CN105798307B - Based on the cutting of IC package device laminated metallic base diamond saw blade and manufacture method - Google Patents
Based on the cutting of IC package device laminated metallic base diamond saw blade and manufacture method Download PDFInfo
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- CN105798307B CN105798307B CN201610286616.9A CN201610286616A CN105798307B CN 105798307 B CN105798307 B CN 105798307B CN 201610286616 A CN201610286616 A CN 201610286616A CN 105798307 B CN105798307 B CN 105798307B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention proposes a kind of laminated metallic base diamond saw blade and its manufacture method for the cutting of IC package device, i.e. on the basis of previously prepared individual layer, by multiple individual layer stack combinations, complex is made through hot pressed sintering again, laminated construction is made it have, and is collectively formed by top layer and sandwich layer and takes on each different cutting functions.Each individual layer changes the structural configuration and combining form of complex by optimizing metal matrix composition and ratio under sintering condition, and then regulate and control inherent mechanics and physical property, the appropriateness reduction of the efficient hardening and sandwich layer on top layer is realized, to obtain the effect that each layer synchronously wears.According to the technology path implemented the technical scheme of the invention constructed and selected, constructing laminated construction has the differentiation configuration of strong and weak collocation, establish the mechanism that core table coordinates abrasion, so that each layer should use up function and be not fully exerted, so as on the premise of chip cutting quality is effectively improved, significantly improve the cutting efficiency of lamination saw blade and extend service life.
Description
【Technical field】
The invention belongs to metal-base composites technology of preparing, for tool made of superhard material and product manufacturing, especially
It is related to a kind of current high-end incisory super thin metal base diamond saw blade product of encapsulation IC devices and preparation method thereof
【Background technology】
Current semiconductor industry is with ball grid array BGA (Ball Grid Array) and quad flat non-pin QFN (Quad
Flat No-lead) pass of the encapsulation technology as implementation IC (Integrated Circuit) surface mount device/chip manufacturing
Key technological measure has obtained fast development, so far in occupation of leading position.But enable these IC package devices in terminal electricity
Applied on sub- product, must just carry out singulation division processing to it, this moves towards test as one from encapsulation must not
The flow chart that can lack.The cutting of saw formula is to perform the widely used method of this process at present, and diamond saw blade product is wherein
Play the role of irreplaceable.
For BGA and QFN packagings, because for example authorized patent ZL200910021517.8 of itself structure,
ZL201010199650.5, ZL201010199811.0 and US 13/703, is very different described in 348, therefore makes in cutting
The composition of diamond saw blade also has significantly different.In terms of applicable cases now, BGA package body is mostly in vacuum suction side
Mainly cut under formula with Metal Substrate saw blade, and QFN packaging bodies are then generally cut under blue film bonding method with resin base saw blade mostly
Cut, and carried out respectively on corresponding special equipment, therefore corresponding actual cutting working condition also differs widely.Metal Substrate is sawed
For knife under speed of mainshaft 25-35Krpm, feed-speed generally uses 150-200mm/min, and current research application can be brought up to
400-450mm/min, effective cutting length reach more than 8Km；And resin base saw blade feeds speed under speed of mainshaft 35-45Krpm
Degree is only 30-50mm/min, and effective cutting length is less than 2Km.Two compare, and the former is notable on cutting efficiency and cutting life
Better than the latter.Perhaps in view of this, not yet met the precedent with resin base saw blade cutting BGA device so far in the industry, but attempt to use
The effort of Metal Substrate saw blade cutting QFN chips is never abandoned.Three granted patents having made a breakthrough property in this regard after above-mentioned
Using.
The IC chip encapsulated relative to QFN, the application of BGA package has a large capacity and a wide range, not only various informative, classification is various, and
And it is complicated, specification is changeable, technology enforcement difficulty increases increasingly, imply to a certain extent as main flow envelope survey technology not
Carry out tendency.Industry is exactly thereby known together, and puts forth effort to promote BGA package skill upgrading and constantly small, in light weight, highly dense towards size
Degree, multi-functional and high-performance direction are developed, and purpose seeks to the core competitiveness that enhancing participates in market.Got over IC chip volume
Carry out the smaller and increasingly lighter requirement of weight, undoubtedly fine cut technology is challenged, also by as do not allow to avoid one
Important research task.
Performance of the Metal Substrate saw blade in cutting process is seen, the subject matter that presently, there are there are three aspects：
It is the formation and aggravation of blade convex pattern or bullet shape first, so as to cause section linear tilt, draws
Size difference up and down is played, or even bottomless U-shaped joint-cutting occurs, lip effect is produced and forms special-shaped section (as shown in Figure 1).This
A little sizes or resemblance for changing chip in various degree, certainly will will also have influence on cutting on line quality.This occurs
Kind phenomenon is usually expressed as extending with Cutting Length due to saw blade is radially asynchronous with two lateral wearings, and radially consumption is too slow
And cause both sides excessive wear, and then promote to cut the change of blade shape anomaly.For compound with homogeneous components and condition
Material saw blade, this is a kind of inevitable failure behaviour, and the simply control that saw blade manufacturer can do is pre- until meeting before disabling
Untill the optimum Cutting effect of phase.
Next to that saw blade consumption is too fast, though ensure that cut quality, service life wretched insufficiency is caused, is unfavorable for giving birth to
Producing cost reduces.It is mainly due to metal matrix or diamond abrasive grain is held loosely, causes to come off too early and lose cutting work(
Can, or itself mechanical property shortcoming, allow to match with the abrasion of diamond abrasive grain exposure unbalance.
