CN105679715B - Lying thermistor with foot rest - Google Patents
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- CN105679715B CN105679715B CN201410655467.XA CN201410655467A CN105679715B CN 105679715 B CN105679715 B CN 105679715B CN 201410655467 A CN201410655467 A CN 201410655467A CN 105679715 B CN105679715 B CN 105679715B
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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Abstract
本发明是一具有脚架的平躺热敏电阻，具有一芯片本体、设置于该芯片本体两相对表面的二电极、二L型脚架及设置于该芯片本体两相对侧边的二端电极，该二L型脚架设置于该芯片本体的两相对侧边，而该二L型脚架分别具有一与该芯片本体表面垂直的第一片部及一与该芯片本体表面平行的第二片部，该二L型脚架的二第一片部分别与该二端电极电连接，该二L型脚架的二第二片部则供焊接至一电路板。该具有脚架的平躺热敏电阻不仅利用该二L脚架垫高该芯片本体以增加散热效率，且能有效地利用二L脚架稳固固定该芯片本体，使该芯片本体不易受外力而改变位置。通过本发明可有效使热敏电阻所占立体空间缩小且结构简单，能利用自动打件方式焊接，节省制作成本。
The present invention is a flat thermistor with a stand, which has a chip body, two electrodes arranged on two opposite surfaces of the chip body, two L-shaped stands and two end electrodes arranged on two opposite sides of the chip body. The two L-shaped stands are arranged on two opposite sides of the chip body, and the two L-shaped stands respectively have a first sheet portion perpendicular to the surface of the chip body and a second sheet portion parallel to the surface of the chip body. The two first sheets of the two L-shaped stands are respectively electrically connected to the two end electrodes, and the two second sheets of the two L-shaped stands are provided for welding to a circuit board. The flat thermistor with a stand not only uses the two L stands to raise the chip body to increase the heat dissipation efficiency, but also can effectively use the two L stands to firmly fix the chip body, so that the chip body is not easily changed in position by external force. The present invention can effectively reduce the three-dimensional space occupied by the thermistor and simplify the structure, and can be welded by automatic welding to save production costs.
Description
技术领域technical field
本发明是一种热敏电阻，尤指一种具有脚架的平躺热敏电阻。The invention relates to a thermistor, especially a flat-lying thermistor with a tripod.
背景技术Background technique
请参阅图6所示，现有的热敏电阻30采用直立式设计，其具有一本体31及两个引脚32。该本体31是一圆形片体，该两个引脚32是由与该本体31表面平行的方向向外延伸而构成。当该热敏电阻30焊接至一电路板40时，将该两个引脚32插入该电路板40的焊接孔41中，以与该电路板40焊接。但现有采用直立式设计的热敏电阻30于焊接致电路板40时，因为该两个引脚32与该本体31平行，且垂直于该电路板40，造成该本体31的高度占用了较大的立体空间，因此现有采直立式设计的热敏电阻30并无法适用于轻薄型的产品中。Please refer to FIG. 6 , the conventional thermistor 30 adopts a vertical design, which has a body 31 and two pins 32 . The body 31 is a circular piece, and the two pins 32 are formed by extending outward in a direction parallel to the surface of the body 31 . When the thermistor 30 is soldered to a circuit board 40 , the two pins 32 are inserted into the soldering holes 41 of the circuit board 40 to be soldered to the circuit board 40 . But when the current thermistor 30 adopting vertical design is soldered to the circuit board 40, because the two pins 32 are parallel to the body 31 and perpendicular to the circuit board 40, the height of the body 31 takes up a relatively large amount. Due to the large three-dimensional space, the existing vertical thermistor 30 cannot be applied to thin and light products.
请参阅图7所示，为了改善该热敏电阻30组装于该电路板40时，占用较大立体空间的问题，另有一设计是将该热敏电阻30的两个引脚32弯折，使该本体31表面与该电路板40表面平行，令该热敏电阻30的本体31更为贴近该电路板40表面，以降低该热敏电阻30焊接至该电路板40后该本体31的高度，使该热敏电阻30于该电路板40上占用较小的立体空间，以缩小该电路板40的体积。Please refer to FIG. 7 , in order to improve the problem that the thermistor 30 occupies a large three-dimensional space when it is assembled on the circuit board 40, another design is to bend the two pins 32 of the thermistor 30 so that The surface of the body 31 is parallel to the surface of the circuit board 40, so that the body 31 of the thermistor 30 is closer to the surface of the circuit board 40, so as to reduce the height of the body 31 after the thermistor 30 is welded to the circuit board 40, The thermistor 30 occupies a smaller three-dimensional space on the circuit board 40 to reduce the volume of the circuit board 40 .
