CN105511206A - Image module and photosensitive chip packaging structure and method thereof - Google Patents

Abstract

The invention relates to an image module and a photosensitive chip packaging structure and method thereof, wherein the image module photosensitive chip packaging structure comprises an optical filter, a photosensitive chip and at least one dustproof base, the optical filter and the photosensitive chip are both used for an image module, the dustproof base is used for connecting and fixing the optical filter and the photosensitive chip, at the same time, at least one isolation cavity is formed between the optical filter and the photosensitive chip, and the photosensitive chip is arranged in the isolation cavity and isolated from other components of the image module so as to avoid dust on the other components from polluting the photosensitive chip.

Description

An image module and its photosensitive chip packaging structure and method

technical field

The invention relates to a photosensitive chip packaging structure, in particular to an image module and a photosensitive chip packaging structure and method thereof.

Background technique

Against the background of the rapid development of smart phones, there is an increasing demand for camera modules, and camera modules with large aperture and high pixel autofocus have become the development trend of camera modules. Under such a development background, the adoption of the integrated motor focusing solution can meet the high flatness requirements of each working element of the camera module, that is, it can solve the problem of the flatness of each working element of the camera module after multiple stacking. The impact of poor brightness on the image quality of the camera module. Then, while using the integrated motor focusing solution to realize the high-quality imaging of the camera module, since the photosensitive chip, the resistance device, the driver, etc. of the product are all in the same internal space, once the environmental factors such as dust are attached to the If it is on the photosensitive chip, there will be black spots in the image captured by the camera module, which seriously affects the image quality of the camera module.

It can be seen that it is of far-reaching significance to solve the influence of dust and other environmental factors on working components such as photosensitive chips in the process of focusing the camera module in the integrated motor design scheme, and to avoid the generation of black spots.

Contents of the invention

An object of the present invention is to provide an image module and its photosensitive chip packaging structure, the image module and its photosensitive chip packaging structure are supplied for an image module, including a dust-proof base, a photosensitive chip and a filter The light sheet, the dust-proof base can be connected to the photosensitive chip and the light filter to form at least one isolation cavity between the photosensitive chip and the light filter, thereby preventing the image module from forming an image when shooting. In case of bad stains.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure, the photosensitive chip is installed and fixed on a circuit board of the image module, and the optical filter is installed on the dustproof base , and furthermore, the dust-proof base can be installed on the circuit board to form the isolation cavity between the optical filter and the photosensitive chip.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure, the photosensitive chip is installed and fixed on a circuit board of the image module, and the optical filter is installed on the dustproof base , and furthermore, the dust-proof base can be installed on the non-working area of the photosensitive chip to form the isolation cavity between the light filter and the photosensitive chip.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure, the dust-proof base can optionally be other electronic components of the circuit board, and furthermore, the optical filter can be installed on the The dust-proof base forms the isolation cavity between the photosensitive chip and the filter.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure. The dust-proof base can optionally be an integral ring structure or a segmented end-to-end structure or a symmetrical arrangement or segmented mutual set at intervals.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure. The structure includes a bonding agent layer, and the bonding agent layer can connect and fix the photosensitive chip, the optical filter and the photosensitive chip. The dustproof base also forms the airtight structure of the isolation cavity.

Another object of the present invention is to provide an image module and its photosensitive chip packaging structure. The isolation cavity is a closed cavity, which can effectively isolate dust, water vapor and other environmental factors to avoid the work of the working components. Effects make an impact.

In order to achieve the above object, the present invention provides an image module photosensitive chip packaging structure, the image module photosensitive chip packaging structure includes a filter, a photosensitive chip and at least one dust-proof base, the filter and the The photosensitive chips can be connected through the dust-proof base, and at least one isolated cavity is formed between the optical filter and the photosensitive chip, and the optical filter and the photosensitive chip are supplied for An image module, the photosensitive chip can be placed in the isolation cavity and isolated from other components of the image module.

Preferably, the optical filter is mounted on a circuit board, that is, the photosensitive chip is a chip on board.

It is worth mentioning that the projection of the filter on the plane where the photosensitive chip is located can cover the photosensitive chip.

Preferably, the filter is mounted on the dust-proof base, and the dust-proof base is mounted on the circuit board to form the isolation cavity between the photosensitive chip and the filter.

Preferably, the support base further includes a first support frame and a second support frame, at least one installation groove is formed between the first support frame and the second support frame, and the optical filter and the The photosensitive chip can be selectively installed in the installation groove, so that the isolation cavity can be formed between the optical filter and the photosensitive chip by fixing the support base to the mounting substrate.

It is worth mentioning that the filter is installed on the dust-proof base, and the dust-proof base can also be installed on the photosensitive chip to form the isolation between the photosensitive chip and the filter. cavity.

It is worth mentioning that the dust-proof base is installed on the non-working area of the photosensitive chip.

Preferably, the support base further includes a first support frame and a second support frame, at least one installation groove is formed between the first support frame and the second support frame, and the optical filter can be installed In the installation groove, the isolation cavity can be formed on the optical filter and the photosensitive chip by fixing the support base to the installation substrate.

The support base further includes a first support frame and a second support frame, at least one installation groove is formed between the first support frame and the second support frame, and the optical filter can be installed on the The installation slot is used to fix the photosensitive chip through the support base to form the isolation cavity between the optical filter and the photosensitive chip.