Moreover be that cut quality is on a declining curve with cutting rice number growth, there is trimming gap, joint-cutting narrows or section
Phenomena such as plucking or even whiting, cause chip edge incompleteness, become large-sized, or section roughness descent.In safe operating life
In the range of meet cut quality, this is basic demand, can typically each be reached., may be with saw blade if going out not up to desired situation
Inner inclusion super large diamond particles, both sides rapid wear or sharpness deficiency are relevant.
Fine cut so values the importance of saw blade product quality, is mostly derived from it and is occupied in whole IC devices processing procedure
End process.Once saw blade inherent quality occurs repeatedly, it may be difficult to maintains stable cut quality, certainly will cause to retrieve
Direct losses, gently then the yield of tens thousand of chips is queried, though investigation be can yet be regarded as a kind of remedial measure one by one, is not
Manufacturing Process is received；Heavy then scrapped because chip manufacture quality is out of control, series of process before this is implemented to be thrown into the eastward flowing stream, this
Performance test afterwards will also come to naught with terminal applies.It can be seen that behavior expression of the saw blade in cutting process, will dominate every
The feasibility that the continuity and function of chips manufacturing process are realized.
【The content of the invention】
In view of above technical problem, the invention provides one kind to be based on IC package device cutting laminated metallic base diamond
Saw blade and manufacture method, weakened by the efficient hardening on top layer and the appropriateness of sandwich layer, structure laminated construction has strong and weak collocation
Differentiation configuration, to obtain the effect that each layer synchronously wears.
The present invention uses following technical scheme：
One kind uses laminated metallic base diamond saw blade based on the cutting of IC package device, is made up of multiple individual layer superimposions,
Its individual layer is divided into top layer and sandwich layer according to saw blade construction, and each individual layer forms by metal matrix and diamond abrasive, wherein, table
The diamond particles of layer are less than the diamond particles size of sandwich layer, and the diamond concentration on top layer is more than the diamond concentration of sandwich layer；
Described metal matrix is mainly made up of Cu, Sn, and CuSn alloys, wherein, the Sn contents in top layer are more than the Sn in sandwich layer
Content.
The diamond particles size on top layer is 38-45 μm, concentration 55%-65%；The diamond particles size of sandwich layer is
53-63 μm, concentration 50%-60%.
The CuSn alloys on the top layer are CuSn20, and the CuSn alloys of sandwich layer are CuSn10.
The metal matrix on the top layer is configured to：Cu and the 18-22 weight of CuSn20,21-26 parts by weight of 68-72 parts by weight
Measure the Sn of part；The metal matrix of the sandwich layer is configured to：Cu and the 9-13 weight of CuSn10,37-43 parts by weight of 47-53 parts by weight
Measure the Sn of part.
Further comprise there is center core layer at the center of described each individual layer, form skin/core/center core layer/sandwich layer/table
Layer, wherein, the particle of described sandwich layer diamond is more than the diamond particles of center core layer.
The diamond particles size of the center core layer is 45-53 μm, and the concentration of the diamond of the center core layer is 55%-
65%.
The metal matrix of the center core layer is configured to：Cu, 18-22 of CuSn10,27-33 parts by weight of 32-38 parts by weight
The Ni of the Co and 12-18 parts by weight of parts by weight.
When the Metal Substrate saw blade is applied to the chip of BGA package, its feed speed reaches 450mm/s, and effective cutting length reaches
6Km。
A kind of manufacture method based on the cutting of IC package device with laminated metallic base diamond saw blade, by cold pressing or hot pressing
Into multiple individual layer pressed compacts, it is alternate stack after be placed in sintering mold, after centering, positioning, fastening, mould is placed into sintering furnace
It is interior, 780-820 DEG C is warming up under conditions of compression is 24MPa, programming rate is 80-90 DEG C/min, after being incubated 6-8min,
Room temperature is cooled to 60-80 DEG C/min speed, then implements hot pressed sintering, the blank of sintering is finally subjected to inside and outside circle, double
Face is thinned and peripheral milling processing and forming, and final saw blade is made.
During described individual layer pressed compact, after metal matrix and diamond abrasive grain are stirred first, then row granulation
It is in shot structure to make it, size 0.5mm-0.7mm, diamond abrasive grain is evenly distributed in metal matrix.
Compared with prior art, the present invention at least has the advantages that：Saw blade of the present invention is using top layer and sandwich layer
Lamination layer structure, wherein, the diamond particles on top layer are less than the diamond particles size of sandwich layer, and the diamond concentration on top layer is more than
The diamond concentration of sandwich layer, the Sn contents in top layer are more than the Sn contents in sandwich layer.Wherein, top layer is improved hard from high Sn contents
Spend and then strengthen wearability, and sandwich layer reduces hardness with sharp abrasive particle exposure from low Sn contents.
