CN105527596B - A kind of wafer acceptance testing board pressurization calibration method - Google Patents
A kind of wafer acceptance testing board pressurization calibration method Download PDFInfo
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- CN105527596B CN105527596B CN201510662809.5A CN201510662809A CN105527596B CN 105527596 B CN105527596 B CN 105527596B CN 201510662809 A CN201510662809 A CN 201510662809A CN 105527596 B CN105527596 B CN 105527596B
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- 238000012360 testing method Methods 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000523 sample Substances 0.000 claims abstract description 28
- 239000000284 extract Substances 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 description 79
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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Abstract
The present invention provides a kind of wafer acceptance testing board pressurization calibration method, same probe card is separately fixed at test wafer on several wafer acceptance testing boards, it extracts the needle trace image formed when probe card test wafer on each wafer acceptance testing board and calculates the median of the pressurization value of each width needle trace image, and the median for extracting the pressurization value of each wafer acceptance testing board carries out data fitting, the specification limit of pressurization value is obtained, the pressurization value of each wafer acceptance testing board is adjusted to the specification limit of pressurization value.Pressurization calibration method provided by the invention, wafer acceptance testing board need to only carry out wafer primary test and form needle trace image, needle trace image is extracted, is calculated the median of pressurization value, therefore reduce board utilizes the time, improve utilization rate, then data are carried out according to above-mentioned data to be fitted to obtain the specification limit of pressurization value, increases the confidence level of pressurization value specification limit setting.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of wafer acceptance testing board pressurization calibration method.
Background technology
WAT (Wafer acceptance test, wafer acceptance testing) is the electricity done to chip after technological process
Property measure, whether for examining each segment process flow to comply with standard, test event includes device property test, capacity measurement, connects
Touch resistance test, breakdown test etc..Generally fix probe card on wafer acceptance testing board, it would be desirable to the wafer of test or
Chip is placed on wafer acceptance testing board, using the weld pad or convex block on probe card bundle wafer either chip, that is, is pressurizeed
(over drive), to test the wafer.
When probe card tests wafer, probe card on wafer weld pad or convex block carry out pressure-loaded,
Needle trace is left on weld pad or convex block, and each wafer acceptance testing board will carry out school to the board when in use
Standard avoids the data error of itself when in use and wafer test is made to generate error.
The wafer acceptance testing board generally used at this stage can use pressurization value to be calibrated, and adjust each wafer
The pressurization value of Acceptance Test board, other data can together change with pressurization value, therefore need to only adjust pressurization value, you can complete
The calibration of each wafer acceptance testing board.
In the prior art, the pressurization value calibration method of wafer acceptance testing board is first to obtain all board probes just to connect
Pressurization value when wafer is touched, and chooses the median of all pressurization values generated after the multiple test to more wafers of the board
It is set as a reference value, the specification limit of pressurization value is set according to previous empirical value, pressurization value is exceeded to the machine of the specification limit
The pressurization value of platform is adjusted to the specification limit.This calibration process is both needed to that wafer acceptance testing board test crystalline substance is used for multiple times
Circle, prover time is longer, and wastes board utilization rate；Meanwhile the specification limit of board is to be set using empirical value, therefore tie
Fruit is less reliable, and precision is short of relative to present FAB manufacturing process.Therefore in view of the above-mentioned problems, it is necessary to invent a kind of school
Quasi- method can reduce calibration duration, improve board utilization rate, improve specification limit setting accuracy.
Invention content
The present invention provides a kind of wafer acceptance testing board pressurization calibration method, when carrying out applied voltage test to wafer,
It extracts the needle trace image formed when the probe card test wafer on each wafer acceptance testing board and calculates every
The median of the pressurization value of needle trace image described in one width, and extract the pressurization value of each wafer acceptance testing board
Median carries out data fitting, obtains the specification limit of pressurization value, to which each wafer acceptance testing board only need to be to wafer
Carry out primary test and generate needle trace image that pressurization value can be calculated, reduce calibration duration, improve board utilization rate and
The specification limit that pressurization value is fitted due to the use of data improves the precision and confidence level of specification limit setting.
In order to achieve the above objectives, the present invention provides a kind of wafer acceptance testing board pressurization calibration method, will similarly visit
Needle card is separately fixed at test wafer on several wafer acceptance testing boards, extracts each wafer acceptance testing machine
It the needle trace image that is formed when the probe card test wafer on platform and calculates in the pressurization value of needle trace image described in each width
Between be worth and the information of each wafer acceptance testing board, and extract each wafer acceptance testing board
The median of pressurization value carries out data fitting, the specification limit of pressurization value is obtained, by each wafer acceptance testing board
Pressurization value adjust to the specification limit of the pressurization value, then each wafer acceptance testing board has been calibrated
At.
