CN106971995B - Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof - Google Patents

Abstract

The invention discloses a circuit pin positioning structure and a welding circuit component manufacturing method thereof. It is applied to a semiconductor packaging structure. It mainly includes a positioning bracket, a plurality of conductor pieces and a conductor positioning piece. The conductor piece passes through the conductor positioning piece. The adhesive layer is used to position the positioning bracket in the positioning bracket; the bottom surface of the positioning bracket is provided with a conductor positioning area with a plurality of positioning holes, and the opposite end of the positioning bracket away from the conductor positioning area is provided with a preset pick-and-place equipment. The operating part; the conductor piece is positioned in the positioning hole; and the conductor positioning piece is arranged on the top surface of the positioning bracket and connected to one end of the conductor piece in the positioning holes. In this way, the conductor can be accurately placed on the default circuit contact of the stacked package at one time, thereby improving production efficiency and overall yield; the positioning bracket and conductor positioning piece can be smoothly separated from the conductor, thereby improving process efficiency. effectiveness and reduce production costs.

Description

Circuit pin positioning structure and manufacturing method of soldered circuit assembly

technical field

The invention relates to the technical field of semiconductor products, in particular to a circuit pin positioning structure used in a semiconductor packaging structure and a manufacturing method for welding circuit components thereof.

Background technique

Since the advent of integrated circuits (ICs), the semiconductor industry has experienced continuous rapid growth due to the continuous increase in the integration density of various electronic components (eg, transistors, diodes, resistors, capacitors, etc.). In most cases, the improvement of integration density is due to the repeated reduction of the minimum feature size, and the reduction of the minimum feature size enables more components to be integrated into a given area. .

Smaller electronic components also correspond to smaller packages (which use less area than previous packages). Small-sized semiconductor packages include: quad flat pack (quad flat pack, QFP), ball grid array (ball grid array, BGA), flip chip package (flip chips, FC), three-dimensional integrated circuits (three dimensional integrated circuits, 3DICs), crystal Wafer level packages (WLPs), package on package (PoP) components.

In the current packaging technology, if it is desired to bond two different stacked packages or the pads of the panel/IC circuit board to each other, it is generally done by using conductive adhesives with metal particles, solder or non-conductive adhesives. join. In stack packaging, multiple semiconductor chips can be packaged separately to form multiple packages, or multiple semiconductor chips can be packaged in one package, and then multiple packages can be connected to form a stack package. Then, semiconductor chips located in different packages can be combined to perform predetermined work. These separate individual packages can be electrically connected to each other, for example, using contact bumps or other connectors. However, these stacked packages have the following problems when they are connected to each other. When placing solder pads or their corresponding conductors in the existing stacked packages, they are arranged to be placed one by one on the soldering pads of the corresponding stacked packages. The process time is too long and inefficient, and the traditional pad assembly structure and setting method, if it needs to be reprocessed, because the entire package structure can only be discarded, it cannot be reprocessed, resulting in waste of materials and related costs. When the package stack is heated, it is also prone to warping and deformation, which needs to be solved.

Therefore, how to solve the above-mentioned problems in the traditional semiconductor packaging technology is the main direction of research in the industry.

Contents of the invention

The technical problem to be solved by the present invention is to provide a circuit pin positioning structure with better packaging effect, higher production efficiency, higher product yield and more stable product performance and its manufacturing method for welding circuit components.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions: a circuit pin positioning structure, which is suitable for the packaging structure of semiconductors, especially the positioning structure used to arrange a plurality of conductors on the default circuit contacts of stacked packages, It includes a positioning bracket, a plurality of conductor parts and a conductor positioning piece, wherein:

The conductor part is positioned in the positioning bracket by using the adhesive layer through the conductor positioning sheet; a conductor positioning area with a plurality of positioning holes is provided on the bottom surface of the positioning bracket, and a conductor positioning area is provided on the opposite end of the positioning bracket away from the conductor positioning area. An operation part loaded on the pick-and-place equipment is provided; the conductor is positioned in the positioning hole; and the conductor positioning piece is arranged on the top surface of the positioning bracket and connected to one end of the conductor in the positioning hole.

Further, the plurality of positioning holes of the positioning bracket are arranged around the periphery of the bottom surface.

Further, the plurality of positioning holes of the positioning bracket are arranged in at least two rows along the periphery of the bottom surface.

