CN106231811B - A kind of chip mounter - Google Patents
A kind of chip mounter Download PDFInfo
- Publication number
- CN106231811B CN106231811B CN201610850637.9A CN201610850637A CN106231811B CN 106231811 B CN106231811 B CN 106231811B CN 201610850637 A CN201610850637 A CN 201610850637A CN 106231811 B CN106231811 B CN 106231811B
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- China
- Prior art keywords
- patch
- axis
- work head
- board
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 63
- 230000033001 locomotion Effects 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims description 25
- 238000007689 inspection Methods 0.000 claims description 13
- 230000003447 ipsilateral effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a kind of chip mounters, patch Y-axis body assembly is erected on board along the y axis, patch Y-axis body assembly can the translational motion along the x axis on X-axis moving assembly, and Head1 patch work head and Head2 patch work head are separately positioned on opposite two opposite side of Y-axis patch transmission component, Head1 patch work head and Head2 patch work head can be moved along Y1 axis and Y2 axis direction respectively each independently with respect to Y-axis patch transmission component, Head1 patch work head and Head2 patch work head use structure of the invention design scheme, it will not interfere with each other at work, and gap is not exchanged in attachment and feeding action switching, it can be uninterruptedly to circuit board mount components, improve the effective time, and then effectively increase attachment efficiency；And Head1 patch work head and Head2 patch work head not only can be fed mould group feeding to the same side simultaneously, but also can carry out feeding to the not ipsilateral feed mould group of board simultaneously respectively, improve device space utilization rate, are suitble to produce in enormous quantities.
Description
[technical field]
The present invention relates to electronic component and circuit board place machine, especially a kind of chip mounter.
[background technique]
In existing chip mounter, it is generally only provided with a Head patch work head, using a Head patch work head
It is mounted, working efficiency is relatively low, cannot quickly and efficiently patch；In order to improve patch efficiency, also has and pasted with Head1
The chip mounter of piece work head and Head2 patch work head, but due to the limitation of its design structure, Head1 patch work head and
Head2 patch work head can interfere with each other at work, cannot be simultaneously to circuit board patch, and cannot be simultaneously to same feed
Mould group feeding, therefore in attachment movement, Head1 patch work head and Head2 patch work head need alternately patch, and then generate
Waiting time causes to reduce the effective time, therefore the working efficiency of existing chip mounter is still to be improved at present.
The present invention researchs and proposes in view of the deficiencies of the prior art.
[summary of the invention]
The invention discloses a kind of chip mounter, Y-axis patch transmission component is erected at along the y axis on the transmission line body of board
Side, Y-axis patch transmission component with respect to board can translational motion along the x axis, and Head1 patch work head and Head2 patch work
On opposite two opposite side that head is separately positioned on Y-axis patch transmission component, Head1 patch work head and Head2 patch work head
It can be moved each independently and respectively along Y1 axis and Y2 axis direction with respect to Y-axis patch transmission component, when Head1 patch work head exists
When patch, Head2 patch work head is then in feeding, since mount components can only be mounted individually, and when feeding can more suction nozzles it is same
When extracting elements, therefore feeding action is very fast with respect to patch movement, and required time is shorter；When on the suction nozzle of Head1 patch work head
Component mounter complete before, Head2 patch work head has been completed extracting elements and has been identified by vision inspection apparatus, and immediately
Position corresponding with Head1 patch work head is moved to wait；When the component mounter on the suction nozzle of Head1 patch work head is complete
Cheng Shi, Head2 patch work head then take over Head1 patch work head and carry out patch, and Head1 patch work head is then taken immediately
Material movement so repeats the above movement, and Head1 patch work head and Head2 patch work head use design scheme of the present invention,
It will not be interfered with each other when work, therefore Head1 patch work head and Head2 patch work head mutually switch in attachment and feeding action
When do not exchange gap so that improving the effective time, and then effectively mention to circuit board uninterruptedly mount components
High attachment efficiency；And Head1 patch work head and Head2 patch work head both can be fed mould group feeding to the same side simultaneously,
Feeding can be carried out to the not ipsilateral feed mould group of board simultaneously respectively again, improve device space utilization rate.
