CN104879731A - LED panel lamp with thermal conductive plastic frame free of substrate packaging - Google Patents
LED panel lamp with thermal conductive plastic frame free of substrate packaging Download PDFInfo
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- 239000004033 plastic Substances 0.000 title claims abstract description 68
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- 239000000758 substrate Substances 0.000 title claims abstract description 22
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- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 2
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- 239000003086 colorant Substances 0.000 claims 1
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- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000012536 packaging technology Methods 0.000 abstract description 8
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
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Abstract
本发明公开一种采用导热塑料边框无基板封装的LED平板灯，包括LED芯片、背板、导光板以及用于承载背板和导光板的凹槽状导热塑料边框，导热塑料边框通过其凹槽设置于背板和导光板四周；LED芯片通过COB封装技术封装在导热塑料边框凹槽的表面，作为侧入式光源。本发明LED平板灯进通过导热塑料边框来固定和承载导光板和背板，LED芯片通过COB封装技术封装在导热塑料边框凹槽的表面，省去了基板，绝缘层等结构，减少了不同材料之间的接触界面的数量，从而大大的缩短了散热通道，凭借导热塑料较低的热阻以及绝缘的特性，在保证用电安全的同时极大地提高了LED平板灯的散热性能，具有结构简单、散热效率高以及使用寿命长的优点。
The invention discloses an LED flat panel lamp packaged without a substrate by a heat-conducting plastic frame, including an LED chip, a back plate, a light guide plate, and a groove-shaped heat-conducting plastic frame for carrying the back plate and the light guide plate, and the heat-conducting plastic frame passes through the groove. It is arranged around the backplane and the light guide plate; the LED chip is packaged on the surface of the groove of the heat-conducting plastic frame through COB packaging technology, as a side-entry light source. The LED flat panel light of the present invention fixes and carries the light guide plate and the back plate through the heat-conducting plastic frame, and the LED chip is packaged on the surface of the groove of the heat-conducting plastic frame through COB packaging technology, eliminating the need for substrates, insulating layers and other structures, and reducing different materials. The number of contact interfaces between them greatly shortens the heat dissipation channel. With the low thermal resistance and insulation characteristics of heat-conducting plastics, it greatly improves the heat dissipation performance of the LED panel light while ensuring the safety of electricity. It has a simple structure , high heat dissipation efficiency and long service life.
Description
技术领域technical field
本发明涉及一种LED平板灯，特别涉及一种采用导热塑料边框无基板封装的LED平板灯。The invention relates to an LED panel lamp, in particular to an LED panel lamp packaged with a heat-conducting plastic frame without a substrate.
背景技术Background technique
采用LED作为光源的平板灯，凭借LED绿色环保、体积小、寿命长等优点，使其相较于其它传统光源，更省电，更符合当前节环保的趋势，因此有广泛的应用前景。但是受限于目前的半导体制造技术，LED的光电转换效率大约只有20％～30％，剩余的能量将转换为无法利用的热能，因此对灯具的散热性能有较高的要求。Compared with other traditional light sources, the flat panel lamp using LED as the light source is more energy-saving and more in line with the current trend of energy saving and environmental protection, so it has a wide application prospect. However, limited by the current semiconductor manufacturing technology, the photoelectric conversion efficiency of LEDs is only about 20% to 30%, and the remaining energy will be converted into unusable heat energy. Therefore, there are high requirements for the heat dissipation performance of lamps.