It is worth mentioning that the optical filter, the dust-proof base, the photosensitive sheet and the circuit board are fixedly connected by a bonding agent layer, and at the same time, the isolation cavity forms a sealed structure.

It is worth mentioning that the dust-proof base has an integral ring structure or a symmetrical structure.

Preferably, the image module is a CCM camera module.

The present invention also provides an image module photosensitive chip packaging structure, the image module photosensitive chip packaging structure includes a light filter and a photosensitive chip, and the light filter and the photosensitive chip are both supplied for an image module set, the optical filter can be mounted on the environmental element of the image module to form at least one airtight isolation cavity between the optical filter and the photosensitive chip, and the photosensitive chip can be placed in the isolation cavity and isolated from the surrounding elements of the image module.

Preferably, the optical filter is mounted on a circuit board, that is, the photosensitive chip is a chip on board.

It is worth mentioning that the projection of the filter on the plane where the photosensitive chip is located can cover the photosensitive chip.

It is worth mentioning that the connection between the optical filter and the environmental element and between the optical filter and the photosensitive chip can be fixedly connected by a connecting agent, and at the same time, the isolation cavity can form a sealed structure.

Preferably, the image module is a CCM camera module, and the environmental element is an electronic component supplied for the CCM camera module.

The present invention also provides a method for forming a photosensitive chip package structure of an image module, the method comprising the following steps:

A: Obtain the assembly of the filter and the dustproof base;

B: attaching the photosensitive chip to the circuit board; and

C: Attach the dust-proof base to the circuit board, wherein both the photosensitive chip and the optical filter are used in an image module, and at least one isolation cavity can be formed on the optical filter and the optical filter. a photosensitive chip, and the photosensitive chip is placed in the isolation cavity.

Preferably, the step A further includes the step of: fixing the filter on the dustproof base to form the assembly.

It is worth mentioning that the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board can pass through the connecting agent layer The fixed connection enables the isolation cavity to form a sealed structure at the same time, and the image module is a CCM camera module.

It is worth mentioning that the dust-proof base has an integral ring structure or a symmetrical structure.

The present invention also provides a method for forming a photosensitive chip packaging structure of an image module, the method comprising the following steps:

A`: Obtain the combination of the filter and the dustproof base;

B`: attaching the photosensitive chip to the circuit board; and

C': Attach the dust-proof base to the photosensitive chip, wherein both the photosensitive chip and the optical filter are used in an image module, and at least one isolation cavity is formed on the optical filter and the optical filter The photosensitive chip is placed in the isolation cavity.

Preferably, the step a further includes the step of: fixing the filter to the dust-proof base to form the assembly.

It is worth mentioning that the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board can be fixed by a connecting agent connected to make the isolation cavity form a sealed structure, and the image module is a CCM camera module.

It is worth mentioning that the dust-proof base has an integral ring structure or the dust-proof base has a symmetrical structure or segmented end-to-end connections or are arranged at intervals from each other.

It is worth mentioning that the dust-proof base is fixed on the non-photosensitive area of the photosensitive chip.

The present invention also provides a method for forming a photosensitive chip packaging structure of an image module, the method comprising the following steps:

A``: An electronic component with a color filter attached to a circuit board, wherein at least one isolation cavity is formed between the filter and the photosensitive chip, and the photosensitive chip can be placed in the isolation cavity.

It is worth mentioning that the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board can pass through the connecting agent layer The fixed connection enables the isolation cavity to form a sealed structure at the same time, and the image module is a CCM camera module.

Description of drawings

FIG. 1 is a cross-sectional view of a preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 2 is a schematic diagram of a partial structural installation of a preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 3 is another cross-sectional view of a preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 4 is a three-dimensional schematic diagram of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 5 is a cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 6 is a top view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 7A is another cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 7B is another cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 8A is another cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 8B is another cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 9 is a cross-sectional view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 10 is a top view of another preferred embodiment of an image module photosensitive chip packaging structure of the present invention.

FIG. 11 is a schematic flowchart of a preferred embodiment of a method for forming a photosensitive chip package structure of an image module according to the present invention.

FIG. 12 is a schematic flowchart of another preferred embodiment of a method for forming a photosensitive chip package structure of an image module according to the present invention.

FIG. 13 is a schematic flowchart of another preferred embodiment of a method for forming a photosensitive chip package structure of an image module according to the present invention.

detailed description

According to the claims of the present invention and the content disclosed in the specification, the technical solution of the present invention is specifically described as follows.

The present invention relates to a photosensitive chip packaging structure of an image module. The photosensitive chip packaging structure of an image module can form an isolation cavity 30 between at least one first working element 100 and at least one second working element 200 of the working module so that The influence of environmental factors on the working effects of the first working element 100 and the second working element 200 is avoided, thereby improving the yield rate of the working module.

It is worth mentioning that the isolation cavity 30 is a closed cavity.

As shown in Fig. 1 to Fig. 3, a photosensitive chip package structure of an image module according to the preferred embodiment is shown.

The working module is preferably an image module, the image module includes a module body, the module body includes a circuit board 10, a photosensitive chip 201 located on the circuit board 10, and at least one anti- The dust-proof base 40 is used to prevent dust on other electronic components on the circuit board from contaminating the photosensitive chip 201 and causing stains on the imaging module during imaging.

