CN107437429A - Temperature sensing situation mode double-row memory module and module circuit board thereof - Google Patents

Abstract

The invention discloses a temperature-sensing situation mode dual-row memory module and its module circuit board. The module circuit board is provided with volatile memory components and electronically erasable rewritable read-only memory components, and the light-emitting side of the module circuit board is provided with light-emitting diode components and situational lighting control components. The light guide strip is placed on the light-emitting side of the module circuit board in an indirect arrangement relationship. The buckle-type heat sinks are buckled with each other so that the light guide strip is fixed in a clamping manner. Among them, the power supply sharing of the situational lighting control component is carried in the power supply system of the light-emitting diode component, and the signal sharing of the situational lighting control component is carried in the signal connection system of the electronically erasable rewritable read-only memory component. Therefore, the lighting situational performance controlled by the situational lighting control component will be consistent with the sensed temperature used to adjust the memory charging frequency without erroneous performance of temperature sensing differences.

Description

Temperature-sensing context mode dual-rank memory module and its module circuit board

technical field

The invention relates to a memory module, in particular to a temperature-sensing situation mode dual-row memory module and a module circuit board thereof.

Background technique

The existing memory module includes a module circuit board and a plurality of volatile memory components connected to the module circuit board, and is used for plugging into a memory slot of a computer system. When the operating frequency of the memory increases to high frequency, the memory module has a higher data transfer rate and higher power consumption, and at the same time, the memory module becomes more likely to accumulate heat and cause the computer system to become unstable. When the operating temperature of the memory module is getting higher and higher than the allowable value, the performance of the memory module will be significantly reduced, and the soft error rate (soft error rate, SER) of the module will also increase at the same time. Therefore, the operating temperature of the memory module is expected to be accurately sensed and applied.

The addition of light-emitting diode components in the memory module is an existing technology. However, the known light-emitting structures can only roughly show simple changes between high temperature and normal temperature, and it is difficult to achieve precise programmable changes in multi-state light-emitting and temperature-sensing situations. In Taiwan Utility Model Patent No. TW-M448772 "Dynamic Random Access Memory", the disclosed DRAM includes a module board body, a plurality of LED components and a translucent light guide strip. The LED assembly is arranged on the body and electrically connected to the body. The light guide strip is arranged on the body and covers the LED assembly, and the light of the LED assembly can pass through the light guide strip. Wherein, the specific setting of the light guide strip is to directly clamp the module board body by using the slit of the light guide strip, and at least one groove is formed on the inner side wall of the slit of the light guide strip, and the light emitting diode assembly is accommodated in the groove. In addition, a controller component for controlling the light emitting frequency of the LED component is disposed on the module board body. Moreover, the controller component has a temperature sensor, the temperature sensor can sense the temperature and convert it into a signal and send it to the controller component, and further drive the controller component to adjust the light emitting frequency of the light emitting diode component, and the light emitting diode component reminds Whether the temperature of the user's dynamic random access memory is overheated. As can be seen from the above, the light-emitting control of the existing light-emitting dynamic random access memory adopts an independent system, and it is necessary to add an independent temperature sensing system, an independent signal system and an independent power supply system in the module board body; The manufacturing cost of memory products, and the new temperature sensing system used to control the light-emitting frequency is different from the temperature sensing system used to control the operation frequency of the original dynamic random access memory. The temperature sensing position and the structure of the sensing components are different. Both will cause errors in the temperature sensing value, and its light-emitting pattern can only roughly show whether it is overheated, and cannot accurately share the working temperature of the memory module with the light-emitting system, so it is difficult to apply it to the correct adjustment of various temperature-sensing situation modes Variety.

Contents of the invention

In order to solve the above-mentioned problems, the main purpose of the present invention is to provide a temperature-sensing situation mode dual-rank memory module and its module circuit board, the working temperature of the memory module can be accurately sensed and applied to make the memory module show a correct Sensitive context has been defined.

The second object of the present invention is to provide a temperature-sensing situational mode dual-row memory module and its module circuit board, in which the signals of the situational lighting control component are carried in a specific sharing manner to reduce the manufacturing cost.

