CN106229277B - A kind of chip mounter and pasting method - Google Patents
A kind of chip mounter and pasting method Download PDFInfo
- Publication number
- CN106229277B CN106229277B CN201610639569.1A CN201610639569A CN106229277B CN 106229277 B CN106229277 B CN 106229277B CN 201610639569 A CN201610639569 A CN 201610639569A CN 106229277 B CN106229277 B CN 106229277B
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- chip
- heat sink
- suction nozzle
- warm table
- mobile station
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a kind of chip mounter and pasting method, chip mounter includes material table, suction nozzle, warm table, angular displacement platform and mobile station；Wherein, material table is to place the chip；Suction nozzle drawing the chip on the material table, and by the chip be attached to it is described it is heat sink on；Warm table is to place and heat the solder on described heat sink and heat sink；Mobile station is arranged below the warm table, to support the warm table, and moves the warm table all around in a plane；Angular displacement platform is set between the mobile station and the warm table, to make the warm table relative to the plane tilt rotation, and then adjusts the preceding light-emitting surface of the chip and the depth of parallelism of the heat sink surface.By the above-mentioned means, the present invention can be improved the preceding light-emitting surface of chip and the depth of parallelism of heat sink surface, and then improve patch quality.
Description
Technical field
The present invention relates to semiconductor laser fields, more particularly to a kind of chip mounter and pasting method.
Background technique
Semiconductor laser (LD, Laser Diode) is since small in size, incident photon-to-electron conversion efficiency is high, direct modulation, optional
The features such as wave-length coverage is wide is selected, application field is more and more extensive.Generally we swash often in contact with to high power single-tube semiconductor
Light device chip package form includes COS (Chip On Submount), and C-mount, F-mount, TO-CAN etc., wherein COS is
It is most common.The manufacturing process of COS is broadly divided into two steps, carries out patch (die bond) before this, then carries out gold thread bonding
(wire bond)。
Patch is completed by chip mounter, and patch quality is critically depend on whether chip is aligned and parallel with heat sink,
If electrode on chip cannot with solder and it is heat sink between completely attach to and generate eutectic reaction, to high-power semiconductor laser chip
Characteristic influence it is very big.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of chip mounter and pasting method, can be improved chip it is preceding go out
The depth of parallelism of smooth surface and heat sink surface, and then improve patch quality.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of chip mounter is provided, to by core
Piece is pasted on heat sink, comprising:
Material table, to place the chip；
Suction nozzle, drawing the chip on the material table, and by the chip be attached to it is described it is heat sink on；
Warm table, to place and heat the solder on described heat sink and heat sink；
Mobile station is arranged below the warm table, to support the warm table, and makes the warm table in a plane
Inside all around move；And
Angular displacement platform is set between the mobile station and the warm table, to make the warm table relative to described
Plane tilt rotation, and then adjust the preceding light-emitting surface of the chip and the depth of parallelism of the heat sink surface.
Wherein, the chip mounter further comprises the CCD to acquire the image of the chip and the heat sink depth of parallelism,
And the display the CCD acquired image is presented.
Wherein, the chip mounter includes CCD and display described in three groups, wherein CCD described in one group and display to
Whether the preceding light-emitting surface for observing chip is parallel with the heat sink side surface, and in addition two groups of CCD and display are to observe the core
Whether the side of piece is parallel with the heat sink surface.
Wherein, the chip mounter further comprises turntable, is arranged between the warm table and the angular displacement platform, is used
To support and make the warm table in a plane internal rotation.
Wherein, the chip mounter further comprises the microscope whether being aligned for observing the chip with heat sink edge.
Wherein, the chip mounter further comprises for installing the microscopical shifting sledge, and the microscope can edge
The shifting sledge it is mobile.
Wherein, the chip mounter further comprises moving handle, and it is mobile that the moving handle manipulates the mobile station, and moves
Fixed handle and the moving ratio of mobile station are 6:1.
Wherein, the chip mounter further comprises the pneumatic table being set between the angular displacement platform and the mobile station,
The material table is placed in the pneumatic table, and the pneumatic table is described the material table or the warm table to be moved to
The lower section of suction nozzle, make suction nozzle draw the chip and by the chip be placed in it is described it is heat sink on.
Wherein, a button is set on the moving handle, and pneumatic table described in the button manipulations moves left and right.
Wherein, the chip mounter further comprises a cantilever, and one end of the cantilever is using the other end of the cantilever as axis
It swings up and down, the suction nozzle is installed on the one end of the cantilever swung up and down.