In this preferred embodiment, the first working element 100 is a color filter 101, the second working element 200 is the photosensitive chip 201, and both the color filter 101 and the photosensitive chip 201 are supplied For the image module, by using the photosensitive chip packaging structure of the image module, the isolation cavity 30 can be formed between the color filter 101 and the photosensitive chip 201, so that the color filter 101 And the photosensitive chip 201 is not affected by environmental factors such as dust and water vapor in the external environment to affect the functions of the color filter 101 and the photosensitive chip 201, thereby improving the product yield of the image module.

It is worth mentioning that, in this preferred embodiment, the isolation effect of the isolation cavity 30 on environmental factors such as dust and water vapor has a particularly significant impact on the photosensitive chip 201, and the isolation cavity 30 can avoid dust, water vapor, etc. Environmental factors are attached to the photosensitive chip 201 and affect the working effect of the photosensitive chip 201 .

Preferably, in this preferred embodiment, the photosensitive chip 201 is installed on a circuit board 10, that is to say, the photosensitive chip 201 is a chip on board (COB: ChipOnBoard), that is to say, the photosensitive chip 201 is fixed on a circuit board 10 of the image module. Through the photosensitive chip packaging structure of the image module, the working module can eliminate the influence of environmental factors such as dust and present a clear image, thereby improving the Product yield rate of image modules.

Specifically, as shown in Fig. 1 and Fig. 2, the packaging structure of the photosensitive chip of the image module includes a filter 101, a photosensitive chip 201 and at least one dust-proof base 40, and the dust-proof base 40 The color filter 101 can be connected to the photosensitive chip 201 to form the isolation cavity 30 between the color filter 101 and the photosensitive chip 201, thereby ensuring that the color filter 101 and the photosensitive chip The chip 201, especially the photosensitive chip 201 can eliminate the influence of environmental factors such as dust and water vapor in the external environment to ensure the working effect of the image module.

Preferably, the isolation cavity 30 is a closed cavity. In this preferred embodiment, the isolation cavity 30 is formed when the color filter 101 is connected to the photosensitive chip 201 through the dustproof base 40 , the entire photosensitive chip 201 is exposed to the isolation cavity 30, so that the photosensitive chip 201 can be isolated from other working elements such as resistors and capacitors in its working environment, thereby ensuring that the photosensitive chip 201 will not be damaged by dust , water vapor and other environmental factors affect the working quality of the image module.

From one aspect of the present invention, the filter 101 is fixed on the dust-proof base 40 and fixed on the circuit board 10 on which the photosensitive chip 201 is installed through the dust-proof base 40, thereby forming the The isolation cavity 30 is between the photosensitive chip 201 and the filter 101 .

The image module further includes a bonding agent layer 60 through which the optical filter 101 can be fixed to the dust-proof base 40, so as to realize the airtight structure of the isolation cavity 30, so that the The photosensitive chip 201 is protected from the environmental factors by being exposed to the isolation cavity 30 .

It is worth mentioning that the dust-proof base 40 is arranged in a symmetrical structure, thereby firmly supporting the optical filter 101 to form the isolation cavity between the optical filter 101 and the photosensitive chip 201 30.

Preferably, in this preferred embodiment, the working module is a CCM camera module (CCM: CameraCompactModule), that is to say, the isolation cavity 30 is formed by the packaging structure of the photosensitive chip of the image module. The light filter 101 and the photosensitive chip 201 are exposed to the isolation cavity 30, so as to prevent the working module from generating black spots when imaging. Furthermore, from another aspect of the present invention, by attaching and fixing the dust-proof base 40 to the circuit board 10, the filter 101 can pass through the mirror seat installed on the CCM camera module, and pass through The connecting agent is seamlessly connected with the dust-proof base 40, thereby realizing the formation of the isolation cavity 30 between the optical filter 101 and the photosensitive chip 201 while ensuring that the isolation cavity 30 is A closed structure.

It is worth mentioning that, by being located in the isolation cavity 30, the photosensitive chip 201 can be isolated from other components mounted on the circuit board 10, thereby preventing the environmental factors from affecting the work of the photosensitive chip 201. The impact of the effect.

The projection of the dust-proof base 40 on the circuit board 10 can cover the photosensitive chip 201 mounted on the circuit board 10, that is, the photosensitive chip 201 can be guaranteed to be completely exposed to the isolation cavity Inside, that is, the photosensitive chip 201 is located in the isolation cavity 30, thereby ensuring that the CCM camera module can avoid affecting the working effect of the photosensitive chip 201 due to the environmental factors and make the CCM camera module The camera module produces black dots when displaying images. From the above, the dust-proof base 40 can also be installed on the non-working area of the photosensitive chip 201 to form the isolation cavity 30 between the optical filter 101 and the photosensitive chip 201 .

It is worth mentioning that the lens base of the CCM camera module can also protect the impact of the environmental factors on the working effect of the CCM camera module, that is, the CCM camera module can pass The mirror base and the photosensitive chip packaging structure of the image module control the influence of the environmental factors on the working effect of the photosensitive chip 201 .

As shown in Figure 3, the dust-proof base 40 further includes a first support frame 41 and a second support frame 42, the first support frame 41 and the second support frame 42 are integrally connected to the A mounting groove 43 is formed between the first support frame 41 and the second support frame 42, and the mounting groove 43 can support the optical filter 101, that is, the optical filter 101 can be placed The installation groove 43 is connected to the dustproof base 40 . Further, the dust-proof base 40 is fixed to the circuit board 10 through connection, so as to realize the indirect connection and fixation of the color filter 101 to the circuit board 10 .

