CN105760591A - Method for bonding package substrate bonding wires - Google Patents
Method for bonding package substrate bonding wires Download PDFInfo
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- CN105760591A CN105760591A CN201610080973.XA CN201610080973A CN105760591A CN 105760591 A CN105760591 A CN 105760591A CN 201610080973 A CN201610080973 A CN 201610080973A CN 105760591 A CN105760591 A CN 105760591A
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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Abstract
The invention relates to a method for bonding package substrate bonding wires. The method comprises the steps of setting a mode combination of bonding parameters to be 'force + friction', wherein parameters corresponding to the force mode include USG1, time t and pressure F1, and parameters corresponding to the friction mode include USG2 and pressure F2; according to the scope corresponding to each parameter, designing n sets of testing data through a five-factor n-level uniform design experimental method, and generating a fitted curve, so that the optimum parameter range corresponding to each parameter is obtained; designing eight sets of testing data through a five-factor two-level horizontal orthogonal design experimental method, so that the maximum value of eight bonding strength measured values is obtained, and treating the testing data set corresponding to the maximum value as the optimum bonding parameter of bonding equipment. The method is simple and definite in procedure, the number of related parameters is small, rapid search can be conducted conveniently, and the method is not only applicable to parameter optimization of bonding wires of different types so that the alarm rate can be raised and bonding strength can be improved but also applicable to parameter optimization of bonding wires which are the same in type but different in specification and wire diameter.
Description
Technical field
The present invention relates to base plate for packaging bonding wire bonding techniques field, particularly to the bonding method of a kind of base plate for packaging bonding wire.
Background technology
Base plate for packaging bonding techniques uses gold thread as bonding wire the earliest, and owing to the good ductility of gold thread, hardness are little, so the parameter of gold thread bonding easily establishes, process window width, alarm rate is low and bond strength is high, but cost is very high.Compared to gold thread bonding, the cheap bonding wire bondings such as alloy wire, plating palladium copper cash, copper cash can be greatly reduced cost, under the driving effect that cost reduces, the development and application of cheap bonding wire bonding techniques is the focus of industry in recent years, but owing to the ductility of cheap bonding wire is generally not as gold thread, and hardness ratio gold thread is big, the bonding alarm rate causing cheap bonding wire is high and bond strength is low.Alarm rate height affects production capacity, is unfavorable for scale of mass production；The low reliability that affects of bond strength, choice of parameters is big with the workload of optimization, and engineering staff cannot quickly determine the efficient combination of parameter and the optimal parameter of optimization, thus the parameter of cheap bonding wire bonding is set up and optimized long-standing problem and engineering staff.
Summary of the invention
It is an object of the invention to provide the bonding method of a kind of base plate for packaging bonding wire, it is possible to quickly determine best bonding parameter, improve bond strength and reduce alarm rate.
For realizing the purpose of the present invention, adopt the technical scheme that:
The bonding method of a kind of base plate for packaging bonding wire, it is determined that the best bonding parameter of bonding equipment, comprises the following steps:
(1), the mode combinations of bonding parameter being set as " dynamics+friction ", parameter corresponding to dynamics pattern has USG1, time t, pressure F1, and the parameter that friction pattern is corresponding has USG2, pressure F2；Set the reception standard of matched curve as: R-Sq and R-Sq (adjustment) is all higher than 90%, and the difference of R-Sq and R-Sq (adjustment) is δ, and curve P value and each factor P value are respectively less than 0.05, wherein-5%≤δ≤5%；
(2) each self-corresponding scope of each parameter, is set；
(3), according to each self-corresponding scope of each parameter, 5 factor n horizontal homogeneous contrived experiment methods are adopted to design n group test data, often group test data all include USG1, time t, pressure F1, USG2, pressure F2 these 5 parameters, wherein 10≤n≤20；
(4), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(5) the bond strength measured value, according to often group test data and correspondence, generates matched curve；
(6) if the matched curve generated meets reception standard, then step (7) is performed；If the matched curve generated is unsatisfactory for reception standard, then re-execute step (2) to (5)；
(7), according to matched curve and parameter designing border, calculating each self-corresponding optimal parameter of each parameter interval, optimal parameter interval corresponding to each parameter has higher limit and lower limit；
(8), according to higher limit corresponding to each parameter and lower limit, adopting 5 factor 2 horizontal quadrature contrived experiment methods to design 8 groups of test data, often group test data all include USG1, time t, pressure F1, these 5 parameters of USG2, pressure F2；
(9), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(10), the maximum that draws in 8 bond strength measured values, and using the test data set corresponding for this maximum best bonding parameter as bonding equipment.
