CN107342233A - Low loss component flush type antenna packages structure and its manufacture method - Google Patents
Low loss component flush type antenna packages structure and its manufacture method Download PDFInfo
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- 238000000465 moulding Methods 0.000 claims abstract description 17
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- 238000007648 laser printing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
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- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L2224/732—Location after the connecting process
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Abstract
本发明涉及一种低损耗部件埋入式天线封装结构及其制造方法，所述结构包括基板（1），所述基板（1）包括多层线路层（1.1）和低损耗绝缘材料（1.2），所述多层线路层（1.1）包括天线区域，所述基板（1）正面设置有低损耗部件（2），所述低损耗部件（2）覆盖多层线路层（1.1）的天线区域，所述基板（1）上方、低损耗部件（2）外围区域包封有塑封料（3），所述基板（1）背面设置有芯片（4）和金属球（6）。本发明一种低损耗部件埋入式天线封装结构及其制造方法，它增加了薄型基板的结构强度，保证了天线区域在工作时受热的稳定性，防止天线的变形，保证天线信号的稳定。
The invention relates to a low-loss component embedded antenna packaging structure and a manufacturing method thereof, the structure includes a substrate (1), and the substrate (1) includes a multi-layer circuit layer (1.1) and a low-loss insulating material (1.2) , the multi-layer circuit layer (1.1) includes an antenna area, the substrate (1) is provided with a low-loss component (2) on the front surface, and the low-loss component (2) covers the antenna area of the multi-layer circuit layer (1.1), The top of the substrate (1) and the peripheral area of the low-loss component (2) are encapsulated with a molding compound (3), and the back of the substrate (1) is provided with chips (4) and metal balls (6). The invention discloses a low-loss part-embedded antenna packaging structure and its manufacturing method, which increases the structural strength of the thin substrate, ensures the stability of the antenna area when it is heated, prevents the deformation of the antenna, and ensures the stability of the antenna signal.
Description
技术领域technical field
本发明涉及一种低损耗部件埋入式天线封装结构及其制造方法，属于半导体封装技术领域。The invention relates to a low-loss component embedded antenna packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging.
背景技术Background technique
天线是无线通讯设备中必需的元件，在可携式的无线通讯设备集成化、小型化、微型化的要求下，现在使用的方式是通过系统级封装，可以尽可能多的把无源器件、小功率有源器件、天线埋入基板内，这就要求基板有尽可能低的介电损耗，同时技术趋势又要求基板尽可能薄型化，但是低损耗的基板或其他材料一般机械强度或刚度较低，从而会影响到整体封装的强度。Antenna is a necessary component in wireless communication equipment. Under the requirements of integration, miniaturization and miniaturization of portable wireless communication equipment, the current method used is through system-level packaging, which can integrate as many passive components, Low-power active devices and antennas are embedded in the substrate, which requires the substrate to have as low a dielectric loss as possible. At the same time, the technical trend requires the substrate to be as thin as possible. However, low-loss substrates or other materials generally have lower mechanical strength or rigidity. Low, which will affect the strength of the overall package.
发明内容Contents of the invention
本发明所要解决的技术问题是针对上述现有技术提供一种低损耗部件埋入式天线封装结构及其制造方法，它增加了薄型基板的结构强度，保证了天线区域在工作时受热的稳定性，防止天线的变形，保证天线信号的稳定。The technical problem to be solved by the present invention is to provide a low-loss component embedded antenna packaging structure and its manufacturing method for the above-mentioned prior art, which increases the structural strength of the thin substrate and ensures the stability of the antenna area when it is heated , to prevent the deformation of the antenna and ensure the stability of the antenna signal.
本发明解决上述问题所采用的技术方案为：一种低损耗部件埋入式天线封装结构，它包括基板，所述基板包括多层线路层和低损耗绝缘材料，所述多层线路层包括天线区域，所述基板正面设置有低损耗部件，所述低损耗部件覆盖多层线路层的天线区域，所述基板上方、低损耗部件外围区域包封有塑封料，所述基板背面设置有芯片和金属球。The technical solution adopted by the present invention to solve the above problems is: a low-loss component embedded antenna packaging structure, which includes a substrate, the substrate includes a multi-layer circuit layer and a low-loss insulating material, and the multi-layer circuit layer includes an antenna area, the front of the substrate is provided with low-loss components, the low-loss components cover the antenna area of the multi-layer circuit layer, the upper part of the substrate and the peripheral area of the low-loss components are encapsulated with a plastic encapsulant, and the back of the substrate is provided with chips and metal ball.
