Summary of the invention
The disclosure provides the production method and display device of a kind of display device, to solve deficiency in the related technology.
According to the first aspect of the embodiments of the present disclosure, a kind of production method of display device is provided, comprising:
Curved substrate including N number of plane is provided;
Successively the first plane of the curved substrate, the second plane ..., N plane formed thin film transistor (TFT), wherein
N-th plane and the (n+1)th flat face, and transistor electrical connection adjacent in the n-th plane and the (n+1)th plane, 1≤n < N, n and N are
Integer;
Organic luminous layer is formed far from the side of the curved substrate in the thin film transistor (TFT);
Encapsulating structure is formed far from the side of the thin film transistor (TFT) in the organic luminous layer.
Optionally, the curved substrate is prismatic surface substrate.
Optionally, the (n+1)th plane and the angle of the n-th plane and the angle of the (n+1)th plane and the n-th+2 plane, greater than the
The angle of n plane and the n-th+2 plane.
Optionally, it is described successively the first plane of the curved substrate, the second plane ..., that N plane forms film is brilliant
Body pipe includes:
Successively the first plane of the prismatic surface substrate, the second plane ..., N-1 plane formed thin film transistor (TFT),
N plane forms the first driving circuit, wherein the grid in first driving circuit and first plane or N-1 plane
Line electrical connection.
Optionally, after forming the encapsulating structure, the method also includes:
The second driving circuit is formed on flexible circuit board;
The prismatic surface substrate will be set in the flexible circuit board, by second driving circuit with it is described N number of
Data line electrical connection in plane.
Optionally, described to be set to the prismatic surface substrate in the flexible circuit board and include:
The flexible circuit board is adhered to the edge of the prismatic surface substrate.
Optionally, described to be set to the prismatic surface substrate in the flexible circuit board and include:
The flexible circuit board is arranged in the reserved area of the N plane.
Optionally, the offer includes that the curved substrate of N number of plane includes:
It is molded flexible resin and forms cylindrical surface substrate;
The cylindrical surface substrate is sheathed on default bracket, to form the curved substrate with N number of plane.
According to the second aspect of an embodiment of the present disclosure, a kind of display device made by the above method is provided, comprising:
Curved substrate, including N number of plane, the n-th plane and the (n+1)th flat face, and phase in the n-th plane and the (n+1)th plane
Adjacent transistor electrical connection, 1≤n < N, n and N are integer;
Thin film transistor (TFT), be arranged in the first plane of the curved substrate, the second plane ..., N plane;
Organic luminous layer is arranged in the thin film transistor (TFT) far from the curved substrate side;
Encapsulating structure is formed in side of the organic luminous layer far from the thin film transistor (TFT).
Optionally, the curved substrate is prismatic surface substrate.
Optionally, the (n+1)th plane and the angle of the n-th plane and the angle of the (n+1)th plane and the n-th+2 plane, greater than the
The angle of n plane and the n-th+2 plane.
Optionally, the thin film transistor (TFT) of the N plane is the first driving circuit, first driving circuit and described the
Grid line electrical connection in one plane or N-1 plane.
Optionally, above-mentioned display device further include:
It is provided with the flexible circuit board of the second driving circuit, is set to the prismatic surface substrate, and the second driving electricity
Road is electrically connected with the data line in N number of plane.
Optionally, the flexible circuit board is adhered to the edge of the prismatic surface substrate.
Optionally, the reserved area of the N plane is arranged in the flexible circuit board.
The technical scheme provided by this disclosed embodiment can include the following benefits:
As can be seen from the above embodiments, the disclosure can sequentially form thin film transistor (TFT), organic luminous layer on curved substrate
Display device is constituted with encapsulating structure, which is organic LED display device, is filled relative to liquid crystal display
It sets, eliminates space and the backlight of filling liquid crystal, therefore can make relatively thin.And each layer structure can make compared with
It is thin, it is easily formed curved display device.And since substrate is curved surface, and transistor adjacent in the plane that connects is electricity
Connection, this makes the N block display screen formed in N number of plane be also electrical connection, therefore in the production process without bending
Operation, simplifies manufacture craft.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
Fig. 1 is a kind of schematic flow diagram of the production method of display device shown according to an exemplary embodiment.Such as Fig. 1
It is shown, this method comprises:
In step s 11, the curved substrate including N number of plane is provided.The section of the curved substrate can be complete ring
Shape, or annular a part, below mainly in the case where the section of the curved substrate is complete annular to this reality
Example is applied to illustrate.
