CN105869891A - A SMD Electrolytic Capacitor - Google Patents
A SMD Electrolytic Capacitor Download PDFInfo
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- CN105869891A CN105869891A CN201610196742.5A CN201610196742A CN105869891A CN 105869891 A CN105869891 A CN 105869891A CN 201610196742 A CN201610196742 A CN 201610196742A CN 105869891 A CN105869891 A CN 105869891A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 38
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 26
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000007784 solid electrolyte Substances 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 10
- 239000010439 graphite Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 5
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/153—Skin fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/032—Inorganic semiconducting electrolytes, e.g. MnO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/07—Dielectric layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
技术领域technical field
本发明涉及电容器技术领域，特别涉及一种贴片式电解电容器。The invention relates to the technical field of capacitors, in particular to a patch type electrolytic capacitor.
背景技术Background technique
电容器通常简称其为电容，是一种容纳电荷的器件。对于电解质电容器，一般指铝电解质电容器，其使用薄氧化物膜作为电介质材料，用铝作为电极材料。由于可以制成非常薄的电介质材料，所以相比于电容器的体积来说可以获得相对大的电容。如何设计一种结构简单的贴片式电解电容器是本发明所要解决的技术问题。A capacitor, often referred to simply as a capacitor, is a device that holds charges. For electrolytic capacitors, it generally refers to aluminum electrolytic capacitors, which use a thin oxide film as the dielectric material and aluminum as the electrode material. Since the dielectric material can be made very thin, a relatively large capacitance can be achieved compared to the volume of the capacitor. How to design a chip electrolytic capacitor with simple structure is the technical problem to be solved by the present invention.
发明内容Contents of the invention
本发明的主要目的是提供一种体积小、容量大、结构简单的贴片式电解电容器。The main purpose of the present invention is to provide a chip type electrolytic capacitor with small volume, large capacity and simple structure.
本发明提出一种贴片式电解电容器，包括外壳和置于所述外壳内的电容器元件，所述电容器元件包括电容芯子、负极引线和正极引线，所述外壳由置于两端的正极电极套、负极电极套和连接在所述正极电极套与所述负极电极套之间的绝缘套构成，所述绝缘套与所述正极电极套、所述负极电极套之间通过卡扣方式连接，在所述绝缘套内壁面的两端设有卡槽，在所述正极电极套与所述负极电极套的与所述绝缘套相连的一端设有与所述卡槽对应的卡勾，通过所述卡勾扣入相应的所述卡槽中，使所述正极电极套、负极电极套与所述绝缘套相互连接形成外壳；The present invention proposes a patch type electrolytic capacitor, which includes a casing and a capacitor element placed in the casing, the capacitor element includes a capacitor core, a negative lead and a positive lead, and the casing is covered by positive electrode sleeves placed at both ends. , a negative electrode sleeve and an insulating sleeve connected between the positive electrode sleeve and the negative electrode sleeve, and the insulating sleeve is connected to the positive electrode sleeve and the negative electrode sleeve through a buckle. The two ends of the inner wall of the insulating sleeve are provided with slots, and the ends of the positive electrode sleeve and the negative electrode sleeve connected to the insulating sleeve are provided with hooks corresponding to the slots. The hooks are snapped into the corresponding slots, so that the positive electrode sleeve, the negative electrode sleeve and the insulating sleeve are connected to each other to form a shell;
所述电容芯子包括由钽金属粉压制成块后高温烧结而成的多孔形钽粉烧结块正极基体，所述钽粉烧结块正极基体的表面经阳极氧化形成有TaO5膜，在所述钽粉烧结块正极基体的负极端通过浸渍硝酸锰再经高温烧结形成固体电解质MnO2层，在所述固体电解质MnO2层上覆盖有负极石墨层，在所述负极石墨层上喷涂有铅锡合金导电层，所述正极引线从所述钽粉烧结块正极基体内伸出至与所述正极电极套接触，所述负极引线从所述固体电解质MnO2层伸出至与所述负极电极套接触。The capacitor core includes a porous tantalum powder sintered block positive electrode substrate formed by pressing tantalum metal powder into blocks and sintering at high temperature. The surface of the tantalum powder sintered block positive electrode substrate is anodized to form a TaO5 film. The negative end of the powder sintered block positive electrode substrate is impregnated with manganese nitrate and then sintered at high temperature to form a solid electrolyte MnO2 layer, the solid electrolyte MnO2 layer is covered with a negative electrode graphite layer, and a lead-tin alloy conductive layer is sprayed on the negative electrode graphite layer , the positive electrode lead protrudes from the tantalum powder sintered block positive electrode matrix to contact the positive electrode sleeve, and the negative electrode lead protrudes from the solid electrolyte MnO2 layer to contact the negative electrode sleeve.
