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CN104994684B - A kind of circuit connection structure - Google Patents

A kind of circuit connection structure Download PDF

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Publication number
CN104994684B
CN104994684B CN201510393015.3A CN201510393015A CN104994684B CN 104994684 B CN104994684 B CN 104994684B CN 201510393015 A CN201510393015 A CN 201510393015A CN 104994684 B CN104994684 B CN 104994684B
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CN
China
Prior art keywords
circuit board
circuit
layer
connection structure
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510393015.3A
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Chinese (zh)
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CN104994684A (en
Inventor
楼锦跃
楼海华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN LAIKEN LIGHTING TECHNOLOGY Co Ltd
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XIAMEN LAIKEN LIGHTING TECHNOLOGY Co Ltd
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Application filed by XIAMEN LAIKEN LIGHTING TECHNOLOGY Co Ltd filed Critical XIAMEN LAIKEN LIGHTING TECHNOLOGY Co Ltd
Priority to CN201510393015.3A priority Critical patent/CN104994684B/en
Publication of CN104994684A publication Critical patent/CN104994684A/en
Application granted granted Critical
Publication of CN104994684B publication Critical patent/CN104994684B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09445Pads for connections not located at the edge of the PCB, e.g. for flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明公开一种电路连接结构,包括硬质电路板单元,硬质电路板单元之间通过柔性线路板进行电性连接。本发明使得电路板可以折叠、弯曲及扭曲,且散热效果较好。

The invention discloses a circuit connection structure, which comprises hard circuit board units, and the hard circuit board units are electrically connected through flexible circuit boards. The invention enables the circuit board to be folded, bent and twisted, and has better heat dissipation effect.

Description

一种电路连接结构A circuit connection structure

技术领域technical field

本发明涉及电路连接技术领域,尤其是指一种电路连接结构。The invention relates to the technical field of circuit connection, in particular to a circuit connection structure.

背景技术Background technique

现有技术中,电路板通常包括铝基电路板和印刷电路板,铝基电路板一般由四层结构组成,底层为铝基板,铝基板上为绝缘层,在绝缘层上设置电路层,最后在电路层上设置绝缘保护层。所述铝基电路板的铝基板可以将电路层产生的热量导走,散热效果较好,然而无法折叠扭曲。In the prior art, the circuit board usually includes an aluminum-based circuit board and a printed circuit board. The aluminum-based circuit board generally consists of a four-layer structure. The bottom layer is an aluminum substrate, and the aluminum substrate is an insulating layer. An insulating protective layer is provided on the circuit layer. The aluminum substrate of the aluminum-based circuit board can conduct away the heat generated by the circuit layer, and has a good heat dissipation effect, but cannot be folded and twisted.

印刷电路板通常为柔性线路板,其结构从下到上依次为:基板、接着剂、铜箔、接着剂和保护膜。柔性线路板可以折叠、弯曲和扭曲等,然而其散热效果较差。The printed circuit board is usually a flexible circuit board, and its structure from bottom to top is: substrate, adhesive, copper foil, adhesive and protective film. Flexible circuit boards can be folded, bent and twisted, etc., but their heat dissipation effect is poor.

如图1所示,现有技术揭示的一种柱状LED发光主体的灯板10展开状态图,在灯板10上设置LED芯片(图中未示出),在生产该LED灯时,该灯板10缠绕在多面柱状体上,因此,需将灯板10分隔成多个灯板单元101,灯板单元101之间设置剖槽102,且灯板单元101之间通过连接桥103进行电性连接,然后将灯板单元101折弯缠绕在多面柱状体上。其缺陷在于:灯板单元101之间通过连接桥103进行电性连接,在折弯灯板单元101时,该连接桥容易翘起裂开,形成虚焊,使得电路发生接触不良,甚至断路,产品合格率较低。As shown in Fig. 1, the expanded state diagram of a lamp board 10 of a columnar LED light-emitting body disclosed in the prior art, LED chips (not shown in the figure) are arranged on the lamp board 10, and when the LED lamp is produced, the lamp The board 10 is wound on the multi-faceted columnar body, therefore, the lamp board 10 needs to be divided into a plurality of lamp board units 101, and the cut grooves 102 are provided between the lamp board units 101, and the electrical connection between the lamp board units 101 is carried out through the connecting bridge 103. connected, and then the lamp panel unit 101 is bent and wound on the polyhedral column. The disadvantage is that the lamp board units 101 are electrically connected through the connecting bridge 103. When the lamp board unit 101 is bent, the connecting bridge is easy to lift and crack, forming a virtual weld, causing poor contact of the circuit, or even breaking the circuit. The product qualification rate is low.

