CN104894625A - Electroplating method for improving uniformity of cadmium plating of complex workpieces - Google Patents
Electroplating method for improving uniformity of cadmium plating of complex workpieces Download PDFInfo
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- CN104894625A CN104894625A CN201510334191.XA CN201510334191A CN104894625A CN 104894625 A CN104894625 A CN 104894625A CN 201510334191 A CN201510334191 A CN 201510334191A CN 104894625 A CN104894625 A CN 104894625A
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- workpiece
- plating
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- plated
- workpieces
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Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000009713 electroplating Methods 0.000 title claims abstract description 23
- 229910052793 cadmium Inorganic materials 0.000 title claims abstract description 20
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 title claims abstract description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- 239000011734 sodium Substances 0.000 claims description 9
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 3
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an electroplating method for improving uniformity of cadmium plating of complex workpieces. The method is technically characterized in that two-stage energization with electroplating bath current is realized, that is, the workpieces are placed in an electroplating bath, short-term impact is performed on the workpieces with current 2-3 times normal current before conventional electroplating, high-intensity current is exerted on the workpieces instantaneously, grooves of the large workpieces in complex shapes are covered with the high-intensity current, when normal electroplating is performed, current similar to that on surfaces of the grooves can also be exerted on the groove parts, so that the plating thickness of the groove parts is increased, and the uniformity of the plating of the whole workpieces is improved. With the adoption of the method, the problem of non-uniform plating can be solved without any auxiliary tools. Trials indicate that the uniformity of the cadmium plating of the large workpieces and the workpieces in the complex shapes can be improved to a certain extent with the method. Workpiece corrosion due to the fact that plating in the grooves is thin and no plating exists in the grooves is effectively eliminated.
Description
Technical field
The present invention relates to a kind of method of the complex-shaped or larger-size workpiece surface cadmium plating containing dark trough, belong to metallurgical electroplating technology technical field.
Background technology
Cadmium plating is modal steel workpiece surface protection process, and this technique has good Corrosion Protection.But limit by processing condition, to erose workpiece, power line in electroplating process non-uniform Distribution, less than normal for the recess of workpiece (trough etc. containing darker) current density, cause this position thickness of coating partially thin or cover without coating, in workpiece use procedure, this position is very easily corroded, and causes the loss that cannot retrieve.
There is the method for multiple raising workpiece local thickness of coating in electroplating technology, wherein modal is use conformal anode, namely when electroplating, increases current density, to improve the thickness of coating at this position with the use of conformal anode to workpiece local.The method has remarkable income for improving local quality of coating in electroplating technology; but this method has extremely strong specific aim; difform workpiece need make special conformal anode; and the making of conformal anode is also comparatively complicated; during making, need to consider the selection of conformal anode electro-conductive material, the protection at non-conductive position, anode position shape, with laminating degree of workpiece etc.
Summary of the invention
The invention provides a kind of electro-plating method of the complex-shaped or larger-size workpiece surface for dark trough, the method can effectively improve cadmium coater homogeneity and easy and simple to handle.
The object of the invention is to be achieved through the following technical solutions:
Improve an electro-plating method for complex part cadmium coater homogeneity, it is characterized in that, step is as follows:
(1), part dress is hung on special fixture or with copper wire and hangs;
(2), by the sodium hydroxide (NaOH) of workpiece at 60 ~ 80g/L, the sodium carbonate (Na of 30 ~ 50g/L
2cO
3), 30 ~ 50g/L tertiary sodium phosphate (Na
3pO
412H
2o), 10 ~ 30g/L water glass (Na
2siO
3) process is to without greasy dirt in mixing solutions, temperature controls at 75 ~ 95 DEG C;
(3), workpiece to be plated is carried out cleaning 1 ~ 2min in the warm water of 40 ~ 60 DEG C;
(4), workpiece to be plated is carried out cleaning 1 ~ 2min in flowing cool water;
(5), check workpiece surface, workpiece is taken out from water 30s moisture film should be kept to break continuously, not, to ensure that workpiece surface is clean;
(6) by workpiece to be plated in hydrochloric acid (HCl, ρ=1.19g/ml, 42ml/L ~ 84ml/L), concentration be the six methyne four ammonium (CH of 40g/L ~ 50g/L
2)
6n
4mixing solutions in process 1 ~ 2min, temperature: room temperature;
(7), workpiece to be plated is put into flowing cool water cleaning 1 ~ 2min;
(8), by workpiece to be plated cadmium plating in the plating solution:
(9), workpiece to be plated is put into flowing cool water and carry out cleaning 1 ~ 2min;
(10), with the pressurized air of dry cleansing, the part after cadmium plating is dried up;
It is characterized in that: in described step (8), workpiece to be plated is energized and is divided into 2 sections in coating bath, and before plating, use the standard electroplating current of 2 ~ 3 times to carry out short-term impact plating to workpiece, duration is 1 ~ 3min; Then electric current is reduced to standard electroplating current to electroplate.
