CN106163218A - Electronic device and expansion device - Google Patents

Abstract

The invention provides an electronic device and an expansion device. The electronic device comprises a heating element and a first connector. The first connector is suitable for being electrically connected with the second connector of the expansion device. The heat generated by the heat generating element is conducted to the first connector. When the first connector is electrically connected with the second connector, the first connector conducts heat generated by the heating element to the expansion device, and the heating element is switched to a heat dissipation mode according to a control signal from the expansion device. The invention can expand the heat dissipation function of the electronic device by utilizing the expansion device, and is beneficial to the miniaturization of the electronic device.

Description

Electronics and Expansion Units

technical field

The invention relates to an electronic device and an expansion device, in particular to an electronic device and the expansion device which can use the expansion device to expand the cooling function.

Background technique

Internal components (eg, central processing unit) of electronic devices often generate a lot of heat during operation. Therefore, how to remove the heat generated by the internal components of the electronic device has become a focus of attention of developers. Generally speaking, most of the existing electronic devices are provided with fans inside, and the fans are used to dissipate heat. However, the fan usually consumes a huge hardware space, thereby increasing the thickness and weight of the electronic device, thereby limiting the development of the miniaturization of the electronic device.

Contents of the invention

The invention provides an electronic device and an expansion device. The expansion device is used to expand the heat dissipation function of the electronic device, thereby contributing to the miniaturization of the electronic device.

The electronic device of the present invention includes a heating element and a first connector. The first connector is adapted to be electrically connected to the second connector of the expansion device. Heat generated by the heating element is conducted to the first connector. When the first connector is electrically connected to the second connector, the first connector conducts the heat generated by the heating element to the expansion device, and the heating element switches to a cooling mode according to a control signal from the expansion device.

In an embodiment of the present invention, the above-mentioned electronic device includes a body and a heat pipe. The body exposes the opening and the heat conducting surface of the first connector. The first end of the heat pipe is connected to the heating element, and the second end of the heat pipe is connected to the first connector. The heating element and the heat pipe are arranged in the body.

In an embodiment of the present invention, when the first connector is electrically connected to the second connector, the heat pipe, the first connector and a metal shell of the expansion device form a heat dissipation path, and the heating element dissipates heat through the heat dissipation path .

In an embodiment of the present invention, part of the machine body is composed of a metal cover, and the heating element also dissipates heat through the metal cover.

In an embodiment of the present invention, the heat conducting surface surrounds the opening, and when the first connector is electrically connected to the second connector, the heat conducting surface contacts a metal shell of the expansion device.

In an embodiment of the present invention, the above-mentioned electronic device further includes a first body, a second body, a bearing seat, a first heat pipe, and a second heat pipe. The first body is provided with a plurality of first engaging parts. The second body exposes an opening and a heat conducting surface of the first connector. The bearing seat is pivotally connected to the second body, and is provided with a plurality of second engaging parts. The plurality of first engaging elements correspond to the plurality of second engaging elements, and the first body is assembled to the second body through the plurality of first engaging elements and the plurality of second engaging elements . The first heat pipe connects the heating element and the plurality of first engaging parts, wherein the heating element and the first heat pipe are arranged in the first body. The second heat pipe connects the plurality of second engaging parts and the first connector, and is arranged in the second body and the bearing seat.

In an embodiment of the present invention, when the first connector is electrically connected to the second connector, and the first body is assembled on the second body, the first heat pipe, the plurality of first engaging parts, the plurality of A heat dissipation path is formed by the second engaging part, the second heat pipe, the first connector and a metal shell of the expansion device, and the heating element dissipates heat through the heat dissipation path.

In an embodiment of the present invention, each second engaging part includes a tenon, a supporting part and a plastic part. The bottom of the tenon is connected with the second heat pipe. The supporting member is sleeved on the tenon and includes a first opening to expose the top of the tenon. The plastic part is sheathed on the supporting part and includes a second opening opposite to the first opening.

In an embodiment of the present invention, the plurality of first engaging parts and the tenons are made of metal.

In an embodiment of the present invention, in the cooling mode, the heating element receives temperature information and rotational speed information from the expansion device through the first connector, and the electronic device displays the temperature information and rotational speed information.

The expansion device of the present invention is suitable for an electronic device including the first connector, and the expansion device includes the second connector. The second connector is suitable for electrically connecting the first connector of the electronic device, and the heat generated by the heating element in the electronic device is conducted to the first connector. When the first connector is electrically connected to the second connector, the first connector conducts the heat generated by the heating element to the expansion device, and the expansion device transmits a control signal to switch the heating element to a cooling mode.

