CN104752851A - System - Google Patents

Abstract

A system is provided that includes a first printed circuit board, a second printed circuit board, and a third printed circuit board. The first connecting terminal of the first connector is mounted on the first plane of the first printed circuit board. The first connection terminal of the second connector is mounted on the second plane of the first printed circuit board. The second connection terminal of the first connector is installed on the first plane of the second printed circuit board. The third printed circuit board is mounted with the second connection terminals of the second connector. The second printed circuit board is connected to the first printed circuit board through the first connector. The first printed circuit board is parallel to the second printed circuit board. The third printed circuit board is connected to the first printed circuit board through the second connector. The above solution helps to reduce the cost of the backplane.

Description

a system

technical field

The invention relates to the field of electronic technology, in particular to a system.

Background technique

A printed circuit board (PCB) can be used to realize the electrical connection of electronic components.

In some systems, a PCB with a specific function needs to be plugged into the backplane. The backplane can also be implemented with a PCB. For example, a PCB for processing video signals and a PCB for processing audio signals are plugged into the PCB serving as the backplane. As the system provides more and more powerful functions, the PCB as the backplane needs to contain an increasing number of layers to provide support for the PCB with specific functions. However, as the number of layers in the PCB serving as the backplane increases, the cost of the backplane also increases. Therefore, how to design a low-cost backplane is an important issue.

Contents of the invention

Embodiments of the present invention provide a system that helps reduce the cost of the backplane.

In order to solve the above technical problems, the embodiment of the present invention discloses the following technical solutions:

In a first aspect, a system is provided, the system includes a first printed circuit board, a second printed circuit board, and a third printed circuit board, and a first connector is mounted on a first plane of the first printed circuit board The first connecting terminal of the first printed circuit board is installed on the second plane of the first printed circuit board, and the first connecting terminal of the second connector is installed on the first plane of the second printed circuit board. the second connection terminal of the second connector, the third printed circuit board is installed with the second connection terminal of the second connector;

The second printed circuit board is connected to the first printed circuit board through the first connector, specifically, the second printed circuit board is connected through the second connection terminal of the first connector to the first connection terminal of the first connector mounted on the first printed circuit board parallel to the second printed circuit board;

the third printed circuit board is connected to the first printed circuit board through the second connector;

Wherein, the first printed circuit board includes a first layer, the second printed circuit board includes a second layer, and the layers that need to be used when the third printed circuit board works include the first layer and the second layer. layer, the third printed circuit board is electrically connected to the first layer through the second connector, and the third printed circuit board is connected to the first layer through the second connector, the second connector and the first layer. The wires between the connectors and the first connector are electrically connected to the second layer.

According to the first aspect, in a first possible implementation manner, the first layer in the first printed circuit board includes a data signal layer, and the second layer in the second printed circuit board includes a power supply layer. Signal layer and data signal layer;

The first connector includes a data signal connector and a power supply signal connector, and the second connector includes a data signal connector and a power supply signal connector.

According to the first possible implementation of the first aspect, in the second possible implementation, the data signal layer in the first printed circuit board includes a high-speed data signal layer, and the data signal layer in the second printed circuit board The data signal layer includes a high-speed data signal layer and a low-speed data signal layer;

The first connector includes a high-speed data signal connector, a low-speed data signal connector, and a power supply signal connector.

According to the first possible implementation manner of the first aspect, in a third possible implementation manner, the data signal layer in the first printed circuit board includes a high-speed data signal layer, and the data signal layer in the second printed circuit board The data signal layer includes a low-speed data signal layer;

The first connector includes a low-speed data signal connector and a power supply signal connector.

According to the first aspect, in the fourth possible implementation manner, the first layer in the first printed circuit board includes a data signal layer, and the second layer in the second printed circuit board includes a power supply signal layer. layer;

The first connector includes a power supply signal connector, and the second connector includes a data signal connector and a power supply signal connector.

According to the fourth possible implementation of the first aspect, in the fifth possible implementation, the data signal layer in the first printed circuit board includes a high-speed data signal layer and a low-speed data signal layer; the second Connectors include high-speed data signal connectors, low-speed data signal connectors, and power supply signal connectors.

According to the first aspect and any one implementation manner of the first aspect, in a sixth possible implementation manner, implementing the electrical connection between the third printed circuit board and the second layer specifically includes:

The wires between the first connector and the second connector pass through the packaging hole on the first printed circuit board.

