CN105658023B - Intelligent wearable device heat dissipation structure - Google Patents
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- 230000017525 heat dissipation Effects 0.000 title abstract description 37
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- 239000000463 material Substances 0.000 claims description 5
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- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
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- 230000008020 evaporation Effects 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 3
- 239000004634 thermosetting polymer Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
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- 230000005494 condensation Effects 0.000 description 1
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- 238000011082 depyrogenation Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及一种智能型穿戴装置散热结构,尤其涉及一种针对智能型穿戴装置进行解热的智能型穿戴装置散热结构。The present invention relates to a heat dissipation structure of an intelligent wearable device, in particular to a heat dissipation structure for an intelligent wearable device for depyrogenation.
背景技术Background technique
随着科技的日新月异,现行的便携式移动设备除了手机、平板外亦扩及至穿戴式装置,诸如:手表、项链、戒子亦成为具有多功能的智能型移动设备,并随着使用需求亦加入触控荧幕及卫星定位及运动感测或医疗监测等电子元件,且该智能型手表除了可与其他移动设备通过蓝牙或网络进行连线使用外,也可插入SIN卡进行3G或4G网络使用以及通话或照相及录像等功能,因此当智能型手表于运作执行时会产生热量,此外由于智能型手表为达到防尘或防水或保护的条件下,其整体结构被设计为封闭状态,因此内部的电子元件所产生的热量无法散溢至外界进行散热,而积热于该手表或装置内部,进而造成该智能型手表产生执行作业延迟或停顿或严重者甚而当机或等缺失,并且传统热管或均温板等散热元件并无法弯折则无法延伸置入表带的部分,故无法将这些传统散热元件应用于智能型手表的散热使用,如何对该智能型手表及各项穿戴式的型动装置进行解热为现行最优先解决的课题。With the rapid development of technology, the current portable mobile devices have expanded to wearable devices in addition to mobile phones and tablets, such as: watches, necklaces, and rings have also become smart mobile devices with multiple functions, and touch Electronic components such as screen control, satellite positioning, motion sensing or medical monitoring, and the smart watch can not only connect with other mobile devices through Bluetooth or the Internet, but also insert a SIN card for 3G or 4G network use and Call or camera and video functions, so when the smart watch is running, it will generate heat. In addition, because the overall structure of the smart watch is designed to be closed in order to achieve dustproof or waterproof or protection conditions, the internal The heat generated by the electronic components cannot be dissipated to the outside for heat dissipation, but the heat accumulates inside the watch or the device, which causes the smart watch to be delayed or paused in the execution of operations, or even crashed or lost in severe cases, and traditional heat pipes or Heat dissipation elements such as vapor chambers cannot be bent and cannot be extended into the strap. Therefore, these traditional heat dissipation elements cannot be applied to the heat dissipation of smart watches. How to make smart watches and various wearable sports The heat dissipation of the device is currently the top priority to solve.
发明内容Contents of the invention
因此,为有效解决上述问题,本发明的主要目的在于提供一种有效解决智能型穿戴装置内部积热问题的智能型穿戴装置散热结构。Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation structure of a smart wearable device that can effectively solve the heat accumulation problem inside the smart wearable device.
为达上述目的本发明提供一种智能型穿戴装置散热结构,包括:一穿戴式移动设备本体,具有一容置空间并容设有多个电子元件,这些电子元件具有至少一发热源;一硬式穿戴体,所述硬式穿戴体为热固式高分子材质或热 塑式高分子材质其中任一,并具有一腔室,该腔室具有一毛细结构及一工作液体,该硬式穿戴体定义一吸热部及至少一散热部,所述散热部由该吸热部至少一端或两端延伸所构形,该硬式穿戴体连接前述穿戴式移动设备本体,并由所述吸热部恰与该电子元件或发热源其中任一接触传导热量。To achieve the above object, the present invention provides a heat dissipation structure for an intelligent wearable device, comprising: a body of a wearable mobile device, which has an accommodating space and accommodates a plurality of electronic components, and these electronic components have at least one heat source; Wearing body, the hard wearing body is any one of thermosetting polymer material or thermoplastic polymer material, and has a chamber, the chamber has a capillary structure and a working liquid, the hard wearing body defines a A heat-absorbing part and at least one heat-dissipating part, the heat-dissipating part is configured by extending at least one or both ends of the heat-absorbing part. Any contact between electronic components or heat sources conducts heat.
所述毛细结构为网格体或纤维体或金属线材编织体或烧结粉末体其中任一。The capillary structure is any one of grid body, fiber body, metal wire braided body or sintered powder body.
