CN104943320B - A method for laminating substrates - Google Patents

Abstract

The invention provides a kind of applying method of substrate, is related to product manufacturing technical field, can solve the problem that after in prior art fitting to thin substrate on thick substrate, as the thin substrate that the active force of fitting between thin substrate and thick substrate causes by force is difficult to the problem that peels off.Concrete scheme is：Pasting on region in first substrate, forms laminating pattern with gap, and what second substrate was covered in first substrate pastes region so that second substrate and pattern contacts of fitting, the thickness of second substrate are less than the thickness of first substrate.The embodiment of the present invention is used for carrying out baseplate-laminating.

Description

A method for laminating substrates

technical field

The invention relates to the technical field of product manufacturing, in particular to a substrate bonding method.

Background technique

Ultra-thin products are the mainstream direction of future electronic products. Since the thickness of the ultra-thin products is small (for example, 0.2 mm), the ultra-thin products are easy to break and difficult to manufacture. Existing manufacturing processes usually cannot directly process ultra-thin products on ultra-thin substrates, but need the support and protection of thick substrates.

In the prior art, usually a layer of bonding film 002 is first formed on the thick substrate 001, and then the ultra-thin substrate 003 is bonded to the bonding film 002, and then the ultra-thin substrate 003 is bonded to the thick substrate 001; Afterwards, the ultra-thin substrate 003 is processed to obtain an ultra-thin product. Wherein, the cross-sectional view after bonding the ultra-thin substrate 003 to the thick substrate 001 can be referred to FIG. 1 . However, the strong bonding force between the ultra-thin substrate and the laminated film in the prior art often makes it difficult to peel off the ultra-thin substrate after processing.

Contents of the invention

Embodiments of the present invention provide a method for attaching substrates, which can solve the problem that the thin substrate is difficult to peel off due to the strong bonding force between the thin substrate and the thick substrate after the thin substrate is attached to the thick substrate in the prior art. The problem.

In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:

On the one hand, a substrate bonding method is provided, the method comprising:

forming a bonding pattern with a gap on the bonding area of the first substrate;

The second substrate is pasted on the pasting area of the first substrate, so that the second substrate is in contact with the pasting pattern, and the thickness of the second substrate is smaller than that of the first substrate.

With reference to this aspect, in a first possible implementation manner of this aspect, before attaching the second substrate to the attaching area of the first substrate, the method further includes:

A first protection pattern is formed on a region of the first substrate corresponding to the gap, and the thickness of the first protection pattern is the same as that of the bonding pattern.

With reference to the first possible implementation manner of this aspect, in a second possible implementation manner of this aspect, while forming the first protection pattern, the method further includes:

A closed second protection pattern is formed in a peripheral area of the bonding pattern on the first substrate, and the thickness of the second protection pattern is the same as that of the bonding pattern.

With reference to this aspect, in a third possible implementation manner of this aspect, the bonding pattern is a uniformly arranged strip pattern.

With reference to this aspect, in a fourth possible implementation manner of this aspect, forming the bonding pattern with gaps on the bonding area of the first substrate includes:

making a bonding film on the first substrate;

The bonding film is patterned to form the bonding pattern with gaps in the bonding area of the first substrate.

With reference to the second possible implementation manner of this aspect, in a fifth possible implementation manner of this aspect, while forming the protection pattern, a The enclosed second protective pattern includes:

making a protective film on the first substrate;

Patterning the protective film to form the first protective pattern located on the attached area of the first substrate corresponding to the gap, and forming the first protective pattern located in the peripheral area of the attached pattern on the first substrate. Describe the second protection pattern.

Combining this aspect to the fifth possible implementation manner of this aspect, in a sixth possible implementation manner of this aspect, the first substrate and the second substrate are glass substrates, plastic substrates or metal substrates.

With reference to the sixth possible implementation manner of this aspect, in the seventh possible implementation manner of this aspect, if the first substrate and the second substrate are both glass substrates, the material of the bonding pattern Indium tin oxide.