Further, the plurality of positioning holes of the positioning bracket are rectangular holes, circular holes or polygonal holes.

Furthermore, the positioning bracket can be moved to the default circuit contact of the stacked package through a preset pick-and-place device loading operation part, and the positioning bracket can be removed after soldering the default circuit contact at one end of the conductor.

Further, the center of the bottom surface of the positioning bracket is recessed inward to form a receiving space.

Further, the operating part is arranged at the opposite end of the bottom surface of the positioning bracket.

Further, the operation part is arranged at the opposite end of the bottom surface of the positioning bracket, and the operation part is provided with at least one operation hole for penetrating the positioning bracket from the bottom surface toward the top surface.

Further, the operating part is provided with at least one operating hole on the side wall of the positioning bracket.

Further, the operating part is provided with at least one operating projection on the side wall of the positioning bracket.

Further, the conductor part is a cylindrical, circular tubular, polygonal column or polygonal tubular conductor.

Further, the conductor positioning sheet is made of PET polyester film, and an adhesive layer is provided on one side of the conductor positioning sheet.

Further, the conductor part is adhered to the conductor part by using the conductor positioning sheet, and the conductor part is positioned in the positioning bracket.

Preferably, the positioning bracket is made of metal material.

Preferably, the positioning bracket is made of plastic material.

Further, the operating part of the positioning bracket is provided with a suction surface for a preset pick-and-place device.

Further, one end of the positioning hole is provided with an opening, and the conductor element enters the positioning hole from the opening for positioning.

Further, the bottom surface of the conductor positioning area is recessed inwardly and forms a contact area.

Further, the bottom surface of the positioning bracket is provided with support columns for positioning the conductors at a predetermined height.

Further, a configuration hole is provided in the center of the positioning bracket for installation and installation of the operation part. The side wall of the operation part is provided with a plurality of positioning slant blocks for clamping the configuration hole. The side walls of the operation part are adjacent to the positioning slant. The lower edge of the block extends outwards and is provided with a supporting edge.

A method for manufacturing soldered circuit components based on the aforementioned circuit pin positioning structure, suitable for semiconductor packaging structures, comprising the following steps: (A) the production line provides at least one stacked package, and the stacked package has a plurality of default circuit contacts; (B) One of the pick-and-place equipment of the production line is equipped with a circuit pin positioning structure, the positioning structure includes a positioning bracket, a plurality of conductor parts and a conductor positioning piece, the conductor piece is positioned on the positioning bracket through the conductor positioning piece and the adhesive layer Inside; (C) Place the circuit pin positioning structure on the stack package of the production line through the preset pick and place equipment, and its default circuit contacts are in contact with the conductors of the circuit pin positioning structure; (D) Place the stack package Both the component and the circuit pin positioning structure are placed in a heating device, heated to the solder melting temperature of the stacked package or the circuit pin positioning structure; (E) the soldered stack package and the circuit pin positioning structure are removed from the heating device In addition; (F) using pick-and-place equipment to remove the positioning bracket of the circuit pin positioning structure and the conductor positioning sheet.

Further, it also includes a repeating step (G), the production line provides other stacked packages to be stacked on the other end of the conductor, and the above steps (A) to (F) are repeated until the stack reaches the predetermined packaging state of the package structure.

Preferably, the positioning bracket described in step (B) is made of plastic material.

Preferably, the positioning bracket described in step (B) is made of metal material.

Further, the conductor positioning sheet described in step (B) is made of PET polyester film (MYLAR), and an adhesive layer is provided on one side of the conductor positioning sheet.

Further, the conductor part described in the step (B) utilizes the conductor positioning sheet to adhere the conductor part to position the conductor part in the positioning bracket.

A method for manufacturing soldered circuit components based on the aforementioned circuit pin positioning structure, suitable for semiconductor packaging structures, comprising the following steps: (A) the production line provides at least one stacked package, and the stacked package has a plurality of default circuit contacts; (B) One of the pick-and-place equipment of the production line is loaded with the circuit pin positioning structure; (C) the circuit pin positioning structure is placed on the stacked package of the production line through the pick-and-place equipment, and its default circuit contacts are connected to the circuit contacts. The conductors of the pin positioning structure are in contact, and the conductors are positioned in the positioning bracket through the conductor positioning sheet and the adhesive layer; (D) Put both the stacked package and the circuit pin positioning structure into a heating device, and heat the stacked package or the solder melting temperature of the circuit pin positioning structure; (E) move the soldered stacked package and the circuit pin positioning structure out of the heating device; (F) use the pick-and-place equipment to position the conductor of the circuit pin positioning structure slice removed.

