CN106155183B - Dynamic pressure module and method for manufacturing the same - Google Patents

Abstract

The present invention provides a dynamic pressure module and a manufacturing method thereof, wherein the dynamic pressure module comprises a fluid tank having at least two channels; at least two elastic devices and at least two sliding blocks respectively disposed in at least two channels; a cover plate disposed above the fluid tank and having an opening; a heat-conducting fluid disposed in the fluid tank; and a heat-conducting module, at least a portion of which passes through the opening of the cover plate and is disposed in the fluid tank. The heat-conducting module has a fitting surface that fits with the electronic component, and when the heat-conducting module moves in a direction perpendicular to the fitting surface, a force is applied to the heat-conducting fluid, and the elastic devices apply a reaction force to the heat-conducting module through the sliding blocks and the heat-conducting fluid, and maintain the heat-conducting module in a balanced position in the direction perpendicular to the fitting surface. Through the present invention, it is possible to prevent the electronic components from being damaged due to the force applied during assembly or the vibration after assembly, and simplify the process of designing different heat-conducting modules for different electronic components.

Description

Dynamic pressure module and method of making the same

technical field

The present invention relates to a dynamic pressure module and its manufacturing method, in particular to a dynamic pressure module applied to a computer device and its manufacturing method.

Background technique

In a computer device, in order to keep the computer device operating at a proper temperature, a heat-conducting device with a heat-conducting module is usually used. By closely adhering the heat-conducting module to an electronic component that generates a large amount of heat energy, the heat energy can be rapidly conducted from the electronic component to the Thermal device.

In order to make the thermal conduction module on the thermal conduction device closely adhere to the electronic components, a traditional method is to insert a thermal pad (Thermal Pad) in the gap between the thermal conduction module and the electronic components, wherein the thermal pad is attached to the electronic components in the thermal conduction module. At the same time, a deformation amount is generated, so that the heat-conducting sheet is closely attached to the heat-conducting module and the electronic components at the same time. However, this thermal pad usually has a high thermal resistance value. In the case of reducing the thickness of the thermal pad as much as possible, the thermal conductive device cannot adapt to the height of different electronic components. Therefore, the traditional method must be aimed at various electronic components with different heights. Design different heat conduction devices, the cost is higher. In addition, the thermally conductive sheet has no buffering capability, and is liable to damage electronic components when subjected to external force or vibration.

Another conventional heat-conducting module, refer to the heat-conducting structure shown in FIG. 1 (Taiwan Utility Model Patent M451797), wherein a heat-conducting block 3 is disclosed. When the heat source of the circuit board (not shown) is attached to the heat-conducting block When the heat transfer block is moved downward, a force is applied to a connecting part 21 of the heat pipe 2 and the elastic positioning piece 4, and the heat transfer block and the heat pipe are fixed by the spring screw, so that the heat transfer block 3 can be closely attached to the heat source on one side at the same time. and the heat pipe 2 on one side to complete a heat conduction structure with low thermal resistance. However, the conventional heat transfer module has the following disadvantages: the deformation of the heat pipe may cause the heat pipe to fail; the cost of the heat pipe and the spring screw is relatively high; it is difficult to adapt to heat sources of different heights for assembly; The heat-conducting structure does not have buffering properties, and it is easy to cause damage to the heat source such as the chip in a vibration environment.

Therefore, the thermal conduction module of the existing thermal conduction device obviously has its inconvenience and defects in practical application, and it needs to be improved.

SUMMARY OF THE INVENTION

In view of the above-mentioned problems of the traditional thermal conduction module, the problem to be solved by the present invention is to prevent the thermal conduction device from being damaged due to external force when assembling the electronic components, and to keep the thermal conduction device and the electronic components in close contact at the same time. In addition, the thermal conduction module can also Adjust the height position to adapt to heat sources of different heights, increase the convenience of assembly, and serve as a buffer for external forces to avoid damage to electronic components due to external forces.