所述芯片通过底部填充胶倒装于基板背面。The chip is flip-chip mounted on the back of the substrate through the underfill glue.
所述低损耗部件在高频下的介电常数Dk<3.5，介质损耗Df <0.01。The low-loss component has a dielectric constant Dk<3.5 and a dielectric loss Df<0.01 at high frequencies.
一种低损耗部件埋入式天线封装结构的制造方法，所述方法包括如下步骤：A method for manufacturing a low-loss component embedded antenna packaging structure, the method comprising the steps of:
步骤一、取一载板；Step 1. Take a carrier board;
步骤二、在载板上制作多层线路板，多层线路之间设计有天线区域，在多层线路层中间使用低损耗绝缘材料，形成基板；Step 2, making a multi-layer circuit board on the carrier board, an antenna area is designed between the multi-layer lines, and a low-loss insulating material is used in the middle of the multi-layer line layers to form a substrate;
步骤三、在基板正面贴装低损耗部件，低损耗部件贴装在基板的天线区域上方；Step 3: mount low-loss components on the front of the substrate, and mount the low-loss components above the antenna area of the substrate;
步骤四、将低损耗部件进行塑封；Step 4: Plastic-encapsulate the low-loss components;
步骤五、移除载板；Step 5. Remove the carrier board;
步骤六、在移除载板后露出的基板背面贴装芯片并进行植球；Step 6. Mount the chip on the back of the substrate exposed after removing the carrier board and perform ball planting;
步骤七、在塑封料表面激光打印产品信息，最后切割成单颗产品。Step 7. Laser print product information on the surface of the plastic encapsulant, and finally cut into individual products.
步骤四塑封作业之后进行研磨减薄。Step 4: Grinding and thinning after plastic sealing.
步骤四塑封料表面贴覆一层保护膜，步骤七激光打印前去除该层保护膜。Step 4 A layer of protective film is pasted on the surface of the molding compound, and step 7 removes the layer of protective film before laser printing.
一种低损耗部件埋入式天线封装结构的制造方法，所述方法包括如下步骤：A method for manufacturing a low-loss component embedded antenna packaging structure, the method comprising the steps of:
步骤一、将低损耗部件内埋入塑封料中；Step 1. Embedding the low-loss components in the plastic encapsulant;
步骤二、在塑封料表面制作基板；Step 2, making a substrate on the surface of the plastic encapsulant;
步骤三、在基板表面倒装芯片并进行植球；Step 3. Flip chip on the surface of the substrate and perform ball planting;
步骤四、在塑封料表面激光打印产品信息，最后切割成单颗产品。Step 4: Laser print product information on the surface of the plastic encapsulant, and finally cut into individual products.
在步骤一的塑封料中埋入支撑块。Embed the support block in the molding compound in step 1.
步骤三完成后在塑封料表面贴覆一层保护膜，步骤四激光打印前去除该层保护膜。After step 3 is completed, a layer of protective film is pasted on the surface of the molding compound, and the layer of protective film is removed before step 4 laser printing.
一种低损耗部件埋入式天线封装结构，它包括基板，所述基板包括多层线路层和低损耗绝缘材料，所述多层线路层包括天线区域，所述基板正面设置有低损耗部件和芯片，所述低损耗部件覆盖多层线路层的天线区域，所述基板上方、低损耗部件和芯片外围区域包封有塑封料，所述基板背面设置有金属球。A low-loss component-embedded antenna packaging structure, which includes a substrate, the substrate includes a multi-layer circuit layer and a low-loss insulating material, the multi-layer circuit layer includes an antenna area, and the front side of the substrate is provided with a low-loss component and a low-loss insulating material. Chip, the low-loss component covers the antenna area of the multi-layer circuit layer, the top of the substrate, the low-loss component and the peripheral area of the chip are encapsulated with a plastic encapsulant, and the back of the substrate is provided with metal balls.
与现有技术相比，本发明的优点在于：Compared with the prior art, the present invention has the advantages of:
1、本发明增加了薄型基板的结构强度，芯片和低损耗部件分别位于基板两侧时，有助于平衡整体基板的翘曲度；芯片和低损耗部件位于基板同侧时，既能增加薄型基板的结构强度，又不增加整体结构的厚度；1. The present invention increases the structural strength of the thin substrate. When the chip and low-loss components are located on both sides of the substrate, it helps to balance the warpage of the overall substrate; when the chip and low-loss components are located on the same side of the substrate, it can increase the thinness The structural strength of the substrate without increasing the thickness of the overall structure;
2、本发明的低损耗部件覆盖天线区域，能够保证天线区域在工作时受热的稳定性，防止天线的变形，保证天线信号的稳定。2. The low-loss component of the present invention covers the antenna area, which can ensure the stability of the antenna area when it is heated, prevent the deformation of the antenna, and ensure the stability of the antenna signal.
