CN105223748B - Display panel and display device using same - Google Patents

Abstract

The present invention discloses a display panel and a display device using the display panel. The display panel includes a first substrate, a second substrate and a display medium, wherein the display medium is disposed between the first substrate and the second substrate. The first substrate includes a first conductive layer and a second conductive layer, wherein the first conductive layer has a first line width, and the second conductive layer is disposed on the first conductive layer, wherein the second conductive layer has a second line width which is smaller than the first line width and partially exposes the first conductive layer on both sides of the second conductive layer. A first side edge of the second conductive layer and a second side edge of the first conductive layer on the same side have a first spacing, and a third side edge of the second conductive layer relative to the first side edge and a fourth side edge of the first conductive layer on the same side have a second spacing, wherein the first spacing is greater than the second spacing.

Description

Display panel and display device using same

technical field

The present invention relates to a display panel and a display device using the display panel, and in particular to a display panel with multi-layer wires on a substrate and a display device using the display panel.

Background technique

With the rapid development of the large-size flat-panel display market, the improvement of the related manufacturing process of its thin film transistor substrate is also proceeding rapidly. Among them, because the copper manufacturing process has low resistivity (about 60% of aluminum), its small cross-sectional area reduces the parasitic capacitance between metal lines and can reduce crosstalk (crosstalk), and copper has high resistance to electricity, high Due to its thermal migration resistance, it can still have relatively high reliability in a small cross-sectional area. Therefore, the copper manufacturing process gradually replaces the aluminum manufacturing process and gradually becomes the mainstream of the market.

However, copper still has the problem that it is not easy to adhere to the substrate and is easy to fall off. Therefore, how to provide a display with good display quality and overcome the difficulties and problems related to the manufacturing process is one of the subjects that the relevant industry is striving for.

Contents of the invention

The object of the present invention is a display panel and a display device using the display panel. In the display panel of the embodiment, the second conductive layer in the substrate is disposed on the first conductive layer and part of the first conductive layer is exposed on both sides thereof, and both sides of the second conductive layer and both sides of the first conductive layer There are two spacings between them, one of the two spacings is larger than the other, so the disconnection or damage of the two conductive layers caused by over-etching can be avoided, and the problem of impedance mismatch can be reduced. .

To achieve the above purpose, the present invention provides a display panel. The display panel includes a first substrate, a second substrate and a display medium, and the display medium is arranged between the first substrate and the second substrate. The first substrate includes a first conductive layer and a second conductive layer, the first conductive layer has a first line width, the second conductive layer is disposed on the first conductive layer, the second conductive layer has a second line width and the second conductive layer The second line width is smaller than the first line width and part of the first conductive layer is exposed on both sides of the second conductive layer. There is a first distance between a first side of the second conductive layer and a second side of the first conductive layer on the same side thereof, a third side of the second conductive layer opposite to the first side and the same side thereof A fourth side of the first conductive layer on the same side has a second distance, wherein the first distance is greater than the second distance.

The invention also provides a display device. The display device includes a display panel and a driving circuit, and the driving circuit is electrically connected to the display panel. The display panel includes a first substrate, a second substrate and a display medium, and the display medium is arranged between the first substrate and the second substrate. The first substrate includes a first conductive layer and a second conductive layer, the first conductive layer has a first line width, the second conductive layer is disposed on the first conductive layer, the second conductive layer has a second line width and the second conductive layer The second line width is smaller than the first line width and part of the first conductive layer is exposed on both sides of the second conductive layer. There is a first distance between a first side of the second conductive layer and a second side of the first conductive layer on the same side thereof, a third side of the second conductive layer opposite to the first side and the same side thereof A fourth side of the first conductive layer on the same side has a second distance, wherein the first distance is greater than the second distance.

