CN105509937B - A kind of pressure sensor, pressure detection method and manufacturing process - Google Patents
A kind of pressure sensor, pressure detection method and manufacturing process Download PDFInfo
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- CN105509937B CN105509937B CN201610008817.2A CN201610008817A CN105509937B CN 105509937 B CN105509937 B CN 105509937B CN 201610008817 A CN201610008817 A CN 201610008817A CN 105509937 B CN105509937 B CN 105509937B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000001514 detection method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 238000000605 extraction Methods 0.000 claims abstract description 14
- 239000011368 organic material Substances 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011853 conductive carbon based material Substances 0.000 claims description 3
- 239000002905 metal composite material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007761 roller coating Methods 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007667 floating Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000000644 propagated effect Effects 0.000 claims 1
- 230000035807 sensation Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 241000251468 Actinopterygii Species 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of pressure sensor, pressure detection method and manufacturing process, pressure sensor includes upper substrate, lower substrate, ontology circuit layer and extraction electrode；The upper substrate and lower substrate are elastic organic material, and one side is identical stereochemical structure, and has being oppositely arranged on one side for stereochemical structure；The ontology circuit layer is flexibility, conductive material is arranged thereon, conductive circuit layer is made；The ontology circuit layer is folded between substrate and lower substrate, is covered in the stereochemical structure of upper substrate and lower substrate by flat functional circuitous pattern structure, and distinguishes extraction electrode at the both ends of ontology circuit layer.The present invention generates the change of substrate solid type by being applied to the strength on the flexible substrates surface of sensor, substrate solid type, which becomes while being located at the three-dimensional circuit structure in substrate, forms solid type change, to form resistance variations, pressure value is calculated according to resistance variations, structure is simple, measurement result is accurate, and high sensitivity.
Description
Technical field
The present invention relates to a kind of pressure sensor, pressure detection method and manufacturing process.
Background technique
Pressure sensor is widely used in intelligence manufacture industry, but existing pressure sensor, senses mode and inside
Structure is excessively complicated, needs far more precise electronic control system, and production cost is excessively high, and size thickness etc. is all very limited
System, can not make ultra-thin pressure sensor, and sensitivity is also extremely limited, and accurate slight pressure can not be measured accurately.
Summary of the invention
The first purpose of the invention is to provide a kind of pressure sensors of energy Sensitive Detection slight pressure.
The technical solution for realizing first purpose of the invention is a kind of pressure sensor, including upper substrate, lower substrate, ontology
Circuit layer and extraction electrode；The upper substrate and lower substrate are elastic organic material, and one side is identical stereochemical structure, and is had
Stereochemical structure is oppositely arranged on one side；The ontology circuit layer is flexibility, conductive material is arranged thereon, conductive circuit layer is made；Institute
Ontology circuit layer is stated to be folded between substrate and lower substrate, uniform fold in the stereochemical structure of upper substrate and lower substrate, and
Extraction electrode is distinguished at the both ends of ontology circuit layer.
The section of the upper substrate and the stereochemical structure in lower substrate is continuous V-arrangement；Or section is continuous U-shaped；
Or section is continuous sinusoidal waveform；Or stereochemical structure is equally distributed triangular pyramid；Or stereochemical structure is uniformly to divide
The identical sphere stereoscopic structure of the size of cloth；Or the combination of aforementioned stereochemical structure；Aforementioned stereochemical structure is set according to functional requirement
Count into the continuous structure that size is identical or size is different.
The elasticity modulus of the upper substrate and lower substrate be 0.002~0.05Gpa, Poisson's ratio be 0.1~1, with a thickness of for
0.02~5mm.
The conductive circuit layer of the ontology circuit layer is graphene conductive route；Or carbon nanotube carbon-based conductive route；
Or metal conductive oxide route；Or metal and carbon-based composite conducting route；Or organic conductive material conducting wire；Or
The composite conducting route of person's organic conductive material and carbon-based material；Or organic conductive material and metal composite conducting wire.
The extraction electrode is that the carbon-based conductive electrode of elasticity or metal electrode or FPC electrode or the plating of organic group bottom are led
The electrode of electrolemma.
