CN106933059B - A kind of device and method of on-line monitoring offset mask layer version thermal deformation - Google Patents
A kind of device and method of on-line monitoring offset mask layer version thermal deformation Download PDFInfo
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- CN106933059B CN106933059B CN201511032055.1A CN201511032055A CN106933059B CN 106933059 B CN106933059 B CN 106933059B CN 201511032055 A CN201511032055 A CN 201511032055A CN 106933059 B CN106933059 B CN 106933059B
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003990 capacitor Substances 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 230000000717 retained effect Effects 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The present invention provides a kind of device and method of on-line monitoring offset mask layer version thermal deformation, first electrode unit is set in mask stage, the opposite polarity second electrode unit of first electrode unit is set on mask plate, first electrode unit forms electrode loop with second electrode unit and constitutes micro- capacitor cell, and the control unit that can monitor micro- capacitor cell capacitance is set, the distance between mask stage is calculated after mask plate deforms by measuring capacitance, and pass through control unit coordination electrode loop voltage, to which the electrostatic force controlled between mask plate and mask stage makes mask plate be moved to mask stage, reduce thermal deformation of the distance between the two to offset mask layer version, so both can with the thermal deformation degree of on-line real time monitoring mask plate can also real-time compensation mask plate thermal deformation.
Description
Technical field
The present invention relates to semiconductor lithography field, more particularly to the device of a kind of on-line monitoring offset mask layer version thermal deformation and
Method.
Background technology
In a lithography system, mask is used for generating marking to the figure in substrate.During typical optical patterning, meeting
Mask is positioned in correct position using positioning device, to ensure that the figure generated can correctly be mapped to integrated electricity
On the corresponding process layer in road.Mask is properly positioned depending on several factors, for example, keep mask and integrated circuit technology layer it
Between object image distance it is correct, if wherein the vertical Wrong localization of mask, then can influence between mask and integrated circuit technology layer
The accuracy of object image distance deteriorates so as to cause imaging image quality.
The vertical position error of mask be probably derived from it is more multifactor, such as the surface irregularity of substrate and mask from
The flexural deformation etc. of body.These error components can cause the imaging optimal focal plane in entire integrated circuit technology layer can be with space
Position is different and changes, and if in imaging process, several places of integrated circuit technology layer are all not at imaging optimal focal plane, then
It can be distorted in finally exposure forming process.With shorter and shorter to the optical source wavelength that generates integrated circuit pattern, by
In the proportion that the vertical position error of mask causes the distortion generated in imaging process shared in the influence to image quality
It is increasing.
In the factor for causing the vertical position error of mask, the flexural deformation of mask is an important factor.By
In in imaging process, the illumination light that lighting source is sent out is beaten on mask always, and mask can absorb a part of luminous energy to make
The heating effect of pairs of mask.It fixes, but sucker can only fix the edge of mask, therefore covers since mask generally has sucker
Film middle section will produce bending or even marginal portion after expanded by heating and can be transmitted to by the deformation of the securing part of sucker
Mask middle section is discharged.Mask expanded by heating can cause the object plane position of the figure off-target on mask, to make
At any two points on mask vertical position and differ, to using on mask point carry out vertical positioning when produce it is vertical
To position error, to make object image distance occur calculating error.
And currently available technology is to monitor thermal deformation by temperature sensor or focusing and leveling means, passes through other surveys
School means or translating means compensate thermal deformation, but can not be monitored and be compensated in real time.
It is therefore desirable to invent a kind of device and method of on-line monitoring offset mask layer version thermal deformation, can detect in real time
It the degree of deformation of mask curvature and is compensated by exposure process.
Invention content
To solve the above problems, the present invention proposes a kind of device and method of on-line monitoring offset mask layer version thermal deformation,
First electrode unit is set in mask stage, the opposite polarity second electrode list of first electrode unit is set on mask plate
Member, first electrode unit and second electrode unit form electrode loop and constitute micro- capacitor cell, and control unit is arranged, and use
In by connecting the first electrode unit and second electrode unit, the capacitance variation of above-mentioned micro- capacitor cell is monitored, and lead to
The voltage change for controlling the electrode loop is crossed, regulates and controls electrostatic force, inhibits the thermal deformation of the mask.By monitor capacitance to
It measures after mask plate deformation the distance between with mask stage, and the voltage for passing through electrode loop so that mask plate and mask stage
Between electrostatic force mask plate is moved to mask stage, reduce distance between the two to the thermal deformation of offset mask layer version.
In order to achieve the above objectives, the present invention provides a kind of device of on-line monitoring offset mask layer version thermal deformation, for solid
Determine and be maintained at mask plate in mask stage to carry out surface type measurement and control, including：
First electrode unit is arranged in the mask stage；
Second electrode unit is arranged on the mask plate, the first electrode unit and second electrode unit polarity phase
Instead, it forms electrode loop and constitutes micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, monitoring above-mentioned micro- capacitance list
The capacitance variation of member, and the voltage change by controlling the electrode loop regulate and control electrostatic force, inhibit the thermal change of the mask
Shape.
