CN105578767B - Manufacturing method of PCB stepped groove - Google Patents

Abstract

The invention discloses a method for manufacturing a PCB stepped groove, which comprises the following steps: s10, forming a stepped groove on the PCB, and reserving a boss at a non-copper-plated part on the side wall of the stepped groove; s20, carrying out whole-board copper electroplating on the PCB, and covering copper layers on the side wall and the bottom of the stepped groove; and S30, removing the bosses in the stepped grooves, and synchronously removing the copper layers covered on the surfaces of the bosses to ensure that no copper layer is covered on the side wall surfaces of the corresponding positions of the bosses. The invention provides a manufacturing method of a PCB stepped groove, which realizes the electroplating of a copper layer on a local area of the side wall of the stepped groove.

Description

A kind of manufacturing method of PCB step groove

technical field

The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a PCB stepped groove.

Background technique

Ordinary stepped grooves in PCB can be roughly divided into two types: sinking copper stepped grooves and non-sinking copper stepped grooves. In practical applications, sometimes there are many different stepped grooves on a PCB, and there are functional gaps between the stepped grooves. For example, a non-sinking copper step slot is designed near the copper sinking step slot, the non-sinking copper step slot is a waveguide port, and the other side of the step slot has a radio frequency line design, then the adjacent non-sinking copper step slot The copper on the side wall of the copper sinking step groove will affect the signal, so it is necessary to scrape off the copper on the side wall of the copper sinking step groove to form a special-shaped step groove with discontinuous plating on the side wall. Based on the above situation, it is necessary for us to design a special step groove manufacturing method to realize the above-mentioned special-shaped step groove structure.

Contents of the invention

An object of the present invention is to provide a method for manufacturing a stepped groove of a PCB, which can electroplate a copper layer on a local area of the side wall of the stepped groove.

An object of the present invention is to provide a method for manufacturing a stepped groove of a PCB, by reserving a boss and removing the boss after electroplating to form a discontinuous electroplating layer on the side wall of the stepped groove, the method is simple and reliable , easy to apply and improve production efficiency.

For reaching this purpose, the present invention adopts following technical scheme:

A method for manufacturing a PCB step groove, comprising the following steps:

S10, providing a stepped groove on the PCB, and reserving a boss on the non-copper-plated part of the side wall of the stepped groove;

S20, electroplating copper on the entire PCB, so that the side walls and bottom of the stepped groove are covered with a copper layer;

S30 , removing the boss in the stepped groove, so that the copper layer covered on the surface of the boss is removed synchronously, so that the surface of the side wall corresponding to the boss is not covered by the copper layer.

Preferably, in step S10, the machining method for opening the stepped groove is milling.

Preferably, the horizontal section of the boss is trapezoidal or rectangular or semicircular.

Preferably, in step S30, the machining method for removing the boss is milling.

Preferably, if the stepped groove opened is milled from the L1 layer to the Ln layer (that is, milling is started from the L1 layer side until the medium between the Ln layer and the Ln-1 layer is milled, and the Ln layer circuit layer remains ), then the inner film at the position of the stepped groove of the Ln layer needs to be covered with copper. Among them, n is a natural number. If the stepped groove is milled from the L1 layer to the metal block inside the PCB (that is, the milling process starts from the L1 layer side until it reaches the metal block, so that the bottom of the stepped groove is located in the metal block ), there is no special requirement for the inner graphics of the stepped groove position mentioned above.

Specifically, the present invention sets bosses in the side wall area that does not require copper plating, and then removes the bosses after the overall copper plating, so that the side wall area corresponding to the bosses is free of copper plating, thereby realizing the localization of the side walls of the stepped grooves. Copper plating, the method has a simple process and is easy to implement, and can effectively save production costs and improve production efficiency.

As a preferred technical solution, between step S20 and step S30, the following steps are further included:

S21, making an outer dry film on the PCB;

S22 , performing pattern tinning on the PCB, so that the side walls and the bottom of the stepped groove are covered with a tin layer.

Preferably, the outer dry film is any one of solvent-based dry film, water-soluble dry film and peel-off dry film.