【Brief description of the drawings】
BGA package IC device process mid-early stage blade shapes are split in the metal-base diamond saw blade sawing that Fig. 1-a are the present invention
The change of looks；
Mid-term blade shape in BGA package IC device process is split in the metal-base diamond saw blade sawing that Fig. 1-b are the present invention
The change of looks；
BGA package IC device process middle and later periods blade shapes are split in the metal-base diamond saw blade sawing that Fig. 1-c are the present invention
The change of looks；
Fig. 2 is composite bending strength under different Sn contents of the invention；
Fig. 3 is the different Sn contents carcasses and composite bending strength of the present invention；
Fig. 4-a be the soaking time of the present invention be 10min, 650 DEG C of different sintering temperatures, 680 DEG C, 710 DEG C to carcass and
The influence of composite density；
Fig. 4-b be the sintering temperature of the present invention be 650 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite density；
Fig. 4-c be the sintering temperature of the present invention be 680 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite density；
Fig. 4-d be the sintering temperature of the present invention be 710 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite density；
Fig. 5-a be the soaking time of the present invention be 10min, 650 DEG C of different sintering temperatures, 680 DEG C, 710 DEG C to carcass and
The influence of composite bending strength；
Fig. 5-b be the sintering temperature of the present invention be 650 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite bending strength；
Fig. 5-c be the sintering temperature of the present invention be 680 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite bending strength；
Fig. 5-d be the sintering temperature of the present invention be 710 DEG C, different soaking time 10min, 30min, 50min to carcass and
The influence of composite bending strength；
Fig. 6 is influence of the Sn contents of the present invention to metal matrix hardness；
Fig. 7-a are the individual layer saw blade Cross Section Morphology that the present invention observes under ESEM；
Fig. 7-b are the lamination saw blade Cross Section Morphology that the present invention observes under ESEM.
【Embodiment】
Weak point as shown in Figure 1 is had based on metal-base diamond saw blade sawing segmentation BGA package IC devices, with reference to
For cutting operating mode on the basis of analysis failure cause and failure mode, present invention proposition is a kind of to have the production of laminated construction saw blade at present
The Design Conception of product, form to go out with the differentiation in mechanical property, suppression sword end convex phenomenon in component by each individual layer
It is existing, it is expected to obtain the cutting effect that each layer synchronously wears.Specifically, the present invention proposes that a kind of cut based on IC package device is used
Laminated metallic base diamond saw blade, on the basis of previously prepared individual layer, by multiple individual layer stack combinations, then through hot pressed sintering system
Complex is obtained, makes it have laminated construction, and is collectively formed by top layer and sandwich layer and takes on each different cutting functions.Each
Individual layer changes the structural configuration and combining form of complex by optimizing metal matrix composition and ratio under sintering condition, and then
Regulate and control inherent mechanics and physical property, realize the appropriateness reduction of the efficient hardening and sandwich layer on top layer, synchronously ground to obtain each layer
The effect of damage.According to technical scheme and the selected technology path that the present invention constructs is implemented, constructing laminated construction has power
The differentiation configuration of collocation, establishing the mechanism that core table coordinates abrasion so that each layer should use up function and be not fully exerted, so that
On the premise of being effectively improved chip cutting quality, significantly improve the cutting efficiency of lamination saw blade and extend service life.
To achieve the above object, the present invention intends being achieved by following design design and technical scheme.
1. it is laminated the construction thinking of saw blade
In the case where saw blade product there should be ultrathin substantially 0.4-0.8mm requirement, propose that a kind of multiple-layer stacked is compound
The imagination of construction.Top layer and sandwich layer are designed to, takes on the main function of resistance abrasion and sharp cutting respectively, for regulating and controlling
Form is cut at sword end, establishes the mechanism of core table matching abrasion.Therefore the functional localization on top layer should not only plate fixing diamond, prevent
It comes off too early, should also maintain diamond abrasive grain go out sword it is sufficiently high under the premise of, be always ensured that the wearability adaptable with it；
And the functional localization of sandwich layer then should firmly hold diamond, the high sharpness for going out sword degree, strengthening cutting of abrasive particle, and companion are maintained
Allow the continuous exposure of new abrasive particle with diamond drop-off, ensure the sharp ability persistently cut.
The guiding theory of design lamination saw blade is to strengthen top layer, weakens sandwich layer, and design core is the difference of the strong and weak collocation of construction
Alienation configuration, Key of Implementation are the size and precision controlling that top layer is relatively thin, sandwich layer is slightly thick.Sum up in the point that fundamentally, exactly regulate and control simultaneously
Resolve many technologies and technological problemses prepared by relevant individual layer.
Basic constituent element of the individual layer as construction lamination saw blade, is made up of metal matrix and diamond abrasive mixture, thus
The enhancing of different individual layers or decrease, substantially seek to assign its corresponding internal performance, this will from metal matrix form and
Consider with matching for diamond.Specific implementation is seen down.
Designed 2. single-layer metal base diamond composite property is evaluated with composition
The mechanical property of 2.1 metal matrix diamond composites
A kind of individual layer mentioned above actually metal matrix diamond composites, are constructed so as to be intended to plate holding using the former
The latter makes it have dissection.The basic composition of metal matrix and diamond abrasive grain as individual layer, it is big in selected abrasive particle
Fixed carcass composition and composition proportion are designed under small and concentration, and changes its internal performance, Jin Erda by changing both
Strengthen the effect with sandwich layer reduction to top layer.Mechanical property and the dependence of carcass composition are explored for this, to be guidance
The reference frame that single-layer metal carcass designs and optimization provides.
The proportioning composition and preparation technology of metal matrix diamond composites have together decided on the intrinsic mechanical property of individual layer.
The present invention is selected using metal Sn powder as bonding phase, using Ni metal and prealloy CuSn20 powder as the equal construction carcass of skeleton,
And test test specimen is prepared using hot pressed sintering or vacuum brazing method, mainly investigate bending strength (σw), density (ρ) and hardness
(HRB/Hm) rule changed with matrix composition, the reason for analyzing change, propose that effectively enhancing top layer and appropriateness weaken accordingly
Implementer's case of sandwich layer.