Another object of the present invention is to provide a temperature-sensing situational mode dual-column memory module and its module circuit board, which utilizes the mutual combination of a plurality of fastening heat sinks, and at the same time enables the light guide strip to be placed on the module circuit in an indirect relationship. On the board, the simple assembly and disassembly of the light guide strip can be achieved and the effect of preventing damage to the light emitting diode component can be achieved.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. The invention discloses a dual-column memory module with a temperature-sensing situational mode, which includes a module circuit board, a light guide strip and a plurality of fastening heat sinks. A surface of the module circuit board is provided with a plurality of first volatile memory components and a plurality of second volatile memory components. There is also an electronic erasable rewritable read-only memory component (EEPROM) between the components. The module circuit board has a plug-in side and a light-emitting side. A plurality of contact fingers are arranged on the plug-in side. The light-emitting side is provided with A plurality of light emitting diode components and a situation lighting control component. The light guiding strip is placed in an indirect disposition relationship on the light emitting side of the module circuit board. The plurality of fastening heat sinks cover the surface and the other opposite surface of the module circuit board, and the light guide strip is fixed by clamping through the mutual fastening of the multiple fastening heat sinks. Wherein, the power supply of the ambient lighting control component is shared on the power supply system of the plurality of LED components, and the signal sharing of the ambient lighting control component is mounted on the signal connection system of the electronic erasable rewritable read-only memory component.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the dual-row memory module of the aforementioned temperature-sensing situation mode, a top cover can also be included, which can be placed on the light guide bar in an indirect setting relationship, and the interlocking of the plurality of buckling heat sinks is used to cause the The top cover is also fixed by clipping. In this way, the consistency of the overall metal appearance is added and the light guide strip is secured.

In the aforementioned temperature-sensing situational mode dual-row memory module, the light-emitting side of the module circuit board may be formed with a plurality of protrusions in an irregular shape, and the plurality of light-emitting diode assemblies may be arranged on the plurality of protrusions in an oblique illumination manner. portion, and the light guide strip may have an irregular side edge profile corresponding to the light emitting side. Thereby, the effect of more uniform light emission of the light guide strip is achieved.

In the dual-rank memory module of the aforementioned temperature-sensing situation mode, a heat conduction layer and a reflective layer can be formed on the inner surface of each of the plurality of fastening heat sinks, wherein the heat conduction layer can be heat-conducted and attached to the plurality of first heat sinks. The volatile memory component and the plurality of second volatile memory components, the reflective layer can cover the plurality of light emitting diode components. Therefore, the light guide bar does not need to cover the plurality of LED assemblies, and the light emitted by the plurality of LED assemblies can still be guided to the light guide bar with high efficiency.

In the aforementioned temperature-sensing context mode dual-rank memory module, the electronically erasable rewritable read-only memory component may have a built-in temperature sensor. Therefore, after the temperature sensed by the temperature sensor is converted into a signal, it can also be used by the ambient lighting control component, and the ambient lighting control component does not need to be built-in or connected with a temperature sensor.

In the aforementioned dual-rank memory module with temperature-sensing context mode, the signal connection system of the electronically erasable rewritable read-only memory component may include a plurality of signal buses, which can connect multiple signals of the electronically erasable rewritable read-only memory component. A first signal terminal point and a plurality of temperature signal transmission fingers in the plurality of contact fingers, and the module circuit board can have a plurality of shared carrying signal lines and a plurality of shared carrying power lines, and the plurality of shared carrying signal lines can be connected The multiple second signal terminals of the ambient lighting control component are connected to the multiple signal buses, and the multiple shared on-board power lines can connect the multiple power terminals of the ambient lighting control component to the power supply system.

In the aforementioned temperature-sensing situation mode dual-rank memory module, the power supply system may include a transformer assembly for converting the first operating voltage into a second operating voltage and a power bus, and the power bus may transmit the first operating voltage. A plurality of power transmission fingers among the plurality of contact fingers are connected to the transformer assembly, and the plurality of shared carrying power lines can be connected by the transformer assembly in the second operating voltage transmission mode, wherein the second operating voltage can be greater than the first working voltage. Therefore, the working voltage of the ambient lighting control component can be greater than the working voltage of the plurality of volatile memory components.

The present invention has the advantage that:

By virtue of the above-mentioned technical means, the present invention provides a dual-rank memory module, which further expands the application of light-emitting diode components and electronically erasable rewritable read-only memory components. In the standard structure of the existing non-luminous memory module, a temperature sensor is built in the electronic erasable rewritable read-only memory component, and the working temperature of the memory module is monitored through the electronic erasable rewritable read-only memory component. In the present invention, the signal converted from monitoring to temperature is output to a computer system through the signal bus connected to the electronic erasable rewritable read-only memory component and the plurality of temperature signal transmission fingers of the module circuit board, thereby selecting A suitable lighting and temperature sensing situation is sent back to the lighting control component of the situation. Therefore, the dual-rank memory module of the present invention can drive the plurality of light-emitting diode assemblies to show various lighting colors, flashing frequency, lighting intensity and other situational changes, and can also adjust the speed of the fan synchronously. Therefore, the user can correctly judge whether the memory module is in a high-load overheating state, which will be very helpful for the balance between the stability of the computer system and the pursuit of high performance.