但将该热敏电阻30的两个引脚32弯折的设计，仅利用该两个引脚32的挠性，将该本体31弯折后维持不动，因此，容易受到其他外力(如晃动或推挤)造成该本体31移动。此外，该热敏电阻30的两个引脚32均位于该热敏电阻30的本体31的相同侧边，于组装至该电路板40时，该热敏电阻30的本体31仅受到单边的支撑，造成组装不稳固。此外，该热敏电阻30于组装至该电路板40时，因为其结构无法采用自动打件的方式焊接，必须通过人工插件进行焊接，然而采用人工插件的方式会让制造成本提高But the design of bending the two pins 32 of the thermistor 30 only utilizes the flexibility of the two pins 32 to keep the body 31 still after bending, so it is easy to be subjected to other external forces (such as shaking or pushing) causes the body 31 to move. In addition, the two pins 32 of the thermistor 30 are located on the same side of the body 31 of the thermistor 30. When assembled to the circuit board 40, the body 31 of the thermistor 30 is only subjected to unilateral pressure. support, causing the assembly to be unstable. In addition, when the thermistor 30 is assembled to the circuit board 40, because its structure cannot be welded by automatic welding, it must be welded by manual insertion, but the manual insertion will increase the manufacturing cost.
当该热敏电阻30的作用是抑制通电瞬间的浪涌电流时，因为通电瞬间该本体31的温度会提高到数百摄氏度的高温，而该热敏电阻30与该电路板40的热膨胀系数不同，当温度提高时会因为膨胀系数的差异产生应力，使得该热敏电阻30破裂，影响使用寿命。且该热敏电阻30于稳态运作时，其工作温度约为90～160℃，长期高温状态下会使该电路板40碳化，影响该电路板40上其余电子元件的可靠度。因此，故现有技术的热敏电阻30势必要做进一步的改良。When the function of the thermistor 30 is to suppress the surge current at the moment of power-on, because the temperature of the body 31 will increase to a high temperature of hundreds of degrees Celsius at the moment of power-on, and the coefficient of thermal expansion of the thermistor 30 and the circuit board 40 is different , when the temperature increases, stress will be generated due to the difference in expansion coefficient, which will cause the thermistor 30 to crack and affect the service life. Moreover, when the thermistor 30 operates in a steady state, its operating temperature is about 90-160° C., and the circuit board 40 will be carbonized in a long-term high temperature state, affecting the reliability of other electronic components on the circuit board 40 . Therefore, the thermistor 30 in the prior art must be further improved.
发明内容Contents of the invention
本发明的主要目的提供一种具有脚架的平躺热敏电阻，用以克服现有的直立式热敏电阻占用立体空间太大，以及组装不稳固的缺点。The main purpose of the present invention is to provide a flat-lying thermistor with a tripod, which is used to overcome the disadvantages of the existing upright thermistor which occupy too much space and are unstable in assembly.
本发明的技术方案是提供一种具有脚架的平躺热敏电阻，包含有：The technical solution of the present invention is to provide a flat-lying thermistor with a tripod, including:
一芯片本体，具有平行且相对的一第一表面与一第二表面；a chip body having a first surface and a second surface parallel and opposite;
一第一电极，设置于该芯片本体的第一表面；a first electrode disposed on the first surface of the chip body;
一第二电极，设置于该芯片本体的第二表面；a second electrode disposed on the second surface of the chip body;
一第一端电极及一第二端电极，分别形成于该芯片本体的相对两侧边，其中该第一端电极电连接该第一电极，该第二端电极电连接该第二电极；A first terminal electrode and a second terminal electrode are respectively formed on opposite sides of the chip body, wherein the first terminal electrode is electrically connected to the first electrode, and the second terminal electrode is electrically connected to the second electrode;
一第一脚架，为L形片体，且包含有相互垂直的一第一片部及一第二片部，该第一片部与该第一表面垂直，并电连接该第一端电极，该第二片部与该第二表面平行，并与该第二表面维持一间距；及A first tripod, which is an L-shaped sheet body, and includes a first sheet portion and a second sheet portion perpendicular to each other, the first sheet portion is perpendicular to the first surface, and is electrically connected to the first terminal electrode , the second piece is parallel to the second surface and maintains a distance from the second surface; and
一第二脚架，为L型片体，且包含有相互垂直的一第一片部及一第二片部，该第二脚架的第一片部与该第二表面垂直，并电连接该第二端电极，该第二脚架的第二片部与该第二表面平行，并与该第二表面维持该间距；A second tripod is an L-shaped piece, and includes a first piece and a second piece perpendicular to each other, the first piece of the second foot is perpendicular to the second surface, and is electrically connected The second terminal electrode, the second piece of the second leg is parallel to the second surface, and maintains the distance from the second surface;
其中该第一脚架的第二片部与该第二脚架的第二片部位于该芯片本体的相同侧。Wherein the second piece of the first leg and the second piece of the second leg are located on the same side of the chip body.