(1) bending strength σwMeasure and its influence factor
Mixed in the range of 5-24% from different Sn contents with Cu and diamond abrasive grain, in 680 DEG C of temperature, insulation
It is L40 × W3 × H8mm test specimens that specification is prepared under the conditions of 10min and pressure 35MPa, determines at 3 points with Instron1195 testing machines
Bend bending strength σwValue is as shown in Fig. 2 therefrom find σwThe trend for first increasing and dropping afterwards is presented with the rise of Sn contents for value, at 12%
Reach maximum 463MPa, illustrate hereafter by increase Sn contents come improve bond strength between carcass and diamond will be by
Limitation, drastically decline especially more than its value after 15%.Main cause is except small part Sn and Cu reactions generation alloy such as hard crisp δ
Outside compound phase, more then it is present in after cooled and solidified with crystalline state in carcass, result in fragility increase.
Reduce Sn contents below 7% or bring up to more than 24%, metal matrix diamond composites show extremely to show
The plasticity of work and fragility converting characteristic, and obtain substantial amounts of process practice and prove.When Sn is less than 7% in individual layer preparation process
When, product produce often excess extension, occur with edge-curl phenomenon, so seriously change original design, make matrix composition and
Diamond distribution is uneven；When Sn is higher than 24%, there is embrittlement or broken mostly in product after coming out of the stove, be difficult to ensure that its whole body is complete, shadow
Ring normal shaping；When Sn increases between 7-24%, it can generally meet prepared by single layer process and require.
Only from obtaining maximum σwValue is set out, and carcasses of the Sn near 12% should be selected to be combined with diamond ideal, is
This experiment prepares the carcass material and composite wood of same size under these conditions when from Sn being respectively 9%, 13% and 18%
Expect test specimen, and σ is measured through lot of experimentswAssembly average is as shown in figure 3, therefrom find out following difference：
In the Sn content ranges of selection, σ corresponding to compositewValue substantially fluctuates in 440-510MPa, and works as Sn
For 13% when it is relatively large, be consistent substantially with aforementioned phenomenon；And σ corresponding to carcass materialwValue changes in 570-720MPa, and
It is gradually reduced with the increase of Sn contents.Illustrate the former presence due to diamond, destroy the original uniformity consistency structure of carcass,
And many fine gaps are formed around particle, or even on faying face produce pockmark the defects of, its σwValue reduction is to be contemplated that
's.
Under corresponding Sn contents, the σ of carcass material is measuredwValue is above composite σwValue, and when Sn contents are
When 9%, its σwDifference about 260MPa, and when Sn contents be 18% when, σwDifference be about 130MPa, display Sn contents it is higher when,
The σ of compositewIt is worth the σ of relatively close carcass materialwValue, show that carcass is tied to diamond hold closer to the inherent of itself
With joint efforts.
Result above again shows that, the σ of compositewIt is strictly maximum occur with Sn changes of contents, corresponding composition
Substantially near 12% or 13%, while also indicate that hereafter increase Sn contents, the σ of compositewAlthough value reduces, with tire
Body material-reduced σwValue difference not Cheng diminution gesture, the bond strength being favorably improved between carcass and diamond, this for ensure
When material has enough bending strengths, take into account and provide reference frame with other performance Proper Matchs.
(2) the effect of density and sintering parameter to bending strength
Bending strength is also influenceed in addition to being influenceed by mentioned component by densification degree and alloying level, and the two
Factor has inevitable contact with sintering process again.It has been generally acknowledged that consistency ρ is bigger, to its σwContribution is bigger.Fig. 4 shows to work as
The carcass material and composite that Sn accountings are 20%, with holding time ρ change, can be seen under different sintering temperatures
Go out the constant rise sintering temperature of either soaking time by 650 DEG C to 710 DEG C, or sintering temperature is constant to extend soaking time
By 10min to 50min, density is slightly in increase tendency, but it is even have fluctuation and overall amplification is little, its value correspond to carcass material and
Composite is respectively in 8.48-8.75g/cm3、7.81-7.98g/cm3In the range of fluctuating change, show under above sintering condition
Change temperature and time, significant change does not occur for density, and it is to σwInfluence tend towards stability.
Fig. 5 shows that above-mentioned carcass material and composite are burnt with junction temperature rise and holding time to σwInfluence,
σ corresponding to it was found thatwValue obtains different degrees of raising, particularly when Composite Sintering temperature rises to 680 DEG C from 650 DEG C
When, σwValue about increases to nearly 510MPa by 310MPa, and amplification reaches 200MPa, shows tyre body alloy degree and further improves to increasing
Big σwRemarkable effect, but at 710 DEG C, amplification is little, maintains the σ roughly the same with previous temperaturewLevel, illustrate 680
Alloying is relatively abundant near DEG C, and the effect for raising temperature again seems little.
(3) hardness test and measure
Tyre body hardness mainly influences the wearability of carcass.Usual hardness is higher, and carcass is got over not easy to wear.But excessive high hardness,
It is unfavorable for the exposure of diamond particles, causes saw blade product cutting rust, easily produce cutting heat, or even spark occur；Hardness
It is too low, easily increase diamond particles exposure amount, though being advantageous to cut sharpness raising, also accelerate early fallout, especially
It is in the case of high rotating speed 25-35Krpm, large inflow 150-250mm/s.