Further, it also includes a repeating step (G), the production line provides other stacked packages to be stacked on the other end of the conductor, and the above steps (A) to (F) are repeated until the stack reaches the predetermined packaging state of the package structure.

Preferably, the positioning bracket described in step (B) is made of plastic material.

Preferably, the positioning bracket in step (B) is made of metal material.

Further, the conductor positioning sheet described in step (B) is made of PET polyester film, and an adhesive layer is provided on one side of the conductor positioning sheet.

Further, the conductor part described in step (B) utilizes the conductor positioning sheet to adhere the conductor part to position the conductor part in the positioning bracket.

The positioning structure of the circuit pins of the present invention does not place a conductor piece one by one to the default circuit contact point of the stacked package through a pick-and-place device, but by accommodating a plurality of conductor pieces on a positioning bracket in advance. In the corresponding positioning holes, the conductor positioning sheet is used to adhere the conductor parts, and these conductor parts can be accurately placed on the default circuit contacts of the stacked package at one time, so as to improve the production efficiency and the overall yield rate.

In addition, the conductors and the corresponding default circuit contacts are set independently. When the conductors and the corresponding default circuit contacts are poorly welded, the defective conductors can be reprocessed separately to reduce the number of scrapped products due to defects. situation, reducing costs.

And through the method provided by the present invention, the conductors pre-accommodated in the positioning holes of a positioning bracket are adhered to the conductors through a conductor positioning sheet, so that the positioning bracket can smoothly move the conductors through a pick-and-place device To the default circuit contact, when the circuit contact or the solder of the conductor is soldered to the opposite side through the heating equipment, the positioning bracket and the conductor positioning piece can be separated from the conductor smoothly, achieving the effect of improving process efficiency.

Moreover, the conductor piece pre-accommodated in the positioning hole of a positioning bracket is adhered to the conductor piece through a conductor positioning sheet, so that the positioning bracket can smoothly move the conductor piece to the default circuit contact through a pick-and-place device. When the circuit contact or conductor The solder of the parts is soldered to the opposite side through the heating equipment, the positioning bracket and the conductor parts are fixed on the default circuit contacts, and the conductor positioning pieces are removed through the pick-and-place equipment to improve the efficiency of the process.

Description of drawings

Fig. 1 is the three-dimensional structural diagram of the first preferred embodiment of the present invention;

Fig. 2 is another three-dimensional structural view of the first preferred embodiment of the present invention;

Figure 3 is an exploded perspective view of the first preferred embodiment of the present invention;

Fig. 4 is a transverse sectional view and a partial enlarged view of the first preferred embodiment of the present invention;

Fig. 5 is the assembly diagram of the first preferred embodiment of the present invention;

Fig. 6 is another assembly diagram of the first preferred embodiment of the present invention;

Fig. 7 is the assembly flowchart of the first preferred embodiment of the present invention;

Fig. 8 is another assembled state diagram of the first preferred embodiment of the present invention;

Fig. 9 is a third assembly state view of the first preferred embodiment of the present invention;

Fig. 10 is a fourth assembly state diagram of the first preferred embodiment of the present invention;

Fig. 11 is a fifth assembly state diagram of the first preferred embodiment of the present invention;

Fig. 12 is the assembled state diagram of the second preferred embodiment of the present invention;

Fig. 13 is a three-dimensional exploded view of the positioning bracket of the third preferred embodiment of the present invention;

Fig. 14 is a three-dimensional exploded view of a fourth preferred embodiment of the present invention;

Fig. 15 is the first assembly flowchart of the first preferred embodiment of the invention;

Fig. 16 is the second assembly flowchart of the first preferred embodiment of the invention;

Fig. 17 is the third assembly flowchart of the first preferred embodiment of the invention;

Fig. 18 is the assembly flowchart four of the first preferred embodiment of the invention;

Fig. 19 is a schematic perspective view of a fifth preferred embodiment of the invention;

Fig. 20 is a schematic perspective view of a sixth preferred embodiment of the invention;

Fig. 21 is a schematic perspective view of a seventh preferred embodiment of the invention.

