic.

In one of the embodiments, the side wall inside the side cover is provided with a coating.

In one of the embodiments, the middle part of the cover plate is made of transparent glass.

In one of the embodiments, the cover plate is provided with mounting holes around the mounting position for screwing the cover plate to the body.

In one embodiment, the thickness of the thermally conductive silica gel is 0.01mm.

In one of the embodiments, the shape of the base is flat square or circular, and a closed cavity is opened inside the flat square or circular base, and the inside of the cavity is also provided with interconnected A number of chambers and a number of disturbing flow parts arranged inside the chambers.

In one embodiment, each of the heat sinks is provided with a plurality of through holes passing through both ends of the heat sink, and the shape of the through holes depends on the shape of the heat sink.

In one of the embodiments, the heat dissipation assembly includes a heat dissipation module, which is used to generate a driving force to force the driving air to move and take away heat after the power is turned on. The heat dissipation module includes a housing, a diaphragm, a driver chip, several air outlets and several air inlets, the diaphragm, the driver chip, several air outlets and several air inlets are arranged on the housing, and the air inlet and the air outlet correspond All have check valves.

In one embodiment, the air outlet of the heat dissipation module communicates with the cavity of the base, and the cavity of the base also communicates with the cavity of the heat sink.

The above-mentioned LED heat sink quickly dissipates the heat generated by the light source module to the surroundings through the heat dissipation component, and at the same time, uses air heat convection to quickly dissipate heat for the LED heat sink. The structure is simple and practical, and it is easy to popularize.

The above-mentioned LED radiator, by setting the thickness of the heat-conducting silica gel to 0.01mm, that is, when the heat-conducting silica gel is melted at a high temperature, due to the small amount and the air between the light source module and the base is squeezed to the outside, there is tension between the light source module and the base, This makes it difficult for the light source module to leave the base.

The above-mentioned LED heat sink, through the cavity and the turbulence part installed in the base, the air will change the original direction of travel after encountering interference during the flow process, so that the air in the cavity can fully contact the inner wall of the cavity and take away more heat.

The above-mentioned LED heat sink increases the heat dissipation efficiency of the heat sink by increasing the perforation on the heat sink, so that the perforation increases the contact area between the heat sink and the air.

The above-mentioned LED heat sink generates forced convection through the heat dissipation module, thereby quickly taking away heat around the heat dissipation component.

The above-mentioned LED radiator communicates with the cavity of the base through the air outlet of the heat dissipation module, and the cavity of the base also communicates with the cavity of the heat sink, so that the inside of the cavity of the base and the perforated hole of the heat sink are combined with the outside of the heat sink. The heat dissipation greatly improves the heat dissipation efficiency of the LED heat sink, thereby improving the service life and other performances of the LED heat sink, and has strong practicability.

Description of drawings

Fig. 1 is the structural representation of an embodiment of LED radiator of the present invention;

Fig. 2 is a schematic structural view of another embodiment of the LED heat sink of the present invention;

Fig. 3 is a schematic diagram of the connection structure of the heat dissipation assembly of the embodiment shown in Fig. 1;

Fig. 4a is a schematic diagram of a connection structure between the base and the heat sink of the embodiment shown in Fig. 1;

Fig. 4b is a schematic diagram of another connection structure between the base and the heat sink of the embodiment shown in Fig. 1;

Fig. 5a is a structural schematic view of the cavity of the base of the embodiment shown in Fig. 1;

Fig. 5b is another schematic structural view of the cavity of the base of the embodiment shown in Fig. 1;

6 is a schematic structural view of another embodiment of the LED heat sink of the present invention;

Fig. 7 is a schematic structural diagram of the heat dissipation module of the embodiment shown in Fig. 6;

FIG. 8 is a schematic diagram of air flow in the cooling module, the base and the cooling fins.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Please refer to FIG. 1 , the LED heat sink includes: a body 100 , a heat dissipation assembly 110 , a light source module 120 , a side cover 130 , a diffusion sheet 140 and a cover plate 150 , a heat dissipation assembly 110 , a light source module 120 , a side cover 130 , and a diffusion sheet 140 The cover plate 150 is sequentially connected to the main body 100 . Wherein, the main body 100 is provided with a mounting position 101 for installing the cooling assembly 110; the cooling assembly 110 is connected to the light source module 120 and fixed on the main body 100; the side cover 130 is arranged around the light source module 120 and fixed on the light source module 120 The diffusion sheet 140 is fixed on the end of the side cover 130 away from the light source module 120; the cover plate 150 cooperates with the body 100 to fix the heat dissipation assembly 110, the light source module 120, the side cover 130 and the diffusion sheet 140 on the cover plate 150 and the The body is between 100.