The test specimen for being used for hardness number detection in actual production is the OD50 × H25mm cylinders specially sintered, in it not
Containing diamond, only it is made up of metal dust, is derived from carcass compound, and prepare using with individual layer identical sintering process.This hair
It is bright to change to investigate Sn on influence caused by hardness, the test specimen of same size is also prepared in the range of its content 5-24% and is measured
Corresponding hardness number is as shown in Figure 6, it is clear that increases with Sn contents, hardness also increases therewith, and is in along with the reduction of plasticity
Reveal the feature of fragility increase.
According to graphical results, for top layer and sandwich layer can determine that carcass amount containing Sn substantially respectively more than 18% with 13%
Hereinafter, so as to ensureing the hardness of saw blade or plastic behavior.The main reason for increase Sn contents can significantly improve hardness is identical
Under sintering temperature, more LIQUID Sns are permeable between more Cu particles under pressure, so as to promote it to be changed into gold
Belong to compound, and the firmly crisp tendency of carcass is enhanced with its hard fragility matter.
It is to also lack direct survey so far nothing but on the above mechanical property test research of carcass material or composite
Determine between metal matrix and simple grain diamond in the case of bond strength effective means, diamond is adapted to so as to description tyre body abrasion
From it is sharp when the size of adhesion or hold is produced to it.But from hot-pressing sintering method, essentially from carcass to Buddha's warrior attendant
The contribution of the mechanical interlocking and Chemical bonding of stone, both of which can be characterized indirectly with the bending strength and consistency of material, its
The hold of the more big then carcass of value is bigger, shows that diamond is more difficult for drop-off, so as to give full play to its shear action.But hold
Power can not still come off greatly to when diamond has lost cutting function, it would be desirable that carcass synchronizes abrasion, the control of its hardness
It is not the higher the better with regard to most important, but the more adapts to the more good, such cutting tools just can be sharp enough, and can guarantee that longevity
Life cutting.
The formula composition design that 2.2 individual layers are strengthened or reduction is implemented
(1) the composition on top layer and reinforcing
In the case of normal cutting is ensured, wear-resisting functions are mainly highlighted, and contain by improving bonding phase Sn in metal matrix
Amount arranges in pairs or groups slightly higher concentration 55-65% to give within 18-22 parts by weight, from 38-45 μm of diamond finer grain (325/400)
To realize.Metal matrix middle skeleton is mutually based on Cu and CuSn20 powders (- 300 mesh), and its accounting changes with Sn contents, generally
Selected respectively in 21-26,68-72 parts by weight.In this formula under the conditions of 700 DEG C of temperature, insulation 7min and pressure 24MPa
Measure carcass material hardness be HRB92-96, averag density 8.66g/cm3And bending strength is 570-590MPa, composite
Bending strength and density be that average value is 440MPa, 7.78g/cm3。
Research is thought when Sn contents are up to more than 18%, though the bending strength of carcass material and composite is not high,
Both differences are obviously reduced.Show that carcass holds firm to abrasive particle and will not come off too early, but hardness significantly increases, then be aided with
The diamond abrasive grain of little particle, high concentration, it is comprehensive make it that the wear-resistant effect in top layer is especially prominent.Fine granularity abrasive particle also contributes to simultaneously
Section obtains smooth cutting effect.
(2) the composition of sandwich layer and reduction
Sandwich layer mainly plays the function for digging sawing, and it is the key of construction lamination saw blade, is preferably used for dropping in metal matrix
Low Sn contents are within 9-13 parts by weight, from the slightly lower concentration 50- of 53-63 μm of diamond larger granularity (230/270) collocation
60% realizes it.It is aided with based on Cu, CuSn10 powder (- 300 mesh) and in right amount additive filler in metal matrix and is modified,
Relative amount is respectively to be selected in 37-43,47-53 parts by weight.In this formula in 700 DEG C of temperature, insulation 7min and pressure
Measured under the conditions of 24MPa carcass material hardness be HRB74-78, density 8.62g/cm3And bending strength is 660-680MPa,
The bending strength and density average of composite are respectively 500-515MP, 7.74g/cm3。
Experiment is also indicated that in the Sn content ranges of selection, has generally corresponded to relatively low hardness and higher bending strength.
The former, which is advantageous to tyre body abrasion, then allows the continuous exposure of abrasive particle, and the latter contributes to carcass strength holding abrasive particle then to allow its exposure
It is higher, and be higher by from larger grain size abrasive grain to be formed in the case of sword degree provides prerequisite, integrate so that sandwich layer is sharp cuts
The advantage cut is given full play to.
(3) top layer is compared with the construction features of sandwich layer and effect is expected
It is significantly different existing for top layer and sandwich layer to show following three aspect according to the composition that assembles as above designed.
Formed from carcass, top layer improves hardness from high Sn contents and then strengthens wearability, and sandwich layer selects low Sn
Content reduces hardness with sharp abrasive particle exposure, is to realize respective functional requirement by changing Sn relative amount.Only from hard
It can be simply viewed as being case-hardening and sandwich layer softening in degree change, but actually be then to regulate and control the knot of carcass using Sn change
Structure configuration and the combining form with abrasive particle, then change densification degree and interface bonding state, and nationality intensity, plasticity and toughness
Reasonable cooperation, obtain the effect of multiple strengthening or reduction.
Assembled from diamond abrasive grain, top layer is arranged in pairs or groups with fine granularity and high concentration, except considering to take precautions against chipping or slitting
Mouthful etc. it is abnormal occur, suppress splintery fracture and ensure outside the cut quality of flattened edge, be then more to improve resistance abrasion
Premised on consumption；And sandwich layer is arranged in pairs or groups with big granularity and low concentration, mainly ensure the high efficiency cutting being higher by under sword degree.