As a preferred technical solution, after step S30, the following steps are also included:

S40 , spraying resist ink on the bottom of the stepped groove corresponding to the removed boss, so as to protect exposed copper at the bottom of the stepped groove.

As a preferred technical solution, after step S40, the following steps are also included:

S50, etching the outer layer graphics on the PCB;

S60, removing the tin layer and the resist ink.

As a preferred technical solution, before step S10, the following steps are also included:

S01, making the inner layer graphics on the sub-board;

S02, pressing several sub-boards to form a PCB.

As a preferred technical solution, the height of the boss is equal to the depth of the stepped groove.

As a preferred technical solution, the width of the end of the boss connected to the side wall is not less than the required width of the non-copper-plated part.

Specifically, if the horizontal section of the boss is trapezoidal or semicircular, the width of the end of the boss connected to the side wall is greater than the required width of the non-copper-plated part; if the horizontal section of the boss is a rectangle, the width of the end connecting the boss to the side wall is equal to the required width of the non-copper-plated part.

As a preferred technical solution, the width of the end of the boss connected to the side wall is greater than the required width of the non-copper-plated part by 1 mil or more and 2 mil or less.

Preferably, the width of the end where the boss is connected to the side wall is 1.1 mil or 1.2 mil or 1.3 mil or 1.4 mil or 1.5 mil or 1.6 mil or 1.7 mil or 1.8 mil or 1.9mil.

Preferably, the distance between the end of the boss close to the side wall and the end of the boss away from the side wall is not less than 1.0 mm and not more than 1.9 mm.

Further, the distance between the end of the boss close to the side wall and the end of the boss away from the side wall is 1.1 mm or 1.2 mm or 1.3 mm or 1.4 mm or 1.5 mm or 1.6 mm or 1.7 mm. mm or 1.8mm.

As a preferred technical solution, in step S10, the actual side length of the stepped groove is greater than the designed side length of the stepped groove by 1 mil or more and 2 mil or less on a single side.

Preferably, the actual side length of the stepped groove is 1.1 mil or 1.2 mil or 1.3 mil or 1.4 mil or 1.5 mil or 1.6 mil or 1.7 mil or 1.8 mil or 1.9 mil larger than the designed side length of the stepped groove.

As a preferred technical solution, in step S30, the processing depth when removing the boss is smaller than the processing depth when creating the stepped groove in step S10 by 1.5 mil or more and 2.5 mil or less.

Preferably, the processing depth when the boss is removed is 1.6 mil or 1.7 mil or 1.8 mil or 1.9 mil or 2.0 mil or 2.1 mil or 2.2 mil or 2.3 mil or 2.4mil.

The beneficial effects of the present invention are: to provide a method for manufacturing a stepped groove of a PCB, which realizes electroplating a copper layer on a local area of the side wall of the stepped groove. In addition, a discontinuous electroplating layer can be formed on the side wall of the stepped groove by reserving a boss and removing the boss after electroplating. This method is simple, reliable, easy to apply and improves production efficiency.

Description of drawings

The present invention will be described in further detail below according to the drawings and embodiments.

Fig. 1 is the flowchart of the manufacturing method of the PCB step groove described in the embodiment;

Fig. 1A is the structural schematic view of forming a PCB by pressing the steps described in the embodiment;

Fig. 2A is a structural schematic diagram of opening a stepped groove and reserving a boss in the steps described in the embodiment;

Fig. 3A is a top view of opening a stepped groove and reserving a boss in the steps described in the embodiment;

Fig. 4A is the structural representation of the step electroplating copper described in the embodiment;

Fig. 5 A is the structural representation of the step electroplating tin described in the embodiment;

Fig. 6A is a structural schematic diagram of removing the boss in the step described in the embodiment;

Fig. 7A is the top view of removing the boss in the step described in the embodiment;

Figure 8A is a schematic structural view of spraying resist ink in the steps described in the embodiment;

Fig. 1B is another schematic structural view of forming a PCB by pressing the steps described in the embodiment;