In order to solve the above technical problems, a kind of chip mounter of the present invention, including board, the board top are equipped with along X-axis side
To extension with the transmission line body for transporting circuit board, on the board and it is located at board side and is additionally provided with for putting feeder
Feeding device, be provided with above the board along the y axis can translational motion along the x axis Y-axis patch transmission component, institute
It states opposite two opposite side of Y-axis patch transmission component and is respectively equipped with the Head1 patch work head that can independently move along the y axis and head
The work of Head2 patch, the chip mounter further include being located on board and after patch work head grasping element for detecting element
Vision inspection apparatus, the vision inspection apparatus includes the vision for being vertically fixedly connected on Y-axis patch transmission component end
Fixed link is detected, vision-based detection fixed link lower end is fixedly connected with the vision-based detection horizontal guide rail parallel with X-direction, institute
State vision-based detection horizontal guide rail be equipped with can translational motion along the x axis vision-based detection component；When Head1 patch work head
And/or when Head2 patch work head grasping element, vision-based detection component is correspondingly moved to accordingly along vision-based detection horizontal guide rail
One end, so that then reading image by vision-based detection component when the element drawn skims over；Along X between the feeding device and board
Axis direction is equipped with feed transmission component, so that feeding device and feeder translational motion along the x axis thereon；The feed dress
It sets and constitutes feed mould group with feed transmission component, the feed mould group changeable and actively connect with board.
The Y-axis patch transmission component includes Y-axis patch transmission ontology, two opposite sides point on the Y-axis patch transmission ontology
Not She You Y1 axis patch guide rail and Y2 axis patch guide rail, the Head1 patch work head and Head2 patch work head respectively with Y1
Axis patch guide rail and Y2 axis patch guide rail accordingly connect, so that Head1 patch work head and Head2 patch work head are mutually indepedent
Ground is moved along Y1 axis patch guide rail and Y2 axis patch guide rail respectively.
The board two sides are equipped with feeding device, and Y-axis patch transmission component both ends are equipped with vision inspection apparatus.
The board two sides are fixed with support column, are fixed with cross between support column described in described board the same side two
Beam is parallel to X-axis on the crossbeam and is fixed with X-axis patch transmission component, and Y-axis patch transmission ontology both ends are respectively with two
X-axis patch transmission component is slidably connected, and can be along X-axis patch transmission component translational motion.
The transmission line body includes the first conveying and the second conveying, is equipped with and adjusts along the y axis on the board
Whole guide rail, first conveying and the second conveying are erected on adjustment guide rail, and are connected with adjustment guide rail sliding
Connect and can along adjustment guide rail translational motion to adjust the spacing between the first conveying and the second conveying.
The Head1 patch work head and Head2 patch work head on be provided with corresponding suction nozzle, the suction nozzle presses square
Shape array or circumference array setting.
Compared with prior art, a kind of chip mounter of the present invention, has the advantages that
1, Head1 patch work head and Head2 patch work head use structure of the invention design scheme, at work will not
It interferes with each other, and between Head1 patch work head and Head2 patch work head are not exchanged when attachment and feeding action switch
Gap can improve the effective time, and then effectively increase attachment efficiency uninterruptedly to circuit board mount components；
And Head1 patch work head and Head2 patch work head not only can simultaneously to the same side be fed mould group feeding, but also can respectively and meanwhile to
The not ipsilateral feed mould group of board carries out feeding, improves device space utilization rate, is suitble to produce in enormous quantities.
2, it is fixed with corresponding vision inspection apparatus in Y-axis patch transmission component end, when patch work head grabs member
Through out-of-date after part, that is, image can be read, without being deliberately moved to corresponding position, therefore further improves attachment efficiency.
3, board two sides are provided with an at least feeding device, and feeding device correspondingly follows Y-axis patch transmission component along X-axis
Direction is mobile and moves, it is ensured that Head1 patch work head and Head2 patch work head rapidly feeding, to guarantee patch efficiency.
4, the feeding device on board two sides can increase or decrease correspondingly feeding device according to production needs, so that in a patch
The attachment in circuit board one side or the attachment of multiple machines can be completed on machine.
5, the suction nozzle in Head1 patch work head and Head2 patch work head is arranged using rectangular array or circumference array,
Multiple element can be drawn simultaneously to be mounted, improved efficiency.
[Detailed description of the invention]
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing, in which:
Fig. 1 is the structural schematic diagram that board side uses one group of feed mould group in the present invention；
Fig. 2 is one of the structural schematic diagram that board side is fed mould group using multiple groups in the present invention；
Fig. 3 is the second structural representation that board side is fed mould group using multiple groups in the present invention；
Fig. 4 is the structural schematic diagram of board in the present invention；
Fig. 5 is the structural schematic diagram of vision inspection apparatus of the present invention；
Fig. 6 is the structural schematic diagram that two patch work heads are connect with patch Y-axis transmission component in the present invention；
Fig. 7 is the attachment structure schematic diagram of support column and crossbeam in the present invention；
Fig. 8 is the structural schematic diagram that mould group is fed in the present invention.