In an embodiment of the present invention, the expansion device further includes a metal casing and a controller. The controller is set in the metal casing. When the first connector is electrically connected to the second connector, the controller generates a control signal.

In an embodiment of the present invention, the expansion device further includes a fan. The fan is arranged in the metal casing and electrically connected to the controller, wherein the controller decides whether to start the fan according to a temperature information.

In an embodiment of the present invention, the expansion device further includes a temperature sensor. The temperature sensor is arranged in the metal casing, and detects the temperature of the expansion device to generate temperature information. When the first connector is electrically connected to the second connector, the expansion device transmits temperature information and fan speed information to the electronic device through the second connector.

In an embodiment of the present invention, the expansion device further includes an air inlet hole and an air outlet hole. The air inlet hole runs through the metal shell. The air outlet runs through the metal casing, and the fan faces the air outlet.

In an embodiment of the present invention, the second connector is disposed on a heat conducting surface of the metal housing, and when the first connector is electrically connected to the second connector, the heat conducting surface contacts the first connector.

In an embodiment of the invention, the second connector is a plug connector.

Based on the above, in the electronic device and the expansion device of the present invention, the electronic device can be externally connected to the expansion device through the first connector, and the heat dissipation can be performed through the expansion device. Thereby, the thickness and weight of the electronic device will be reduced, and the miniaturization of the electronic device will be facilitated.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a schematic block diagram of an electronic device according to an embodiment of the present invention;

2 is a partial structural diagram of an electronic device according to an embodiment of the present invention;

3 is a schematic structural diagram of an expansion device according to an embodiment of the present invention;

FIG. 4 and FIG. 5 are respectively external views of an expansion device according to an embodiment of the present invention;

FIG. 6 is a schematic block diagram of an expansion device according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of heat dissipation using a metal casing of an expansion device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of heat dissipation using a metal casing and a fan of an expansion device according to an embodiment of the present invention;

FIG. 9 is an appearance diagram of an electronic device according to an embodiment of the present invention;

10 is a schematic block diagram of an electronic device according to another embodiment of the present invention;

FIG. 11 is an appearance diagram of an electronic device according to another embodiment of the present invention;

12 is a schematic side view of an electronic device according to an embodiment of the present invention;

Fig. 13 is a schematic diagram of a second engaging part according to an embodiment of the present invention;

Fig. 14 is an exploded view of the second engaging part according to an embodiment of the present invention.

Explanation of reference signs:

10, 100: electronic device;

110: heating element;

120: heat pipe;

130: a first connector;

131, 211: heat conduction surface;

132, 1321, 1331: opening;

140: substrate;

150: battery;

160: body;

20: Expansion device;

210: metal shell;

220: second connector;

310: substrate;

320: internal circuit;

330: fan;

340: air inlet hole;

350: air outlet;

601, 602: signal terminals;

603: power terminal;

604: ground terminal;

610: storage module;

620: controller;

630: temperature sensor;

910: metal cover;

1010: The first body;

1011, 1012: the first engaging part;

1020: bearing seat;

1021, 1022: the second engaging part;

1030: second body;

1040: the first heat pipe;

1050: the second heat pipe;

1310: tenon;

1320: plastic parts;

1330: Supports.

detailed description

FIG. 1 is a schematic block diagram of an electronic device according to an embodiment of the present invention. As shown in FIG. 1 , the electronic device 10 includes a heating element 110 , a heat pipe 120 , a first connector 130 , a substrate 140 , a battery 150 and a body 160 . The heating element 110 can be, for example, a central processing unit, but in other embodiments, the heating element 110 can also be a memory module or a hard disk. The substrate 140 can be, for example, a printed circuit board. The first connector 130 may be, for example, a Universal Serial Bus (USB) connector. The heating element 110 is disposed on the substrate 140 . A first end of the heat pipe 120 is connected to the heating element 110 , and a second end of the heat pipe 120 is connected to the first connector 130 .

The electronic device 10 can be externally connected to an expansion device 20 through the first connector 130 . For example, the first connector 130 may be, for example, a socket connector, and the socket connector includes an accommodating space. The expansion device 20 includes a metal shell 210 and a second connector 220 . The metal shell 210 can be made of metal with high thermal conductivity, and the second connector 220 can be, for example, a plug connector. In addition, the plug connector of the expansion device 20 is suitable for being inserted into the accommodating space of the socket connector.