Lamination saw blade is a kind of at least more than three layers of odd number multi-layer compound structure, and top layer and sandwich layer interval are built,
I.e. in the differentiation configuration of strong and weak matching.It is constructed so as on the ultrathin of saw blade product requirement, it is expected to be formed in cutting
Straight excessive sword end pattern is easily realized, but is also not excluded for the possibility for matrix or W type shapes occur, and this is to splitting cutting off processing
Do not adversely affect, only require width of slit unanimously and trimming it is vertical, but for cut groove processing then reduction or
While eliminating excessive fillet, it is possible to raised or corrugated groove is formed in bottom surface and brings adverse effect.
3. it is laminated the main points of saw blade preparation method
Lamination saw blade preparation be built upon on the basis of some individual layer superimposions, before it is firm from single-layer metal fund
The composition design and performance evaluation of stone composite material, which is started with, to be optimized, and accomplishes the regulation and control to its inherent quality, this is to complete
A vital task.But also a vital task is exactly to be laminated the slimming of saw blade product manufacturing, this is to determine that its is final
The key of shaping, the techniques such as prepared by individual layer, multiple-layer stacked is sintered combined and thickness is thinned are related generally to, are worth strict management and control.Tool
Body is implemented using following methods.
3.1 powders are pelletized and individual layer cold-press moulding
Formula composition according to 2.2 designs weighs the metal dust and diamond particles of respective amount respectively, using wet mixing side
Formula and after being thoroughly mixed, then capable granulation makes it be in pellet, size is about 0.5-0.7mm, so as to realizing diamond abrasive ratio
It is also relative to improve apparent density while more uniform distribution is in carcass, not only improve thick during die cavity cloth before control is cold-pressed
The uniformity of degree, it is also beneficial to strengthen mobility of the powder in cold pressing, is substantially shunk so that producing volume after cold pressing.But by
It is tiny in diamond abrasive, often granulation expect in number, also can it is exposed on the surface so that abrasive material distribution it is very unequal
It is even, wait further to be lifted.
Above-mentioned granulation material is uniformly distributed in steel die and is placed on press, keeps 2-4s to be made under 100 tons of pressure
Individual layer is cold-pressed state pressed compact, and its skin depth is can be controlled in the range of 0.24-0.26mm, and its core layer thickness can be controlled in 0.33-
In the range of 0.35mm.
3.2 multiple-layer stackeds are sintered combined
More than 3 cold pressing state individual layer pressed compacts are taken to be moved into after being positioned in hot pressing die pair in sintering furnace, after the 24MPa that presses
By 80 DEG C/min of heating, 700 DEG C of insulation and delay 7min setup parameters, lamination saw blade sintered state blank is produced.Three layers compound
Thickness is sintered within 0.62-0.66mm.
In this process operations, pay close attention in addition to assigning the due material condition of complex, also multiple individual layers
Can firm phenomenon compound and that layering will not be produced, and the problem of thus cause thickness to change.For rear kind of problem
Solution it is expected to obtain as thinner as possible thickness, to avoid processing is thinned and bringing internal performance because follow-up loss, this
With regard to needing to ensure to improve pressure and temperature.So being possible to change top layer and sandwich layer, each the relative of internal component contains
Amount, particularly Sn is easy to scattering and permeating at high temperature and pressure, so as to the disloyal original intention of original design, therefore should not use.But
Pressure and temperature is not improved, the generation for planting phenomenon before strick precaution, which just seems, takes effective measures.In fact just pay attention to initial stage from design
To this problem, and solved from carcass composition.Top layer and sandwich layer are specifically designed as to have same or like change
Composition is learned, can be spread under the conditions of hot pressed sintering by Sn interface, be induced Cu powder and change and promote alloying so that individual layer
Between easily realize metallurgical binding and be complex as a whole.
Fig. 7 is the cross-section morphology in surface sweeping electricity Microscopic observation single layer structure and sandwich construction, it can be seen that each layer of the latter it
Between achieve firm interface cohesion, notable difference is not yet found on carcass construction compared with the former, but in diamond particles
But there are significant changes in distribution.
3.3 thickness are thinned
Limited by technological measure, the disposable sintered state blank in place of thickness can not be obtained, it is therefore desirable to thickness is thinned
Spend and reach the planarity requirements of consistency of thickness.Free abrasive double side grinding process is specifically used, is divided into corase grind and fine grinding work
Sequence is simultaneously carried out on different private use plane grinders.Existing operation will be put one by one through the finished sintered state blank of inside and outside circle
Enter using lower millstone as in the erratic star wheel of bearing, SiC is injected separately into the case where falling upper millstone pressure 0.12-0.18MPa, and (granularity is
32-40 μm) or diamond (10-20 μm of granularity) oiliness lapping liquid (concentration 0.25-0.35Kg/ml) be used for roughly grind or refine,
Main shaft being opened simultaneously the upper and lower mutually opposing circular motion of mill being driven with 20-50rpm rotating speeds, erratic star wheel rotates and driven therewith
Workpiece is revolved round the sun in lapping liquid and rotation.Rubbed and be ground by sand grains in pressure effect upper and lower surface, until size and precision will
Ask.
Carry out the above content of the invention to explore and study, it is intended to for being laminated the actual production of saw blade.Below with reference to implementation
Example is explained to its embodiment, and its implementation result is verified with application on site example.