In order to have a better understanding of the above-mentioned and other aspects of the present invention, the preferred embodiments are specifically cited below, together with the accompanying drawings, and described in detail as follows:

Description of drawings

FIG. 1A is a schematic diagram of a display panel according to an embodiment of the present invention;

1B is a top view of a first substrate according to an embodiment of the present invention;

2A is an enlarged top view of a partial area of the first substrate according to an embodiment of the present invention;

Figure 2B is a cross-sectional view along section line 2B-2B';

3A-3B are schematic diagrams before and after etching of conductive layers with different shapes;

4A is a partially enlarged top view of a substrate according to another embodiment of the present invention;

Figure 4B is a cross-sectional view along section line 4B-4B';

5A to 5B are schematic diagrams of the alignment offset of the conductive layer according to the embodiment of the present invention;

FIG. 6 is a block diagram of a display device according to an embodiment of the present invention.

Symbol Description

1: display device

10: Display panel

100: first substrate

101: display area

102: Display drive circuit area

100': Substrate

110: first conductive layer

110E, 120E: extension

110s, 120s: bottom surface

120: second conductive layer

120E: extension

130: dielectric layer

20: Drive circuit

200: display media

300: second substrate

410, 410', 610, 610': conductive layer

2B-2B’, 4B-4B’: Hatching

A1, A2, A3: overlapping parts

B, B1, B2: bending part

D1: first spacing

D2: second spacing

P: convex area

R, R1, R1’, R2, R2’: concave area

S1: first side

S2: second side

S3: third side

S4: Fourth side

W1: first line width

W2: second line width

θ1: first angle

θ2: second angle

θ3: third angle

θ4: Fourth angle

Detailed ways

According to an embodiment of the present invention, in the display panel, the second conductive layer on the substrate is disposed on the first conductive layer and part of the first conductive layer is exposed on both sides thereof, and both sides of the second conductive layer are connected to the first conductive layer. There is a gap between the two sides of the layer, one of the two gaps is larger than the other, so the disconnection or damage of the two conductive layers caused by over-etching can be avoided, and the impedance mismatch can be reduced. The problem arises. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals are used in the drawings to designate the same or similar parts. It should be noted that the drawings have been simplified to clearly illustrate the content of the embodiments, and the detailed structures proposed in the embodiments are for illustration purposes only, and are not intended to limit the scope of protection of the present invention. Those with ordinary knowledge can modify or change these structures according to the needs of actual implementation.

FIG. 1A shows a display panel 10 according to an embodiment of the present invention, FIG. 1B shows a top view of a first substrate 100 according to an embodiment of the present invention, and FIG. 2A shows an enlarged partial area of the first substrate according to an embodiment of the present invention. 2B shows a cross-sectional view along the section line 2B-2B'.

As shown in FIG. 1A , the display panel 10 includes a first substrate 100 , a display medium 200 and a second substrate 300 . The display medium 200 is disposed between the first substrate 100 and the second substrate 300 . In an embodiment, the display medium 200 is, for example, a liquid crystal layer or a light emitting element, such as an organic light emitting diode. In this way, the display panel 10 is, for example, a liquid crystal display panel or an OLED display panel. As shown in FIG. 1B , the first substrate 100 includes a display area 101 and a display driving circuit area 102 surrounding the display area 101 .

As shown in FIGS. 2A-2B , the first substrate 100 includes a first conductive layer 110 and a second conductive layer 120 , and the second conductive layer 120 is disposed on the first conductive layer 110 . The first conductive layer 110 has a first line width W1, the second conductive layer 120 has a second line width W2, the second line width W2 is smaller than the first line width W1 and part of the first conductive layer is exposed on both sides of the second conductive layer 120. Layer 110. A first side S1 of the second conductive layer 120 and a second side S2 of the first conductive layer 110 on the same side have a first distance D1, and the distance between the second conductive layer 120 relative to the first side S1 A third side S3 and a fourth side S4 of the first conductive layer 110 on the same side have a second distance D2, wherein the first distance D1 is greater than the second distance D2.

As shown in FIG. 2B , in this embodiment, the first conductive layer 110 and the second conductive layer 120 are stacked in contact to form a conductive circuit with a composite layer. In one embodiment, the conductive lines are, for example, data lines or scan lines on the thin film transistor substrate. In an embodiment, the first conductive layer 110 and the second conductive layer 120 are, for example, located in the gate driving circuit or the data driving circuit of the display driving circuit area 102 . In another embodiment, the first conductive layer 110 and the second conductive layer 120 are located in the display area 101 , for example.