The conducting wire of the ontology circuit layer include power supply signal circuit, signal acquisition circuit, D/A converting circuit,
MCU governor circuit and signal output apparatus；The power supply signal circuit is the power supply of MCU governor circuit, is provided for pressure sensor
Signal source；The signal acquisition circuit acquires main body circuit deformation bring resistance change；The D/A converting circuit is to letter
The data of number Acquisition Circuit acquisition carry out digital-to-analogue conversion, which is transmitted to MCU governor circuit and is analyzed, and analysis result passes through
Signal output apparatus, which exports, gives terminal device master control.
A second object of the present invention is to provide a kind of manufacturing methods for manufacturing pressure sensor.
The technical solution for realizing second purpose of the invention is a kind of manufacturing method of pressure sensor, including following step
It is rapid:
Step 1: lower substrate is made；It uses the film of required stereochemical structure for mold, elastic organic material is filled into
Die for molding is to have the substrate with a thickness of 0.02~5mm of stereochemical structure on one side；
Step 2: ontology circuit layer flexible is made；
Step 3: ontology circuit layer is transferred in lower substrate；
Step 4: in ontology circuit layer both ends extraction electrode；
Step 5: upper substrate is made using the same method of step 1, upper substrate is covered on ontology circuit layer；Or
Elastic organic material, substrate in formation are covered on ontology circuit layer；The electrode section exposes pressure sensor.
Transfer method in the step 3 are as follows: fish out the ontology circuit layer for having etched conductive circuit layer floating in the solution
It takes and is placed in lower substrate；Or it is transferred in lower substrate using double-sided adhesive；Or lower substrate is transferred to using water-based glue
On.
In the step 4, electrode is made using the method for conductive glue bond or coating；In the step 5, in ontology
The method that elastic organic material is covered on circuit layer is using spraying or roller coating or spin coating or printing or side for dispensing glue
Method forms the elastic substrates of 0.02~5mm thickness；Hardness number is 0~20 degree.
Third object of the present invention is to provide a kind of pressure detection methods of pressure sensor for detecting slight pressure.
The technical solution for realizing third object of the present invention is a kind of pressure detection method of pressure sensor, power supply letter
Number circuit loads constant pressure or constant current or square-wave signal source to sensor；After sensor is under pressure, main body circuit layer deformation is described
Signal acquisition circuit acquires main body circuit layer deformation bring resistance change；The D/A converting circuit is to signal acquisition circuit
The data of acquisition carry out digital-to-analogue conversion, which is transmitted to MCU governor circuit and is analyzed, and calculate change in resistance amount, according to base
The material characteristic parameter that bottom material type becomes is calibrated to obtain pressure value by normal pressure, and pressure value is defeated by signal output apparatus
Terminal device master control is given out.
After above-mentioned technical proposal, the present invention has the effect of following positive: (1) present invention is by being applied to sensing
The strength on the flexible substrates surface of device generates substrate solid type and becomes, and substrate solid type becomes while being located at the three-dimensional circuit in substrate
Structure forms three-dimensional deformation, to form resistance variations, the electricity of constant current or constant pressure or square wave or other waveforms is loaded by electrode
Source, resistance change can be obtained by measuring current change quantity or voltage variety, by the elasticity modulus characteristic for calculating material
With the type variable of calibration unit resistance variable quantity, the pressure value received can be calculated, structure is simple, and measurement result is accurate, and
And high sensitivity.
(2) present invention is available by adjusting the stereochemical structure of ontology circuit and the characteristic and thickness structure of substrate
The sensor of different pressures resolution ratio.
(3) a preferred embodiment of the present invention is ontology circuit using graphene film, is conducted electricity very well, thickness is very
It is thin, therefore available ultra-thin pressure sensor, and graphene is very high to the sensitivity of pressure, point of pressure sensor
Resolution can measure the pressure of 0.01g~200KG, realize the detection to small pressure.
Detailed description of the invention
In order that the present invention can be more clearly and readily understood, right below according to specific embodiment and in conjunction with attached drawing
The present invention is described in further detail, wherein
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structural schematic diagram of deformation after present invention pressing.
Fig. 3 is the circuit diagram of ontology circuit layer.
Numbering in the drawing are as follows:
Upper substrate 1, lower substrate 2, ontology circuit layer 3, power supply signal circuit 31, signal acquisition circuit 32, digital-to-analogue conversion electricity
Road 33, MCU governor circuit 34, signal output apparatus 35, extraction electrode 4, terminal device master control 5.
