CN105578840B - A kind of mobile terminal - Google Patents
A kind of mobile terminal Download PDFInfo
- Publication number
- CN105578840B CN105578840B CN201510466836.5A CN201510466836A CN105578840B CN 105578840 B CN105578840 B CN 105578840B CN 201510466836 A CN201510466836 A CN 201510466836A CN 105578840 B CN105578840 B CN 105578840B
- Authority
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- China
- Prior art keywords
- plate
- middle frame
- frame support
- mainboard
- mobile terminal
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Links
- 238000009434 installation Methods 0.000 claims description 10
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000005514 two-phase flow Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000012530 fluid Substances 0.000 abstract description 10
- 238000002309 gasification Methods 0.000 abstract description 4
- 206010037660 Pyrexia Diseases 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of mobile terminal, including shell, middle frame support and the mainboard for being provided with electronic component；Middle frame support includes the first plate and the second plate that arrangement is laminated, and the first plate and the second plate are metallic plate, and the edge of the two is fixedly connected, and is formed with vacuum cavity between；Vacuum cavity is provided with two phase fluid, and capillary structure is provided on the inner wall of vacuum cavity；Mainboard is connected with the first plate, and by the heat transfer that electronic component generates to the first plate, gasification, the liquefaction of diphasic liquids are carried out in vacuum chamber body-internal-circulation, can be transferred heat at the relatively low position of middle frame support temperature, be realized heat dissipation；It can play the role of structural support and heat dissipation two using one component of middle frame support, simplify terminal structure, and fever is fully relied on into hardware heat sink conception and is solved, temperature is controlled in the receptible range of user, not by the frequency and charging current of software control electronics, give full play to terminal capabilities.
Description
Technical field
The present invention relates to electronic product more particularly to a kind of mobile terminals.
Background technology
With the development of intelligent machine, CPU monokaryons, double-core are promoted to four cores, eight cores, and the frequency also the next high, mobile terminal hair
Heat is excessively high to increasingly become experience bottleneck, and current solution is to be attached in cell phone rear cover using natural, electrographite film
Side enhance heat diffusivity energy, reduce fuselage surface temperature, improve hot experience sense by.But in the technical solution, radiate membrane material
Generally can be at 3~8 DEG C using improving, temperature reduction is limited, and more improve needs software to dissipate CPU frequency reducings or charging current limiter etc.
Heat management measure is realized, but these measures can all reduce the performance of mobile phone, influence user experience.
Invention content
The technical problems to be solved by the invention are, provide a kind of mobile terminal, can effectively improve heat dissipation performance.
In order to solve the above-mentioned technical problem, the embodiment provides a kind of mobile terminal, including shell, center branch
Frame and the mainboard for being provided with electronic component；The middle frame support is fixed in the shell, and the mainboard is fixed on the center
Stent；
The middle frame support includes the first plate and the second plate that arrangement is laminated, and first plate and second plate are gold
Belong to plate, the edge of the two is fixedly connected, and is formed with vacuum cavity between；The vacuum cavity is provided with two-phase
Fluid is provided with capillary structure on the inner wall of the vacuum cavity；
The mainboard is connected with first plate, by the heat transfer that the electronic component generates to first plate
On, and pass through the middle frame support and radiate.
Wherein, the mainboard has installation plate face, and the electronic component is arranged in the installation plate face；The installing plate
Face and the outer surface of first plate are oppositely arranged；
On the outer surface of first plate storage tank is formed with recess at the corresponding position of the electronic component；It is described
Electronic component is located in the storage tank, and the electronic component is connected with the groove bottom of the storage tank.
Wherein, heat-conducting silicone grease is filled in the storage tank.
Wherein, at the storage tank, between being equipped between the inner surface of the inner surface of second plate and first plate
Away from first plate is connected with the capillary structure on the inner surface of both second plates.
Wherein, second plate is tabular.
Wherein, the edge of the middle frame support is provided with engaging lug, and the engaging lug is fixed with the shell to be connected
It connects.
Wherein, support column is provided in the vacuum cavity, the support column is supported on first plate and described second
Between plate；The middle frame support is provided with mounting hole, and the mounting hole is arranged at the position of the support column.