发明内容Contents of the invention

本发明的目的在于提供一种电路连接结构,使得电路板可以折叠、弯曲及扭曲,且散热效果较好。The purpose of the present invention is to provide a circuit connection structure, so that the circuit board can be folded, bent and twisted, and the heat dissipation effect is better.

为达成上述目的,本发明的解决方案为:To achieve the above object, the solution of the present invention is:

一种电路连接结构,包括硬质电路板单元,硬质电路板单元之间通过柔性线路板进行电性连接。A circuit connection structure includes hard circuit board units, and the hard circuit board units are electrically connected through flexible circuit boards.

进一步,硬质电路板单元为铝基电路板。Further, the rigid circuit board unit is an aluminum-based circuit board.

进一步,铝基电路板由四层结构组成,底层为铝基板,铝基板上为绝缘层,在绝缘层上设置电路层,在电路层上设置绝缘保护层。Further, the aluminum-based circuit board is composed of a four-layer structure, the bottom layer is an aluminum substrate, the aluminum substrate is an insulating layer, a circuit layer is arranged on the insulating layer, and an insulating protection layer is arranged on the circuit layer.

进一步,柔性线路板由下至上依次由基板、接着剂、铜箔、接着剂和保护膜组成,其中铜箔连接铝基电路板的电路层。Further, the flexible circuit board is composed of a substrate, an adhesive, a copper foil, an adhesive and a protective film from bottom to top, wherein the copper foil is connected to the circuit layer of the aluminum-based circuit board.

进一步,电路层上设置LED芯片。Further, LED chips are arranged on the circuit layer.

进一步,硬质电路板单元之间通过金属连接桥进行弹性连接。Further, the hard circuit board units are elastically connected through metal connecting bridges.

进一步,金属连接桥为铝基板。Further, the metal connection bridge is an aluminum substrate.

采用上述方案后,本发明硬质电路板单元之间通过柔性线路板进行电性连接,而不是通过金属连接桥进行电性连接。因此,本发明硬质电路板单元之间可以折叠、弯曲及扭曲,进而提高电路之间的连接效果,不至于产生接触不良,提高产品良率。同时,硬质电路板单元设置导热基板,其散热效果较好。After adopting the above solution, the rigid circuit board units of the present invention are electrically connected through the flexible circuit board instead of through the metal connection bridge. Therefore, the rigid circuit board units of the present invention can be folded, bent and twisted, thereby improving the connection effect between circuits, avoiding poor contact, and improving product yield. At the same time, the hard circuit board unit is provided with a heat-conducting substrate, which has a better heat dissipation effect.

附图说明Description of drawings

图1是现有技术的结构示意图;Fig. 1 is the structural representation of prior art;

图2是本发明的结构示意图;Fig. 2 is a structural representation of the present invention;

图3是本发明应用于LED灯板的结构示意图。Fig. 3 is a schematic diagram of the structure of the present invention applied to an LED lamp panel.

标号说明Label description

灯板10 灯板单元101Light panel 10 Light panel unit 101

剖槽102Grooving 102

硬质电路板单元1 柔性线路板2Rigid circuit board unit 1 Flexible circuit board 2

金属连接桥3 顶部硬质电路板单元4。Metal connecting bridge 3 top rigid circuit board unit 4 .