Step (8) described plating solution is as follows:
Cadmium chloride fine powder (CdCl
22.5H
2o) 35 ~ 55g/L;
Ammonium chloride (NH
4cl) 200 ~ 300g/L;
Sodium-chlor (NaCl) 0 ~ 40g/L
Thiocarbamide ((NH
2)
2cS) 8 ~ 10g/L
MALEIC ANHYDRIDE 1.0 ~ 2.0g/L
PH value 4.0 ~ 5.0
Temperature 75 ~ 95 DEG C
Average sedimentation rate 16 ~ 22 μm/h.
Before plating, in coating bath, the current density of energising presses 1.3A/dm
2~ 3.0A/dm
2calculate, i.e. first paragraph energising 2 ~ 3 times of electric currents; Electroplating time 1 ~ 3min, then reduces electric current, and current density is by 0.5 A/dm
2~ 1.2 A/dm
2calculate, i.e. second segment conventional current energising, is electroplated to the thickness of requirement.
Beneficial effect of the present invention: the feature of the technology of the present invention is embodied in 2 sections of energisings of coating bath electric current, when being placed in plating tank by workpiece, before carrying out routine plating, the electric current of normal current 2 ~ 3 times is used to carry out short-term impact to workpiece, workpiece is made to be subjected to high current within moment, make all to be covered by high electric current in the groove of complex-shaped large-scale workpiece, during pending normal plating, groove position also can be applied in the electric current being similar to its surface, thus increase the thickness of coating at groove position, improve the coating uniformity of whole workpiece.Not by any auxiliary means, only before plating electric current is done to the adjustment of moment, can the problem of uneven coating improved.Through on probation, the method can improve the cadmium plating layer uniformity coefficient of large-scale workpiece, complex-shaped workpieces to a certain extent.Use the method cadmium plating, in groove, is on average reduced to 10% ~ 20% with the coating deviation of workpiece regular surfaces by original 60% ~ 80%, efficiently solve due to the flash plating in groove, the workpiece corrosion that causes without coating.
Embodiment
Implementation process:
1, part dress is hung on special fixture or with copper wire and hangs;
2, by the sodium hydroxide (NaOH) of workpiece at 60 ~ 80g/L, the sodium carbonate (Na of 30 ~ 50g/L
2cO
3), 30 ~ 50g/L tertiary sodium phosphate (Na
3pO
412H
2o), 10 ~ 30g/l water glass (Na
2siO
3) process is to without greasy dirt in mixing solutions, temperature controls at 75 ~ 95 DEG C;
3, workpiece to be plated is carried out cleaning 1 ~ 2min in the warm water of 40 ~ 60 DEG C;
4, workpiece to be plated is carried out cleaning 1 ~ 2min in flowing cool water;
5, check workpiece surface, workpiece is taken out from water 30s moisture film should be kept to break continuously, not, to ensure that workpiece surface is clean;
6, workpiece to be plated is the six methyne four ammonium (CH of 40g/L ~ 50g/L in hydrochloric acid (HCl, ρ=1.19g/ml, 42ml/L ~ 84ml/L), concentration
2)
6n
4mixing solutions in process 1 ~ 2min, temperature: room temperature;
7, workpiece to be plated is put into flowing cool water cleaning 1 ~ 2min;
8, by workpiece to be plated cadmium plating in following solutions: according to current density and workpiece real area, calculate the electric current needed for plating, when starting to electroplate, current density presses 1.3A/dm
2~ 3.0A/dm
2calculate, (first paragraph is energized, 2 ~ 3 times of electric currents) electroplates 1 ~ 3min, then reduces electric current, and current density is by 0.5 A/dm
2~ 1.2 A/dm
2calculate, (second segment is energized, conventional current) is electroplated to the thickness of requirement;
The solution of cadmium plating is:
Cadmium chloride fine powder (CdCl
22.5H
2o) 35 ~ 55g/L
Ammonium chloride (NH
4cl) 200 ~ 300g/L
Sodium-chlor (NaCl) 30 ~ 40g/L
Thiocarbamide ((NH
2)
2cS) 8 ~ 10g/L
MALEIC ANHYDRIDE 1.0 ~ 2.0g/L
PH value 4.0 ~ 5.0
Temperature 75 ~ 95 DEG C
Average sedimentation rate 16 ~ 22 μm/h
9, workpiece to be plated is put into flowing cool water and carry out cleaning 1 ~ 2min;
10, with the pressurized air of dry cleansing, the part after cadmium plating is dried up.