Fig. 2B is another structural schematic diagram of opening a stepped groove and reserving a boss in the steps described in the embodiment;

Fig. 3B is another top view of opening a stepped groove and reserving a boss in the steps described in the embodiment;

Fig. 4B is another kind of structure schematic diagram of step electroplating copper described in the embodiment;

Fig. 5B is another kind of structural schematic diagram of electroplating tin in the step described in the embodiment;

Fig. 6B is another structural schematic diagram of removing the boss in the step described in the embodiment;

Fig. 7B is another top view of removing the boss in the step described in the embodiment;

Fig. 8B is another structural schematic diagram of spraying resist ink in the steps described in the embodiment.

In the picture:

1. Sub-board; 11. L1 layer; 12. L2 layer; 2. Step groove; 21. Boss; 3. Copper layer; 4. Tin layer; 5. Anti-corrosion ink; 6. Metal block.

Detailed ways

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

Embodiment one:

As shown in Figure 1, a method for manufacturing a PCB stepped groove includes the following steps:

S01, making an inner layer graphic on the sub-board 1;

S02, pressing several sub-boards 1 to form a PCB, as shown in FIG. 1A;

S10. Set up a stepped groove 2 on the PCB, and reserve a boss 21 at the non-copper-plated part of the side wall of the stepped groove 2, as shown in FIGS. 2A and 3A ;

S20, electroplating copper on the entire PCB, so that the side walls and bottom of the stepped groove 2 are covered with the copper layer 3, as shown in FIG. 4A;

S21, making an outer dry film on the PCB;

S22. Carry out graphic tin plating on the PCB, so that the side walls and bottom of the stepped groove 2 are covered with the tin layer 4, as shown in FIG. 5A ;

S30, removing the boss 21 in the stepped groove 2, so that the copper layer 3 covered on the surface of the boss 21 is removed synchronously, so that the side wall surface corresponding to the boss 21 is not covered by the copper layer 3, as shown in Figure 6A and as shown in 7A;

S40, spraying resist ink 5 on the bottom of the stepped groove 2 corresponding to the removed boss 21, so as to protect the exposed copper at the bottom of the stepped groove 2, as shown in FIG. 8A;

S50, etching the outer layer graphics on the PCB;

S60 , removing the tin layer 4 and the resist ink 5 .

Specifically, the present invention sets the boss 21 on the side wall area that does not require copper plating, and then removes the boss 21 after the overall copper plating, so that the side wall area corresponding to the boss 21 is free of copper plating, thereby realizing the stepped groove 2 The partial copper plating of the side wall of the method is simple and easy to implement, and can effectively save production costs and improve production efficiency.

In this embodiment, the stepped groove 2 is milled from the L1 layer 11 to the L2 layer 12 (that is, the milling process starts from the side of the L1 layer 11 until the medium between the L1 layer 11 and the L2 layer 12 is milled. The L2 layer and 12 circuit layers are reserved), and the inner layer film at the position of the 12 stepped grooves 2 of the L2 layer is laid with copper.

In this embodiment, in step S10 , the machining method for opening the stepped groove 2 is milling. In step S30, the processing method for removing the boss 21 is milling.

The horizontal section of the boss 21 is trapezoidal or rectangular or semicircular. In this embodiment, the horizontal section of the boss 21 is trapezoidal.

The outer dry film adopts any one of solvent-based dry film, water-soluble dry film and peel-off dry film. In this embodiment, the outer dry film is a solvent-based dry film.

In this embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2 . The width of the end of the boss 21 connected to the side wall is 1 mil larger than the required width of the non-copper plated part. The distance between the end of the boss 21 close to the side wall and the end of the boss 21 away from the side wall is 1.0 mm. In step S10 , the actual side length of the stepped groove 2 is 1 mil larger than the designed side length of the stepped groove 2 . In step S30, the processing depth when removing the boss 21 is 1.5 mil smaller than the processing depth when creating the stepped groove 2 in step S10.

