CN106443460A - Power supply management device - Google Patents

Abstract

The invention relates to a power supply management device, and is used for providing a power supply management device having both power supply capability and detection capability. The device comprises a connection layer which comprises connection parts which are used for connecting the power supply management device on a circuit board to be tested; a functional layer which comprises a power supply management circuit which is connected with the connection parts and supplies power to the functional modules on the circuit board to be tested through the connection parts; and a test layer which comprises measurement parts which are connected with the power supply management circuit, wherein the value of the electrical parameters of the functional modules under the current power supply can be measured through the measurement parts.

Description

A power management device

technical field

The present disclosure relates to the field of electronic technology, and in particular to a power management device.

Background technique

With the continuous development of science and technology, electronic technology has also been developed rapidly. Various electronic devices have become an indispensable part of people's entertainment life, such as mobile phones, PAD (Personal Digital Assistant, tablet computer), PC ( Personal Computer, personal computer), etc., these electronic devices enrich people's life. Generally, various functional modules are arranged inside the electronic equipment, such as CPU (Central Processing Unit, central processing unit), GPU (Graphics Processing Unit, graphics processing unit), etc., and electronic equipment can realize different functions through different functional modules. Features.

In the research and development stage of electronic equipment, testers are often required to test the power supply status of each functional module in the electronic equipment to detect whether the channel design is reasonable. At present, in order to test the power supply status, it is possible to make a simulation board for testing. The production of the simulation board needs to add welding test hardware on the original circuit board, and the test method is relatively complicated.

Contents of the invention

In order to overcome the problems in the related technologies, the present disclosure provides a power management device, which has both power supply capability and detection capability.

An embodiment of the present disclosure provides a power management device, including:

A connection layer, including a connection part, the connection part is used to connect the power management device to the circuit board under test;

The functional layer includes a power management circuit, the power management circuit is connected to the connecting part, and supplies power to the functional modules on the circuit board under test through the connecting part;

The test layer includes a measurement component connected to the power management circuit, wherein the measurement component can measure the value of the electrical parameter of the functional module under the current power supply.

Optionally, the measuring component is connected to the power management circuit and connected in series with the connecting component.

Optionally, the power management circuit further includes a variable resistor, wherein the value of the electrical parameter output by the power management circuit can be adjusted by adjusting the resistance value of the variable resistor.

Optionally, the power management circuit further includes a variable capacitor, wherein the value of the electrical parameter output by the power management circuit can be adjusted by adjusting the capacitance of the variable capacitor.

Optionally, the power management circuit includes at least one power management sub-circuit, and the functional layer further includes a circuit switching switch, and the circuit switching switch is used to switch the circuit currently connected to the circuit board under test in the at least Switching is performed between one power management sub-circuit, wherein different power management sub-circuits output different values of electrical parameters.

Optionally, among the electronic components included in the power management circuit, at least one electronic component is detachably arranged in the functional layer.

Optionally, the functional layer further includes a selection component, the selection component is used to select a functional module to be measured.

Optionally, the test layer further includes a power access component, which is used to access a DC power supply.

Optionally, the functional module includes at least one of a central processing unit, a digital signal processor, a graphics processor, a sensor hub, and a radio frequency unit.

Optionally, the electrical parameters include at least one of current parameters, voltage parameters, and power consumption parameters.

The technical solutions provided by the embodiments of the present disclosure can include the following beneficial effects: the power management device can be composed of three layers, the power management device can be connected to the circuit board through the connection layer, and the power management function can be realized through the functional layer, for Each functional module on the circuit board supplies power, and each power supply can be detected through the test layer. In actual production, the circuit board will be continuously upgraded, so different batches of boards need to be tested, and when the time interval between different batches of boards is short, it may be too late to make a simulation board for testing. Through the technical solutions in the embodiments of the present disclosure, there is no need to make a simulation board for testing, and the power management device in the embodiments of the present disclosure can be used to directly replace the PMIC (Power Management IC, power management chip) on boards of different batches. It can realize the power supply for each functional module on the circuit board, and can also detect the value of the electrical parameters of each functional module more conveniently and easily, meeting the test requirements for different batches of boards, and at the same time, there is no need to add soldering to the original circuit board For other hardware, the measurement method is relatively simple and accurate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of a power management device according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram of a side of a power management device according to an exemplary embodiment.

detailed description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

FIG. 1 is a schematic diagram of a power management device according to an exemplary embodiment. As shown in FIG. 1 , the power management device may include a connection layer 10 , a function layer 20 , and a test layer 30 .

The connection layer 10 may include a connection part 11, and the connection part is used to connect the power management device to the circuit board under test;

The functional layer 20 may include a power management circuit (not shown in the figure), the power management circuit is connected to the connection part 11, and supplies power to the functional modules on the circuit board to be tested through the connection part 11;

The test layer 30 includes a measurement component 31 connected to the power management circuit, wherein the value of the electrical parameter of the functional module under the current power supply can be measured through the measurement component 31 .