优选地，所述负极引线为铜丝，所述正极引线为镍丝。Preferably, the negative electrode lead is copper wire, and the positive electrode lead is nickel wire.
本发明的贴片式电解电容器的有益效果为：The beneficial effect of chip type electrolytic capacitor of the present invention is:
本发明的外壳由置于两端的正极电极套、负极电极套和连接在正极电极套与负极电极套之间的绝缘套构成，绝缘套与正极电极套、负极电极套之间通过卡扣方式连接，在绝缘套内壁面的两端设有卡槽，在正极电极套与负极电极套的与绝缘套相连的一端设有与卡槽对应的卡勾，通过卡勾扣入相应的卡槽中，使正极电极套、负极电极套与绝缘套相互连接形成外壳，结构简单，组装方便。The casing of the present invention is composed of a positive electrode sleeve placed at both ends, a negative electrode sleeve and an insulating sleeve connected between the positive electrode sleeve and the negative electrode sleeve. , the two ends of the inner wall of the insulating sleeve are provided with a slot, and the end of the positive electrode sleeve and the negative electrode sleeve connected to the insulating sleeve is provided with a hook corresponding to the slot, and the hook is buckled into the corresponding slot. The positive electrode sleeve, the negative electrode sleeve and the insulating sleeve are connected to each other to form a shell, which has a simple structure and is convenient for assembly.
贴片式电解电容器采用颗粒很细的钽粉压制成块后高温烧结成多孔形的钽粉烧结块正极基体，其单体积内的有效面积大，使用温度范围宽；钽粉烧结块正极基体的表面经阳极氧化形成有TaO5膜，TaO5膜的介电常数比铝氧化膜的介电常数大；在钽粉烧结块正极基体的负极端通过浸渍硝酸锰再经高温烧结形成固体电解质MnO2层，在固体电解质MnO2层上覆盖有负极石墨层，在负极石墨层上喷涂有铅锡合金导电层；因此在相同耐压和电容量的条件下，贴片式电解电容器的体积比铝电解电容器的体积要小得多，可制成超小型元件，而且性能稳定，长时间工作仍能保持良好的电性能。SMD electrolytic capacitors are pressed into blocks with very fine tantalum powder and then sintered at high temperature to form a porous tantalum powder sintered block positive substrate, which has a large effective area in a single volume and a wide operating temperature range; The surface is anodized to form a TaO5 film, and the dielectric constant of the TaO5 film is larger than that of the aluminum oxide film; the negative end of the tantalum powder sintered block positive electrode substrate is impregnated with manganese nitrate and then sintered at high temperature to form a solid electrolyte MnO2 layer. The solid electrolyte MnO2 layer is covered with a negative electrode graphite layer, and a lead-tin alloy conductive layer is sprayed on the negative electrode graphite layer; therefore, under the same withstand voltage and capacitance conditions, the volume of the chip electrolytic capacitor is smaller than that of the aluminum electrolytic capacitor. It is much smaller and can be made into ultra-small components, and its performance is stable, and it can still maintain good electrical properties after working for a long time.
附图说明Description of drawings
图1为本发明的贴片式电解电容器的的剖视图。FIG. 1 is a cross-sectional view of a chip-type electrolytic capacitor of the present invention.
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization of the purpose of the present invention, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.
具体实施方式detailed description
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
参照图1，提出本发明的贴片式电解电容器的一实施例：With reference to Fig. 1, propose an embodiment of the chip type electrolytic capacitor of the present invention:
一种贴片式电解电容器，包括外壳和置于外壳内的电容器元件，电容器元件包括电容芯子、负极引线和正极引线。外壳由置于两端的正极电极套11、负极电极套12和连接在正极电极套11与负极电极套12之间的绝缘套13构成，绝缘套13与正极电极套11、负极电极套12之间通过卡扣方式连接。在绝缘套13内壁面的两端设有卡槽，在正极电极套11与负极电极套12的与绝缘套13相连的一端设有与卡槽对应的卡勾14，通过卡勾14扣入相应的卡槽中，使正极电极套11、负极电极套12与绝缘套13相互连接形成外壳，结构简单，组装方便。A patch type electrolytic capacitor includes a shell and a capacitor element placed in the shell, and the capacitor element includes a capacitor core, a negative lead and a positive lead. The shell is composed of positive electrode sleeve 11, negative electrode sleeve 12 placed at both ends, and insulating sleeve 13 connected between positive electrode sleeve 11 and negative electrode sleeve 12. Between insulating sleeve 13, positive electrode sleeve 11 and negative electrode sleeve 12 Connect by buckle. The two ends of the inner wall surface of the insulating sleeve 13 are provided with a slot, and the end of the positive electrode sleeve 11 and the negative electrode sleeve 12 connected to the insulating sleeve 13 is provided with a hook 14 corresponding to the slot. In the draw-in slot, the positive electrode cover 11, the negative electrode cover 12 and the insulating cover 13 are connected to each other to form a shell, which has a simple structure and is easy to assemble.