Specific embodiment
(embodiment 1)
See Fig. 1, a kind of pressure sensor of the present embodiment, including upper substrate 1, lower substrate 2, ontology circuit layer 3 and extraction
Electrode 4；Upper substrate 1 and lower substrate 2 are elastic organic material, and one side is identical stereochemical structure, and has the one of stereochemical structure
Face is oppositely arranged；Ontology circuit layer 3 is flexibility, conductive material is arranged thereon, conductive circuit layer is made；Ontology circuit layer 3 is folded in
Between upper substrate 1 and lower substrate 2, uniform fold is in the stereochemical structure of upper substrate 1 and lower substrate 2, and in ontology circuit layer 3
Distinguish extraction electrode 4 in both ends.Upper substrate 1 and the section of the stereochemical structure in lower substrate 2 are the identical V-arrangement of continuous size；Or
Person section is the identical U-shaped of continuous size；Or section is the identical sinusoidal waveform of continuous size；Or stereochemical structure is
The identical triangular pyramid of equally distributed size；Say that stereochemical structure is the identical spherical surface of equally distributed size.Upper substrate 1 is under
The elasticity modulus of substrate 2 is 0.002~0.05Gpa, and Poisson's ratio is 0.1~1, with a thickness of being 0.02~5mm, hardness number for 0~
20 degree.The conductive circuit layer of ontology circuit layer 3 is graphene conductive route；Or carbon nanotube carbon-based conductive route；Or gold
Belong to oxide conducting route；Or metal and carbon-based composite conducting route；Or organic conductive material conducting wire；Or it is organic
The composite conducting route of conductive material and carbon-based material；Or organic conductive material and metal composite conducting wire.Extraction electrode 4
The electrode of conductive film is plated for the carbon-based conductive electrode of elasticity or metal electrode or FPC electrode or organic group bottom.
See Fig. 3, the conducting wire of ontology circuit layer 3 includes power supply signal circuit 31, signal acquisition circuit 32, digital-to-analogue conversion
Circuit 33, MCU governor circuit 34 and signal output apparatus 35；Power supply signal circuit 31 is the power supply of MCU governor circuit 34, is pressure sensitivity
Sensor provides signal source；Signal acquisition circuit 32 acquires 3 deformation bring resistance change of main body circuit；D/A converting circuit
The data that 33 pairs of signal acquisition circuits 32 acquire carry out digital-to-analogue conversion, which is transmitted to MCU governor circuit 34 and is analyzed, point
Result is analysed to export by signal output apparatus 35 to terminal device master control 5.Power supply signal circuit 31 to sensor load constant pressure or
Constant current or square-wave signal source；Sensor be under pressure after (as shown in Fig. 2, finger pressing), 3 deformation of main body circuit layer, signal is adopted
Collector 32 acquires 3 deformation bring resistance change of main body circuit layer；D/A converting circuit 33 adopts signal acquisition circuit 32
The data of collection carry out digital-to-analogue conversion, which is transmitted to MCU governor circuit 34 and is analyzed, and calculate change in resistance amount, according to base
The material characteristic parameter that bottom material type becomes is calibrated to obtain pressure value by normal pressure, and pressure value passes through signal output apparatus 35
It exports to terminal device master control 5.
The manufacturing method of pressure sensor, comprising the following steps:
Step 1: lower substrate 2 is made；It uses the film of required stereochemical structure for mold, elastic organic material is perfused
It is to have the substrate with a thickness of 0.02~5mm of stereochemical structure on one side to die for molding；Stereochemical structure shown in Fig. 1 is continuous
V-type.
Step 2: ontology circuit layer 3 flexible is made；The ontology circuit layer 3 for having etched conductive circuit layer is swum in molten
It fishes for and is placed in lower substrate 2 in liquid；Or it is transferred in lower substrate 2 using double-sided adhesive；Or it is shifted using water-based glue
Onto lower substrate 2；
Step 3: ontology circuit layer 3 is transferred in lower substrate 2；
Step 4: in 3 both ends extraction electrode 4 of ontology circuit layer；Electricity is made using the method for conductive glue bond or coating
Pole 4；
Step 5: upper substrate 1 is made using the same method of step 1, upper substrate 1 is covered on ontology circuit layer 3；
Either on ontology circuit layer 3 using spraying or roller coating or spin coating or printing or method for dispensing glue, form 0.02~
The elastic substrates of 5mm thickness, as upper substrate 1；Expose pressure sensor in 4 part of electrode.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in guarantor of the invention
Within the scope of shield.