In order to support and assemble the entire LED heat sink, the body 100 includes a frame structure made of metal material, for example, the body 100 adopts a square or round frame structure of aluminum alloy. In this way, the frame structure can provide a certain structural space for installing the heat dissipation assembly 110 , the light source module 120 , the side cover 130 , the diffusion sheet 140 and the cover plate 150 . At the same time, due to the good thermal conductivity of metals, especially aluminum alloys are relatively cost-effective in terms of thermal conductivity and material cost, and the use of square or circular shapes is considered to be practical. Among them, the square shape is beneficial to be placed or installed on a plane, and the circular shape has a larger area, and more LED chips can be installed after being fitted with the same circular light source module 120 .

In other embodiments, the body 100 can use hard thermally conductive plastics, for example, thermally conductive plastics such as PP, ABS, PC, PA, LCP, PPS, PEEK among existing materials can be used. It is lighter than metal, so portable or wearable LED lights can be made by using heat-conducting plastics. In addition, since heat-conducting plastics, such as heat-conducting polymers, have the characteristics of flex resistance and tensile rigidity, they can also be made into LED electronic products with stricter size requirements.

In order to facilitate the installation of the heat dissipation assembly 110 , installation positions 101 are provided around the same side of the body 100 for installing the heat dissipation assembly 110 . For example, the installation positions 101 are disposed in different directions on the same side of the body 100 , that is, the installation positions 101 are disposed in four directions, front, rear, left, and right, on the same side of the body 100 . For example, the mounting position 101 is a plurality of internal screw holes, preferably, the mounting position 101 is four internal screw holes, and each internal screw hole is respectively opened at four corners of the body 100 . In this way, the heat dissipation assembly 110 can be assembled on the body 100 very conveniently by means of screw connection. In other embodiments, the installation position 101 can also be set in a plug-in manner.

In order to facilitate the combination of the LED heat sink with other components; for example, a connecting portion 102 is provided on the side of the body 100 away from the heat dissipation assembly 110 for hanging or hoisting the body 100, for example, the connecting portion 102 is a Hook or socket. In this way, when it is necessary to combine the LED radiator with other components, for example, when the LED radiator is suspended on the ceiling, a ring or slot for hanging is provided on the ceiling, and the LED radiator is connected with the hanging ring or slot. That's it.

In order to facilitate access to an external power supply, for example, a power interface is provided on the body 100 for connecting to an external power supply. For example, the power interface adopts 20+4pin, 4+4pin main power supply interface or SATA power supply interface or USB interface. In this way, when the LED radiator does not have a built-in power supply, it can supply power to the light source module 120 through the power interface; The ion battery provides charging and discharging, which is convenient and practical.

In order to ensure the safe use of the LED radiator, the main body 100 is also provided with a power over-current overload protector, and the power over-current overload protector is arranged between the light source module 120 and the power interface, so that the external power can be connected after passing through the power interface. To the power supply overcurrent and overload protector, and under the action of the power supply overcurrent and overload protector, prevent overcurrent, quick disconnection and short circuit, so as to ensure the normal use of the LED radiator.

Please refer to Fig. 2, in order to carry the LED radiator conveniently, the body 100 is provided with a lifting portion 103 for lifting the body 100, for example, the lifting portion 103 is a plate-shaped semi-circular ring, which is arranged on the side of the body 100, For example, it is fixed on the body 100 by welding or screwing. In this way, the carrying part 103 can be used for convenient carrying or the LED heat sink can be rotated or hung according to actual usage.