In the figure, 1 is the circuit pin positioning structure, 2 is the positioning bracket, 20 is the operation part, 200 is the operation hole groove, 201 is the operation bump, 202 is the suction surface, 203 is the bottom surface, 204 is the top surface, and 205 is the configuration Hole, 206 is a positioning inclined block, 207 is a supporting edge, 21 is a conductor positioning area, 22 is a positioning hole, 220 is an opening, 23 is a receiving space, 24 is a supporting column, 3 is a conductor, 30 is a bonding part, 31 is a contact part, 4 is a stack package, 40 is a default circuit contact, 5 is a pick-and-place device, 6 is a heating device, 7 is a conductor positioning sheet, 70 is a surface layer, and 71 is an adhesive layer.

Detailed ways

The present invention will be further described below in conjunction with specific embodiments.

Embodiment 1, with reference to Fig. 1-Fig. 7, the present invention is a kind of circuit pin positioning structure 1, is used on the packaging structure of semiconductor, includes positioning support 2, conductor part 3 and conductor fixing plate 7, so with respect to this The main components and features of the invention are described in detail below, wherein:

The positioning bracket 2 can be made of plastic material or metal material, and it is provided with a bottom surface 203 and a top surface 204 corresponding up and down, and a conductor positioning area 21 is arranged on the bottom surface 203, and the conductor positioning area 21 is provided with a plurality of positioning holes 22, the two ends of these positioning holes 22 are provided with openings 220 for the insertion of conductors 3, and the opposite end of the positioning bracket 2 away from the conductor positioning area 21 is provided with preset pick-and-place equipment (not shown in the figure) ) loaded with an operating part 20, in this preferred embodiment, the positioning holes 22 are arranged in at least two rows along the circumference of the bottom surface 203, and the positioning holes 22 are circular holes, but in actual use, they are not Limited to circular holes, rectangular holes, polygonal holes, special-shaped holes or other similar shapes can be set, and the center of the bottom surface 203 of the positioning bracket 2 is recessed inwardly for chip parts (not shown in the drawing) or resistance parts (figure 1). surface not shown) accommodates a housing space 23, and the operating portion 20 is provided with at least one operating hole 200 penetrating the operating portion 20 upwards from the bottom surface 204, the number of operating holes 200 is set to four, and The appearance of the operation hole 200 is rectangular, and a suction surface 202 for preset pick-and-place equipment (not shown) is provided at the center of the operation part 20, and the corner where the positioning bracket 2 intersects with the bottom surface 203 is provided. There are supporting pillars 24 used for positioning predetermined heights during the encapsulation process of the conductor element 3 .

A plurality of conductors 3, these conductors 3 are cylindrically arranged in a preferred embodiment, the conductors 3 include a bonding portion 30 and a contact portion 31, the bonding portion 30 of these conductors 3 is used for bonding Position the conductors 3 in the positioning holes 22 by means of the conductor positioning parts 7, and the conductors 3 can be inserted into the conductors 3 from any opening 220 of the positioning holes 22, and the contact part 31 is exposed to the positioning bracket 2 Outside the positioning hole 22 of the conductor positioning area 21.

A conductor positioning sheet 7, the conductor positioning sheet 7 is provided with a surface layer 70 and an adhesive layer 71, wherein the surface layer 70 is made of PET polyester film (MYLAR) material or material that can substantially achieve the same effect as the aforementioned material, The conductor positioning piece 7 covers the top surface 204 of the positioning bracket 2, and the adhesive portion 30 at one end of the conductors 3 located in the positioning holes 22 of the positioning bracket 2 adheres to the adhesive layer 71 of the conductor positioning piece 7, so that the conductors 3 is positioned on the positioning bracket 2.

Referring to Fig. 1-Fig. 6, wherein the positioning hole 22 of the positioning bracket 2 is placed into a plurality of conductors 3 from the opening 220 in advance, but the opening 220 is not limited to the bottom surface 203, and the top surface 204 can also be provided with the opening 220 It is used for placing the conductor 3. When the conductor 3 is in the positioning hole 22, the contact part 31 of the conductor 3 is exposed outside the opening 220 of the positioning bracket 2, and the ends of the adhesive parts of these conductors 3 are exposed. Outside the opening 220 on the top surface, the conductor positioning sheet 7 is arranged on the top surface 204 of the positioning bracket 2, and the adhesive layer 71 provided on one side of the conductor positioning sheet 7 is attached to the adhesive part 30 and the top surface exposed at the top surface 204. Surface 204, so that the conductor 3 can be positioned on the positioning bracket 2.

