CN105645752B - Method for cutting brittle material substrate - Google Patents
Method for cutting brittle material substrate Download PDFInfo
- Publication number
- CN105645752B CN105645752B CN201510689784.8A CN201510689784A CN105645752B CN 105645752 B CN105645752 B CN 105645752B CN 201510689784 A CN201510689784 A CN 201510689784A CN 105645752 B CN105645752 B CN 105645752B
- Authority
- CN
- China
- Prior art keywords
- cutting
- brittle material
- material substrate
- groove
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 123
- 238000005520 cutting process Methods 0.000 title claims abstract description 78
- 239000000463 material Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 40
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 description 18
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Landscapes
- Chemical & Material Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
Abstract
The present invention relates to a method and apparatus for cutting a brittle material substrate. When cutting a glass substrate, when forming a plurality of scribe lines with a narrow pitch or intersection, the processing quality is inhibited from being reduced. The method comprises a first step and a second step. In the first step, a groove for cutting is formed along a line to cut while a scribing wheel is moved while being pressed against the surface of the glass substrate with a predetermined load. The second step is to apply a cutting force to the cutting groove formed in the first step to cut the glass substrate. The pressing load of the scribing wheel against the glass substrate in the first step is a load of such a magnitude that no rib is generated when the groove is formed in the first step and a vertical crack is formed right below the groove.
Description
Technical Field
The present invention relates to a method for cutting a brittle material substrate, and more particularly to a method for cutting a brittle material substrate along a line to cut. The present invention also relates to a processing apparatus for a brittle material substrate.
Background
In a process of manufacturing a liquid crystal display panel, after forming crossing scribe lines on a mother substrate, a cutting force is applied to the mother substrate to cut the mother substrate along the scribe lines into a plurality of unit substrates.
For forming a scribe line on a mother substrate, for example, methods such as those described in patent documents 1 and 2 are used. In the methods shown in these documents, first, a scribe line is formed on the surface of a glass substrate using a scribe wheel. Thereafter, a cutting force is applied to the glass substrate, thereby cutting the glass substrate along the scribe line.
In particular, in patent document 2, the processing is performed so that a rib-like ridge is present in a scribe line (cutting groove). Generally, a rib is formed right below the groove, and a vertical crack extends from a front end of the rib in a thickness direction of the substrate. By forming the rib-like pattern on the scribe line, the mother substrate can be cut with a relatively small force.
[ background Art document ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2012-6780
[ patent document 2] Japanese patent application laid-open No. 2008-308380
Disclosure of Invention
[ problems to be solved by the invention ]
As shown in patent document 2, in the case of cutting a glass substrate, when forming a cutting groove, a scribing wheel is pressed against the glass substrate with a relatively large pressing load in such a manner that a rib is formed. This makes it possible to form a deep crack in the thickness direction of the glass substrate, and to cut the glass substrate satisfactorily without causing a lateral crack when cutting.
However, in recent years, it has been required to cut very small unit substrates from a mother substrate. In this case, it is necessary to form a plurality of scribe lines at a narrow pitch or to perform cross scribing at a narrow pitch. In such a situation, stress generated by the scribe line formed first may adversely affect the scribe line formed later. Specifically, the surface at the portion where the scribe lines intersect has a problem of deterioration in quality (horizontal cracks, chips, peeling, burrs, etc.) or a problem of deterioration in processing quality such as the cut end face becoming non-perpendicular.
The invention aims to prevent the processing quality from being reduced when a brittle material substrate such as a glass substrate is cut by forming a plurality of scribing lines or forming cross scribing at a narrow pitch.
[ means for solving problems ]
A method for cutting a brittle material substrate according to an aspect of the present invention is a method for cutting a brittle material substrate along a line to cut, and includes a first step and a second step. The first step is to move a cutter blade while pressing the cutter blade against the surface of the brittle material substrate with a predetermined load, thereby forming a groove for cutting along a line to cut. The second step is to apply a cutting force to the cutting groove formed in the first step to cut the brittle material substrate. In the first step, the pressing load of the cutter blade against the brittle material substrate is a load of such a magnitude that no rib is generated when the groove is formed in the first step and a vertical crack is formed right below the groove.
