CN106206473B - Integrated circuit plastic capsulation structure and preparation method thereof - Google Patents
Integrated circuit plastic capsulation structure and preparation method thereof Download PDFInfo
- Publication number
- CN106206473B CN106206473B CN201610791484.5A CN201610791484A CN106206473B CN 106206473 B CN106206473 B CN 106206473B CN 201610791484 A CN201610791484 A CN 201610791484A CN 106206473 B CN106206473 B CN 106206473B
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- Prior art keywords
- lcp
- cover board
- shell
- molding
- plastic
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- 239000004033 plastic Substances 0.000 title claims abstract description 38
- 229920003023 plastic Polymers 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 40
- 239000011230 binding agent Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000007812 deficiency Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of integrated circuit plastic capsulation structures and preparation method thereof, are characterized in, comprising the following steps: (1) make the pre-molding LCP shell being arranged in array, pre-molding LCP shell has cavity, forms cover board locating slot in cavity top edge；(2) chip assembling procedure is carried out in the cavities；(3) progress cover board is pre-sealed in the cover board locating slot for the cavity top edge that seal cover board is embedded in pre-molding LCP shell；(4) pre-molding LCP shell is placed in injection forming mold, it is molded above the seal cover board of pre-molding LCP shell, injected plastics material is LCP, obtains LCP sealing binder course, and pre-molding LCP shell and seal cover board are sealed binder course by LCP and form a complete plastic-sealed body；(5) the complete plastic-sealed body being arranged in array is cut using scribing process, is divided into single package body.The present invention can evade the lamination problem in conventional plastic package between chip and encapsulating resin, meet the requirement of highly reliable Plastic Package.
Description
Technical field
The present invention relates to a kind of integrated circuit plastic capsulation structures and preparation method thereof, belong to ic manufacturing technology neck
Domain.
Background technique
The encapsulation of highly reliable integrated circuit usually has three kinds of main shapes such as ceramic package, Metal Packaging, ceramics-glass encapsulation
Formula.These three encapsulation all have many advantages, such as cavity structure, have high-air-tightness, high mechanical strength, high heat conductance, are widely used in
The fields such as Aeronautics and Astronautics, military, Industry Control.But compared with the Plastic Package of large-scale production, these types is encapsulated in small-sized
Disadvantage is in terms of change, lightweight, cost and production cycle.
The advantages of Plastic Package is that size is small, light-weight, and since production technology is relatively easy, manufacturing cost is low, is easy real
Existing large-scale production.In addition, epoxy resin enclosed material used in Plastic Package has lower dielectric constant, in high frequency
Performance is even better than ceramic package.It is mainly epoxy resin that its maximum deficiency, which is encapsulating material used in common plastics encapsulate,
Its vapour performance that seeps water is poor, and the lamination problem after encapsulation is difficult to avoid.These deficiencies limit Plastic Package highly reliable
Application in integrated antenna package.
Summary of the invention
The purpose of the present invention is overcoming the deficiencies in the prior art, provide a kind of integrated circuit plastic capsulation structure and
Preparation method improves and is based on EMC(epoxy-plastic packaging material) deficiency of the Plastic Package in terms of steam infiltration, routine can be evaded
Lamination problem in Plastic Package between chip and encapsulating resin meets the requirement of highly reliable Plastic Package.
According to technical solution provided by the invention, a kind of integrated circuit plastic capsulation structure is characterized in: including pre-molding
LCP shell, seal cover board and LCP seal binder course, and pre-molding LCP shell has cavity, chip in cavity, cavity top
Seal cover board is installed；The top of the pre-molding LCP shell and seal cover board is molded by LCP sealing binder course and forms packaging body.
Further, the top edge of the cavity is provided with cover board locating slot, and the edge and cover board of seal cover board position
Slot, which is matched, realizes sealing for cavity.
Further, the height of the cavity is 0.5~1mm.
Further, the seal cover board is using ceramics or metal cover board.
The preparation method of the integrated circuit plastic capsulation structure, is characterized in, comprising the following steps:
(1) production has the pre-molding LCP shell of cavity, and made pre-molding LCP shell is arranged in array；In pre- mould
The cavity top edge for moulding LCP shell forms cover board locating slot；
(2) chip assembling procedure is carried out in the cavity of the LCP shell of pre-molding；
(3) cover board that seal cover board insertion is completed to the cavity top edge of the pre-molding LCP shell of chip assembling is determined
It is pre-sealed that cover board is carried out in the slot of position；
(4) by complete cover board it is pre-sealed after pre-molding LCP shell be placed in injection forming mold, in pre-molding LCP
Be molded above the seal cover board of shell, injected plastics material LCP, obtain LCP sealing binder course, by pre-molding LCP shell and
Seal cover board seals binder course by LCP and forms a complete plastic-sealed body；
(5) the complete plastic-sealed body being arranged in array is cut using scribing process, is divided into single package body.