Preferably, described control unit also provides power supply and capacitive measuring device, the capacitive measuring device is for surveying
Measure the capacitance of micro- capacitor cell.
Preferably, the power supply also has the regulation component for the voltage output that can regulate and control power supply, for controlling motor
The voltage in circuit.
Preferably, the first electrode unit is arranged in the upper surface of mask stage, the second electrode unit setting exists
The upper surface of the lower surface of mask plate, mask stage corresponds to the lower surface of mask plate.
Preferably, the second electrode unit and mask plate integrated molding.
Preferably, the first electrode unit is embedded in the mask stage, and contacted with mask plate lower surface.
Preferably, with several be in the first electrode unit of array distribution in the mask stage, and several the
One electrode unit is insulated by megohmite insulant between each other.
Preferably, the mask plate by first electrode unit Electrostatic Absorption in the mask stage.
Preferably, regulation resistance is also in series in the electrode loop, for adjusting by the electrode loop
The capacitance of electric current and the capacitance.
The present invention also provides a kind of methods of on-line monitoring offset mask layer version thermal deformation, and first electrode is arranged in mask stage
Second electrode unit is arranged in unit on mask plate, and the first electrode and second electrode polarity are opposite so that first electrode
Unit forms electrode loop with second electrode unit and constitutes micro- capacitor cell, and control unit is arranged, for by connecting institute
First electrode unit and second electrode unit are stated, monitors the capacitance variation of above-mentioned micro- capacitor cell, and by controlling the electricity
The voltage change in pole circuit regulates and controls electrostatic force, inhibits the thermal deformation of the mask.
Preferably, the maximum distortion degree of setting mask plate, the maximum distance between corresponding mask plate and mask stage is d0,
When control unit monitor micro- capacitor cell capacitance after, calculate the distance between mask plate and mask stage be more than d0When,
The voltage for increasing electrode loop is controlled by control unit, to increase the electrostatic between first electrode unit and second electrode unit
Power so that the distance between mask plate and mask stage reduce.
Preferably, be provided with power supply in described control unit and regulate and control the regulation component of the voltage output of power supply,
Described control unit regulates and controls the output of power supply to the voltage change in coordination electrode circuit by regulation component.
Preferably, the electrode loop is also in series with regulation resistance, described control unit adjusts electricity by regulation resistance
The capacitance of electric current and micro- capacitor cell in the circuit of pole.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention provides a kind of on-line monitoring offset mask layer version heat
The device of deformation, for carrying out surface type measurement and control to being secured and retained in mask stage mask plate, including：
First electrode unit is arranged in the mask stage；
Second electrode unit is arranged on the mask plate, the first electrode unit and second electrode unit polarity phase
Instead, it forms electrode loop and constitutes micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, monitoring above-mentioned micro- capacitance list
The capacitance variation of member, and the voltage change by controlling the electrode loop regulate and control electrostatic force, inhibit the thermal change of the mask
Shape.
The present invention also provides a kind of methods of on-line monitoring offset mask layer version thermal deformation, and first electrode is arranged in mask stage
Second electrode unit is arranged in unit on mask plate, and the first electrode unit and second electrode unit polarity are opposite so that
First electrode unit forms electrode loop with second electrode unit and constitutes micro- capacitor cell, and control unit is arranged, for leading to
It crosses and connects the first electrode unit and second electrode unit, monitor the capacitance variation of above-mentioned micro- capacitor cell, and pass through control
The voltage change of the electrode loop is made, regulates and controls electrostatic force, inhibits the thermal deformation of the mask.
First electrode unit is arranged in the present invention in mask stage, and it is opposite that first electrode unit polarity is set on mask plate
Second electrode unit, first electrode unit and second electrode unit form electrode loop and constitute micro- capacitor cell, and are arranged
The control unit of the capacitance of micro- capacitor cell can be measured, for by connecting the first electrode unit and second electrode list
Member monitors the capacitance variation of above-mentioned micro- capacitor cell, and the voltage change by controlling the electrode loop, regulates and controls electrostatic
Power inhibits the thermal deformation of the mask., by measure the capacitance of micro- capacitor cell to measure after mask plate deformation with mask
The distance between platform, and the voltage by adjusting electrode loop, the electrostatic force controlled between mask plate and mask stage to cover
Film version is moved to mask stage, reduces thermal deformation of the distance between the two to offset mask layer version, so both can online in real time
Monitor mask plate thermal deformation degree can also real-time compensation mask plate thermal deformation.