Claims (3)
1. improve an electro-plating method for complex part cadmium coater homogeneity, it is characterized in that, step is as follows:
(1), part dress is hung on special fixture or with copper wire and hangs;
(2), by the sodium hydroxide (NaOH) of workpiece at 60 ~ 80g/L, the sodium carbonate (Na of 30 ~ 50g/L
2cO
3), 30 ~ 50g/L tertiary sodium phosphate (Na
3pO
412H
2o), 10 ~ 30g/L water glass (Na
2siO
3) process is to without greasy dirt in mixing solutions, temperature controls at 75 ~ 95 DEG C;
(3), workpiece to be plated is carried out cleaning 1 ~ 2min in the warm water of 40 ~ 60 DEG C;
(4), workpiece to be plated is carried out cleaning 1 ~ 2min in flowing cool water;
(5), check workpiece surface, workpiece is taken out from water 30s moisture film should be kept to break continuously, not, to ensure that workpiece surface is clean;
(6) by workpiece to be plated in hydrochloric acid (HCl, ρ=1.19g/ml, 42ml/l ~ 84ml/l), concentration be the six methyne four ammonium (CH of 40g/L ~ 50g/L
2)
6n
4mixing solutions in process 1 ~ 2min, temperature: room temperature;
(7), workpiece to be plated is put into flowing cool water cleaning 1 ~ 2min;
(8), by workpiece to be plated cadmium plating in the plating solution:
(9), workpiece to be plated is put into flowing cool water and carry out cleaning 1 ~ 2min;
(10), with the pressurized air of dry cleansing, the part after cadmium plating is dried up;
It is characterized in that: in described step (8), workpiece to be plated is energized and is divided into 2 sections in coating bath, and before plating, use the standard electroplating current of 2 ~ 3 times to carry out short-term impact plating to workpiece, duration is 1 ~ 3min; Then electric current is reduced to standard electroplating current to electroplate.
2. a kind of electro-plating method improving complex part cadmium coater homogeneity according to claim 1, is characterized in that, step (8) described plating solution is as follows:
Cadmium chloride fine powder (CdCl
22.5H
2o) 35 ~ 55g/L;
Ammonium chloride (NH
4cl) 200 ~ 300g/L;
Sodium-chlor (NaCl) 30 ~ 40g/L
Thiocarbamide ((NH
2)
2cS) 8 ~ 10g/L
MALEIC ANHYDRIDE 1.0 ~ 2.0g/L
PH value 4.0 ~ 5.0
Temperature 75 ~ 95 DEG C
Average sedimentation rate 16 ~ 22 μm/h.