Referring to Figures 7-11, when the pick-and-place equipment 5 of the production line grabs or absorbs the circuit pin positioning structure 1, it is placed on the stacked package 4 already on the production line, and the stacked package 4 can be a circuit Substrates, stacked packaging components or other similar components that can be used for stacked packaging, etc., the limiting conductor 3 through the support column 24 can provide a better height for the positioning bracket 2 and a limiting method that reduces the contact surface, thereby reducing Conductor 3 interferes with positioning bracket 2 due to excessive contact area of positioning hole 22. Through heating device 6, the solder on stacked package 4 or contact portion 31 is melted, and removed from heating device 6 until the solder is solidified. Afterwards, the positioning bracket 2 made of plastic and the conductor positioning piece 7 on the top surface 204 of the positioning bracket 2 are removed through the pick-and-place device 5, and the conductor part 3 is welded on the default circuit contact 40. This is the first preferred embodiment Once the welding process is completed, in this embodiment where the positioning bracket 2 and the conductor positioning piece 7 are removed, the positioning bracket 2 made of plastic material can also be made of metal material.

Embodiment 2, referring to FIG. 12 , differs from Embodiment 1 in that when the conductor positioning sheet 7 on the top surface 204 of the positioning bracket 2 is removed through the pick-and-place device 5, the conductor member 3 has been soldered to the default circuit contact 40 , and the positioning bracket 2 is a continuation of the subsequent packaging process, which is the completion of a welding procedure in the second preferred embodiment.

Embodiment 3, referring to FIG. 13 , is different from Embodiment 1 in that the operating part 20 and the positioning bracket 2 are separated, and the center of the positioning bracket 2 is provided with a configuration hole 205 for the installation of the operating part 20. The side wall of the part 20 is provided with a plurality of positioning slant blocks 206 for clamping the configuration hole, and the side wall of the operation part 20 is adjacent to the lower edge of the positioning slant block 206 and partially extends outwards with a support edge part 207 around it. After the operating part 20 enters through the configuration hole 205, the positioning slant block 206 is used to guide the positioning bracket 2 through the configuration hole 205, so that the edges around the configuration hole 205 are clamped between the positioning slant block 206 and the supporting edge 207, and assembled Form a positioning bracket 2 structure.

Embodiment 4, with reference to FIG. 14 , is different from the above-mentioned first embodiment in that the positioning bracket 2 made of metal material is set in a single piece, which is another embodiment of the positioning bracket 2. The positioning bracket 2 operating part 20 Only one configuration hole 205 is provided on the top surface 204. After the conductor 3 is welded, the positioning bracket 2 and the conductor positioning piece 7 can be removed by suction or clamping through a pick-and-place device (not shown).

Referring to Fig. 1-Fig. 16, the circuit pin positioning structure 1 of the present invention is used on the packaging structure, and the manufacturing method of its welding circuit assembly includes the following steps:

The first step (A) (S701): the production line provides at least one stacked package 4, the stacked package 4 has a plurality of default circuit contacts 40, wherein the stacked package 4 of the production line can be moved by crawler transmission or suction on the production line;

The second step (B) (S702): one of the pick-and-place equipment 5 of the production line is loaded with a circuit pin positioning structure 1, wherein the circuit pin positioning structure 1 is provided with a positioning bracket 2 made of plastic material and a plurality of conductors 3 and A conductor positioning sheet 7, the conductor positioning sheet 7 is made of PET polyester film (MYLAR), and one side surface of the conductor positioning sheet 7 is provided with an adhesive layer 71, and these conductor parts 3 pass through the conductor positioning sheet 7 Adhesive positioning on the positioning bracket 2;

The third step (C) (S703): Place the circuit pin positioning structure 1 on the stacked package 4 of the production line through the pick-and-place device 5, and the default circuit contact 40 is in phase with the conductor 3 of the circuit pin positioning structure 1 Contact, at this time, the stacked package 4 or the conductor 3 has been covered with solder in advance, and the two are ready to be placed in the heating device 6 together;

The fourth step (D) (S704): put both the stacked package 4 and the circuit pin positioning structure 1 into a heating device 6, and heat to the solder melting temperature of the stacked package 4 or the circuit pin positioning structure 1, and the solder Melting temporarily connects the two to each other;