Here, the pressing load of the cutter blade against the brittle material substrate is set to be relatively small, and the cutter blade is moved, whereby the cutting groove is formed along the line to cut the surface of the brittle material substrate. By forming the cutting groove in this manner, stress is less likely to accumulate inside the brittle material substrate along the groove. Therefore, when another groove is formed close to the cutting groove formed first or a crossing groove is formed, chipping is less likely to occur. For the same reason, the verticality of the end face of the brittle material substrate obtained after cutting is improved.
In the present invention, the "rib-like pattern" means a pattern formed in the thickness direction of the substrate, in which a plurality of curved (rib-like) lines extending in the thickness direction of the substrate on the end surface (cut surface) of the substrate are continuously observed in the cutting direction below a plastic deformation region formed by pressing and moving a dicing blade against the surface of the substrate. A vertical crack was formed in the thickness direction of the substrate, in which no curved streaks were observed from the leading end of the rib (the end on the inner side of the substrate).
In another aspect of the present invention, in the method for cutting a brittle material substrate, in the first step, the dicing blade is pressed against the brittle material substrate with a load of 10N or less and 1N or more.
By pressing the cutter blade against the brittle material substrate with such a small pressing load, a groove and a vertical crack necessary for cutting can be formed without generating a rib in the brittle material substrate.
In a method for cutting a brittle material substrate according to still another aspect of the present invention, in the first step, the dicing blade is pressed against the brittle material substrate with a load of 6N or less and 1N or more.
Here, the groove and the vertical crack required for cutting can be formed more reliably without generating the rib-like grain inside the brittle material substrate.
In a method for cutting a brittle material substrate according to still another aspect of the present invention, in the first step, a groove including a plastically deformed region having a depth from a surface of 3% or more and 15% or less of a thickness of the substrate is formed on a glass substrate having a thickness of 0.1mm or more and 1mm or less.
Here, the depth of the plastic deformation region formed in the first step is shallow as compared with the conventional processing method. Therefore, the stress accumulated in the brittle material substrate during the processing in the first step can be reduced, and the degradation of the processing quality can be suppressed.
In the method for cutting a brittle material substrate according to still another aspect of the present invention, in the second step, the cutting groove formed in the first step is directed downward to support both sides of the groove on the surface of the brittle material substrate, or the entire surface of the brittle material substrate is supported by an elastic body (for example, an elastic sheet such as a rubber sheet laid on a table made of a hard material such as metal or ceramic), and the rear surface of the brittle material substrate in the portion where the groove is formed is pressed from above to cut the brittle material substrate.
By this cutting method, the verticality of the cut end face of the brittle material substrate obtained after cutting can be improved.
In a method for cutting a brittle material substrate according to still another aspect of the present invention, the brittle material substrate is glass.
In one aspect of the present invention, a processing apparatus for a brittle material substrate forms a groove for cutting and a vertical crack on a surface of the brittle material substrate along a line to cut. The device comprises a platform for placing the brittle material substrate, a cutter for cutting the brittle material substrate, a cutter pressing mechanism, and a moving mechanism. The cutter is arranged above the platform in a freely lifting manner. The cutter pressing mechanism presses the cutter against the surface of the brittle material substrate with a specific load. The moving mechanism relatively moves the cutter and the table along the line to cut, and forms a groove for cutting on the brittle material substrate. The cutter pressing mechanism presses the cutter against the brittle material substrate with a load of a magnitude that does not cause rib-like lines in the cutting groove and that forms a vertical crack directly below the groove (inside the substrate).
In another aspect of the present invention, the cutting blade is a scribing wheel having an outer peripheral edge portion formed by intersecting bottom portions of two truncated cones sharing a rotation axis to form a circumferential ridge line. The scoring wheel has a plurality of notches and protrusions formed alternately in the circumferential direction along the circumferential ridge line.