[specific embodiment]
It elaborates with reference to the accompanying drawing to embodiments of the present invention.
As shown in Figure 1, Figure 2 and Figure 3, a kind of chip mounter of the present invention, including board 1,1 top of board are equipped with along X-axis
Direction extend with the transmission line body 3 for transporting circuit board 2, on the board 1 and be located at 1 side of board and be additionally provided with for putting
Material volume/disk of the feeding device 5 of feeder 4, element is mounted on feeder 4, and 1 top of board is provided with along the y axis
Can translational motion along the x axis Y-axis patch transmission component 6, opposite two opposite side of the Y-axis patch transmission component 6 is respectively equipped with
The Head1 patch work head 13 and head Head2 patch work head 12, the chip mounter that can independently move along the y axis further include
It is located on board 1 and is used for after patch 13 grasping element of work head the vision inspection apparatus 7 of detecting element.Head1 patch work
Make first 13 and head Head2 patch work head 12 using being separately positioned on opposite two opposite side of Y-axis patch transmission component 6, Head1
Patch work head 13 and head Head2 patch work head 12 can opposite panel Y-axis patch transmission component 6 each independently and respectively along Y1 axis
It is moved with Y2 axis direction, so that Head1 patch work head 13 and head Head2 patch work head 12 both can be simultaneously to same feed moulds
Group feeding, and feeding can be carried out to two not ipsilateral feed mould groups of board simultaneously respectively, and make continuous uninterrupted to circuit board 2
Ground mount components, therefore effectively increase attachment efficiency.
As shown in fig. 6, the Y-axis patch transmission component 6 includes that Y-axis patch is driven ontology 61, the Y-axis patch transmission is originally
Two opposite sides are respectively equipped with Y1 axis patch guide rail 62 and Y2 axis patch guide rail 63,13 He of Head1 patch work head on body 61
The connection corresponding to Y1 axis patch guide rail 62 and Y2 axis patch guide rail 63 respectively of Head2 patch work head 12, so that Head1 patch work
Make first 13 and Head2 patch work head 12 moved respectively along Y1 axis patch guide rail 62 and Y2 axis patch guide rail 63 independently of each other.
Head1 patch work head 13 and Head2 patch work head 12 in the same direction or can be moved oppositely, between each other without interference, so that
Head1 patch work head 13 and Head2 patch work head 12 can be alternately continuously to 2 mount components of circuit board.
As shown in figure 5, the vision inspection apparatus 7 includes vertically being fixedly connected on 6 end of Y-axis patch transmission component
Vision-based detection fixed link 71,71 lower end of vision-based detection fixed link are fixedly connected with the vision-based detection water parallel with X-direction
Level gauge 72, the vision-based detection horizontal guide rail 72 be equipped with can translational motion along the x axis vision-based detection component 73.It is described
CCD camera can be selected in vision-based detection component 73, when 12 grasping element of Head1 patch work head 13 and/or Head2 patch work head
When, vision-based detection component 73 is correspondingly moved to corresponding one end along vision-based detection horizontal guide rail 72, so that the element drawn is plunderred
It is out-of-date that image is then read by vision-based detection component 73, it is carried out without the element grabbed is deliberately moved to corresponding position
Detection, therefore further improve attachment efficiency.
Feed transmission component 8 is equipped between the feeding device 5 and board 1 along the x axis, by being fed transmission component 8
So that feeding device 5 and the translational motion along the x axis of feeder 4 thereon.Feeding device 5 is corresponding by feed transmission component 8
Ground follows Y-axis patch transmission component 6 to move and move along the x axis, it is ensured that Head1 patch work head 13 and Head2 patch
The rapidly grasping element of work head 12, shortens 12 feeding path of Head1 patch work head 13 and Head2 patch work head, protects
Patch efficiency is demonstrate,proved.
The feeding device 5 and feed transmission component 8 constitute feed mould group, the feed mould group changeable and actively with
Board 1 connects.Feeding device 5 on 1 two sides of board can increase or decrease correspondingly feeding device 5 according to production needs, so that at one
The attachment in 2 one side of circuit board or the attachment of multiple machines can be completed on chip mounter, have the characteristics that efficient.