In step s 12, successively the first plane of the curved substrate, the second plane ..., N plane formed film
Transistor, wherein the n-th plane and the (n+1)th flat face, and transistor electrical connection adjacent in the n-th plane and the (n+1)th plane, 1
≤ n < N, n and N are integer.
In the present embodiment, curved substrate can be made of clear material, such as glass, organic resin.Thin film transistor (TFT)
It may include grid, source electrode and drain electrode, and be connected to the active layer of source electrode and drain electrode, wherein grid can be formed directly into
It in substrate, and could be formed with gate insulation layer between grid and active layer, source electrode, drain electrode, may be used also on source electrode and drain electrode
To be formed with passivation layer.
Fig. 2 is a kind of structural schematic diagram of prismatic surface substrate shown according to an exemplary embodiment.Referring to fig. 2, it shows
A kind of structure of curved substrate when N=4, wherein ABFE is the first plane, and BCGF is the second plane, and ADHE is third plane,
DCGH is fourth plane.
Fig. 3 is the schematic diagram of two to connect plane shown according to an exemplary embodiment.As shown in figure 3, to be formed
Grid line be parallel to AB in case where, close to the thin of the thin film transistor (TFT) M1 of BF and BF close in the second plane in the first plane
Film transistor M2 is located at same a line, the two transistors are electrically connected by grid line, that is, is formed in grid line and the formation of the first plane
It is electrically connected in the grid line of the second plane.It should be understood that in the case where data line is parallel to AB, then be formed in connect it is flat
The data line in face is electrically connected.
In step s 13, organic luminous layer is formed far from the side of the curved substrate in the thin film transistor (TFT).
In the present embodiment, organic luminous layer can be formed on thin film transistor (TFT), and organic luminous layer from the bottom to top may be used
Successively to include anode, hole injection layer, hole transmission layer, organic material layer, electron transfer layer, electron injecting layer and cathode
(it is of course also possible to by the reverse setting of the layer structure of organic luminous layer from the bottom to top), and between adjacent sub-pixel, may be used also
To be provided with pixel defining layer (insulated column).The source electrode of thin film transistor (TFT) can connect in data line, and drain electrode can connect in having
The anode of machine luminescent layer, wherein data line can be formed while forming source electrode and drain electrode, in thin film transistor (TFT) conducting,
Display signal in data line can be transmitted to anode by source electrode, active layer and drain electrode, shine to control organic luminous layer.
Need to illustrate when, the organic luminous layer in the present embodiment can issue colourama (such as can issue it is red, green,
Blue three color light), it can also only issue white light.In the case where organic luminous layer only issues white light, the present embodiment step S14 it
Before further include organic luminous layer far from thin film transistor (TFT) side formed color blocking layer, color blocking layer may include red color resistance area,
Green color blocking area and blue color blocking area, to guarantee that from the light that display device projects include red, green, blue three coloured light.
In step S14, encapsulating structure is formed far from the side of the thin film transistor (TFT) in the organic luminous layer.
In the present embodiment, encapsulating structure may include sealant and protection glass, and wherein sealant can be set in song
The edge of face substrate, protection glass can be then covered on sealant and organic luminous layer.The thickness of sealant can omit
It is thicker than the sum of each layer structural thickness formed on curved substrate, to guarantee to be adhered to protection glass well.
According to this embodiment, it can sequentially form thin film transistor (TFT), organic luminous layer and encapsulating structure on curved substrate
Display device is constituted, which is organic LED display device, relative to liquid crystal display device, eliminate and fill out
The space of filling liquid crystalline substance and backlight, therefore can make relatively thin.And each layer structure can make relatively thin, be easily formed
Curved display device.And since substrate is curved surface, and transistor adjacent in the plane that connects is electrical connection, this makes
Obtaining the N block display screen formed in N number of plane is also electrical connection, therefore is simplified in the production process without bending operation
Manufacture craft.
In addition, according to the display device that the present embodiment makes, such as the display dress formed on curved substrate shown in Fig. 2
It sets comprising 4 display surfaces, wherein the first plane and third plane are larger, the display device formed thereon can be used as main aobvious
Show face, may further as the front display screen and back displays screen in double-sided display screen, correspondingly, in the second plane and
The display device formed in fourth plane can be used as side display screen.
Relative to being respectively set a display screen in front and back in the related technology, and pass through different driving circuit point
Not Qu Dong two display screens, the display screen in the present embodiment in N number of plane can pass through one due to being electrical connection
Driving circuit driving, circuit structure are simple.