The circuit board to be tested may be any circuit board used to measure the power supply status of the functional modules during the development and testing phase. One or more functional modules to be tested may be arranged on the circuit board to be tested.

Optionally, the embodiments of the present disclosure do not limit the functional modules on the circuit board to be tested. For example, the functional modules may include a central processing unit, a digital signal processor, a graphics processor, a sensor hub, and a radio frequency unit At least one of them, or may also include other functional modules, such as an image acquisition unit, a display unit, a microphone, an audio output unit, etc., as long as the modules that need to be powered can be the functions in the embodiments of the present disclosure module.

The connection component 11 can be any component capable of connecting the power management device to the circuit board under test. For example, in FIG. In the embodiment of the present disclosure, the connecting part 11 can have the same structure and size as the part on the packaged PMIC module used to connect to the circuit board, for example, all have 18 pins of the same size, etc., and then can realize the use of power The management device directly replaces the PMIC module.

The power management circuit on the functional layer can realize power management functions, such as providing different voltage power supplies, over-voltage protection functions, under-voltage protection functions, and over-temperature protection functions for different functional models on the circuit board to be tested. , Overcurrent protection function, etc. The power management circuit can be connected to the circuit board under test through the connection part 11, and then supply power to each functional module on the circuit board under test and realize various power management functions related to power supply.

Optionally, please refer to FIG. 2. FIG. 2 is a side view of the power management device. The power management circuit of the functional layer 20 may also include a variable resistor 22, so the output of the power management circuit can be adjusted by adjusting the resistance value of the variable resistor 22. The value of the electrical parameters.

Optionally, the embodiment of the present disclosure does not limit what kind of parameter the electrical parameter is. For example, the electrical parameter may include at least one of a current parameter, a voltage parameter, and a power consumption parameter, or the electrical parameter may also include other Some parameters related to power supply.

As shown in Figure 2, the power management circuit of the functional layer 20 can be realized by various electronic components arranged on the PCB (Printed Circuit Board, printed circuit board) board 21, and the program for power management can be burned into the power management In the device, the function of power management is realized.

In the embodiment of the present disclosure, the variable resistor 22 can be set on the PCB board 21. After the variable resistor 22 is connected to the power management circuit, the value of the electrical parameter output by the power management circuit can be adjusted by changing the resistance value of the variable resistor 22. . In practical applications, the specifications of the functional modules on different circuit boards to be tested may be different, and the power supply required by the functional modules may be different. For example, the voltage required by the CPU module of the circuit board to be tested 1 is 1.8V. The voltage required by the CPU module of the test circuit board 2 is 1.2V, etc., then the resistance value of the variable resistor 22 can be changed so that the power management circuit can output voltages of different levels. In this way, the value of the electrical parameters output by the power management circuit can be adjusted by adjusting the resistance value of the variable resistor 22. The power management device can be adapted to new circuit boards to be tested, the power management device can be adapted to various circuit boards to be tested with different specifications, and the power management device has better versatility.

Optionally, please continue to refer to FIG. 2 , the power management circuit may further include a variable capacitor 23 , and the value of an electrical parameter output by the power management circuit can be adjusted by adjusting the capacitance of the variable capacitor 23 .

In the embodiment of the present disclosure, a variable capacitor 23 can be provided on the PCB 21. After the variable capacitor 23 is connected to the power management circuit, the value of the electrical parameter output by the power management circuit can be adjusted by changing the capacitance of the variable capacitor 23. . For example, the voltage required by the CPU module of the circuit board to be tested 1 is 1.8V, and the voltage required by the CPU module of the circuit board to be tested 2 is 1.2V, etc., so the capacitance of the variable capacitor 23 can be changed so that the power management circuit can Different levels of voltage can be output. In this way, the value of the electrical parameters output by the power management circuit can be adjusted by adjusting the capacitance of the variable capacitor 23. Even if the power supply of the circuit board under test is upgraded, the value of the variable capacitor 23 can The power management device can be adapted to new circuit boards to be tested, the power management device can be adapted to various specifications of circuit boards to be tested, and the power management device has strong versatility.

Optionally, the power management circuit may include at least one power management sub-circuit, and the functional layer 20 further includes a circuit switching switch, which is used to switch the circuit currently connected to the circuit board under test between at least one power management sub-circuit. Switching, the values of the electrical parameters output by different power management sub-circuits are different.

In the embodiment of the present disclosure, multiple power management subcircuits can be pre-configured in the functional layer 20, and different power management subcircuits can output different values of electrical parameters. The DC voltage of V is configured under the power management sub-circuit 2, which can output a DC voltage of 1.2V. Then the user can select the power management sub-circuit with electrical parameters to be connected through the circuit switching switch on the functional layer 20. In this way, the power management device can adapt to different requirements of testers and can be applied to various test scenarios, and the power management device has strong versatility.

