CN105891696A - A low-temperature test method for integrated circuits - Google Patents

Abstract

The invention provides a low-temperature test method of an integrated circuit, wherein the low-temperature test device of the integrated circuit comprises a test board of an integrated circuit test system, a test board bracket, a sealing cover and a hose, and compressed air is continuously filled in the test board bracket; firstly, placing a tested circuit in a low-temperature box with the temperature lower than the specified temperature by 5 ℃ for storage for at least 30 minutes, and then performing low-temperature test, wherein the test must be completed within 1 minute; the invention has the advantages of simple and quick low-temperature test, low cost and obvious effect, and is suitable for test production line application.

Description

A low-temperature test method for integrated circuits

technical field

The invention relates to the field of integrated circuit testing, in particular to the field of low-temperature testing of integrated circuits.

Background technique

Since the working environment temperature of equipment containing integrated circuit circuits is minus 40 degrees to minus 85 degrees, if the device is used in the military field, its ambient temperature may be minus 55 degrees to minus 125 degrees, so in order to ensure the normal operation of the equipment For operation, it is required to conduct all tests on the functions, DC and AC parameters of the integrated circuit within the specified temperature range; both normal temperature and high temperature tests are easy to implement, and low temperature tests are prone to frosting. After frosting, it will affect the leakage current and functional test of the circuit under test Result: In the prior art, there are multiple low-temperature test methods, such as using a special instrument-heat flow hood to test the function and parameters of the integrated circuit, and the test temperature can be set according to the needs. Set it up, fasten the cover on the integrated circuit under test, and wait for the temperature of the circuit under test to stabilize for 5 minutes before testing. For a large number of production line tests, the test time is long and the test cost is high.

Contents of the invention

The invention provides a low-temperature testing method for an integrated circuit, which solves the above-mentioned problems of long testing time and high cost.

The present invention is achieved like this:

The integrated circuit low-temperature test device includes the test board of the integrated circuit test system, the test board bracket, and the sealing cover. The sealing cover is installed in the middle position under the test board through screws, and the air jet soft hose is installed in the cover. In the middle position, the outer end of the soft rubber hose is connected to the compressed air hose.

Further, the sealing cover should cover the peripheral components of the circuit under test.

Described low temperature test method step is as follows:

The first step is to store the circuit under test in a low temperature box 5 degrees lower than the specified test temperature for at least 30 minutes;

The second step is to take out the circuit under test from the low temperature box and place it in the test socket;

The third step is to run the test test program for testing;

After the fourth step of the test is completed, take it out and put it in the tray.

Further, the test must be completed within 1 minute;

Further, during the low temperature test, the compressed gas remains inflated.

The low-temperature test of the invention is simple and fast, has low cost and obvious effect, and is suitable for use in test production lines.

Description of drawings

Further description will be made below in conjunction with accompanying drawings and specific implementation schemes:

Figure 1 Low temperature test profile

Figure 2 Bottom view of low temperature test

Figure 3 low temperature test flow chart

detailed description

The present invention will be described in further detail in conjunction with accompanying drawing:

Referring to Figure 1, the integrated circuit test system has a test adapter, also called PCB board 1, which is fastened to the test system through positioning holes. The middle position of the board support 3 is a position not in contact with the testing machine. The test socket 2 is installed on it, and the integrated circuit to be tested is placed in the test socket 1. At the same time, different components are installed under the test board according to the needs of the circuit to be tested. 4. The sealing cover 5 and the soft rubber hose 7 pass through the sealing cover to install the air injection valve 6, and connect to the compressed air pipe through the outer end 8 of the soft rubber hose;

In the bottom view of accompanying drawing 2, a sealing resin cover 5 is designed in the middle of the test board 9, and the support 10 is supported under the test board of the large-scale test system, and the resin cover 11 is fixed on the test board support 10 by screws 14. Drill a hole on the bracket to install a soft rubber tube, one end leads to the outside of the test board, and the other end leads to the middle of the resin cover, install an air jet valve 13 on the soft rubber tube inside the cup, and connect the outer end to the compressed air pipeline to form a complete circuit under test The test environment; so that the test program can be run to perform low temperature tests on the circuit under test;

The size of the closed resin cover is not only related to the empty space in the middle, but also related to the peripheral components of the PCB board. Try to cover all the peripheral components. The air valve of the cup is in the middle of the socket. The middle position is the lowest temperature during the test. The air port is more likely to prevent frost formation here.

The flow chart of the circuit under test is shown in Figure 3. The circuit under test is stored in a low-temperature box 5 degrees lower than the specified temperature for at least 30 minutes, then take out the circuit under test and place it in the socket, and tighten the cover of the socket; run the test test Program for testing, take out the circuit under test and place it in the test socket, run the test program software for testing, take it out and put it in the tray after the test is completed, the test must be completed within 1 minute, during the low temperature test, the compressed gas is always Stay inflated.

This method has been applied in the test production line, and the effect is obvious. It saves the test time of the test machine, and also saves the space in the clean room, and the test cost is significantly reduced.

The above are the embodiments of the invention, and all equivalent changes and modifications made according to the scope of the claims of the present invention shall fall within the scope of the claims of the present invention.

Claims (5)

1. A low-temperature test method for integrated circuits is characterized in that: the low-temperature test device for integrated circuits includes an integrated circuit test system test board, a test board support, and a sealed cover; Rubber hose, one end of the soft rubber hose is equipped with an air jet valve and placed in the middle of the sealing cover, and the outer end of the soft rubber hose is connected to the compressed air pipe. 2. The method according to claim 1, characterized in that the sealing cover will cover the peripheral components of the circuit under test. 3. The method according to claim 1, characterized in that the low temperature test method step is: The first step is to store the circuit under test in a low temperature box 5 degrees lower than the specified temperature for at least 30 minutes; The second step is to take out the circuit under test from the low temperature box and place it in the socket; The third step is to run the test test program for testing; After the fourth step of the test is completed, take it out and put it in the tray. 4. The method according to claim 3, characterized in that the low temperature test must be completed within 1 minute. 5. The method according to claim 3, characterized in that the compressed gas remains inflated during the low temperature test.