Wherein, the chip mounter further comprises the weight being set on the cantilever, and the suction nozzle is to described heat sink
Pressure size depends on position of the weight on the cantilever.
Wherein, the chip mounter further comprises the hand lever swung up and down to operate the cantilever, and the hand lever is complete
When pushing, suction nozzle vacuum is closed, and the chip is detached from the absorption of the suction nozzle.
Wherein, the suction nozzle is made of metal, and the suction nozzle has heating function, is provided with resistance wire.
In order to solve the above technical problems, another technical solution used in the present invention is: providing and a kind of be pasted to chip
Heat sink pasting method, comprising:
One material table is provided, the chip is placed on the material table；
One warm table is provided, described with solder heat sink is placed on the warm table；
One mobile station is provided, is arranged below the warm table, to support the warm table, and the warm table is made to exist
It is all around moved in one plane；
One angular displacement platform is provided, is set between the mobile station and the warm table, to keep the warm table opposite
In the plane tilt rotation；
One suction nozzle is provided, draw the chip on the material table and by the chip pushing be attached to it is described it is heat sink on；
When drawing the chip on the material table by the suction nozzle and the chip is pressed to close described heat sink, see
Examine the preceding light-emitting surface of the chip and the inclined degree of the heat sink surface, operate the mobile station and angular displacement platform make it is described
Warm table is mobile or relative to the Plane Rotation, and then adjusts the preceding light-emitting surface of the chip and the depth of parallelism of heat sink surface.
Wherein, the method further includes:
One moving handle is provided, manipulates the mobile station, and the moving handle and the shifting using the moving handle
The moving ratio of dynamic platform is 6:1.
Wherein, it is drawn before the chip is attached to the heat sink step in the suction nozzle, further comprises:
It is roughly the same with the height of the warm table to adjust the material table.
Wherein, when the suction nozzle draws the chip, vacuum is kept inside the suction nozzle.
Wherein, the method further includes:
A cantilever is provided, one end of the cantilever is swung up and down using the other end of the cantilever as axis, the suction nozzle
It is connected to the one end of the cantilever swung up and down.
Wherein, the method further includes:
A weight is provided on the cantilever, the suction nozzle push chip in it is described it is heat sink before, adjust the weight position
The loading of compacting chip needed for reaching.
Wherein, the method further includes:
The hand lever that the one operation cantilever is swung up and down is provided, when the hand lever pushes completely, the suction nozzle vacuum is closed,
The chip is detached from the absorption of the suction nozzle, and the suction nozzle still pushes down chip.
Wherein, the method further includes:
It provides a pneumatic table to be placed between the mobile station and angular displacement platform, the material table is placed in the pneumatic table
On, lower section of the pneumatic table the material table or the warm table to be moved to the suction nozzle makes described in suction nozzle absorption
Chip and by the chip be placed in it is described it is heat sink on.
Wherein, the solder with a thickness of 3 to 5 microns.
The beneficial effects of the present invention are: be in contrast to the prior art, the present invention by warm table and mobile station it
Between be arranged angular displacement platform, angular displacement platform can all around be moved relative to warm table where plane rotated, when suction nozzle will
Chip is picked up from material table, and by chip belt to heat sink top close to it is heat sink when, such as the preceding light-emitting surface and heat sink surface of fruit chip
It is not parallel, it at this moment can be rotated by adjusting angular displacement platform, so that angular displacement platform is driven the heat sink rotation on warm table, so that hot
Heavy surface is parallel with the preceding light-emitting surface of chip, and then improves patch quality.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of chip mounter of embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram side view of chip mounter of embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the angular displacement platform of chip mounter of embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of chip mounter of another embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram side view of chip mounter of embodiment of the present invention；
Fig. 6 is a kind of schematic diagram that chip is pasted to heat sink pasting method of the present invention and embodiment.
Specific embodiment
The present invention is described in detail with embodiment with reference to the accompanying drawing.