Optionally, among the electronic components included in the power management circuit, at least one electronic component is detachably arranged in the functional layer.

The detachable manner may be, for example, direct plugging, or may be connected or separated through a snap-fit structure, etc., and the embodiment of the present disclosure does not limit the detachable manner.

In this way, testers can selectively configure the electronic components in the functional layer according to different test requirements. For example, when the power supply of the circuit board to be tested changes after the upgrade, the upgraded The test of the circuit board to be tested, the power management device has strong versatility.

Please continue to refer to FIG. 1 , the power management device may include a connection layer 10 , a function layer 20 , and a test layer 30 from bottom to top. The test layer 30 may include a measurement component 31 connected to the power management circuit of the functional layer 20. By measuring the measurement component 31, the electrical parameter values of the functional modules on the circuit board to be tested under the current power supply can be obtained.

The embodiment of the present disclosure does not limit what kind of component the measurement component 31 is, as long as the power supply of each functional module on the circuit board to be tested can be drawn out for measurement. For example, the measurement member 31 may be a metal contact, or the like.

The present disclosure also does not limit the method of measuring the value of the electrical parameter of the functional module under the current power supply through the measuring component 31. For example, the current value can be measured by an ammeter, the voltage value can be measured by a voltmeter, and the power consumption can be measured by a power meter. ,etc.

Optionally, the measurement component 31 is connected to the power management circuit, and connected to the connection component 11 in series.

The measuring component 31 is connected in series with the connecting component 11 , that is, the connecting component 11 can be taken out as a measuring point through the measuring component 31 to measure the value of the electrical parameter on the connecting component 11 . In this way, the values of the electrical parameters of the functional modules on the circuit board to be tested can be measured more conveniently without changing the original circuit design, and the testing process is more convenient and simple.

Optionally, the functional layer 20 may also include a selection component, which is used to select a functional module to be measured.

When testing the circuit board to be tested, it is usually to measure each functional module on the board separately. For example, when testing the power supply of the CPU module, it may be necessary to disconnect the power supply of other modules except the CPU module, and measure the power of the CPU module separately. The value of the electrical parameter, therefore, the functional module to be measured can be selected through the selection component provided on the functional layer 20, and after selection, the power supply to other functional modules is cut off. In this manner, testers can more conveniently test different functional modules on the circuit board to be tested, and the power management device has a strong test capability.

Optionally, the test layer 30 may also include a power access component for accessing a DC power supply.

The power management device needs to be connected to a DC power supply in order to divide and convert the DC voltage to supply power to each functional module according to the requirements of different functional modules. On the test layer 30 , a DC power supply, such as a 4.8V or 2.4V DC power supply, can be connected more conveniently during the test process. In this way, it is more convenient for testers to operate during the test, and there is no need to install a power supply battery on the circuit board to be tested during the test, and the direct connection to a standard DC power source makes the test result more accurate.

Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A power management device, characterized in that, comprising: A connection layer, including a connection part, the connection part is used to connect the power management device to the circuit board under test; The functional layer includes a power management circuit, the power management circuit is connected to the connecting part, and supplies power to the functional modules on the circuit board under test through the connecting part; The test layer includes a measurement component connected to the power management circuit, wherein the measurement component can measure the value of the electrical parameter of the functional module under the current power supply. 2. The device according to claim 1, wherein the measurement unit is connected to the power management circuit and connected in series with the connection unit. 3. The device according to claim 1, wherein the power management circuit further comprises a variable resistor, wherein the electrical parameters output by the power management circuit can be adjusted by adjusting the resistance value of the variable resistor value. 4. The device according to claim 1, wherein the power management circuit further comprises a variable capacitor, wherein the electrical parameters output by the power management circuit can be adjusted by adjusting the capacitance of the variable capacitor value. 5. The device according to claim 1, wherein the power management circuit includes at least one power management sub-circuit, and the functional layer further includes a circuit switching switch, and the circuit switching switch is used to switch the currently connected The circuits of the circuit board to be tested are switched between the at least one power management sub-circuit, wherein the values of electrical parameters output by different power management sub-circuits are different. 6. The device according to claim 1, wherein at least one of the electronic components included in the power management circuit is detachably arranged in the functional layer. 7. The device according to claim 1, wherein the functional layer further comprises a selection component, the selection component is used to select a functional module to be measured. 8 . The device according to claim 1 , wherein the test layer further comprises a power access component for connecting a direct current power. 9 . 9. The device according to claim 1, wherein the functional module comprises at least one of a central processing unit, a digital signal processor, a graphics processor, a sensor hub, and a radio frequency unit. 10. The device according to claim 1, wherein the electrical parameter comprises at least one of a current parameter, a voltage parameter, and a power consumption parameter.