According to the first aspect and any one implementation manner of the first aspect, in a seventh possible implementation manner, implementing the electrical connection between the third printed circuit board and the second layer specifically includes:

The wires between the first connector and the second connector are located on a layer of the first printed circuit board.

According to the first aspect and any implementation manner of the first aspect, in an eighth possible implementation manner, the second printed circuit board includes multiple printed circuit boards, the second layer includes multiple layers, and Each printed circuit board of the plurality of printed circuit boards includes at least one of the plurality of layers.

According to an eighth possible implementation manner of the first aspect, in a ninth possible implementation manner, the multiple printed circuit boards are located on the same plane.

In an embodiment of the present invention, the system includes a first printed circuit board, a second printed circuit board and a third printed circuit board. Wherein, the layers required for the operation of the third printed circuit board in the system are respectively located in the first printed circuit board and the second printed circuit board. That is to say, both the first printed circuit board and the second printed circuit board are the backplane of the third printed circuit board. The first printed circuit board need not include all of the layers required for the third printed circuit board to function. The second printed circuit board need not include all of the layers required for the third printed circuit board to function. The first printed circuit board includes only a portion of the layers required for the third printed circuit board to function. The second printed circuit board need not include all of the layers required for the third printed circuit board to function. Therefore, the above technical solution helps to reduce the number of layers in the first printed circuit board and the number of layers in the second printed circuit board. The fewer the number of layers in the backplane, the lower the cost of the backplane. Therefore, the above technical solution helps to reduce the cost of the backplane.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, In other words, other drawings can also be obtained from these drawings without paying creative labor.

FIG. 1 is a schematic diagram of a system provided in an embodiment of the present invention;

Fig. 2 is another system schematic diagram provided in the embodiment of the present invention;

Fig. 3 is a schematic diagram of another system provided in the embodiment of the present invention;

4-1, 4-2 and 4-3 are schematic structural diagrams of the second printed circuit board provided in the embodiment of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, the following describes the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings For further detailed explanation.

Some technologies involved in the embodiments of the application documents are described below. If there is no indication to the contrary, the layers in the embodiments refer to the layers in the PCB. For example, a PCB may include one or more layers. If the PCB includes only one layer, the PCB may be a single sided PCB. If the PCB includes only two layers, the PCB can be a double sided (double sided) PCB. During specific implementation, the layer in the embodiment may specifically be a copper layer (copper layer). The copper layer can be obtained by etching a copper sheet. The copper sheet can be located on an insulating substrate (non-conductive substrate) in the PCB. For example, the layer in the embodiment may be a power supply signal layer or a data signal layer. The power supply signal layer is used for transmitting power supply signals. The data signal layer is used for transmitting data signals. In addition, the embodiments relate to connectors. Connectors can be used to connect multiple PCBs. The connector may be a power supply signal connector or a data signal connector. The power supply signal connector is used to transmit the power supply signal. Data signal connectors are used to transmit data signals. Specifically, the power supply signal connector can be used to transmit power supply signals to the connected PCB. Data signal connectors can be used to transmit data signals to the connected PCB.

Referring to FIG. 1 , an embodiment of the present invention provides a system. The system comprises a first printed circuit board 11 , a second printed circuit board 12 and a third printed circuit board 13 . The first connecting terminal of the first connector 14 is installed on the first plane of the first printed circuit board 11 . The first connection terminal of the second connector 15 is mounted on the second plane of the first printed circuit board 11 . The second connection terminal of the first connector 14 is installed on the first plane of the second printed circuit board 12 . The third printed circuit board 13 is mounted with the second connection terminal of the second connector 15 .

The second printed circuit board 12 is connected to the first printed circuit board 11 through the first connector. Specifically, the second printed circuit board 12 is connected to all terminals of the first connector 14 mounted on the first printed circuit board 11 through the second connection terminal of the first connector 14. the first connecting terminal. The first printed circuit board 11 is parallel to the second printed circuit board 12 .

The third printed circuit board 13 is connected to the first printed circuit board 11 through the second connector 15 .

Wherein, the first printed circuit board 11 includes a first layer, the second printed circuit board 12 includes a second layer, and the layers that need to be used when the third printed circuit board 13 works include the first layer and the first layer. Describe the second layer. The third printed circuit board 13 is electrically connected to the first layer through the second connector 15, the third printed circuit board 13 is connected through the second connector 15, the second connector 15 The wire between the first connector 14 and the first connector 14 are electrically connected to the second layer.