Claims (9)
1. a kind of pressure sensor, it is characterised in that: including upper substrate (1), lower substrate (2), ontology circuit layer (3) and draw electricity
Pole (4)；The upper substrate (1) and lower substrate (2) are elastic organic material, and one side is identical stereochemical structure, and has solid
Structure is oppositely arranged on one side；The ontology circuit layer (3) is flexibility, conductive material is arranged thereon, conductive circuit layer is made；Institute
It states ontology circuit layer (3) to be folded between substrate (1) and lower substrate (2), uniform fold is in upper substrate (1) and lower substrate (2)
Stereochemical structure on, and the both ends of ontology circuit layer (3) distinguish extraction electrode (4)；The upper substrate (1) and lower substrate (2)
Elasticity modulus be 0.002~0.05Gpa, Poisson's ratio be 0.1~1, with a thickness of be 0.02~5mm, hardness number be 0~20 degree；
The upper substrate (1) and lower substrate (2) use the film of required stereochemical structure for mold, and elastic organic material is filled into mould
The substrate for having stereochemical structure on one side is shaped in tool.
2. a kind of pressure sensor according to claim 1, it is characterised in that: on the upper substrate (1) and lower substrate (2)
Stereochemical structure section be continuous V-arrangement；Or section is continuous U-shaped；Or section is continuous sinusoidal waveform；Or
Stereochemical structure is equally distributed triangular pyramid；Or stereochemical structure is the identical sphere stereoscopic structure of equally distributed size；Or
The combination of the aforementioned stereochemical structure of person；Aforementioned stereochemical structure is continuous according to functional requirement is designed to that size is identical or size is different
Structure.
3. a kind of pressure sensor according to claim 2, it is characterised in that: the conductor wire of the ontology circuit layer (3)
Road floor is graphene conductive route；Or carbon nanotube carbon-based conductive route；Or metal conductive oxide route；Or metal
With carbon-based composite conducting route；Or organic conductive material conducting wire；Or organic conductive material and carbon-based material is compound
Conducting wire；Or organic conductive material and metal composite conducting wire.
4. a kind of pressure sensor according to claim 3, it is characterised in that: the extraction electrode (4) is that elasticity is carbon-based
The electrode of conductive electrode or metal electrode or FPC electrode or organic group bottom plating conductive film.
5. a kind of pressure sensor according to claim 4, it is characterised in that: the conductor wire of the ontology circuit layer (3)
Road includes power supply signal circuit (31), signal acquisition circuit (32), D/A converting circuit (33), MCU governor circuit (34) and letter
Number output circuit (35)；The power supply signal circuit (31) is MCU governor circuit (34) power supply, provides signal for pressure sensor
Source；The signal acquisition circuit (32) acquires main body circuit (3) deformation bring resistance change；The D/A converting circuit
(33) digital-to-analogue conversion is carried out to the data of signal acquisition circuit (32) acquisition, which is transmitted to MCU governor circuit (34) and is carried out
Analysis, analysis result give terminal device master control (5) by signal output apparatus (35) output.
6. a kind of manufacture a kind of manufacturing method of pressure sensor as claimed in claim 5, it is characterised in that including following step
It is rapid:
Step 1: lower substrate (2) are made；It uses the film of required stereochemical structure for mold, elastic organic material is filled into
Die for molding is to have the substrate with a thickness of 0.02~5mm of stereochemical structure on one side；
Step 2: ontology circuit layer (3) flexible is made；
Step 3: ontology circuit layer (3) is transferred on lower substrate (2)；
Step 4: in ontology circuit layer (3) both ends extraction electrode (4)；
Step 5: upper substrate (1) is made using the same method of step 1, upper substrate (1) is covered in ontology circuit layer (3)
On；Or elastic organic material is covered on ontology circuit layer (3), substrate (1) in formation；Expose pressure in electrode (4) part
Propagated sensation sensor.