具体实施方式detailed description

以下结合附图及具体实施例对本发明做详细描述。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

参阅图2所示,本发明揭示的一种电路连接结构,包括硬质电路板单元1,硬质电路板单元1之间通过柔性线路板2进行电性连接。硬质电路板单元1通常为铝基电路板。Referring to FIG. 2 , a circuit connection structure disclosed by the present invention includes hard circuit board units 1 , and the hard circuit board units 1 are electrically connected through a flexible circuit board 2 . The rigid circuit board unit 1 is usually an aluminum-based circuit board.

硬质电路板单元1之间通过柔性线路板2进行电性连接,而不是通过金属连接桥进行电性连接。硬质电路板单元1之间可以折叠、弯曲及扭曲,可以适用于电路板安装复杂的情况;同时,硬质电路板单元1通常设置铝基板,其散热效果较好。同时具备散热好且可以扭曲安装。The hard circuit board units 1 are electrically connected through the flexible circuit board 2 instead of through the metal connection bridge. The hard circuit board unit 1 can be folded, bent and twisted, which is suitable for complex installation of circuit boards; meanwhile, the hard circuit board unit 1 is usually provided with an aluminum substrate, which has a better heat dissipation effect. At the same time, it has good heat dissipation and can be twisted and installed.

铝基电路板由四层结构组成,底层为铝基板,铝基板上为绝缘层,在绝缘层上设置电路层,在电路层上设置绝缘保护层。The aluminum-based circuit board is composed of a four-layer structure, the bottom layer is an aluminum substrate, the aluminum substrate is an insulating layer, a circuit layer is arranged on the insulating layer, and an insulating protective layer is arranged on the circuit layer.

柔性线路板2由下至上依次由基板、接着剂、铜箔、接着剂和保护膜组成,其中铜箔连接铝基电路板的电路层。The flexible circuit board 2 is composed of a substrate, an adhesive, a copper foil, an adhesive and a protective film in sequence from bottom to top, wherein the copper foil is connected to the circuit layer of the aluminum-based circuit board.

如图3所示,本发明电路连接结构应用于LED灯板时,硬质电路板单元1的电路层上设置LED芯片。硬质电路板单元1之间通过金属连接桥3进行弹性连接,金属连接桥为铝基板。As shown in FIG. 3 , when the circuit connection structure of the present invention is applied to an LED light board, LED chips are arranged on the circuit layer of the hard circuit board unit 1 . The hard circuit board units 1 are elastically connected through metal connecting bridges 3, and the metal connecting bridges are aluminum substrates.

该LED灯板在缠绕在多面柱状体上时,柔性线路板2可以扭曲,不会影响硬质电路板单元1之间的电连接,而金属连接桥使得缠绕较为牢固。且对应多面柱状体顶部,设置有顶部硬质电路板单元4,顶部硬质电路板单元4与其它硬质电路板单元1之间也通过柔性线路板2进行电连接,同时也通过金属连接桥进行弹性连接。When the LED lamp board is wound on the multi-faceted columnar body, the flexible circuit board 2 can be twisted without affecting the electrical connection between the hard circuit board units 1, and the metal connection bridge makes the winding more firm. And corresponding to the top of the multi-faceted columnar body, a top rigid circuit board unit 4 is provided, and the top rigid circuit board unit 4 and other rigid circuit board units 1 are also electrically connected through the flexible circuit board 2, and also through the metal connecting bridge. Make elastic connections.

所述电路连接结构可以应用于LED灯板结构,也可以应用于其它电路板中,如汽车电路板等。The circuit connection structure can be applied to the LED lamp board structure, and can also be applied to other circuit boards, such as automobile circuit boards.

以上所述仅为本发明的优选实施例,并非对本案设计的限制,凡依本案的设计关键所做的等同变化,均落入本案的保护范围。The above descriptions are only preferred embodiments of the present invention, and are not limitations on the design of this case. All equivalent changes made according to the key design of this case fall within the scope of protection of this case.