In the apparatus for processing a brittle material substrate according to still another aspect of the present invention, the notch of the scribing wheel is formed at a pitch of 10 μm or more and 50 μm or less (preferably 10 μm or more and 40 μm or less) along the entire circumference of the circumferential ridge line. The depth of the notch is 0.5 to 5.0 μm (preferably 1.0 to 3.0 μm).
In addition, there are a type in which the length of the notch in the circumferential direction is shorter than the length of the protrusion in the circumferential direction and a type in which the length of the notch in the circumferential direction is longer than the length of the protrusion in the circumferential direction, and in a type in which the length of the notch in the circumferential direction is relatively shorter than the length of the protrusion in the circumferential direction, the vertical crack tends to be formed relatively deeply, and in a type in which the length of the notch in the circumferential direction is assumed to be longer than the length of the protrusion in the circumferential direction, the strength of the end face of the substrate after cutting tends to be relatively high.
[ Effect of the invention ]
In the present invention, when cutting a brittle material substrate, particularly when a plurality of cutting grooves (scribe lines) are formed at a narrow pitch or when intersecting grooves (scribe lines) are formed (intersection scribing), it is possible to suppress a reduction in processing quality.
Drawings
Fig. 1 is a schematic configuration diagram of a machining apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of a scoring wheel according to one embodiment of the present invention.
FIG. 3 is a front view of the scoring wheel.
Fig. 4 is a partially enlarged view of fig. 3.
Fig. 5 is a schematic diagram showing a cutting step.
Fig. 6 is a photomicrograph showing a comparison between the cutting method according to the embodiment of the present invention and a conventional cutting method.
Detailed Description
[ scribing apparatus ]
Fig. 1 shows an apparatus for forming a cutting groove in a glass substrate (an example of a brittle material substrate). The scribing apparatus 1 includes a stage 2, a scribing wheel 3, a pressing mechanism 4, and a moving mechanism 5.
The stage 2 is used for placing a glass substrate G, and the glass substrate G placed thereon is fixed by a vacuum adsorption member. The platform 2 is capable of horizontal rotation.
The scoring wheel 3 is mounted on a scoring head 10. The scribing wheel 3 rolls while being pressed against the glass substrate G, and a cutting groove and a vertical crack are formed in the glass substrate G. As shown in fig. 2 and 3, the scribing wheel 3 includes: an outer peripheral edge portion 3b which forms a circumferential ridge line 3a by intersecting bottom portions of two truncated cones C sharing the rotation axis R; and a plurality of notches 3c and projections 3d formed in the circumferential direction along the circumferential ridge line 3 a. Further, a through hole 3e is formed in the center of the scribing wheel 3.
As shown in fig. 4 in an enlarged scale, the notches 3c of the scribing wheel 3 are formed at a pitch P of 10 μm or more and 50 μm or less (preferably 10 μm or more and 40 μm or less) along the entire circumference of the circumferential ridge line 3 a. The depth h of the notch 3c is preferably 0.5 μm or more and 5.0 μm or less (particularly preferably 1.0 μm or more and 3.0 μm or less). In the scribing wheel shown in fig. 4, the length a in the circumferential direction of the notch 3c is formed shorter than the length b in the circumferential direction of the protrusion 3 d.
The pressing mechanism 4 includes, for example, an air cylinder or an oil cylinder, and is provided in the scribing head 10. The pressing mechanism 4 can adjust the pressing load of the scribing wheel 3 on the glass substrate G. A servo motor can also be used as the pressing mechanism 4.
The moving mechanism 5 is a mechanism for relatively moving the stage 2 and the scribing head 10 in the X direction and the Y direction. The X direction is the left-right direction in fig. 1, and the Y direction is a direction perpendicular to the X direction and perpendicular to the paper surface in fig. 1.
The moving mechanism 5 includes a pair of guide rails 15, a ball screw 16, a guide rod 17, and a motor 18. The pair of guide rails 15 extend in the Y direction and are arranged parallel to each other, and support the stage 2 so as to be movable in the Y direction. The ball screw 16 moves the platform 2 along a pair of guide rails 15. The guide bar 17 is erected above the stage 2 in the X direction. The guide rod 17 is provided with a scribing head 10 slidably in the X direction. The motor 18 slides the scribing head 10 along the guide bar 17. Further, a pair of CCD (Charge Coupled Device) cameras 19 for recognizing alignment marks of the glass substrate G formed on the stage 2 are disposed above the guide bar 17.