Based on the purpose of the present invention, a dynamic pressure module is provided, which includes: a fluid tank, at least two elastic devices, at least two sliding blocks, a cover plate, a heat-conducting fluid and a heat-conducting module. The fluid groove has a side wall and at least two channels, and the at least two channels each have an engaging side wall. The at least two elastic devices are respectively disposed in the at least two channels and have a fixed side engaged with the engaging sidewalls of the at least two channels. Preferably, the at least two elastic devices are composed of springs. The at least two sliding blocks are disposed in the at least two channels and are respectively joined to one side of the at least two elastic devices opposite to the fixed side, wherein the at least two sliding blocks divide the fluid groove into at least two Two elastic device spaces and a heat-conducting fluid space. The cover plate is arranged above the fluid tank and has an opening. The heat-conducting fluid is arranged in the heat-conducting fluid space, and preferably, the heat-conducting fluid is made of a material with a thermal conductivity ranging from 3 to 6 W/m°C. The heat conduction module includes a setting surface and a bonding surface, the setting surface is arranged in the fluid tank through the opening of the cover plate, and is in contact with the heat conduction fluid, and the bonding surface is arranged on the cover plate relative to the fluid One side of the groove to form a tight fit with an electronic component. When the heat conducting module moves in the direction perpendicular to the bonding surface, the setting surface exerts a force on the heat conducting fluid, and the elastic devices exert a reaction force on the setting surface through the sliding blocks and the heat conducting fluid , and maintain the setting surface in a balanced position in the direction perpendicular to the bonding surface.

Based on the purpose of the present invention, a method for manufacturing a dynamic pressure module is provided, which includes: first, providing a heat-conducting plate and fabricating a fluid groove on the heat-conducting plate, the fluid groove having a side wall and at least two channels, the at least one The two channels each have a bonding sidewall. Secondly, in the at least two channels, at least two elastic devices are respectively correspondingly disposed, and the at least two elastic devices respectively have a fixed side engaged with the joint sidewall of the at least two channels, preferably, the At least two elastic means are composed of springs. Also secondly, at least two sliding blocks are arranged in the at least two channels, respectively joined to one side of the at least two elastic devices opposite to the fixed side, wherein the at least two sliding blocks divide the fluid groove into At least two elastic device spaces and a heat-conducting fluid space. And secondly, a cover plate is arranged above the fluid tank, and the cover plate has an opening. Next, a heat-conducting fluid is arranged in the heat-conducting fluid space. And set a heat conduction module, the heat conduction module includes a setting surface and a bonding surface, the setting surface is arranged in the fluid tank through the opening of the cover plate, and is in contact with the heat conduction fluid, and the bonding surface is arranged on the One side of the cover plate opposite to the fluid tank is in close contact with an electronic component. Wherein, when the heat conducting module moves in the direction perpendicular to the bonding surface, the setting face exerts a force on the heat conducting fluid, and the elastic devices exert a force on the setting face through the sliding blocks and the heat conducting fluid. Reaction force is applied, and the setting surface is maintained in a balanced position in the direction perpendicular to the bonding surface, so that the bonding surface and the electronic component form a close contact.

The beneficial effect of the present invention is that, through the dynamic pressure module and the manufacturing method thereof according to the embodiments of the present invention, damage to electronic components due to force applied during assembly or vibration after assembly can be avoided, and the design of different thermal conductivity for different electronic components can be simplified. The craft of the module.

Description of drawings

Fig. 1 is a kind of heat conduction structure of prior art;

2 is an exploded view of the dynamic pressure module of the first embodiment of the present invention;

3 is a perspective view of the dynamic pressure module according to the first embodiment of the present invention;

4 is a cross-sectional view of a dynamic pressure module according to the first embodiment of the present invention;

5 is a perspective view of a fluid tank according to a second embodiment of the present invention;

6 is a perspective view of a dynamic pressure module according to a second embodiment of the present invention;

Fig. 7 is the flow chart of the manufacturing method of dynamic pressure module of the present invention;

Fig. 8 is the perspective view of the fluid tank setting completed in step S01 of the manufacturing method of the present invention;

Fig. 9 is the perspective view that the S02 step of the manufacturing method of the present invention completes the setting of the sliding block;

Fig. 10 is the perspective view of the step S03 of the manufacturing method of the present invention completing the setting of the elastic device;

11 is a perspective view of the cover plate setting completed in step S04 of the manufacturing method of the present invention.