Wherein, the middle frame support is extended to outside the edge of the mainboard.
Wherein, the electronic component is located on mainboard at the side far from the middle frame support.
Wherein, the mobile terminal further includes the display screen component, the back side of the display screen component and described second
Plate is connected.
Mobile terminal provided in an embodiment of the present invention, middle frame support can play knot to the mainboard in terminal and other component
Structure supports and fixed function, convenient for the assembly connection of element each in terminal；Gasification, the liquefaction of diphasic liquids follow in vacuum cavity
Ring carries out, and the heat transfer that can generate electronic component is at the relatively low position of middle frame support temperature, in utilizing
Frame bracket radiates, and improves heat dissipation effect；Two works of structural support and heat dissipation can be played using one component of middle frame support
With, simplified terminal structure, and fever is fully relied on into hardware heat sink conception and is solved, temperature is controlled in the receptible range of user
It is interior, not by the frequency and charging current of software control electronics, terminal capabilities is given full play to, brings better use
It experiences at family.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the structure diagram for the mobile terminal that first embodiment of the invention provides；
Fig. 2 is sectional view at A-A in Fig. 1；
Fig. 3 is the structure diagram for the mobile terminal that second embodiment of the invention provides；
Fig. 4 is the structure diagram for the mobile terminal that third embodiment of the invention provides；
Fig. 5 is the thermal profile of the mobile terminal in Fig. 4；
Fig. 6 is the thermal profile of mobile terminal of the prior art.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes.
It is a kind of mobile terminal that first embodiment of the invention provides, including shell 1, middle frame support 2 referring to Fig. 1 and Fig. 2
And it is provided with the mainboard 3 of electronic component 4；Middle frame support 2 is fixedly connected with shell 1, and mainboard 3 is fixedly connected with middle frame support 2.
Middle frame support 2 can play structural support and fixed function to the mainboard 3 in terminal and other component, convenient for terminal
In each element assembly connection.Element of the electronic component 4 to generate heat on mainboard 3, such as CPU etc..Electronic component 4 can be
One, or multiple.
Middle frame support 2 includes the first plate 21 and the second plate that arrangement is laminated.First plate 21 and the second plate 22 are metallic plate,
Preferably, the first plate 21 and the second plate 22 are copper coin.First plate 21 is fixedly connected with the edge of both the second plates 22,
And it is formed with vacuum cavity 20 between.Vacuum cavity 20 is provided with two phase fluid (not shown), vacuum cavity 20
Inner wall on be provided with capillary structure 23.Capillary structure 23 can be silk screen capillary structure, porous foam metal capillary structure, pine
Divided powder is sintered any one of capillary structure to be formed etc..
Mainboard 3 is connected with the first plate 21, by the heat transfer that electronic component 4 generates to the first plate 21, and passes through
Frame bracket 2 radiates.After in the heat transfer to the first plate 21 of electronic component 4, after the two phase fluid in vacuum cavity 20 is heated
Start the gasification phenomenon generated, two phase fluid absorbs thermal energy and rapid spatial expansion at this time, and the fluid of gas phase is full of entire true
Cavity body 20 liquefies, and discharge heat when the fluid of gas phase touches a relatively low region of temperature, and liquefied fluid can lead to
Capillary structure 23 is crossed to return at the heat source i.e. position of electronic component 4.
The gasification of diphasic liquids, liquefaction cycle in vacuum cavity 20 carry out, and can pass the heat that electronic component 4 generates
It is delivered at the relatively low position of 2 temperature of middle frame support, so as to radiate using middle frame support 2, improves heat dissipation effect.It utilizes
2 one components of middle frame support can play the role of structural support and heat dissipation two, simplify terminal structure.Fever is fully relied on firmly
Part heat sink conception solves, and temperature is controlled in the receptible range of user, does not pass through the frequency of software control electronics such as CPU
With charging current, terminal capabilities is given full play to, bring better user experience.