Optionally, the curved substrate is prismatic surface substrate.By prismatic surface substrate execute above-mentioned steps S11, S12,
S13 and S14 can form annular display device, therefore on the basis of simplifying production process, also make the annular display to be formed
Seam is not present in device, improves the aesthetics of product.
Optionally, the (n+1)th plane and the angle of the n-th plane and the angle of the (n+1)th plane and the n-th+2 plane, greater than the
The angle of n plane and the n-th+2 plane.
Fig. 4 is the structural schematic diagram of another prismatic surface substrate shown according to an exemplary embodiment.Fig. 5 is according to one
Angle schematic diagram between plane shown in exemplary embodiment.
As shown in figure 4, prismatic surface substrate includes 8 planes, the plane for being parallel to horizontal plane including two and two
Perpendicular to the plane of horizontal plane.As shown in figure 5, in the case where n=1, the angle of the second plane and the first plane is α, second
The angle of plane and third plane is β, and wherein α and β is obtuse angle, and the angle of the first plane and third plane is then right angle.
Therefore the grid line formed in the first plane, the second plane and third plane, from the first plane to the second plane, then from
Second plane to third plane, than from the first plane directly to the degree of third plane bending it is smaller so that at flat face
It forms electrical connection and is less prone to open circuit, be easy to guarantee the validity being electrically connected between adjacent plane in each plane of N.
Fig. 6 is the schematic flow diagram of the production method of another display device shown according to an exemplary embodiment.Such as
Shown in Fig. 6, on the basis of embodiment shown in Fig. 1, it is described successively the first plane of curved substrate, the second plane ..., N
Plane forms thin film transistor (TFT)
In step S121, successively the first plane of prismatic surface substrate, the second plane ..., N-1 plane formed film
Transistor forms the first driving circuit in N plane, wherein first driving circuit and first plane or N-1 are flat
Grid line electrical connection in face.
In the present embodiment, the first driving circuit can be gate drive circuit, which is made of thin film transistor (TFT),
So as to form the driving circuit during forming first plane transistor into N-1 plane.It is alternatively possible to logical
It crosses GIP (Gate in panel) technique and forms the first driving circuit.
By taking prismatic surface substrate shown in Fig. 2 as an example, the first driving circuit can be formed in fourth plane, and the first driving
Circuit is electrically connected with the grid line in the first plane or third plane, and grid line of first plane into third plane is electrical connection
, therefore scanning signal can be transmitted to grid line of first plane into third plane by the first driving circuit, to control
The switch of first plane transistor into third plane.Namely it is formed in the first driving circuit of N plane, it can control first
The switch of plane transistor into N-1 plane.
Fig. 7 is the schematic flow diagram of the production method of another display device shown according to an exemplary embodiment.Such as
Shown in Fig. 7, on the basis of embodiment shown in Fig. 6, after forming the encapsulating structure, the method also includes:
In step S15, the second driving circuit is formed on flexible circuit board;
In step s 16, the prismatic surface substrate will be set in the flexible circuit board, by the second driving electricity
Road is electrically connected with the data line in N number of plane.
In the present embodiment, the second driving circuit can be data line drive circuit, adjustable by the driving circuit
The state of every data line transmission data-signal.And the second driving circuit is formed on flexible circuit board by the present embodiment, shape
At flip chip (COF, Chip On Film), since flip chip are readily bent, convenient for being disposed at prismatic surface
Because of bending open circuit occurs for any position of substrate without will lead to the second driving circuit.
It should be noted that may be used also in addition to flexible circuit board is set to prismatic surface substrate after forming encapsulating structure
It, will be flexible flexible circuit board is set to prismatic surface substrate before forming organic luminous layer, and when forming encapsulating structure
Circuit board encapsulates together.
Optionally, by before being set to the prismatic surface substrate in the flexible circuit board, the method also includes:
The flexible circuit board is close to the surface of the driving circuit and the position of the corresponding driving circuit forms protective layer, described
Flexible circuit board forms stiffening plate far from the surface of the driving circuit.
In the present embodiment, the second driving circuit can be formed in flexible circuit board, and protective layer can be formed in second
The surface of driving circuit vertical direction, area are greater than or equal to the area of driving circuit.Wherein, the material of protective layer can be with
It is liquid photopolymerizable solder resist (green oil).