Description of drawings

FIG. 1 : According to a specific embodiment of the present invention, a three-dimensional exploded schematic diagram of components of a temperature-sensing context mode dual-rank memory module.

FIG. 2 is a schematic front view of a module circuit board of the temperature-sensing context mode dual-rank memory module according to an embodiment of the present invention.

FIG. 3 : According to a specific embodiment of the present invention, a schematic diagram of the bus connection of the module circuit board of the dual-rank memory module in the temperature-sensing context mode.

FIG. 4 : According to a specific embodiment of the present invention, a schematic diagram of the connection of the power supply system of the light-emitting diode assembly in the module circuit board of the dual-rank memory module of the temperature-sensing situation mode.

FIG. 5 : According to a specific embodiment of the present invention, a schematic connection diagram of the signal connection system of the electronically erasable rewritable read-only memory component in the module circuit board of the dual-rank memory module of the temperature-sensing situation mode.

FIG. 6 : According to a specific embodiment of the present invention, a schematic diagram of the circuit connection of the ambient lighting control component in the module circuit board of the dual-rank memory module of the temperature-sensing ambient mode.

FIG. 7 : According to a specific embodiment of the present invention, a pin definition diagram of the contact fingers in the module circuit board of the dual-rank memory module of the temperature-sensing situation mode.

FIG. 8 : According to a specific embodiment of the present invention, a schematic diagram of communication between the temperature-sensitive context mode dual-rank memory module and a computer device.

In the picture:

10 computer processor means;

20 software programs;

100 thermal context mode dual-rank memory modules;

110 modular circuit boards;

111 a first volatile memory component; 112 a second volatile memory component;

113 Electronically erasable rewritable read-only memory components;

114 plug side; 115 light emitting side;

116 contact finger; 116A temperature signal transmission finger;

116B power transmission finger;

117 convex portion; 118 signal bus;

120 light guiding strip; 121 irregular side edge profile;

130 buckle-type heat sink; 131, 132 buckle parts;

133 heat conduction layer; 134 reflection layer;

140 top cover; 141 hollow slotting;

150 light emitting diode components;

160 situation lighting control component; 161 second signal terminal;

162 power terminals;

170 share the carrying signal line; 180 share the carrying power line;

190 power supply system; 191 transformer assembly;

192 Power bus.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

According to a specific embodiment of the present invention, a temperature-sensing context mode dual-rank memory module 100 is illustrated in the three-dimensional exploded diagram of components in FIG. 1 . The thermal context mode dual-rank memory module 100 includes a module circuit board 110 , a light guide strip 120 and a plurality of fastening heat sinks 130 . Wherein, FIG. 2 shows the front side of the module circuit board 110 of the dual-rank memory module 100 of the temperature-sensing situation mode. FIG. 3 shows the bus connection relationship of the module circuit board 110 of the thermal context mode dual-rank memory module 100 .

Referring to FIGS. 1 to 3 , a surface of the module circuit board 110 is provided with a plurality of first volatile memory components 111 and a plurality of second volatile memory components 112 . The plurality of first volatile memory components 111 are concentrated in one area and arranged at a fixed pitch, and the plurality of second volatile memory components 112 are concentrated in another area and arranged at the same fixed pitch. The gap between the volatile memory components 111 and the plurality of second volatile memory components 112 is greater than the above-mentioned fixed distance, so as to form a blank area in the center of the surface of the module circuit board 110 . The plurality of first volatile memory components 111 and the plurality of second volatile memory components 112 can specifically be dynamic random access memory components, such as DDR2 DRAM, DDR3 DRAM, and DDR4 DRAM. Moreover, the module circuit board 110 is also provided with an electronic erasable rewritable read-only memory component 113 between the plurality of first volatile memory components 111 and the plurality of second volatile memory components 112, which can be electronically The method rewrites the data multiple times and saves the data like a hard disk without power on. In this embodiment, the electronically erasable rewritable ROM element 113 may have a built-in temperature sensor. Cooperating with the technical means described below, the temperature sensed by the temperature sensor can also be used in an ambient lighting control component 160 after being converted into a signal, so the ambient lighting control component 160 does not need a built-in temperature sensor.