The method flow process is simply clear and definite, the number of parameters related to is few, the search of parameter and optimization method are determined, it is widely used in all kinds of bonding wire bonding, the method is applicable not only to the parameter optimization of dissimilar bonding wire to reduce alarm rate and to improve bond strength, parameter optimization with the bonding wire of type different size wire diameter is equally applicable, can quickly determine best bonding parameter by the method, improves bond strength and reduces alarm rate.
Below technical scheme is further illustrated:
Further, in step (3), n=12.
It is further, in step (7), curvilinear equation corresponding to matched curve is y=a+b × USG1+c × t+d × F1+e × USG2+f × F2+g × USG1 × USG1+h × t × F1, wherein a, b, c, d, e, f, g, h are all not equal to 0, this curvilinear equation is sought extreme value, obtains each self-corresponding optimal parameter of each parameter interval.
Further, after determining best bonding parameter, adjusting the auxiliary parameter that friction pattern is corresponding, this auxiliary parameter includes friction cycle, friction amplitude and friction frequency, first adjusts the friction cycle, then adjusts friction amplitude, finally adjusts friction frequency.Make bond strength meet under the premise of requirement, reduce alarm rate.
Further, the unit of adjustment of friction cycle and friction amplitude is 1, and the unit of adjustment of friction frequency is 50.
Further, described auxiliary parameter also includes friction phase place, and friction phase settings is circular.The rubbing action of bonded interface is more abundant relative to " in line " and " Perp ", is more beneficial for the raising of bond strength.
Further, when bonding wire is 1.0mil copper cash, the friction cycle is 5, and friction amplitude is 2, and friction frequency is 400.
Further, bonding wire is gold thread, alloy wire, plating palladium copper cash or copper cash.
It is further, when bonding wire is 1.0mil copper cash, the optimal parameter interval of USG1 is 90-160mAmps, the optimal parameter interval of time t is 26-28ms, the optimal parameter interval of pressure F1 is 10-65g, the optimal parameter interval of USG2 is 75-120mAmps, and the optimal parameter interval of pressure F2 is 25-40g.
Further, best bonding parameter is: USG1=160mAmps, time t=28ms, pressure F1=10g, USG2=75mAmps, pressure F2=40g.Bond strength reaches 9.873g, and bond strength is big, highly reliable.
Compared with prior art, the method have the advantages that
Flow process of the present invention is simply clear and definite, the number of parameters related to is few, the search of parameter and optimization method are determined, it is widely used in all kinds of bonding wire bonding, the method is applicable not only to the parameter optimization of dissimilar bonding wire to reduce alarm rate and to improve bond strength, parameter optimization with the bonding wire of type different size wire diameter is equally applicable, can quickly determine best bonding parameter by the method, improves bond strength and reduces alarm rate.For 1.0mil bonding wire, copper replaces gold can lower the cost of 75%.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the bonding method of embodiment of the present invention base plate for packaging bonding wire；
Fig. 2 is the design of 1.0mil copper cash 5 factor 12 horizontal homogeneous laboratory method；
Fig. 3 is regression analysis detailed data table；
The best bonding that Fig. 4 is 1.0mil copper cash is interval；
Fig. 5 is the design of 1.0mil copper cash 5 factor 2 horizontal quadrature laboratory method.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail:
As it is shown in figure 1, the bonding method of a kind of base plate for packaging bonding wire, it is determined that the best bonding parameter of bonding equipment, comprise the following steps:
(1), the mode combinations of bonding parameter being set as " dynamics+friction ", parameter corresponding to dynamics pattern has USG1, time t, pressure F1, and the parameter that friction pattern is corresponding has USG2, pressure F2；Set the reception standard of matched curve as: R-Sq and R-Sq (adjustment) is all higher than 90%, and the difference of R-Sq and R-Sq (adjustment) is δ, and curve P value and each factor P value are respectively less than 0.05, wherein-5%≤δ≤5%；
(2) each self-corresponding scope of each parameter, is set；
(3), according to each self-corresponding scope of each parameter, 5 factor n horizontal homogeneous contrived experiment methods are adopted to design n group test data, often group test data all include USG1, time t, pressure F1, USG2, pressure F2 these 5 parameters, wherein 10≤n≤20；
(4), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(5) the bond strength measured value, according to often group test data and correspondence, generates matched curve；
(6) if the matched curve generated meets reception standard, then step (7) is performed；If the matched curve generated is unsatisfactory for reception standard, then re-execute step (2) to (5)；
(7), according to matched curve and parameter designing border, calculating each self-corresponding optimal parameter of each parameter interval, optimal parameter interval corresponding to each parameter has higher limit and lower limit；
(8), according to higher limit corresponding to each parameter and lower limit, adopting 5 factor 2 horizontal quadrature contrived experiment methods to design 8 groups of test data, often group test data all include USG1, time t, pressure F1, these 5 parameters of USG2, pressure F2；
(9), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(10), the maximum that draws in 8 bond strength measured values, and using the test data set corresponding for this maximum best bonding parameter as bonding equipment.