附图说明Description of drawings
图1为本发明一种低损耗部件埋入式天线封装结构实施例1的示意图。FIG. 1 is a schematic diagram of Embodiment 1 of a low-loss component-embedded antenna package structure according to the present invention.
图2~图9为本发明一种低损耗部件埋入式天线封装结构实施例1制造方法的工序流程示意图。2 to 9 are schematic process flow diagrams of the manufacturing method of Embodiment 1 of a low-loss component-embedded antenna package structure according to the present invention.
图10~图13为本发明一种低损耗部件埋入式天线封装结构实施例1另一制造方法的工序流程图。10 to 13 are process flow charts of another manufacturing method of Embodiment 1 of a low-loss component-embedded antenna package structure according to the present invention.
图14为本发明一种低损耗部件埋入式天线封装结构实施例2的示意图。FIG. 14 is a schematic diagram of Embodiment 2 of a low-loss component-embedded antenna package structure according to the present invention.
图15为本发明一种低损耗部件埋入式天线封装结构实施例3的示意图。FIG. 15 is a schematic diagram of Embodiment 3 of a low-loss component-embedded antenna package structure according to the present invention.
图16为本发明一种低损耗部件埋入式天线封装结构实施例4的示意图。FIG. 16 is a schematic diagram of Embodiment 4 of a low-loss component-embedded antenna package structure according to the present invention.
其中：in:
基板1Substrate 1
多层线路层1.1Multilayer circuit layer 1.1
低损耗绝缘材料1.2Low Loss Insulation Materials 1.2
天线区域1.3Antenna Area 1.3
低损耗部件2Low Loss Components 2
塑封料3Plastic compound 3
芯片4chip 4
底部填充胶5Underfill 5
金属球6。metal ball6.
具体实施方式detailed description
以下结合附图实施例对本发明作进一步详细描述。The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
实施例1：芯片与低损耗部件位于基板两侧Example 1: Chips and low-loss components are located on both sides of the substrate
参见图1，本实施例中的一种低损耗部件埋入式天线封装结构，它包括基板1，所述基板1包括多层线路层1.1和低损耗绝缘材料1.2，所述多层线路层1.1包括天线区域1.3，所述基板1正面设置有低损耗部件2，所述低损耗部件2覆盖多层线路层1.1的天线区域1.3，所述基板1上方、低损耗部件2外围区域包封有塑封料3，所述基板1背面设置有芯片4和金属球6；Referring to Fig. 1, a low-loss component embedded antenna packaging structure in this embodiment includes a substrate 1, and the substrate 1 includes a multilayer circuit layer 1.1 and a low-loss insulating material 1.2, and the multilayer circuit layer 1.1 Including the antenna area 1.3, the front of the substrate 1 is provided with a low-loss component 2, the low-loss component 2 covers the antenna area 1.3 of the multi-layer circuit layer 1.1, and the upper part of the substrate 1 and the peripheral area of the low-loss component 2 are encapsulated with a plastic package material 3, the back of the substrate 1 is provided with chips 4 and metal balls 6;
所述芯片4通过底部填充胶5倒装于基板1背面；The chip 4 is flip-chip mounted on the back of the substrate 1 through the underfill glue 5;
所述低损耗部件2在高频（>20 GHz）下具有低的介电常数（Dk<3.5），具有低的介质损耗（Df <0.01）。The low-loss component 2 has a low dielectric constant (Dk<3.5) and a low dielectric loss (Df<0.01) at high frequencies (>20 GHz).