该电子元件为电路机板或晶体管或CPU或MCU或GPU或RAM或电池其中任一。The electronic component is any one of circuit board or transistor or CPU or MCU or GPU or RAM or battery.
所述腔室壁面具有一镀层。The wall of the chamber has a coating.
所述吸热部嵌设一热传良导体,并该热传良导体一侧相对于这些电子元件或发热源贴设,所述热传良导体另一侧相对前述硬式穿戴体的腔室,并所述毛细结构设置于该热传良导体表面。A good heat transfer conductor is embedded in the heat absorbing part, and one side of the good heat transfer conductor is attached to these electronic components or heat sources, and the other side of the good heat transfer conductor is opposite to the cavity of the aforementioned hard wearable body, And the capillary structure is arranged on the surface of the good heat transfer conductor.
所述硬式穿戴体的吸热部较该硬式穿戴体其他部位厚度薄,并该吸热部局部与该电子元件或发热源接触。The heat absorbing part of the hard wearing body is thinner than other parts of the hard wearing body, and the heat absorbing part is partially in contact with the electronic component or heat source.
更具有至少一导热元件,所述导热元件为热管或均温板或石墨片其中任一,并该导热元件设于前述电子元件与该硬式穿戴体之间。It further has at least one heat conduction element, the heat conduction element is any one of heat pipe, vapor chamber or graphite sheet, and the heat conduction element is arranged between the aforementioned electronic element and the hard wearing body.
通过本发明智能型穿戴装置散热结构可大幅增加智能型穿戴装置的散热效能。Through the heat dissipation structure of the smart wearable device of the present invention, the heat dissipation efficiency of the smart wearable device can be greatly increased.
附图说明Description of drawings
图1为本发明的智能型穿戴装置散热结构的第一实施例的立体分解图;FIG. 1 is a three-dimensional exploded view of the first embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图2为本发明的智能型穿戴装置散热结构的第一实施例的组合剖视图;2 is a combined sectional view of the first embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图3为本发明的智能型穿戴装置散热结构的第一实施例的组合局部剖视图;Fig. 3 is a combined partial cross-sectional view of the first embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图4为本发明的智能型穿戴装置散热结构的第二实施例的立体分解图;Fig. 4 is a three-dimensional exploded view of the second embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图5为本发明的智能型穿戴装置散热结构的第二实施例的组合局部剖视图;5 is a combined partial cross-sectional view of the second embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图6为本发明的智能型穿戴装置散热结构的第三实施例的组合剖视图;6 is a combined sectional view of the third embodiment of the heat dissipation structure of the smart wearable device of the present invention;
图7为本发明的智能型穿戴装置散热结构的第四实施例的组合剖视图。FIG. 7 is a combined cross-sectional view of the fourth embodiment of the heat dissipation structure of the smart wearable device of the present invention.
符号说明Symbol Description
智能型穿戴装置散热结构 1Heat dissipation structure of smart wearable device 1
穿戴式移动设备本体 11Wearable mobile device body 11
硬式穿戴体 12Hardwear 12
容置空间 111Storage space 111
电子元件 112Electronic components 112
发热源 1121Heat source 1121
腔室 121chamber 121
吸热部 122Heat sink 122
热传良导体 122aGood conductor of heat transfer 122a
毛细结构 123capillary structure 123
散热部 124Heat sink 124
工作液体 2working fluid 2
导热元件 3Thermal element 3
镀层 4Plating 4
具体实施方式Detailed ways
下面将参照图面,详解本发明的实施例:Below with reference to drawing, explain the embodiment of the present invention in detail:
本发明的上述目的及其结构与功能上的特性,将依据所附图的较佳实施例予以说明。The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
请参阅图1、2、3,为本发明的智能型穿戴装置散热结构的第一实施例的立体分解及组合图剖视及局部剖视图,如图所示,本发明智能型穿戴装置散热结构1,包括:一穿戴式移动设备本体11、一硬式穿戴体12;Please refer to Figures 1, 2, and 3, which are three-dimensional exploded and combined view sectional views and partial sectional views of the first embodiment of the intelligent wearable device heat dissipation structure of the present invention. As shown in the figure, the intelligent wearable device heat dissipation structure 1 of the present invention , including: a wearable mobile device body 11, a hard wearable body 12;
所述穿戴式移动设备本体11具有一容置空间111并容设有多个电子元件 112,这些电子元件112具有至少一发热源1121。The wearable mobile device body 11 has an accommodating space 111 and accommodates a plurality of electronic components 112, and these electronic components 112 have at least one heat source 1121.