With reference to the sixth possible implementation manner of this aspect, in the eighth possible implementation manner of this aspect, if both the first substrate and the second substrate are glass substrates, the first protection pattern The material is silicon nitride, silicon carbide or polyimide.

An embodiment of the present invention provides a substrate bonding method, by forming a bonding pattern with a gap on the bonding area of the first substrate, and then bonding a second substrate having a thickness smaller than the first substrate on the bonding area of the first substrate. On the covering area, the second substrate is in contact with the bonding pattern with a gap, so that the second substrate can only be bonded to the first substrate by the bonding force of the bonding pattern on the bonding area of the first substrate, while the second substrate There is no bonding force at the gap between the second substrate and the bonding pattern on the bonding area of the first substrate, thereby reducing the bonding force between the second substrate and the first substrate. Compared with the prior art where the second substrate and the first substrate are bonded together through a layer of bonding film without a gap, the method provided by the embodiment of the present invention can solve the problem of bonding the thin substrate to the substrate in the prior art. After being placed on the thick substrate, it is difficult to peel off the thin substrate due to the strong bonding force between the thin substrate and the thick substrate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a cross-sectional view of an ultra-thin substrate bonded to a thick substrate in the prior art;

Fig. 2 is a schematic flow chart of a method provided by an embodiment of the present invention;

Fig. 3 is a cross-sectional view of a first substrate forming a bonding pattern provided by an embodiment of the present invention;

FIG. 4 is a cross-sectional view of a second substrate bonded to the first substrate with a bonding pattern shown in FIG. 3 according to an embodiment of the present invention;

5-7 are top views of the bonding pattern in the structure shown in FIG. 3 provided by the embodiment of the present invention;

FIG. 8 is a schematic flowchart of another method provided by an embodiment of the present invention;

Fig. 9 is a cross-sectional view of a first substrate forming a bonding pattern and a first protection pattern according to an embodiment of the present invention;

10-12 are top views of the pasting pattern and the first protection pattern in the structure shown in FIG. 9 provided by the embodiment of the present invention;

Fig. 13 is a cross-sectional view of a first substrate forming a bonding pattern, a first protection pattern and a second protection pattern according to an embodiment of the present invention;

Fig. 14 is a top view of the bonding pattern, the first protection pattern and the second protection pattern in the structure shown in Fig. 13 provided by the embodiment of the present invention;

Fig. 15 is a cross-sectional view of a second substrate bonded to the first substrate shown in Fig. 9 to form a bonding pattern and a first protection pattern according to an embodiment of the present invention;

FIG. 16 is a cross-sectional view of a second substrate bonded to the first substrate shown in FIG. 13 to form a bonding pattern, a first protection pattern, and a second protection pattern according to an embodiment of the present invention;

Fig. 17 is a schematic flowchart of another method provided by an embodiment of the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description. It is not intended to indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and thus should not be construed as limiting the invention.

Example 1

An embodiment of the present invention provides a substrate lamination method, see FIG. 2, the main steps of the method may include:

101. As shown in FIG. 3 , form a bonding pattern 012 with gaps on the bonding area of the first substrate 011 .

102. As shown in FIG. 4, attach the second substrate 013 to the attaching area of the first substrate 011, so that the second substrate 013 is in contact with the pasting pattern 012, and the thickness of the second substrate 013 is smaller than the thickness of the first substrate 011 .

Wherein, the first substrate 011 and the second substrate 013 can be made of any materials such as glass substrate, plastic substrate, metal substrate, etc., and the materials of the first substrate 011 and the second substrate 013 can be the same or different, which is not limited here.

The lamination area of the first substrate 011 refers to the area that overlaps with the second substrate 013 when viewed from the vertical direction of the first substrate 011 during the lamination process. For example, generally the size of the first substrate 011 is larger than the size of the second substrate 013, at this time, the attached area of the first substrate 011 can be the projected area of the second substrate 013 on the first substrate 011; of course, the first substrate The size of 011 can also be equal to the size of the second substrate 013. At this time, the attached area of the first substrate 011 can be the entire surface area of the first substrate 011; as another example, the size of the first substrate 011 can also be smaller than the second substrate 011 The size of the substrate 013 , at this time, the attached area of the first substrate 011 may still be the entire surface area of the first substrate 011 .