Such as Fig. 1 and Fig. 2, embodiment of the present invention provides a kind of chip mounter, for chip to be pasted to heat sink, core
Piece can be the chip of high power semiconductor lasers, such as single tube chip (Chip) or naked bar (Bar) etc., wherein the present invention
The chip mounter of embodiment includes: material table 1, suction nozzle 2, warm table 3, angular displacement platform 25 and mobile station 5, and wherein chip is placed on
On material table 1, warm table 3 connects to place and heat the solder on heat sink and heat sink, a settable heater 18 with warm table 3
It connects, for heating to heat sink, pulse heater can be used in present embodiment.Also settable 19 pairs of protective gas heat into
The heat sink and chip of row reaction is protected, and protective gas 19 can be the inert gases such as nitrogen.Suction nozzle 2 is used for absorbing material platform
Chip on 1, and chip is pasted on heat sink, upper surface heat sink on the upper surface of material table 1 and warm table 3 can be arranged
Almost for the consistent either height of height, absorption and placement in order to suction nozzle 2 to chip.
Mobile station 5 is arranged below warm table 3, warm table 3 is used to support, before and after mobile station 5 can carry out in a plane
It moves left and right, such as is all around moved in the plane where 5 upper surface of mobile station, mobile station 5 drives warm table 3 same
Step is all around moved, and material table 1 may also be arranged in mobile station 5, is all around moved with the synchronization of mobile station 5.
Chip mounter further includes angular displacement platform 25, and angular displacement platform 25 is arranged between mobile station 5 and warm table 3, angular displacement platform
25 can all around move the Plane Rotation at place relative to warm table 3 with mobile station 5, so that warm table 3 is relative to it
Plane Rotation where all around moving, and then adjust the preceding light-emitting surface (FF, Front facet) and heat sink surface of chip
The depth of parallelism.
Present embodiment can be relative to by the way that angular displacement platform 25, angular displacement platform 25 are arranged between warm table 3 and mobile station 5
Plane where warm table 3 all around moves is rotated, when suction nozzle 2 picks up chip from material table 1, and extremely by chip belt
Heat sink top close to it is heat sink when, preceding light-emitting surface and the heat sink surface such as fruit chip are not parallel, at this moment can be by adjusting angular displacement platform
25 rotations, make angular displacement platform 25 drive the heat sink rotation on warm table 3, so that the preceding light-emitting surface of heat sink surface and chip is flat
Row, and then improve patch quality.
Wherein, angular displacement platform 25 may be provided between turntable 4 and mobile station 5, be adjusted by turntable 4 and mobile station 5
Chip edge is aligned with heat sink edge, and the preceding light-emitting surface of chip and the depth of parallelism of heat sink surface are adjusted by angular displacement platform 25,
To improve patch quality.
Wherein, such as Fig. 3, angular displacement platform 25 includes base portion 251 and rotation section 252, and base portion 251 is equipped with arc groove 253,
The bottom surface of rotation section 252 is matched with arc groove 253, and rotation section 252 can rotate in arc groove 253 along cambered surface.
Wherein, chip mounter includes the CCD11 of the image for acquisition chip Yu the heat sink depth of parallelism, and for rendering
The display 12 of CCD11 acquired image, CCD11 are connect with display 12.It, can be straight by setting CCD11 and display 12
Observation chip and the heat sink depth of parallelism, adjust convenient for operator.
Wherein, the chip mounter of embodiment of the present invention include three groups of CCD11 and display 12, wherein one group of CCD11 and
Whether display 12 is parallel with heat sink side surface to the preceding light-emitting surface for observing chip, and in addition two groups of CCD11 and display 12 divide
It is whether not parallel with heat sink surface to observe the side of chip.
Wherein, in embodiment of the present invention, each CCD11 may also include matched lens barrel.
Wherein, such as Fig. 4 and Fig. 5, chip mounter further includes turntable 4, and turntable 4 is arranged in warm table 3 and angular displacement platform 25
Between, turntable 4 can in a plane internal rotation, such as in the plane internal rotation where the upper surface of turntable 4, turntable 4 with
Warm table 3 is fixedly connected, and warm table 3 can be rotated with the rotation of turntable 4, to drive the heat sink rotation on warm table 3；This
In invention embodiment, turntable 4 rotated where plane and mobile station 5 all around moved where plane phase
It is mutually parallel.
Turntable 4 is arranged in the chip mounter of embodiment of the present invention below warm table 3, and movement is arranged below turntable 4
Platform 5 makes heating platform in a plane internal rotation, and then drives the heat sink rotation on warm table 3 by turntable 4, and passes through shifting
Dynamic platform 5 moves warm table 3 all around in a plane, and then drive on warm table 3 heat sink all around moves；Work as suction
Mouth 2 picks up chip from material table 1, and by chip belt to heat sink top close to it is heat sink when, pass through turntable 4 and mobile station 5
Heat sink rotation and movement are adjusted, so that heat sink edge and front end edge and front end pair with the chip on suction nozzle 2 respectively
Together, chip and the heat sink precision being aligned are improved, and then improves patch quality.