该具有脚架的平躺热敏电阻是通过该第一脚架及该第二脚架的第二片部平贴焊接于一电路板的焊垫上，令该电路板能通过该第一脚架及该第二脚架分别与该第一、第二电极电连接，连通该芯片本体。然该具有脚架的平躺热敏电阻的第一脚架及该第二脚架的第二片部与该芯片本体的第一、第二表面平行，且该第二片部平贴焊接于该电路板的焊垫上，故芯片本体与该电路板平行，如此一来，不仅能节省该具有脚架的平躺热敏电阻占用的立体体积，且利用第一脚架及该第二脚架设置于该芯片本体相对的两侧边，以共同支撑该芯片本体，增加该具有脚架的平躺热敏电阻的固定强度，令其不容易受到其他外力(如晃动或推挤)造成该芯片本体移动而改变位置，能稳固地组装于该电路板上。此外，该具有脚架的平躺热敏电阻的结构简单，能通过该第一脚架及该第二脚架的第二片部与该电路板的焊垫利用自动打件方式焊接，以节省制造成本。且该脚架具有高度，以垫高该芯片本体，使该芯片本体与该电路板之间存有该间距，使空气流通，提高散热效率。The flat-lying thermistor with a tripod is flatly welded on the welding pad of a circuit board through the second part of the first tripod and the second tripod, so that the circuit board can pass through the first tripod and the second leg are respectively electrically connected to the first and second electrodes, and connected to the chip body. However, the second piece of the first foot and the second foot of the flat thermistor with a foot is parallel to the first and second surfaces of the chip body, and the second piece is welded flat on the On the welding pad of the circuit board, the chip body is parallel to the circuit board. In this way, not only can save the three-dimensional volume occupied by the flat-lying thermistor with a tripod, but also use the first tripod and the second tripod It is arranged on opposite sides of the chip body to jointly support the chip body and increase the fixing strength of the flat-lying thermistor with a tripod, so that it is not easy to be damaged by other external forces (such as shaking or pushing). The body moves to change its position, and can be firmly assembled on the circuit board. In addition, the flat-lying thermistor with a tripod has a simple structure, and can be welded with the welding pad of the circuit board through the second part of the first tripod and the second tripod by automatic punching, so as to save manufacturing cost. Moreover, the tripod has a height to raise the chip body, so that there is the distance between the chip body and the circuit board, so that air can circulate and heat dissipation efficiency can be improved.
附图说明Description of drawings
图1为本发明第一较佳实施例的侧视剖面图。Fig. 1 is a side sectional view of the first preferred embodiment of the present invention.
图2为本发明第一较佳实施例的立体外观图。Fig. 2 is a three-dimensional appearance view of the first preferred embodiment of the present invention.
图3为本发明第二较佳实施例的立体外观图。Fig. 3 is a perspective view of a second preferred embodiment of the present invention.
图4为本发明第二较佳实施例覆盖有绝缘层的立体外观图。FIG. 4 is a perspective view of a second preferred embodiment of the present invention covered with an insulating layer.
图5为本发明第二较佳实施例覆盖有绝缘层的侧视剖面图。5 is a side cross-sectional view of a second preferred embodiment of the present invention covered with an insulating layer.
图6为现有直立式热敏电阻的立体外观图。Fig. 6 is a perspective view of a conventional vertical thermistor.
