CN104867879A - Ceramic package - Google Patents
Ceramic package Download PDFInfo
- Publication number
- CN104867879A CN104867879A CN201510085220.3A CN201510085220A CN104867879A CN 104867879 A CN104867879 A CN 104867879A CN 201510085220 A CN201510085220 A CN 201510085220A CN 104867879 A CN104867879 A CN 104867879A
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- mentioned
- main body
- sagging
- package main
- metal
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- 239000000919 ceramic Substances 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 46
- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 238000007665 sagging Methods 0.000 claims description 79
- 238000005219 brazing Methods 0.000 claims description 41
- 238000005476 soldering Methods 0.000 abstract description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 230000001815 facial effect Effects 0.000 description 44
- 238000005538 encapsulation Methods 0.000 description 23
- 230000035882 stress Effects 0.000 description 11
- 238000009825 accumulation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000009194 climbing Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 235000013372 meat Nutrition 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present invention provides a ceramic package, even if a metallic cover plate is connected on a metal layer which is formed at the surface of a packaging main body formed by ceramic and is in a rectangular frame shape in top view by means of a soldering material, a part of the soldering material is also difficult to climb to the upper surface of the cover plate, and stress caused by thermal deformation of the cover plate is alleviated so that the ceramic of the packaging main body is difficult to break. The ceramic package comprises: the packaging main body formed by ceramics such as aluminum oxide and comprising a surface and a back surface which are in rectangular shapes in top view and four side surfaces arranged between edges of the surface and the back surface; and a cavity which is provided with an opening at the side of the surface of the packaging main body and is in a rectangular shape in top view, wherein at four corners of the surface in the rectangular shape, the highest positions of adjacent two side strip-shaped surfaces clamping each corner are respectively used as a reference surface, a drooping surface part drooping towards the side of the back surface of the packaging main body is set relative to the two reference surfaces.
Description
Technical field
The present invention relates to a kind of comprise overall package main body in box shape and on the surface of this main body opening the peristome such as chamber moreover utilize the ceramic packaging of the above-mentioned peristome of metal cover plate for sealing after various element has been installed in this peristome.
Background technology
Such as, propose the encapsulation of a kind of housing electronic part, when being made up of pottery, and on the surface of the overall insulating body in box shape opening recess in electronic device has been installed after, be previously formed on the sealing metal level on the rectangular box-like surface that the peristome of this recess is surrounded, by brazing material by seam weldering accurately and securely jointing metal lid and improve airtight reliability, normally work for a long time to enable the electronic device be arranged in above-mentioned recess, each limit of the above-mentioned sealing metal level of the rectangular frame-shaped when overlooking is concavely bent (such as on respective length direction, with reference to patent documentation 1).
But, as above-mentioned housing electronic part encapsulation, when make to be formed at each limit on the surface of the insulating body be made up of pottery, the sealing metal level of rectangular frame-shaped when overlooking concavely bending in the longitudinal direction, swell upward near the corner of this metal level.Therefore, when the brazing material by this metal level closes metal cap body by seam welding, there is such unfavorable condition: the part of this brazing material is easy to climb on the upper surface of this metal cap body walk around the lateral surface of metal cap body near above-mentioned corner after.In addition, also there is such unfavorable condition: due to when the weldering of above-mentioned seam to the thermal deformation of this metal cap body caused by the expansion caused by the heating of metal cap body and the contraction these two aspects factor that produces along with cooling afterwards, on the pottery of the near surface of insulating body, create stress across above-mentioned brazing material, thus it is damaged to cause that this pottery cracks etc.And, as above-mentioned electronic unit storage encapsulation, when protuberance and central portion on the length direction on each limit are the form of depression upward near the corner of sealing metal level, also there is such unfavorable condition: this pair of rolls electrode is pressed on the above-mentioned metal level being difficult to the pair of rolls electrode used when carrying out the weldering of above-mentioned seam to be arranged on exactly each bight downwards.
prior art document
patent documentation
Patent documentation 1: Japanese Patent No. 3140439 publication (the 1st page ~ the 5th page, Fig. 1 ~ Fig. 4)
Summary of the invention
the problem that invention will solve
Problem of the present invention is the ceramic packaging of the problems such as the unfavorable condition providing a kind of solution to illustrate in the introduction, for this ceramic packaging, even if engage metal cover plate by brazing material on metal level on the surface being formed at the package main body be made up of pottery, the rectangular frame-shaped when overlooking, a part for this brazing material is also difficult to climb on the upper surface of above-mentioned cover plate, and relaxes stress caused by the thermal deformation of above-mentioned cover plate and make the pottery of package main body be difficult to produce damaged.
for the scheme of dealing with problems
The present invention is to solve the problem, be conceived to following technology make: the peristomes such as the chamber by opening on the surface of the package main body be made up of pottery be surrounded, when overlooking rectangular frame-shaped above-mentioned surface on, the exterior lateral area in the corner on this surface forms each bight to the sagging sagging face of the rear side of package main body.