FIG. 2 is a partial structural diagram of an electronic device according to an embodiment of the present invention. As shown in FIGS. 1 and 2 , the first connector 130 includes a heat conducting surface 131 and an opening 132 . The heat conducting surface 131 surrounds the opening 132 . When the electronic device 10 is externally connected to the expansion device 20 , the electronic device 10 will activate a heat dissipation mode and can dissipate heat through a heat dissipation path. Specifically, when the second connector 220 of the expansion device 20 is electrically connected to the first connector 130 of the electronic device 10 , the heat pipe 120 , the first connector 130 and the expansion device 20 can form a heat dissipation path.

For example, as the electronic device is externally connected to the expansion device, the heat conducting surface 131 of the first connector 130 will contact the metal shell 210 of the expansion device 20 . At this time, the heat generated by the heating element 110 can be transferred to the accommodating space of the first connector 130 through the heat pipe 120 , and the heat conducting surface 131 of the first connector 130 can transfer the heat in the accommodating space to the accommodating space of the expansion device 20 Metal shell 210 . In this way, the heat generated by the heating element 110 can be transferred to the air through the metal casing 210 of the expansion device 20 , so as to achieve the purpose of heat dissipation.

In addition, the heating element 110 can receive a control signal from the expansion device 20 through the first connector 130, and the heating element 110 will switch to the cooling mode according to the control signal. In the cooling mode, the heating element 110 can dissipate heat through the heat dissipation path, so the heating element 110 can maintain or improve the operating performance. For example, when switching to the cooling mode, the heating element 110 may increase or not decrease the frequency of its internal frequency signal, so as to maintain a high load state.

In the cooling mode, the heating element 110 can also receive temperature information from the expansion device 20 and/or rotational speed information of a fan in the expansion device 20 through the first connector 130 . In addition, the electronic device 10 can display temperature information and/or rotational speed information from the expansion device 20 through a display module (not shown), so that the user can monitor the system status of the electronic device 10 at any time. For example, the user can judge whether the electronic device 10 is in a state of high performance and high temperature according to the temperature information and/or the rotational speed information. In other words, the heat dissipation function of the electronic device 10 can be expanded by connecting the expansion device 20 , which helps to reduce its thickness and weight, thereby contributing to the development of miniaturization. In addition, the expansion device 20 can also improve the cooling capacity by turning on the internal fan. That is to say, the expansion device 20 can provide a two-stage heat dissipation program, and the heat dissipation process of the expansion device 20 will be described in detail as follows.

FIG. 3 is a schematic structural diagram of an expansion device according to an embodiment of the present invention, and FIG. 4 and FIG. 5 are respectively external views of the expansion device according to an embodiment of the present invention. As shown in FIG. 3 , the expansion device 20 further includes a base board 310 , an internal circuit 320 and a fan 330 . Wherein, the substrate 310 , the internal circuit 320 and the fan 330 are disposed in the metal casing 210 , and the internal circuit 320 is disposed on the substrate 310 . In addition, as shown in FIGS. 3 and 4 , the metal shell 210 includes a heat conducting surface 211 , and the second connector 220 is disposed on the heat conducting surface 211 . When the second connector 220 of the expansion device 20 is electrically connected to the first connector 130 of the electronic device 10, the heat conduction surface 211 of the metal shell 210 will be in contact with the heat conduction surface 131 of the first connector 130, thereby facilitating Heat from the electronic device 10 is conducted to the metal case 210 . Furthermore, as shown in FIG. 3 and FIG. 5 , the expansion device 20 further includes an air inlet hole 340 and an air outlet hole 350 . Wherein, the air inlet hole 340 and the air outlet hole 350 pass through the metal casing 210 , and the fan 330 faces the air outlet hole 350 .

In operation, the metal casing 210 of the expansion device 20 can be used for heat dissipation, and the expansion device 20 can further improve the heat dissipation capability through the fan 330 . For example, FIG. 6 is a schematic block diagram of an expansion device according to an embodiment of the present invention. As shown in FIG. 6 , the second connector 220 includes a signal terminal 601 , a signal terminal 602 , a power terminal 603 and a ground terminal 604 . In one embodiment, the second connector 220 may be, for example, a USB connector, and the signal terminal 601 and the signal terminal 602 may be, for example, D+ pins and D− pins of the USB connector.