图7为现有直立式热敏电阻弯折后的立体外观图。FIG. 7 is a three-dimensional appearance view of a conventional vertical thermistor after being bent.
主要元件符号说明：Description of main component symbols:
10 该具有脚架的平躺热敏电阻 11 芯片本体10 The flat-laying thermistor with tripod 11 Chip body
111 第一表面 112 第二表面111 First surface 112 Second surface
12 第一电极 13 第二电极12 First electrode 13 Second electrode
14 第一脚架 141 第一片部14 The first leg 141 The first piece
142 第二片部 143 第一缺口142 Second Part 143 First Notch
144 第二缺口 15 第二脚架144 Second notch 15 Second stand
151 第一片部 152 第二片部151 Part 1 152 Part 2
153 第一缺口 154 第二缺口153 First gap 154 Second gap
16 第一端电极 17 第二端电极16 First terminal electrode 17 Second terminal electrode
18 绝缘层 20 电路板18 insulating layer 20 circuit board
21 焊垫 30 热敏电阻21 Solder pad 30 Thermistor
31 本体 32 引脚31 Body 32 Pins
40 电路板 41 焊接孔40 Circuit board 41 Solder holes
具体实施方式Detailed ways
以下配合图式及本发明较佳实施例，进一步阐述本发明为达成预定发明目的所采取的技术手段。The technical means adopted by the present invention to achieve the intended invention purpose are further described below in conjunction with the drawings and preferred embodiments of the present invention.
请参阅图1及图2所示，本发明为一具有脚架的平躺热敏电阻10。该具有脚架的平躺热敏电阻10包含有一芯片本体11、一第一电极12、一第二电极13、一第一脚架14、一第二脚架15、一第一端电极16及一第二端电极17。Please refer to FIG. 1 and FIG. 2 , the present invention is a flat thermistor 10 with a stand. The flat-lying thermistor 10 with a tripod includes a chip body 11, a first electrode 12, a second electrode 13, a first tripod 14, a second tripod 15, a first end electrode 16 and A second terminal electrode 17 .
该芯片本体11是一片体，并具有相互平行且相对的一第一表面111及一第二表面112。该第一电极12设置于该芯片本体11的第一表面111，而该第二电极13则设置于该芯片本体11的第二表面112。该第一端电极16与该第二端电极17分别形成于该芯片本体11的两个相对侧边，且该第一端电极16电连接该第一电极12，而该第二端电极17电连接该第二电极。The chip body 11 is a piece, and has a first surface 111 and a second surface 112 parallel to and opposite to each other. The first electrode 12 is disposed on the first surface 111 of the chip body 11 , and the second electrode 13 is disposed on the second surface 112 of the chip body 11 . The first terminal electrode 16 and the second terminal electrode 17 are respectively formed on two opposite sides of the chip body 11, and the first terminal electrode 16 is electrically connected to the first electrode 12, and the second terminal electrode 17 is electrically connected. Connect the second electrode.
该第一脚架14为L型片体，包含有相互垂直的一第一片部141及一第二片部142。该第一片部141与该第一表面111垂直，并与该第一端电极16电连接。该第二片部142与该第二表面112平行，且与该第二表面112维持一间距H。The first leg 14 is an L-shaped piece, including a first piece 141 and a second piece 142 perpendicular to each other. The first piece 141 is perpendicular to the first surface 111 and electrically connected to the first terminal electrode 16 . The second sheet portion 142 is parallel to the second surface 112 and maintains a distance H from the second surface 112 .
该第二脚架15为L型片体，包含有相互垂直的一第一片部151及一第二片部152。该第一片部151与该第二表面112垂直，并与该第二端电极17电连接。该第二片部152与该第二表面112平行，且与该第二表面112维持该间距H。该第一脚架14的第二片部142与该第二脚架15的第二片部152均位于该芯片本体11的相同侧。The second stand 15 is an L-shaped piece, including a first piece 151 and a second piece 152 perpendicular to each other. The first piece 151 is perpendicular to the second surface 112 and electrically connected to the second terminal electrode 17 . The second piece 152 is parallel to the second surface 112 and maintains the distance H from the second surface 112 . The second piece 142 of the first leg 14 and the second piece 152 of the second leg 15 are located on the same side of the chip body 11 .