目前传统的LED平板灯，存在以下问题；灯具的灯珠安装在PCB板上，在灯珠里面还有芯片、固晶胶、基板、绝缘层等结构。当LED芯片加电后，芯片产生的热量需要通过多种材料的传导才能传递到散热外壳。在导热过程中，在层与层之间的界面会形成极大热阻，致使芯片产生的热不能及时传导出去。而且PCB板不易导热及散热，进一步降低灯具的散热性能。加上涉及的结构多，使制作变得复杂。如果LED器件产生的热不能及时散去，将会导致结温过高，最终使得LED芯片出现寿命变短、光衰加剧、波长漂移等问题，大大缩短了LED平板灯的使用寿命。At present, the traditional LED flat panel lights have the following problems: the lamp beads of the lamps are installed on the PCB board, and there are chips, solid crystal glue, substrates, insulating layers and other structures inside the lamp beads. When the LED chip is powered on, the heat generated by the chip needs to be transferred to the heat dissipation shell through the conduction of various materials. During the heat conduction process, a huge thermal resistance will be formed at the interface between layers, so that the heat generated by the chip cannot be conducted out in time. Moreover, the PCB board is not easy to conduct heat and dissipate heat, which further reduces the heat dissipation performance of the lamp. In addition, there are many structures involved, which makes the production complicated. If the heat generated by the LED device cannot be dissipated in time, the junction temperature will be too high, which will eventually lead to problems such as shortened life of the LED chip, increased light decay, and wavelength drift, which greatly shorten the service life of the LED panel light.
侧入式LED平板灯光源为灯具侧边的LED灯条，在平板灯侧边狭小的腔体内极大地限制了LED芯片产生的热的发散，因此侧入式LED平板灯的散热问题是制约其进一步发展的主要原因之一。The light source of the side-in LED panel light is the LED light bar on the side of the lamp. The narrow cavity on the side of the panel light greatly limits the heat dissipation generated by the LED chip. Therefore, the heat dissipation problem of the side-in LED panel light is restricting its One of the main reasons for further development.
采用现有的COB技术可以将LED芯片直接贴装在基板上，获得更短的散热路径，提高了散热效果。但是如果LED芯片采用金属基板的COB封装方式，为了防止漏电，通常会在芯片与基板之间加上绝缘层，由于绝缘层材料的导热系数很低，将严重地阻碍着热量的散出，缩短LED平板灯的使用寿命。Using the existing COB technology, the LED chips can be directly mounted on the substrate to obtain a shorter heat dissipation path and improve the heat dissipation effect. However, if the LED chip adopts the COB packaging method of the metal substrate, in order to prevent leakage, an insulating layer is usually added between the chip and the substrate. Because the thermal conductivity of the insulating layer material is very low, it will seriously hinder the heat dissipation and shorten the LED chip. The service life of LED panel lights.
发明内容Contents of the invention
本发明的目的在于克服现有技术的缺点与不足，提供一种采用导热塑料边框无基板封装的LED平板灯。该LED平板灯具有结构简单、散热效率高以及使用寿命长的优点。The object of the present invention is to overcome the disadvantages and deficiencies of the prior art, and provide an LED flat panel lamp packaged with a heat-conducting plastic frame without a substrate. The LED panel lamp has the advantages of simple structure, high heat dissipation efficiency and long service life.
本发明的目的通过下述技术方案实现：一种采用导热塑料边框无基板封装的LED平板灯，包括LED芯片、背板和导光板，其特征在于：还包括用于承载背板和导光板的凹槽状导热塑料边框，导热塑料边框通过其凹槽设置于背板和导光板四周；所述LED芯片通过COB封装技术封装在导热塑料边框凹槽的表面，作为LED平板灯的侧入式光源。The purpose of the present invention is achieved through the following technical solutions: an LED flat panel lamp packaged with a heat-conducting plastic frame without a substrate, including an LED chip, a backplane and a light guide plate, and is characterized in that it also includes a support for carrying the backplane and the light guide plate Groove-shaped heat-conducting plastic frame, the heat-conducting plastic frame is arranged around the backplane and the light guide plate through its groove; the LED chip is packaged on the surface of the groove of the heat-conducting plastic frame through COB packaging technology, and used as a side-entry light source for the LED panel light .
优选的，所述导热塑料边框内凹槽表面设置有凸起的环状包边，所述LED芯片位于环状包边内部。Preferably, the surface of the inner groove of the heat-conducting plastic frame is provided with a raised ring-shaped wrapping, and the LED chip is located inside the ring-shaped wrapping.
更进一步的，所述导热塑料边框内表面上设置有金属电路，金属电路穿过环状包边通过金线与LED芯片建立电气连接，LED芯片通过金属电路连接外部电源。Furthermore, a metal circuit is provided on the inner surface of the heat-conducting plastic frame, and the metal circuit is electrically connected to the LED chip through the ring-shaped wrapping through a gold wire, and the LED chip is connected to an external power source through the metal circuit.