As shown in FIG. 2A , the conductive circuit formed by contacting and stacking the first conductive layer 110 and the second conductive layer 120 has a bending portion (bending portion) B, wherein the first distance D1 is located at the bending portion B of the conductive circuit. In the recessed region (recess region) R, the second distance D2 is located in the protruding region (protruding region) P of the bent portion B.

In an embodiment, the material of the first conductive layer 110 and the material of the second conductive layer 120 independently include metal layers such as copper and titanium or composite conductive metal layers. In this embodiment, the material of the first conductive layer 110 is, for example, titanium, and the material of the second conductive layer 120 is, for example, copper.

3A and 3B are schematic diagrams showing before and after etching conductive layers with different shapes, respectively. The conductive layer 410 is over-etched to form a conductive layer 410', and the conductive layer 610 is over-etched to form a conductive layer 610'. As shown in FIG. 3A, in the production of the conventional conductive layer 610, the pattern of the conductive layer to be formed is designed during the design of the photomask, but during the etching process, because the etchant is easy to accumulate in the bent portion B2 In the concave region R2, when other circuit pattern parts (such as the line width of a straight line) are completely etched to form a conductive layer with a predetermined pattern, the etchant accumulated in the concave region R2 will easily cause the conductive layer 610 to bend The over-etching of the part B2, and the over-etching will easily lead to disconnection or damage of the conductive layer 610, forming the conductive layer 610' and the damaged concave region R2', which will easily cause the problem of impedance mismatch. In contrast, as shown in FIG. 3B , in this embodiment, the conductive layer 410 is designed to have a larger area in the concave region R1 of the bending portion B1 during the photomask design, so even if accumulated The etching solution in the conductive layer 410 causes over-etching of the bending portion B1 of the conductive layer 410, but since the concave region R1 of the bending portion B1 has a relatively large area in this embodiment, the above-mentioned over-etching problem can be avoided, and a conductive layer 410 can be formed. The layer 410' has a concave region R1' close to the predetermined pattern.

Accordingly, as shown in the above-mentioned FIG. 2A and FIG. 2B, the first conductive layer 110 (such as titanium) and the second conductive layer 120 (such as copper) are contacted and stacked to form a conductive circuit with a composite layer. The first conductive layer 110 and the second conductive layer 120 are made of different metal materials. In the process of etching to form a predetermined pattern, the etching rate of different metals will be different due to the etching solution (for example, the etching rate of the first conductive layer is greater than that of the second conductive layer. ) to form a structure in which the second line width W2 is smaller than the first line width W1 and part of the first conductive layer 110 is exposed on both sides of the second conductive layer 120 as shown in FIG. 2A and FIG. 2B . In addition, according to the aforementioned FIG. 3A and FIG. 3B , the etchant will easily accumulate in the concave region R of the bent portion B, so the first conductive layer 110 at the concave region R in FIG. 2A and FIG. 2B is compared to The first conductive layer 110 at the protruding region P is more likely to be over-etched, so that the first distance D1 of the concave region R located at the bent portion B is greater than the second distance D2 of the protruding region P, and the first conductive layer The included angle θ1 between the sides and the bottom of the concave region R located in the bent portion B is greater than the included angle θ2 between the sides and the bottom of the convex region P, and the second conductive layer is located on the side of the concaved region R of the bent portion B The included angle θ3 between the sides and the bottom surface is greater than the included angle θ4 between the side edges and the bottom surface of the protruding region P.

In an embodiment, the first distance D1 is, for example, 1.1˜3 times of the second distance D2.

For example, in one embodiment, the second line width W2 of the second conductive layer 120 is, for example, 4.34 microns (μm), the first distance D1 is, for example, 0.68 microns, and the second distance D2 is, for example, 0.39 microns, then the first distance D1 It is 1.74 times of the second spacing D2; in another embodiment, the second line width W2 of the second conductive layer 120 is, for example, 8.89 microns, the first spacing D1 is, for example, 1.25 microns, and the second spacing D2 is, for example, 0.87 microns, then the second The first distance D1 is 1.44 times the second distance D2.