Namely, ceramic packaging of the present invention (technical scheme 1) is a kind of ceramic packaging, comprise: package main body, it is made up of pottery, is included in surface and the back side that profile when overlooking is rectangular shape and four sides between this surface and each limit at the back side; And peristome, its face side opening in above-mentioned package main body and when overlooking rectangular shaped; The feature of this ceramic packaging is, in four bights on the surface of above-mentioned rectangular shaped, with respective extreme higher position, the surface clipping each this bight and adjacent two edge strip shapes for datum level, this two datum levels are relatively set to the sagging sagging face of the rear side of above-mentioned package main body; This sagging face is arranged to as follows, namely when overlooking, intersection point between two the adjacent sides by above-mentioned package main body and the intersection point between two adjacent inner surfaces of above-mentioned peristome, along on the datum line of inward-outward direction, total length between the most external of relatively intersecting with this datum line and penetralia, the distance this sagging face is arranged on from this outermost position to this most external is in the scope of the position of more than 10% of this total length.
Accordingly, be four bights on the above-mentioned surface of rectangle (frame) shape when overlooking, with respective extreme higher position, the surface clipping each this bight and adjacent two edge strip shapes for datum level, relative these two datum levels are set to the sagging sagging face of the rear side of above-mentioned package main body, this sagging face, the part of intersection point side between the part that is in the intersection point side between two sides adjacent in above-mentioned package main body when overlooking or the extended line being in these two sides when overlooking becomes the foot of this sagging face.Therefore, as described below, when also engaging metal cover plate by brazing material above the metal level be covered in advance on above-mentioned surface and the coat of metal, be formed with the accumulation region of above-mentioned brazing material directly over four sagging faces near the corner being positioned at above-mentioned surface, engage (soldering or seam weldering) above-mentioned cover plate by the rectangular box-like utilizingthebrazing material layer comprising this accumulation region near corner.
Its result, even if press above-mentioned cover plate while carry out above-mentioned joint from the upper surface side of above-mentioned cover plate towards utilizingthebrazing material layer side, also can make a part for this brazing material be difficult to climb on the upper surface of above-mentioned cover plate.
And, along with the stress that thermal expansion and the cooling meat of above-mentioned cover plate during above-mentioned joint produce, can accumulate region by the brazing material that is positioned at directly over above-mentioned sagging face and be relaxed, above-mentioned sagging face be positioned near the corner that on the surface of package main body, this stress is the most easily applied to.Therefore, even if be subject to the effect of above-mentioned stress, it is damaged also reliably can to prevent that the pottery of the vicinity, corner on the surface of package main body from cracking etc.
Thus, can provide a kind of and can make to be arranged on the higher ceramic packaging of airtight reliability that the various elements in above-mentioned peristome normally work for a long time.
In addition, above-mentioned pottery is such as the high temperature sintering pottery of aluminium oxide etc. or the low-temperature sintered ceramics of glass-ceramic etc.
In addition, peristome comprises the such as chamber of entirety in rectangular shape or the recess be made up of concave curved surface etc., for above-mentioned chamber, is formed on its bottom surface such as installing the electrode of more than a pair (multiple) of the elements such as quartz crystal unit.
And the extreme higher position separately, surface of above-mentioned edge strip shape refers to the near top of in the male and fomale(M&F) on the top layer on the surface on each limit, to be positioned at the top convex surface.In order to obtain this extreme higher position becoming datum level, when observing each surface of above-mentioned edge strip shape in side, on the side comprising this surface, with the back side of package main body for benchmark, will plane in multiple protuberance, the protuberance of position farthest from this back side be comprised as said reference face.Wherein, when carrying out above-mentioned side and observing, when the back side of package main body is upturned, the imaginary line at the two ends at link back side during to be included in side-looking at interior imaginary plane for benchmark, using the plane that comprises from the protuberance of this imaginary line position farthest as said reference face.
In addition, above-mentioned sagging face, the part of intersection point side between two adjacent sides of being in package main body when overlooking or be in these two sides when overlooking extended line between the part of intersection point side become the foot of this sagging face, be such as rendered as the slowly bending curved surface or single inclined plane that raise up when side-looking.
And, the limit of the inner side in above-mentioned chamber side of above-mentioned sagging face when overlooking be protruding to side, angle or from the curve of side, angle depression or for adjacent two sides between the straight line of inclination that tilts to intersect.
In addition, preferably, total length between the most external of relatively intersecting with said reference line and penetralia, distance above-mentioned sagging face is arranged on from this outermost position to this most external is in the scope of the inner side of more than 20% of this total length, more preferably, total length between the most external of relatively intersecting with said reference line and penetralia, the distance above-mentioned sagging face is arranged on from this outermost position to this most external is in the scope of the inner side of more than 30% of total length.It should be noted that, the position of innermost side be the distance between most external identical with above-mentioned total length, be total length 100% position, when this 100%, the boundary between the surface of sagging face and adjacent two edge strip shapes also comprises the form split by the face side part of these two edge strip shapes.