The first printed circuit board 11 is a backplane. The second printed circuit board 12 is a backplane. It should be noted that FIG. 1 is a schematic diagram of a system in an embodiment of the present invention. In the diagram, the numbers of the first printed circuit board 11 , the second printed circuit board 12 and the third printed circuit board 13 are 1, 1 and 2, respectively. The numbers of the first connectors 14 and the second connectors 15 are 2 and 2, respectively. This embodiment does not limit the number of objects in the schematic diagram. For example, in actual implementation, the number of the third printed circuit board 13 may be one. The number of second connectors 15 may be one.

For ease of understanding, the terms involved in the above system are given examples below.

The third printed circuit board 13 may refer to a printed circuit board used to implement a certain function in the system. For example, the third printed circuit board 13 may be a switching fabric board, an interface board or a main control board. For example, the third printed circuit board 13 may be a printed circuit board in a network device. The network device may be a router, a network switch, a firewall, a load balancer, a base station or a data center. During specific implementation, the third printed circuit board 13 may include a network processor. The network processor may be implemented by a field programmable gate array (field programmable gate array, FPGA) or an application-specific integrated circuit (application-specific integrated circuit, ASIC). In addition, the number of the third printed circuit board 13 may be 1 or an integer greater than 1.

The first printed circuit board 11 and the second printed circuit board 12 provide the third printed circuit board 13 with layers required for the operation of the third printed circuit board 13 . In addition, the first printed circuit board 11 and the second printed circuit board 12 can also play the role of connecting and supporting the third printed circuit board 13 . Since the first printed circuit board 11 and the second printed circuit board 12 provide the layers required for other printed circuit boards to work, the first printed circuit board 11 and the second printed circuit board can be 12 is called a backboard. The first printed circuit board 11 and the second printed circuit board 12 may also be referred to as a motherboard. In the embodiment of the present invention, the backplane of the third printed circuit board 13 includes the first printed circuit board 11 and the second printed circuit board 12 . Wherein, the number of the first printed circuit board 11 may be one. When the number of third printed circuit boards 13 in the system is an integer greater than 1, each third printed circuit board 13 is connected to the first printed circuit board 11 . The second printed circuit board 12 may be 1 or an integer greater than 1. No other PCB is included between the second printed circuit board 12 and the first printed circuit board 11 . Other PCBs are included between the third printed circuit board 13 and the second printed circuit board 12 .

The first connector 14 can provide mechanical and electrical connection between the first printed circuit board 11 and the second printed circuit board 12 through packaging holes or surface mounting. Wherein, in order to realize this physical connection, the first connector 14 may include a first connection terminal and a second connection terminal. Wherein, a first connection terminal (such as a male terminal) of the first connector 14 is mounted on a first plane (such as a back surface) of the first printed circuit board 11 . Correspondingly, the second connection terminals (such as female terminals) of the first connector 14 are installed on the first plane of the second printed circuit board 12 . In this way, the second printed circuit board 12 can be connected to the first connector 14 mounted on the first printed circuit board 11 through the second connection terminal of the first connector 14. first connection terminal. Wherein, there may be one or more first connectors 14 . The first printed circuit board 11 and the second printed circuit board 12 may be parallel. The first connector 14 can also be used to transfer signals between the first printed circuit board 11 and the second printed circuit board 12, so as to realize the electrical connection between the two. According to different types of information to be transmitted, the first connector 14 may include a data signal connector and a power supply signal connector.

In addition, it should be noted that the data signals to be transmitted may include high-speed data signals and low-speed data signals. High-speed data signals and low-speed data signals are relative concepts. For example, a data signal with a transmission rate of 1 Gbps or above may be a high-speed data signal. The data signal whose transmission rate is below 1 Gbps may be a low-speed data signal. In addition, the high-speed data signal may include switching network cells. The low-speed data signal may include at least one of control information and configuration information. Therefore, the data signal connector may also be a high-speed data signal connector or a low-speed data signal connector. In addition, since the high-speed data signal connector can also be used to transmit low-speed data signals, only the high-speed data signal connector can be used to transmit high-speed data signals and low-speed data signals.

The second connector 15 may be similar to the first connector 14 in terms of physical structure. The second connector 15 is used to realize the electrical connection between the first printed circuit board 11 and the third printed circuit board 13 . After connection, the third printed circuit board 13 may be vertical to the first printed circuit board 11 . Certainly, the third printed circuit board 13 may not be perpendicular to the first printed circuit board 11 . For example, the angle between the third printed circuit board 13 and the first printed circuit board 11 is an acute angle. For other relevant information, refer to the introduction about the first connector 14 , which will not be repeated here.