The fifth step (E) (S705): move the soldered stacked package 4 and the circuit pin positioning structure 1 out of the heating device 6, and cool down for a better time to solder them to each other;

The sixth step (F) (S706): the positioning bracket 2 and the conductor positioning piece made of plastic material are removed from the positioning bracket 2 of the circuit pin positioning structure 1 by using the pick-and-place equipment 5, and the conductor parts 3 are soldered and fixed in the stack package 4, and the removed positioning bracket 2 and conductor positioning piece of plastic material are discarded by the pick-and-place equipment 5, that is, assembled into a package structure, and in this step, it is also possible to check whether the conductor 3 is defective due to soldering to test.

The seventh step (G) (S707): The production line provides other stacked packages 4 to be stacked on the other end of the conductor 3, repeating the above first step (A) to the sixth step (F) until the stack reaches the predetermined package of the package structure State, through the above steps can reduce the time cost, easy operation, mutual alignment effect.

For the positioning bracket 2 in the manufacturing method of the above-mentioned preferred embodiment, it can be determined whether the positioning bracket 2 is packaged and stacked in the packaging structure according to requirements, but if the positioning bracket 2 is made of metal material, it cannot be packaged in the packaging structure.

Referring to Figures 1-18, the circuit pin positioning structure 1 of the first preferred embodiment of the present invention is used on the packaging structure, but the packaging process is slightly different. The manufacturing method of the soldered circuit assembly includes the following steps:

The first step (A) (S801): the production line provides at least one stacked package 4, the stacked package 4 has a plurality of default circuit contacts 40, wherein the stacked package 4 of the production line can be moved by crawler transmission or suction on the production line;

The second step (B) (S802): one of the pick-and-place equipment 5 of the production line is loaded with a circuit pin positioning structure 1, wherein the circuit pin positioning structure 1 is provided with a positioning bracket 2 made of plastic material and a plurality of conductors 3 and A conductor positioning sheet 7, the conductor positioning sheet is made of PET polyester film (MYLAR), and one side surface of the conductor positioning sheet 7 is provided with an adhesive layer 71, and these conductor parts 3 pass through the conductor positioning sheet 7 Adhesive positioning on the positioning bracket 2;

The third step (C) (S803): Place the circuit pin positioning structure 1 on the stacked package 4 of the production line through the pick-and-place device 5, and the default circuit contact 40 is in phase with the conductor 3 of the circuit pin positioning structure 1 Contact, at this time, the stacked package 4 or the conductor 3 has been covered with solder in advance, and the two are ready to be placed in the heating device 6 together;

The fourth step (D) (S804): put both the stacked package 4 and the circuit pin positioning structure 1 into a heating device 6, and heat to the solder melting temperature of the stacked package 4 or the circuit pin positioning structure 1, and the solder Melting temporarily connects the two to each other;

The fifth step (E) (S805): move the soldered stacked package 4 and the circuit pin positioning structure 1 out of the heating device 6, and cool down for a better time to solder them to each other;

The sixth step (F) (S806): the conductor positioning sheet 7 on the positioning bracket 2 made of plastic is removed by using the pick-and-place equipment 5, and the conductors 3 are welded and fixed on the stack package 4, After removal, the conductor positioning sheet 7 is discarded by the pick-and-place equipment 5, that is, it is assembled into a packaging structure, and in this step, it is also possible to check whether the conductor 3 is defective in welding.

The seventh step (G) (S807): the production line provides other stacked packages 4 to be stacked on the other end of the conductor 3, repeating the first step (A) to the sixth step (F) until the stack reaches the predetermined package of the package structure State, through the above steps can reduce the time cost, easy operation, mutual alignment effect.

Embodiment 5, referring to FIG. 19 , is different from Embodiment 1 in that: the operating part 20 provided on the top surface 204 of the positioning bracket 2 is provided with at least one operating projection 201 extending outward from the top surface 204, the operating projection 201 can be connected with the operating projection 201 by a pick-and-place device (not shown in the figure) by clamping or hooking the operation bump 201, and what is disclosed above is only a preferred embodiment of the present invention, and cannot In this way, the scope of rights of the present invention is limited.