Preferably, including the following steps：
Step 1：Reference probe card is provided；
Step 2：The reference probe card is separately fixed on several described wafer acceptance testing boards and tests crystalline substance
Circle；
Step 3：Reference probe described in step 2 is stuck in the needle trace image that the when of testing the wafer obtains and carries out image
Processing, obtains the diameter of each needle trace in needle trace image described in each width, and obtain needle trace in needle trace image described in every width
The median of diameter；
Step 4：The middle-value calculating of the diameter of needle trace in needle trace image described in the every width obtained in step 3 is gone out each
Pressurization value of the wafer acceptance testing board in test wafer described in platform；
Step 5：Pressurization value meter of each wafer acceptance testing board that step 4 is obtained in test wafer
Calculate the specification limit of the pressurization value of all wafer acceptance testing boards；
Step 6：The pressurization value of all wafer acceptance testing boards is adjusted to the rule of the pressurization value described in step 5
Within the scope of lattice.
Preferably, the diameter of each needle trace in needle trace image described in each width is ranked up in step 2, then root
The median of the diameter of needle trace in needle trace image described in every width is obtained according to the diameter of each needle trace after sequence.
Preferably, obtain in needle trace image described in every width after the median of the diameter of needle trace while obtaining in step 3
The board number of each wafer acceptance testing board.
Preferably, being tested by the pressurization value and each wafer of each wafer acceptance testing board in step 5
The mathematic interpolation of the median of the diameter of the needle trace of Acceptance Tests board obtains the pressurization value of all wafer acceptance testing boards
Specification limit.
Preferably, by the pressurization value of each wafer acceptance testing board and each wafer acceptance in step 5
The difference of the median of the diameter of the needle trace of tester table carries out data and is fitted to obtain all wafer acceptance testing boards
The specification limit of pressurization value.
Preferably, the data are fitted to linear fit.
Preferably, the probe diameter of the probe card is 35nm.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention provides a kind of wafer acceptance testing board pressurization
Same probe card is separately fixed at test wafer on several wafer acceptance testing boards, extracts each by calibration method
The needle trace image that is formed when the probe card test wafer on the wafer acceptance testing board and calculate needle described in each width
The information of the median of the pressurization value of trace image and each wafer acceptance testing board, and extract described in each
The median of the pressurization value of wafer acceptance testing board carries out data fitting, the specification limit of pressurization value is obtained, by each institute
The pressurization value for stating wafer acceptance testing board is adjusted to the specification limit of the pressurization value, then each wafer acceptance is surveyed
Commissioning stage is calibrated completion.Pressurization calibration method provided by the invention, wafer acceptance testing board only need to carry out one to wafer
Secondary test forms needle trace image, extracts, is calculated the median of pressurization value to needle trace image, therefore reduce
Board utilizes the time, improves utilization rate, and then carrying out data according to above-mentioned data is fitted to obtain the specification limit of pressurization value,
Increase the confidence level of pressurization value specification limit setting.
Description of the drawings
Fig. 1 is wafer acceptance testing board provided by the invention pressurization calibration method flow chart.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.
Fig. 1 is please referred to, in order to achieve the above objectives, the present invention provides a kind of wafer acceptance testing board pressurization calibration method,
Include the following steps：
Step 1：The reference probe card for doing wafer test is provided, usually, the probe diameter of reference probe card is
35nm。
Step 2：Reference probe card is separately fixed on several described wafer acceptance testing boards, it will be same brilliant
Circle is individually placed to test using reference probe card on above-mentioned all wafer acceptance testing boards, due to the weldering in different wafers
Pad is different with bump material ingredient, it is therefore necessary to use same wafer, it is ensured that the needle trace image subsequently obtained is same
The trace to be pressurizeed on material composition avoids the hardness due to material different, caused by needle trace shape and depth all
It is different, to affect the precision of calculating；
Step 3：Reference probe described in step 2 is stuck in the needle trace image that the when of testing the wafer obtains and carries out image
Processing, obtains diameter such as d1, d2 ... dn of each needle trace in needle trace image described in each width, in each needle trace image
Needle trace diameter is ranked up, and the median dm of the diameter of needle trace in needle trace image described in every width is calculated；
Step 4：The median dm of the diameter of needle trace in needle trace image described in the every width obtained in step 3 is calculated often
Pressurization value of one wafer acceptance testing board in test wafer can use correspondingly computer system, according to micro-
The principle for seeing hardness test is extracted needle trace from image, and according to the hardness of weld pad at that time or the material of convex block, is calculated
Correspondingly pressure value, obtained pressurization value are OD1, OD2 ... ODn, and each wafer acceptance testing board corresponds to a width needle trace
Image, therefore the median dm of the diameter of a corresponding middle needle trace, while also corresponding to a pressurization value OD；
Step 5：Pressurization value OD of all wafer acceptance testing boards that step 4 is obtained in test wafer
The data that computer is carried out with the difference of the median dm of the diameter of the needle trace of respective board are fitted, preferably linear fit, are intended
The specification limit of pressurization value is obtained after conjunction；
Step 6：The pressurization value of all wafer acceptance testing boards is adjusted to the specification model of the pressurization value described in step 5
In enclosing, then completion is calibrated.
Preferably, obtain in needle trace image described in every width after the median of the diameter of needle trace while obtaining every in step 3
The board of a wafer acceptance testing board is numbered.