The first layer in the embodiment may be one layer or multiple layers. Similarly, the second layer in the embodiment may also be one or more layers. The first layer may include at least one of a power supply signal layer and a data signal layer. The second layer may include at least one of a power supply signal layer and a data signal layer. According to the definition in Protel99, the layers in the printed circuit board can include: Signal Layers (signal layer) and Internal Planes (internal plane). In a specific implementation, the data signal layer may be the signal layer. In a specific implementation, the power supply signal layer may be the internal plane. Wherein, the signal layer is used to implement signal lines, and the internal power supply/ground layer is used to implement power supply lines/ground lines. After the number and type of the third printed circuit board 13 are determined, the layers required for the third printed circuit board 13 to work can be determined. Assume that the number of layers required for the operation of the third printed circuit board 13 is n. Among the n layers, the n1 layer is located in the first printed circuit board 11 , and the n2 layer is located in the second printed circuit board 12 . The intersection of layer n1 and layer n2 is an empty set. Wherein, n1+n2 may be equal to n. Alternatively, the result at n1+n2 is greater than n. n1 is less than n. n2 is also smaller than n.

The layers required for the third printed circuit board 13 to work may be distributed on the first printed circuit board 11 and the second printed circuit board according to the principle of convenient wiring. The specific implementation is provided below.

Specific implementation method one

In this specific implementation mode 1, the first layer in the first printed circuit board 11 may include a data signal layer, and the second layer in the second printed circuit board 12 may include a power supply signal layer and Data signal layer. Referring to FIG. 2 , the first connector 14 may include a data signal connector 141 and a power supply signal connector 142 . The second connector may also include a data signal connector 151 and a power supply signal connector 152 . That is to say, a part of the data signal layer can be arranged on the first printed circuit board 11 , and another part of the data signal layer and the power supply signal layer can be arranged on the second printed circuit board 12 . At this time, the information transmitted by the signal line and the power line in the second printed circuit board 12 needs to be transmitted to the first printed circuit board 11 through the first connector 14, and then transmitted to the third printed circuit board 11 by the first printed circuit board 11. Therefore, the first connector 14 may include at least one of a data signal connector 141 and a power supply signal connector 142 .

Wherein, during specific implementation, the data signal layer may include a high-speed data signal layer and a low-speed data signal layer. At this time, the distribution of the data signal layers on the first printed circuit board 11 and the second printed circuit board 12 can be further refined. For example, in an optional implementation manner, the data signal layer in the first printed circuit board 11 includes a high-speed data signal layer, and the data signal layer in the second printed circuit board 12 includes a high-speed data signal layer and Low-speed data signal layer. That is to say, the first printed circuit board 11 is used for arranging a part of the high-speed data signal layer, and the second printed circuit board 12 is used for arranging another part of the high-speed data signal layer and the low-speed data signal layer. In this way, the second printed circuit board 12 is also used to arrange the power supply signal layer. Therefore, the first connector 14 may include a high-speed data signal connector, a low-speed data signal connector, and a power supply signal connector. Or, in another optional implementation manner, the first printed circuit board 11 may also be used for arranging a high-speed data signal layer, and the second printed circuit board 12 is used for arranging a low-speed data signal layer. Likewise, the second printed circuit board 12 is also used to arrange the power supply signal layer. At this time, the first connector 14 may include a low-speed data signal connector and a power supply signal connector.

Specific implementation method two

In the second specific implementation, the first layer in the first printed circuit board 11 may include a data signal layer, and the second layer in the second printed circuit board 12 may include a power supply signal layer; At this time, referring to FIG. 3 , the first connector may only include a power supply signal connector 142 , and the second connector includes a data signal connector 151 and a power supply signal connector 152 . Wherein, the data signal layer in the first printed circuit board 11 may include a high-speed data signal layer and a low-speed data signal layer, and the second connector 15 includes a high-speed data signal connector, a low-speed data signal connector and a power supply signal connector.

It should be noted that since the power supply signal layer is generally located on the second printed circuit board 12, the second printed circuit board can also be connected to the fourth printed circuit board through a power transfer connector, as shown in FIG. 3 , the first printed circuit board The four printed circuit boards are used to provide system power. Therefore, it is also called a power backplane. The system power line can be connected to the fourth printed circuit board through the power module, and the fourth printed circuit board supplies power to the third printed circuit board. The parts related to the power supply in FIG. 2 may be similar to those in FIG. 3 , and will not be repeated here.