The bonding pattern 012 refers to a pattern with a bonding effect, which is used to bond the second substrate 013 and the first substrate 011 together in this embodiment, generally speaking, whether it has a bonding effect depends on the material of the pattern . In this embodiment, the material of the pattern may be a material capable of forming an intermolecular force with the second substrate 013 or an adhesive material. In addition, the so-called pasting pattern 012 with a gap on the pasting area of the first substrate 011 means that only a part of the pasting area of the first substrate 011 is covered by the pasting pattern 012, and the other part is not pasted. The area covered by the pattern 012 is called the gap. The gap may not be filled by any other material.

For the shape of the bonding pattern 012 in the structure shown in FIG. 3 , it may include multiple discontinuous patterns (that is, there is no connection between the multiple patterns), and the interval between these discontinuous patterns is the gap. For example, the top view of the bonding pattern 012 in the structure shown in FIG. 3 can refer to FIG. 5, the bonding pattern 012 is a uniformly arranged strip pattern, and the second substrate 013 can be connected with The first substrate 011 is bonded together, so that the bonding force between the second substrate 013 and the first substrate 011 is relatively uniform, so that the thinner second substrate 013 is less likely to be damaged when peeled off. Specifically, as shown in Figure 5(a), the strip patterns are arranged in an array, and the spacing s between each adjacent strip pattern in the horizontal direction is equal, and the spacing s between each adjacent strip pattern in the vertical direction is d is also equal, wherein s and d can be equal or not, and it should be noted that the bar pattern is generally rectangular; or as shown in Figure 5 (b), the bar pattern is arranged at equal intervals along the horizontal direction (spacing Marked with v), each bar pattern extends in the vertical direction. Or, as an example, the top view of the bonding pattern 012 in the structure shown in FIG. 3 may also refer to FIG. 6 , the bonding pattern 012 is a mesh pattern. Or, as another example, the top view of the bonding pattern 012 in the structure shown in FIG. 3 can also refer to FIG. 7 , the bonding pattern 012 is an irregular pattern. In fact, the bonding pattern 012 may be a pattern of any shape, and the embodiment of the present invention does not limit its specific shape.

The above-mentioned bonding pattern 012 can be formed on the first substrate 011 through a patterning process. The so-called patterning process can include: film formation, exposure, development and other processes, and of course can further include etching, stripping and other processes. Of course, the patterning process in this embodiment is not limited thereto, as long as a process capable of forming a pattern of a certain shape on the substrate should fall within the protection scope of the present invention. Exemplarily, a lamination film can be fabricated on the first substrate 011 , and then the lamination film is patterned to form a lamination pattern 012 with gaps in the lamination area of the first substrate 011 .

The above steps 101 and 102 are used to attach the thinner second substrate 013 to the thicker first substrate 011 , and the specific thicknesses of the first substrate 011 and the second substrate 013 are not limited in the embodiment of the present invention. For example, the thickness of the first substrate 011 may be 0.5 mm, and the thickness of the second substrate 013 may be 0.1 mm, 0.01 mm, or 102-105 angstroms.

A method for attaching substrates provided by an embodiment of the present invention is to form an attaching pattern 012 with a gap on the attaching area of the first substrate 011, and then attach a second substrate 013 with a thickness smaller than that of the first substrate 011 on the substrate. On the pasting area of the first substrate 011, the second substrate 013 is in contact with the pasting pattern 012 with a gap, so that the second substrate 013 can only pass through the pasting cooperation with the pasting pattern 012 on the pasting area of the first substrate 011. Attach to the first substrate 011 with force, but there is no adhesive force at the gap between the second substrate 013 and the pasting pattern 012 on the first substrate 011, thereby reducing the adhesion between the second substrate 013 and the first substrate 011 Cooperate hard. Compared with the prior art where the thin substrate and the thick substrate are bonded together through a layer of bonding film without gaps, the method provided by the embodiment of the present invention can solve the problem of bonding the thin substrate to the thick substrate in the prior art. After the substrate is attached, it is difficult to peel off the thin substrate due to the strong bonding force between the thin substrate and the thick substrate.