And, above-mentioned dip portion face is formed by operating as follows: such as after stacked multiple green sheet of the above-mentioned package main body of formation, jig for pressing when carrying out thermo-compressed is made an effort, or on many green sheet duplexers in flakes, utilize laser processing to form the slot segmentation of singualtion along direction anyhow, now, the processing conditions of the position of the processing conditions near the position making slot segmentation anyhow intersected with each other except near this cross part is different.
In addition, during above-mentioned inward-outward direction refers to when overlooking package main body using the side on above-mentioned four limits as outside and using the direction of the central portion of above-mentioned peristome as inner side.
And said reference line, two intersection points or position are imaginary line or point.
In addition, above-mentioned ceramic packaging also can provide with many forms in flakes as follows, namely has the product area that to be anyhow all adjacent to when overlooking this encapsulation be set up in parallel simultaneously and is positioned at the edge part formed around this product area and by above-mentioned pottery.
In addition, in the present invention, following ceramic packaging (technical scheme 2) is also comprised: on the surface of the rectangular shape of above-mentioned package main body, comprise the above-mentioned sagging face of the corner being positioned at this surface, be coated with metal level and the coat of metal.
Accordingly, on the surface of rectangle (frame) shape comprising the above-mentioned sagging face be positioned near corner, metal level and the coat of metal is coated with successively.Therefore, at least on the coat of metal of side, top layer, can directly engage (soldering or so-called direct joint) following metal cover plate by brazing material, and now, can eliminate or reliably suppress above-mentioned brazing material to cause the breakage of pottery to the climbing of the upper surface of cover plate and the thermal stress that produces when carrying out above-mentioned joint.
In addition, when above-mentioned package main body is high temperature sintering pottery, the metal that it is main component that above-mentioned metal level uses with W or Mo etc., when above-mentioned package main body is low-temperature sintered ceramics, the metal that it is main component that above-mentioned metal level uses with Cu or Ag etc.
In addition, the above-mentioned coat of metal is made up of the Ni plated film of such as lower layer side and the Au plated film of upper layer side.
And, in the present invention, also comprise following ceramic packaging (technical scheme 3): above the above-mentioned coat of metal, be bonded to metal cover plate by brazing material.
Accordingly, on the surface of rectangle (frame) shape comprising the above-mentioned sagging face be positioned near corner, on the metal level be covered in successively on this surface and the coat of metal, be bonded to metal cover plate by the utilizingthebrazing material layer comprising accumulation region near corner.Therefore, it is possible to eliminate or reliably suppress above-mentioned brazing material to cause the breakage of pottery to the climbing of the upper surface of cover plate and the thermal stress that produces when carrying out above-mentioned joint.Thus, can provide a kind of and can make to be arranged on the higher ceramic packaging of airtight reliability that the various elements in above-mentioned peristome normally work for a long time.
In addition, above-mentioned brazing material uses such as Ag solder flux (Ag-15%Cu).
In addition, above-mentioned cover plate is made up of such as 42 alloys (42%Ni-Fe), Kovar alloy (Fe-29%Ni-17%Co), 194 alloys (Cu-2.3%Fe-0.03%P) or stainless steel.
Accompanying drawing explanation
Fig. 1 is the stereogram of the ceramic packaging representing a mode of the present invention.
Fig. 2 is the vertical view of above-mentioned ceramic packaging.
(A) of Fig. 3 is the partial perspective view of the adjacent corner representing the above-mentioned encapsulation shown in the arrow A in Fig. 2, (B) of Fig. 3 is the vertical view representing this adjacent corner.
Fig. 4 is the vertical sectional view of looking along X-X alignment in Fig. 2.
Fig. 5 is the amplification view of the single dotted broken line part Y represented in Fig. 4.
Fig. 6 is the vertical sectional view engaging the state of cover plate above its surface representing above-mentioned encapsulation.
Fig. 7 is the amplification view of the single dotted broken line part Z represented in Fig. 6.
(A) of Fig. 8 is the partial perspective view same as described above of the dip portion representing different modes, and (B) of Fig. 8 is the partial perspective view same as described above of the dip portion representing another different modes.
Fig. 9 is the vertical view of the ceramic packaging representing different modes.
(A) of Figure 10 is the partial perspective view same as described above of the dip portion represented for above-mentioned encapsulation, and (B) of Figure 10, (C) of Figure 10 are the partial perspective views same as described above of the dip portion representing different modes.
Figure 11 represents and the dip portion of modes different above, same as described above partial top view.
Figure 12 is the partial top view same as described above of the dip portion representing another different modes.
Embodiment
Below, illustrate for implementing mode of the present invention.
Fig. 1 is the stereogram of ceramic packaging (hereinafter referred to as the encapsulating) 1a representing a mode of the present invention, and Fig. 2 is the vertical view of this encapsulation 1a.