更进一步的，所述环状包边的正投影呈正方形，四个内表面为倾斜的斜面。Furthermore, the orthographic projection of the annular wrapping is a square, and the four inner surfaces are inclined slopes.
更进一步的，所述LED芯片的个数为多个，LED芯片的数量与导热塑料边框内凹槽表面设置的环状包边的数量相同。Furthermore, the number of LED chips is multiple, and the number of LED chips is the same as the number of ring-shaped wrappings provided on the surface of the groove in the heat-conducting plastic frame.
更进一步的，所述LED芯片为蓝光芯片，所述环状包边内部空间填充有荧光胶。Furthermore, the LED chip is a blue light chip, and the inner space of the annular wrapping is filled with fluorescent glue.
优选的，所述LED芯片为RGB三基色芯片，所述环状包边内部空间填充透明的环氧树脂。Preferably, the LED chip is an RGB three-color chip, and the inner space of the annular wrapping is filled with transparent epoxy resin.
优选的，所述导热塑料边框、背板和导光板对应位置设置有通孔，采用螺丝穿过通孔将背板和导光板固定安装到导热塑料边框上。Preferably, the heat-conducting plastic frame, the back plate and the light guide plate are provided with through holes at corresponding positions, and the back plate and the light guide plate are fixedly installed on the heat-conducting plastic frame through the through holes with screws.
优选的，所述导光板为集成扩散微结构的集成化导光板，导光板未对着LED芯片的侧边和背面贴上反光膜。Preferably, the light guide plate is an integrated light guide plate with integrated diffusion microstructure, and the light guide plate is not pasted with a reflective film on the side and back of the LED chip.
优选的，所述设置于背板和导光板四周的导热塑料边框包括长边框和短边框，其中LED芯片通过COB封装技术封装在导热塑料边框中长边框凹槽的表面。Preferably, the thermally conductive plastic frame arranged around the backplane and the light guide plate includes a long frame and a short frame, wherein the LED chip is packaged on the surface of the groove of the long frame in the thermally conductive plastic frame by COB packaging technology.
本发明相对于现有技术具有如下的优点及效果：Compared with the prior art, the present invention has the following advantages and effects:
(1)本发明LED平板灯进通过导热塑料边框来固定和承载导光板和背板，LED芯片通过COB封装技术封装在导热塑料边框凹槽的表面，省去了基板，绝缘层等结构，减少了不同材料之间的接触界面的数量，从而大大的缩短了散热通道，凭借导热塑料较低的热阻以及绝缘的特性，在保证用电安全的同时极大地改善并提高了LED平板灯的散热性能，成为一种能够高效散热的侧入式LED平板灯，因此可以延长LED平板灯的使用寿命，达到环保的目的。(1) The LED flat panel light of the present invention fixes and carries the light guide plate and the backplane through the heat-conducting plastic frame, and the LED chip is packaged on the surface of the groove of the heat-conducting plastic frame through COB packaging technology, eliminating the need for substrates, insulating layers and other structures, reducing Reduce the number of contact interfaces between different materials, thus greatly shortening the heat dissipation channel, relying on the low thermal resistance and insulation characteristics of heat-conducting plastics, while ensuring the safety of electricity use, it greatly improves and improves the heat dissipation of LED panel lights Performance, become a side-entry LED panel light that can efficiently dissipate heat, so it can prolong the service life of the LED panel light and achieve the purpose of environmental protection.
(2)本发明LED平板灯仅需集成化导热塑料边框、导光板、背板即可完成组装，另外本发明导光板为一体化的集成化导光板，集成扩散微结构到导光板中，从而省去扩散膜。相较于由前框、灯条、反光纸、导光板、扩散板、后框、背板等多种结构组成的传统LED平板灯来说，本发明LED平板灯所需要部件少，结构更加简单，能减少生产工序，简化制作流程。(2) The LED flat panel light of the present invention only needs to integrate the thermally conductive plastic frame, light guide plate, and back plate to complete the assembly. In addition, the light guide plate of the present invention is an integrated integrated light guide plate, and the diffusion microstructure is integrated into the light guide plate, thereby The diffusion film is omitted. Compared with the traditional LED panel light composed of front frame, light bar, reflective paper, light guide plate, diffuser plate, rear frame, back plate, etc., the LED panel light of the present invention requires fewer parts and has a simpler structure , can reduce the production process and simplify the production process.