当该具有脚架的平躺热敏电阻10焊接至一电路板20上时，通过该第一脚架14的第二片部142与该第二脚架15的第二片部152与该电路板20上的焊垫21焊接，以电连接至该电路板20。该第一脚架14及该第二脚架15的第二片部142、152与该芯片本体11的第一、第二表面111、112平行，且该两个第二片部142、152平贴焊接于该电路板20的焊垫21上，故芯片本体11与该电路板20平行，如此一来，便能节省该具有脚架的平躺热敏电阻10于该电路板20上占用的立体体积。且该具有脚架的平躺热敏电阻10的结构简单，能通过该第一脚架14及该第二脚架15的第二片部142、152与该电路板20的焊垫21利用自动打件方式焊接，以节省制造成本。When the flat-lying thermistor 10 with a tripod is welded to a circuit board 20, the second sheet 142 of the first tripod 14 and the second sheet 152 of the second tripod 15 are connected to the circuit The pads 21 on the board 20 are soldered to be electrically connected to the circuit board 20 . The second pieces 142, 152 of the first leg 14 and the second leg 15 are parallel to the first and second surfaces 111, 112 of the chip body 11, and the two second pieces 142, 152 are flat. Paste and weld on the welding pad 21 of the circuit board 20, so the chip body 11 is parallel to the circuit board 20. In this way, the space occupied by the flat-lying thermistor 10 with a tripod on the circuit board 20 can be saved. three-dimensional volume. And the structure of this flat-lying thermistor 10 with tripod is simple, can utilize automatic Welding by punching to save manufacturing cost.
因为该第一脚架14及该第二脚架15设置于该芯片本体11的两侧边，由该芯片本体11的两侧边共同支撑该芯片本体11，可避免因外力导致该芯片本体11的位置改变，令其不容易受到其他外力(如晃动或推挤)造成该芯片本体11移动而改变位置，能稳固地组装于该电路板20上。Because the first leg 14 and the second leg 15 are arranged on the two sides of the chip body 11, the chip body 11 is jointly supported by the two sides of the chip body 11, which can prevent the chip body 11 from being damaged due to external force. The position of the chip body 11 is changed so that it is not easily affected by other external forces (such as shaking or pushing) to cause the chip body 11 to move and change its position, and can be firmly assembled on the circuit board 20 .
此外，该第一、第二脚架14、15的第二片部142、152均位于该芯片本体11的相同侧，且该第一脚架14的第二片部142与该第二脚架15的第二片部152与该第一、第二表面111、112平行，并与该第二表面112具有该间距H，当该具有脚架的平躺热敏电阻10焊接至该电路板20时，便可令该芯片本体11的第二表面112与该电路板20的间保持该间距H，以吸收因膨胀系数的差异而于热胀冷缩时产生的应力，同时可保持空气流通，提供良好的散热效率，以有效地降低该电路板20上焊垫21的温度，避免因该焊垫21长期处于温度过高的状态下，而导致焊接点的焊锡熔解脱落，或是该电路板20碳化的情况发生。因此，本发明便可通过改变该间距H的大小来调整散热的效果。In addition, the second pieces 142, 152 of the first and second legs 14, 15 are located on the same side of the chip body 11, and the second piece 142 of the first leg 14 is the same as the second leg. The second piece 152 of 15 is parallel to the first and second surfaces 111, 112, and has the distance H from the second surface 112. When the flat-laying thermistor 10 with legs is soldered to the circuit board 20 At this time, the distance H between the second surface 112 of the chip body 11 and the circuit board 20 can be maintained to absorb the stress caused by thermal expansion and contraction due to the difference in expansion coefficient, while maintaining air circulation. Provide good heat dissipation efficiency to effectively reduce the temperature of the solder pad 21 on the circuit board 20, avoiding the melting and falling off of the solder at the soldering point due to the long-term high temperature of the solder pad 21, or the circuit board 20 Cases of carbonization occur. Therefore, the present invention can adjust the effect of heat dissipation by changing the size of the distance H.