As shown in Figure 1 and Figure 2, above-mentioned encapsulation 1a comprises and to be made up of pottery and overall in the package main body 2a of box shape with the chamber (peristome) 7 of the center side opening in the side, surface 3 of this package main body 2a.
Above-mentioned package main body 2a is such as made up of the high temperature sintering pottery of aluminium oxide etc. or the low-temperature sintered ceramics of glass-ceramic etc., comprises surface 3 and the back side 5 that profile is rectangle (rectangle) shape when overlooking and four sides 6 between surface 3 and four limits at the back side 5.Above-mentioned surperficial 3 when overlooking overall rectangular frame-shaped, there is sagging facial 4a, this sagging facial 4a is fan shape when overlooking, and near the corner being in surface 3 of this sagging facial 4a adjacent two sides 6 extended line between the part of intersection point side become the position of side most on the lower.In addition, the above-mentioned back side 5 is tabular surface.
In addition, in every two adjacent above-mentioned sides 6 each other, being all formed when vertical is overlooked along vertical is the groove 10 of circular shape.
As shown in Figure 1 and Figure 2, on above-mentioned surperficial 3 roughly whole that comprises the sagging facial 4a near corner and on whole of the groove 10 of corner, be coated with the coating 13 of side, top layer across metal level described later (11) and the coating (12) of lower layer side.
And above-mentioned chamber 7 is made up of the bottom surface 8 being rectangle (rectangle) shape when overlooking, curved surface 9a from four limits of bottom surface 8 to surperficial 3 sides that to erect the inner surface 9 that arranges and the interior angle place between every two adjacent these inner surfaces 9 from.Above-mentioned bottom surface 8 is formed with pair of electrodes 14.
When above-mentioned package main body 2a is high temperature sintering pottery, the metal that it is main component that above-mentioned electrode 14 uses with W or Mo etc., when above-mentioned package main body 2a is low-temperature sintered ceramics, the metal that it is main component that above-mentioned electrode 14 uses with Cu or Ag etc., and on the surface of above-mentioned electrode 14, be coated with coating described later (12,13).
In addition, above-mentioned electrode 14 can by the via conductor run through between the bottom surface 8 of chamber 7 and the back side 5 of package main body 2a (not shown), with the indivedual external connection terminals conductings be formed in multiple external connection terminals (not shown) at the above-mentioned back side 5.Above-mentioned via conductor and external connection terminals are also made up of the metal identical with above-mentioned electrode 14, wherein, the surface of external connection terminals are coated with coating same as described above.
As shown in (A) of Fig. 3, above-mentioned sagging facial 4a lays respectively at the corner place of the above-mentioned package main body 2a illustrated in arrow A in Fig. 2, above-mentioned sagging facial 4a is surrounded by smooth surface 3, adjacent two sides 6 and groove 10, overall in fan shape when overlooking, be made up of the curved surface raised up when side-looking.
As shown in (B) of Fig. 3, this sagging facial 4a with surface 3, the part that clips bight residing for this sagging facial 4a and adjacent two edge strip shapes extreme higher position M1, M2 separately for datum level time, relatively described datum level is sagging to the side, the above-mentioned back side 5 of package main body 2a.And, this sagging facial 4a is arranged to as follows, namely when overlooking, on the datum line L of the intersection point V between the extended line by two adjacent sides 6 and the intersection point U between the extended line of two inner surfaces 9 adjacent in above-mentioned chamber 7, total length W1 between the most external of intersecting relative to this datum line L and penetralia, this sagging facial 4a is arranged in the scope of the position S from above-mentioned most external to inner side, and S distance be between itself and most external in this position is in the scope of more than 10% of this total length W1.That is, the length W2 in the inward-outward direction of the sagging facial 4a intersected with datum line L is in the scope of 10% ~ 100% of above-mentioned total length W1.
In addition, above-mentioned length W2 is preferably in the scope of 20% ~ 90% of above-mentioned total length W1, is more preferably in the scope of 30% ~ 80% of above-mentioned total length W1.
As in above-mentioned Fig. 2 along X-X alignment depending on vertical sectional view Fig. 4 and after the single dotted broken line part Y in this Fig. 4 is amplified shown in Fig. 5 of obtaining, on the surface 3 of package main body 2a, sagging facial 4a and groove 10, be coated with metal level 11, the coat of metal 12 and the coat of metal 13 successively.When above-mentioned package main body 2a is high temperature sintering pottery, the metal that it is main component that above-mentioned metal level 11 also uses with W or Mo etc., when above-mentioned package main body 2a is low-temperature sintered ceramics, the metal that it is main component that above-mentioned metal level 11 also uses with Cu or Ag etc., such as, there is the thickness of about 5 μm ~ 40 μm.