Preferably, in this preferred embodiment, after the photosensitive chip 201 is connected and fixed on the circuit board 10, the dust-proof base 40 on which the optical filter 101 is fixed is fixed on the circuit board 10 , and then the motor can be mounted on the motor base of the CCM camera module to focus the CCM camera module, thereby forming the isolation cavity 30 to ensure the working efficiency of the photosensitive chip 201, and to utilize The integrated motor focusing solution performs automatic focusing on the CCM camera module to ensure the imaging effect of the CCM camera module. The impact of the working effect of the module provides a solution for the development of ultra-high pixel modules.

Preferably, the plane where the installation groove 43 is located is parallel to the plane where the circuit board 10 is located, that is, the plane where the installation groove 314 is located is parallel to the plane where the photosensitive chip 201 is located, that is, the optical filter 101 It is arranged parallel to the photosensitive chip 201, thereby ensuring the imaging effect of the CCM camera module.

Preferably, the projected areas of the first support frame 41 and the second support frame 42 on the circuit board 10 are greater than or equal to the effective working area of the photosensitive chip 201, thereby ensuring that the photosensitive chip 201 is present. like quality.

It is worth mentioning that the projected area of the filter 101 on the circuit board 10 is greater than or equal to the effective working area of the photosensitive chip 201 , thereby ensuring the working effect of the photosensitive chip 201 .

It is worth mentioning that the optical filter 101 can be fixed to the installation groove 43 of the dust-proof base 40 through glue, glue and other connecting agents, and can also be physically related to the dust-proof base 40 . Such as pressure and friction, it is installed on the dustproof base 40 .

It is worth mentioning that the isolation chamber 30 is realized by connecting the filter 101 between the dust-proof base 40 and the circuit board 10 and the dust-proof base 40 through glue, glue and other connecting agents. sealed structure.

As shown in FIG. 4 to FIG. 8B , another preferred embodiment of the present invention is an image module photosensitive chip packaging structure. The image module photosensitive chip packaging structure can form at least one isolation cavity 30 in the working module. The isolation cavity 30 can provide the working environment required by at least one working element of the working module, so that the working element can get rid of environmental elements such as dust and water vapor generated in the external environment or by its adjacent working elements, so that The working effect of the working element is guaranteed, thereby improving the yield rate of the working module.

It is worth mentioning that the isolation chamber 30 is a sealed structure.

In this preferred embodiment, the isolation cavity 30 is formed between at least one first working element 100 and at least one second working element 200 of the working module, so that the second working element 200 can be completely Exposure to the isolation cavity 30, that is, the photosensitive chip 201 is located in the isolation cavity 30, so that the second working element 200 can be separated from the influence of environmental factors such as dust and water vapor in the external environment to ensure the second working element. The function of the element 200, that is to say, the isolation cavity 30 can ensure that the second working element 200 is in the working environment required by the second working element 200 to ensure the working effect of the second working element 200, and then Ensure the working effect of the working module to ensure the yield rate of the working module.

In this preferred embodiment, the photosensitive chip packaging structure of the image module is preferably suitable for a CCM camera module (CCM: Camera Compact Module), that is, the working module is the CCM camera module.

The CCM camera module includes a module main body, the module main body includes a circuit board 10, a photosensitive chip 201 located on the circuit board 10, and at least one dustproof base 40, and the dustproof base 40 is used for Prevent the dust on other electronic components on the circuit board from contaminating the photosensitive chip 201 and causing stains on the CCM camera module when displaying an image.

As shown in Figures 4 to 7B, the first working element 100 is preferably a filter 101, and the filter 101 is supplied for the CCM camera module, that is, the filter 101 is supplied for the CCM camera module. The second working element 200 is preferably the photosensitive chip 201, and the photosensitive chip 201 is supplied for the CCM camera module, that is to say, the photosensitive chip 201 is supplied for the CCM camera module .

It is worth mentioning that the isolation cavity 30 can prevent environmental factors such as dust from adhering to the second working element 2001 and causing black spots in the image captured by the CCM camera module.

Specifically, as shown in FIG. 4 , the photosensitive chip packaging structure of the image module includes a filter 101, a photosensitive chip 201 and at least one dustproof base 40A, and the dustproof base 40A can hold the optical filter 101 and the photosensitive chip 102 are installed together. Preferably, in this preferred embodiment, the photosensitive chip 201 is installed on a circuit board 10, that is to say, the photosensitive chip 201 is a chip on board (COB: ChipOnBoard), and then the optical filter 101 can be It is indirectly connected to the photosensitive chip 201 by being connected and fixed to the circuit board 10 .

It is worth mentioning that the optical filter 101 can be connected to the photosensitive chip 201 by being fixed on the circuit board 10 connected to the photosensitive chip 201 .

The image module photosensitive chip packaging structure further includes a bonding agent layer 60, when the optical filter 101 and the photosensitive chip 201 are fixed to each other through the dustproof base 40A, the optical filter 101 can pass through fixed on the circuit board 10 and connected to the photosensitive chip 201, and the filter 101 can also be fixed to the photosensitive chip 201 through the dustproof base 40A and the bonding agent layer 60 to be connected to the photosensitive chip 201. Chip 201 is connected.