Claims (6)

1.一种电路连接结构,其特征在于:包括硬质电路板单元,硬质电路板单元之间通过柔性线路板进行电性连接,硬质电路板单元之间通过金属连接桥进行弹性连接,形成LED灯板,该LED灯板缠绕在多面柱状体上。1. A circuit connection structure, characterized in that: it comprises a hard circuit board unit, the hard circuit board units are electrically connected by a flexible circuit board, and the hard circuit board units are elastically connected by a metal connecting bridge, An LED lamp board is formed, and the LED lamp board is wound on the multi-faceted columnar body. 2.如权利要求1所述的一种电路连接结构,其特征在于:硬质电路板单元为铝基电路板。2. The circuit connection structure according to claim 1, wherein the rigid circuit board unit is an aluminum-based circuit board. 3.如权利要求2所述的一种电路连接结构,其特征在于:铝基电路板由四层结构组成,底层为铝基板,铝基板上为绝缘层,在绝缘层上设置电路层,在电路层上设置绝缘保护层。3. A circuit connection structure as claimed in claim 2, characterized in that: the aluminum-based circuit board consists of four layers, the bottom layer is an aluminum substrate, the aluminum substrate is an insulating layer, and a circuit layer is arranged on the insulating layer. An insulation protection layer is arranged on the circuit layer. 4.如权利要求3所述的一种电路连接结构,其特征在于:柔性线路板由下至上依次由基板、接着剂、铜箔、接着剂和保护膜组成,其中铜箔连接铝基电路板的电路层。4. A circuit connection structure as claimed in claim 3, characterized in that: the flexible circuit board is composed of substrate, adhesive, copper foil, adhesive and protective film from bottom to top, wherein the copper foil is connected to the aluminum-based circuit board circuit layer. 5.如权利要求3所述的一种电路连接结构,其特征在于:电路层上设置LED芯片。5. The circuit connection structure according to claim 3, characterized in that: LED chips are arranged on the circuit layer. 6.如权利要求1所述的一种电路连接结构,其特征在于:金属连接桥为铝基板。6. The circuit connection structure according to claim 1, wherein the metal connection bridge is an aluminum substrate.
CN201510393015.3A 2015-07-07 2015-07-07 A kind of circuit connection structure Expired - Fee Related CN104994684B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510393015.3A CN104994684B (en) 2015-07-07 2015-07-07 A kind of circuit connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510393015.3A CN104994684B (en) 2015-07-07 2015-07-07 A kind of circuit connection structure

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Publication Number Publication Date
CN104994684A CN104994684A (en) 2015-10-21
CN104994684B true CN104994684B (en) 2017-12-19

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202262031U (en) * 2011-08-10 2012-05-30 田茂福 Heat dissipation type LED flexible line way board
CN202514167U (en) * 2012-04-27 2012-10-31 深圳市盛创新精密电子有限公司 Connecting structure for hard circuit boards and flexible circuit boards of LED (Light Emitting Diode) strip
CN204328941U (en) * 2014-12-24 2015-05-13 上海小糸车灯有限公司 A kind of LED circuit board structure for automobile lamp
CN204741612U (en) * 2015-07-07 2015-11-04 厦门莱肯照明科技有限公司 Circuit connection structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314433B2 (en) * 2009-03-19 2012-11-20 Cid Technologies Llc Flexible thermal energy dissipating and light emitting diode mounting arrangement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202262031U (en) * 2011-08-10 2012-05-30 田茂福 Heat dissipation type LED flexible line way board
CN202514167U (en) * 2012-04-27 2012-10-31 深圳市盛创新精密电子有限公司 Connecting structure for hard circuit boards and flexible circuit boards of LED (Light Emitting Diode) strip
CN204328941U (en) * 2014-12-24 2015-05-13 上海小糸车灯有限公司 A kind of LED circuit board structure for automobile lamp
CN204741612U (en) * 2015-07-07 2015-11-04 厦门莱肯照明科技有限公司 Circuit connection structure

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