In addition, the coat of metal 12 of lower floor's (substrate) side is such as made up of the Ni plated film of thickness about 1 μm ~ 10 μm, and the coat of metal 13 of side, top layer is such as made up of the Au plated film of thickness about 0.1 μm ~ 1.2 μm.
In addition, above-mentioned metal level 11, the coat of metal 12 and the coat of metal 13 also configure along the side, the back side 5 of package main body 2a, and this part is used for joint when such as this encapsulation 1a being installed on not shown motherboard surperficial.
Encapsulation 1a as above such as manufactures as following.
Prepare multiple have many (Japanese: most Ge gets り) in flakes of multiple packaging area anyhow simultaneously green sheet when overlooking, punching processing is implemented to the central portion when overlooking of each packaging area in a part of green sheet in these raw embryo sheets, be formed in the through hole of rectangular shaped when overlooking, and punching processing is implemented to the correct position of each packaging area in the smooth green sheet of remainder, forms the via hole that diameter is smaller.
Then, for the surface integral of a part of green sheet being all formed with above-mentioned rectangular-shaped through hole at each packaging area, silk screen printing contains the conductive paste of W, Mo, Cu or Ag powder etc., thus forms unsintered above-mentioned metal level 11.
On the other hand, in each via hole being all formed with the green sheet of the remainder of above-mentioned via hole at each packaging area, fill conductive paste same as described above and define unsintered via conductor, the conductive paste that on the surface of each packaging area exposed in the upper surface of each this via conductor and lower surface afterwards and the back side, silk screen printing is same as described above, forms unsintered above-mentioned electrode 14 and external connection terminals.
Then, multiple above-mentioned two kinds of green sheets are stacked on platform, on the surface of obtained green sheet duplexer, press jig for pressing down afterwards and carry out thermo-compressed.Now, near each position that the green sheet of the superiors is intersected to the line of demarcation anyhow of carrying out zoning between adjacent one another are four packaging areas, the recessed pressure surface of above-mentioned jig for pressing is made an effort, thus form four sagging facial 4a.
And then, between the surface of above-mentioned green sheet duplexer with the back side, Formation cross-section is the through hole of the circle centered by the position that intersects by above-mentioned line of demarcation anyhow, afterwards along each this through hole the cylindrical shape of internal face be coated with conductive paste same as described above.Then, along each above-mentioned line of demarcation anyhow, insert cutoff tool from face side or implement laser processing, thus to be formed in when overlooking be the slot segmentation of lattice shape and constant depth.
In addition, after green sheet duplexer such more than having sintered, obtained many package assemblies in flakes be impregnated in successively plating Ni use and plate the electrolysis coating bath of Au, now, apply in a flexible way and be located at the coating electrode of above-mentioned aggregate periphery in advance, the surface of above-mentioned metal level 11, electrode 14 etc. covers Ni plated film (coat of metal) 12 and Au plated film (coat of metal) 13 successively with desired thickness.
Finally, along above-mentioned slot segmentation shearing carried out to above-mentioned package assembly and carry out singualtion, thus multiple above-mentioned encapsulation 1a can be obtained simultaneously.
Fig. 6 is the vertical sectional view representing the state engaging metal cover plate 18 above the first-class coat of metal 12,13 on the surface 3 being positioned at above-mentioned encapsulation 1a by brazing material 16, and Fig. 7 is the enlarged drawing of the single dotted broken line part Z in Fig. 6.
As shown in Figure 6, Figure 7, on pair of electrodes 14 on the bottom surface 8 being previously formed in chamber 7, by not shown brazing material, such as quartz crystal unit 15 is installed, on the coat of metal 13, mounting is pre-formed as the rectangular box-like brazing material 16 similar to surface 3 shape of package main body 2a when overlooking afterwards, further, on this brazing material 16, metal cover plate 18 is loaded.In addition, this cover plate 18 is such as the flat board be made up of Kovar alloy.
Then, downwards this cover plate 18 is pressurizeed, and the encapsulation 1a being placed with above-mentioned brazing material 16 and cover plate 18 is inserted in not shown heating furnace, at set point of temperature band, it is heated.Its result, above-mentioned brazing material 16 entirety is softening and skin section becomes molten condition, can by above-mentioned cover plate 18 soldering (joint) in the top of Au coating 13.Afterwards, when taking out encapsulation 1a from above-mentioned heating furnace, then this brazing material 16 cools.
As shown in Figure 7, above-mentioned brazing material 16 defines the accumulation region 16a of this brazing material 16 directly over each above-mentioned sagging facial 4a of package main body 2a.Its result, the lateral surface 17 be made up of the curved surface of the depression of this brazing material 16, part near the centre of the side of above-mentioned cover plate 18 becomes topmost, brazing material 16 is not climbed on the upper surface of this cover plate 18.