Embodiment two:

As shown in Figure 1, a method for manufacturing a PCB stepped groove includes the following steps:

S01, making an inner layer graphic on the sub-board 1;

S02, pressing several sub-boards 1 to form a PCB, as shown in FIG. 1B;

S10, providing a stepped groove 2 on the PCB, and reserving a boss 21 at the non-copper-plated part of the side wall of the stepped groove 2, as shown in Figures 2B and 3B;

S20. Electroplate copper on the entire PCB, so that the side walls and bottom of the stepped groove 2 are covered with the copper layer 3, as shown in FIG. 4B;

S21, making an outer dry film on the PCB;

S22. Carry out graphic tin plating on the PCB, so that the sidewall and bottom of the stepped groove 2 are covered with the tin layer 4, as shown in FIG. 5B;

S30, remove the boss 21 in the stepped groove 2, so that the copper layer 3 covered on the surface of the boss 21 is removed synchronously, so that the side wall surface corresponding to the boss 21 is not covered by the copper layer 3, as shown in Figure 6B and as shown in 7B;

S40, spraying resist ink 5 on the bottom of the stepped groove 2 corresponding to the removed boss 21, so as to protect the exposed copper at the bottom of the stepped groove 2, as shown in FIG. 8B;

S50, etching the outer layer graphics on the PCB;

S60 , removing the tin layer 4 and the resist ink 5 .

Specifically, the present invention sets the boss 21 on the side wall area that does not require copper plating, and then removes the boss 21 after the overall copper plating, so that the side wall area corresponding to the boss 21 is free of copper plating, thereby realizing the stepped groove 2 The partial copper plating of the side wall of the method is simple and easy to implement, and can effectively save production costs and improve production efficiency.

In this embodiment, the stepped groove 2 is milled from the L1 layer 11 to the metal block 6 inside the PCB, that is, the milling process starts from the side of the L1 layer 11 until it reaches the metal block 6, so that the The bottom of the stepped groove 2 is located in the metal block 6 .

In this embodiment, in step S10 , the machining method for opening the stepped groove 2 is milling. In step S30, the processing method for removing the boss 21 is milling.

The horizontal section of the boss 21 is trapezoidal or rectangular or semicircular. In this embodiment, the horizontal section of the boss 21 is rectangular.

The outer dry film adopts any one of solvent-based dry film, water-soluble dry film and peel-off dry film. In this embodiment, the outer dry film is a water-soluble dry film.

In this embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2 . The width of the end of the boss 21 connected to the side wall is equal to the required width of the non-copper plated part. The distance between the end of the boss 21 close to the side wall and the end of the boss 21 away from the side wall is 1.9 mm. In step S10 , the actual side length of the stepped groove 2 is 2 mil larger than the designed side length of the stepped groove 2 . In step S30, the processing depth when removing the boss 21 is 2.5 mil smaller than the processing depth when creating the stepped groove 2 in step S10.

Embodiment three:

As shown in Figure 1, a method for manufacturing a PCB stepped groove includes the following steps:

S01, making an inner layer graphic on the sub-board 1;

S02, pressing several sub-boards 1 to form a PCB, as shown in FIG. 1A;

S10. Set up a stepped groove 2 on the PCB, and reserve a boss 21 at the non-copper-plated part of the side wall of the stepped groove 2, as shown in FIGS. 2A and 3A ;

S20, electroplating copper on the entire PCB, so that the side walls and bottom of the stepped groove 2 are covered with the copper layer 3, as shown in FIG. 4A;

S21, making an outer dry film on the PCB;

S22. Carry out graphic tin plating on the PCB, so that the side walls and bottom of the stepped groove 2 are covered with the tin layer 4, as shown in FIG. 5A ;

S30, removing the boss 21 in the stepped groove 2, so that the copper layer 3 covered on the surface of the boss 21 is removed synchronously, so that the side wall surface corresponding to the boss 21 is not covered by the copper layer 3, as shown in Figure 6A and as shown in 7A;

S40, spraying resist ink 5 on the bottom of the stepped groove 2 corresponding to the removed boss 21, so as to protect the exposed copper at the bottom of the stepped groove 2, as shown in FIG. 8A;

S50, etching the outer layer graphics on the PCB;

S60 , removing the tin layer 4 and the resist ink 5 .