In an embodiment, the first distance D1 is, for example, about 10-20% of the second line width W2 of the second conductive layer 120, such as 10%, for example, 9.95-11.07%; the second distance D2 is, for example, the second About 1-10% of the second line width W2 of the layer 120 is, for example, 6%, such as 6.35-6.92%.

In an embodiment, as shown in FIG. 2B, the second side S2 of the first conductive layer 110 and a bottom surface 110s of the first conductive layer 110 have a first angle θ1, and the fourth side S4 of the first conductive layer 110 and The bottom surface 110s of the first conductive layer 110 has a second angle θ2, and the first angle θ1 is, for example, 1.1˜2 times the second angle θ2.

For example, in one embodiment, the first angle θ1 is, for example, 15.00°, and the second angle θ2 is, for example, 11.85°, then the first angle θ1 is 1.27 times the second angle θ2; in another embodiment, the first angle θ1 is, for example, 57.26°, and the second angle θ2 is, for example, 30.14°, so the first angle θ1 is 1.90 times the second angle θ2.

Moreover, in the embodiment, as shown in FIG. 2B , the first side S1 of the second conductive layer 120 and a bottom surface 120s of the second conductive layer 120 have a third angle θ3, and the third side of the second conductive layer 120 The side S3 and the bottom surface 120s of the second conductive layer 120 have a fourth angle θ4, and the third angle θ3 is, for example, 1.1˜2 times of the fourth angle θ4.

For example, in one embodiment, the third angle θ3 is, for example, 65.91°, and the fourth angle θ4 is, for example, 59.24°, then the third angle θ3 is 1.11 times the fourth angle θ4; in another embodiment, the third angle θ3 is, for example, 41.19°, and the fourth angle θ4 is, for example, 23.87°, so the third angle θ3 is 1.73 times the fourth angle θ4.

In the embodiment, the concave region of the bent portion of the conductive line can have a larger area through the design of the photomask to avoid disconnection or damage of the first conductive layer 110/second conductive layer 120 caused by over-etching, In turn, the problem of impedance mismatch can be reduced. In addition, due to the different etching rates of the first conductive layer and the second conductive layer, the structure will make the first distance D1 larger than the second distance D2, and the first conductive layer is located at the bending part B The first angle θ1 of the concave region R is greater than the second angle θ2 of the convex region P, and the third angle θ3 of the concave region R of the second conductive layer located in the bending part B is greater than the fourth angle θ4 of the convex region P .

FIG. 4A shows a partially enlarged top view of a substrate according to another embodiment of the present invention, and FIG. 4B shows a cross-sectional view along section line 4B-4B'. The substrate 100' shown in FIGS. 4A-4B can be used as the first substrate 100 of the display panel 10. Referring to FIG. The components in this embodiment that are the same as those in the previous embodiments use the same component numbers, and for the related description of the same components, please refer to the above, and details will not be repeated here.

As shown in FIGS. 4A-4B , the first substrate 100 ′ includes a first conductive layer 110 and a second conductive layer 120 , and the second conductive layer 120 is disposed on the first conductive layer 110 . The first conductive layer 110 has a first line width W1, the second conductive layer 120 has a second line width W2, the second line width W2 is smaller than the first line width W1 and part of the first conductive layer is exposed on both sides of the second conductive layer 120. Layer 110. A first side S1 of the second conductive layer 120 and a second side S2 of the first conductive layer 110 on the same side have a first distance D1, and the distance between the second conductive layer 120 relative to the first side S1 A third side S3 and a fourth side S4 of the first conductive layer 110 on the same side have a second distance D2, wherein the first distance D1 is greater than the second distance D2.

In an embodiment, the first distance D1 is, for example, 1.1˜3 times of the second distance D2.