7. a kind of manufacturing method of pressure sensor according to claim 6, it is characterised in that: turn in the step 3
Shifting method are as follows: the ontology circuit layer (3) for having etched conductive circuit layer floating is fished in the solution and is placed on lower substrate (2)
On；Or it is transferred on lower substrate (2) using double-sided adhesive；Or it is transferred on lower substrate (2) using water-based glue.
8. a kind of manufacturing method of pressure sensor according to claim 7, it is characterised in that: in the step 4, adopt
Electrode (4) are made with the method for conductive glue bond or coating；In the step 5, elasticity is covered on ontology circuit layer (3)
The method of organic material is to form 0.02~5mm using spraying or roller coating or spin coating or printing or method for dispensing glue
Thick elastic substrates.
9. a kind of a kind of pressure detection method of pressure sensor as claimed in claim 5, it is characterised in that: power supply signal electricity
Road (31) loads constant pressure or constant current or square-wave signal source to sensor；After sensor is under pressure, main body circuit layer (3) deformation,
The signal acquisition circuit (32) acquires main body circuit layer (3) deformation bring resistance change；The D/A converting circuit
(33) digital-to-analogue conversion is carried out to the data of signal acquisition circuit (32) acquisition, which is transmitted to MCU governor circuit (34) and is carried out
Analysis calculates change in resistance amount, according to the material characteristic parameter that base material type becomes, calibrates to obtain pressure by normal pressure
Value, pressure value give terminal device master control (5) by signal output apparatus (35) output.
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| CN201610008817.2A CN105509937B (en) | 2016-01-07 | 2016-01-07 | A kind of pressure sensor, pressure detection method and manufacturing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008817.2A CN105509937B (en) | 2016-01-07 | 2016-01-07 | A kind of pressure sensor, pressure detection method and manufacturing process |
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| CN105509937A CN105509937A (en) | 2016-04-20 |
| CN105509937B true CN105509937B (en) | 2018-12-25 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107329601A (en) * | 2016-04-28 | 2017-11-07 | 常州二维碳素科技股份有限公司 | A kind of touch screen and touch-control system and control method |
| CN106197775A (en) * | 2016-08-31 | 2016-12-07 | 新港海岸(北京)科技有限公司 | A kind of pressure transducer |
| CN111189476B (en) * | 2020-01-14 | 2021-04-27 | 中国农业大学 | A kind of flexible sensor and preparation method thereof |
| CN112179561B (en) * | 2020-09-17 | 2022-09-30 | 五邑大学 | Pressure sensor array calibration method, device and equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2602583A1 (en) * | 1975-01-22 | 1976-07-29 | Minnesota Mining & Mfg | MEASURING DEVICE WORKING WITH PIEZOELECTRIC MATERIAL |
| WO2011103808A1 (en) * | 2010-02-24 | 2011-09-01 | 香港纺织及成衣研发中心有限公司 | Flexible pressure sensor and flexible pressure sensing array |
| CN102713546A (en) * | 2009-10-14 | 2012-10-03 | 国立大学法人东北大学 | Sheet-like tactile sensor system |
| CN105094441A (en) * | 2015-08-20 | 2015-11-25 | 宸鸿科技(厦门)有限公司 | Pressure sensing device |
| CN205562090U (en) * | 2016-01-07 | 2016-09-07 | 常州二维光电科技有限公司 | Pressure sensor |
-
2016
- 2016-01-07 CN CN201610008817.2A patent/CN105509937B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2602583A1 (en) * | 1975-01-22 | 1976-07-29 | Minnesota Mining & Mfg | MEASURING DEVICE WORKING WITH PIEZOELECTRIC MATERIAL |
| CN102713546A (en) * | 2009-10-14 | 2012-10-03 | 国立大学法人东北大学 | Sheet-like tactile sensor system |
| WO2011103808A1 (en) * | 2010-02-24 | 2011-09-01 | 香港纺织及成衣研发中心有限公司 | Flexible pressure sensor and flexible pressure sensing array |
| CN105094441A (en) * | 2015-08-20 | 2015-11-25 | 宸鸿科技(厦门)有限公司 | Pressure sensing device |
| CN205562090U (en) * | 2016-01-07 | 2016-09-07 | 常州二维光电科技有限公司 | Pressure sensor |
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