CN105562866A - Through-hole welding device and method for circuit board - Google Patents
Through-hole welding device and method for circuit board Download PDFInfo
- Publication number
- CN105562866A CN105562866A CN201610050436.0A CN201610050436A CN105562866A CN 105562866 A CN105562866 A CN 105562866A CN 201610050436 A CN201610050436 A CN 201610050436A CN 105562866 A CN105562866 A CN 105562866A
- Authority
- CN
- China
- Prior art keywords
- template
- wiring board
- welding
- hole
- mozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000006071 cream Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of through-hole welding of circuit boards and particularly relates to a through-hole welding device and method for a circuit board. The device comprises a solder paste printing machine, a pressure roller, a positioning frame and a welding template, wherein the pressure roller and the positioning frame are arranged on the solder paste printing machine, the welding template is correspondingly arranged above the positioning frame, and the welding template is correspondingly arranged below the pressure roller and comprises a template and flow guide tubes inlaid in the template. The device is simple in structure and convenient to operate, when the device is used for welding, the welding cost can be substantially reduced, and the welding first pass yield can be increased. Besides, the invention further discloses the through-hole welding method for the circuit board.
Description
Technical field
The invention belongs to wiring board through hole welding technology field, particularly a kind of devices and methods therefor for the welding of wiring board through hole.
Background technology
At present, in electronics manufacturing, often need a large amount of electronic devices and components fixing in the circuit board by through hole welding procedure.Currently used through hole welding procedure is wave soldering and human assistance welding mainly.The advantage of these current through hole welding process flows is that Joint Strength is large and is applicable to batch production, but its shortcoming is that surface mount and through hole welding must separately be carried out, wiring board difficulty of processing for double-sided belt surface mount elements is very large, but also there is many defects such as energy consumption is comparatively large, solder oxidation is fast.
Along with the progress of technology, also develop selective wave soldering processes in this field, it is more compatible for being suitable for of double-sided wiring board, also alleviates power consumption to a certain extent.Specifically, in selective wave soldering processes, by device programming device, scaling powder spraying module can complete scaling powder spraying to whole wiring board, after warm-up block preheating, then completes welding by welding module to each solder joint pointwise.But adopt this technique, its equipment used costly, makes many enterprises hang back.
Summary of the invention
An object of the present invention is: for the deficiencies in the prior art, and provides a kind of for wiring board through hole welder, and this apparatus structure is simple, easy to operate, adopts its welding significantly will reduce welding cost, improves welding first-pass yield.
For achieving the above object, technical scheme of the present invention is:
A kind of for wiring board through hole welder, comprise stencil printer, pressure roller, positioning framework and welding template, described pressure roller and described positioning framework are all arranged at described stencil printer, described welding template correspondence is arranged at above described positioning framework, described welding template correspondence is arranged at the below of described pressure roller, and described welding template comprises template and is embedded in the mozzle of described template.Said apparatus structure is simple, easy to operate, adopts its welding significantly will reduce welding cost, improves welding first-pass yield.
Improve as the one for wiring board through hole welder of the present invention, shape of through holes and the size of described mozzle and wiring board match.
Improve as the one for wiring board through hole welder of the present invention, described mozzle is set to hollow circular configuration or hollow ellipse structure.
Improve as the one for wiring board through hole welder of the present invention, the thickness of described template is 1 ~ 4mm.
Improve as the one for wiring board through hole welder of the present invention, the thickness of described template is 3mm.
Improve as the one for wiring board through hole welder of the present invention, described positioning framework is provided with the detent for placing wiring board.
Improve as the one for wiring board through hole welder of the present invention, one end of described mozzle and the top of described template maintain an equal level, and the other end of described mozzle stretches out in the bottom of described template.