The module circuit board 110 has a plugging side 114 and a light emitting side 115 , and a plurality of contact fingers 116 are arranged on the plugging side 114 . The light emitting side 115 is provided with a plurality of LED components 150 and a situational lighting control component 160 . The ambient lighting control component 160 is used to control the switch, light color and flashing frequency of the plurality of LED components 150 . A specific type of the ambient lighting control component 160 may be a 20-pin pinless quad flat package structure (QFN 20 ). Please refer to FIG. 1 to FIG. 3 again. Preferably, the light-emitting side 115 of the module circuit board 110 can be formed with a plurality of protrusions 117 in an irregular shape, and the plurality of light-emitting diode assemblies 150 can be arranged in an oblique illumination manner. In the plurality of protrusions 117 , the above-mentioned oblique irradiation method is a non-unidirectional staggered arrangement. Moreover, the light guide bar 120 can have an irregular side edge profile 121 corresponding to the light emitting side 115 . Thereby, the effect of more uniform light emission of the light guide strip 120 is achieved.

Referring to FIG. 1 again, the light guide bar 120 is placed on the light emitting side 115 of the module circuit board 110 in an indirect arrangement relationship. The material of the light guide bar 120 can be a translucent plastic material, and when the light sources emitted by the plurality of LED assemblies 150 are introduced into the light guide bar 120 , the light guide bar 120 can emit light evenly. Moreover, the plurality of fastening heat sinks 130 cover the surface of the module circuit board 110 and the other opposite surface, and the multiple fastening heat sinks 130 are interlocked so that the light guide bar 120 Secured by clamping. In this embodiment, each fastening heat sink 130 has a fastening portion 131 and another fastening portion 132 on both sides thereof. The fastening portions 131 , 132 of the plurality of fastening heat sinks 130 are fastened together to form a combination, and at the same time, fasten the light guide strip 120 . In a specific structure, the temperature-sensing situation mode dual-rank memory module 100 can further include a top cover 140, which can be placed on the light guide bar 120 in an indirect setting relationship, and utilizes the plurality of fastening heat sinks 130 Interlocking with each other, so that the top cover 140 is also fixed in a clamping manner. Thereby, the uniformity of the overall metal appearance is increased and the fixing of the light guide strip 120 is ensured. Specifically, the top cover 140 has a plurality of hollow slots 141 for the light in the light guide bar 120 to pass through.

Please refer to FIG. 1 again. In a preferred specific structure, a heat conduction layer 133 and a reflective layer 134 can be formed on the inner surface of each of the plurality of fastening heat sinks 130, wherein the heat conduction layer 133 can be thermally conductive and attached to the The plurality of first volatile memory components 111 and the plurality of second volatile memory components 112 , the reflective layer 134 can cover the plurality of LED components 150 . Therefore, the light guide bar 120 does not need to cover the plurality of LED assemblies 150 , and the light emitted by the plurality of LED assemblies 150 can still be efficiently guided to the light guide bar 120 .

In addition, the power supply of the ambient lighting control component 160 is shared by the power supply system 190 of the plurality of LED components 150, and the signal of the ambient lighting control component 160 is shared by the electronically erasable rewritable read-only memory component 113. Signal connection system. FIG. 4 illustrates the connection relationship of the power supply system of the plurality of LED assemblies 150 in the module circuit board 110 of the temperature-sensing situation mode dual-rank memory module 100 . FIG. 5 shows the connection relationship of the signal connection system of the electronic erasable rewritable read-only memory component 113 in the module circuit board 110 of the temperature-sensing situation mode dual-rank memory module 100 . FIG. 6 shows the circuit connection relationship of the ambient light control component 160 in the module circuit board 110 of the temperature-sensitive ambient mode dual-rank memory module 100 . FIG. 7 shows the definition relationship of the pins of the contact fingers 116 in the module circuit board 110 of the dual-rank memory module 100 of the thermal context mode. FIG. 8 shows a schematic communication relationship between the temperature-sensing context mode dual-rank memory module 100 and a computer device.