Example 2

Referring to Fig. 8, the embodiment of the present invention provides another substrate bonding method, the main steps may include steps:

201. On the bonding area of the first substrate 011, form a bonding pattern 012 with gaps.

For the process of forming the bonding pattern 012 with gaps on the bonding area of the first substrate 011 , please refer to the description in Embodiment 1 for details.

Forming a bonding pattern 012 with a gap on the bonding area of the first substrate 011 can make the second substrate 013 only bond with the bonding pattern 012 on the bonding area of the first substrate 011 through a strong bonding force. On the first substrate 011, there is no bonding force at the gap of the bonding pattern 012. Therefore, it is pasted with a layer of bonding film that does not have a gap on the bonding area between the thin substrate and the thick substrate in the prior art. Compared together, the method provided by the embodiment of the present invention can reduce the bonding force between the second substrate 013 and the first substrate 011, thereby solving the problem caused by the strong bonding force between the second substrate 013 and the first substrate 011. The problem that the second substrate 013 is difficult to peel off.

202 . As shown in FIG. 9 , form a first protection pattern 014 on the area of the first substrate 011 corresponding to the gap between the bonding patterns 012 , and the thickness of the first protection pattern 014 is the same as that of the bonding pattern 012 .

After the bonding pattern 012 with a gap is formed on the bonding area of the first substrate 011, a first protection pattern having the same thickness as the bonding pattern 012 can also be formed on the first substrate 011 corresponding to the gap of the bonding pattern 012 014, so that a flat and continuous film layer can be formed between the second substrate 013 and the first substrate 011, thus avoiding the production of product components on the second substrate 013 without forming the first protective pattern 014 During the process, the problem of liquid seepage through the gaps of the pasting pattern 012 protects the pasting pattern from being corroded by liquid seepage, so that the second substrate 013 can be firmly pasted on the first substrate 013 through the pasting pattern 012 before peeling off. on the substrate 011. For example, when it is necessary to etch the first surface of the bonded second substrate 013 that is not bonded to the first substrate 011, if the first protective pattern 014 is not formed in the gap corresponding to the bonded pattern 012 , the solution used for etching may penetrate into the gaps of the bonding pattern 012 to corrode the bonding pattern 012 .

It should be noted that the bonding pattern 012 is mainly used to bond the second substrate 013 to the first substrate 011, while the main function of the first protective pattern 014 is to prevent liquid seepage, thereby protecting the bonding pattern from Corrosion by seepage is not for bonding the second substrate 013 and the first substrate 011, so the material of the first protection pattern 014 is different from that of the pasting pattern 012, and the gap between the second substrate 013 and the first protection pattern 014 is There is little or no fitting force, or the fitting force is weak.

In addition, since the first protection pattern 014 corresponds to the gap of the bonding pattern 012 , the shape of the first protection pattern 014 corresponds to the shape of the gap of the bonding pattern 012 . For example, in the structure shown in FIG. 9, when the bonding pattern 012 is a uniformly arranged strip pattern as shown in FIG. 5, referring to FIG. 10, the first protective pattern 014 corresponding to the gap between the bonding pattern 012 is also uniform Arranged strip patterns; or, when the bonding pattern 012 is a mesh pattern as shown in Figure 6, the shape of the first protective pattern 014 is a checkered pattern as shown in Figure 11; or, when the bonding pattern When 012 is an irregular-shaped pattern as shown in FIG. 7 , the shape of the first protection pattern 014 is an irregular shape corresponding to the gap between the bonding patterns 012 as shown in FIG. 12 . Since the bonding pattern 012 can be a pattern of any shape, the first protection pattern 014 can also be a pattern of any shape, which is not limited in this embodiment of the present invention.