reference number

2 heat pipes

21 Connections

3 thermal block

4 Elastic positioning piece

1000, 2000 Dynamic Pressure Modules

1100, 2100 Fluid Body

1110, 2110 Sidewall

1120, 2120 channel

1130 Elastic device space

1140 Thermal fluid space

1121, 2121 Joining sidewalls

1200 Elastic Device

1210 Fixed side

1300 Sliding Block

1400,2400 Cover

1410 Opening

1500,2500 Thermal Modules

1510,2510 Fitting surface

1520 Set face

1600, 2600 thermal plate

Detailed ways

The following are specific embodiments according to the present invention and described with reference to the drawings.

First, a first specific embodiment of the present invention will be described. Please refer to FIG. 2 , which is an exploded view of the dynamic pressure module 1000 in this embodiment, which depicts a fluid tank 1100 , two sliding blocks 1300 , two elastic devices 1200 , a cover plate 1400 and a heat conduction module 1500 . The fluid tank 1100 is disposed on the thermally conductive plate 1600 and has side walls 1110 , two channels 1120 opposite to each other, and joint side walls 1121 in the channels 1120 . The elastic devices 1200 are respectively disposed in the channels 1120, and the fixed sides 1210 of the elastic devices 1200 are respectively joined to the engaging side walls 1121 of the channels 1120, wherein the present embodiment uses a spring as the elastic device. Preferably, the elastic device of the present invention can also be made of other elastic materials, for example, an elastic device made of rubber material. The sliding block 1300 is joined to the other end of the elastic device 1200 opposite to the fixed side 1210 and disposed in the channel 1120 to divide the fluid groove 1100 into two elastic device spaces 1130 and a heat-conducting fluid space 1140 . The cover plate 1400 is disposed on the fluid tank 1100 and has an opening 1410 . The thermally conductive module 1500 has a bonding surface 1510 and a setting surface 1520 opposite to each other, wherein the setting surface 1520 is arranged in the fluid tank 1100 through the opening 1410 of the cover plate 1400 , and the bonding surface 1510 is arranged outside the fluid tank 1100 to communicate with an electronic Components form a tight fit.

Please refer to FIG. 3 , which is a perspective view of the dynamic pressure module 1000 in this embodiment, which depicts the cover plate 1400 , the thermal conduction module 1500 , and the bonding surface 1510 of the thermal conduction module 1500 after the combined dynamic pressure module 1000 . Wherein, when the dynamic pressure module 1000 is used to provide a better thermal conduction path for the electronic components, the bonding surface 1510 of the thermal conduction module 1500 can form a close fit with the electronic components, so that the thermal energy of the electronic components is conducted to the electronic components through the bonding surface 1510. Thermally conductive module 1500.

Please refer to FIG. 4 , which is a cross-sectional view of the dynamic pressure module 1000 in the present embodiment along the AA direction in FIG. 3 , which depicts the position where the heat conduction module 1500 is disposed in the fluid tank. Wherein, the heat-conducting fluid space 1140 between the sliding block 1300 and the heat-conducting module 1500 is provided with an appropriate amount of heat-conducting fluid. When the heat-conducting module 1500 is installed, the setting surface 1520 of the heat-conducting module 1500 is disposed in the heat-conducting fluid space 1140 through the cover plate 1400 , and in contact with heat transfer fluid. Preferably, the heat transfer fluid is made of a material with a thermal conductivity of 3-6 W/m°C. More preferably, when the abutment surface 1510 and the electronic components are in close contact, the setting surface 1520 is abutted with the bottom surface of the fluid tank to form a better heat conduction path between the setting surface 1520 and the bottom surface of the fluid tank.

