CN105682341A - Rigid-flex board and mobile terminal - Google Patents
Rigid-flex board and mobile terminal Download PDFInfo
- Publication number
- CN105682341A CN105682341A CN201610105704.4A CN201610105704A CN105682341A CN 105682341 A CN105682341 A CN 105682341A CN 201610105704 A CN201610105704 A CN 201610105704A CN 105682341 A CN105682341 A CN 105682341A
- Authority
- CN
- China
- Prior art keywords
- layer
- hole
- soft
- copper foil
- hard board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a rigid-flex board and a mobile terminal, which comprise a flexible substrate layer and a copper foil layer stacked on the flexible substrate layer, wherein the surface of the copper foil layer is provided with at least one through hole and a reinforcing element, the at least one through hole penetrates through the flexible substrate layer, and the reinforcing element is arranged around the periphery of the second through hole. According to the rigid-flex board and the mobile terminal, the reinforcing element is arranged at the periphery of the via hole of the copper foil layer, and the via hole is reinforced by the reinforcing effect of the reinforcing element, so that when the via hole is connected with the electronic component in a plugging and pulling manner, the structural strength of the copper foil layer at the periphery of the via hole can be enhanced by the reinforcing element, the situation that the periphery of the via hole is cracked or damaged is prevented, the connection reliability of the via hole and the electronic component is ensured, and the use reliability of the rigid-flex board is improved.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of soft or hard board and mobile terminal.
Background technology
Soft or hard board is exactly flexible circuit board and rigid wiring board, through operations such as pressings, combines by related process requirement, formation there is flexible circuit board characteristic and the wiring board of rigid wiring board characteristic.
At present, soft or hard board, when carrying out plug with electronic devices and components and be connected, is typically employed on copper foil layer to offer at least one and crosses Kong Laiyu electronic devices and components and connect; And be usually arranged in flexible substrate layer due to copper foil layer, therefore, its quality is softer; When cross hole carry out with electronic devices and components plugging be connected time, easily occurred Kong Shouli excessive and caused the surface of hole week side that the situation of crack or damage occurs, thus cause copper foil layer that crack or damage occur, while affecting the connection of hole and electronic devices and components, also easily cause product Joint failure, the work reliability of soft or hard board cannot be ensured.
Summary of the invention
In view of the above-mentioned problems in the prior art, technical problem to be solved by this invention is, it is provided that one prevents copper foil layer from crack or damage occur by power, it is ensured that the soft or hard board of work reliability and mobile terminal.
In order to realize above-mentioned purpose, embodiment of the present invention provides following technical scheme:
First aspect, the present invention provides a kind of soft or hard board, it copper foil layer comprising flexible substrate layer and being stacked in described flexible substrate layer, wherein, the surface of described copper foil layer is provided with at least one and crosses hole and reinforced element, described at least one cross all through to the described flexible substrate layer in hole, described reinforced element around described at least one cross hole periphery arrange.
Wherein, it is coated with metallic coating at least one hole wall crossing hole described.
Wherein, described metallic coating is metallic copper coating or metallic tin coating.
Wherein, described reinforced element is be etched in the described copper foil layer crossing hole peripheral.
Wherein, described reinforced element is be attached at the described steel stiffening plate crossing hole peripheral.
Wherein, described copper foil layer comprises the first joining region being arranged side by side and the 2nd joining region, described at least one cross hole and be opened in described first joining region.
Wherein, described soft or hard board also comprises hard layer, line layer and anti-solder ink layer, described hard layer is stacked at described 2nd joining region, and described line layer is laminated in the side that described hard layer deviates from described first copper foil layer, and described anti-solder ink layer covers described line layer.
Wherein, described line layer is provided with the through hole of through to described copper foil layer, is provided with the electrical conductor connecting described line layer and described copper foil layer in described through hole.
Wherein, described anti-solder ink layer is provided with welding hole, is provided with the electrical element being welded in described line layer in described welding hole.
Second aspect, present invention also offers a kind of mobile terminal, described mobile terminal comprises body, is located at the mainboard of described body interior and the soft or hard board as described in above-mentioned first aspect, and described soft or hard board is located on described mainboard, and is electrically connected with described mainboard.