Description of the drawings
Fig. 1 is Electrostatic Absorption mask plate schematic diagram provided by the invention；
Fig. 2 is apparatus structure schematic diagram provided by the invention；
Fig. 3 is mask plate top electrode distribution schematic diagram provided by the invention；
Fig. 4 is monitoring mask plate thermal deformation schematic diagram provided by the invention；
Fig. 5 is device circuit figure provided by the invention；
Fig. 6 is monitoring and compensation thermal deformation method flow diagram provided by the invention.
In figure：1- mask stages, 2- mask plates, 3- electrodes, 4- electric wires, 5- total control box, 6- power supplys, 7- capacitance measurements are set
Standby, 8- regulation resistances.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.
Mask plate 2 is attracted in mask stage 1, when photoetching, in the illumination to mask plate 2 that lighting source is sent out, due to covering
There is reflecting layer, so the light that is reflected from graphics field and being collected by optical device irradiates in graphics field in film version 2
To the substrate of work stage, to stamp the figure on mask plate 2 to substrate.
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the present invention provides a kind of device of on-line monitoring offset mask layer version thermal deformation, installation
In mask plate 2 and mask stage 1 for carrying the mask plate 2, the present embodiment, mask plate 2 is conductive materials, certainly
Conducting medium can also be coated on that surface that mask plate 2 is contacted with mask stage 1, mask stage 1 contacts that with mask plate 2
The electrode 3 of array arrangement is embedded on surface, which is mainly metal, which can either be with conductive mask
Version 2 forms capacitance, and the component for Electrostatic Absorption mask plate 2.
Fig. 5 is please referred to, is connect every electrode 3 with mask plate 2 using electric wire 4, and a total control box 5 of connecting are formed back
Road, provides the power supply in the circuit in total control box 5, capacitive measuring device of the configuration one for measuring capacitance in each circuit
7, between each circuit independently of each other, each each one total control box 5 of self-configuring in circuit.
In addition to capacitive measuring device 7, can also regulate and control the pressure regulation of 6 voltage output size of power supply in total control box 5
Component (not shown).
Please continue to refer to Fig. 5, regulation resistance 8 is also in series in circuit, for adjusting through the electric current and electricity in circuit
The capacitance of appearance.
Fig. 4 and Fig. 6 are please referred to, on-line monitoring offset mask layer version thermal deformation as described above is used the present invention also provides a kind of
Device on-line monitoring offset mask layer version thermal deformation method, specifically comprise the following steps：
Step 1：Electrode 3 on mask plate 2 and mask stage 1 is formed into a loop with power supply 6, and regulation of series resistance 8,
And capacitive measuring device 7, the maximum distance d after setting 2 thermal deformation of mask plate between mask stage 10。
Step 2：When exposure starts, power supply 6 is opened, mask plate 2 becomes the public capacitance pole of all electrodes 3 at this time, also
The electrostatic field range for being that all motor 3 all forms capacitance with mask plate 2, but being formed due to each electrode 3 and mask plate 2 compared with
It is small, therefore it is smaller to influence each other between 3 corresponding capacitance of electrode and the capacitance of another electrode 3 formation, it more will not short circuit.
Step 3：When mask plate 2 starts deformation, the distance between mask plate 2 and mask stage 1 d will increase, mask plate 2
With the capacitance between electrode 3Wherein ε is dielectric constant, and k is electrostatic force constant, and S is 3 area of electrode, thus may be used
Know, when d increases, the capacitance between mask plate 2 and electrode 3 reduces, therefore when capacitive measuring device 7 measures mask plate 2 and electricity
Capacitance between pole 3, to which d be calculated>d0, and the electrostatic force F=U/d between mask plate 2 and electrode 3, i.e.,
Wherein U is the voltage value that power supply 6 exports, therefore can improve mask plate 2 by the size for the voltage value that adjusting power supply 6 exports
With the electrostatic force between electrode 3, to change the distance between mask plate 2 and electrode 3, until d<d0, with timely offset mask layer
The thermal deformation of version 2.
In d<d0When, it may not be necessary to the size for adjusting the voltage value of the output of power supply 6 can observe the survey of capacitive measuring device 7 in real time
The capacitance obtained, thereby realizes the real-time monitoring for 2 thermal deformation of mask plate.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment, it is clear that this field
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations within the scope of the claims of the present invention and its equivalent technology, then the present invention be also intended to include
Including these modification and variations.
Claims (13)
1. a kind of device of on-line monitoring offset mask layer version thermal deformation, for being carried out to being secured and retained in mask plate in mask stage
Surface type measurement and control, which is characterized in that including：
First electrode unit is arranged in the mask stage；
Second electrode unit is arranged on the mask plate, and the first electrode unit and second electrode unit polarity are on the contrary, shape
At electrode loop and constitute micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, monitoring above-mentioned micro- capacitor cell
Capacitance variation, and the voltage change by controlling the electrode loop regulate and control electrostatic force, inhibit the thermal change of the mask plate
Shape.
2. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that described control unit
Power supply and capacitive measuring device are also provided, the capacitive measuring device is used to measure the capacitance of micro- capacitor cell.
3. the device of on-line monitoring offset mask layer version thermal deformation as claimed in claim 2, which is characterized in that the power supply also has
The regulation component for having the voltage output that can regulate and control power supply, the voltage for controlling electric motor loop.
4. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that the first electrode
Unit is arranged in the upper surface of mask stage, and the second electrode unit is arranged in the lower surface of mask plate, the upper surface of mask stage
The lower surface of corresponding mask plate.
5. the device of on-line monitoring offset mask layer version thermal deformation as claimed in claim 4, which is characterized in that the second electrode
Unit and mask plate integrated molding.
6. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that the first electrode
Unit contacts in the mask stage with mask plate lower surface.
7. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that in the mask stage
It is in the first electrode unit of array distribution with several, and several first electrode units pass through megohmite insulant between each other
Insulation.
8. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that the mask plate quilt
First electrode unit Electrostatic Absorption is in the mask stage.
9. the device of on-line monitoring offset mask layer version thermal deformation as described in claim 1, which is characterized in that the electrode loop
In be also in series with regulation resistance, for adjusting capacitance by electric current and the capacitance in the electrode loop.
10. a kind of method of on-line monitoring offset mask layer version thermal deformation, which is characterized in that first electrode list is arranged in mask stage
Second electrode unit is arranged in member on mask plate, and the first electrode unit and second electrode unit polarity are opposite so that the
One electrode unit forms electrode loop with second electrode unit and constitutes micro- capacitor cell, and control unit is arranged, for passing through
The first electrode unit and second electrode unit are connected, the capacitance variation of above-mentioned micro- capacitor cell is monitored, and passes through control
The voltage change of the electrode loop regulates and controls electrostatic force, inhibits the thermal deformation of the mask.
11. the method for on-line monitoring offset mask layer version thermal deformation as claimed in claim 10, which is characterized in that setting mask plate
Maximum distortion degree, the maximum distance between corresponding mask plate and mask stage is d0, when control unit monitors to obtain micro- capacitor cell
Capacitance after, calculate the distance between mask plate and mask stage be more than d0When, it is controlled by control unit and increases electrode loop
Voltage, to increase the electrostatic force between first electrode unit and second electrode unit so that between mask plate and mask stage
Distance reduce.
12. the method for on-line monitoring offset mask layer version thermal deformation as claimed in claim 10, which is characterized in that in the control
It is provided with power supply in unit and regulates and controls the regulation component of the voltage output of power supply, described control unit is regulated and controled by regulation component
The voltage change of power supply exported to coordination electrode circuit.
13. the method for on-line monitoring offset mask layer version thermal deformation as claimed in claim 10, which is characterized in that the electrode returns
Road is also in series with regulation resistance, and described control unit adjusts electric current and micro- capacitor cell in electrode loop by regulation resistance
Capacitance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511032055.1A CN106933059B (en) | 2015-12-31 | 2015-12-31 | A kind of device and method of on-line monitoring offset mask layer version thermal deformation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511032055.1A CN106933059B (en) | 2015-12-31 | 2015-12-31 | A kind of device and method of on-line monitoring offset mask layer version thermal deformation |
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| CN106933059A CN106933059A (en) | 2017-07-07 |
| CN106933059B true CN106933059B (en) | 2018-11-13 |
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| CN107976872A (en) * | 2017-12-29 | 2018-05-01 | 武汉华星光电技术有限公司 | Compensate method and device, the exposure machine of the deformation quantity of light shield |
| CN108362771A (en) * | 2018-02-13 | 2018-08-03 | 京东方科技集团股份有限公司 | A kind of damage monitoring apparatus and system |
| US20200218165A1 (en) * | 2018-12-21 | 2020-07-09 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Exposure apparatus and method of detecting alignment error of reticle |
| CN111769028B (en) * | 2020-06-24 | 2023-03-21 | 上海理工大学 | Glass negative flatness correction device and method |
| CN116791028B (en) * | 2023-06-28 | 2024-09-13 | 惠科股份有限公司 | Mask plate assembly and evaporation device |
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| JP2002036373A (en) * | 2000-07-25 | 2002-02-05 | Sanyo Electric Co Ltd | Stereolithography |
| JP2003324028A (en) * | 2002-04-30 | 2003-11-14 | Jfe Steel Kk | Manufacturing method of planar magnetic element |
| US7649611B2 (en) * | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| WO2012123144A1 (en) * | 2011-03-11 | 2012-09-20 | Asml Netherlands B.V. | Electrostatic clamp apparatus and lithographic apparatus |
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