It is worth mentioning that when the filter 101 is fixed to the photosensitive chip 201 by the dust-proof base 40A and the connecting agent at the same time and connected to the photosensitive chip 201, the dust-proof base 40A and The connecting agent is fixed on the non-working area of the photosensitive chip 201 , thereby avoiding contacting the working area of the photosensitive chip 201 and affecting the working effect of the photosensitive chip 201 .

Preferably, in one aspect of this preferred embodiment, the optical filter 101 is preferably fixed on the circuit board 10, and then, the optical filter 101 can be connected to the photosensitive chip 201 and connected to the filter At least one isolation cavity 30 is formed between the sheet 101 and the photosensitive chip 201, so as to prevent the dustproof base 40A and the connecting agent from contacting and covering the working area of the photosensitive chip 201 during the installation process. affect the working effect of the photosensitive chip 201 .

Further, the dust-proof base 40A is disposed on the circuit board 10 adjacently or symmetrically, so that the optical filter 101 can be installed on the circuit board 10 by being installed on the dust-proof base 40A, That is to say, the optical filter 101 can be connected to the photosensitive chip 201 by being connected and fixed on the dust-proof base 40A, and at least one photosensitive chip 201 is formed between the optical filter 101 and the photosensitive chip 201. The isolation cavity 30 is used to ensure that the photosensitive chip 201 is isolated from environmental factors such as dust and water vapor, so as to ensure the working effect of the CCM camera module.

The dust-proof base 40A further includes a first support frame 41A and a second support frame 42A, the first support frame 41A and the second support frame 42A are integrally connected and connected to the first support frame 41A and the second support frame 42A. A mounting groove 43A is formed between the second supporting frame 42A for supporting the optical filter 101 , that is, the optical filter 101 can be connected to the photosensitive chip 201 by being fixed in the mounting groove 43A.

When the optical filter 101 and the photosensitive chip 201 are simultaneously connected by at least one dust-proof base 40A and the connecting agent, the optical filter 101 can be bonded through the adhesive connection of the connecting agent. To achieve fixing on the circuit board 10, the filter 101 can also fix the dust-proof base 40A on the circuit board 10 through the connecting agent, and then fix it in the installation groove 43A to realize the fixed The filter 101 is on the circuit board 10 .

It is worth mentioning that the connecting agent can eliminate the gap between the dust-proof base 40A and the circuit board 10 and the gap between each of the dust-proof bases 40A, and at the same time, the connecting agent can also eliminate The gap between the optical filter 101 and the photosensitive chip 102 can further form the isolation cavity 30 between the optical filter 101 and the photosensitive chip 201, while preventing dust, water vapor, etc. in the environment Possible environmental elements enter the isolation cavity 30 and affect the working effect of the photosensitive element 201 .

It is worth mentioning that the optical filter 101 can be fixed in the installation groove 43A through the connecting agent, and the optical filter 101 can also be fixed by the physical force such as pressure between the dust-proof base 40A. , frictional force and fixed in the installation groove 43A.

When the photosensitive chip packaging structure of the image module includes at least two dust-proof bases 40A, each of the dust-proof bases 40A is arranged in a contiguous manner or symmetrically or spaced apart from each other, and surrounds the photosensitive chip 102, wherein each of the dust-proof bases 40A is filled with the bonding agent layer.

As shown in Figure 6, preferably, the image module photosensitive chip packaging structure includes two dust-proof bases 40A, and the two dust-proof bases 40A are preferably arranged adjacently or symmetrically to ensure that the photosensitive chip 201 is able to receive light information processed by the filter 101 .

As shown in Figures 7A and 7B, the two dust-proof bases 40A are preferably arranged symmetrically, so that the filter 101 can be placed in the two symmetrically arranged installation grooves 43A, and then the filter The sheet 101 can be balanced and stably fixed on the dustproof base 40A. As shown in Figure 7A, it is a sectional view of the CCM camera module having the dust-proof base 40A connected to the optical filter 101 and the photosensitive chip 201, and the symmetrical two ends of the optical filter 101 have been fixed It is indirectly connected to the photosensitive chip 201 in the installation groove 43A. As shown in FIG. 7B , it is a cross-sectional view of the optical filter 101 of the CCM camera module, except for the symmetrical two ends mentioned above, which is connected to the photosensitive chip 201 through the connecting agent.

It is worth mentioning that while the two dust-proof bases 40A can ensure that the optical filter 101 is firmly fixed in the installation groove 143A, the usage of the dust-proof base 40A can be reduced, thereby reducing the amount of the dust-proof base 40A. The amount of usage of the above-mentioned dustproof base 40A.

As shown in FIGS. 8A to 8B , in another aspect of this embodiment, the filter 101 can be directly fixed on the non-working area of the photosensitive chip 201 through the dustproof base 40A to achieve 201 and the filter 101 form the isolation cavity 30 .

Preferably, the photosensitive chip 201 is preferably fixedly connected and fixed to the installation groove 43A, and the optical filter 101 is connected to the dustproof base 40A through the connecting agent, and further, the optical filter 101 And the photosensitive chip 201 is connected to each other through the dustproof base 40A and the connecting agent.

It is worth mentioning that the filter 101 can also be optionally fixedly connected to the installation groove 43A, and at the same time connected to the dust-proof base 40A through the photosensitive chip 201 to realize the filter 101 and the The photosensitive chip 201 is connected to form the isolation cavity 30, that is to say, the photosensitive chip 201 and the filter sheet 101 can be interchangeably installed in the position of the dustproof base 40A without affecting the Describe the working effect of the CCM camera module.