该硬式穿戴体12为热固式高分子材质或热塑式高分子材质其中任一,并具有一腔室121,该腔室121具有一毛细结构123及一工作液体2,The hard wearable body 12 is any one of thermosetting polymer material or thermoplastic polymer material, and has a cavity 121, and the cavity 121 has a capillary structure 123 and a working fluid 2,
该硬式穿戴体12定义一吸热部122及一散热部124,所述散热部124由所述吸热部122至少一端或两端延伸所构形。该硬式穿戴体12连接前述穿戴式移动设备本体11。The hard wearing body 12 defines a heat absorbing portion 122 and a heat dissipation portion 124 , and the heat dissipation portion 124 is configured by extending at least one end or both ends of the heat absorbing portion 122 . The hard wearing body 12 is connected to the aforementioned wearable mobile device body 11 .
由所述吸热部122与等该电子元件112或发热源1121其中任一接触传导热量;所述硬式穿戴体12为热固式高分子材质或热塑式高分子材质其中任一。Heat is conducted through the contact between the heat absorbing portion 122 and any one of the electronic component 112 or the heat source 1121 ; the hard wearable body 12 is made of thermosetting polymer material or thermoplastic polymer material.
所述硬式穿戴体12的吸热部122较该硬式穿戴体12其他部位的厚度薄,并该吸热部122局部与该电子元件112或发热源1121直接接触。The heat absorbing portion 122 of the hard wearing body 12 is thinner than other parts of the hard wearing body 12 , and the heat absorbing portion 122 is partially in direct contact with the electronic component 112 or the heat source 1121 .
本实施例主要通过在硬式穿戴体12内部设置一可作为汽液循环的腔室121,并通过该吸热部122将穿戴式移动设备本体11内部的电子元件112或发热源1121所产生的热量进一步传导至吸热部122处内部的腔室121内进行热交换,并令腔室121内部的工作流体2受热后产生蒸发汽化后于该腔室121内扩散,并于该散热部124处内的腔室冷却后产生冷凝为液态的工作流体2通过腔室121内所设置的毛细结构123回流至该吸热部122周围再次进行汽液循环,借此将热量传递至远端进行散热而不产生积热。In this embodiment, a chamber 121 that can be used as a vapor-liquid circulation is provided inside the hard wearable body 12, and the heat generated by the electronic components 112 or the heat source 1121 inside the wearable mobile device body 11 is absorbed by the heat absorbing portion 122. It is further conducted to the chamber 121 inside the heat absorbing part 122 for heat exchange, and the working fluid 2 inside the chamber 121 is heated to produce evaporation and vaporization, and then diffuses in the chamber 121, and then spreads in the heat dissipation part 124. After the chamber is cooled, the working fluid 2 that condenses into a liquid state flows back around the heat absorbing part 122 through the capillary structure 123 provided in the chamber 121 to perform vapor-liquid circulation again, thereby transferring heat to the remote end for heat dissipation without Build up heat.
请参阅图4、5,为本发明的智能型穿戴装置散热结构的第二实施例的立体分解及组合局部剖视图,如图所示,本实施例部分结构技术特征与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例的差异在于,所述吸热部122嵌设一热传良导体122a,并该热传良导体122a一侧相对于这些电子元件112或发热源1121贴设,所述热传良导体122a另一侧相对前述硬式穿戴体12的腔室121,并所述毛细结构123设置于该热传良导体122a表面。Please refer to Figures 4 and 5, which are three-dimensional exploded and combined partial cross-sectional views of the second embodiment of the heat dissipation structure of the smart wearable device of the present invention. No more details will be given here, but the difference between this embodiment and the aforementioned first embodiment is that a heat-conducting conductor 122a is embedded in the heat-absorbing portion 122, and one side of the heat-conducting conductor 122a is opposite to these electronic components. 112 or heat source 1121, the other side of the good heat transfer conductor 122a is opposite to the chamber 121 of the aforementioned rigid wearable body 12, and the capillary structure 123 is arranged on the surface of the good heat transfer conductor 122a.