Wherein, the chip mounter of embodiment of the present invention includes microscope 6, and microscope 6 is arranged above warm table 3, is used for
Whether observation chip is aligned with heat sink edge, be aligned chip and it is heat sink when, by being observed in microscope 6, cooperation turntable 4
With mobile station 5 to heat sink rotation and movement, can intuitively operate is aligned chip with heat sink end face；Embodiment of the present invention
In, chip and heat sink angle are controlled to the bulge quantity within the scope of 90 ° ± 0.75 °, by chip end face relative to heat sink end face
Control is in 0~10 μ m.Wherein, microscope 6 can be stereomicroscope 6, is clear that using stereomicroscope 6
Chip and heat sink end face alignment condition.
Wherein, the chip mounter of embodiment of the present invention includes shifting sledge 7, and microscope 6 is mounted on shifting sledge 7, can
It is moved on shifting sledge 7, keeps microscope 6 removable by installing shifting sledge 7, conducive to the range of observation for expanding microscope 6,
Improve the precision of patch.Wherein, shifting sledge 7 can be arranged in parallel with the preceding light-emitting surface of chip.
Wherein, reflecting mirror can be set on material table 1, can determine the preceding light-emitting surface of chip by reflecting mirror；Suction nozzle 2 is from object
On material platform 1 before absorption chip, chip is placed on reflecting mirror, declines suction nozzle 2 close to chip, passes through the shifting of mobile station 5
It is dynamic that the dynamic chip driven on material table 1 carries out micro-shifting, and chip edge is allowed to be aligned with suction nozzle edge, at the same allow chip front end and suction
The front end of mouth 2 is aligned, and suction nozzle pushes absorption chip, and suction nozzle 2 is then allowed slightly to rise, by going out light before reflection sem observation chip
The position in face and rear light-emitting surface, then by suction nozzle 2 by chip be placed into warm table 3 it is heat sink on.
Wherein, chip mounter further includes a cantilever 13, and one end of cantilever 13 carries out the upper bottom by axis of the other end of cantilever 13
Dynamic, suction nozzle 2 is installed on the one end of cantilever 13 swung up and down.When material table 1 is switched to 2 lower section of suction nozzle, suction nozzle 2 is with outstanding
Arm 13 is rocked to pushes down chip downwards, and the vacuum 21 for opening suction nozzle 2 makes suction nozzle 2 adsorb chip, and at this moment cantilever 13 is swung up, and is made
Suction nozzle 2 leaves material table 1, and warm table 3 is then switched to 2 lower section of suction nozzle, and control cantilever 13 drives suction nozzle 2 to be rocked to core downwards
Piece is heat sink on warm table 3.
Wherein, chip mounter further includes the weight 14 being set on cantilever 13, and weight 14 moves on cantilever 13, passes through tune
Position of the bulk wight hammer 14 on cantilever 13, when adjustable suction nozzle 2 presses to warm table 3, the chip on suction nozzle 2 is to heat sink pressure
Power size.Wherein, a settable pressure sensor 23 is connect with warm table 3, big for pressure suffered by induction heating platform 3
It is small.
Wherein, chip mounter further comprises the hand lever 15 swung up and down for operating cantilever 13, by pushing or lifting hand
Bar 15 and control swinging up and down for cantilever 13, when hand lever 15 pushes completely, the vacuum 21 of suction nozzle 2 is closed, and is detached from chip and is inhaled
Mouth 2.
Certainly, in other embodiments, chip mounter can also be vertically formula, i.e., suction nozzle does not reside on cantilever with outstanding
Arm is rotated around some fixing axle, and is mounted in a mechanism vertically, and suction nozzle can vertical up-or-down movement.
Such as Fig. 4 and Fig. 5, in another embodiment of the present invention, when chip mounter is that the above-mentioned cantilevered including cantilever 13 is pasted
When piece machine, chip mounter further includes lifting platform 24, and lifting platform 24 is arranged between warm table 3 and mobile station 5, specifically, lifting platform
24 may be provided between turntable 4 and angular displacement platform 25, lifting platform 24 can vertical ascent or decline, so as to adjust warm table 3
Highly.