The main body 100 is provided with a mounting position 101 for installing the heat dissipation component 110. The heat dissipation component 110 is used to dissipate the heat generated by the light source module 120 after it is connected to the light source module 120, and is installed and fixed together with the light source module 120. Mounting position 101 on the body 100 . Referring to FIG. 3 , for example, the heat dissipation assembly 110 includes a base 111 and heat sinks 112 connected around the base 111 . The connection structure between the heat sink 112 and the base 111 is shown in FIG. 4 a and FIG. 4 b ; for example, the heat dissipation assembly 110 includes a square base 111 . As another example, a connection position is provided on the central area of the base 111 for connecting the light source module 120 .

In order to quickly transfer the heat of the light source module 120 to the base 111, for example, the base 111 is a square aluminum alloy base 111, and the surface of the base 111 is coated with a uniform layer of heat-conducting silica gel, and the light source module 120 is bonded to the surface of the base 111 In this way, due to the high thermal conductivity and low volume resistivity of the heat-conducting silica gel, the thermal contact resistance generated between the surface of the heat source and the contact surface of the LED heat sink can be reduced and the heat of the light source module 120 can be transferred to the base 111.

In order to prevent the heat-conducting silica gel from melting under the high temperature generated by the light source module 120 and dislodging after melting, for example, the amount of heat-conducting silica gel applied to the base 111 should be moderate, for example, the thickness of the heat-conducting silica gel is 0.01 mm and it is evenly applied on On the base 111 , compared to the thermally conductive silica gel with a thickness greater than 0.01mm, the amount of 0.01mm thick thermally conductive silica gel that can flow on the base 111 is very small when it is melted at high temperature. The connection with the light source module 120 can squeeze out the space between the base 111 and the light source module 120 after the base 111 is connected to the light source module 120, so that the heat-conducting silica gel is placed between the base 111 and the light source module 120 Tension is formed under the action of the base 111 and the light source module 120 so that the connection between the base 111 and the light source module 120 is more reliable. Tension exists between the group 120 and the base 111 , making it difficult for the light source module 120 to leave the base 111 . As another example, when it is necessary to install the LED heat sink on a fixed part, the base 111 is also provided with a limit block extending upward vertically from the base 111, that is, the limit block forms a groove in the middle of the base 111, and the light source module 120 It is arranged around the limit block in the middle area of the base 111 . In this way, when the heat-conducting silica gel is heated and melted, the liquefied heat-conducting silica gel will not flow out from the base 111 , and at the same time, the movement of the light source module 120 can be restricted, which is especially suitable for occasions where lighting is fixedly installed, such as ground lamps.

Please refer to FIG. 5a and FIG. 5b. In order to prevent the base 111 in contact with the light source module 120 from deteriorating due to heat accumulation and unable to dissipate heat quickly, for example, the shape of the base 111 is flat square or round, and the shape of the flat square or round An airtight cavity is opened inside the base 111, and a number of chambers communicating with each other are also provided inside the cavity, as well as a number of disturbing flow parts arranged inside the chambers. For example, a first chamber and a first spoiler, a second chamber and a second spoiler, a second chamber and a third spoiler communicated with each other are arranged inside the cavity, and each chamber communicates with the base 111 The center of the base 111 , and the chambers are 120 degrees apart and extend from the center of the base 111 to the outside. For example, the spoiler is a protrusion arranged on the inner side wall of the chamber, so that the air will change its original direction of travel after encountering the protrusion during the flow process, that is, interfere with the air flow direction so that the air in the chamber can fully contact the chamber. interior walls to remove more heat. In this way, the heat generated by the light source module 120 is transferred to the base 111 through the heat-conducting silica gel. The surface of the base 111 that contacts the side of the heat-conducting silica gel is heated. Since the LED chips on the light source module 120 are arranged in a matrix, that is, each LED chip is distributed at different positions on the base 111 . When the LED chip emits light and generates heat, the heat will be transferred to the base 111 which is in contact with the LED chip. The temperature of the part of the base 111 that is in contact with the LED chip will be higher than that of the part that does not contact the LED chip, and it will be indirectly reflected in the interior of the base 111, that is, because the interior of the base 111 is a closed hollow cavity, and there are first cavities that communicate with each other. chamber, the second chamber and the third chamber, when each chamber is unevenly heated, the air in the chamber will be disturbed due to uneven heating, the air with high temperature in the chamber will exchange with the air with low temperature, and Flow in each chamber, and spread the temperature of the contact part of the base 111 with the LED chip to the whole base 111, and transfer the heat to the surrounding under the action of the heat sink 112, thereby preventing the heat generated by the LED chip from damaging the base 111, It is especially suitable for the situation where LED chips that generate heat sources are arranged and installed in a dispersed manner.