Compared with the prior art the present invention has the advantage that
(1) plastic capsulation structure of the present invention uses LCP material as encapsulation base material, with existing based on EMC's
Plastic Package is compared, and encapsulating structure of the invention has the ability for more preferably resisting the erosions such as steam；
(2) the plastic capsulation structure of the present invention cavity structure similar using ceramic package, with existing using complete
The Plastic Package of encapsulating structure is compared, and encapsulating structure of the invention can evade the lamination problem between chip and encapsulating resin.
Detailed description of the invention
Fig. 1 is to obtain the schematic diagram of pre-molding LCP shell in preparation method of the present invention.
Fig. 2 is the schematic diagram of chip assembling procedure in preparation method of the present invention.
Fig. 3 is that the pre-sealed schematic diagram of cover board is carried out in preparation method of the present invention.
Fig. 4 is the schematic diagram for carrying out injection molding in preparation method of the present invention and forming complete plastic-sealed body.
Fig. 5 is the schematic diagram for cutting complete plastic-sealed body in preparation method of the present invention.
Fig. 6 is to obtain the schematic diagram of single package body in preparation method of the present invention.
Fig. 7 is the schematic diagram of integrated circuit plastic capsulation structure of the present invention.
Figure label: pre-molding LPC shell 1, seal cover board 2, LCP sealing binder course 3, cavity 4, chip 5, cover board positioning
Slot 10.
Specific embodiment
Below with reference to specific attached drawing, the invention will be further described.
As shown in Figure 7: the integrated circuit plastic capsulation structure includes pre-molding LCP shell 1, seal cover board 2 and LCP close
Binder course 3 is sealed, pre-molding LCP shell 1 has cavity 4, chip 5 in cavity 4, and seal cover board 2 is installed on 4 top of cavity；Institute
The top for stating pre-molding LCP shell 1 and seal cover board 2 forms packaging body by the LCP sealing injection molding of binder course 3.
The top edge of the cavity 4 is provided with cover board locating slot 10, edge and 10 phase of cover board locating slot of seal cover board 2
Cooperation carries out cavity 4 pre-sealed.
The size of the cavity 4 generally determines according to the size dimension of chip 5, the height of cavity 4 is generally 0.5~
1mm, the width of cavity 4, which is subject to, meets the requirement that chip 5 carries out routing.
The seal cover board 2 is using ceramics or metal cover board.
The preparation method of integrated circuit plastic capsulation structure of the present invention, comprising the following steps:
(1) as shown in Figure 1, making pre-molding LCP shell 1, made pre-molding LCP shell using standard spray technique
1 is arranged in array；The top edge of 1 cavity of pre-molding LCP shell forms a cover board locating slot 10 according to specific product size；
(2) as shown in Fig. 2, completing the chip in pre-molding LCP shell 1 using the chip load of standard, bonding technology
Assembling procedure；
(3) as shown in figure 3, chip assembling is completed in ceramics or metal cover board insertion by the chip load technique using standard
1 seal area of pre-molding LCP shell cover board locating slot 10 in carry out cover board it is pre-sealed；
(4) as shown in figure 4, the pre-molding LCP shell 1 after completion cover board is pre-sealed is placed in injection forming mold；It adopts
With similar QFN(Quad Flat No-lead Package, quad flat non-pin package) technique is in pre-molding LCP shell 1
It is molded above ceramics or metal cover board, injected plastics material LCP, obtains LCP sealing binder course 3, binder course is sealed by LCP
3 form a complete plastic-sealed body；
(5) as shown in figure 5, being cut the complete plastic-sealed body being arranged in array using conventional scribing process；
(6) as shown in fig. 6, the complete plastic-sealed body being arranged in array is divided into single package body.