The specification of embodiment 1 is the preparation of OD78 × T0.4 × ID40 laminating three layers saw blade
Diamond is 38-45 μm (325/400), concentration 65% from granularity during dispensing and batch mixing are formed on top layer, tire
Body is respectively 20,26 and 70 parts by weight from metal dust Sn, Cu and CuSn20；And diamond selects granularity in sandwich layer composition
For 53-63 μm (230/270), concentration 55%, carcass is respectively 10,42 and 50 weights from metal dust Sn, Cu and CuSn10
Measure part, and additional appropriate modifier.
Formed by above-mentioned formula and weigh corresponding parts by weight dispensing respectively, batch mixer stirring is put into after considering addition wetting agent
No less than 8 hours obtained compounds, are granulated in a manner of rubbing sieve with the hands and are dried under protective atmosphere immediately, you can it is uniform to obtain composition
The uniform pellet particle of abrasive particle.
Individual layer cold-press moulding adds appropriate binder or lubricant in granulation is expected and is distributed in punching block, is put after capping
100 tons of pressure and the obtained individual layer shaping pressed compacts of pressurize 2s are contacted and applied with top board on press lower platen, being slowly promoted to, and
Observation has the defects of flawless, gap and hole to occur, and especially detects thickness and its uniformity.
MULTILAYER COMPOSITE hot pressed sintering takes 3 individual layer pressed compacts to be loaded in mould and moved into the lump in sintering furnace after centering positioning,
According to 80 DEG C 80 DEG C/min of programming rate, 700 DEG C of sintering temperature, soaking time 7min, cooling velocity/min after the 24MPa that presses
Process conditions under sintering produce blank.
Forming to the finishing of sintering blank or and correction after implement to form, substantially cut by inside and outside circle, be thick
Spend the process such as thinned to carry out, OD78 × T0.40 × ID40 terminal saw blade product is so far made.
Application example cutting on line different size on different EAD6340K scribing machines with the saw blade that above-mentioned preparation method produces
Chip, concrete application situation are respectively：
Under speed of mainshaft 25Krpm, the Micro SD using feed rate 250mm/s cut form as 1 × 11 × 15mm
Chip is encapsulated, effective cutting length 6Km, corresponding external diameter consumption is 2.25mm, 0.37 μm/m of wear rate average out to；
Cut lengths are 0.7 × 8 × 10mm BGA package core under speed of mainshaft 25Krpm, feed speed 200mm/s
Piece, effective cutting length reach more than 4Km, and corresponding radial wear is 0.52mm, and wear rate is only 0.13 μm/m；
In the case where ensureing chip cutting quality and maintaining Cutting Length constant, above-mentioned feed speed is carried at present
High 450mm/s till now, cutting efficiency are lifted by about one time, significantly shorten the online production duration.
The specification of embodiment 2 is the five of the OD58 × T0.8 × ID40 preparation for pressing saw blade layer by layer
Individual layer prepare top layer from diamond grit be 38-45 μm (325/400), concentration be 60% and metal dust Sn,
Cu and CuSn20 is respectively that 18,21 and 70 parts by weight are formed, and sandwich layer includes time sandwich layer and sandwich layer, by the following two kinds structure.
It is respectively from diamond grit 53-63 μm (230/270), concentration 55% and metal dust Sn, Cu and CuSn10
9th, 42 and 50 parts by weight form as time core layer formulation；
Granularity from diamond abrasive is 45-53 μm (270/325), concentration is 55-65% and metal and prealloy powder
Last Cu, Co, Ni, CuSn20 are respectively sandwich layer composition proportion of 30,20,15 and 35 parts by weight as among.
Saw blade prepare it is different from three layers of saw blade product in embodiment 1, though this money product using five layers of superimposion,
Processing procedure is identical, therefore is performed with reference to the preparation method that it is used with the processing step implemented.
Application example with this saw blade on EAD6430K using rotating speed 30Krpm, amount of feeding 120mm/s cut form as
0.6 × 5 × 7.5 or 0.65 × 5 × 5mm chip bga, it is no more than 2.0mm requirement in control saw blade diameter wear extent
Under, effective cutting length 3Km, corresponding wear extent is 0.7mm, 0.23 μm/m of wear rate average out to.
In the present invention, the concentration of diamond is defined as：The content of diamond in unit volume, its unit be carat/li
Rice3.According to standard, 100% concentration contains 4.39 carats of diamond in representing per cubic centimeter.
Claims (9)
1. one kind uses laminated metallic base diamond saw blade based on the cutting of IC package device, it is characterised in that：The saw blade is by multiple lists
Layer superimposion is formed, and individual layer is divided into top layer and sandwich layer according to saw blade construction, and each individual layer is by metal matrix and Buddha's warrior attendant stone mill
Material composition, wherein, the diamond particles on top layer are less than the diamond particles size of sandwich layer, and the diamond concentration on top layer is more than sandwich layer
Diamond concentration；Described metal matrix is mainly made up of Cu, Sn, and CuSn alloys, wherein, the Sn contents in top layer are big
Sn contents in sandwich layer；The diamond particles size on top layer is 38-45 μm, concentration 55%-65%；The diamond of sandwich layer
Grain size is 53-63 μm, concentration 50%-60%.
2. a kind of cut based on IC package device according to claim 1 uses laminated metallic base diamond saw blade, its feature
It is：The CuSn alloys on the top layer are CuSn20, and the CuSn alloys of sandwich layer are CuSn10.