Among them, the thermal conduction module of the present invention can not only form a close contact with the electronic components to provide a better thermal conduction path for the electronic components, but also avoid excessive force on the electronic components and cause damage to the electronic components. Please continue to refer to FIG. 4 , when the dynamic pressure module 1000 is used to provide a heat conduction path for the electronic component, the bonding surface 1510 of the heat conduction module 1500 first comes into contact with an electronic component. At this time, the heat conduction module 1500 is forced to move into the fluid tank 1100 , and in the direction perpendicular to the bonding surface 1510, a force is exerted on the heat-conducting fluid, and then the heat-conducting fluid flows to the surroundings to squeeze the sliding block 1300. After the sliding block 1300 is squeezed, the elastic device 1200 is formed. At this time, the deformed elastic device 1200 exerts an elastic force on the heat-conducting fluid through the sliding block 1300, and the heat-conducting fluid subjected to the elastic force exerts a reaction force on the heat-conducting module 1500 in the direction perpendicular to the bonding surface. In the direction perpendicular to the bonding surface, when the force exerted by the heat conduction module 1500 on the heat conduction fluid and the reaction force exerted by the elastic device 1200 on the heat conduction module 1500 through the sliding block 1300 and the heat conduction fluid reach a balance, the heat conduction module 1500 maintains a balance. position. Therefore, when the dynamic pressure module 1000 of the present invention exerts a force to make the heat conduction module 1500 closely adhere to an electronic component, the above-mentioned process can prevent the electronic component from being damaged by external force. Furthermore, the electronic components assembled with the dynamic pressure module 1000 are less likely to be damaged when subjected to vibration. In addition, through the above-mentioned mechanism, the dynamic pressure module 1000 of the present invention can be closely attached to electronic components with different heights or thicknesses, which simplifies the process of designing different thermal conduction modules for different electronic components.

Preferably, in an actual test, the dynamic pressure module 1000 of this embodiment has better thermal conductivity than the prior art that uses a thermal pad as the interface between the thermal module and the electronic components. For detailed test conditions and results, please refer to Table 1 below. In this test, Example 1 is the dynamic pressure module 1000 according to the first embodiment of the present invention, and is tested with an Intel i7-4700EQ processor operating at a power of 47 watts. Comparative Example 1 uses a thermal conductive sheet as the interface between the thermal conductive module and electronic components in the prior art, and uses an Intel i7-4700EQ processor operating at a power of 17 watts for testing, wherein the ambient temperature of Example 1 and Comparative Example 1 are both is 65°C. The test results show that the temperature difference between the processor and the ambient temperature is 15.6°C in the test of Example 1 and 22.6°C in the test of Comparative Example 1. It can be seen that the dynamic pressure module of the present invention is better than the traditional one. The heat-conducting device in this way has better heat-conducting effect, so that the temperature difference between the processor and the environment can be maintained at a lower value.

Table 1. Thermal conductivity test results of the dynamic pressure module

Next, a second specific embodiment of the present invention will be described. Please refer to FIG. 5 , which is an exploded view illustrating the dynamic pressure module 2000 in this embodiment, which depicts a fluid groove 2100 , the fluid groove 2100 is disposed on a heat conducting plate 2600 and has sidewalls 2110 and four channels 2120, and the channels 2120 are arranged around the fluid tank 2100 as a set of two opposite each other, the joint sidewall 2121 of each channel 2120 is respectively joined to the fixed side of an elastic device, and each elastic device is opposite to a fixed side of the fixed side. The side is joined to a sliding block, and the sliding block divides the fluid groove into four elastic device spaces and a heat-conducting fluid space. The cover plate is arranged above the fluid tank and has an opening. The heat conduction module has a setting surface and a bonding surface, wherein the setting surface is arranged in the fluid tank through the opening of the cover plate, and the bonding surface is arranged outside the fluid tank to form close contact with an electronic component.

Please refer to FIG. 6 , which is a perspective view illustrating the dynamic pressure module 2000 in the present embodiment, which depicts the cover plate 2400 , the thermal conduction module 2500 , the thermal conduction plate 2600 , and the bonding surface 2510 of the thermal conduction module 2500 of the combined dynamic pressure module 2000 . Wherein, when the dynamic pressure module 2000 is used to provide a better thermal conduction path for the electronic components, the bonding surface 2510 of the thermal conduction module 2500 can form a close fit with the electronic components, so that the thermal energy of the electronic components is conducted to the electronic components through the bonding surface 2510. Thermally conductive module 2500.