Soft or hard board provided by the invention and mobile terminal, by the hole peripheral of crossing at copper foil layer, reinforced element is set, the strengthening action of reinforced element is utilized to carry out reinforcement in hole to crossing, thus worked as hole and carry out plug with electronic devices and components when being connected, this reinforced element can strengthen the structural strength of the copper foil layer of hole peripheral, thus prevent this periphery crossing hole from the situation of crack or damage occurring, ensure the connection reliability of hole and electronic devices and components, and then improve the work reliability of soft or hard board.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic cross-section of the soft or hard board that the embodiment of the present invention provides;
Fig. 2 is the schematic diagram of the copper foil layer of the soft or hard board that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only the present invention's part embodiment, instead of whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature as illustrated in the drawing is described. It is appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or during layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or can there is element or layer between two parties.
It can be appreciated that term used is only to describe specific embodiment, do not really want restriction the present invention here. When using here, clearly state unless context separately has, otherwise odd number form " " and " being somebody's turn to do " are also intended to comprise plural form. Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of existence or the increase of other features one or more, entirety, step, element, assembly and/or its combination. Specification sheets subsequent descriptions is implement the better embodiment of the present invention, and right described description is to illustrate for the purpose of the general principle of the present invention, it does not mean to limit the scope of the present invention.Protection scope of the present invention is when being as the criterion depending on the claims person of being defined.
See also Fig. 1 and Fig. 2, a kind of soft or hard board 100 provided by the invention, the copper foil layer 20 that described soft or hard board 100 comprises flexible substrate layer 10 and is stacked in described flexible substrate layer 10. The surface of described copper foil layer 20 is provided with at least one and crosses hole 21 and reinforced element 22, described at least one cross all through to the described flexible substrate layer 10 in hole 21. Described reinforced element 22 is around at least one periphery setting crossing hole 21 described. It should be appreciated that described soft or hard board 100 is applied in mobile terminal, this mobile terminal can be mobile phone, panel computer, notebook computer etc., the conduction that described soft or hard board 100 is responsible between the electronic component in mobile terminal.
The soft or hard board 100 that the embodiment of the present invention provides is by arranging reinforced element 22 crossing of described copper foil layer 20 around hole 21, utilize described reinforced element 22 to the described strengthening action crossing hole 21, so that when described cross hole 21 carry out with electronic devices and components plugging be connected time, the structural strength of the described copper foil layer 20 crossing hole 21 periphery can be strengthened by the strengthening action of described reinforced element 22, prevent described hole 21 periphery of crossing from forced breakage or damage occurring, guarantee the described connection crossed between hole 21 and described electronic devices and components, improve the work reliability of described soft or hard board 100.
In the present embodiment, described flexible substrate layer 10 can adopt the material such as polyimide or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arranging described copper foil layer 20 in described flexible substrate layer 10, and described flexible substrate layer 10 can be described copper foil layer 20 provides insulation environment, so that etching signal walks line and ground connection walks line on described copper foil layer 20. Preferably, the thickness of described flexible substrate layer 10 can be 20 μm. Described flexible substrate layer 10 can arrange flex area 10a and non-flex area 10b, described flex area 10a is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described soft or hard board 100 to connect external device, described non-flex area 10b can fix hard plate, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in mobile terminal.
In the present embodiment, described copper foil layer 20 is the plate arranging Copper Foil on film, and the ground connection on described copper foil layer 20 is walked line and is Copper Foil with signal lead and becomes through etching technics according to predetermined wire structures. Ground connection on described copper foil layer 20 walks line and signal lead can be wholely set, and the signal lead on described copper foil layer 20 realizes the conduction between electric elements, and the ground connection on described copper foil layer 20 is walked line and carried out ground connection.