It is worth mentioning that the optical filter 101 can be fixed to the installation groove 43A of the dust-proof base 40A through glue and other connecting agents, and can also be fixed through the physical relationship with the dust-proof base 40A, such as pressure, It is installed on the dust-proof base 40A by friction force.

It is worth mentioning that the connecting agent is preferably glue, that is, the photosensitive chip 201 can also be fixed on the dust-proof base 40A through the connecting agent.

Preferably, the dustproof base 40A can connect and fix the optical filter 101 and the photosensitive chip 201 according to the specifications of the optical filter 101 and the photosensitive chip 201, that is, the dustproof The base 40A is not limited by the size of the optical filter 101 and the photosensitive chip 201 .

It is worth mentioning that the connecting agent attached between the optical filter 101 and the photosensitive chip 201 is attached to the non-working area of the photosensitive chip 201, so that the connecting agent will not affect all Describe the working effect of the photosensitive chip 201.

It is worth mentioning that the connecting agent will not easily change in shape or texture under the action of physical conditions such as temperature and pressure, thus affecting the fixed state or affecting the connection between the optical filter 101 and the photosensitive chip 201. To the working effect of the optical filter 101 and the photosensitive chip 201.

It is worth mentioning that the effective working area of the photosensitive chip 201 is covered by the projected area of the optical filter 101 on the photosensitive chip 201 , thereby ensuring the working efficiency of the photosensitive chip 201 .

It is worth mentioning that the connection agent or other connection agent layer 60 can realize the sealing structure of the isolation cavity 30 .

Preferably, in this preferred embodiment, after the photosensitive chip 201 is connected and fixed on the circuit board 10, the dust-proof base 40A on which the optical filter 101 is fixed is fixed on the circuit board 10 , and then an integrated motor can be installed on the motor base of the CCM camera module, thereby forming the isolation cavity 30 to ensure the working efficiency of the photosensitive chip 201, and the integrated motor can be used to focus The solution is to automatically focus on the CCM camera module to ensure the imaging effect of the CCM camera module.

Preferably, the connecting agent layer 60 is glue, glue and other substances.

As shown in Fig. 9 and Fig. 10, another preferred embodiment of the present invention is shown. In this preferred embodiment, the image module photosensitive chip packaging structure can be applied to at least one first CCM camera module. Between a working element 100 and at least one second working element 200, at least one isolation cavity 30 is formed between the first working element 100 and the second working element 200, that is, the image module photosensitive The chip packaging structure includes a first working element 100 and a second working element 200, so that at least one of the first working element 100 and the second working element 200 is no longer affected by dust, The influence of environmental factors such as water vapor will affect the work efficiency and quality, thereby improving the yield rate and work efficiency of the CCM camera module.

The image module packaging structure further includes a bonding agent layer 60, at least one environmental element 50 exists between the first working element 100 and the second working element 200, the first working element 100 and the The second working elements 200 are connected through the bonding agent layer 60 and so on, and at least one isolation cavity 30 is formed between the first working element 100 and the second working element 200 .

Preferably, the connecting agent layer 60 is glue, glue and other substances.

It is worth mentioning that the isolation chamber 30 is an airtight structure, thereby ensuring that the second working element 200 and the first working element can achieve their working effects without being affected by environmental factors such as dust and water vapor.

Preferably, in this preferred embodiment, the image module is preferably a CCM camera module (CCM: CameraCompactModule), the environmental element 50 is an electronic component of the CCM camera module, and the first The working element 100 is a filter 101 , the second working element 200 is a photosensitive chip 201 , and the filter 101 and the photosensitive chip 201 are preferably supplied for the CCM camera module.

It is worth mentioning that the environmental element 50 is part of the non-photosensitive area of the CCM camera module.

It is worth mentioning that the photosensitive chip 201 is mounted on a circuit board 10 , that is, the photosensitive chip 201 is a chip on board (COB: ChipOnBoard).

It is worth mentioning that the environmental element 50 can optionally be fixed on the same part of the CCM camera module as the optical filter 101 or the photosensitive chip 201. In this preferred embodiment, the environmental element 50 is preferably fixed on the circuit board 10, that is to say, the optical filter 101 and the photosensitive chip 201 can be formed between the optical filter 101 and the photosensitive chip 201 through the environmental element 50 At least one of the isolation chambers 30 .

Specifically, that is to say, the optical filter 101 can be fixed to the environmental element 50 to form the isolation cavity 30 between the optical filter 101 and the photosensitive chip 201 .

Preferably, in this preferred embodiment, the environmental element 50 is an electronic component in the CCM camera module.

It is worth mentioning that the optical filter 101 can be fixed to the environmental element 50 through a bonding agent such as the bonding agent layer 60, and the optical filter 101 can also be fixed to the environmental element 50 through physical forces such as pressure and friction. The environmental element 50, in this preferred embodiment, the filter 101 is preferably fixed to the environmental element 50 by a connecting agent.

It is worth mentioning that the projected area of the filter 101 on the plane where the photosensitive chip 201 is located is larger than the area of the effective working area of the photosensitive chip 201 , thereby ensuring the working efficiency of the photosensitive chip 201 .