Mainboard 3 has installation plate face 30, and electronic component 4 is arranged in installation plate face 30；30 and first plate 21 of plate face is installed
Outer surface be oppositely arranged.On the outer surface of first plate 21 storage tank is formed with recess at 4 corresponding position of electronic component
24；Electronic component 4 is located in storage tank 24, and electronic component 4 is connected with the groove bottom of storage tank 24.It can be with using storage tank 24
It is surrounded so that middle frame support 2 forms electronic component 4, heat absorption capacity can be enhanced, improve heat dissipation effect, while can be fully sharp
With the space around electronic component 4 so that it is compact-sized, conducive to the miniaturization of terminal.
It further, can be by electronics member using heat-conducting silicone grease filled with heat-conducting silicone grease (not shown) in storage tank 24
Part 4 coats so that the cell wall of storage tank 24 can also absorb the heat of electronic component 4, so as to improve heat transfer performance.Thermal conductive silicon
Fat can also fill the slight void between the groove bottom of electronic component 4 and storage tank 24, the conjugation of the two be improved, convenient for heat
Amount is transmitted, to improve heat dissipation effect.Herein, in other embodiments, thermal conductive silicon pad can also be set in storage tank 24, profit
Between being arranged on 4 and first plate 21 of electronic component with thermal conductive silicon pad, gap can also be filled, improves heat transfer performance.
At storage tank 24, spacing is equipped between the inner surface of the inner surface of the second plate 22 and the first plate 21, can be caused
There are certain space and two phase fluid and capillary structure 23 can be provided in the corresponding position of storage tank 24, conducive to two-phase flow
Body fully absorbs the heat of electronic component 4, to improve heat-sinking capability.In the corresponding position of storage tank 24, the first plate 21 and
Capillary structure 23 on the inner surface of both two plates 22 is connected so that the fluid on the second plate 22 can be entered in the first plate 21
At the position that storage tank 24 is corresponded on surface, heat transfer performance is improved.
Gap is equipped between the outer surface of installation 30 and first plate 21 of plate face.When carrying out assembling fastening, can utilize tight
Firmware is fastened and is reduced the distance between outer surface of installation 30 and first plate 21 of plate face, so that electronic component 4 is tight
The close groove bottom for being resisted against storage tank 24 improves the heat transfer performance between 4 and first plate 21 of electronic component.
Second plate 22 is tabular, and it is also tabular to make at its position in corresponding storage tank 24, may be such that the second plate 22
Outer surface generally plane, conducive to the mating connection of the second plate 22 and other component.
Further, mobile terminal further includes display screen component 5, and the back side of display screen component 5 is connected with the second plate 22, utilizes
Middle frame support 2 can be in order to the assembling of display screen component 5, while the heat that can be generated to display screen component 5 radiates.It is aobvious
Display screen component 5 is separately positioned on the both sides of middle frame support 2 with mainboard 3, can be convenient for assembly.
The edge of middle frame support 2 is provided with engaging lug 25, and engaging lug 25 is fixedly connected with shell 1.Pass through connection
Ear 25 can easily realize shell 1 and 2 assembly connection of middle frame support, such as can utilize screw by engaging lug 25 and shell 1
It is fixedly connected.Engaging lug 25 is extended to form by the edge of the first plate 21 and the second plate 22, i.e., engaging lug 25 is double-layer structure,
The structural strength of engaging lug 25 can be improved.Herein, in other embodiments, engaging lug 25 can also be only by the first plate 21
Edge is extended to form or is only extended to form by the edge of the second plate 22.
In the present embodiment, shell 1 is the frame of terminal, is provided with positioning region 11 on inner surface, positioning region 11 exists
It is stairstepping on the thickness direction of middle frame support 2, the engaging lug 25 of the edge of middle frame support 2 is resisted against the ladder of positioning region 11
On face, the edge of mainboard 3 is fixedly connected with shell 1, so as to which middle frame support 2 is pressed between positioning region 11 and mainboard 3, with side
Just the assembly connection of middle frame support 2, and without setting other connection structures in the centre of middle frame support 2, to avoid to true
Cavity body 20 damages.Herein, in other implementations, the edge of middle frame support 2 can not also set engaging lug
25, and directly the edge of middle frame support 2 is resisted against on the cascaded surface of positioning region 11.