(3)本发明LED平板灯的导热塑料边框为塑料材料，具有可塑性好、容易加工、重量轻、色泽丰富等优势，加上先有的较为成熟的塑料加工技术，使得本发明LED平板灯的制作更具有广阔的应用前景。(3) The thermally conductive plastic frame of the LED panel lamp of the present invention is made of plastic material, which has the advantages of good plasticity, easy processing, light weight, rich color, etc., plus the prior relatively mature plastic processing technology, which makes the LED panel lamp of the present invention Making more broad application prospects.
附图说明Description of drawings
图1是发明的组装后的总体结构示意图。Figure 1 is a schematic diagram of the overall structure of the invention after assembly.
图2是本发明的部分拆解示意图。Fig. 2 is a partially disassembled schematic view of the present invention.
图3是本发明的导热塑料边框长边框的局部图。Fig. 3 is a partial view of the long frame of the heat-conducting plastic frame of the present invention.
图4是本发明的导热塑料边框长边框的细节图。Fig. 4 is a detailed view of the long frame of the heat-conducting plastic frame of the present invention.
图5是本发明的导热塑料边框、导光板、背板组合后的局部示意图。Fig. 5 is a partial schematic diagram of the combination of the heat-conducting plastic frame, the light guide plate and the back plate of the present invention.
具体实施方式Detailed ways
下面结合实施例及附图对本发明作进一步详细的描述，但本发明的实施方式不限于此。The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
实施例Example
如图1至5所示，本实施例公开了一种采用导热塑料边框无基板封装的LED平板灯，包括LED芯片8、背板4、导光板3以及凹槽状导热塑料边框6，导热塑料边框通过其凹槽设置于背板4和导光板3四周，通过凹槽固定和承重导光板3和背板4；LED芯片通过COB封装技术封装在导热塑料边框凹槽的表面，作为LED平板灯的侧入式光源。本实施例中导光板为一体化的集成化导光板，集成扩散微结构到导光板中，从而省去扩散膜。另外导光板未对着LED芯片的侧边和背面贴上反光膜。As shown in Figures 1 to 5, this embodiment discloses an LED flat panel lamp packaged without a substrate using a heat-conducting plastic frame, including an LED chip 8, a back plate 4, a light guide plate 3, and a groove-shaped heat-conducting plastic frame 6, the heat-conducting plastic The frame is set around the back plate 4 and the light guide plate 3 through its groove, and the light guide plate 3 and the back plate 4 are fixed and loaded through the groove; the LED chip is packaged on the surface of the groove of the heat-conducting plastic frame through COB packaging technology, as an LED panel light side-lit light sources. In this embodiment, the light guide plate is an integrated integrated light guide plate, and the diffusion microstructure is integrated into the light guide plate, so that the diffusion film is omitted. In addition, the light guide plate is not pasted with a reflective film on the side and back of the LED chip.
导热塑料边框包括长边框6和短边框2，具体长度根据背板4和导光板3的四周尺寸进行设置，其中本实施例中LED芯片通过COB封装技术封装在导热塑料边框长边的凹槽表面。导热塑料边框所用材料可以为任何一种的具有绝缘特性的导热塑料。The thermally conductive plastic frame includes a long frame 6 and a short frame 2, and the specific length is set according to the surrounding dimensions of the backplane 4 and the light guide plate 3. In this embodiment, the LED chip is packaged on the groove surface of the long side of the thermally conductive plastic frame by COB packaging technology . The material used for the heat-conducting plastic frame can be any kind of heat-conducting plastic with insulating properties.