[ method of cutting glass substrate ]
Here, as an example, a method of obtaining a plurality of unit substrates by forming cutting grooves intersecting in the X and Y directions in a mother substrate and cutting the mother substrate along the cutting grooves will be described.
First, a glass substrate G to be a mother substrate is placed on the stage 2. The alignment mark formed on the glass substrate G is observed by the CCD camera 19, and the position of the glass substrate G on the stage 2 is adjusted.
Next, the scribing head 10 is moved to the scribing start position by the moving mechanism 5, and further, the scribing wheel 3 is pressed against the surface of the glass substrate G with a specific load by the pressing mechanism 4. The pressing load at this time is set to a load at which no rib is formed in the glass substrate G when the cutting groove is formed, and a vertical crack is formed right below the groove. In this example, the scribing start position is a position from the edge of the glass substrate G to the inside.
Then, the moving mechanism 5 is driven to move the glass substrate G or the stage 2 along, for example, a plurality of lines to cut in the X direction. If the process of forming the groove along the plurality of lines to cut in the X direction is finished, the groove is formed similarly in the plurality of lines to cut in the Y direction. In this example, each scribing end position is a position from the edge of the glass substrate G to the inside, similarly to the start position.
After the cutting grooves are formed along all the lines to be cut in the above manner, the glass substrate is placed on the cutting table 22 with the surface of the glass substrate on the side where the cutting grooves L are formed facing downward, as shown in fig. 5. Then, a specific cutting force F is applied to the upper side, that is, the surface opposite to the surface on which the cutting groove L is formed. Thereby, the glass substrate G is cut along the cutting groove L.
[ Experimental example ]
Fig. 6 shows an experimental example using the method according to an embodiment of the present invention and a conventional method. The "low permeability scoring" in fig. 6 represents a method according to an embodiment of the invention and the "general scoring" represents a prior art method.
< Condition >
The experimental conditions are as follows.
(1) Glass substrate
Low penetration scoring and typical scoring are as follows.
The material is as follows: alkali-free glass
Thickness: 0.5mm
(2) Load is pressed to the scribing wheel
Low-permeability scoring: 3N
Generally, the following steps are performed: 16N
(3) Spacing of the lines (Cross ruling)
Low penetration scoring and typical scoring were both 3mm
The processing was carried out under the above conditions, and the results were as follows.
< result of step for forming cutting groove >
In low permeation scribing, the depth of the plastic deformation region (groove) formed by the scribing wheel 3 was 10 μm, and under the plastic deformation region, a vertical crack was formed just below, and no rib was observed. The vertical cracks extend from the surface of the substrate to a depth of 25 μm.
In typical scoring, ribbing is observed below the groove formed by the scoring wheel 3. In addition, the vertical cracks extend deeper down from the ribs. If the observation surface and the intersection portion are enlarged, chipping, particularly chipping, does not occur in the intersection portion in low-permeation scribing, but debris occurs in the intersection portion in general scribing.
< result of the cutting step >
If the "perpendicularity of separation" of the cut end face is observed, it is known that: in low-permeability scribing, cutting is performed substantially vertically, but in general scribing, a portion near the upper surface is cut obliquely, and cutting is not performed vertically.
[ conclusion ]
From the above experimental results, it is understood that the following conditions are preferable in order to suppress the deterioration of the cutting process quality.
The pressing load of the scribing wheel is preferably 10N or less and 1N or more, and more preferably 6N or less and 1N or more.
(2) The glass substrate having a thickness of 0.1mm to 1.0mm is preferably subjected to a pressing load of a depth from the surface of the glass substrate to a degree of a plastic deformation region of 3% to 15% of the thickness of the substrate. In this case, the rib is not generated, and the vertical crack is formed just below the plastic deformation region, so that the cutting can be easily performed in the cutting step.