Since suction nozzle 2 is as one end of cantilever 13 is swung using 13 other end of cantilever as axis, so the swing of suction nozzle 2
It is not vertically, but to be swung in a camber line, so swing of the chip adsorbed on suction nozzle 2 with suction nozzle 2
It is to be swung in a camber line, when chip swings to different location with suction nozzle 2, the side of chip and the angle of horizontal plane also can
Change, i.e., when chip at various height when, the side of chip also can be different from the angle of horizontal plane.According to this feelings
Lifting platform 24 is arranged in embodiment of the present invention below warm table 3 for condition, when suction nozzle 2 adsorb chip close to it is heat sink when, utilize
CCD11 is acquired and is passed through display 12 whether observe chip sides parallel with heat sink surface, if not parallel, according to chip sides and
The gradient of heat sink surface adjusts lifting platform 24, adjusts height heat sink on warm table 3, using lifting platform 24 so as to adjust core
The height of the position of piece and heat sink contact, since the inclined degree of chip at various height is different, therefore can be by adjusting chip
When making chip with heat sink contact with the height of heat sink contacted position, the side of chip is parallel with heat sink surface.
In present embodiment, by the way that lifting platform 24 is arranged between warm table 3 and mobile station 5, adjusted by lifting platform 24
Heat sink height on warm table 3, so that when the contact of heat sink and chip, the side of chip and heat sink surface keeping parallelism, from
And improve patch quality.
Wherein, the chip mounter of embodiment of the present invention includes moving handle 8, and moving handle 8 connect with mobile station 5, is used for
It is mobile to manipulate mobile station 5, mobile station 5 is mobile synchronous with moving handle 8, and the moving ratio of moving handle 8 and mobile station 5
For 6:1, it is possible to understand that, in other embodiments, movement specifically can be set according to the size and manpower operating habit of chip
The moving ratio of handle 8 and mobile station 5, is not limited to 6:1.
Wherein, the chip mounter of embodiment of the present invention further include be set to it is pneumatic between angular displacement platform 25 and mobile station 5
Platform 9, material table 1 are placed in pneumatic table 9, and lower section of the pneumatic table 9 material table 1 or warm table 3 to be moved to suction nozzle 2 makes
2 absorption chip of suction nozzle and chip is placed on heat sink.
Pneumatic table 9 is arranged in mobile station 5, can with the movement of mobile station 5 synchronizing moving, and pneumatic table 9 can move
It is moved on dynamic platform 5, material table 1 and angular displacement platform are respectively placed in pneumatic table 9, and movement of the pneumatic table 9 in mobile station 5 is so that object
Material platform 1 and warm table 3 are toggled in the lower section of suction nozzle 2, i.e., when warm table 3 is in 2 lower section of suction nozzle, are moving pneumatic table 9
Mobile primary on dynamic platform 5, at this moment material table 1 will be moved to 2 lower section of suction nozzle with moving for pneumatic table 9；It is inhaled when material table 1 is in
When 2 lower section of mouth, keep pneumatic table 9 mobile primary in mobile station 5, at this moment warm table 3 is by moving and be moved to suction with pneumatic table 9
2 lower section of mouth；Suction nozzle 2 is facilitated to be placed on warm table 3 from absorption chip on material table 1, and by chip in this way.Wherein, of the invention
The pneumatic table 9 of embodiment can be controlled by pneumatic device 22 and be moved；Pneumatic device 22 can be cylinder etc..
Wherein, the mobile button 10 of manipulation pneumatic table 9 is provided on moving handle 8 makes pneumatic table by pressing lower button 10
9 are once moved；In embodiment of the present invention, button 10 is connect with pneumatic device 22.
In embodiment of the present invention, a suction nozzle rotary shaft 17 can be set on suction nozzle 2, be rotatably installed in suction nozzle 2
On cantilever 13；Suction nozzle 2 is arranged to rotatable, is conducive to suction nozzle 2 and is aligned with chip and chip with heat sink.
Wherein, suction nozzle 2 can be also arranged to can heating structure, inhaled by the heating of the suction nozzle heater 16 that is connect with suction nozzle 2
Mouth 2, and then the chip that suction nozzle 2 adsorbs is heated, the control of temperature when being welded conducive to chip and heat sink eutectic.Specifically, of the invention
In embodiment, suction nozzle 2 is made of metal material, and resistance wire is arranged on suction nozzle 2 to heat to suction nozzle 2.It is understood that
, suction nozzle 2 can also be heat-insulating material and be made, and when suction nozzle 2 is heat-insulating material, can not heat to suction nozzle 2.