And along with the heating and cooling of above-mentioned brazing material 16, above-mentioned cover plate 18 also carries out thermal expansion and cooling meat along in-plane and thickness direction.The stress produced along with the thermal deformation of this cover plate 18 is also relaxed because of the accumulation region 16a of above-mentioned brazing material 16.Its result, the pottery of each above-mentioned sagging facial 4a immediately below near the corner producing the most obviously above-mentioned stress being positioned at above-mentioned cover plate 18, package main body 2a and the pottery adjacent with these sagging facial 4a on surface 3 such as not to crack at the breakage of local.
In addition, even if replace above-mentioned soldering, and press pair of rolls electrode downwards along every two relative limits of above-mentioned cover plate 18 and this pair of rolls electrode rolled and carry out seam weldering, also can prevent in the same manner as described above the climbing of brazing material 16 with surperficial 3 the breakage of pottery.In the method, above-mentioned pair of rolls electrode can easily and be reliably made to roll along the total length on every two relative limits of above-mentioned cover plate 18.
In addition, even if replace the sagging facial 4a of above-mentioned package main body 2a, and as shown in (A) of Fig. 8, encapsulate in 1a use by when overlooking overall in fan shape and in side-looking time the sagging facial 4b that forms to the curved surface of lower convexity, also can play effect same as described above.
And as shown in (B) of Fig. 8, even if sagging facial 4c such below using in encapsulation 1a, also can play above-mentioned identical effect, this sagging facial 4c entirety when overlooking is fan shape and is single inclined plane when side-looking.Also can be, as shown in the linear dash line in (B) of Fig. 8, make this sagging facial 4c be following such form, the line of demarcation namely between this sagging facial 4c and surface 3 be the straight line of inclination when overlooking.
According to encapsulation 1a such above, after engaging metal cover plate 18 by brazing material 16 above metal level 11, the coat of metal 12 and the coat of metal 13 on the surface 3 being covered in package main body 2a, be positioned at the accumulation region 16a being formed with above-mentioned brazing material 16 directly over four near the above-mentioned corner of surperficial 3 sagging facial 4a, and be bonded to above-mentioned cover plate 18 by the rectangular box-like brazing material 16 comprising this accumulation region 16a near corner.Its result, even if press above-mentioned cover plate 18 while carry out above-mentioned joint from the upper surface side of above-mentioned cover plate 18 towards brazing material 16 side, the situation that also can easily prevent the part for this brazing material 16 from climbing on the upper surface of above-mentioned cover plate 18 occurs.
And, along with the stress that thermal expansion and the cooling meat of the above-mentioned cover plate 18 during above-mentioned joint produce, relaxed by being positioned at the accumulation region 16a directly over each sagging facial 4a of brazing material 16, each sagging facial 4a is positioned near the corner that on the surface 3 of package main body 2a, this stress is the most easily applied to.Therefore, even if be subject to the effect of above-mentioned stress, the pottery near the surface 3 of package main body 2a also can be made to be difficult to breakages such as cracking.
Thus, the ceramic packaging 1a that one can be provided to make to be arranged on airtight reliability that the element such as above-mentioned oscillator 15 grade in above-mentioned chamber (peristome) 7 normally works for a long time is higher.
Fig. 9 is the vertical view of the encapsulation 1b representing different modes, and (A) of Figure 10 is the partial perspective view of the adjacent corner on the surface 3 illustrating this package main body 2b.
As shown in Figure 9, above-mentioned encapsulation 1b has surface 3 same as described above, the back side 5, side 6, chamber (peristome) 7, metal level 11, the coat of metal 12, the coat of metal 13 and electrode 14 etc., but do not have above-mentioned groove 10 near the corner on the surface 3 of this package main body 2b, two adjacent sides 6 vertical edges each other forms angle when overlooking.Therefore, as shown in (A) of Figure 10, by when overlooking being the fan shape of quadrant shape and the sagging facial 4d that the curved surface raised up when side-looking is formed is positioned near the corner on surface 3 of package main body 2b.
Encapsulation 1b as above also utilizes method same as described above to manufacture.
Utilize above such encapsulation 1b, also can play the effect identical with above-mentioned encapsulation 1a when engaging above-mentioned cover plate 18, and play effect same as described above.
In addition, as shown in (B) of Figure 10, also can replace above-mentioned sagging facial 4d, arrange respectively near the corner on the surface 3 of package main body 2b by when overlooking rounded 1/4th fan shape and in side-looking time the sagging facial 4e that forms to the curved surface of lower convexity.
And, as shown in (C) of Figure 10, also can be set to following sagging facial 4f like this, this sagging facial 4f when overlooking rounded 1/4th fan shape and be single of the straight line tilted when side-looking.Also can be, as shown in the linear dash line in (C) of Figure 10, make this sagging facial 4f be following such form, the line of demarcation namely between this sagging facial 4f and surface 3 be the straight line of inclination when overlooking.