According to the present embodiment, by the way that protective layer is arranged, physical open circuit can occur in bending to avoid driving circuit.It is logical
Setting stiffening plate is crossed, the suppleness of flexible circuit board entirety can be improved, convenient for being arranged flexible circuit board in prismatic surface substrate
Arbitrary region.
Fig. 8 is the schematic flow diagram of the production method of another display device shown according to an exemplary embodiment.Such as
It is on the basis of the embodiment shown in fig. 7, described that the prismatic surface substrate packet will be set in the flexible circuit board shown in Fig. 8
It includes:
In step S161, the flexible circuit board is adhered to the edge of the prismatic surface substrate.
By taking prismatic surface substrate shown in Fig. 2 as an example, in the case where grid line is parallel to AB setting, data line is then perpendicular to AB
Setting.Fig. 9 is the schematic diagram that flexible circuit board is shown according to an exemplary embodiment, soft on the basis of embodiment shown in Fig. 2
Property circuit board is adhered to the edge of prismatic surface substrate, such as the side AB.Since data line is arranged perpendicular to AB, by flexible circuit
Plate is adhered to the side AB, and the second driving circuit is connected to the data line of all planes convenient for setting wiring, so that control first is flat
The state of face every data line transmission data-signal into third plane.The first plane may further be controlled to N-1 plane
In every data line transmission data-signal state.
Figure 10 is the schematic flow diagram of the production method of another display device shown according to an exemplary embodiment.Such as
It is on the basis of the embodiment shown in fig. 7, described that the prismatic surface substrate packet will be set in the flexible circuit board shown in Figure 10
It includes:
In step S162, the flexible circuit board is arranged in the reserved area of the N plane.
By taking prismatic surface substrate shown in Fig. 2 as an example, in the case where the first driving circuit is formed in fourth plane, this reality
The flexible circuit board applied in example also can be set in fourth plane, wherein form the first driving electricity by Patternized technique
During road, one piece of region can be reserved for flexible circuit board to be arranged.
According to the present embodiment, by the reserved area that flexible circuit board is arranged in N plane, it is possible to reduce in prismatic surface
The quantity of display interlock circuit is set other than substrate, so that the annular display device appearance formed is more succinct, improves aesthetics.
Figure 11 is the schematic flow diagram of the production method of another display device shown according to an exemplary embodiment.Such as
Shown in Figure 11, on the basis of embodiment shown in Fig. 1, the offer includes that the curved substrate of N number of plane includes:
In step S111, injection molding flexible resin forms cylindrical surface substrate;
In step S112, the cylindrical surface substrate is sheathed on default bracket, to form the song with N number of plane
Face substrate.
According to this embodiment, it can cylindrical surface substrate be formed by flexible material, so that the cylinder flat-panel display device formed
Suppleness with higher, is not easily broken in use.And since the cylindrical surface substrate of formation is flexible, it is easy to logical
Cross the curved substrate that different default brackets forms different shapes, such as the prismatic surface substrate in the present embodiment, it is easier to full
Sufficient process requirement.
Corresponding with the embodiment of the production method of display device above-mentioned, the disclosure additionally provides the implementation of display device
Example.
Include: according to the display device of an embodiment of the present disclosure
Curved substrate, including N number of plane, the n-th plane and the (n+1)th flat face, and phase in the n-th plane and the (n+1)th plane
Adjacent transistor electrical connection, 1≤n < N, n and N are integer;
Thin film transistor (TFT), be arranged in the first plane of the curved substrate, the second plane ..., N plane;
Organic luminous layer is arranged in the thin film transistor (TFT) far from the curved substrate side;
Encapsulating structure is formed in side of the organic luminous layer far from the thin film transistor (TFT).
Optionally, the curved substrate is prismatic surface substrate.
Optionally, the (n+1)th plane and the angle of the n-th plane and the angle of the (n+1)th plane and the n-th+2 plane, greater than the
The angle of n plane and the n-th+2 plane.
Optionally, the thin film transistor (TFT) of the N plane is the first driving circuit, first driving circuit and described the
Grid line electrical connection in one plane or N-1 plane.
Optionally, above-mentioned display device further include:
It is provided with the flexible circuit board of the second driving circuit, is set to the prismatic surface substrate, and the second driving electricity
Road is electrically connected with the data line in N number of plane.
Optionally, the flexible circuit board is adhered to the edge of the prismatic surface substrate.
Optionally, the reserved area of the N plane is arranged in the flexible circuit board.
About the display device in above-described embodiment, wherein the concrete mode of each structure role is in related system
Make to be described in detail in the embodiment of method, no detailed explanation will be given here.
Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.