Preferably, the isolation cavity 30 can ensure that environmental elements such as dust and water vapor will not easily adhere to the photosensitive element 201, thereby ensuring the product yield of the CCM camera module.

It is worth mentioning that while the optical filter 101 can be connected and fixed to the environmental element 50 through the connecting agent layer 60, the connecting agent layer 60 and the like can also realize the airtight structure of the isolation cavity 30, Furthermore, the photosensitive chip 201 is exposed to the isolation cavity 30 , that is, the photosensitive chip 201 is located in the isolation cavity 30 .

It is worth mentioning that the CCM camera module can preferably connect and fix the color filter 101 to the environmental element 50 first, and then install an integrated motor, and then use the integrated motor focusing scheme to focus on the The CCM camera module performs automatic focusing to ensure the imaging effect of the CCM camera module.

The present invention also discloses a method for forming a photosensitive chip package structure of an image module, as shown in FIG. 11 , the method includes the following steps:

A: Obtain the assembly of the optical filter 101 and the dustproof base 40;

B: sticking the photosensitive chip 201 on the circuit board 10; and

C: Attach the dust-proof base 40 to the circuit board 10, wherein the photosensitive chip 201 and the optical filter 101 are both supplied for the image module, and at least one isolation cavity 30 is formed Between the filter 101 and the photosensitive chip 201 , the photosensitive chip 201 can be placed in the isolation cavity 30 .

Preferably, the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board 10 can be fixedly connected by a connecting agent, At the same time, the isolation cavity forms a sealed structure, and the image module is a CCM camera module.

It is worth mentioning that the dust-proof base can optionally be in an integral annular structure or in a symmetrical structure.

As shown in FIG. 12, another preferred embodiment of the present invention is a method for forming a photosensitive chip package structure of an image module. The method includes the following steps:

A': Obtain the assembly of the optical filter 101 and the dustproof base 201;

B': sticking the photosensitive chip 201 on the circuit board 10; and

C': Attach the dust-proof base 40 to the photosensitive chip 201, wherein the photosensitive chip 201 and the optical filter 101 are both supplied for the image module, and at least one isolation cavity 30 is formed in the The filter 101 and the photosensitive chip 201 are placed in the isolation cavity 30 .

Preferably, the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board 10 can be fixedly connected by a connecting agent, At the same time, the isolation cavity forms a sealed structure, and the image module is a CCM camera module.

It is worth mentioning that, the dust-proof base 40 can optionally have an integral ring structure or a symmetrical structure.

It is worth mentioning that the dust-proof base is fixed on the non-photosensitive area of the photosensitive chip.

As shown in FIG. 13 , another preferred embodiment of the present invention is a method for forming a photosensitive chip package structure of an image module. The method includes the following steps:

A``: Attach the color filter 101 to the environmental element 50, wherein the photosensitive chip 201, the color filter 101, the circuit board 10 and the environmental element 50 are all supplied for a In the image module, at least one isolation cavity 30 is formed between the optical filter 101 and the photosensitive chip 201 , and the photosensitive chip 201 can be placed in the isolation cavity 30 .

Preferably, the projection of the optical filter on the plane where the photosensitive chip is located can cover the photosensitive chip, and the optical filter, the dust-proof base and the circuit board 10 can be fixedly connected by a connecting agent, At the same time, the isolation cavity forms a sealed structure, and the image module is a CCM camera module.

The foregoing content is an example of specific embodiments of the present invention, and the devices and structures not described in detail therein should be understood to be implemented by adopting existing general devices and methods in the art.

At the same time, the above-mentioned embodiments of the present invention are only for illustrating the technical solutions of the present invention, and are only enumerations of the technical solutions of the present invention, and are not used to limit the technical solutions of the present invention and their protection scope. The use of equivalent technical means, equivalent equipment, etc. to improve the technical solutions disclosed in the claims and description of the present invention shall not exceed the scope disclosed in the claims and description of the present invention.

Claims (28)

1. an image module, it is characterized in that, described image module comprises a module main body, described module main body comprises a wiring board, be positioned at the sensitive chip on described wiring board, and at least one dust-proof base, described dust-proof base is for preventing sensitive chip described in the dust pollution on described wiring board on other electronic devices and components.

2. image module as claimed in claim 1, it is characterized in that, described image module also comprises an optical filter, and described optical filter is installed on described dust-proof base, between described optical filter and described sensitive chip, form at least one separate cavities, described sensitive chip is placed in described separate cavities simultaneously.

3. image module as claimed in claim 2, it is characterized in that, described optical filter is covered described sensitive chip in the projection of described sensitive chip place plane.

4. image module as claimed in claim 3, it is characterized in that, described optical filter is installed on described dust-proof base, and described dust-proof base is installed on described wiring board.

5. image module as claimed in claim 3, it is characterized in that, described optical filter is installed on described dust-proof base, and described dust-proof base is installed on the non-active area of described sensitive chip.

6. the image module as described in claim 4 or 5, it is characterized in that, described image module also comprises a connection oxidant layer, between described dust-proof base and described optical filter, described dust-proof base and described sensitive chip and be fixedly connected with make described separate cavities form hermetically-sealed construction simultaneously by the described oxidant layer that is connected between described optical filter with described sensitive chip.

7. image module as claimed in claim 6, it is characterized in that, described base for supporting comprises one first bracing frame and one second bracing frame further, between described first bracing frame and described second bracing frame, form at least one mounting groove, described optical filter or described sensitive chip are selectively installed on described mounting groove.