Specifically, the present invention sets the boss 21 on the side wall area that does not require copper plating, and then removes the boss 21 after the overall copper plating, so that the side wall area corresponding to the boss 21 is free of copper plating, thereby realizing the stepped groove 2 The partial copper plating of the side wall of the method is simple and easy to implement, and can effectively save production costs and improve production efficiency.

In this embodiment, the stepped groove 2 is milled from the L1 layer 11 to the L2 layer 12 (that is, the milling process starts from the side of the L1 layer 11 until the medium between the L1 layer 11 and the L2 layer 12 is milled. The L2 layer and 12 circuit layers are reserved), and the inner layer film at the position of the 12 stepped grooves 2 of the L2 layer is laid with copper.

In this embodiment, in step S10 , the machining method for opening the stepped groove 2 is milling. In step S30, the processing method for removing the boss 21 is milling.

The horizontal section of the boss 21 is trapezoidal or rectangular or semicircular. In this embodiment, the horizontal section of the boss 21 is a semicircle.

The outer dry film adopts any one of solvent-based dry film, water-soluble dry film and peel-off dry film. In this embodiment, the outer dry film is a peel-off dry film.

In this embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2 . The width of the end of the boss 21 connected to the side wall is 2 mil larger than the required width of the non-copper plated part. The distance between the end of the boss 21 close to the side wall and the end of the boss 21 away from the side wall is 1.5 mm. In step S10 , the actual side length of the stepped groove 2 is 1.5 mil larger than the designed side length of the stepped groove 2 . In step S30, the processing depth when removing the boss 21 is 2.0 mil smaller than the processing depth when creating the stepped groove 2 in step S10.

It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the applied technical principles. Within the technical scope disclosed in the present invention, any changes or substitutions that are easily conceivable by those skilled in the art, All should be covered within the protection scope of the present invention.

Claims (10)

1. a kind of production method of PCB stepped grooves, which is characterized in that include the following steps：

S10, stepped groove is opened up on PCB, boss, the water of the boss are reserved at the non-copper facing position of the side wall of the stepped groove Plane section is trapezoidal either rectangle or semicircle；

S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper of the stepped groove；

Boss in S30, the removal stepped groove, enables the layers of copper that boss surface covers be synchronized removal, makes boss corresponding position Sidewall surfaces no copper layer covering.

2. a kind of production method of PCB stepped grooves according to claim 1, which is characterized in that in step S20 and step It is further comprising the steps of between S30：

S21, outer layer dry film is made on PCB；

S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers of the stepped groove.

3. a kind of production method of PCB stepped grooves according to claim 2, which is characterized in that after step S30, also Include the following steps：

S40, the position spraying etching resisting ink for having removed boss is corresponded to the bottom of the stepped groove, with the bottom to the stepped groove The dew copper in portion is protected.

4. a kind of production method of PCB stepped grooves according to claim 3, which is characterized in that after the step s 40, also Include the following steps：

S50, outer graphics are etched on PCB；

S60, the tin layers and the etching resisting ink are removed.

5. a kind of production method of PCB stepped grooves according to claim 1, which is characterized in that before step S10, also Include the following steps：

S01, inner figure is made on daughter board；

S02, several daughter boards are pressed to form PCB.

6. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that the boss Height be equal to the stepped groove depth.

7. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that the boss The width of the one end being connect with the side wall is not less than the requirement width at non-copper facing position.

8. a kind of production method of PCB stepped grooves according to claim 7, which is characterized in that the boss and the side The width of one end of wall connection is bigger 1mil or more 2mil or less than the requirement width at non-copper facing position.

9. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that in step In S10, unilateral big 1mil or more the 2mil or less of the design length of side of stepped groove described in the practical side ratio of the stepped groove.

10. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that in step In S30, working depth when removing the boss opens up the small 1.5mil or more of working depth when the stepped groove than step S10 2.5mil following.