电容芯子包括由钽金属粉压制成块后高温烧结而成的多孔形钽粉烧结块正极基体21，其单体积内的有效面积大，使用温度范围宽。钽粉烧结块正极基体21的表面经阳极氧化形成有TaO5膜22，TaO5膜22的介电常数比铝氧化膜的介电常数大。在钽粉烧结块正极基体21的负极端通过浸渍硝酸锰再经高温烧结形成固体电解质MnO2层23，在固体电解质MnO2层23上覆盖有负极石墨层24，在负极石墨层24上喷涂有铅锡合金导电层25。负极引线为铜丝，正极引线为镍丝。正极引线从钽粉烧结块正极基体21内伸出至与正极电极套11接触，负极引线从固体电解质MnO2层23伸出至与负极电极套12接触。The capacitor core includes a porous tantalum powder sintered block positive electrode substrate 21 formed by pressing tantalum metal powder into a block and sintering at high temperature. It has a large effective area in a single volume and a wide operating temperature range. A TaO5 film 22 is formed on the surface of the positive electrode substrate 21 of the tantalum powder sintered block through anodic oxidation, and the dielectric constant of the TaO5 film 22 is larger than that of the aluminum oxide film. The negative end of the tantalum powder sintered block positive electrode substrate 21 is impregnated with manganese nitrate and then sintered at high temperature to form a solid electrolyte MnO2 layer 23. The solid electrolyte MnO2 layer 23 is covered with a negative electrode graphite layer 24, and the negative electrode graphite layer 24 is sprayed with lead and tin. alloy conductive layer 25 . The negative electrode lead is copper wire, and the positive electrode lead is nickel wire. The positive electrode lead extends from the positive electrode base 21 of the tantalum powder sintered block to contact the positive electrode sleeve 11 , and the negative electrode lead extends from the solid electrolyte MnO2 layer 23 to contact the negative electrode sleeve 12 .
本贴片式电解电容器在相同耐压和电容量的条件下，贴片式电解电容器的体积比铝电解电容器的体积要小得多，可制成超小型元件，而且性能稳定，长时间工作仍能保持良好的电性能。Under the conditions of the same withstand voltage and capacitance, the volume of the chip electrolytic capacitor is much smaller than that of the aluminum electrolytic capacitor. Can maintain good electrical properties.
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technical fields, are all The same reasoning is included in the patent protection scope of the present invention.
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| CN201610196742.5A CN105869891A (en) | 2016-03-31 | 2016-03-31 | A SMD Electrolytic Capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110249400A (en) * | 2017-02-03 | 2019-09-17 | 株式会社村田制作所 | Solid electrolytic capacitor and method of making the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4764844A (en) * | 1986-06-13 | 1988-08-16 | Murata Manufacturing Co., Ltd. | Electronic component with terminal caps |
| CN104240951A (en) * | 2014-07-09 | 2014-12-24 | 宁国市裕华电器有限公司 | Capacitor |
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2016
- 2016-03-31 CN CN201610196742.5A patent/CN105869891A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4764844A (en) * | 1986-06-13 | 1988-08-16 | Murata Manufacturing Co., Ltd. | Electronic component with terminal caps |
| CN104240951A (en) * | 2014-07-09 | 2014-12-24 | 宁国市裕华电器有限公司 | Capacitor |
Non-Patent Citations (1)
| Title |
|---|
| 肖景和: "《电子元器件识别与检测百问百答》", 31 July 2009 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110249400A (en) * | 2017-02-03 | 2019-09-17 | 株式会社村田制作所 | Solid electrolytic capacitor and method of making the same |
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Application publication date: 20160817 |