Embodiment 6, referring to FIG. 20 , is different from Embodiment 1 in that: the operation part 20 is provided with at least one operation hole 200 at the side wall of the positioning bracket 2, and the operation hole 200 can be clamped by the pick-and-place device. The operation hole 200 is connected in a manner, and what is disclosed above is only a preferred embodiment of the present invention, and the scope of rights of the present invention cannot be limited by this.

Embodiment 7, referring to FIG. 21 , is different from Embodiment 1 in that: the operation part 20 is provided with at least one operation projection 201 at the side wall of the positioning bracket 2, and what is disclosed above is only a preferred implementation of the present invention It is only an example, and the scope of rights of the present invention cannot be limited by this.

The present invention has been described in detail above. The foregoing description is only a preferred embodiment of the present invention, and should not limit the implementation scope of the present invention. within the scope of the invention.

Claims (32)

1. A circuit pin positioning structure, suitable for packaging structures of semiconductors, especially a positioning structure for setting a plurality of conductors on the default circuit contacts of stacked packages, which includes a positioning bracket, a plurality of conductors and A conductor spacer, wherein: The conductor part is positioned in the positioning bracket by using the adhesive layer through the conductor positioning sheet; a conductor positioning area with a plurality of positioning holes is provided on the bottom surface of the positioning bracket, and a conductor positioning area is provided on the opposite end of the positioning bracket away from the conductor positioning area. An operation part loaded on the pick-and-place equipment is provided; the conductor is positioned in the positioning hole; and the conductor positioning piece is arranged on the top surface of the positioning bracket and connected to one end of the conductor in the positioning hole. 2 . The circuit pin positioning structure according to claim 1 , wherein the plurality of positioning holes of the positioning bracket are arranged around the periphery of the bottom surface. 3 . 3 . The positioning structure for circuit pins according to claim 2 , wherein at least two rows of positioning holes of the positioning bracket are arranged around the periphery of the bottom surface. 4 . 4. The circuit pin positioning structure according to claim 3, wherein the plurality of positioning holes of the positioning bracket are circular holes or polygonal holes. 5. The circuit pin positioning structure according to claim 1, wherein the positioning bracket is loaded with an operating part through a preset pick-and-place device, so that the positioning bracket can be moved to the default circuit contact of the stacked package, and the positioning bracket is on the conductor Solder the default circuit contact at one end of the component and remove it. 6. The circuit pin positioning structure according to any one of claims 1-5, wherein a middle part of the bottom surface of the positioning bracket is recessed inward to form a receiving space. 7. The circuit pin positioning structure according to claim 1, wherein the operating portion is disposed at an opposite end of the bottom surface of the positioning bracket. 8. The circuit pin positioning structure according to claim 1 or 7, wherein the operating part is arranged at the opposite end of the bottom surface of the positioning bracket, and the operating part is provided with at least one operation from the bottom surface to the top surface for penetrating the positioning bracket hole slot. 9 . The circuit pin positioning structure according to claim 1 , wherein the operating portion is provided with at least one operating hole on a side wall of the positioning bracket. 10. The circuit pin positioning structure according to claim 1, wherein the operating portion is provided with at least one operating protrusion on a side wall of the positioning bracket. 11 . The positioning structure for circuit pins according to claim 1 , wherein the conductive member is cylindrical, circular tube, polygonal columnar or polygonal tubular. 12 . 12. The circuit pin positioning structure according to claim 1, wherein the conductor positioning sheet is made of PET polyester film, and an adhesive layer is provided on one surface of the conductor positioning sheet. 13 . The positioning structure for circuit pins according to claim 12 , wherein the conductor component is adhered to the conductor component by the conductor positioning sheet, and the conductor component is positioned in the positioning bracket. 14 . 14. The circuit pin positioning structure according to claim 1, wherein the positioning bracket is made of metal material. 15. The circuit pin positioning structure according to claim 1, wherein the positioning bracket is made of plastic material. 16. The circuit pin positioning structure according to claim 1, wherein the operating portion of the positioning bracket is provided with a suction surface for a preset picking and placing device. 17. The circuit pin positioning structure according to claim 1, wherein an opening is formed at one end of the positioning hole, and the conductor member enters the positioning hole from the opening for positioning. 18. The circuit pin positioning structure according to claim 1, wherein a bottom surface of the conductor positioning area is recessed inwardly and forms a contact area. 19. The positioning structure for circuit pins according to claim 1, wherein the bottom surface of the positioning bracket is provided with a support column for positioning the conductive elements at a preset height. 