其制造方法包括如下步骤：Its manufacturing method comprises the following steps:
步骤一、参见图2，取一载板；Step 1, see Figure 2, take a carrier board;
步骤二、参见图3，在载板上制作多层线路板，多层线路之间设计有天线区域，在多层线路层中间使用低损耗绝缘材料，形成基板；Step 2, see Figure 3, make a multilayer circuit board on the carrier board, design an antenna area between the multilayer circuits, and use low-loss insulating materials in the middle of the multilayer circuit layers to form a substrate;
步骤三、参见图4，在基板正面贴装低损耗部件，低损耗部件贴装在基板的天线区域上方，低损耗部件的尺寸大于等于天线区域的面积；Step 3, referring to Figure 4, mounting low-loss components on the front of the substrate, the low-loss components are mounted above the antenna area of the substrate, and the size of the low-loss components is greater than or equal to the area of the antenna area;
步骤四、参见图5，将低损耗部件进行塑封；Step 4, see Figure 5, plastic-encapsulate the low-loss components;
步骤五、参见图6，塑封料表面进行研磨减薄，可以研磨至低损耗部件露出，也可以不露出，塑封料表面贴覆一层保护膜，其目的是为了好的粘附作用和降低热阻；Step 5. See Figure 6. Grind and thin the surface of the molding compound. It can be ground until the low-loss parts are exposed or not exposed. The surface of the molding compound is covered with a protective film for good adhesion and heat reduction. resistance;
步骤六、参见图7，移除载板；Step 6, see Figure 7, remove the carrier board;
步骤七、参见图8，在移除载板后露出的基板背面贴装芯片，贴装方式可以用倒装，芯片底部和周围用底部填充胶进行填充，在需要和外部电性连接处进行植球；Step 7, see Figure 8, mount the chip on the back of the substrate exposed after removing the carrier board. ball;
步骤八、参见图9，去除保护膜，在塑封料表面激光打印产品信息，最后切割成单颗产品。其另一制造方法包括如下步骤：Step 8, see Figure 9, remove the protective film, laser print product information on the surface of the molding compound, and finally cut into individual products. Its another manufacturing method comprises the following steps:
步骤一、参见图10，将低损耗部件内埋入塑封料中，为了防止翘曲，可以在塑封料中埋入其他的支撑块；Step 1. Referring to Figure 10, embed the low-loss components in the molding compound. In order to prevent warping, other support blocks can be embedded in the molding compound;
步骤二、参见图11，在塑封料表面进行多层电镀以及填充绝缘材料制作形成基板；Step 2. Referring to FIG. 11 , perform multi-layer electroplating on the surface of the molding compound and fill insulating materials to form a substrate;
步骤三、参见图12，在塑封料表面贴覆一层保护膜，其目的是为了好的粘附作用和降低热阻，在基板表面倒装芯片并进行植球；Step 3, see Figure 12, apply a layer of protective film on the surface of the plastic encapsulant, the purpose of which is to achieve good adhesion and reduce thermal resistance, flip chip on the surface of the substrate and perform ball planting;
步骤四、参见图13，去除保护膜，在塑封料表面激光打印产品信息，最后切割成单颗产品。Step 4, see Figure 13, remove the protective film, laser print product information on the surface of the molding compound, and finally cut into individual products.
实施例2：芯片与低损耗部件位于基板同一侧Example 2: The chip and the low-loss component are located on the same side of the substrate
参见图14，本实施例中的一种低损耗部件埋入式天线封装结构，它包括基板1，所述基板1包括多层线路层1.1和低损耗绝缘材料1.2，所述多层线路层1.1包括天线区域1.3，所述基板1正面设置有低损耗部件2和芯片4，所述低损耗部件2覆盖多层线路层1.1的天线区域1.3，所述基板1上方、低损耗部件2和芯片4外围区域包封有塑封料3，所述基板1背面设置有金属球6。Referring to FIG. 14 , a low-loss components embedded antenna packaging structure in this embodiment includes a substrate 1, and the substrate 1 includes a multilayer circuit layer 1.1 and a low-loss insulating material 1.2. The multilayer circuit layer 1.1 Including the antenna area 1.3, the front of the substrate 1 is provided with a low-loss component 2 and a chip 4, and the low-loss component 2 covers the antenna area 1.3 of the multi-layer circuit layer 1.1, above the substrate 1, the low-loss component 2 and the chip 4 The peripheral area is encapsulated with molding compound 3 , and metal balls 6 are arranged on the back of the substrate 1 .
实施例3：Example 3:
参见图15，实施例3与实施例1的区别在于：低损耗部件2的背面未被塑封料3所包封。Referring to FIG. 15 , the difference between Embodiment 3 and Embodiment 1 is that the back of the low-loss component 2 is not encapsulated by the molding compound 3 .
实施例4：Example 4:
参见图16，实施例4与实施例2的区别在于：低损耗部件2的背面未被塑封料3所包封。Referring to FIG. 16 , the difference between Embodiment 4 and Embodiment 2 is that the back of the low-loss component 2 is not encapsulated by the molding compound 3 .
除上述实施例外，本发明还包括有其他实施方式，凡采用等同变换或者等效替换方式形成的技术方案，均应落入本发明权利要求的保护范围之内。In addition to the above-mentioned embodiments, the present invention also includes other implementations, and any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the claims of the present invention.
Claims (10)
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