Middle frame support 2 is extended to outside the edge of mainboard 3 so that the size of middle frame support 2 is larger with respect to mainboard 3, the first plate
21 outer surface is more than the installation plate face 30 of mainboard 3, so as to conduct heat at the position for being relatively distant from mainboard 3, keeps away
Exempt from heat and concentrate at the position of mainboard 3 to radiate, and then improve heat dissipation performance.
As shown in figure 3, in second embodiment provided by the invention, the overall structure and first embodiment of mobile terminal are big
Cause it is identical, the difference is that, connection structure and middle frame support 2a between middle frame support 2a and shell 1a and mainboard 3a it
Between connection structure.
Specifically, between middle frame support 2a and shell 1a, pass through screw and shell using the engaging lug 25a of middle frame support 2a
1a is directly fixedly connected.
Between middle frame support 2a and mainboard 3a, support column 27a is provided in vacuum cavity 20a, support column 27a is supported on
Between one plate 21a and the second plate 22a；Middle frame support 2a is provided with mounting hole, and mounting hole 26a is arranged on the position of support column 27a
Place.In the present embodiment, mounting hole 26a is threaded hole, and opening wears master on the outer surface of the first plate 21a by screw
Plate 3a is simultaneously threadedly coupled with mounting hole 26a, and middle frame support 2a is connect with mainboard 3a.Meanwhile it can be incited somebody to action using mounting hole 26a
Other component in mobile terminal is fixed on middle frame support 2a.
Mounting hole 26a is arranged at the position of support column 27a, it can be to avoid mounting hole 26a to the knot of middle frame support 2a
Structure intensity impacts, while avoids damaging the vacuum cavity 20a inside middle frame support 2a.
Herein, in other embodiments, mounting hole may be through-hole, wear mainboard 3a, center successively by screw
Stent 2a is simultaneously threadedly coupled with shell 1a, can realize the assembly connection between mainboard 3a, middle frame support 2a and shell 1a.
In the above two embodiments, the mounting surface of mainboard is set towards middle frame support, certainly, in other embodiments,
Can also be mainboard another side towards middle frame support set.As shown in figure 4, in third embodiment provided by the invention,
Mainboard 3b is connected with the first plate of middle frame support 2b, and electronic component 4b is located at the side far from middle frame support 2b on mainboard 3b.
The heat that electronic component 4b is generated can be transmitted on middle frame support 2b, then dissipated by middle frame support 2b by mainboard 3b
Heat.Thermal conductive silicon pad between mainboard 3b and middle frame support 2b can be set, the gap between mainboard 3b and middle frame support 2b can be filled,
Heat transfer performance therebetween is improved, while can be electrically connected to avoid mainboard 3b with middle frame support 2b and cause short circuit.
As shown in figure 5, on the mobile terminal provided for third embodiment of the invention middle frame support thermal profile, figure
The 6 heat distribution for middle frame support structure common under identical assembly method in the prior art, it is seen then that provided by the invention mobile whole
The heat distribution at end is comparatively uniform, is not concentrated on certain point, can effectively improve heat dissipation performance, reduces mobile terminal
Temperature.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (7)
1. a kind of mobile terminal, which is characterized in that including shell, middle frame support and the mainboard for being provided with electronic component；In described
Frame bracket is fixed in the shell, and the mainboard is fixed on the middle frame support；
The middle frame support includes the first plate and the second plate that arrangement is laminated, and first plate and second plate are metal
Plate, the edge of the two is fixedly connected, and is formed with vacuum cavity between；The vacuum cavity is provided with two-phase flow
Body is provided with capillary structure on the inner wall of the vacuum cavity；
The mainboard is connected with first plate, by the heat transfer that the electronic component generates to first plate, and
It is radiated by the middle frame support；
The mainboard has installation plate face, and the electronic component is arranged in the installation plate face；It is described installation plate face with it is described
The outer surface of first plate is oppositely arranged, and is equipped with gap therebetween；
On the outer surface of first plate storage tank is formed with recess at the corresponding position of the electronic component；The electronics
Element is located in the storage tank, and the electronic component is connected with the groove bottom of the storage tank；
At the storage tank, it is equipped with spacing between the inner surface of the inner surface of second plate and first plate, described the
One plate is connected with the capillary structure on the inner surface of both second plates.