Further, while forming the first protection pattern 014, the method may further include: forming a closed second protection pattern 015 in the peripheral area of the first substrate 011 pasted with the pattern 012, and the thickness of the second protection pattern 015 is the same as that of the pasted pattern 012. The combined pattern 012 has the same thickness. Since the closed second protection pattern 015 is formed in the peripheral area of the bonding pattern 012, the bonding pattern 012 can be completely surrounded inside the second protection pattern 015, thus avoiding the The corrosive solution corrodes the pasting pattern 012 to better protect the pasting pattern 012 , so that the second substrate 013 can be firmly pasted on the first substrate 011 through the pasting pattern 012 before peeling off.

Specifically, while forming the first protective pattern 014, forming the closed second protective pattern 015 on the peripheral area of the first substrate 011 pasted with the pattern 012 may include: making a protective film on the first substrate 011, placing the protective film Patterning forms the first protection pattern 014 located on the attached area of the first substrate 011 corresponding to the gap, and forms the second protection pattern 015 located on the peripheral area of the attached pattern 012 of the first substrate 011 . Wherein, the material of the second protection pattern 015 is the same as that of the first protection pattern 014 .

Exemplarily, the cross-sectional view of the first substrate 011 forming the bonding pattern 012, the first protective pattern 014 and the second protective pattern 015 can also refer to FIG. 13; the bonding pattern 012, the first protective pattern 014 in the structure shown in FIG. And the top view of the second protection pattern 015 can refer to FIG. 14 .

203 . Paste the second substrate 013 on the pasting area of the first substrate 011 , so that the second substrate 013 is in contact with the pasting pattern 012 , and the thickness of the second substrate 013 is smaller than the thickness of the first substrate 011 .

Exemplarily, the cross-sectional view of the first substrate 011 formed with the bonding pattern 012 and the first protection pattern 014 shown in FIG. 9 after bonding the second substrate 013 can refer to FIG. 15; Refer to FIG. 16 for the cross-sectional view of the first substrate 011 after forming the bonding pattern 012 , the first protection pattern 014 and the second protection pattern 015 shown in FIG. 13 .

In the embodiment of the present invention, since the first substrate 011 and the second substrate 013 may be glass substrates, plastic substrates, metal substrates or other substrates made of any material. If the materials of the first substrate 011 and the second substrate 013 are different, the materials of the bonding pattern 012 for bonding may also be different, and the materials of the first protection pattern 014 may also be different.

Exemplarily, if both the first substrate 011 and the second substrate 013 are glass substrates, the bonding pattern 012 may be made of indium tin oxide. If both the first substrate 011 and the second substrate 013 are glass substrates, the material of the first protection pattern 014 may be silicon nitride, silicon carbide or polyimide. The same as the material of the first protection pattern 014, the material of the second protection pattern 015 can also be silicon nitride, silicon carbide or polyimide.

Or, as an example, if the first substrate 011 and the second substrate 013 are both plastic substrates, they can also be bonded through the bonding pattern 012 formed by an adhesive, and the material of the first protection pattern 014 can also be silicon nitride. , silicon carbide or polyimide, etc. Certainly, for different combinations of the materials used for the first substrate 011 and the materials used for the second substrate 013 , the materials for the pasting pattern 012 and the first protection pattern 014 can be selected according to specific conditions, which is not limited here.

A method for attaching substrates provided by an embodiment of the present invention is to form an attaching pattern 012 with a gap on the attaching area of the first substrate 011, and then attach a second substrate 013 with a thickness smaller than that of the first substrate 011. On the pasting area of the first substrate 011, the second substrate 013 is in contact with the bonding pattern 012 with a gap, so that the second substrate 013 can only pass through the bonding pattern 012 on the bonding area of the first substrate 011. The bonding force of the second substrate 013 to the first substrate 011 is reduced by cooperating with the first substrate 011 . Compared with the prior art where the thin substrate and the thick substrate are bonded together through a layer of bonding film without gaps, the method provided by the embodiment of the present invention can solve the problem of bonding the thin substrate to the thick substrate in the prior art. After the substrate is attached, it is difficult to peel off the thin substrate due to the strong bonding force between the thin substrate and the thick substrate.