The signal connection system of the electronically erasable rewritable read-only memory component 113 may include a plurality of signal buses 118, which can connect multiple first signal terminals of the electronically erasable rewritable read-only memory component 113 (as shown in FIG. 6 The plurality of signal bus lines 118 are connected and marked as SCL, SDA, SA0, SA1, SA2) and the plurality of temperature signal transmission fingers 116A in the plurality of contact fingers 116 . The plurality of signal buses 118 may specifically be a system management bus (System Management Bus, SMBUS) of a memory module. And, as shown in FIG. 3 , the module circuit board 110 can have a plurality of shared carrying signal lines 170 and a plurality of shared carrying power lines 180, and the plurality of shared carrying signal lines 170 can be connected to a plurality of the ambient lighting control components 160. The second signal terminals 161 (as shown in FIG. 6 ) are connected to the plurality of signal buses 118 , and the plurality of shared onboard power lines 180 can connect the plurality of power terminals 162 of the ambient lighting control assembly 160 to the power supply system 190 .

3 to 8, the power supply system 190 may include a transformer assembly 191 that converts the first operating voltage into a second operating voltage and a power bus 192, the power bus 192 may transmit the first operating voltage A plurality of power transmission fingers 116B in the plurality of contact fingers 116 are connected to the transformer assembly 191, and the plurality of shared carrying power lines 180 can be connected to the transformer assembly 191 in the second working voltage transmission mode, wherein the second The operating voltage may be greater than the first operating voltage. In this specific embodiment, the first working voltage is 2.5V, and the second working voltage is 4V.

Please refer to FIG. 4 , the power supply of the ambient lighting control component 160 is shared by the power supply system mounted on the plurality of LED components 150 . Please refer to FIG. 5 , the signal connection of the ambient lighting control component 160 shares the signal connection system mounted on the electronic erasable rewritable read-only memory component 113 .

Please refer to FIG. 6 , the ambient lighting control component 160 does not have a built-in temperature sensor and corresponding circuit connection. Please refer to FIG. 7 , the pin position definition of the contact finger 116 in the module circuit board 110 includes the temperature signal transmission fingers 116A corresponding to the electronic erasable rewritable read-only memory component 113 and the plurality of light emitting diodes The plurality of power delivery fingers 116B of the assembly 150 . The connection terminals of the plurality of temperature signal transmission fingers 116A in FIG. 7 are specifically marked as SCL, SDA, SA0, SA1, SA2, and are also connected to the signal terminals of the ambient lighting control component 160 in FIG. 6 . The connection terminal position of the plurality of power transmission fingers 116B in FIG. 7 is specifically marked as VPP, which is connected to the power supply system 190 of the plurality of LED assemblies 150 .

Please refer to FIG. 8 , the dual-rank memory module 100 of the thermal context mode can be plugged into a computer device, and connected to the computer processor device 10 of the computer device, such as a central processing unit (CPU) or a platform path controller ( PCH, Platform Controller Hub). The working temperature 100 of the memory module can be accurately sensed, and through the signal connection system of the electronically erasable rewritable read-only memory component 113, the temperature signal can be transmitted to the computer processor device 10, and the matching is selected through the software program 20 The defined temperature sensing situation, under the correct address communication, the computer processor device 10 can pass the corresponding control signal through the signal connection system of the electronic erasable rewritable read-only memory component 113 (including the multiple signals The bus 118 ) and the plurality of shared carrying signal lines 170 are transmitted back to the ambient lighting control assembly 160 , so that the plurality of LED assemblies 150 of the memory module 100 exhibit correct defined temperature sensing scenarios.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention shall be determined by the claims.

Claims (13)