1 two sides of board are equipped with feeding device 5, and 6 both ends of Y-axis patch transmission component are equipped with vision inspection apparatus
7.When Head1 patch work head 13 and Head2 patch work head 12 feed mould group feeding on not ipsilateral board 1 respectively,
Two vision inspection apparatus 7 can correspondingly identify the element that Head1 patch work head 13 and Head2 patch work head 12 are grabbed,
It improves element and grabs recognition efficiency.
As shown in figs. 4 and 7,1 two sides of board are fixed with support column 9, and the support column 9 on 1 two sides of board is symmetrical
It is arranged, is fixed with crossbeam 10 between support column 9 described in described 1 the same side two of board, is parallel to X-axis on the crossbeam 10 and fixes
Equipped with X-axis patch transmission component 100, the Y-axis patch transmission 61 both ends of ontology are sliding with two X-axis patch transmission components 100 respectively
Dynamic connection, Y-axis patch is driven ontology 61 can translational motion along the x axis by X-axis patch transmission component 100.
In order to adapt to mount the circuit board 2 of different dimensions, the transmission line body 3 includes the first conveying 31 and the
Two conveyings 32 are equipped with adjustment guide rail 11, first conveying 31 and the second conveying on the board 1 along the y axis
Guide rail 32 be erected at adjustment guide rail 11 on, and with adjustment guide rail 11 be slidably connected and can along adjust 11 translational motion of guide rail with
Adjust the spacing between the first conveying 31 and the second conveying 32.
It is provided with corresponding suction nozzle 131 in the Head1 patch work head 13 and head Head2 patch work 14, it is described
Suction nozzle 131 is arranged by rectangular array or circumference array.Suction nozzle 131 is preferably arranged using rectangular array in the present invention, and uses two
Column are arranged side by side, and every row has 6 suction nozzles, when Head1 patch work head 13 and Head2 patch work head 12 carry out suction, 12
Suction nozzle can simultaneously extracting elements, improve feeding efficiency.
Head1 patch work head 13, Head2 patch work head 12, feed mould group, Y-axis patch transmission component 6 in the present invention
Linear motor or lead screw and servo motor driving can be selected with transmission line body 3.Present invention design scheme using the above structure, more often
At least 1.5 times of patch efficiency can be improved in rule chip mounter.
When chip mounter of the present invention carries out patch, include the following steps: that A, circuit board 2 deliver into patch along transmission line body 3
It machines on workbench；B, chip mounter reads the mark point on scanning circuit plate 2；C, it is pasted according to corresponding patch program
Dress, during attachment, Head1 patch work head 13 and Head2 patch work head 12, can be simultaneously according to the optimization of patch program
In the same direction toward the feed mould group feeding of 1 side of board, mould group feeding oppositely can also be fed to the two of 1 two sides of board simultaneously；
When the component kind that mounted circuit board 2 is related to is more or is related to the multiple machines of simultaneous processing, 1 two sides of board are correspondingly
Increase feed mould group, during attachment, feed mould group follows Y-axis patch transmission component 6 mobile and moves, and is fed mould group phase
Patch Y-axis transmission component 6 is independently moved, so that feed mould group is moved to below piece Y-axis transmission 61 end of ontology accordingly, with
Convenient for 12 extracting elements of Head1 patch work head 13 and Head2 patch work head.
Claims (6)
1. a kind of chip mounter, it is characterised in that including board (1), board (1) top be equipped with extend along the x axis with
Transmission line body (3) in transporting circuit board (2) on the board (1) and is located at board (1) side and is additionally provided with for putting feeder
(4) feeding device (5), be provided with above the board (1) along the y axis can the Y-axis patch of translational motion along the x axis pass
Dynamic component (6), opposite two opposite side of Y-axis patch transmission component (6) is respectively equipped with the Head1 that can independently move along the y axis
Patch work head (13) and head Head2 patch work head (12), the chip mounter further include being located on board (1) and when patch work
Make the vision inspection apparatus (7) that detecting element is used for after head (13) grasping element, the vision inspection apparatus (7) includes vertically
The vision-based detection fixed link (71) of Y-axis patch transmission component (6) end is fixedly connected on, under the vision-based detection fixed link (71)
End is fixedly connected with the vision-based detection horizontal guide rail (72) parallel with X-direction, sets on the vision-based detection horizontal guide rail (72)
Have can translational motion along the x axis vision-based detection component (73), when Head1 patch work head and/or Head2 patch work head
When grasping element, vision-based detection component is correspondingly moved to corresponding one end along vision-based detection horizontal guide rail, so that the member drawn
Image is then read by vision-based detection component when part skims over；
Feed transmission component (8) is equipped between the feeding device (5) and board (1) along the x axis, so that feeding device (5)
And feeder (4) translational motion along the x axis thereon；The feeding device (5) and feed transmission component (8) constitute feed mould
Group, the feed mould group changeable and actively connect with board (1).