Several ways of distributing the layers that need to be used when the third printed circuit board works are introduced above. In practical application, it can be selected according to the actual situation, or other methods under the same idea can be selected for realization. Preferably, the number of first layers in the first printed circuit board 11 may be equal to or similar to the number of second layers in the second printed circuit board. This keeps system costs to a minimum.

As mentioned above, the third printed circuit board 13 is only physically connected to the first printed circuit board 11 through the second connector 14, and there is no direct physical connection between the third printed circuit board 13 and the second printed circuit board 12. connection, that is to say, all the third printed circuit boards 13 are only connected on one of the planes of the first printed circuit board 11, and do not need to be physically connected to the second printed circuit board, so that the whole system can be connected with the first printed circuit board Plate 11 is the datum surface, which facilitates the tolerance control of the system.

In addition to the advantages of facilitating tolerance control, the above implementation has other advantages. For example, one aspect of the advantages is mainly reflected in: since the third printed circuit board 13 only needs to be connected to the first printed circuit board 11 , does not need to be physically connected to the second printed circuit board 12, therefore, the whole system can be made into a full-frame device or a half-frame device. Among them, the full-frame equipment is relatively high in height, usually has two layers of third printed circuit boards 13, and the number of slots is greater than or equal to 16. Only one such equipment can be placed in a cabinet, and there is no space for other equipment. Half-frame equipment: shorter in height, usually only has one layer of the third printed circuit board 13, the number of slots is usually less than or equal to 10, and one cabinet can accommodate two such equipment.

Certainly, the third printed circuit board 13 needs to rely on the first layer and the second layer when working. That is to say, the third printed circuit board 13 needs to be electrically connected to the first layer and the second layer respectively, so as to transmit signals and obtain energy from the power supply. Wherein, for the first layer on the first printed circuit board 11 , the third printed circuit board 13 may be directly electrically connected to the first layer through the second connector 14 . As for the second layer on the second printed circuit board 12, the third printed circuit board 13 can communicate with the first connector 15, the first connector 14, and the second connector 15. The wires between the connectors 14 are electrically connected to the second layer.

There may be wires between the first connector 14 and the second connector 15 . The two can communicate with each other, so that the electrical connection between the third printed circuit board 13 and the second layer can be realized. During specific implementation, the wires between the first connector 14 and the second connector 15 can be implemented in various ways. For example, in one of the ways, the first connector 14 and the corresponding second connector 15 can be connected by sharing the same packaging hole, that is, the first connector 14 and the second connector 15 The wires between the two connectors 15 can pass through the packaging holes on the first printed circuit board 11 . Or, in another implementation manner, the wires between the first connector 14 and the second connector 15 may also be arranged in a specific layer in the first printed circuit board 11, that is, at this time, the first A connector 14 and a second connector 15 having a corresponding relationship may not share the same packaging hole, and the physical positions of the two on the first printed circuit board 11 may be different, but the two may be connected by wires. The wires are located in specific layers in the first printed circuit board 11 . It should be noted that, with regard to a certain layer, after the deployment of specific lines is completed, there may be some free areas. Therefore, the aforementioned wires can be arranged in these vacant areas without affecting the normal operation of the layer where the wires are located.

Optionally, in the above technical solution, the second printed circuit board includes a plurality of printed circuit boards, the second layer includes multiple layers, and each printed circuit board in the plurality of printed circuit boards includes the multi-layer at least one of the layers.

Optionally, in the above technical solution, the plurality of printed circuit boards are located on the same plane.

It should be noted that when the first printed circuit board 11 is connected to the second printed circuit board 12, the connection area is relatively large, and the number of the first connectors 14 will be relatively large, and the insertion force required will be relatively large. more difficult. In addition, the insertion and withdrawal force of the first connector 14 may also accumulate the tolerance to a relatively large value, making it difficult to control the system tolerance. Therefore, in the case where the area of the second printed circuit board 12 is relatively large, it can also be designed as a plurality of second printed circuit boards 12, and each second printed circuit board 12 can include a part of layers, and through the first connector 14 It is connected with the first printed circuit board 11. In this way, when the second printed circuit board 12 is installed, the insertion and extraction force of each second printed circuit board 12 is reduced exponentially, the actual installation is much easier, and excessive accumulation of tolerances can also be avoided.