It is worth mentioning that the dynamic pressure module of the present invention is not limited to a specific number of channels. The dynamic pressure module of the present invention is characterized in that the elastic devices arranged in the multiple channels exert multiple forces on the heat-conducting fluid through the sliding block, which can reach a balance on a plane parallel to the abutting surface of the heat-conducting module, so as to achieve a balance between the two forces. When the heat-conducting module is pressed by the heat-conducting fluid, the heat-conducting module does not move in the direction parallel to the bonding surface, but only receives the thrust of the heat-transfer fluid in a direction perpendicular to the bonding surface through the arrangement facing the heat-conducting module. Therefore, optionally, the dynamic pressure module of the present invention may have a plurality of channels, and the channels form a rotationally symmetrical relationship on a plane parallel to the bonding surface of the thermally conductive module, and respectively accommodate an elastic device and A sliding block is in it.

Next, a manufacturing method of the dynamic pressure module in the present invention will be described. Referring to FIG. 7 , it is a flow chart of making a dynamic pressure module according to the present invention. The following describes an embodiment of the method for manufacturing a dynamic pressure module in the present invention with reference to the dynamic pressure module 1000 according to the first specific embodiment of the present invention.

In step S01 , a heat-conducting plate 1600 is provided first, and a fluid groove 1100 is fabricated on the heat-conducting plate 1600 . Referring to FIG. 8 , the fluid groove 1100 on the thermally conductive plate 1600 fabricated in the step S01 in this embodiment has a side wall 1110 and two channels 1120 respectively joined to the side walls 1121 . Preferably, the fluid tank 1100 of the present invention may be integrally formed with the heat conducting plate 1600 .

In step S02, two sliding blocks 1300 are provided to be disposed in the two channels 1120, respectively. Please refer to FIG. 9 , which depicts the sliding block 1300 after the step S03 in this embodiment is completed. The sliding block 1300 divides the fluid groove into an elastic device space 1130 and a heat-conducting fluid space 1140 .

In step S03, two elastic devices 1200 are provided and disposed in the two channels 1120 respectively. Referring to FIG. 10 , it is depicted that the elastic device 1200 completed in step S03 in this embodiment is a spring. Wherein, the fixed sides 1210 of the elastic device 1200 are respectively joined to the joining sidewalls 1121 of the channel 1120 . Optionally, the elastic device 1200 of the present invention can also be made of other elastic materials, for example, an elastic device made of a rubber material.

In step S04, a cover plate 1400 having an opening 1410 is provided. Please refer to FIG. 11 , which depicts the cover plate 1400 after step S03 in this embodiment, which is disposed above the fluid tank 1100 .

In step S05, a heat-conducting fluid is provided, which is set in the heat-conducting fluid space 1140. Preferably, the heat transfer fluid is made of a material with a thermal conductivity of 3-6 W/m°C.

In step S06, a heat conduction module 1500 is provided. Please refer to FIG. 3 and FIG. 4 , which illustrate the dynamic pressure module 1000 in which step S06 is completed in this embodiment. 4 is a cross-sectional view of the dynamic pressure module 1000 in the present embodiment along the AA direction in FIG. 3 . When the thermal conduction module 1500 is disposed in the fluid tank 1100 , the disposition surface 1520 of the thermal conduction module 1500 passes through the opening 1410 of the cover plate 1400 and The heat-conducting fluid is in contact, and the bonding surface 1510 of the heat-conducting module 1500 is disposed outside the fluid tank 1100 to form close contact with an electronic component. Optionally, the present invention may further provide a thermally conductive sheet disposed on the bonding surface 1510 to fill the gap between the bonding surface 1510 and the electronic components. Preferably, when the bonding surface 1510 is in close contact with the electronic components, the setting surface 1520 is bonded to the bottom surface of the fluid tank 1100 to form a better heat conduction path between the setting surface 1520 and the bottom surface of the fluid tank.

The dynamic pressure module made by the method of the present invention can provide a buffer function through the mobility of the thermal conduction module 1500 in the fluid tank 1100 when the thermal conduction module 1500 is attached to an electronic component, so as to prevent the electronic component from being damaged during assembly. It can be damaged by force or vibration after assembly, and simplify the process of designing different thermal modules for different electronic components.

After describing the preferred embodiments of the present invention in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the claims of the present invention, and the present invention is not limited Implementation of the examples given in the specification.