[ other embodiments ]
The present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the scope of the present invention.
In the described embodiment, a scoring wheel is used as the scoring cutter, but other cutters may be used. The specification of the scribing wheel is not limited to the above embodiment.
The brittle material substrate is described by taking a glass substrate as an example, but the brittle material substrate to be the object of the present invention is not limited to a glass substrate.
[ description of symbols ]
1 scribing device
2 platform
3 scribing wheel
4 pressing mechanism
5 moving mechanism
Claims (4)
1. A method for cutting a brittle material substrate along a line to cut, the method comprising:
a first step of moving a cutter blade while pressing the cutter blade against the surface of a brittle material substrate with a specific load, and forming a crossing groove for cutting along a line to cut; and
a second step of applying a cutting force to the cutting groove formed in the first step to cut the brittle material substrate; and is
The pressing load of the cutting knife on the brittle material substrate in the first step is a load which does not generate rib-like lines when the groove is formed in the first step and forms a vertical crack right below the groove;
in the first step, pressing the cutting knife against the brittle material substrate with a load of less than 10N and more than 1N;
the thickness of the brittle material substrate is more than 0.1mm and less than 1.0 mm;
the brittle material substrate is glass.
2. The method for cutting a brittle material substrate according to claim 1, wherein in the first step, the cutting blade is pressed against the brittle material substrate with a load of 6N or less and 1N or more.
3. The method for cutting a brittle material substrate according to claim 1 or 2, wherein in the first step, a groove including a plastically deformed region having a depth from a surface of 3% or more and 15% or less of a substrate thickness is formed on the brittle material substrate.
4. A method for cutting a brittle material substrate according to claim 1 or 2, wherein in the second step, the cutting groove formed in the first step is directed downward to support both sides of the groove on the surface of the brittle material substrate, or the entire surface of the brittle material substrate is supported by an elastic body, and the rear surface of the brittle material substrate in a portion where the groove is formed is pressed from above to cut the brittle material substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014243746A JP6507600B2 (en) | 2014-12-02 | 2014-12-02 | Method and apparatus for dividing brittle material substrate |
| JP2014-243746 | 2014-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105645752A CN105645752A (en) | 2016-06-08 |
| CN105645752B true CN105645752B (en) | 2021-06-22 |
Family
ID=56121843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510689784.8A Active CN105645752B (en) | 2014-12-02 | 2015-10-22 | Method for cutting brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6507600B2 (en) |
| KR (1) | KR102443753B1 (en) |
| CN (1) | CN105645752B (en) |
| TW (1) | TWI666182B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101826235B1 (en) * | 2016-08-05 | 2018-02-06 | 한국미쯔보시다이아몬드공업(주) | Method for dividing glass substrate inducing time difference |
| JP2020083690A (en) | 2018-11-22 | 2020-06-04 | 三星ダイヤモンド工業株式会社 | Method of dividing laminated substrate |
| CN113997433B (en) * | 2021-11-05 | 2023-09-29 | 贵州工程应用技术学院 | Square socket grooving machine and use method thereof |
| JP2023128345A (en) * | 2022-03-03 | 2023-09-14 | 日東電工株式会社 | Brittle material chip, brittle material sheet, method for manufacturing brittle material sheet and method for manufacturing brittle material chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101657388A (en) * | 2007-04-12 | 2010-02-24 | 三星钻石工业股份有限公司 | Scribing device and method |
| CN102285009A (en) * | 2005-07-06 | 2011-12-21 | 三星钻石工业股份有限公司 | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same |
| JP2012030992A (en) * | 2010-07-29 | 2012-02-16 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel, scribing device, and scribing method |