Another object of the present invention is to provide a kind of for wiring board through hole welding method, comprises the following steps:
A, according to wiring board make weld template accordingly, then wiring board is placed on positioning framework and positions, adjustment welding template make itself and wiring board contraposition;
B, the tin cream that matches is detected after by stencil printer note tin in welding template, then tin cream flows on the corresponding through hole of wiring board by the mozzle of welding template again;
C, solder is released in corresponding through hole welding position by mozzle, then inserts components and parts at lead to the hole site;
D, finally by Reflow Soldering/infrared ray, through hole and components and parts to be welded.
Directly encourage tin cream by above-mentioned through hole welding method to be released on through hole welding position, and then welded by the hot blast noncontact of Reflow Soldering, therefore can obtain the welding quality of SMD welding procedure, significantly reduce fraction defective, improve utilization rate of equipment and installations and cost input.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment and Figure of description, the present invention is described in further detail, but embodiments of the invention are not limited to this.
embodiment 1
As shown in Figure 1, a kind of for wiring board through hole welder, comprise stencil printer 1, pressure roller 2, positioning framework 3 and welding template 4, pressure roller 2 and positioning framework 3 are all arranged at stencil printer 1, welding template 4 correspondence is arranged at above positioning framework 3, welding template 4 correspondence is arranged at the below of pressure roller 2, welding template 4 comprises template 41 and is embedded in the mozzle 42 of template 41, the present embodiment directly can also hollow out in template 41, replace the function of mozzle 42, can cost be saved like this.The positioning framework 3 of the supporting corresponding product size of above-mentioned welding template 4, by the pressure of pressure roller 2 by tin cream water conservancy diversion in wiring board via pad, thus realize the object of welding.
Preferably, shape of through holes and the size of mozzle 42 and wiring board match, because the through-hole structure of the wiring board of different size is different, so will meet welding procedure, the shape of through holes of mozzle 42 and wiring board and size just must be allowed to match, thus realize effective note tin and welding.Mozzle 42 is set to hollow circular configuration or hollow ellipse structure, is conducive to the mobility improving tin cream, makes tin cream can be covered with through hole fast.
Preferably, template 41 is made of copper, and the thickness of template 41 is 1 ~ 4mm, and the thickness of the template 41 of the present embodiment is 3mm, meets general welding process requirement.One end of mozzle 42 and the top of template 41 maintain an equal level, and the top making template 41 is a plane, are conducive to pressure roller 2 and carry out rolling printing; The other end of mozzle 42 stretches out in the bottom of template 41, and exceed the length of mozzle 1/42nd 2, the reason of such setting is: after carrying out paster technique, have components and parts, and mozzle 42 stretches out in the bottom of template 41, is conducive to reserving space and avoids components and parts height.
Preferably, positioning framework 3 is provided with the detent 31 for placing wiring board, can also be equiped with positioning fixture, for fixing circuit board in detent 31.
embodiment 2
As shown in Figure 1, a kind of for wiring board through hole welding method, comprise the following steps:
A, make corresponding welding template 4 according to wiring board, be then placed on by wiring board on positioning framework 3 and position, adjustment welding template 4 makes itself and wiring board contraposition;
B, the tin cream that matches is detected after by stencil printer 1 note tin in welding template 4, then tin cream flows on the corresponding through hole of wiring board by the mozzle 42 of welding template 4 again;
C, solder is released in corresponding through hole welding position by mozzle 42, then inserts components and parts at lead to the hole site;
D, finally by Reflow Soldering/infrared ray, through hole and components and parts to be welded.
The tin cream that uses in said method needs according to printing stencil adjustment viscosity, detects, guarantee that tin cream meets technological requirement when batch to use to viscosity.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also change above-mentioned embodiment and revise.Therefore, the present invention is not limited to above-mentioned detailed description of the invention, and any apparent improvement of every those skilled in the art done by basis of the present invention, replacement or modification all belong to protection scope of the present invention.In addition, although employ some specific terms in this description, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (8)
1. one kind for wiring board through hole welder, it is characterized in that: comprise stencil printer, pressure roller, positioning framework and welding template, described pressure roller and described positioning framework are all arranged at described stencil printer, described welding template correspondence is arranged at above described positioning framework, described welding template correspondence is arranged at the below of described pressure roller, and described welding template comprises template and is embedded in the mozzle of described template.