Wherein, the specifically used process of the chip mounter of embodiment of the present invention are as follows:
(1) adjustment material table 1 flushes 1 apparent height of material table almost with 3 apparent height of warm table；
(2) button 10 on moving handle 8 is pressed, makes pneumatic table 9 that warm table 3 is switched to 2 lower section of suction nozzle；
(3) hand lever 15 is pushed completely, is that cantilever 13 presses to suction nozzle 2 on warm table 3, pressure sensor 23 can feed back lotus
It weighs and shows on control panel 20；
(4) decontroling hand lever 15 rises suction nozzle 2；
(5) position of the adjustment weight 14 on cantilever 13, repeats the operation of (2)~(4), to reach required loading；
(6) chip is placed on material table 1；
(7) it is observed using stereomicroscope 6 and is placed in the heat sink of prefabricated solder on warm table 3 and fixed；
(8) button 10 on moving handle 8 is pressed, makes pneumatic table 9 that material table 1 is switched to 2 lower section of suction nozzle；
(9) rotary suction nozzle rotary shaft 17 arrives 2 size of suction nozzle for being suitble to chip；
(10) pushing hand lever 15 makes suction nozzle 2 close to chip edge；
(11) it is observed using microscope 6, drives mobile station 5 mobile using moving handle 8, keep chip and 2 edge of suction nozzle flat
Together；
(12) it is observed using microscope 6, drives mobile station 5 mobile using moving handle 8, hold level with both hands before making chip and suction nozzle 2
Together；
(13) pushing hand lever 15 presses to cantilever 13 on chip, and hand lever 15, which presses down suction nozzle 2 at this time, can open vacuum
21, hand lever 15 is decontroled after absorption chip, suction nozzle 2 can rise automatically；
(14) button 10 on moving handle 8 is pressed, warm table 3 is made to switch to 2 lower section of suction nozzle；
(15) pushing hand lever 15 makes the suction nozzle 2 of absorption chip close to heat sink；
(16) whether concordant with heat sink front end using the observation of microscope 6 chip front end；
(17) adjustment turntable 4 keeps chip front end and edge concordant with heat sink front end；
(18) control moving handle 8 drives mobile platform mobile, and cooperation microscope 6 is observed, and controls chip position and chip
The amount of front end protrusion；
(19) image is acquired using CCD11, and the preceding light-emitting surface of chip and putting down for heat sink surface is observed by display 12
Row degree；
(20) adjusting angle displacement platform 25 keeps the preceding light-emitting surface of chip parallel with heat sink surface；
(21) image is acquired using CCD11, and observes the side of chip and the depth of parallelism of heat sink surface by display 12；
(22) adjustment lifting platform 24 keeps the side of chip parallel with heat sink surface；
(23) hand lever 15 is pushed completely after the completion of adjusting, 2 vacuum 21 of suction nozzle can be closed at this time；
(24) warm table 3 heats up, and solder fusing and chip is made to carry out eutectic weldering to carry out patch；
(25) hand lever 15 is decontroled after solder is cooling rises suction nozzle 2；
(26) product after removing the encapsulation on warm table 3.
Such as Fig. 6, another embodiment of the present invention provide it is a kind of chip is pasted to heat sink pasting method, method includes:
Step S101: a material table is provided, chip is placed on material table；
Step S102: providing a warm table, will be placed on warm table with the heat sink of solder；
Step S103: providing a mobile station, is arranged below warm table, to support warm table, and makes warm table one
It is all around moved in plane；
Step S104: providing an angular displacement platform, be set between mobile station and warm table, to make warm table relative to flat
Face tilt rotation；
Step S105: providing a suction nozzle, and chip pushing is simultaneously attached on heat sink by the chip on absorbing material platform；
Step S106: when passing through the chip on suction nozzle absorbing material platform and chip being pressed to close heat sink, chip is observed
Preceding light-emitting surface and heat sink surface inclined degree, operating mobile station and angular displacement platform keeps warm table mobile or turns relative to plane
It is dynamic, and then adjust the preceding light-emitting surface of chip and the depth of parallelism of heat sink surface.
Embodiment of the present invention can be relative to adding by the way that angular displacement platform, angular displacement platform are arranged between warm table and mobile station
Plane where thermal station all around moves is rotated, when suction nozzle picks up chip from material table, and by chip belt to heat sink
Top close to it is heat sink when, preceding light-emitting surface and the heat sink surface such as fruit chip are not parallel, at this moment can be rotated by adjusting angular displacement platform,
Angular displacement platform is set to drive the heat sink rotation on warm table, so that heat sink surface is parallel with the preceding light-emitting surface of chip, Jin Erti
High patch quality.