For example, in one embodiment, the first line width W1 of the first conductive layer 110 is, for example, 22.43 microns, the second line width W2 of the second conductive layer 120 is, for example, 19.28 microns, and the first distance D1 is, for example, 1.67 microns. The second distance D2 is, for example, 1.48 microns, and the first distance D1 is 1.13 times the second distance D2.

As shown in FIG. 4B , the first substrate 100' further includes a dielectric layer 130. Referring to FIG. The dielectric layer 130 is located between the first conductive layer 110 and the second conductive layer 120 . In one embodiment, the composite structure of the first conductive layer 110 /dielectric layer 130 /second conductive layer 120 is, for example, a storage capacitor on a thin film transistor substrate.

As shown in FIG. 4A , the second conductive layer 120 has an extension 120E on the first side S1 , and the first conductive layer 110 also has an extension 110E on the second side S2 . In other words, in this embodiment, the first conductive layer 110 and the second conductive layer 120 have a T shape.

In an embodiment, the material of the first conductive layer 110 and the material of the second conductive layer 120 may include copper, titanium or other metals or composite conductive metal layers. In this embodiment, the material of the first conductive layer 110 is the same as that of the second conductive layer 120 . In this embodiment, the material of the first conductive layer 110 and the material of the second conductive layer 120 are both copper.

5A-5B are schematic diagrams illustrating the alignment shift of the conductive layer according to an embodiment of the present invention. FIG. 5A shows that the first conductive layer 110 approaches the fourth side S4 of the second conductive layer 120 to cause an alignment shift, and FIG. 5B shows that the first conductive layer 110 faces the second side S2 of the second conductive layer 120. Alignment shift due to proximity.

In the embodiment, the composite structure of the first conductive layer 110/dielectric layer 130/second conductive layer 120 is used as a T-shaped storage capacitor, and the capacitance value of the storage capacitor and the overlap between the first conductive layer 110 and the second conductive layer 120 Therefore, when the alignment shift occurs between the two conductive layers, the overlapping area of the two conductive layers will be changed, thereby changing the capacitance value of the storage capacitor. If the overlapping area is too small, the capacitance value of the storage capacitor is insufficient, leakage current may occur, the voltage will drop, and the color brightness of the display screen will change accordingly, further causing the display effect of the pixel to decay (decay).

As shown in FIG. 5A , in the T-shaped storage capacitor structure, when the first conductive layer 110 approaches the fourth side S4 of the second conductive layer 120 and the alignment shift occurs, not only the first conductive layer 110 and the second The overlapping area of the conductive layer 120 does not decrease, but increases the area of an overlapping portion A1, which causes the capacitance value of the storage capacitor to increase. Conversely, as shown in FIG. 5B , when the first conductive layer 110 approaches the second side S2 of the second conductive layer 120 to cause an alignment shift, the first conductive layer 110 and the second conductive layer 120 originally overlap Parts A2 and A3 no longer overlap, thus resulting in a reduced overlapping area and a reduced capacitance value.

Accordingly, according to an embodiment of the present invention, in the storage capacitor structure formed by the first conductive layer 110 and the second conductive layer 120, the first conductive layer 110 is designed to be close to the second side S4 of the second conductive layer 120 or far away from the second side S4 of the second conductive layer 120. The first side S1 of the second conductive layer 120, so that the first distance D1 towards the first side S1 (extension 120E) is greater than the second distance D2 towards the third side S3, that is, towards the second side S3. The direction of one side S1 leaves a larger alignment offset buffer space, which is beneficial to avoid the overlapping of the first conductive layer 110 and the second conductive layer 120 due to the alignment offset of the photomask during the manufacturing process. When the area decreases, the capacitance value of the storage capacitor decreases. In this way, even if the alignment of the first conductive layer 110 and the second conductive layer 120 is shifted during the manufacturing process, this design still helps to maintain sufficient storage capacitance and maintain sufficient voltage difference to make the display screen Attenuation does not occur, thereby improving the stability of display quality.