The internal circuit 320 of the expansion device 20 includes a storage module 610 , a controller 620 and a temperature sensor 630 . The storage module 610 is electrically connected to the signal terminals 601 and 602 and can be used to provide data storage function. In other words, in one embodiment, the expansion device 20 can be, for example, a USB Flash Disk with heat dissipation function. The controller 620 is electrically connected to the power terminal 603 to provide power through the power signal from the electronic device 10 , and the controller 620 is used to control the fan 330 . The temperature sensor 630 detects the temperature of the extension device 20 to generate temperature information.

When the second connector 220 of the expansion device 20 is electrically connected to the first connector 130 of the electronic device 10 , the controller 620 generates a control signal. The memory controller (not shown) in the storage module 610 transmits the control signal generated by the controller 620 to the electronic device 10 through the signal terminal 601 or 602 . Thereby, the electronic device 10 can switch to the cooling mode in response to the control signal, and can dissipate heat through the metal casing 210 of the expansion device 20 . For example, FIG. 7 is a schematic diagram of utilizing the metal casing of the expansion device to dissipate heat according to an embodiment of the present invention. As shown in FIG. 7 , the heat energy from the electronic device 10 is conducted to the metal casing 210 , and can be further transferred to the air through the surface of the metal casing 210 .

On the other hand, the temperature sensor 630 will continuously detect the temperature of the extension device 20 and update the temperature information accordingly. The memory controller in the storage module 610 can transmit the temperature information to the electronic device 10 through the signal terminal 601 or 602 , so as to further display the temperature information through the electronic device 10 . Furthermore, the controller 620 determines whether to activate the fan 330 according to the temperature information. For example, FIG. 8 is a schematic diagram of utilizing a metal casing and a fan of an expansion device to dissipate heat according to an embodiment of the present invention. As shown in FIG. 8 , when the value of the temperature information is greater than a preset temperature value, the controller 620 starts the fan 330 . At this time, the fan 330 can drive a heat dissipation airflow, and the heat dissipation airflow enters the metal casing 210 from the air inlet hole 340 and flows out of the metal casing 21 through the air outlet hole 350 .

In other words, the expansion device 20 can provide a two-stage cooling procedure. In the heat dissipation procedure of the first stage, the expansion device 20 first utilizes the surface of the metal casing 210 to dissipate heat. When the temperature of the expansion device 20 reaches the preset temperature value, the expansion device 20 will switch to the second stage of the heat dissipation process to further use the fan 330 to accelerate heat dissipation. In addition, in the second stage of the heat dissipation process, the controller 620 can increase the speed of the fan 330 as the temperature rises, and the expansion device 20 can transmit the speed information of the fan 330 to the electronic device 10 through the signal terminal 601 or 602, so as to The rotational speed information is further displayed by the electronic device 10 .

Please continue to refer to FIG. 1 , the appearance structure of the electronic device 10 includes a body 160 . Wherein, the heating element 110 , the heat pipe 120 , the substrate 140 and the battery 150 are disposed in the body 160 . In addition, the body 160 exposes the heat-conducting surface 131 and the opening 132 of the first connector 130 for connecting the expansion device 20 . FIG. 9 is an appearance diagram of an electronic device according to an embodiment of the present invention. As shown in FIG. 9 , part of the body 160 can be formed by a metal cover 910 , and the heating element 110 in the electronic device 10 can dissipate heat through the metal cover 910 .

FIG. 10 is a schematic block diagram of an electronic device according to another embodiment of the present invention, and FIG. 11 is an appearance view of the electronic device according to another embodiment of the present invention. As shown in FIGS. 10 and 11 , the appearance structure of the electronic device 100 includes a first body 1010 , a bearing base 1020 and a second body 1030 . Wherein, the first body 1010 is provided with first engaging parts 1011 and 1012 . The bearing seat 1020 is pivotally connected to the second body 1030 and has second engaging parts 1021 and 1022 .

Looking further, the second engaging parts 1021 and 1022 protrude from the bearing base 1020 . The first engaging parts 1011 and 1012 correspond to the second engaging parts 1021 and 1022 , and each of the first engaging parts 1011 and 1012 forms an engaging groove. In this way, when the second engaging parts 1021 and 1022 on the bearing seat 1020 are inserted into the engaging grooves formed by the first engaging parts 1011 and 1012, the first body 1010 can be fixed above the bearing seat 1020 . In other words, the first body 1010 can be assembled to the second body 1030 through the first engaging parts 1011 and 1012 and the second engaging parts 1021 and 1022 .