In order to install the heat sink 112 around the base 111 , for example, joints are provided around the base 111 , for example, the joints are a plurality of slots, and the heat sink 112 is fixed to the base 111 by buckles. In this embodiment, the junction is a sintering point, and the heat sink 112 and the base 111 are integrally formed by sintering. Due to the buckle method and the sintering method, the heat sink 112 and the base 111 can be fully contacted, the air between the two is reduced, and the air is prevented from hindering heat transfer between the contact surfaces of the heat sink 112 and the base 111 . In this way, by installing the cooling fins 112 around the base 111 , when the heat is transferred to the base 111 , the base 111 can conduct the heat to the surroundings through the plurality of cooling fins 112 .

In order to increase the heat dissipation efficiency of the heat sink 112, the heat sink 112 adopts a metal or metal compound with high thermal conductivity, for example, aluminum-manganese alloy or metal copper. As another example, each heat sink 112 offers a number of perforations through the two ends of the heat sink 112, that is, the perforations are provided in the heat sink 112 along the length direction of the heat sink 112, that is, the heat sink 112 is a hollow sheet, and the hollow part Through the two ends of the heat sink 112, the shape of the perforation depends on the shape of the heat sink 112. In this way, several perforations can increase the contact area between the heat sink 112 and the air, thereby improving the heat dissipation efficiency of the heat sink 112. As another example, each heat sink 112 is a thin cylinder, and each thin cylinder is arranged around the base 111. In this way, several thin cylinders can increase the contact area between the heat sink 112 and the air, and also increase the heat dissipation efficiency of the heat sink 112.

Please refer to FIG. 6 , in order to achieve a better heat dissipation effect, the heat dissipation assembly 110 includes a heat dissipation module 115 for generating a driving force to force the air to move and take away heat after the power is turned on. For example, the heat dissipation module 115 is disposed on a side of the heat dissipation assembly 110 facing away from the light source module 120 . Please refer to Fig. 7, the cooling module 115 includes a housing 115a, a vibrating film 115b, a driver chip 115c, a number of air outlets 115d and a number of air inlets 115e, a vibrating film 115b, a driver chip 115c, a number of air outlets 115d and a number of air inlets 115e It is arranged on the housing 115a, and the air inlet 115e and the air outlet 115d are respectively provided with check valves 115f. Its working method is as follows: after the drive chip 115c is powered on, it drives the vibrating membrane 115b to vibrate, and after the vibrating membrane 115b vibrates, it forces the air in the casing 115a to flow out from the air outlet 115d on the rising edge of its vibration, and forces the air in the housing 115a to flow out from the air outlet 115d on the falling edge of its vibration. The air outside the driving housing 115a enters through the air inlet 115e, so that the air flowing out from the air outlet 115d creates forced convection with the surrounding air, thereby rapidly taking away the heat around the heat dissipation assembly 110 .

In order to make the heat dissipation module 115 generate a stronger driving force, for example, the housing 115a is circular or square and made of hard material, for example, metal or hard plastic. Preferably, the housing 115a is made of a circular hard insulating plastic material, and the interior is hollow and sealed. In this way, the hard plastic can ensure that the vibrating membrane 115b is the only place where the entire heat dissipation module 115 vibrates, so that the air can flow smoothly from several The air flows through the air outlet 115d and several air inlets 115e.

The housing 115a is provided with a through hole for installing the vibrating film 115b. The vibrating film 115b is sealed and installed on the housing 115a along the periphery of the through hole. The edge of the vibrating film 115b in contact with the through hole is sealed with a sealant, for example, silicon Rubber, polysulfide rubber, neoprene and epoxy sealants, etc. In order to reduce the interference of external objects on the vibrating membrane 115b, the vibrating membrane 115b is installed on the side of the through hole close to the inside of the housing 115a, and the other side of the through hole away from the inside of the housing 115a is also provided with spacers arranged at equal intervals. The bars, on the one hand, are ventilated, and on the other hand, can effectively prevent external damage to the vibrating membrane 115b, thereby ensuring the normal operation of the vibrating membrane 115b.