| CN103601361A (en) * | 2013-11-06 | 2014-02-26 | 深圳市华星光电技术有限公司 | Cutting device for cutting liquid crystal substrate, and cutter pressure debugging method of cutting device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2904089B2 (en) * | 1995-01-30 | 1999-06-14 | 双葉電子工業株式会社 | Substrate cutting device |
| JP2005247599A (en) * | 2004-03-01 | 2005-09-15 | Nec Machinery Corp | Method for cutting flat glass and apparatus for cutting flat glass |
| JP2007039302A (en) * | 2005-08-05 | 2007-02-15 | Matsushita Electric Ind Co Ltd | Glass substrate cleaving method and glass substrate cleaving apparatus |
| JP4730345B2 (en) * | 2007-06-18 | 2011-07-20 | ソニー株式会社 | Display device having glass substrate pair and cutting method thereof |
| JP2009234874A (en) * | 2008-03-28 | 2009-10-15 | Shiba Giken:Kk | Cutter wheel and method for manufacturing the same |
| JP5538090B2 (en) | 2010-06-23 | 2014-07-02 | 株式会社ジャパンディスプレイ | Glass cutter |
-
2014
- 2014-12-02 JP JP2014243746A patent/JP6507600B2/en active Active
-
2015
- 2015-10-06 TW TW104132858A patent/TWI666182B/en active
- 2015-10-22 CN CN201510689784.8A patent/CN105645752B/en active Active
- 2015-10-23 KR KR1020150147808A patent/KR102443753B1/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102285009A (en) * | 2005-07-06 | 2011-12-21 | 三星钻石工业股份有限公司 | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same |
| CN101657388A (en) * | 2007-04-12 | 2010-02-24 | 三星钻石工业股份有限公司 | Scribing device and method |
| JP2012030992A (en) * | 2010-07-29 | 2012-02-16 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel, scribing device, and scribing method |
| CN103601361A (en) * | 2013-11-06 | 2014-02-26 | 深圳市华星光电技术有限公司 | Cutting device for cutting liquid crystal substrate, and cutter pressure debugging method of cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6507600B2 (en) | 2019-05-08 |
| JP2016108158A (en) | 2016-06-20 |
| CN105645752A (en) | 2016-06-08 |
| TW201623170A (en) | 2016-07-01 |
| TWI666182B (en) | 2019-07-21 |
| KR102443753B1 (en) | 2022-09-19 |
| KR20160066492A (en) | 2016-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8029879B2 (en) | Display device having pair of glass substrates and method for cutting it | |
| US11084752B2 (en) | Method for breaking out a sheet of glass | |
| TWI432387B (en) | Processing method and processing device for brittle material substrate | |
| CN105645752B (en) | Method for cutting brittle material substrate | |
| CN102264516B (en) | Scribing device and scribing method | |
| US20110138986A1 (en) | Cutter wheel, manufcturing method for same, manual scribing tool and scribing device | |
| JP2009208237A (en) | Scribing device and its method | |
| TW201240783A (en) | Cutter and method for cutting brittle material substrate using same | |
| TW201315557A (en) | Mother substrate splitting method | |
| JP6332618B2 (en) | Scribing cutter wheel and scribing device | |
| JP2003292332A (en) | Scribing method and scribing device | |
| JP6481465B2 (en) | Breaking method of composite substrate | |
| TWI586234B (en) | Disassembly Method and Scribing Device of Laminated Ceramic Substrate | |
| CN111438442A (en) | Method and apparatus for dividing SiC substrate | |
| TWI619588B (en) | Fracture method and device for brittle material substrate | |
| TW201623173A (en) | Scribe line forming method and scribe line forming device | |
| TWI774883B (en) | Scribing method and scribing device for bonding substrates | |
| EA034120B1 (en) | Method for manufacturing sheets of glass of complex shape | |
| KR102412482B1 (en) | Machining method | |
| TW201707910A (en) | Apparatus and method of cutting a non-metallic material by using a roller | |
| JP2014104736A (en) | Method for dividing ceramic substrate, and scribing device | |
| JP3856236B2 (en) | Processed plate and manufacturing method thereof, product plate manufacturing method, and V-cut processing apparatus | |
| KR101648010B1 (en) | Scribing method | |
| KR20150037482A (en) | Method and apparatus for breaking brittle material substrate | |
| KR20200112655A (en) | BREAKING APPARATUS and BREAKING METHOD for BRITTLE MATERIAL SUBSTRATE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |