CN106085647B - A kind of electronic chip scavenger specially - Google Patents
A kind of electronic chip scavenger specially Download PDFInfo
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- CN106085647B CN106085647B CN201610402398.0A CN201610402398A CN106085647B CN 106085647 B CN106085647 B CN 106085647B CN 201610402398 A CN201610402398 A CN 201610402398A CN 106085647 B CN106085647 B CN 106085647B
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- electronic chip
- cleaning agent
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- 239000002516 radical scavenger Substances 0.000 title claims abstract description 30
- 239000012459 cleaning agent Substances 0.000 claims abstract description 28
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 239000005977 Ethylene Substances 0.000 claims abstract description 15
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 14
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 12
- 229940031098 ethanolamine Drugs 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 9
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims description 30
- -1 carbon alkane Chemical class 0.000 claims description 15
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- HOWGUJZVBDQJKV-UHFFFAOYSA-N docosane Chemical compound CCCCCCCCCCCCCCCCCCCCCC HOWGUJZVBDQJKV-UHFFFAOYSA-N 0.000 claims description 4
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 claims description 4
- NLAGNNORBYGNAV-UHFFFAOYSA-N isotriacontane Natural products CCCCCCCCCCCCCCCCCCCCCCCCCCCC(C)C NLAGNNORBYGNAV-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 15
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000006378 damage Effects 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 230000009972 noncorrosive effect Effects 0.000 abstract description 2
- ILLHQJIJCRNRCJ-UHFFFAOYSA-N dec-1-yne Chemical compound CCCCCCCCC#C ILLHQJIJCRNRCJ-UHFFFAOYSA-N 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- 239000002689 soil Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000003599 detergent Substances 0.000 description 3
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000006210 lotion Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/247—Hydrocarbons aromatic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5027—Hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a kind of electronic chip scavenger speciallies, are prepared by the raw material of following mass percents：Ethylene glycol monoethyl ether 10 16%, ethanol amine 3 7%, 4,72,4,7,9 tetramethyl of dihydroxy, 5 decine 10 16%, cleaning agent 20 30%, alkane solvent 20 28%, surplus are 1 methyl 4 (1 methyl ethylene) cyclic ethylene.The cleaning agent of the present invention is exclusively used in chip cleaning, and chip without any damage is hindered in the oil stain that just can be thoroughly cleaned on chip after production and application and spot, noresidue, and non-corrosive after chip cleaning has certain protective role；All kinds of high-end chips of electronic chip scavenger specially professional cleaning of the present invention are also applied for common each electric appliances chip cleaning.
Description
Technical field
The present invention relates to chemical technical field more particularly to a kind of electronic chip scavenger speciallies.
Background technology
Chip（chip）Refer to and includes the silicon chip of integrated circuit, volume very little, often computer or other electronic equipments
A part, also known as integrated circuit（English：integrated circuit, IC）, microcircuit（microcircuit）, microchip
（microchip）It is a kind of in electronics circuit（Include mainly semiconductor equipment, also including passive component etc.）Miniaturization
Mode, and be normally manufactured on semiconductor wafer surface.
In the production process of the electronic component of electronics industry manufacture, using detergent to component carry out cleaning be must can not
Few technical process, and the most of cleaning agent including freon of cleaning agent used, and freon is that destruction air is smelly
The substance of oxygen layer, according to the Montreal Agreement book signed in the world, each state that signs should be phased out the chlorofluorocarbons such as freon
Substance.This is being sent out to electronics industry for task and challenge, it is therefore desirable to which selection is suitable to substitute detergent and using corresponding
Production technology.
In electronics industry manufacture, the production of electronic component and it is assembled with multiple stages composition, and each stage has
The technical process of cleaning, to ensure the high reliability and high finished product rate of product.Due to the contamination of pollution particle and inappropriate clear
Electronic component problem caused by washing includes height electric leakage, short circuit open circuit, corrosion corrosion, detects failure, bad welding, sealing loosely
With metal migration etc. and cause a large amount of degradation products and substandard products.Therefore it needs further to develop a kind of not only environmental protection but also efficient cleaning
Agent.
Domestic chip cleaning agent used at present, mainly based on the external import.With production cost is reduced, production is improved
The overall situation of product competitiveness changes, and exploitation substitutes R＆D direction of the import high price chemical products at chemical industry.