After the vibrating membrane 115b is sealed and mounted on the casing 115a along the periphery of the through hole, the driving chip 115c is connected to the vibrating membrane 115b and fixed outside the casing 115a. The driving chip 115c is also provided with conductive wires, and the driving chip 115c is connected to the external power supply through the conductive wires after being connected to the vibrating membrane 115b. For example, the conductive wire is electrically connected to the light source module 120 in parallel. In this way, when the light source module 120 is energized to work, the vibrating membrane 115b is also energized to work, so that lighting and heat dissipation can be performed synchronously.

Several air outlets 115d are provided on the housing 115a near the gap between the two heat sinks 112, that is, the air flow direction of the air outlets 115d is along the extending direction of the heat sink 112, so that the air on the surface of the heat sink 112 produces forced convection to dissipate The heat of the heat sink 112 is carried away. Several air inlets 115e are opened on the side of the vertical cooling fin 112 direction of the housing 115a, that is, the air inlet 115e is opened on the side of the housing 115a away from the cooling fin 112 and the base 111, so that the air entering from the air inlet 115e is Cool air, thus increasing efficiency. Each air outlet 115d and air inlet 115e are provided with a check valve 115f, and the air flow direction of the check valve 115f of each air outlet 115d is directed from the inside of the housing 115a to the outside of the housing 115a, and the check valve of each air inlet 115e The airflow direction of the valve 115f is from the outside of the housing 115a to the inside of the housing 115a. From the formula of fluid mechanics: Q=H·A·ΔT, where Q is the heat taken away by heat convection, H is the value of the heat convection coefficient (Hest Transfer Coefficient), A represents the "effective" contact area when heat convection occurs, ΔT represents the temperature difference between the solid surface and the local fluid (Local Ambient). It can be known that the heat dissipation effect of the heat dissipation assembly 110 can be greatly improved by using the heat dissipation module 115 .

Please refer to FIG. 8 , in order to further improve the heat dissipation efficiency of the heat dissipation assembly 110 , the air outlet 115 d of the heat dissipation module 115 communicates with the chamber of the base 111 , and the chamber of the base 111 also communicates with the chamber of the heat sink 112 . For example, the heat dissipation module 115 is provided with three air outlets 115d, and the three air outlets 115d are connected to the first chamber, the second chamber and the second chamber of the base 111 in one-to-one correspondence, and the first chamber, the second chamber of the base 111 The chamber and the third chamber are also provided with a number of engagement holes communicating with the through holes of the heat sink 112 . That is, the air outlet 115d generates a forced airflow to drive air convection in the chamber of the base 111 and the perforation of the heat sink 112, thereby achieving the effect of improving heat dissipation efficiency. Specifically: when the cooling module 115 works, the vibrating membrane 115b is energized to work, and when it vibrates, air flows in from the air inlet 115e and flows out from the air outlet 115d, and the air flowing out from the air outlet 115d enters the cavity of the base 111, due to the vibrating membrane 115b continues to work, and the air continues to enter the cavity of the base 111. The air entering the cavity of the base 111 then flows into the perforation of the heat sink 112, and finally the air flows out from the perforation of the heat sink 112 with heat, so that the inside of the cavity and the perforation Realize heat dissipation. At the same time, other air outlets 115d of the cooling module 115 that are not connected to the cavity of the base 111 generate forced airflow to drive the air around the cooling fin 112 to convect, thereby realizing heat dissipation outside the cooling fin 112 . In this way, the cavity of the base 111 and the perforated interior of the heat sink 112 are combined with the outside of the heat sink 112 to dissipate heat, which greatly improves the heat dissipation efficiency of the LED heat sink, thereby improving the service life and other performances of the LED heat sink. Strong practicability and easy promotion.

The light source module 120 includes a PCB board and a plurality of LED chips, each LED chip is arranged in a matrix and distributed on the PCB board, and the PCB board is fixedly connected to the connection position of the base 111 by an adhesive. For example, the light source module 120 uses a COB light source to overcome the defects of traditional LED lamp beads and realize a flat display light source. At the same time, the installation is more convenient and simple, and the cost control is lower. As another example, the light source module 120 adopts an LED patch module, that is, a component composed of patch-type LED lamp beads surface-attached on the PCB and then soldered with electric wires, so that the light source module 120 has a large luminous angle and high brightness. , low light attenuation and other advantages, a wide range of applications.