Described copper foil layer 20 comprises the first joining region 23 and the 2nd joining region 24 that are arranged side by side, the described first corresponding described flex area 10a in joining region 23 is arranged, the corresponding described non-flex area 10b in described 2nd joining region 24 is arranged, and arranges hard plate so that follow-up and connects electronic devices and components. In the present embodiment, the area of described first joining region 23 is greater than the area of described 2nd joining region 24, so that described soft or hard board 100 can have enough spaces carries out arranging electronic components and parts, ensure the cloth member space of the flexible board part on described soft or hard board 100.
In the present embodiment, described copper foil layer 20 can be one layer or two layers. Preferably, described copper foil layer 20 is two layers, and two layers of described copper foil layer 20 are located at the both sides of described flexible substrate layer 10 respectively, to increase the cloth member space of described soft or hard board 100.
Described at least one cross hole 21 and be opened in described first joining region 23. In the present embodiment, described at least one cross the circular hole of hole 21 for being opened on described first joining region 23. Described at least one cross and in hole 21, be provided with conducting connecting part (not shown), in order to be connected with electronic devices and components, to realize electrically conducting between described soft or hard board 100 and electronic devices and components.
Further, the described spacing crossed between hole 21 of adjacent two can be 2mm～3mm such that it is able to prevents adjacent two from crossing too intensive between hole 21 and causing likely occurring that two described were crossed the mutually through situations in hole 21. Specifically, in order to strengthen the structural strength of described copper foil layer 20 further, preventing described copper foil layer 20 from crossing hole 21 and cause strength reduction owing to offering described some, the described hole wall crossing hole 21 is coated with metallic coating 211. Utilize described metallic coating 211 to increase the metal content of described copper foil layer 20, thus increase the overall construction intensity of described copper foil layer 20. Preferably, described metallic coating 211 is metallic copper coating or metallic tin coating. Described metallic coating 211 can be processed in the lump when the circuit processed on described copper foil layer 20. In addition, it is understandable that, owing to described mistake in hole 21 has described metallic coating 211, therefore, the described inwall crossing hole 21 also has conductivity, and now, described hole 21 of crossing can be used as the conduction pad on described copper foil layer 20, in order to be connected with other electronic devices and components, to realize electrically conducting of described copper foil layer 20 and other electronic devices and components.
In the present embodiment, for the ease of processing, described reinforced element 22 is for being etched in the described copper foil layer crossing hole 21 periphery. That is, on the described periphery crossing hole 21, etching has one layer of copper foil layer, so that the copper foil layer thickness of the described peripheral position crossing hole 21 increases, to strengthen the described copper foil layer intensity crossing hole 21 peripheral position. Specifically, in order to the reinforcing effect of described reinforced element 22, described reinforced element 22 is and the described circular block shape structure crossed the peripheral shape in hole 21 and mate mutually.
It should be appreciated that described reinforced element 22 also can be is attached at the described steel stiffening plate crossing hole 21 periphery. Owing to the structural strength of steel stiffening plate is better, therefore, when described reinforced element 22 is steel stiffening plate, described copper foil layer 20 can also have preferably structural strength due to the described reinforced element 22 that is sticked, it is thus possible to prevent from described crossing the situation that hole 21 occurs forced breakage with electronic devices and components when being connected, it is ensured that the connection reliability of described hole 21 and described electronic devices and components excessively. Preferably, when described reinforced element 22 is steel stiffening plate, described reinforced element 22 is and the described circular plate crossed the peripheral shape in hole 21 and mate mutually such that it is able to encloses and closes in the described periphery crossing hole 21, plays and strengthen the described effect crossing hole 21 peripheral structure intensity.
In other embodiments, certainly, described reinforced element 22 also can be and is painted on the described metallic coating crossing hole 21 periphery, such as metallic copper coating or metallic tin coating etc.
Further, described soft or hard board 100 also comprises hard layer 30, line layer 40 and anti-solder ink layer 50, described hard layer 30 is stacked on described 2nd joining region 24, described line layer 40 is laminated in the side that described hard layer 30 deviates from described copper foil layer 20, and described anti-solder ink layer 50 covers described line layer 40.