Figure 11 represents the partial top view with the sagging facial 4g of each mode different modes above-mentioned.As shown in figure 11, bight place when the overlooking of package main body 2a same as described above, total length W2 between the most external of intersecting with said reference line L of sagging facial 4g and penetralia (point of intersection S) is common relative to the total length W1 between most external of intersecting with datum line L same as described above and penetralia, and the central portion of the curved surface 9a of line of demarcation R when overlooking all and between the inner surface 9,9 of chamber 7 between sagging facial 4g and the surface 3 of every two adjacent edge strip shapes contacts.The sagging facial 4g of this fan shape is with groove 10 side be extreme lower position inclined plane same as described above or curved surface.
Figure 12 is the partial top view of the sagging facial 4h representing the mode also different from each mode above-mentioned.As shown in figure 12, bight place when the overlooking of package main body 2a same as described above, the total length W2 between the most external of intersecting with said reference line L of sagging facial 4h and penetralia is common relative to the total length W1 between most external of intersecting with datum line L same as described above and penetralia.And, line of demarcation R between the surface 3 of sagging facial 4h and every two adjacent edge strip shapes is divided into two sections by according to these two surfaces 3,3, and the point of intersection S 1 that this line of demarcation R and said reference line L should intersect is with being intersected by the imaginary curve r coupled together between above-mentioned two sections of line of demarcation R.The sagging facial 4h of this fan shape is also with groove 10 side be extreme lower position inclined plane same as described above or curved surface.
Utilize above such sagging facial 4g, 4h, also can play the effect identical with above-mentioned encapsulation 1a when above-mentioned cover plate 18 being engaged in the peristome of chamber 7, and play effect same as described above.
In addition, above-mentioned sagging facial 4g, 4h also can be applied to the above-mentioned ceramic packaging 1b having and do not have the package main body 2b of groove 10 in corner.
The present invention is not limited to each mode discussed above.
Such as, also can make, the surface 3 of above-mentioned package main body 2a, 2b and the profile when overlooking at the back side 5 are square (rectangle) shape.
In addition, also can be that the line of demarcation between the surface 3 of above-mentioned sagging facial 4a ~ sagging facial 4f and package main body 2a, 2b is the curve of the circular shape to each side, bight projection when overlooking.
And, also can be, at the pars intermedia of the part at the four limit places on the surface 3 of above-mentioned package main body 2a, 2b, on the length direction on each limit, there is single or multiple sagging face, this sagging face semicircular in shape shape or half-oval shaped and be positioned at side 6 side corresponding with each limit and it is in the central portion of side, side 6 that rearwardly 5 sides are sagging when overlooking.
In addition, above-mentioned package main body 2a, 2b also can for being also configured with the form of the peristome such as chamber 7, recess same as described above on its back side 5.
And, when the length along adjacent side 6 on the surface 3 of two that clip this sagging face above-mentioned edge strip shapes is different, above-mentioned sagging face is with the shorter length in these two length for benchmark, and the distance be configured between above-mentioned most external is in the scope of more than 10% of this benchmark.
In addition, above-mentioned brazing material 16 also can be the brazing material be made up of the solder flux except Ag solder flux.
In addition, above-mentioned cover plate 18 also can be by the flat board rectangular when overlooking and form along the four limits vertical wall down of this flat board, the overall form in smooth box shape.
utilizability in industry
Adopt the present invention, a kind of ceramic packaging can be provided, for this ceramic packaging, even if engage metal cover plate by brazing material on metal level on the surface being formed at the package main body be made up of pottery, the rectangular frame-shaped when overlooking, also a part for this brazing material can be made to be difficult to climb on the upper surface of above-mentioned cover plate, and to relax stress caused by the thermal deformation of above-mentioned cover plate and make the pottery of package main body be difficult to produce damaged.
description of reference numerals
1a, 1b ... ceramic packaging; 2a, 2b ... package main body; 3 ... surface; 4a ~ 4f ... sagging face; 5 ... the back side; 6 ... side; 7 ... chamber (peristome); 11 ... metal level; 12,13 ... the coat of metal; 16 ... brazing material; 18 ... metal cover plate; M1, M2 ... extreme higher position; V, U ... intersection point; L ... datum line; S ... the position being in inner side of sagging face.
Claims (3)
1. a ceramic packaging (1a, 1b), comprising:
Package main body (2a, 2b), it is made up of pottery, four sides (6) between each limit being included in the surface (3) of profile rectangular shaped when overlooking and the back side (5) and being positioned at this surface (3) and the back side (5); And
Peristome (7), its surface at above-mentioned package main body (2a, 2b) (3) side opening and when overlooking rectangular shaped,
The feature of this ceramic packaging (1a, 1b) is,
In four bights on the surface (3) of above-mentioned rectangular shaped, with respective extreme higher position (M1, M2), the surface (3) clipping each this bight and adjacent two edge strip shapes for datum level, the sagging face (4a ~ 4f) that these two datum levels (M1, M2) are sagging to the back side (5) side of above-mentioned package main body (2a, 2b) is relatively set
This sagging face (4a ~ 4f) is arranged to as follows, namely when overlooking, by above-mentioned package main body (2a, intersection point (V) between two adjacent sides (6) 2b) and the intersection point (U) between two adjacent inner surfaces (9) of above-mentioned peristome (7), along on the datum line (L) of inward-outward direction, total length (W1) between the most external of relatively intersecting with this datum line (L) and penetralia, distance this sagging face (4a ~ 4f) is arranged on from this outermost position to this most external is in the scope of position (S) of more than 10% of this total length (W1).