The side cover 130 is made of hard heat-conducting plastic, which is hollow square or cylindrical, and its specific shape is adapted according to the shapes of the heat dissipation assembly 110 and the light source module 120 . In order to increase the heat dissipation capability of the side cover 130 in terms of heat radiation, for example, a coating is provided on the side wall inside the side cover, and the coating adopts dark green paint or pigment, or adopts a material having a body material that is dark green , for example, chromium oxide green. In another example, the thickness of the coating is 0.1mm. As another example, the side wall inside the side cover 130 is sprayed with dark green paint or painted with dark green paint, and at the same time, the base is also connected to the heat dissipation assembly 110, so that the heat produced by the light source module 120 can also be dissipated by heat radiation. Part of the heat is dissipated to the surroundings through the side cover 130 .

In order to achieve different luminous effects, the top of the side cover 130 away from the light source module 120 is also provided with a clamping position for installing a diffuser 140 , and the diffuser 140 is clamped and fixed on the top of the side cover 130 . For example, the base material of the diffuser 140 is a material with high light transmittance, such as PET/PC/PMMA.

In order to prevent the LED radiator installed or used outdoors from being damaged by foreign objects or rainwater, the LED radiator is also provided with a cover plate 150, and the cover plate 150 cooperates with the main body 100 of the frame structure to connect the light source module 120, side cover 130, The diffusion sheet 140 and the like are covered in the hollow, and the middle part of the side wall of the cover plate 150 for transmitting light is made of transparent glass or other materials with high light transmittance, for transmitting light from the light source module 120 In this way, on the one hand, the LED light can pass through the light, and on the other hand, it can be used as a protective layer to isolate the LED heat sink from the outside world to prevent damage to components such as the light source module 120 by foreign objects or rainwater immersion. In addition, the cover plate 150 is provided with mounting holes around the mounting position 101 for screwing the cover plate 150 onto the body 100 .

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (1)

1. a kind of LED radiator, including body and be connected in turn on the body radiating subassembly, light source module group, side cover, expansion Discrete piece and cover board, it is characterised in that

Installation position is provided with the body, for installing the radiating subassembly；

The radiating subassembly connects the light source module group；

The light source module group includes pcb board and some LED chips, and each LED chip is distributed in pcb board into matrix arrangement On；

The side cover sets around the light source module group and is fixed in the light source module group；

The diffusion sheet is fixed on one end of the remote light source module group of the side cover；

The radiating subassembly, the light source module group, the side cover and the diffusion sheet are arranged at the cover board and the body Between；

The side away from the radiating subassembly is provided with connecting portion on the body；

The portion of lifting is provided with the body, for lifting body, the portion of lifting is a tabular semicircular ring, the tabular semicircle Ring is arranged at the side of the body；

The radiating subassembly includes base and is connected to the heat sink of the base surrounding, and the base is square aluminium alloy Base, the susceptor surface apply the uniform heat conductive silica gel of last layer, and the light source module group is bonded in the heat conduction of the susceptor surface On silica gel；

Heat conductive silica gel thickness is 0.01mm and is equably applied on base, and base surrounding is additionally provided with vertical feet and upwardly extends Limited block, light source module group is arranged on base intermediate region around limited block；

The inside of the base offers closed cavity, and the cavity inside is provided with the first chamber to communicate with each other and first Spoiler, second chamber and the second spoiler and second chamber and the 3rd spoiler, each chamber is in the base Center, extends outward into 120 degree and by the center of the base between each chamber；The body to be square or Circular frame structure；

The surrounding that the body is located at same side is provided with installation position, for installing the radiating subassembly；

The installation position is arranged at the different direction that the body is located at same side；

The installation position is four female screw holes；

The side cover is hollow square or cylindrical；

The side cover is made of hard heat-conducting plastic；

Coating is provided with side wall inside the side cover；

Transparent glass is used in the middle part of the cover board；

The cover board surrounding is provided with the mounting hole coordinated with the installation position, for the cover board to be bolted in the body On.