In the present embodiment, described hard layer 30 adopts superpolymer polypropylene material, and described hard layer 30 has insulation characterisitic, so that can insulate with described copper foil layer 20 when arranging devices or other line layers on described hard layer 30.Described hard layer 30 correspondence is arranged at the non-flex area 10b of described flexible substrate layer 10, it is thus possible to utilize the rigidity of described hard layer 30, make the intensity increase of described soft or hard board 100 on described non-flex area 10b so that described soft or hard board 100 is in described non-flex area 10b not easily bending. Meanwhile, the circuit of described copper foil layer 20 at 10b place, described non-flex area can be protected by described hard layer 30, increases the firm property of structure of described soft or hard board 100.
In the present embodiment, described line layer 40 can also be that Copper Foil is shaping through etch process. And the number of plies of described line layer 40 can be arranged according to the number of plies of described hard layer 30. That is, when described hard layer 30 is two layers, the number of plies of described line layer 40 is also two layers, and two layers of described line layer 40 fit on two layers of described hard layer 30 respectively. Two layers of described line layer 40 can be all arrange circuit, thus increases the circuit configuration of described soft or hard board 100.
In the present embodiment, the circuit on described line layer 40 is protected by described anti-solder ink layer 50, prevents the short circuit of the circuit on described line layer 40.
Further, described line layer 40 is provided with the through hole 41 of through to described copper foil layer 20, is provided with the electrical conductor 42 connecting described line layer 40 and described copper foil layer 20 in described through hole 41. Described through hole 41 is through described hard layer 30. Utilize line layer 40 and described copper foil layer 20 described in the conducting of described electrical conductor 42, thus conveniently for the circuit on described line layer 40 carries out ground connection, so that described soft or hard board 100 structure is simple, it is to increase conductivity. Described electrical conductor 42 can be the copper post through described through hole 41. In other embodiments, the number of described through hole 41 can be multiple, thus realizes the multiple mode conducting of described line layer 40 with described copper foil layer 20.
Further, described anti-solder ink layer 50 is provided with welding hole 51, is provided with the electrical element 52 being welded in described line layer 40 in described welding hole 51. Described electrical element 52 can be the electronic components such as resistance, electric capacity, diode, it is also possible to is the devices such as junctor, chip or pad. Fill scolding tin in described welding hole 51, to be welded on the circuit of described line layer 40 by described electrical element 52, thus realize the function that described soft or hard board 100 possesses printed circuit board (PCB).
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprises body (not shown), be located at described body interior mainboard (not shown) and described soft or hard board 100, described soft or hard board 100 is located at described body interior, and is electrically connected with described mainboard. Described mobile terminal can be mobile phone, computer, flat board, handheld game machine or media player etc.
Soft or hard board provided by the invention and mobile terminal arrange reinforced element 22 by hole 21 periphery of crossing at described copper foil layer 20, the strengthening action of reinforced element 22 is utilized to carry out reinforcement in hole 21 to crossing, thus worked as hole 21 and carry out plug with electronic devices and components when being connected, this reinforced element 22 can strengthen the structural strength of the copper foil layer 20 of hole 21 periphery, thus prevent this periphery crossing hole 21 from the situation of crack or damage occurring, ensure the connection reliability of hole 21 with electronic devices and components, and then improve the work reliability of soft or hard board.
In the description of this specification sheets, at least one embodiment that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " the first embodiment " etc. means to be contained in the present invention in conjunction with concrete feature, structure, material or feature that this embodiment or example describe or example. In this manual, the schematic representation of above-mentioned term is not necessarily referred to identical embodiment or example. And, the concrete feature of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described enforcement mode, does not form the restriction to this technical scheme protection domain.The amendment done within any spirit in above-mentioned enforcement mode and principle, equivalent replace and improvement etc., all should be included within the protection domain of this technical scheme.
Claims (10)
1. a soft or hard board, it copper foil layer comprising flexible substrate layer and being stacked in described flexible substrate layer, it is characterized in that, the surface of described copper foil layer is provided with at least one and crosses hole and reinforced element, described at least one cross through to the described flexible substrate layer in hole, described reinforced element around described at least one cross hole periphery arrange.
2. soft or hard board as claimed in claim 1, it is characterised in that, it is coated with metallic coating at least one hole wall crossing hole described.