The method flow process is simply clear and definite, the number of parameters related to is few, the search of parameter and optimization method are determined, it is widely used in all kinds of bonding wire bonding, the method is applicable not only to the parameter optimization of dissimilar bonding wire to reduce alarm rate and to improve bond strength, parameter optimization with the bonding wire of type different size wire diameter is equally applicable, can quickly determine best bonding parameter by the method, improves bond strength and reduces alarm rate.
In the present embodiment, bonding wire is 1.0mil copper cash, for 1.0mil bonding wire, copper replaces gold can lower the cost of 75%, and the reception standard of the bond strength that 1.0mil copper cash is corresponding is for being not less than 4g, in step (2), the scope of each parameter is as shown in table 1, n=12, adopts 5 factor 12 horizontal homogeneous contrived experiment methods to design 12 groups of test data, and the bond strength that often group test data are corresponding is as shown in table 1.
The data utilizing Minitab software his-and-hers watches 1 are added up, generate matched curve, and carry out regression analysis, curvilinear equation corresponding to matched curve is: y=-5.12+0.144 × USG1+0.361 × t+0.0670 × F1+0.0213 × USG2-0.0280 × F2-0.000600 × USG1 × USG1-0.00794 × t × F1, the detailed data of regression analysis is in Table 2.From table 2, curvilinear equation P=0.000 < 0.05, each factor P value is respectively less than 0.05 simultaneously, R-Sq=100.0% and R-Sq (adjustment)=99.9%, the two is close, S=0.0525754 < bond strength standard deviation × 10%, and bond strength standard deviation is calculated by 12 bond strength values in table 1, matched curve meets reception standard, can be used for predicting the optimum bonding parameter area of 1.0mil copper cash.
Associative list 2, the optimal parameter of each parameter by determining after curvilinear equation is asked extreme value is interval, refers to table 3.For the effectiveness of parameter each in proof list 3, set 5 factor 2 horizontal quadrature experiments and be verified, design 8 groups of test data, refer to table 4.
From table 4, in the parameter area that table 3 is determined, bond strength is stable between 7.553-9.873g, and CpKmin=1.71 >=1.67 bond strength significantly improves.Best bonding parameter is USG1=160mAmps, time t=28ms, pressure F1=10g, USG2=75mAmps, pressure F2=40g.Bond strength reaches 9.873g, and bond strength is big, highly reliable.
After determining best bonding parameter, in order to reduce alarm rate further, the auxiliary parameter that friction pattern is corresponding is adjusted, this auxiliary parameter includes friction cycle, friction amplitude and friction frequency, first adjust the friction cycle, then adjust friction amplitude, finally adjust friction frequency, make bond strength meet under the premise of requirement, reduce alarm rate.
Auxiliary parameter also includes friction phase place, and friction phase settings is circular.The rubbing action of bonded interface is more abundant relative to " in line " and " Perp ", is more beneficial for the raising of bond strength.
Adjust these auxiliary parameters for improving alarm rate, the typically not bond strength that significantly changes, the variable quantity of bond strength controls within 10%.Therefore, when bond strength is sufficiently high, suitably reduce bond strength to ensure being remarkably decreased of alarm rate, improve production capacity.Being in course of adjustment, the unit of adjustment of friction cycle and friction amplitude is 1, and the unit of adjustment of friction frequency is 50.
Being 1.0mil copper cash for bonding wire, the friction cycle is 5, and friction amplitude is 2, friction frequency is 400, and friction phase place is circular, and the alarm rate of bonding wire controls at 100ppm, bond strength controls at more than 7g, makes alarm rate and bond strength meet requirement simultaneously, is beneficial to scale of mass production.