In actual implementation, the second printed circuit board 12 may include multiple printed circuit boards (referred to as multiple second printed circuit boards 12 ). There is no connection between the printed circuit boards 12, and the second printed circuit boards 12 can be placed side by side. For example, referring to FIG. 4-1 , it may include two second printed circuit boards, respectively a second printed circuit board 121 and a second printed circuit board 122 , and the two second printed circuit boards are placed side by side. Alternatively, the two second printed circuit boards 12 can also be placed in the manner shown in Fig. 4-2. Furthermore, four second printed circuit boards may also be included, as shown in FIG. 4-3 , may include second printed circuit boards 123, 124, 125, 126, and so on.

In a word, in the system provided by the embodiment of the present invention, at least the following effects can be achieved:

First, the system may include a first printed circuit board, a second printed circuit board, and a third printed circuit board, wherein the layers required for the operation of the third printed circuit board in the system may be distributed on the first printed circuit board, the second printed circuit board On the second printed circuit board, the number of layers of a single printed circuit board is reduced in this way, which is convenient for reducing system cost.

Second, the printed circuit boards can be connected through connectors, the process is simple, and high-precision mechanical devices are not required for fixing.

Third, the connector between the printed circuit boards can also serve as an electrical connection, and the third printed circuit board can only be connected to the first printed circuit board without direct physical contact with the second printed circuit board. The connection, therefore, enables the whole system to use the first printed circuit board as a reference plane, which facilitates tolerance control, and the whole system can be made into a full-frame device or a half-frame device.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A system, characterized in that the system comprises a first printed circuit board, a second printed circuit board and a third printed circuit board, and a first connector is mounted on a first plane of the first printed circuit board The first connecting terminal of the first printed circuit board is installed on the second plane of the first printed circuit board, and the first connecting terminal of the second connector is installed on the first plane of the second printed circuit board. the second connection terminal of the second connector, the third printed circuit board is installed with the second connection terminal of the second connector; The second printed circuit board is connected to the first printed circuit board through the first connector, specifically, the second printed circuit board is connected through the second connection terminal of the first connector to the first connection terminal of the first connector mounted on the first printed circuit board parallel to the second printed circuit board; the third printed circuit board is connected to the first printed circuit board through the second connector; Wherein, the first printed circuit board includes a first layer, the second printed circuit board includes a second layer, and the layers that need to be used when the third printed circuit board works include the first layer and the second layer. layer, the third printed circuit board is electrically connected to the first layer through the second connector, and the third printed circuit board is connected to the first layer through the second connector, the second connector and the first layer. The wires between the connectors and the first connector are electrically connected to the second layer. 2. The system of claim 1, wherein the first layer in the first printed circuit board includes a data signal layer and the second layer in the second printed circuit board includes a power supply layer. Signal layer and data signal layer; The first connector includes a data signal connector and a power supply signal connector, and the second connector includes a data signal connector and a power supply signal connector. 3. The system according to claim 2, wherein the data signal layer in the first printed circuit board comprises a high-speed data signal layer, and the data signal layer in the second printed circuit board comprises a high-speed data signal layer And the low-speed data signal layer; The first connector includes a high-speed data signal connector, a low-speed data signal connector, and a power supply signal connector. 4. The system according to claim 2, wherein the data signal layer in the first printed circuit board includes a high-speed data signal layer, and the data signal layer in the second printed circuit board includes a low-speed data signal layer ; The first connector includes a low-speed data signal connector and a power supply signal connector. 5. The system of claim 1, wherein the first layer in the first printed circuit board includes a data signal layer and the second layer in the second printed circuit board includes a power supply layer. signal layer; The first connector includes a power supply signal connector, and the second connector includes a data signal connector and a power supply signal connector. 6. The system according to claim 5, wherein the data signal layer in the first printed circuit board includes a high-speed data signal layer and a low-speed data signal layer; the second connector includes a high-speed data signal connector , low-speed data signal connectors and power supply signal connectors. 7. The system according to any one of claims 1 to 6, wherein the electrical connection between the third printed circuit board and the second layer specifically comprises: The wires between the first connector and the second connector pass through the packaging hole on the first printed circuit board. 8. The system according to any one of claims 1 to 6, wherein the electrical connection between the third printed circuit board and the second layer specifically comprises: The wires between the first connector and the second connector are located on a layer of the first printed circuit board. 9. The system according to any one of claims 1 to 6, wherein the second printed circuit board comprises a plurality of printed circuit boards, the second layer comprises multiple layers, and the plurality of printed circuit boards Each of the printed circuit boards includes at least one of the multiple layers. 10. The system of claim 9, wherein the plurality of printed circuit boards are located on the same plane.