Wherein, the pasting method of embodiment of the present invention a further include: moving handle is provided, is manipulated and is moved using moving handle
Dynamic platform, and moving handle and the moving ratio of mobile station are 6:1.
Wherein, it is attached in suction nozzle absorption chip before heat sink step, the pasting method of embodiment of the present invention is into one
Step includes:
It is roughly the same with the height of warm table to adjust material table.
Wherein, when suction nozzle absorption chip, vacuum is kept inside suction nozzle.
Wherein, the pasting method of embodiment of the present invention further include: provide a cantilever, one end of cantilever is with the another of cantilever
End swings up and down for axis, and suction nozzle is connected to the one end of cantilever swung up and down.
Wherein, the pasting method of embodiment of the present invention further include: provide a weight on cantilever, suction nozzle push chip in
Before heat sink, the loading of compacting chip needed for adjustment weight position reaches.
Wherein, the pasting method of embodiment of the present invention further include: the hand lever that an operation cantilever is swung up and down, hand lever are provided
When pushing completely, suction nozzle vacuum is closed, and chip is detached from the absorption of suction nozzle, and suction nozzle still pushes down chip.
Wherein, the pasting method of embodiment of the present invention further include: provide a pneumatic table be placed in mobile station and turntable it
Between, material table is placed in pneumatic table, and lower section of the pneumatic table material table or warm table to be moved to suction nozzle draws suction nozzle
Chip and chip is placed on heat sink.
Wherein, solder with a thickness of 3 to 5 microns.
The chip mounter that above embodiment can be used in the pasting method of embodiment of the present invention is realized, is specifically please referred to above-mentioned
The content of embodiment, this will not be repeated here.
The above is only embodiments of the present invention, are not intended to limit the scope of the invention, all to utilize the present invention
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field is included within the scope of the present invention.
Claims (21)
1. a kind of chip mounter, chip to be pasted on heat sink characterized by comprising
Material table, to place the chip；
Suction nozzle, drawing the chip on the material table, and by the chip be attached to it is described it is heat sink on；
Warm table, to place and heat the solder on described heat sink and heat sink；
Mobile station, be arranged below the warm table, to support the warm table, and make the warm table in a plane before
After move left and right；And
Angular displacement platform is set between the mobile station and the warm table, to make the warm table relative to the plane
Tilt rotation, and then adjust the preceding light-emitting surface of the chip and the depth of parallelism of the heat sink surface；
Turntable is arranged between the warm table and the angular displacement platform, to support and make the warm table in a plane
Interior rotation.
2. chip mounter according to claim 1, which is characterized in that further comprise to acquire the chip and the heat
The CCD of the image of the heavy depth of parallelism, and the display the CCD acquired image is presented.
3. chip mounter according to claim 2, which is characterized in that including CCD and display described in three groups, wherein one group
Whether the CCD and display are parallel with the heat sink side surface to the preceding light-emitting surface for observing chip, in addition two groups of CCD and aobvious
Show whether device is parallel with the heat sink surface to the side for observing the chip.
4. chip mounter according to claim 1, which is characterized in that further comprise for observing the chip and heat sink side
The microscope whether edge is aligned.
5. chip mounter according to claim 4, which is characterized in that further comprise for installing the microscopical movement
Sliding rail, the microscope can be moved along the shifting sledge.
6. chip mounter according to claim 1, which is characterized in that it further comprise moving handle, the moving handle behaviour
It is mobile to control the mobile station, and moving handle and the moving ratio of mobile station are 6:1.
7. chip mounter according to claim 6, which is characterized in that further comprise be set to the angular displacement platform with it is described
Pneumatic table between mobile station, the material table are placed in the pneumatic table, the pneumatic table to by the material table or
The warm table is moved to the lower section of the suction nozzle, and suction nozzle is made to draw the chip and be placed in the chip described heat sink
On.
8. chip mounter according to claim 7, which is characterized in that a button, the button are arranged on the moving handle
The pneumatic table is manipulated to move left and right.
9. chip mounter according to claim 1, which is characterized in that further comprise a cantilever, one end of the cantilever with
The other end of the cantilever swings up and down for axis, and the suction nozzle is installed on the one end of the cantilever swung up and down.
10. chip mounter according to claim 9, which is characterized in that it further comprise the weight being set on the cantilever,
The suction nozzle depends on position of the weight on the cantilever to the heat sink pressure size.