2. mobile terminal according to claim 1, which is characterized in that heat-conducting silicone grease is filled in the storage tank.
3. mobile terminal according to claim 1, which is characterized in that second plate is tabular.
4. mobile terminal according to claim 1, which is characterized in that the edge of the middle frame support is provided with company
Lug, the engaging lug are fixedly connected with the shell.
5. mobile terminal according to claim 1, which is characterized in that support column is provided in the vacuum cavity, it is described
Support column is supported between first plate and second plate；The middle frame support is provided with mounting hole, and the mounting hole is set
It puts at the position of the support column.
6. mobile terminal according to claim 5, which is characterized in that the middle frame support extends to the edge of the mainboard
Outside.
7. according to claim 1-6 any one of them mobile terminals, which is characterized in that the mobile terminal further includes display screen
Component, the back side of the display screen component are connected with second plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466836.5A CN105578840B (en) | 2015-07-31 | 2015-07-31 | A kind of mobile terminal |
| PCT/CN2015/091342 WO2017020419A1 (en) | 2015-07-31 | 2015-09-30 | Mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466836.5A CN105578840B (en) | 2015-07-31 | 2015-07-31 | A kind of mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578840A CN105578840A (en) | 2016-05-11 |
| CN105578840B true CN105578840B (en) | 2018-06-15 |
Family
ID=55888330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510466836.5A Active CN105578840B (en) | 2015-07-31 | 2015-07-31 | A kind of mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105578840B (en) |
| WO (1) | WO2017020419A1 (en) |
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| CN106027708A (en) * | 2016-07-25 | 2016-10-12 | 深圳天珑无线科技有限公司 | Mobile phone |
| CN106131254A (en) * | 2016-07-25 | 2016-11-16 | 深圳天珑无线科技有限公司 | A kind of mobile phone |
| CN106647022A (en) * | 2016-12-01 | 2017-05-10 | 深圳市华星光电技术有限公司 | Heat dissipation structure of backlight module, backlight module, liquid crystal display module and television set |
| CN106993396A (en) * | 2017-05-16 | 2017-07-28 | 奇酷互联网络科技（深圳）有限公司 | A kind of anti-shielding construction of mobile phone and cell phone mainboard |
| CN109565114B (en) * | 2017-07-06 | 2020-08-04 | 株式会社村田制作所 | Electronic device |
| CN107509381B (en) * | 2017-09-15 | 2019-11-15 | 维沃移动通信有限公司 | Manufacturing method of shielding cover, shielding cover and mobile terminal |
| CN208370081U (en) * | 2018-04-17 | 2019-01-11 | 南昌黑鲨科技有限公司 | A kind of radiating component and intelligent terminal |
| CN108833646B (en) * | 2018-04-25 | 2020-10-02 | 维沃移动通信有限公司 | a protective cover |
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| CN109673136A (en) * | 2018-12-29 | 2019-04-23 | 深圳市鸿富诚屏蔽材料有限公司 | Structure, heat dissipation center or heat dissipation rear shell and manufacturing method for radiate center or the rear shell that radiates |
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| CN111356345A (en) * | 2020-04-08 | 2020-06-30 | 江苏精研科技股份有限公司 | Mobile phone middle frame |
| CN114138083A (en) * | 2020-09-04 | 2022-03-04 | 宇瞻科技股份有限公司 | Liquid medium heat sink |
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| CN113905565B (en) * | 2021-10-18 | 2023-11-10 | Oppo广东移动通信有限公司 | Shell, shell assembly and electronic equipment |
| CN114126355B (en) * | 2021-11-02 | 2023-02-28 | 武汉华星光电半导体显示技术有限公司 | Folding display device |
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Also Published As
| Publication number | Publication date |
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| WO2017020419A1 (en) | 2017-02-09 |
| CN105578840A (en) | 2016-05-11 |
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