20. The circuit pin positioning structure according to claim 1, wherein a configuration hole is provided in the center of the positioning bracket for installation of the operation part, and a plurality of positioning holes are provided on the side wall of the operation part to fasten the configuration hole. As for the inclined block, a side wall of the operating portion is adjacent to the lower edge of the positioning inclined block and extends outward to surround with a supporting edge. 21. A method for manufacturing soldered circuit components based on the circuit pin positioning structure according to claim 1, which is suitable for packaging structures of semiconductors, comprising the following steps: (A) the production line provides at least one stacked package, the stacked package There are a plurality of default circuit contacts; (B) one of the pick-and-place equipment of the production line is equipped with a circuit pin positioning structure, the positioning structure includes a positioning bracket, a plurality of conductor parts and a conductor positioning piece, and the conductor piece passes through the conductor positioning piece Use the adhesive layer to locate in the positioning bracket; (C) place the circuit pin positioning structure on the stacked package of the production line through the preset pick-and-place equipment, and its default circuit contacts are in contact with the conductors of the circuit pin positioning structure ; (D) Put both the stacked package and the circuit pin positioning structure into a heating device, and heat it to the solder melting temperature of the stacked package or the circuit pin positioning structure; (E) put the soldered stacked package and the circuit pin positioning structure The pin positioning structure is moved out of the heating device; (F) the positioning bracket and the conductor positioning sheet of the circuit pin positioning structure are removed by using pick-and-place equipment. 22. The manufacturing method of soldered circuit assembly according to claim 21, further comprising a repeating step (G) the production line provides other stacked packages to be stacked on the other end of the conductor, and repeating the steps (A) to (F) until stacking A predetermined encapsulation state of the encapsulation structure is achieved. 23. The method for manufacturing a soldered circuit assembly according to claim 21 or 22, wherein the positioning bracket in step (B) is made of plastic material. 24. The method for manufacturing a soldered circuit assembly according to claim 21 or 22, wherein the positioning bracket in step (B) is made of metal. 25. The method for manufacturing a soldered circuit assembly according to claim 24, wherein the conductor positioning sheet in step (B) is made of PET polyester film, and an adhesive layer is provided on one surface of the conductor positioning sheet. 26 . The method for manufacturing a soldered circuit assembly according to claim 25 , wherein the conductor piece described in step (B) is adhered to the conductor piece by the conductor positioning sheet, and the conductor piece is positioned in the positioning bracket. 27. A method for manufacturing soldered circuit components based on the circuit pin positioning structure according to claim 1, which is suitable for packaging structures of semiconductors, comprising the following steps: (A) the production line provides at least one stacked package, the stacked package There are a plurality of default circuit contacts; (B) one of the pick-and-place equipment of the production line is loaded with a said circuit pin positioning structure; (C) the circuit pin positioning structure is placed on the stacked package of the production line through the pick-and-place equipment, Its default circuit contacts are in contact with the conductors of the circuit pin positioning structure, and the conductors are positioned in the positioning bracket through the conductor positioning sheet and the adhesive layer; (D) Put the stacked package and the circuit pin positioning structure into a heating equipment, heated to the melting temperature of the solder of the stacked package or circuit pin positioning structure; (E) moving the soldered stacked package and circuit pin positioning structure out of the heating equipment; (F) using the pick and place equipment to remove the circuit The conductor positioning tabs of the pin positioning structure are removed. 28. The manufacturing method of soldered circuit assembly according to claim 27, further comprising a repeating step (G) the production line provides other stacking packages to be stacked on the other end of the conductor, repeating the steps (A) to (F) until stacking A predetermined encapsulation state of the encapsulation structure is achieved. 29. The method for manufacturing a soldered circuit assembly according to claim 27 or 28, wherein the positioning bracket in step (B) is made of plastic material. 30. The method for manufacturing a soldered circuit assembly according to claim 27 or 28, wherein the positioning bracket in step (B) is made of metal material. 31. The method for manufacturing a soldered circuit assembly according to claim 30, wherein the conductor positioning sheet in step (B) is made of PET polyester film, and an adhesive layer is provided on one side of the conductor positioning sheet. 32 . The method for manufacturing a soldered circuit assembly according to claim 31 , wherein the conductor element in step (B) is adhered to the conductor element by the conductor positioning sheet, and the conductor element is positioned in the positioning bracket. 33 .