11. chip mounter according to claim 10, which is characterized in that further comprise to operate the bottom on the cantilever
Dynamic hand lever, when the hand lever pushes completely, suction nozzle vacuum is closed, and the chip is detached from the absorption of the suction nozzle.
12. chip mounter according to claim 1, which is characterized in that the suction nozzle is made of metal, and the suction nozzle, which has, to be added
Heat function is provided with resistance wire.
13. a kind of be pasted to chip heat sink pasting method characterized by comprising
One material table is provided, the chip is placed on the material table；
One warm table is provided, described with solder heat sink is placed on the warm table；
One mobile station is provided, is arranged below the warm table, to support the warm table, and keeps the warm table flat one
It is all around moved in face；
One angular displacement platform is provided, is set between the mobile station and the warm table, to make the warm table relative to institute
State plane tilt rotation；
One suction nozzle is provided, draw the chip on the material table and by the chip pushing be attached to it is described it is heat sink on；
One turntable is provided, is arranged between the warm table and the angular displacement platform, to support and make the warm table to exist
One plane internal rotation；
When drawing the chip on the material table by the suction nozzle and the chip is pressed to close described heat sink, institute is observed
The preceding light-emitting surface of chip and the inclined degree of the heat sink surface are stated, operating the mobile station, turntable and angular displacement platform makes
The warm table is mobile or a plane internal rotation or relative to the Plane Rotation, and then adjusts the preceding light-emitting surface of the chip
With the depth of parallelism of heat sink surface.
14. pasting method according to claim 13, which is characterized in that further comprise:
One moving handle is provided, manipulates the mobile station, and the moving handle and the mobile station using the moving handle
Moving ratio be 6:1.
15. pasting method according to claim 13, which is characterized in that draw the chip in the suction nozzle and be attached to institute
Before stating heat sink step, further comprise:
It is roughly the same with the height of the warm table to adjust the material table.
16. pasting method according to claim 13, which is characterized in that when the suction nozzle draws the chip, the suction
Vacuum is kept inside mouth.
17. pasting method according to claim 13, which is characterized in that further comprise:
A cantilever is provided, one end of the cantilever is swung up and down using the other end of the cantilever as axis, the suction nozzle connection
In the one end of the cantilever swung up and down.
18. pasting method according to claim 17, which is characterized in that further comprise:
A weight is provided on the cantilever, the suction nozzle push chip in it is described it is heat sink before, adjust the weight position and reach
The loading of required compacting chip.
19. pasting method described in 7 or 18 according to claim 1, which is characterized in that further comprise:
The hand lever that an operation cantilever is swung up and down is provided, when the hand lever pushes completely, the suction nozzle vacuum is closed, described
Chip is detached from the absorption of the suction nozzle.
20. pasting method according to claim 13, which is characterized in that further comprise:
It provides a pneumatic table to be placed between the mobile station and angular displacement platform, the material table is placed in the pneumatic table, institute
State lower section of the pneumatic table the material table or the warm table to be moved to the suction nozzle, make suction nozzle draw the chip and
By the chip be placed in it is described it is heat sink on.
21. pasting method according to claim 13, which is characterized in that the solder with a thickness of 3 to 5 microns.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610639569.1A CN106229277B (en) | 2016-08-05 | 2016-08-05 | A kind of chip mounter and pasting method |
| PCT/CN2017/073812 WO2018023962A1 (en) | 2016-08-05 | 2017-02-16 | Die bonder and die bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610639569.1A CN106229277B (en) | 2016-08-05 | 2016-08-05 | A kind of chip mounter and pasting method |
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| CN106229277A CN106229277A (en) | 2016-12-14 |
| CN106229277B true CN106229277B (en) | 2019-03-26 |
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| CN201610639569.1A Active CN106229277B (en) | 2016-08-05 | 2016-08-05 | A kind of chip mounter and pasting method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018023962A1 (en) * | 2016-08-05 | 2018-02-08 | 深圳瑞波光电子有限公司 | Die bonder and die bonding method |
| CN109515004B (en) * | 2018-12-28 | 2020-05-05 | 北海绩迅电子科技有限公司 | An ink cartridge placement machine and a patch control method applied to an ink cartridge |
| JP6644921B1 (en) * | 2019-01-15 | 2020-02-12 | キヤノンマシナリー株式会社 | Solder flattening device, die bonder, solder flattening method, and bonding method |
| CN112157348A (en) * | 2020-10-23 | 2021-01-01 | 浙江热刺激光技术有限公司 | Chip welding device |
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