In the present embodiment, bonding wire is 1.0mil copper cash, the method applies also for the determination that material is other bonding wire the best bonding parameters such as gold thread, alloy wire or plating palladium copper cash, it is also applied for the parameter optimization of the bonding wire of same type different size wire diameter, as developed 0.8mil copper cash on the basis of 1.0mil copper cash.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the bonding method of a base plate for packaging bonding wire, it is determined that the best bonding parameter of bonding equipment, it is characterised in that comprise the following steps:
(1), the mode combinations of bonding parameter being set as " dynamics+friction ", parameter corresponding to dynamics pattern has USG1, time t, pressure F1, and the parameter that friction pattern is corresponding has USG2, pressure F2；Set the reception standard of matched curve as: R-Sq and R-Sq (adjustment) is all higher than 90%, and the difference of R-Sq and R-Sq (adjustment) is δ, and curve P value and each factor P value are respectively less than 0.05, wherein-5%≤δ≤5%；
(2) each self-corresponding scope of each parameter, is set；
(3), according to each self-corresponding scope of each parameter, 5 factor n horizontal homogeneous contrived experiment methods are adopted to design n group test data, often group test data all include USG1, time t, pressure F1, USG2, pressure F2 these 5 parameters, wherein 10≤n≤20；
(4), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(5) the bond strength measured value, according to often group test data and correspondence, generates matched curve；
(6) if the matched curve generated meets reception standard, then step (7) is performed；If the matched curve generated is unsatisfactory for reception standard, then re-execute step (2) to (5)；
(7), according to matched curve and parameter designing border, calculating each self-corresponding optimal parameter of each parameter interval, optimal parameter interval corresponding to each parameter has higher limit and lower limit；
(8), according to higher limit corresponding to each parameter and lower limit, adopting 5 factor 2 horizontal quadrature contrived experiment methods to design 8 groups of test data, often group test data all include USG1, time t, pressure F1, these 5 parameters of USG2, pressure F2；
(9), will often organize test data input bonding equipment, and test often organizing test data, and record the bond strength measured value that often group test data are corresponding；
(10), the maximum that draws in 8 bond strength measured values, and using the test data set corresponding for this maximum best bonding parameter as bonding equipment.
2. the bonding method of base plate for packaging bonding wire according to claim 1, it is characterised in that in step (3), n=12.
3. the bonding method of base plate for packaging bonding wire according to claim 1, it is characterized in that, in step (7), curvilinear equation corresponding to matched curve is y=a+b × USG1+c × t+d × F1+e × USG2+f × F2+g × USG1 × USG1+h × t × F1, wherein a, b, c, d, e, f, g, h are all not equal to 0, this curvilinear equation is sought extreme value, obtains each self-corresponding optimal parameter of each parameter interval.
4. the bonding method of base plate for packaging bonding wire according to claim 1, it is characterized in that, after determining best bonding parameter, adjust the auxiliary parameter that friction pattern is corresponding, this auxiliary parameter includes friction cycle, friction amplitude and friction frequency, first adjust the friction cycle, then adjust friction amplitude, finally adjust friction frequency.
5. the bonding method of bonding wire according to claim 4, it is characterised in that the unit of adjustment of friction cycle and friction amplitude is 1, the unit of adjustment of friction frequency is 50.
6. the bonding method of bonding wire according to claim 4, it is characterised in that described auxiliary parameter also includes friction phase place, and friction phase settings is circular.
7. the bonding method of base plate for packaging bonding wire according to claim 6, it is characterised in that when bonding wire is 1.0mil copper cash, the friction cycle is 5, and friction amplitude is 2, and friction frequency is 400.
8. the bonding method of the bonding wire according to any one of claim 1 to 7, it is characterised in that bonding wire is gold thread, alloy wire, plating palladium copper cash or copper cash.
9. the bonding method of bonding wire according to claim 8, it is characterized in that, when bonding wire is 1.0mil copper cash, the optimal parameter interval of USG1 is 90-160mAmps, the optimal parameter interval of time t is 26-28ms, the optimal parameter interval that optimal parameter interval is 10-65g, USG2 of pressure F1 is 75-120mAmps, and the optimal parameter interval of pressure F2 is 25-40g.
10. the bonding method of bonding wire according to claim 9, it is characterised in that best bonding parameter is: USG1=160mAmps, time t=28ms, pressure F1=10g, USG2=75mAmps, pressure F2=40g.
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2016
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| US6564115B1 (en) * | 2000-02-01 | 2003-05-13 | Texas Instruments Incorporated | Combined system, method and apparatus for wire bonding and testing |
| CN1497694A (en) * | 2002-10-16 | 2004-05-19 | ESECó��˾ | Method for Determining Optimal Bonding Parameters When Bonding with a Wire Bonder |
| CN1828858A (en) * | 2003-05-06 | 2006-09-06 | 北京大学 | Detection method of bonding strength of semiconductor micro-device |
| CN102420150A (en) * | 2010-09-27 | 2012-04-18 | 库利克和索夫工业公司 | Methods of forming wire bonds for wire loops and conductive bumps |
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