2. according to claim 1 for wiring board through hole welder, it is characterized in that: shape of through holes and the size of described mozzle and wiring board match.
3. according to claim 1 for wiring board through hole welder, it is characterized in that: described mozzle is set to hollow circular configuration or hollow ellipse structure.
4. according to claim 1 for wiring board through hole welder, it is characterized in that: the thickness of described template is 1 ~ 4mm.
5. according to claim 4 for wiring board through hole welder, it is characterized in that: the thickness of described template is 3mm.
6. according to claim 1 for wiring board through hole welder, it is characterized in that: described positioning framework is provided with the detent for placing wiring board.
7. according to claim 1 for wiring board through hole welder, it is characterized in that: one end of described mozzle and the top of described template maintain an equal level, and the other end of described mozzle stretches out in the bottom of described template.
8., for a wiring board through hole welding method, it is characterized in that, comprise the following steps:
A, according to wiring board make weld template accordingly, then wiring board is placed on positioning framework and positions, adjustment welding template make itself and wiring board contraposition;
B, the tin cream that matches is detected after by stencil printer note tin in welding template, then tin cream flows on the corresponding through hole of wiring board by the mozzle of welding template again;
C, solder is released in corresponding through hole welding position by mozzle, then inserts components and parts at lead to the hole site;
D, finally by Reflow Soldering/infrared ray, through hole and components and parts to be welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610050436.0A CN105562866A (en) | 2016-01-26 | 2016-01-26 | Through-hole welding device and method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610050436.0A CN105562866A (en) | 2016-01-26 | 2016-01-26 | Through-hole welding device and method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105562866A true CN105562866A (en) | 2016-05-11 |
Family
ID=55873792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610050436.0A Pending CN105562866A (en) | 2016-01-26 | 2016-01-26 | Through-hole welding device and method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105562866A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311987A (en) * | 2021-12-31 | 2022-04-12 | 深圳市和田古德自动化设备有限公司 | Full-automatic vision printing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1449810A2 (en) * | 2003-02-24 | 2004-08-25 | Samsung Electronics Co., Ltd. | Method for manufacturing micro-electro-mechanical system using solder balls |
| CN204134812U (en) * | 2014-09-28 | 2015-02-04 | 张政 | Adjustable for height tin cream roll-on device |
| CN204248167U (en) * | 2014-11-21 | 2015-04-08 | 海宁瑞鑫照明有限公司 | A kind of painting tin cream machine of LED wiring board |
| CN204397118U (en) * | 2014-12-24 | 2015-06-17 | 江苏明富自动化科技股份有限公司 | Reflow soldering apparatus |
| CN205324924U (en) * | 2016-01-26 | 2016-06-22 | 东莞市先飞电子材料有限公司 | A device for through-hole welding of circuit boards |
-
2016
- 2016-01-26 CN CN201610050436.0A patent/CN105562866A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1449810A2 (en) * | 2003-02-24 | 2004-08-25 | Samsung Electronics Co., Ltd. | Method for manufacturing micro-electro-mechanical system using solder balls |
| CN204134812U (en) * | 2014-09-28 | 2015-02-04 | 张政 | Adjustable for height tin cream roll-on device |
| CN204248167U (en) * | 2014-11-21 | 2015-04-08 | 海宁瑞鑫照明有限公司 | A kind of painting tin cream machine of LED wiring board |
| CN204397118U (en) * | 2014-12-24 | 2015-06-17 | 江苏明富自动化科技股份有限公司 | Reflow soldering apparatus |
| CN205324924U (en) * | 2016-01-26 | 2016-06-22 | 东莞市先飞电子材料有限公司 | A device for through-hole welding of circuit boards |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311987A (en) * | 2021-12-31 | 2022-04-12 | 深圳市和田古德自动化设备有限公司 | Full-automatic vision printing machine |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160511 |