3. a kind of cut based on IC package device according to claim 1 uses laminated metallic base diamond saw blade, its feature
It is：The metal matrix on the top layer is configured to：Cu the and 18-22 weight of CuSn20,21-26 parts by weight of 68-72 parts by weight
The Sn of part；The metal matrix of the sandwich layer is configured to：Cu the and 9-13 weight of CuSn10,37-43 parts by weight of 47-53 parts by weight
The Sn of part.
4. a kind of cut based on IC package device according to claim 1 uses laminated metallic base diamond saw blade, its feature
It is：Further comprise there is center core layer at the center of described each individual layer, form skin/core/center core layer/sandwich layer/top layer,
Wherein, the particle of described sandwich layer diamond is more than the diamond particles of center core layer.
5. a kind of cut based on IC package device according to claim 4 uses laminated metallic base diamond saw blade, its feature
It is：The diamond particles size of the center core layer is 45-53 μm, and the concentration of the diamond of the center core layer is 55%-65%.
6. a kind of cut based on IC package device according to claim 4 uses laminated metallic base diamond saw blade, its feature
It is：The metal matrix of the center core layer is configured to：Cu, 18-22 weight of CuSn10,27-33 parts by weight of 32-38 parts by weight
The Ni of the Co and 12-18 parts by weight of part.
It is 7. as claimed in any of claims 1 to 6 a kind of firm with laminated metallic fund based on the cutting of IC package device
Stone saw knife, it is characterised in that：When the saw blade is applied to the chip of BGA package, its feed speed reaches 450mm/s, effectively cutting length
Degree reaches 6Km.
A kind of a kind of 8. system based on the cutting of IC package device with laminated metallic base diamond saw blade based on described in claim 1
Make method, it is characterised in that：Will cold pressing or hot pressing made of multiple individual layer pressed compacts, it is alternate stack after be placed in sintering mold, it is right
In, positioning, fastening after, by mould place sintering furnace in, in the condition that compression is 24MPa, programming rate is 80-90 DEG C/min
Under be warming up to 780-820 DEG C, after being incubated 6-8min, room temperature is cooled to 60-80 DEG C/min speed, then implements hot pressing burning
Knot, the blank of sintering is finally subjected to inside and outside circle, two-sided thinned and peripheral milling processing and forming, final saw blade is made.
A kind of 9. manufacturer based on the cutting of IC package device with laminated metallic base diamond saw blade according to claim 8
Method, it is characterised in that：During described individual layer pressed compact, after metal matrix and diamond abrasive grain are stirred first, then
Row granulation makes it be in shot structure, size 0.5mm-0.7mm, diamond abrasive grain is evenly distributed in metal matrix.
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| CN113211337B (en) * | 2021-05-18 | 2023-04-07 | 南通大学 | Preparation method and precision polishing method of polishing disc for superhard substrate polishing |
| CN113681004B (en) * | 2021-08-10 | 2024-11-19 | 泉州众志新材料科技有限公司 | A method for preparing high-cost-effective fine slices and fine slices |
| CN114472889B (en) * | 2021-12-28 | 2024-02-20 | 苏州赛尔科技有限公司 | Ultra-thin superfinishing cutter with metal binding agent and preparation method |
| CN114905420A (en) * | 2022-04-18 | 2022-08-16 | 郑州磨料磨具磨削研究所有限公司 | Multi-element cross-scale laminated composite diamond grinding wheel and forming method |
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| JPS6230804A (en) * | 1985-08-01 | 1987-02-09 | Yoshinobu Kobayashi | Multi-layer sintering method for sintered hard material powder and ferrous metallic powder by powder hot press method |
| FR2706630B1 (en) * | 1993-05-10 | 1995-09-08 | Aerospatiale | Method for manufacturing a reflector with a metal matrix composite support, and reflector thus obtained. |
| US7323049B2 (en) * | 1997-04-04 | 2008-01-29 | Chien-Min Sung | High pressure superabrasive particle synthesis |
| US20030159555A1 (en) * | 2002-02-22 | 2003-08-28 | Perry Edward Robert | Thin wall singulation saw blade and method |
| CN101510527B (en) * | 2009-03-13 | 2011-01-26 | 西安点石超硬材料发展有限公司 | Thin metal-based diamond cutting sheet for saw cutting of semiconductor chip BGA package and manufacturing method thereof |
| CN101590666A (en) * | 2009-07-10 | 2009-12-02 | 丹阳市华锋钻石工具机械有限公司 | A kind of processing method of diamond disc |
| CN101870008B (en) * | 2010-06-11 | 2012-01-11 | 西安点石超硬材料发展有限公司 | Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate |
| CN101879597B (en) * | 2010-06-11 | 2011-12-07 | 西安交通大学 | Preparation method of metal sintering-type diamond saw cutter for cutting QFN (Quad Flat Non-Leaded Package) packaging device |
| CN102001056B (en) * | 2010-09-27 | 2012-08-15 | 安泰科技股份有限公司 | Brazing-hot pressing diamond tool and manufacturing method thereof |
| CN102049814A (en) * | 2010-11-27 | 2011-05-11 | 常州华中集团有限公司 | Diamond saw blade and manufacturing method thereof |
| CN103350232A (en) * | 2013-07-31 | 2013-10-16 | 王建国 | Production method of diamond circular saw blade by cold-press molding and hot-press sintering |
| CN203783475U (en) * | 2014-03-17 | 2014-08-20 | 中矿资源勘探股份有限公司 | Diamond bit with metal plate internally |
| CN204354312U (en) * | 2014-05-30 | 2015-05-27 | 上海荣子锯片有限公司 | The diamond saw blade of cutting aerated blocks |
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