本实施例主要通过嵌设于该吸热部122的热传良导体122a裸露于该硬式 穿戴体12腔室121外部的部位可直接与该穿戴式移动设备本体11内部的电子元件112或发热源1121接触并传导热量,并通过该热传良导体122a相对该腔室121内部的部位对该腔室121内部的工作流体2加热产生蒸发汽化,受蒸发后的工作流体2于该腔室121进行扩散,并于散热部124处的腔室冷却后冷凝成液态通过该毛细结构123回流至该热传良导体122a周围附近再次进行汽液循环,借此将热量传递至远端进行散热而不产生积热并达到提升穿戴式移动设备本体11的整体散热效能。In this embodiment, the part exposed outside the chamber 121 of the hard wearable body 12 through the good heat conduction conductor 122a embedded in the heat absorbing portion 122 can directly connect with the electronic components 112 or the heat source inside the body 11 of the wearable mobile device. 1121 contacts and conducts heat, and heats the working fluid 2 inside the chamber 121 through the heat transfer conductor 122a relative to the inside of the chamber 121 to generate evaporation and vaporization, and the evaporated working fluid 2 is carried out in the chamber 121 Diffusion, and condensed into a liquid state after the cooling of the cavity at the heat dissipation part 124, and then flow back to the vicinity of the heat-conducting good conductor 122a through the capillary structure 123 to perform vapor-liquid circulation again, thereby transferring heat to the far end for heat dissipation without generating heat. The heat is accumulated to improve the overall heat dissipation performance of the body 11 of the wearable mobile device.
请参阅图6,为本发明的智能型穿戴装置散热结构的第三实施例的组合剖视图,如图所示,本实施例部分结构技术特征与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例的差异在于,本实施例更具有一导热元件3,所述导热元件3为热管或均温板或石墨片或金属件其中任一,本实施例为均温板作为说明实施例但并不引以为限,所述均温板为一种大面积及面与面的热量传导,故可通过该均温板相对应设置与至少一发热源1121或多个发热源1121同时收集并吸附热量,其后,再通过均温板进一步将热量传导至硬式穿戴体12的吸热部122及散热部124(如图1所示)进行热传导(蒸发汽化及冷却冷凝)的工作,借此有效提升提高穿戴式移动设备本体11的整体散热效能。Please refer to FIG. 6, which is a combined cross-sectional view of the third embodiment of the heat dissipation structure of the smart wearable device of the present invention. As shown in the figure, some structural technical features of this embodiment are the same as those of the first embodiment described above, so they will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that this embodiment further has a heat conduction element 3, and the heat conduction element 3 is any one of a heat pipe, a vapor chamber, a graphite sheet or a metal piece, and this embodiment is The vapor chamber is used as an illustrative example but is not limited thereto. The vapor chamber is a large-area and surface-to-surface heat conduction, so the vapor chamber can be set correspondingly with at least one heat source 1121 or A plurality of heat sources 1121 collect and absorb heat at the same time, and then further conduct heat to the heat absorbing portion 122 and the heat dissipation portion 124 (as shown in FIG. 1 ) of the hard wearable body 12 through the vapor chamber for heat conduction (evaporation and evaporation) cooling and condensation), thereby effectively improving the overall heat dissipation performance of the body 11 of the wearable mobile device.
请参阅图7,为本发明的智能型穿戴装置散热结构的第四实施例的组合剖视图,如图所示,本实施例部分结构技术特征系与前述第一实施例相同故在此将不再赘述,惟本实施例与前述第一实施例的差异在于,本实施例更具有一镀层4,并该镀层4附着于该硬式穿戴体12的腔室121与壁面之间。Please refer to FIG. 7, which is a combined cross-sectional view of the fourth embodiment of the heat dissipation structure of the smart wearable device of the present invention. As shown in the figure, some structural and technical features of this embodiment are the same as those of the aforementioned first embodiment, so they will not be repeated here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that this embodiment further has a coating 4 , and the coating 4 is attached between the chamber 121 and the wall of the hard wearing body 12 .
前述第一~四实施例中所述毛细结构123为网格体或纤维体或金属线材编织体或烧结粉末体其中任一;这些电子元件112系为电路机板或晶体管或CPU或MCU或GPU或RAM或电池其中任一。The capillary structure 123 described in the foregoing first to fourth embodiments is any one of the grid body or fiber body or metal wire braid or sintered powder body; these electronic components 112 are circuit boards or transistors or CPUs or MCUs or GPUs or RAM or battery any.
尽管本发明的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用,它完全可以被适用于各种适合本发明的领域,对于 熟悉本领域的人员而言,可容易地实现另外的修改,因此在不背离权利要求及等同范围所限定的一般概念下,本发明并不限于特定的细节和这里示出与描述的图例。Although the embodiment of the present invention has been disclosed as above, it is not limited to the use listed in the specification and implementation, it can be applied to various fields suitable for the present invention, and it can be easily understood by those skilled in the art Therefore, the invention is not limited to the specific details and examples shown and described herein without departing from the general concept defined by the claims and their equivalents.
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| CN105658023A (en) | 2016-06-08 |
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