One of principal item as surface cleaning agent, the mating appearance since high-end electronic product of chip cleaning agent, with
The continuous development of science and technology, the requirement effect of chip cleaning agent constantly improving, same chip cleaning agent function with
There is new progress in terms of raw material composition, essentially becomes the principal item of alternative chip inlet cleaning agent.
Compared with chip inlet cleaning agent, the cleaning agent usability that the present invention researches and develops is safer, and cleaning effect performance is good
The advantages that.
Chip cleaning agent is generally divided into the different desired cleaning agents such as digital electronic goods, electronic circuit board, electrical terminal.
Chip cleaning agent of the present invention cleans dynamics is strong, and corrosivity is weak, and volatility is fast, clean range is wide etc. compared with general cleaning agent
Good characteristics.
Invention content
Aiming at the above shortcomings existing in the prior art, technical problem to be solved by the invention is to provide a kind of electronics cores
Piece scavenger specially.
Purpose of the present invention is to what is be achieved through the following technical solutions：
A kind of electronic chip scavenger specially, is prepared by the raw material of following mass percents：Ethylene glycol monoethyl ether 10-
16%, ethanol amine 3-7%, 4,7- dihydroxy -2,4,7,9- tetramethyls -5- decine 10-16%, cleaning agent 20-30%, alkane solvent
20-28%, surplus are 1- methyl -4- (1- methyl ethylenes) cyclic ethylene.
Preferably, the cleaning agent is or mixtures thereof one kind in n-methyl-2-pyrrolidone, dimethyl carbonate.
It is highly preferred that the cleaning agent is 1 in mass ratio by n-methyl-2-pyrrolidone, dimethyl carbonate：（2-6）
It mixes.
Preferably, the alkane solvent is the alkane of C5-C20, the preferably linear paraffin of C5-C20, can be selected from different
It is one or more in hexane, 12 carbon alkane of positive structure, hexadecane, n-docosane, positive melissane, normal octane, solvent naphtha D35
Mixture.
It is highly preferred that the alkane solvent is 1 in mass ratio by isohexane, 12 carbon alkane of positive structure：（2-6）Mixing and
At.
The present invention also provides the preparation methods of above-mentioned electronic chip scavenger specially, according to the ratio by ethylene glycol list second
Ether, 1- methyl -4- (1- methyl ethylenes) cyclic ethylene, detergent additive, alkane solvent, dimethyl carbonate mixing are equal
It is even to obtain the final product.
Specifically, in the present invention：
Ethylene glycol monoethyl ether, No. CAS：110-80-5.
Ethanol amine, No. CAS：141-43-5.
N-methyl-2-pyrrolidone, No. CAS：2687-44-7.
4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine, No. CAS：126-86-3.
Solvent naphtha D35, be C5-20 normal paraffin paraffin, No. CAS：64771-72-8.
1- methyl -4- (1- methyl ethylenes) cyclic ethylene, also known as dipentene, No. CAS：138-86-3.
Dimethyl carbonate, No. CAS：616-38-6.
Isohexane, also known as 2- methylpentanes, No. CAS：107-83-5.
12 carbon alkane of positive structure, No. CAS：93685-81-5.
The cleaning agent of the present invention is exclusively used in chip cleaning, and oil stain and dirt on chip just can be thoroughly cleaned after production and application
Chip without any damage is hindered in stain, noresidue, and non-corrosive after chip cleaning has certain protective role.The electronic chip of the present invention is special clear
All kinds of high-end chips of lotion professional cleaning are also applied for common each electric appliances chip cleaning.
Specific implementation mode
With reference to embodiment, the present invention is described further, as described below, is only the preferable implementation to the present invention
Example, not limits the present invention, any person skilled in the art is possibly also with the disclosure above
Technology contents be changed to the equivalent embodiment changed on an equal basis.Without departing from the concept of the present invention, according to the present invention
Technical spirit any simple modification that following embodiment is made or equivalent variations, all fall in protection scope of the present invention.
Embodiment 1
Electronic chip scavenger specially raw material：Ethylene glycol monoethyl ether 13kg, ethanol amine 5kg, n-methyl-2-pyrrolidone
5kg, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine 13kg, solvent naphtha D35 9kg, 1- methyl -4- (1- ethylene methacrylics
Base) cyclic ethylene 20kg, dimethyl carbonate 20kg, isohexane 3kg, 12 carbon alkane 12kg of positive structure.