2. a kind of chip mounter according to claim 1, it is characterised in that the Y-axis patch transmission component (6) includes Y-axis patch
It is driven ontology (61), two opposite sides are respectively equipped with Y1 axis patch guide rail (62) and Y2 axis patch on Y-axis patch transmission ontology (61)
Piece guide rail (63), the Head1 patch work head (13) and Head2 patch work head (12) respectively with Y1 axis patch guide rail (62)
It is accordingly connected with Y2 axis patch guide rail (63), so that Head1 patch work head (13) and Head2 patch work head (12) are mutually solely
On the spot moved respectively along Y1 axis patch guide rail (62) and Y2 axis patch guide rail (63).
3. a kind of chip mounter according to claim 1 or claim 2, it is characterised in that board (1) two sides are equipped with feeding device
(5), and Y-axis patch transmission component (6) both ends are equipped with vision inspection apparatus (7).
4. a kind of chip mounter according to claim 2, it is characterised in that board (1) two sides are fixed with support column (9),
It is fixed with crossbeam (10) between support column (9) described in described board (1) the same side two, is parallel to X-axis on the crossbeam (10)
Be fixed with X-axis patch transmission component (100), Y-axis patch transmission ontology (61) both ends respectively with two X-axis patch transmission groups
Part (100) is slidably connected, and can be along X-axis patch transmission component (100) translational motion.
5. a kind of chip mounter according to claim 1, it is characterised in that the transmission line body (3) includes the first conveying
(31) and the second conveying (32) adjustment guide rail (11), is equipped on the board (1) along the y axis, first conveying is led
Rail (31) and the second conveying (32) are erected in adjustment guide rail (11), and are slidably connected and can with adjustment guide rail (11)
Along adjustment guide rail (11) translational motion to adjust the spacing between the first conveying (31) and the second conveying (32).
6. a kind of chip mounter according to claim 1, it is characterised in that the Head1 patch work head (13) and head Head2
Patch work head (12) on be provided with corresponding suction nozzle (131), the suction nozzle (131) is set by rectangular array or circumference array
It sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610850637.9A CN106231811B (en) | 2016-09-26 | 2016-09-26 | A kind of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610850637.9A CN106231811B (en) | 2016-09-26 | 2016-09-26 | A kind of chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106231811A CN106231811A (en) | 2016-12-14 |
| CN106231811B true CN106231811B (en) | 2019-02-05 |
Family
ID=58077493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610850637.9A Expired - Fee Related CN106231811B (en) | 2016-09-26 | 2016-09-26 | A kind of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231811B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060083285A (en) * | 2005-01-14 | 2006-07-20 | 삼성테크윈 주식회사 | Component Mounter |
| CN202799416U (en) * | 2012-08-21 | 2013-03-13 | 余耀国 | Automatic chip mounter |
| CN202799414U (en) * | 2012-08-21 | 2013-03-13 | 余耀国 | Chip mounter |
| CN203827614U (en) * | 2014-05-15 | 2014-09-10 | 唐治东 | Matrix type chip mounter |
| CN206149608U (en) * | 2016-09-26 | 2017-05-03 | 陈欢欢 | Chip mounter |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105149924A (en) * | 2015-09-09 | 2015-12-16 | 舒建文 | Workpiece attaching machine |
| CN205029987U (en) * | 2015-10-20 | 2016-02-10 | 温州市正邦电子设备有限公司 | Chip mounter paster actuating mechanism |
| CN105722382A (en) * | 2016-03-23 | 2016-06-29 | 广东工业大学 | Placement machine provided with transverse synchronous feeding mechanism and feeding method |
-
2016
- 2016-09-26 CN CN201610850637.9A patent/CN106231811B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060083285A (en) * | 2005-01-14 | 2006-07-20 | 삼성테크윈 주식회사 | Component Mounter |
| CN202799416U (en) * | 2012-08-21 | 2013-03-13 | 余耀国 | Automatic chip mounter |
| CN202799414U (en) * | 2012-08-21 | 2013-03-13 | 余耀国 | Chip mounter |
| CN203827614U (en) * | 2014-05-15 | 2014-09-10 | 唐治东 | Matrix type chip mounter |
| CN206149608U (en) * | 2016-09-26 | 2017-05-03 | 陈欢欢 | Chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106231811A (en) | 2016-12-14 |
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