FIG. 6 is a block diagram of a display device 1 according to an embodiment of the present invention. In yet another embodiment, as shown in FIG. 6 , the present invention provides a display device 1 . The display device 1 may include the aforementioned display panel 10 and a driving circuit 20 . The drive circuit 20 is used to electrically connect the display panel 10 to drive the display panel 10, to receive externally transmitted display and control signals, and to transmit external signals to the display drive circuit area 102 in the display panel 10 to drive the display area 101. .

The display panel of the present invention and the display device using it are designed so that the second conductive layer is located on the first conductive layer and the distance between one side of the second conductive layer and the side of the first conductive layer on the same side is greater than that of the second conductive layer The distance between the other side and the other side of the first conductive layer on the same side, and the angle between one side of the second conductive layer and the bottom surface and the angle between the side and the bottom surface of the first conductive layer on the same side It will be larger than the angle between the other side of the second conductive layer and the bottom surface and the angle between the other side of the first conductive layer on the same side and the bottom surface to reduce the problem of impedance mismatch and the reduction of capacitance. Image instability problem.

In summary, although the present invention has been disclosed in conjunction with the above preferred embodiments, they are not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (13)

1. a kind of display panel, including：

First substrate, including：

First conductive layer has the first line width；And

Second conductive layer is set on first conductive layer, which has the second line width and second line width is less than First line width simultaneously manifests part first conductive layer in the second conductive layer both sides；

Wherein, the first side of second conductive layer and have between first with the second side of first conductive layer of its homonymy Away from the four side relative to the third side of the first side and with first conductive layer of its homonymy of second conductive layer With the second spacing, wherein first spacing is more than second spacing；

Wherein, first conductive layer and second conductive layer are stacked to form the conducting wire of tool composite layer, the first spacing position In the recessed area (recess region) of the bending part (bending portion) of the conducting wire, the second spacing position In the outer convex domain (protruding region) of the bending part；

Second substrate；And

Display medium is set between the first substrate and the second substrate.

2. display panel as described in claim 1, wherein first conductive layer and second conductive layer contact.

3. display panel as described in claim 1, the wherein first substrate include viewing area and the driving around the viewing area Circuit region, first conductive layer are located at the drive circuit area with second conductive layer.

4. display panel as described in claim 1, wherein first spacing are 1.1~3 times of second spacing.

5. display panel as described in claim 1, the wherein first substrate further include dielectric layer, be located at first conductive layer with Between second conductive layer.

6. the material phase of display panel as described in claim 1, the wherein material of first conductive layer and second conductive layer Together.

7. display panel as described in claim 1, wherein second conductive layer have extension in the first side.

8. display panel as described in claim 1, wherein first spacing are the 10~20% of second line width.

9. display panel as described in claim 1, wherein second spacing are the 1~10% of second line width.

10. display panel as described in claim 1, the wherein second side of first conductive layer and first conductive layer There is first angle, the four side of first conductive layer to have second jiao with the bottom surface of first conductive layer for one bottom surface Degree, the first angle are 1.1~2 times of the second angle.

11. the material of display panel as described in claim 1, the wherein material of first conductive layer and second conductive layer is only Include on the spot copper, titanium or composite conducting metal layer.

12. display panel as described in claim 1, the wherein display medium are liquid crystal layer or light-emitting component.

13. a kind of display device, including：

Display panel, including：

First substrate, including：

First conductive layer has the first line width；And

Second conductive layer is set on first conductive layer, which has the second line width and second line width is less than First line width simultaneously manifests part first conductive layer in the second conductive layer both sides；

Wherein, the first side of second conductive layer and have between first with the second side of first conductive layer of its homonymy Away from one the 4th relative to a third side of the first side and with first conductive layer of its homonymy of second conductive layer There is one second spacing, wherein first spacing to be more than second spacing for side；

Wherein, first conductive layer and second conductive layer are stacked to form the conducting wire of tool composite layer, the first spacing position In the recessed area (recess region) of the bending part (bending portion) of the conducting wire, the second spacing position In the outer convex domain (protruding region) of the bending part；

Second substrate；And

Display medium is set between the first substrate and the second substrate；And

Driving circuit is electrically connected the display panel.