如图3和4所示，本实施例中导热塑料边框内凹槽表面设置有凸起的环状包边，LED芯片位于环状包边内部中央位置。导热塑料边框内表面及LED芯片两侧上设置有金属电路7，金属电路7穿过环状包边9底部并到达LED芯片8附近位置，然后通过金线与LED芯片建立电气连接，LED芯片通过金属电路连接外部电源。其中LED芯片8、金属线和凸起的环状包边9构成了LED芯片的封装结构1。环状包边的正投影呈正方形，四个内表面为倾斜的斜面。As shown in FIGS. 3 and 4 , in this embodiment, a raised ring-shaped wrapping is provided on the surface of the groove inside the heat-conducting plastic frame, and the LED chip is located in the center of the ring-shaped wrapping. A metal circuit 7 is provided on the inner surface of the heat-conducting plastic frame and on both sides of the LED chip. The metal circuit 7 passes through the bottom of the ring-shaped wrapping 9 and reaches the position near the LED chip 8, and then establishes an electrical connection with the LED chip through a gold wire. The metal circuit is connected to an external power source. Wherein the LED chip 8 , the metal wire and the raised annular wrapping 9 constitute the package structure 1 of the LED chip. The orthographic projection of the ring-shaped edging is square, and the four inner surfaces are inclined bevels.
本实施例中LED芯片的个数为多个，LED芯片的数量与导热塑料边框内凹槽表面设置的环状包边的个数相同。In this embodiment, the number of LED chips is multiple, and the number of LED chips is the same as the number of annular wrappings provided on the surface of the groove in the heat-conducting plastic frame.
本实施例中LED芯片为蓝光芯片，环状包边内部剩余空间填充有掺有荧光粉的荧光胶。蓝光芯片与荧光粉搭配从而发出白光。当然本实施例中的LED芯片也可以为RGB三基色芯片，此时环状包边内部填充透明的环氧树脂，不需要填充掺有荧光粉的荧光胶，三基色芯片混光后即可形成白光。In this embodiment, the LED chip is a blue light chip, and the remaining space inside the annular wrapping is filled with phosphor glue mixed with phosphor powder. The blue light chip is matched with phosphor to emit white light. Of course, the LED chip in this embodiment can also be an RGB three-color chip. At this time, the ring-shaped edge is filled with transparent epoxy resin, and there is no need to fill the fluorescent glue mixed with phosphor powder. The three-color chip can be formed after mixing light. white light.
如图5所示，导热塑料边框、背板和导光板相对应位置设置有圆柱形通孔5，采用螺丝穿过通过圆柱形通孔5将背板4和导光板3固定安装到导热塑料边框上。As shown in Figure 5, a cylindrical through-hole 5 is provided at the corresponding position of the heat-conducting plastic frame, the back plate and the light guide plate, and the back plate 4 and the light guide plate 3 are fixedly installed on the heat-conducting plastic frame by passing through the cylindrical through-hole 5 with screws superior.
本实施例中制作时，使用导热塑料作为基材，使用已有的塑料成型方法制作凹槽状的导热塑料边框。应用COB封装技术封装蓝光LED芯片于上述导热塑料边框的长边框2的环状包边9内部的中央，并将导热塑料边框内表面的金属电路7与蓝光LED芯片8采用金线建立电气连接。注塑成型LED封装结构1的环状包边9，并在环状包边9内填充荧光胶，按照已有的方法制作集成化导光板并在相应位置打圆柱形通孔，组装时，只需使用螺丝旋入通过圆柱形通孔5便可完成整个LED平板灯的组装。In the production of this embodiment, heat-conducting plastic is used as the base material, and the groove-shaped heat-conducting plastic frame is made by using the existing plastic molding method. Apply COB packaging technology to package the blue LED chip in the center of the inner ring edge 9 of the long frame 2 of the heat-conducting plastic frame, and establish an electrical connection between the metal circuit 7 on the inner surface of the heat-conducting plastic frame and the blue LED chip 8 using gold wires. Injection molding the annular wrapping 9 of the LED packaging structure 1, and filling the annular wrapping 9 with fluorescent glue, making an integrated light guide plate according to the existing method and punching cylindrical through holes at the corresponding positions. When assembling, only need The assembly of the whole LED flat panel light can be completed by screwing in through the cylindrical through hole 5 with screws.
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention.
Claims (10)
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