2. ceramic packaging according to claim 1 (1a, 1b), is characterized in that,
Upper on the surface (3) of the rectangular shape of above-mentioned package main body (2a, 2b), to comprise the corner being positioned at this surface (3) above-mentioned sagging face (4a ~ 4f), is coated with metal level (11) and the coat of metal (12,13).
3. ceramic packaging according to claim 2 (1a, 1b), is characterized in that,
In the top of the above-mentioned coat of metal (12,13), be bonded to metal cover plate (18) by brazing material (16).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-033570 | 2014-02-25 | ||
| JP2014033570A JP2015159204A (en) | 2014-02-25 | 2014-02-25 | ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104867879A true CN104867879A (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510085220.3A Pending CN104867879A (en) | 2014-02-25 | 2015-02-16 | Ceramic package |
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| Country | Link |
|---|---|
| JP (1) | JP2015159204A (en) |
| CN (1) | CN104867879A (en) |
| TW (1) | TWI559462B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134436A (en) * | 2016-02-26 | 2017-09-05 | 意法半导体(格勒诺布尔2)公司 | Include the electronic device of the local encapsulating block with relatively small thickness |
| CN107285274A (en) * | 2017-05-10 | 2017-10-24 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of three-dimension packaging method of micromachined process |
| CN109075761A (en) * | 2016-09-16 | 2018-12-21 | 株式会社大真空 | Piezodectric vibration device |
| CN111010102A (en) * | 2019-03-18 | 2020-04-14 | 天津大学 | Shape-considered thin-film-packaged MEMS device assembly and electronic apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10396002B2 (en) | 2015-03-24 | 2019-08-27 | Kyocera Corporation | Electronic component storage substrate and housing package |
| JP6892250B2 (en) * | 2016-11-24 | 2021-06-23 | 日本電波工業株式会社 | Piezoelectric device and base |
| JP7650780B2 (en) | 2020-12-25 | 2025-03-25 | Ｎｇｋエレクトロデバイス株式会社 | Package and method for manufacturing the same |
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| WO2012144115A1 (en) * | 2011-04-19 | 2012-10-26 | 日本特殊陶業株式会社 | Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same |
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| US5760465A (en) * | 1996-02-01 | 1998-06-02 | International Business Machines Corporation | Electronic package with strain relief means |
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| CN107768502B (en) * | 2011-05-16 | 2019-07-05 | 日亚化学工业株式会社 | Light-emitting device and method of manufacturing the same |
| JP5836796B2 (en) * | 2011-12-28 | 2015-12-24 | 日本特殊陶業株式会社 | Ceramic package |
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- 2014-02-25 JP JP2014033570A patent/JP2015159204A/en active Pending
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- 2015-02-16 TW TW104105221A patent/TWI559462B/en not_active IP Right Cessation
- 2015-02-16 CN CN201510085220.3A patent/CN104867879A/en active Pending
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| CN201113937Y (en) * | 2007-08-16 | 2008-09-10 | 台晶(宁波)电子有限公司 | Quartz crystal oscillator ceramic packaging structure |
| WO2012144115A1 (en) * | 2011-04-19 | 2012-10-26 | 日本特殊陶業株式会社 | Ceramic wiring board, multi-pattern ceramic wiring board, and method for producing same |
| CN103444270A (en) * | 2011-04-25 | 2013-12-11 | 日本特殊陶业株式会社 | Wiring substrate, multi-piece wiring substrate, and method for manufacturing same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107134436A (en) * | 2016-02-26 | 2017-09-05 | 意法半导体(格勒诺布尔2)公司 | Include the electronic device of the local encapsulating block with relatively small thickness |
| CN109075761A (en) * | 2016-09-16 | 2018-12-21 | 株式会社大真空 | Piezodectric vibration device |
| CN107285274A (en) * | 2017-05-10 | 2017-10-24 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of three-dimension packaging method of micromachined process |
| CN107285274B (en) * | 2017-05-10 | 2019-03-01 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of three-dimension packaging method of micromachined process |
| CN111010102A (en) * | 2019-03-18 | 2020-04-14 | 天津大学 | Shape-considered thin-film-packaged MEMS device assembly and electronic apparatus |
| CN111010102B (en) * | 2019-03-18 | 2023-12-15 | 天津大学 | MEMS device assembly and electronic equipment of thin film encapsulation taking shape into consideration |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015159204A (en) | 2015-09-03 |
| TW201537695A (en) | 2015-10-01 |
| TWI559462B (en) | 2016-11-21 |
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