另一方面，该第一脚架14与该第二脚架15的材质亦会影响散热效率及该焊垫21的温度，而当所选用的材质的导热率越差，该焊垫21的温度越低，即该芯片本体11的热量越不容易传导致该焊垫21。举例来说，可选用材质如铜、铝、铁等金属，而其中以铁的导热效率较差，故选用铁作为该第一脚架14与该第二脚架15的材质时，焊垫的温度较低。On the other hand, the material of the first leg 14 and the second leg 15 will also affect the heat dissipation efficiency and the temperature of the welding pad 21, and when the thermal conductivity of the selected material is worse, the temperature of the welding pad 21 will be lower. Low, that is, the heat of the chip body 11 is less likely to be transferred to the bonding pad 21 . For example, materials such as copper, aluminum, iron and other metals can be selected, and iron has poor thermal conductivity, so when iron is selected as the material of the first leg 14 and the second leg 15, the solder pads The temperature is lower.
请参阅图3所示，在该第一脚架14的第一片部141与该第二片部142交界，于该第一片部141形成有一第一缺口143，并于该第二片部142形成有一第二缺口144，且该第一缺口143与该第二缺口144相连。而在该第二脚架15的第一片部151与该第二片部152交界，于该第一片部151形成有一第一缺口153，并于该第二片部152形成有一第二缺口154，且该第一缺口153与该第二缺口154相连。通过该第一脚架14中相连的第一缺口143与第二缺口144，以及该第二脚架15中相连的第一缺口153与该第二缺口154，进一步增加空气流通的方向，提高散热效率，且减少两第二片部142、152与该电路板20焊垫21的接触面积，因而减少该芯片本体11传导至该焊垫21的热量，以进一步降低该焊垫21的温度。Please refer to Fig. 3, at the junction of the first piece 141 and the second piece 142 of the first leg 14, a first notch 143 is formed on the first piece 141, and a gap 143 is formed on the second piece 142. 142 forms a second notch 144 , and the first notch 143 is connected to the second notch 144 . At the junction of the first piece 151 and the second piece 152 of the second tripod 15, a first notch 153 is formed on the first piece 151, and a second notch is formed on the second piece 152. 154, and the first notch 153 is connected to the second notch 154. Through the first notch 143 connected to the second notch 144 in the first leg 14, and the first notch 153 connected to the second notch 154 in the second leg 15, the direction of air circulation is further increased to improve heat dissipation efficiency, and reduce the contact area between the two second pieces 142 , 152 and the solder pad 21 of the circuit board 20 , thereby reducing the heat conducted from the chip body 11 to the solder pad 21 to further reduce the temperature of the solder pad 21 .
请参阅图4及图5所示，该具有脚架的平躺热敏电阻10进一步具有一绝缘层18，该绝缘层18包覆该芯片本体11、该第一电极12及该第二电极13，但露出该第一脚架14及该第二脚架15供焊接置电路板。在本较佳实施例中，该绝缘层18是金属氧化物、非金属氧化物、玻璃或高分子材料。Please refer to FIG. 4 and FIG. 5, the flat-laying thermistor 10 with legs further has an insulating layer 18, and the insulating layer 18 covers the chip body 11, the first electrode 12 and the second electrode 13. , but the first leg 14 and the second leg 15 are exposed for soldering and placing the circuit board. In this preferred embodiment, the insulating layer 18 is metal oxide, non-metal oxide, glass or polymer material.
以上所述仅是本发明的较佳实施例而已，并非对本发明做任何形式上的限制，虽然本发明已以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案的范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。The above descriptions are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.
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|---|---|---|---|---|
| US5107324A (en) * | 1989-04-27 | 1992-04-21 | Fuji Electric Co., Ltd. | Two-terminal semiconductor device of surface installation type |
| CN1526165A (en) * | 2001-05-15 | 2004-09-01 | Gem | Improved Surface Mount Packaging |
| JP2005123342A (en) * | 2003-10-15 | 2005-05-12 | Alps Electric Co Ltd | Electronic circuit unit and its manufacturing method |
| CN204167284U (en) * | 2014-11-17 | 2015-02-18 | 兴勤电子工业股份有限公司 | Lay-flat thermistor with tripod |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5107324A (en) * | 1989-04-27 | 1992-04-21 | Fuji Electric Co., Ltd. | Two-terminal semiconductor device of surface installation type |
| CN1526165A (en) * | 2001-05-15 | 2004-09-01 | Gem | Improved Surface Mount Packaging |
| JP2005123342A (en) * | 2003-10-15 | 2005-05-12 | Alps Electric Co Ltd | Electronic circuit unit and its manufacturing method |
| CN204167284U (en) * | 2014-11-17 | 2015-02-18 | 兴勤电子工业股份有限公司 | Lay-flat thermistor with tripod |
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