Claims (11)

1. a kind of dynamic pressure module, which is characterized in that the dynamic pressure module includes:

One fluid slot, has one side wall and at least two channels, and at least two channel is respectively provided with an engagement side wall；

At least two elastic devices, be respectively arranged at least two channel and have an affixed side, described at least two The affixed side of elastic device is respectively engaged to the engagement side wall of at least two channel；

At least two sliding stop blocks, are set at least two channel, and be respectively engaged at least two elastic device Relative to the side of the affixed side, wherein the fluid slot is divided at least two elastic devices by described at least two sliding stop blocks Space and a heat-conducting fluid space；

One cover board is set to above the fluid slot and has an opening；

One heat-conducting fluid is set in the heat-conducting fluid space；And

One heat conducting module includes:

One setting face, is set in the fluid slot, and contact with the heat-conducting fluid by the opening of the cover board；With And

One binding face, relative to the setting face, the binding face is set to side of the cover board relative to the fluid slot, To be fitted closely with electronic component formation,

Wherein, the heat conducting module when moving on the vertical binding face direction, apply towards the heat-conducting fluid by the setting With an active force, and at least two elastic device is set by described at least two sliding stop blocks and the heat-conducting fluid to described The face of setting imposes a reaction force, and the setting face is maintained an equilbrium position on the direction of the vertical binding face.

2. dynamic pressure module according to claim 1, which is characterized in that the heat-conducting fluid is existed by thermal coefficient range 3~6W/m DEG C of material is constituted.

3. dynamic pressure module according to claim 1, which is characterized in that at least two elastic device is spring.

4. dynamic pressure module according to claim 1, which is characterized in that the dynamic pressure module includes one thermally conductive Piece is set to the binding face of the heat conducting module, to fill up the gap of the binding face Yu the electronic component.

5. dynamic pressure module according to claim 1, which is characterized in that the heat conducting module and the electronic component shape When at fitting closely, the bottom surface of the setting face and the fluid slot, which is formed, to be fitted closely.

6. a kind of dynamic pressure module manufacturing methods, which is characterized in that the dynamic pressure module manufacturing methods include:

One heat-conducting plate is provided；

Making a fluid slot on the heat-conducting plate, the fluid slot has one side wall and at least two channels, and described at least two A channel is respectively provided with an engagement side wall；

At least two elastic devices are set, are respectively correspondingly set at least two channel, at least two elasticity Device is respectively provided with the engagement side wall that an affixed side is bonded at least two channel；

The sliding stop block of setting at least two, it is opposite to be respectively engaged at least two elastic device at least two channel In the side of the affixed side, wherein the fluid slot is divided at least two elastic device spaces by described at least two sliding stop blocks An and heat-conducting fluid space；

One cover board is set above the fluid slot, and the cover board has an opening；

A heat-conducting fluid is set in the heat-conducting fluid space；And

One heat conducting module is set, and the heat conducting module is set to the stream by the opening of the cover board comprising a setting face It in body slot, and is contacted with the heat-conducting fluid, the heat conducting module further includes a binding face and is set to the cover board relative to institute The side of fluid slot is stated, to be fitted closely with electronic component formation,

Wherein, the heat conducting module when moving on the vertical binding face direction, apply towards the heat-conducting fluid by the setting With an active force, and at least two elastic device is set by described at least two sliding stop blocks and the heat-conducting fluid to described The face of setting imposes a reaction force, and the setting face is maintained an equilbrium position on the direction of the vertical binding face.

7. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the fluid slot with it is described thermally conductive Plate is integrally formed completion.

8. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the heat-conducting fluid is by thermally conductive system Number ranges are made by 3~6W/m DEG C of the material.

9. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that at least two elastic device It is made of with spring.

10. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the dynamic pressure module Manufacturing method further include: further one thermally conductive sheet of setting is on the binding face of the heat conducting module, to fill up the patch The gap in conjunction face and the electronic component.

11. dynamic pressure module manufacturing methods according to claim 6, which is characterized in that the binding face and the electricity When subcomponent formation fits closely, the setting face is bonded with the bottom surface of the fluid slot.