FIG. 12 is a schematic side view of an electronic device according to an embodiment of the present invention. As shown in FIGS. 10 and 12 , the electronic device 100 further includes a first heat pipe 1040 and a second heat pipe 1050 . Wherein, the heating element 110 , the first heat pipe 1040 , the substrate 140 and the battery 150 are disposed in the first body 1010 . The second body 1030 exposes the heat conduction surface 131 and the opening 132 of the first connector 130 for connecting the expansion device 20 . The second heat pipe 1050 is disposed on the bearing seat 1020 and the second body 1030 .

The first heat pipe 1040 is connected to the heating element 110 and the first engaging parts 1011 and 1012 . The second heat pipe 1050 is connected to the first connector 130 and the second engaging parts 1021 and 1022 . When the second connector 220 of the expansion device 20 is electrically connected to the first connector 130 of the electronic device 100, and the first body 1010 is assembled on the second body 1030, the first heat pipe 1040, the first engaging parts 1011 and 1012, The second engaging parts 1021 and 1022 , the second heat pipe 1050 , the first connector 130 and the metal casing 210 of the expansion device 20 can form a heat dissipation path. Thereby, the heating element 110 can dissipate heat through the heat dissipation path, and can switch to the heat dissipation mode according to the control signal from the expansion device 20 .

Specifically, when the two bodies 1010 and 1030 of the electronic device 100 are assembled together, and the electronic device 100 is externally connected to the expansion device 20 , the heat generated by the heating element 110 can be transferred to the first engaging member 1011 and the first engaging member 1011 through the first heat pipe 1040 . 1012. In addition, the first engaging parts 1011 and 1012 are made of metal. Each of the second engaging parts 1021 and 1022 includes a tenon, and the tenon is made of metal. Therefore, the first engaging parts 1011 and 1012 and the second engaging parts 1021 and 1022 will further transfer heat energy to the second heat pipe 1050 . Moreover, the second heat pipe 1050 transfers heat energy to the accommodating space of the first connector 130 , and the heat conducting surface 131 of the first connector 130 can transfer the heat in the accommodating space to the metal casing 210 of the expansion device 20 . In this way, the heat generated by the heating element 110 can be transferred to the air through the metal casing 210 of the expansion device 20 , so as to achieve the purpose of heat dissipation.

FIG. 13 is a schematic diagram of a second engaging part according to an embodiment of the present invention, and FIG. 14 is an exploded view of the second engaging part according to an embodiment of the present invention. As shown in FIG. 13 and FIG. 14 , the second engaging part 1021 includes a tenon 1310 , a plastic part 1320 and a supporting part 1330 . Wherein, the supporting member 1330 is sleeved on the tenon 1310 , and the opening 1331 of the supporting member 1330 exposes the top of the tenon 1310 . The plastic part 1320 is sleeved on the supporting part 1330 , and the opening 1321 of the plastic part 1320 faces the opening 1331 of the supporting part 1330 , so that the plastic part 1320 also exposes the top of the tenon 1310 .

In overall configuration, the bottom of the tenon 1310 is connected to the second heat pipe 1050 . In addition, when the two bodies 1010 and 1030 of the electronic device 100 are assembled together, the top of the tenon 1310 contacts the first engaging part 1011, so that the tenon 1310 can transfer the heat energy from the first engaging part 1011 to the second engaging part 1011. Heat pipe 1050. It is worth mentioning that the material of the tenon 1310 can be, for example, a metal material (eg, copper). The material of the supporting member 1330 can be, for example, zinc alloy, so as to improve the stability of the assembly of the first body 1010 on the second body 1030 . The plastic part 1320 is helpful to reduce the friction force in the assembly of the first body 1010 and the second body 1030 .

To sum up, the electronic device of the present invention conducts the heat generated by the heating element to the first connector, and connects to an external expansion device through the first connector. Thereby, when the electronic device is electrically connected with the expansion device, the electronic device can dissipate heat through the expansion device. In addition, the expansion unit provides a two-stage cooling program. In the first stage of the heat dissipation process, the electronic device can dissipate heat through the metal casing of the expansion device. In the second stage of the heat dissipation process, the electronic device can further dissipate heat through the fan in the expansion device. The electronic device can further display temperature information and/or rotational speed information from the expansion device, so that the user can monitor the system status of the electronic device at any time. Since the heat dissipation function of the electronic device can be expanded through the expansion device, it is helpful to the development of the miniaturization of the electronic device.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (17)

1. an electronic installation, it is characterised in that including:

One heater element；And

One first adapter, is suitable to be electrically connected with one second adapter of an expanding device, and described heating The heat that element produces is conducted to described first adapter,

Wherein, when described first adapter is electrically connected with described second adapter, described first adapter The conduction of heat produced by described heater element is to described expanding device, and described heater element is according to from institute The control signal stating expanding device switches to a radiating mode.