Example 3

In the embodiment of the present invention, both the first substrate 011 and the second substrate 013 are glass substrates, the material of the bonding pattern 012 is indium tin oxide (Indium Tin Oxide, ITO), and the material of the first protection pattern 014 is silicon nitride. As an example, the bonding method of substrates will be described. Referring to Figure 17, the main steps of the method may include:

301 . Fabricate an ITO bonding film on the first substrate 011 .

Wherein, the function of the bonding film is mainly to form the bonding pattern 012 so as to bond the second substrate 013 to the first substrate 011 . When the first substrate 011 and the second substrate 013 are both glass substrates, there can be many kinds of materials for the bonding pattern 012 bonding the two glass substrates together, that is, there can be many kinds of materials for the bonding film, such as ITO , Adhesives, etc. When ITO is in contact with the glass substrate, it will form an intermolecular force on the contact surface so that it can be tightly attached to the glass substrate, and compared with other materials such as adhesives, when the second substrate 013 is peeled off, the adhesive will stick to the pattern 012 will leave a lot of residue, which needs further processing; while the bonding pattern 012 using ITO material will not leave residue, and is more suitable as a material for bonding pattern 012. Therefore, in this step, a continuous ITO bonding film can be deposited on the surface of the first substrate 011 by means of sputtering, ion plating, vacuum evaporation, etc., so as to form an ITO bonding pattern on the basis of the ITO bonding film 012, so that the second substrate 013 and the first substrate 011 are bonded together.

302 . Pattern the ITO lamination film to form an ITO lamination pattern 012 with gaps in the lamination area of the first substrate 011 .

After the continuous ITO thin film is formed on the surface of the first substrate 011, the ITO bonding pattern 012 located in the bonding area of the first substrate 011 can be formed by a patterning process. Exemplarily, uniformly arranged strip-shaped ITO bonding patterns 012 can be formed through patterning processes such as gluing, exposure, development, etching, and stripping.

It should be noted that after forming the ITO bonding pattern 012 with gaps, the thin glass substrate can only be bonded to the thick glass substrate by the bonding force at the ITO bonding pattern 012 on the thick substrate bonding area, while There is no bonding force at the gap of the bonding pattern 012, so compared with the thin substrate and the thick substrate bonded together by a layer of ITO bonding film without a gap in the prior art, the embodiment of the present invention provides The method reduces the bonding force between the thin glass substrate and the thick glass substrate, and can solve the problem of the thin substrate caused by the strong bonding force between the thin substrate and the thick substrate after the thin substrate is bonded to the thick substrate in the prior art. Difficult to separate issues.

303 . Form a silicon nitride protective film on the first substrate 011 .

Wherein, the function of the protective film is mainly to form the first protective pattern 014 in the area corresponding to the gap of the bonding pattern 012, so as to form a flat film layer on the bonding area of the first substrate 011 to avoid liquid seepage, and It is not for attaching the second substrate 013 to the first substrate 011, so there may be no bonding force or weak bonding force between the first protective pattern 014 and the second substrate 013, so the first protective pattern 014 and The material of the protective film can be various protective materials such as silicon nitride, silicon carbide, and polyimide. Exemplarily, silicon nitride material is used here to make the protection film.

Specifically, a continuous silicon nitride film, that is, a silicon nitride protective film, may be deposited on the surface of the first substrate 011 forming the bonded pattern 012 by means of sputtering, ion plating, vacuum evaporation and the like.

304. Pattern the silicon nitride protective film to form a silicon nitride first protection pattern 014 on the first substrate 011 corresponding to the gap between the ITO bonding pattern 012, and form the periphery of the ITO bonding pattern 012 on the first substrate 011 The silicon nitride second protection pattern 015 in the region.