Compared with prior art, pressurization calibration method provided by the invention, wafer acceptance testing board only need to wafer into
The primary test of row forms needle trace image, extracts, is calculated the median of pressurization value to needle trace image, therefore subtract
That has lacked board utilizes the time, improves utilization rate, and then carrying out data according to above-mentioned data is fitted to obtain the specification of pressurization value
Range increases the confidence level of pressurization value specification limit setting.
Obviously, those skilled in the art can carry out invention spirit of the various modification and variations without departing from the present invention
And range.If these modifications and changes of the present invention is within the scope of the claims of the present invention and its equivalent technology, then
The present invention is also intended to including these modification and variations.
Claims (7)
- The calibration method 1. a kind of wafer acceptance testing board pressurizes, which is characterized in that if same probe card is separately fixed at Test wafer on dry wafer acceptance testing board extracts the probe card test on each wafer acceptance testing board The needle trace image formed when wafer, and calculate the median of the pressurization value of needle trace image described in each width and each described in The information of wafer acceptance testing board, the median for extracting the pressurization value of each wafer acceptance testing board carry out data Fitting, obtains the specification limit of pressurization value, the pressurization value of each wafer acceptance testing board is adjusted to the pressurization In the specification limit of value, then each wafer acceptance testing board calibration is completed, and specifically includes following steps：Step 1：Reference probe card is provided；Step 2：The reference probe card is separately fixed at test wafer on several described wafer acceptance testing boards；Step 3：Reference probe described in step 2 is stuck in the needle trace image that the when of testing the wafer obtains to carry out at image Reason, obtains the diameter of each needle trace in needle trace image described in each width, and obtains the straight of needle trace in needle trace image described in every width The median of diameter；Step 4：Go out each according to the middle-value calculating of the diameter of needle trace in needle trace image described in the every width obtained in step 3 Pressurization value of the wafer acceptance testing board in test wafer；Step 5：Pressurization value of each wafer acceptance testing board that step 4 is obtained in test wafer calculates institute There is the specification limit of the pressurization value of the wafer acceptance testing board；Step 6：The pressurization value of all wafer acceptance testing boards is adjusted to the specification model of the pressurization value described in step 5 In enclosing.
- The calibration method 2. wafer acceptance testing board as described in claim 1 pressurizes, which is characterized in that will be each in step 2 The diameter of each needle trace is ranked up in needle trace image described in width, then obtains every width according to the diameter of each needle trace after sequence The median of the diameter of needle trace in the needle trace image.
- The calibration method 3. wafer acceptance testing board as described in claim 1 pressurizes, which is characterized in that obtained in step 3 Obtain the board of each wafer acceptance testing board in needle trace image described in every width after the median of the diameter of needle trace simultaneously Number.
- The calibration method 4. wafer acceptance testing board as described in claim 1 pressurizes, which is characterized in that by each in step 5 The median of the diameter of the needle trace of the pressurization value of a wafer acceptance testing board and each wafer acceptance testing board Mathematic interpolation obtain all wafer acceptance testing boards pressurization value specification limit.
- The calibration method 5. wafer acceptance testing board as claimed in claim 4 pressurizes, which is characterized in that will be each in step 5 The median of the diameter of the needle trace of the pressurization value of the wafer acceptance testing board and each wafer acceptance testing board Difference carries out data fitting, obtains the specification limit of the pressurization value of all wafer acceptance testing boards.
- The calibration method 6. wafer acceptance testing board as claimed in claim 5 pressurizes, which is characterized in that the data are fitted to Linear fit.
- The calibration method 7. wafer acceptance testing board as described in claim 1 pressurizes, which is characterized in that the spy of the probe card The a diameter of 35nm of needle.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN112731241B (en) * | 2020-12-23 | 2024-01-19 | 华虹半导体(无锡)有限公司 | Calibration tool and calibration method for wafer test machine |
| CN115166476A (en) * | 2022-06-22 | 2022-10-11 | 上海华力集成电路制造有限公司 | Method for predicting test stability of probe card according to needle marks |
| CN115856585B (en) * | 2023-01-19 | 2023-05-12 | 合肥晶合集成电路股份有限公司 | Parameter determining method of WAT test machine |
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| CN103489807A (en) * | 2012-06-13 | 2014-01-01 | 台湾积体电路制造股份有限公司 | Method of test probe alignment control |
| CN103809100A (en) * | 2014-03-07 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Automatic test system for wafer |
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| JP2013137224A (en) * | 2011-12-28 | 2013-07-11 | Sharp Corp | Multichip prober, method for correcting contact position thereof, control program, and readable recording medium |
| JP2013191737A (en) * | 2012-03-14 | 2013-09-26 | Tokyo Electron Ltd | Wafer inspection device |
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|---|---|---|---|---|
| CN103489807A (en) * | 2012-06-13 | 2014-01-01 | 台湾积体电路制造股份有限公司 | Method of test probe alignment control |
| CN103809100A (en) * | 2014-03-07 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Automatic test system for wafer |
Non-Patent Citations (1)
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