1. A temperature-sensing context mode dual-rank memory module, characterized in that, comprising: A modular circuit board, a surface of the modular circuit board is provided with a plurality of first volatile memory components and a plurality of second volatile memory components, the modular circuit board is arranged on the plurality of first volatile memory components and the plurality of volatile memory components An electronic erasable rewritable read-only memory component is also arranged between the second volatile memory components. The module circuit board has a plug-in side and a light-emitting side. A plurality of contact fingers are arranged on the plug-in side. A plurality of light emitting diode components and a situation lighting control component are provided; a light guide strip placed in indirect relation on the light emitting side of the module circuit board; and A plurality of fastening heat sinks cover the surface and another opposite surface of the module circuit board, and the light guide strip is fixed by clamping through the mutual fastening of the multiple fastening heat sinks. 2. The temperature-sensing situation mode dual-rank memory module according to claim 1, wherein the power supply of the situation lighting control component is shared with the power supply system mounted on the plurality of LED components, and the situation lighting control component The signal sharing is mounted on the signal connection system of the electronically erasable rewritable read-only memory component. 3. The temperature-sensing context mode dual-rank memory module according to claim 1, further comprising a top cover, which is placed on the light guide strip in an indirect relationship, and the plurality of fastening heat sinks are used to interlocking, so that the top cover is also fixed in a clamping manner. 4. The temperature-sensing situational mode dual-rank memory module according to claim 1, wherein the light-emitting side of the module circuit board is formed with a plurality of protrusions in an irregular shape, and the plurality of light-emitting diode assemblies are formed with The oblique illumination mode is arranged on the plurality of protrusions, and the light guide strip has an irregular side edge profile corresponding to the light-emitting side. 5. The temperature-sensing situation mode dual-rank memory module according to claim 1, wherein a thermal conduction layer and a reflective layer are formed on the inner surface of each of the plurality of fastening heat sinks, wherein the heat conduction layer conducts heat Attached to the plurality of first volatile memory components and the plurality of second volatile memory components, the reflective layer covers the plurality of light emitting diode components. 6 . The thermal context mode dual-rank memory module according to any one of claims 1 to 5 , wherein a temperature sensor is built in the electronically erasable rewritable read-only memory module. 7. The temperature-sensing context mode dual-rank memory module according to claim 2, wherein the signal connection system of the electronically erasable rewritable read-only memory component comprises a plurality of signal buses, which connect the electronically erasable A plurality of first signal terminals of a rewritable read-only memory component and a plurality of temperature signal transmission fingers in the plurality of contact fingers, and the module circuit board has a plurality of shared carrying signal lines and a plurality of shared carrying power lines, the A plurality of shared on-board signal lines connects a plurality of second signal terminals of the ambient lighting control component to the plurality of signal buses, and a plurality of shared on-board power lines connects a plurality of power terminals of the ambient lighting control component to the power supply system. 8. The thermal context mode dual-rank memory module according to claim 7, wherein the power supply system comprises a transformer assembly for converting the first operating voltage into a second operating voltage and a power bus, the The power bus is connected to the transformer component by the multiple power transmission fingers of the multiple contact fingers in the first working voltage transmission mode, and the multiple shared carrying power lines are connected by the transformer component in the second working voltage transmission mode , wherein the second operating voltage is greater than the first operating voltage. 9. A module circuit board of a temperature-sensing situation mode dual-row memory module, characterized in that, a surface of the module circuit board is provided with a plurality of first volatile memory components and a plurality of second volatile memory components, the module The circuit board is also provided with an electronically erasable rewritable read-only memory component between the plurality of first volatile memory components and the plurality of second volatile memory components. The modular circuit board has a plug-in side and a light emitting On the plug-in side, a plurality of contact fingers are arranged, and on the light-emitting side, a plurality of light-emitting diode components and a situational light-emitting control component are arranged; wherein, the signal of the situational light-emitting control component is shared and mounted on the electronic erasable rewritable only The signal connection system of the read memory component, the power supply of the ambient lighting control component is shared by the power supply system mounted on the plurality of light emitting diode components. 10. The module circuit board of the temperature-sensing situation mode dual-rank memory module according to claim 9, wherein the light-emitting side of the module circuit board is formed with a plurality of protrusions and is irregular, and the plurality of The light emitting diode assembly is arranged on the plurality of protrusions in an oblique illumination manner. 11. The module circuit board of the temperature-sensing context mode dual-rank memory module according to claim 9, wherein a temperature sensor is built in the electronically erasable rewritable read-only memory module. 12. The module circuit board of the temperature-sensing situation mode dual-rank memory module according to claim 9, 10 or 11, wherein the signal connection system of the electronically erasable rewritable read-only memory component includes a plurality of signal A bus, which connects the multiple first signal terminals of the electronically erasable rewritable read-only memory component and the multiple temperature signal transmission fingers among the multiple contact fingers, and the module circuit board has multiple shared carrying signal lines and a plurality of shared on-board power lines, the plurality of shared on-board signal lines are connected to a plurality of second signal terminals of the ambient lighting control component to the plurality of signal buses, and the plurality of shared on-board power lines are connected to multiple power terminals to the power supply system. 13. The module circuit board of the temperature-sensing situation mode dual-rank memory module according to claim 12, wherein the power supply system comprises a transformer assembly for converting the first operating voltage into a second operating voltage and a A power bus, the power bus is connected to the transformer assembly from a plurality of power transmission fingers of the plurality of contact fingers in the first working voltage transmission mode, and the plurality of shared carrying power lines are connected to the transformer component in the second working voltage transmission mode The transformer assembly is connected, wherein the second operating voltage is greater than the first operating voltage.