Exemplarily, the silicon nitride protective film can be formed through patterning processes such as gluing, exposure, development, etching, and peeling to form the silicon nitride first layer in the area corresponding to the gap between the ITO bonding pattern 012 on the bonding area of the first substrate 011. protection pattern 014, and form a silicon nitride second protection pattern 015 located in the peripheral area of the ITO bonding pattern 012 of the first substrate 011, so that the thickness of the silicon nitride first protection pattern 014 and the silicon nitride second protection pattern 015 The thickness is the same as the thickness of the ITO bonding pattern 012.

305 . Paste the second substrate 013 on the pasting area of the first substrate 011 , so that the second substrate 013 is in contact with the pasting pattern 012 , and the thickness of the second substrate 013 is smaller than the thickness of the first substrate 011 .

In this step, the second substrate with a smaller thickness (i.e., a thin glass substrate) is pasted on the pasting area of the first substrate 011 with a larger thickness (i.e., a thick glass substrate), so that the second substrate 013 is bonded to the The pattern 012 is in contact with the continuous film layer formed by the first protection pattern 014 , and is bonded to the first substrate 011 through the bonding pattern 012 .

A substrate lamination method provided in the embodiment of the present invention is to form an ITO lamination pattern 012 with a gap on the lamination area of the thick glass substrate, and then laminate the thin glass substrate on the lamination area of the thick glass substrate , so that the thin glass substrate is in contact with the ITO bonding pattern 012 with a gap, so that the thin glass substrate can only be bonded to the thick glass substrate through the bonding force of the ITO bonding pattern 012 on the thick glass substrate bonding area, The bonding force between the thin glass substrate and the thick glass substrate is reduced. Compared with the prior art where the thin substrate and the thick substrate are bonded together through a layer of ITO bonding film without a gap, the method provided by the embodiment of the present invention can solve the problem of bonding the thin substrate to the thick substrate in the prior art. After the substrate is placed on the substrate, it is difficult to peel off the thin substrate due to the strong bonding force between the thin substrate and the thick substrate.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (8)

1. a kind of applying method of substrate, it is characterised in that include：

The laminating pattern that formed on region with gap of pasting in first substrate；

On the region that the first substrate corresponds to the gap, form first and protect pattern, the thickness of the first protection pattern Spend identical with the thickness of the laminating pattern；

What second substrate was covered in the first substrate pastes region so that the second substrate is connect with the pattern of fitting Touch, the thickness of the second substrate is less than the thickness of first substrate.

2. method according to claim 1, it is characterised in that while the first protection pattern is formed, the side Method also includes：

The outer peripheral areas of the laminating pattern on the first substrate, form the second protection pattern of closing, and described second protects The thickness of shield pattern is identical with the thickness of the laminating pattern.

3. method according to claim 1, it is characterised in that the laminating pattern is the bar paten of uniform arrangement.

4. method according to claim 1, it is characterised in that between the pasting on region and formed and have of the first substrate The laminating pattern of gap includes：

Attaching film is made on the first substrate；

The attaching film composition is formed the laminating pattern with gap for pasting region for being located at the first substrate.

5. method according to claim 2, it is characterised in that while the first protection pattern is formed, described The outer peripheral areas of the laminating pattern on first substrate, the described second protection pattern for forming closing include：

Protective film is made on the first substrate；

The protective film composition is formed the institute for pasting the region in the correspondence gap on region for being located at the first substrate The first protection pattern is stated, and forms the second protection figure positioned at the outer peripheral areas of laminating pattern described in the first substrate Case.

6. the method according to any one of claim 1-5, it is characterised in that the first substrate and the second substrate are Glass substrate, plastic base or metal substrate.

7. method according to claim 6, it is characterised in that if the first substrate and the second substrate are glass Substrate, then the material of the laminating pattern is tin indium oxide.

8. method according to claim 6, it is characterised in that if the first substrate and the second substrate are glass Substrate, then the material of the first protection pattern is silicon nitride, carborundum or polyimides.