It is prepared by electronic chip scavenger specially：Will solvent naphtha D35, dimethyl carbonate stirring after add ethanol amine mix stir
After mixing uniformly, ethylene glycol monoethyl ether, n-methyl-2-pyrrolidone, 4,7- dihydroxy -2,4,7, the 9- tetramethyl -5- last of the ten Heavenly stems are added
Alkynes, 1- methyl -4- (1- methyl ethylenes) cyclic ethylene, isohexane, 12 carbon alkane of positive structure are uniformly mixed, you can embodiment is made
1 electronic chip scavenger specially.
Embodiment 2
Electronic chip scavenger specially raw material：Ethylene glycol monoethyl ether 13kg, ethanol amine 5kg, 4,7- dihydroxy -2,4,7,9-
Tetramethyl -5- decine 13kg, cleaning agent 25kg, alkane solvent 24kg, 1- methyl -4- (1- methyl ethylenes) cyclic ethylene 20kg.
The cleaning agent is 1 in mass ratio by n-methyl-2-pyrrolidone, dimethyl carbonate：4 be uniformly mixed obtain.
The alkane solvent is 1 in mass ratio by isohexane, 12 carbon alkane of positive structure：4 be uniformly mixed obtain.
It is prepared by electronic chip scavenger specially：Ethanol amine is added in alkane solvent and is stirred 6 minutes with 400 revs/min, then is added
Enter ethylene glycol monoethyl ether, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine are stirred 6 minutes with 400 revs/min, are eventually adding clear
Lotion, 1- methyl -4- (1- methyl ethylenes) cyclic ethylenes are uniformly mixed for 10 minutes with 400 revs/min of stirrings.It can be prepared by embodiment
2 electronic chip scavenger specially.
Embodiment 3
It is substantially the same manner as Example 2, it differs only in：The cleaning agent is only n-methyl-2-pyrrolidone.
The electronic chip scavenger specially of embodiment 3 is made.
Embodiment 4
It is substantially the same manner as Example 2, it differs only in：The cleaning agent is only dimethyl carbonate.It can be prepared by reality
Apply the electronic chip scavenger specially of example 4.
Embodiment 5
It is substantially the same manner as Example 2, it differs only in：The alkane solvent is only isohexane.It can be prepared by implementing
The electronic chip scavenger specially of example 5.
Embodiment 6
It is substantially the same manner as Example 2, it differs only in：The alkane solvent is only 12 carbon alkane of positive structure.
The electronic chip scavenger specially of embodiment 6 is made.
Comparative example 1
Electronic chip scavenger specially raw material：Ethylene glycol monoethyl ether 13kg, ethanol amine 5kg, n-methyl-2-pyrrolidone
13kg, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine 18kg, solvent naphtha D35 15kg, 1- methyl -4- (1- ethylene methacrylics
Base) cyclic ethylene 20kg, isohexane 4kg, 12 carbon alkane 12kg of positive structure.
It is prepared by electronic chip scavenger specially：After solvent naphtha and ethanol amine are mixed evenly, ethylene glycol list is added
Ether, n-methyl-2-pyrrolidone, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine, 1- methyl -4- (1- ethylene methacrylics
Base) cyclic ethylene, 12 carbon alkane of positive structure, isohexane is uniformly mixed, you can the electronic chip scavenger specially of comparative example 1 is made.
Comparative example 2
Electronic chip scavenger specially raw material：Ethylene glycol monoethyl ether 10kg, ethanol amine 5kg, 4,7- dihydroxy -2,4,7,9-
Tetramethyl -5- decine 18kg, solvent naphtha D35 14kg, 1- methyl -4- (1- methyl ethylenes) cyclic ethylene 20kg, isohexane 3kg,
Positive structure 12 carbon alkane 12kg, dimethyl carbonate 18kg.
It is prepared by electronic chip scavenger specially：It is mixed ethanol amine is added after solvent naphtha, dimethyl carbonate stirring
After uniformly, ethylene glycol monoethyl ether, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine, 1- methyl -4- (1- methyl second are added
Alkenyl) cyclic ethylene, isohexane be uniformly mixed, you can the electronic chip scavenger specially of comparative example 2 is made.
Test case 1
Detergency ability test is carried out to the electronic chip scavenger specially of embodiment 1-6 and comparative example 1-2.
Test chip：Totally 8 groups, every group takes the ㎝ of 0.5 ㎝ × 0.5 chips for cell phone 10 respectively, respectively check weighing W1, is applied on chip
The dirt for covering one layer 30 grams is dried one hour at 80 DEG C, respectively check weighing W2.