Electronic installation the most according to claim 1, it is characterised in that also include:

One body, exposes an opening and a thermal conductive surface of described first adapter；And

One heat pipe, its first end connects described heater element, and the second end of described heat pipe connects described first Adapter, wherein said heater element and described heat pipe are arranged in described body.

Electronic installation the most according to claim 2, it is characterised in that when described first adapter electricity Property when connecting described second adapter, the one of described heat pipe, described first adapter and described expanding device Metal shell forms a heat dissipation path, and described heater element is dispelled the heat by described heat dissipation path.

Electronic installation the most according to claim 3, it is characterised in that the described body of part is by one Metal cap body is constituted, and described heater element dispels the heat also by described metal cap body.

Electronic installation the most according to claim 2, it is characterised in that described thermal conductive surface is around described Opening, and when described first adapter is electrically connected with described second adapter, described thermal conductive surface contacts institute State a metal shell of expanding device.

Electronic installation the most according to claim 1, it is characterised in that also include:

One first housing, is provided with multiple first fastener；

One second housing, exposes an opening and a thermal conductive surface of described first adapter；

One load bearing seat, is articulated in the described second housing, and is provided with multiple second fastener, wherein those One fastener corresponds to those second fasteners, and the described first housing by those first fasteners and is somebody's turn to do A little second fasteners are assembled in the described second housing；

One first heat pipe, connects described heater element and those first fasteners, wherein said heater element It is arranged in the described first housing with described first heat pipe；And

One second heat pipe, connects those second fasteners and described first adapter, and is arranged on described the In two bodies and described load bearing seat.

Electronic installation the most according to claim 6, it is characterised in that when described first adapter electricity Property connect described second adapter, and when the described first housing is assembled in the described second housing, described first Heat pipe, those first fasteners, those second fasteners, described second heat pipe, described first adapter Form a heat dissipation path with a metal shell of described expanding device, and described heater element is dissipated by described Hot path dispels the heat.

Electronic installation the most according to claim 6, it is characterised in that those second fasteners each Including:

One trip, the bottom of wherein said trip connects described second heat pipe；

One support member, is sheathed on described trip, and includes that one first opening is to expose described trip Top；And

One working of plastics, is sheathed on described support member, and includes one second relative to described first opening Opening.

Electronic installation the most according to claim 8, it is characterised in that those first fasteners and institute State trip and be metal material.

Electronic installation the most according to claim 1, it is characterised in that under described radiating mode, Described heater element receives the temperature information and from described expanding device by described first adapter Rotary speed information, and described electronic installation shows described temperature information and described rotary speed information.

11. 1 kinds of expanding devices, it is characterised in that be applicable to include an electronics dress of one first adapter Put, and described expanding device include:

One second adapter, is suitable to be electrically connected with this first adapter of described electronic installation, and described electricity The heat that in sub-device, a heater element produces is conducted to described first adapter,

Wherein, when described first adapter is electrically connected with described second adapter, described first adapter The conduction of heat produced by described heater element is to described expanding device, and described expanding device transmits a control Signal, so that described heater element switches to a radiating mode.

12. expanding devices according to claim 11, it is characterised in that also include:

One metal shell；And

One controller, is arranged in described metal shell, is wherein electrically connected with institute when described first adapter When stating the second adapter, described controller produces described control signal.

13. expanding devices according to claim 12, it is characterised in that also include:

One fan, is arranged in described metal shell, and is electrically connected with described controller, wherein said control Device processed decides whether to start described fan according to a temperature information.

14. expanding devices according to claim 13, it is characterised in that also include:

One temperature sensor, is arranged in described metal shell, and detect the temperature of described expanding device with Produce described temperature information, and when described first adapter is electrically connected with described second adapter, described Expanding device by described second adapter by a rotary speed information transmission of described temperature information Yu described fan To described electronic installation.

15. expanding devices according to claim 13, it is characterised in that also include:

One fresh air inlet, runs through described metal shell；And

One exhaust vent, runs through described metal shell, and described wafter is to described exhaust vent.

16. expanding devices according to claim 12, it is characterised in that described second adapter sets It is placed in a thermal conductive surface of described metal shell, and connects when described first adapter is electrically connected with described second During device, described thermal conductive surface contacts described first adapter.

17. expanding devices according to claim 11, it is characterised in that described second adapter is One pin connector.