3. a kind of electro-plating method improving complex part cadmium coater homogeneity according to claim 2, is characterized in that, before plating, in coating bath, the current density of energising presses 1.3A/dm
2~ 3.0A/dm
2calculate, i.e. first paragraph energising 2 ~ 3 times of electric currents; Electroplating time 1 ~ 3min, then reduces electric current, and current density is by 0.5 A/dm
2~ 1.2 A/dm
2calculate, i.e. second segment conventional current energising, is electroplated to the thickness of requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510334191.XA CN104894625A (en) | 2015-06-17 | 2015-06-17 | Electroplating method for improving uniformity of cadmium plating of complex workpieces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510334191.XA CN104894625A (en) | 2015-06-17 | 2015-06-17 | Electroplating method for improving uniformity of cadmium plating of complex workpieces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104894625A true CN104894625A (en) | 2015-09-09 |
Family
ID=54027568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510334191.XA Pending CN104894625A (en) | 2015-06-17 | 2015-06-17 | Electroplating method for improving uniformity of cadmium plating of complex workpieces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104894625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110129838A (en) * | 2019-06-04 | 2019-08-16 | 中国航发贵州红林航空动力控制科技有限公司 | Low hydrogen brittleness non-cyanide plating cadmium tank liquor and application method are realized on a kind of high strength steel |
| CN115505984A (en) * | 2022-09-16 | 2022-12-23 | 中国航发哈尔滨东安发动机有限公司 | High-precision plating method for cadmium layer of high-length-diameter ratio deep-hole structure |
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|---|---|---|---|---|
| FR2716463A1 (en) * | 1994-02-18 | 1995-08-25 | Neyrpic | Method of coating conductive substrates with protective layer |
| JP2000034593A (en) * | 1998-07-14 | 2000-02-02 | Daiwa Kasei Kenkyusho:Kk | Aqueous solution for reduction precipitation of metal |
| EP1308540A1 (en) * | 2001-10-02 | 2003-05-07 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| CN101942681A (en) * | 2010-06-28 | 2011-01-12 | 重庆长安工业(集团)有限责任公司 | Process for plating cadmium on shaped steel part with deep/blind hole |
| CN102383153A (en) * | 2011-10-28 | 2012-03-21 | 北京科技大学 | Preparation method of electroplated cadmium coating for metalwork |
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| CN104032342A (en) * | 2014-06-11 | 2014-09-10 | 安徽大地熊新材料股份有限公司 | Method for improving combining force of sintered Nd-Fe-B magnet and electroplated coating |
-
2015
- 2015-06-17 CN CN201510334191.XA patent/CN104894625A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2716463A1 (en) * | 1994-02-18 | 1995-08-25 | Neyrpic | Method of coating conductive substrates with protective layer |
| JP2000034593A (en) * | 1998-07-14 | 2000-02-02 | Daiwa Kasei Kenkyusho:Kk | Aqueous solution for reduction precipitation of metal |
| EP1308540A1 (en) * | 2001-10-02 | 2003-05-07 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| CN101942681A (en) * | 2010-06-28 | 2011-01-12 | 重庆长安工业(集团)有限责任公司 | Process for plating cadmium on shaped steel part with deep/blind hole |
| CN103014819A (en) * | 2011-09-27 | 2013-04-03 | 肖云捷 | Wearable compound layer material for machine parts and manufacturing method and equipment thereof |
| CN102383153A (en) * | 2011-10-28 | 2012-03-21 | 北京科技大学 | Preparation method of electroplated cadmium coating for metalwork |
| CN104032342A (en) * | 2014-06-11 | 2014-09-10 | 安徽大地熊新材料股份有限公司 | Method for improving combining force of sintered Nd-Fe-B magnet and electroplated coating |
Non-Patent Citations (2)
| Title |
|---|
| 潘继民主编: "《电镀工技能提高必读》", 31 December 2011 * |
| 谢和生: "《电镀工问答》", 31 December 1983 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110129838A (en) * | 2019-06-04 | 2019-08-16 | 中国航发贵州红林航空动力控制科技有限公司 | Low hydrogen brittleness non-cyanide plating cadmium tank liquor and application method are realized on a kind of high strength steel |
| CN115505984A (en) * | 2022-09-16 | 2022-12-23 | 中国航发哈尔滨东安发动机有限公司 | High-precision plating method for cadmium layer of high-length-diameter ratio deep-hole structure |
| CN115505984B (en) * | 2022-09-16 | 2025-08-08 | 中国航发哈尔滨东安发动机有限公司 | A method for high-precision plating of cadmium layer with high aspect ratio deep hole structure |
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Application publication date: 20150909 |