3. soft or hard board as claimed in claim 2, it is characterised in that, described metallic coating is metallic copper coating or metallic tin coating.
4. soft or hard board as claimed in claim 1, it is characterised in that, described reinforced element is be etched in the described copper foil layer crossing hole peripheral.
5. soft or hard board as claimed in claim 1, it is characterised in that, described reinforced element is be attached at the described steel stiffening plate crossing hole peripheral.
6. soft or hard board as claimed in claim 1, it is characterised in that, described copper foil layer comprises the first joining region being arranged side by side and the 2nd joining region, described at least one cross hole and be opened in described first joining region.
7. soft or hard board as claimed in claim 6, it is characterized in that, described soft or hard board also comprises hard layer, line layer and anti-solder ink layer, described hard layer is stacked at described 2nd joining region, described line layer is laminated in the side that described hard layer deviates from described copper foil layer, and described anti-solder ink layer covers described line layer.
8. soft or hard board as claimed in claim 7, it is characterised in that, described line layer is provided with the through hole of through to described copper foil layer, is provided with the electrical conductor connecting described line layer and described copper foil layer in described through hole.
9. soft or hard board according to claim 7, it is characterised in that, described anti-solder ink layer is provided with welding hole, is provided with the electrical element being welded in described line layer in described welding hole.
10. a mobile terminal, it is characterized in that, described mobile terminal comprises body, is located at the mainboard of described body interior and soft or hard board as described in claim 1 to 9 any one, and described soft or hard board is located on described mainboard, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105704.4A CN105682341B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105704.4A CN105682341B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682341A true CN105682341A (en) | 2016-06-15 |
| CN105682341B CN105682341B (en) | 2018-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105704.4A Expired - Fee Related CN105682341B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105682341B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688691A (en) * | 2017-11-16 | 2019-04-26 | 苏州旭创科技有限公司 | Flexible circuit board, optical transceiver module and optical module |
| CN110290636A (en) * | 2019-07-29 | 2019-09-27 | Oppo（重庆）智能科技有限公司 | FPC component and electronic equipment with it |
| CN112702830A (en) * | 2019-10-22 | 2021-04-23 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
| WO2022012193A1 (en) * | 2020-07-14 | 2022-01-20 | Oppo广东移动通信有限公司 | Circuit board, display screen and electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100372104C (en) * | 2004-09-07 | 2008-02-27 | 日月光半导体制造股份有限公司 | Substrate with welding pad strengthening structure |
| JP4520392B2 (en) * | 2005-05-12 | 2010-08-04 | 株式会社丸和製作所 | Printed circuit board manufacturing method |
| US8404978B2 (en) * | 2010-02-12 | 2013-03-26 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
| CN203104949U (en) * | 2013-02-26 | 2013-07-31 | 福清三照电子有限公司 | Double-sided PCB (Printed Circuit Board) |
| CN203537660U (en) * | 2013-10-10 | 2014-04-09 | 上海斐讯数据通信技术有限公司 | Printed circuit board |
| SG10201402788SA (en) * | 2014-05-30 | 2015-12-30 | Hitachi Chemical Co Ltd | Printed wiring board and method of manufacturing the same |
-
2016
- 2016-02-25 CN CN201610105704.4A patent/CN105682341B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688691A (en) * | 2017-11-16 | 2019-04-26 | 苏州旭创科技有限公司 | Flexible circuit board, optical transceiver module and optical module |
| CN109688691B (en) * | 2017-11-16 | 2020-09-25 | 苏州旭创科技有限公司 | Flexible circuit board, optical transceiver module and optical module |
| CN110290636A (en) * | 2019-07-29 | 2019-09-27 | Oppo（重庆）智能科技有限公司 | FPC component and electronic equipment with it |
| CN112702830A (en) * | 2019-10-22 | 2021-04-23 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
| CN112702830B (en) * | 2019-10-22 | 2022-04-15 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
| WO2022012193A1 (en) * | 2020-07-14 | 2022-01-20 | Oppo广东移动通信有限公司 | Circuit board, display screen and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105682341B (en) | 2018-09-04 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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