8. image module as claimed in claim 7, it is characterized in that, described image module is a CCM camera module, and described image module is integral type annular structure.

9. image module as claimed in claim 7, it is characterized in that, described image module is a CCM camera module, the described dust-proof base of the described image module structure or symmetrically arrange or arrange apart from one another by ground in sectional type of joining end to end selectively in segmentation, and arrange round described sensitive chip.

10. the image module as described in claim 4 or 9, it is characterized in that, described image module also comprises a connection oxidant layer, be fixedly connected with by the described oxidant layer that is connected between described dust-proof base with described optical filter and between described optical filter with described sensitive chip, make described separate cavities form hermetically-sealed construction simultaneously.

11. image modules as claimed in claim 10, it is characterized in that, described image module is a CCM camera module, and described dust-proof base is formed by the electronic devices and components being installed on described wiring board.

12. 1 kinds of image module sensitive chip encapsulating structures, it is characterized in that, described sensitive chip encapsulating structure comprises a sensitive chip, a color filter and at least one dust-proof base, and described sensitive chip and described color filter are linked together by described dust-proof base.

13. sensitive chip encapsulating structures as claimed in claim 12, it is characterized in that, described sensitive chip is installed on a wiring board of an image module, and namely described sensitive chip is a chip on board.

14. image module sensitive chip encapsulating structures as claimed in claim 13, it is characterized in that, described encapsulating structure also comprises a connection oxidant layer, connected by described connection oxidant layer between described optical filter, described sensitive chip and described dust-proof base, form at least one separate cavities of sealing between described optical filter and described sensitive chip, described light sensation optical chip is placed in described separate cavities simultaneously.

15. image module sensitive chip encapsulating structures as claimed in claim 14, it is characterized in that, the described dust-proof end is integral type annular structure, and described dust-proof base is installed on described wiring board.

16. image module sensitive chip encapsulating structures as claimed in claim 14, it is characterized in that, described image module sensitive chip encapsulating structure comprises at least two dust-proof bases, and each described dust-proof base selectively finishes up mutually or is installed on described wiring board with being symmetrical set.

17. image module sensitive chip encapsulating structures as claimed in claim 14, is characterized in that, described dust-proof base is the electronic devices and components of the described image module being installed on described wiring board.

18. image module sensitive chip encapsulating structures as claimed in claim 14, it is characterized in that, described dust-proof base is selectively in integral type, or joining end to end of segmentation connects, or symmetrically, or sectional type is arranged apart from one another by ground, and be arranged in the non-active area of described sensitive chip round described sensitive chip.

19. as arbitrary in claim 15 to 18 as described in image module sensitive chip, it is characterized in that, described optical filter is covered described optical filter in the projection of the plane at described sensitive chip place.

20. image module sensitive chip encapsulating structures as claimed in claim 19, it is characterized in that, described image module also comprises a connection oxidant layer, between described dust-proof base and described optical filter, described dust-proof base, be fixedly connected with by described connection oxidant layer between described sensitive chip and described optical filter, form the hermetically-sealed construction of described separate cavities simultaneously.

21. image module sensitive chip encapsulating structures as claimed in claim 20, it is characterized in that, described base for supporting comprises one first bracing frame and one second bracing frame further, at least one mounting groove is formed between described first bracing frame and described second bracing frame, described optical filter or described sensitive chip are selectively installed on described mounting groove, thus are able to be fixed on described sensitive chip by described base for supporting and form described separate cavities in described optical filter and described sensitive chip.

The formation method of 22. 1 kinds of image module sensitive chip encapsulating structures, it is characterized in that, described method comprises steps A: linked together by dust-proof base by the sensitive chip on optical filter and wiring board, and described dust-proof base is for preventing sensitive chip described in the dust pollution on wiring board on other electronic devices and components.

23. methods as claimed in claim 22, it is characterized in that, described optical filter is covered described sensitive chip in the projection of described sensitive chip place plane.

24. methods as claimed in claim 22, it is characterized in that, described method also comprises the steps:

B: attach sensitive chip in the wiring board of described image module,

C: attach described dust-proof base in described wiring board, wherein, described sensitive chip is for being applied to described image module, and at least one separate cavities is formed at described optical filter and described sensitive chip, and described sensitive chip is placed in described separate cavities.

25. methods as claimed in claim 22, it is characterized in that, described method also comprises the steps:

B: attach sensitive chip in wiring board; And

C: attach described dust-proof base in the non-active area of described sensitive chip, wherein, described sensitive chip is for being applied to described image module, and at least one separate cavities is formed at described optical filter and described sensitive chip, and described sensitive chip is placed in described separate cavities.

26. methods as described in arbitrary claim as described in claim 23-25, it is characterized in that, described optical filter is covered described sensitive chip in the projection of the plane at described sensitive chip place, described optical filter, be fixedly connected with by coupling agent between described dust-proof base and described wiring board, make described separate cavities form hermetically-sealed construction simultaneously.

27. methods as claimed in claim 25, is characterized in that, described image module is a CCM camera module, and described dust-proof base is selectively in integral type annular structure or segmentation structure.

28. methods as claimed in claim 23, is characterized in that, also comprise step: attach the electronic devices and components of described optical filter on described wiring board, wherein said electronic devices and components form described dust-proof base.