Integrated circuit plastic capsulation structure of the present invention and preparation method thereof, using the LCP(polymerizable mesogenic of pre-molding
Object) package casing of the shell as integrated circuit, it is pre-sealed to the progress of LCP shell using ceramics or metal cover board, and use phase
LCP shell pre-sealed after completion chip assembling (load, bonding) is carried out spray shape by moulding technology by the LCP of same material
At a complete Plastic Package.It is the same to have ceramic package shell using the similar moulding technology of conventional plastic packaging by the present invention
Cavity structure.Since LCP material has the ability for more preferably resisting the erosions such as steam than common EMC material, the Plastic Package ratio
Conventional plastic package has better seal performance, can also evade the layering in conventional plastic package between chip and encapsulating resin
Problem has preferable application prospect in highly reliable Plastic Package product.
Claims (2)
1. a kind of preparation method of integrated circuit plastic capsulation structure, characterized in that the following steps are included:
(1) production has the pre-molding LCP shell (1) of cavity (4), and made pre-molding LCP shell (1) is arranged in array；
Cover board locating slot (10) are formed in cavity (4) top edge of pre-molding LCP shell (1)；
(2) chip assembling procedure is carried out in the cavity (4) of the LCP shell (1) of pre-molding；
(3) seal cover board (2) insertion is completed to the lid of cavity (4) top edge of the pre-molding LCP shell (1) of chip assembling
It is pre-sealed that cover board is carried out in plate locating slot (10)；
(4) by complete cover board it is pre-sealed after pre-molding LCP shell (1) be placed in injection forming mold, outside pre-molding LCP
It is molded above the seal cover board of shell (1), injected plastics material LCP, obtains LCP sealing binder course (3), it will be outside pre-molding LCP
Shell (1) and seal cover board (2) pass through LCP sealing binder course (3) one complete plastic-sealed body of formation；
(5) the complete plastic-sealed body being arranged in array is cut using scribing process, is divided into single package body.
2. the preparation method of integrated circuit plastic capsulation structure as described in claim 1, it is characterized in that: the seal cover board
(2) ceramic wafer is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610791484.5A CN106206473B (en) | 2016-08-30 | 2016-08-30 | Integrated circuit plastic capsulation structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610791484.5A CN106206473B (en) | 2016-08-30 | 2016-08-30 | Integrated circuit plastic capsulation structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206473A CN106206473A (en) | 2016-12-07 |
| CN106206473B true CN106206473B (en) | 2019-06-28 |
Family
ID=58085359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610791484.5A Active CN106206473B (en) | 2016-08-30 | 2016-08-30 | Integrated circuit plastic capsulation structure and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106206473B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11588231B2 (en) * | 2020-07-23 | 2023-02-21 | Robert Bosch Gmbh | Radar sensor including waveguide structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107324273B (en) * | 2017-06-12 | 2019-02-19 | 中国电子科技集团公司第五十四研究所 | A packaging method of MEMS device based on LCP multilayer stacking technology |
| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
| CN112645279B (en) * | 2020-12-23 | 2023-09-05 | 东南大学 | Packaging method of MEMS wind speed and direction sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228152A (en) * | 1988-03-09 | 1989-09-12 | Hitachi Chem Co Ltd | Manufacture of semiconductor device |
| JP2004260012A (en) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | How to assemble electronic components |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660562B2 (en) * | 2001-12-03 | 2003-12-09 | Azimuth Industrial Co., Inc. | Method and apparatus for a lead-frame air-cavity package |
| JP4134893B2 (en) * | 2003-12-05 | 2008-08-20 | 松下電器産業株式会社 | Electronic device package |
| JP2005235884A (en) * | 2004-02-18 | 2005-09-02 | Sanyo Electric Co Ltd | Circuit arrangement |
| KR100664310B1 (en) * | 2005-07-13 | 2007-01-04 | 삼성전자주식회사 | Wafer Level Encapsulation Chip and Encapsulation Chip Manufacturing Method |
| CN101281901A (en) * | 2007-04-04 | 2008-10-08 | 欣相光电股份有限公司 | Multi-chip integrated image sensing chip module and packaging method thereof |
| JP5732286B2 (en) * | 2011-03-16 | 2015-06-10 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
-
2016
- 2016-08-30 CN CN201610791484.5A patent/CN106206473B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228152A (en) * | 1988-03-09 | 1989-09-12 | Hitachi Chem Co Ltd | Manufacture of semiconductor device |
| JP2004260012A (en) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | How to assemble electronic components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11588231B2 (en) * | 2020-07-23 | 2023-02-21 | Robert Bosch Gmbh | Radar sensor including waveguide structure |
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| Publication number | Publication date |
|---|---|
| CN106206473A (en) | 2016-12-07 |
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