Cleaning method：Weigh respectively embodiment 1-6 and comparative example 1-2 1000 grams of electronic chip scavenger speciallies pour into it is small
In type ultrasonic drilling machine, 8 groups of chips for cell phone are cleaned respectively, ultrasonic temperature is 50 DEG C, and it is 5 minutes to be cleaned by ultrasonic the time, so
It is rinsed 5 minutes under 50 DEG C of water flowings afterwards, baking oven drying, respectively check weighing W3.Soil removal efficiency is obtained by gravimetric method.
Above-mentioned dirt is by 15 grams of rosin, 15 grams of scaling powder（Scaling powder is provided using Shenzhen Yongtai Xi Ye Co., Ltds
The colophony type scaling powder of model YT004）It is uniformly mixed and forms.
Soil removal efficiency=【（W2-W3）/（W2-W1）】× 100 ﹪.Concrete outcome is shown in Table 1.
Table 1：Soil removal efficiency test result table
| Soil removal efficiency ﹪ | |
| Embodiment 1 | 99 |
| Embodiment 2 | 99 |
| Embodiment 3 | 86 |
| Embodiment 4 | 92 |
| Embodiment 5 | 90 |
| Embodiment 6 | 89 |
| Comparative example 1 | 75 |
| Comparative example 2 | 88 |
In the present invention, using dimethyl carbonate and n-methyl-2-pyrrolidone both efficient cleaners combination, carbonic acid two
Methyl esters is environment-friendly and green industrial chemicals, is the green solvent for integrating spatter property and safety, and cleaning dynamics has significantly
It improves, comparing embodiment 2 and embodiment 3-4, embodiment 2（Dimethyl carbonate, n-methyl-2-pyrrolidone compounding）Soil removal efficiency is bright
It is aobvious to be higher than embodiment 3-4（Single raw material in dimethyl carbonate, n-methyl-2-pyrrolidone）.
Particularly, comparing embodiment 2 and embodiment 5-6, embodiment 2（Isohexane, 12 carbon alkane of positive structure compounding）Decontamination
Rate is apparently higher than embodiment 5-6（Single raw material in isohexane, 12 carbon alkane of positive structure）.
The electronic chip scavenger specially of the present invention, it is easy to use, chip cleaning agent is poured into ultrasonic echography cleaning again
It is dried after adding water to rinse, can have the function that clean chip and forms the work of one layer of lasting protective film of antirust on surface
With product of the present invention is safe to use, is the cleaning products of greening and environmental protection.
Claims (3)
1. a kind of electronic chip scavenger specially, it is characterised in that：It is prepared by the raw material of following mass percents：Ethylene glycol
Single ether 10-16%, ethanol amine 3-7%, 4,7- dihydroxy -2,4,7,9- tetramethyl -5- decine 10-16%, cleaning agent 20-
30%, alkane solvent 20-28%, surplus are 1- methyl -4- (1- methyl ethylenes) cyclic ethylene；The cleaning agent is by N- first
Base -2-Pyrrolidone, dimethyl carbonate are 1 in mass ratio：(2-6) is mixed.
2. electronic chip scavenger specially as described in claim 1, it is characterised in that：The alkane solvent be isohexane,
It is one or more in 12 carbon alkane of positive structure, hexadecane, n-docosane, positive melissane, normal octane, solvent naphtha D35 to mix
Close object.
3. electronic chip scavenger specially as claimed in claim 2, it is characterised in that：The alkane solvent by isohexane,
12 carbon alkane of positive structure is 1 in mass ratio：(2-6) is mixed.
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| CN115821276A (en) * | 2022-07-07 | 2023-03-21 | 中山市浩科化工科技有限公司 | Strong cleaning agent for new energy metal and preparation method thereof |
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| CN102660393A (en) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Cleaning solution for light-emitting diode (LED) chip |
| CN102851151A (en) * | 2012-09-25 | 2013-01-02 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly cleaning agent for electronic industry |
| KR20130068903A (en) * | 2011-12-16 | 2013-06-26 | 동우 화인켐 주식회사 | Cleaning composition using electronic material |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW594444B (en) * | 2000-09-01 | 2004-06-21 | Tokuyama Corp | Residue cleaning solution |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130068903A (en) * | 2011-12-16 | 2013-06-26 | 동우 화인켐 주식회사 | Cleaning composition using electronic material |
| CN102660393A (en) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Cleaning solution for light-emitting diode (LED) chip |
| CN102851151A (en) * | 2012-09-25 | 2013-01-02 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly cleaning agent for electronic industry |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
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