CN107450692B - A computer cooling structure - Google Patents

Abstract

The invention provides a computer heat dissipation structure, which improves the current simple copper tube surrounding heat dissipation structure and can effectively improve the heat dissipation effect. Three heat dissipation frames with special structural shapes are arranged around the fan. Heat exchange can quickly and efficiently transfer the heat of the computer heat source device to the cooling fan, and the cooling fan can use high-speed rotation to discharge the airflow out of the computer, and a special heat-absorbing component is set at the computer heat source device, which can quickly dissipate the heat of the heat source device. It absorbs and takes away the heat, and uses a fan to discharge the heat. The invention also designs a heat dissipation fan adapted to it, and the heat dissipation blades can assist to quickly absorb and take away the heat, which can ensure the heat dissipation effect.

Description

A computer cooling structure

technical field

The invention relates to the technical field of computer auxiliary components, in particular to a computer heat dissipation structure, which belongs to the technical field of computer hardware equipment.

Background technique

A large number of integrated circuits are used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. At present, the computer radiator absorbs heat by contacting the surface of the heat-generating components, and then transmits the heat to a distance through various methods, such as the air in the chassis, and then the chassis transmits the hot air to the outside of the chassis to complete the heat dissipation of the computer. . Among them, since the CPU is the brain of the computer, the most common one is the CPU radiator. Heat sinks can be divided into active heat dissipation and passive heat dissipation according to the way in which heat is removed from the heat sink. The former is common with air-cooled radiators, while the latter is common with heat sinks. To further subdivide the cooling methods, it can be divided into air cooling, heat pipe, liquid cooling, semiconductor cooling, compressor cooling and so on. However, for ordinary computers at present, air cooling is the most common, and it is very simple. It uses a fan to take away the heat absorbed by the radiator. This kind of radiator has the advantages of relatively low price and simple installation, but it is relatively dependent on the environment, such as the temperature rise and the overclocking performance will be greatly affected.

At the same time, the current computing speed of the computer is gradually increasing, which requires higher and higher heat dissipation performance of the computer, and the liquid cooling and cooling methods will cause the circuit to be very complicated and increase the size of the computer. The current air-cooled heat dissipation only uses The simple structure of ordinary fans and copper tubes is too simple, and the heat dissipation effect is very poor, which seriously affects the service life and computing speed of the computer. Therefore, in order to meet the heat dissipation requirements of modern computers, it is necessary to improve the structure of the computer's radiator. Improvements in order to improve its cooling effect.

Based on the above technical problems, the present invention provides a computer heat dissipation structure, so as to improve the heat dissipation efficiency of the computer and ensure the heat dissipation effect.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a computer heat dissipation structure with a novel structure and effectively improve the heat dissipation effect of the computer.

In order to achieve the above object, the present invention adopts the following technical solutions: a computer heat dissipation structure, which includes a heat dissipation air outlet assembly, a heat conduction pipe and a heat absorption assembly, wherein the heat absorption assembly is arranged on the heat source device side of the computer, and the heat dissipation air outlet The assembly is arranged at the heat dissipation hole of the computer, and the heat dissipation air outlet assembly and the heat absorption assembly are connected by a heat pipe. The first cooling rack, the second cooling rack and the third cooling rack are all U-shaped structures, the first cooling rack and the second cooling rack are symmetrically arranged on the U-shaped opening side of the third cooling rack, and the first cooling rack and the cooling rack The open end of the second heat dissipation frame is opposite to the open side of the third heat dissipation frame, and the side elevation of the U-shaped structure of the heat dissipation frame three is facing the middle axis of the bottom surface of the U-shaped structure of the heat dissipation frame one or the heat dissipation frame two. , the side elevation of the U-shaped structure of the heat dissipation frame 2 on the side close to the heat dissipation frame 3 and the side elevation of the U-shaped structure of the heat dissipation frame 1 on the side close to the heat dissipation frame 3 are both shorter than the other side of the respective A cooling fan is arranged in the center of the area enclosed between the first cooling frame, the second cooling frame and the third cooling frame.

Further, preferably, the blades of the cooling fan are densely arranged, and the gap between two adjacent blades is smaller than the width of the blades, and the blades are made of copper alloy material.

Further, preferably, a plurality of auxiliary heat dissipation columns are arranged on the outer side of the bottom surface of the U-shaped structure of the first heat dissipation frame, the second heat dissipation frame or the third heat dissipation frame, which is opposite to the U-shaped opening, and the end surfaces of the auxiliary heat dissipation columns are provided with auxiliary heat dissipation columns. A heat dissipation ball, the diameter of the auxiliary heat dissipation ball is larger than the diameter of the auxiliary heat dissipation column, and the auxiliary heat dissipation ball and the auxiliary heat dissipation column are made of copper materials.

Further, preferably, the outer sides of the side elevations of the U-shaped structures of the first heat dissipation frame and the second heat dissipation frame are provided with a plurality of auxiliary heat dissipation columns, and the end surfaces of the auxiliary heat dissipation columns are provided with auxiliary heat dissipation balls.

Further, preferably, the outer side of the side elevation of the U-shaped structure of the heat dissipation frame 3 is also provided with a plurality of auxiliary heat dissipation columns, and the end surfaces of the auxiliary heat dissipation columns are provided with auxiliary heat dissipation balls.

Further, preferably, the heat-absorbing assembly includes a heat-absorbing and heat-conducting plate, a heat-conducting connecting column and a heat-absorbing and heat-conducting seat, wherein the heat-absorbing guide plate is arranged on one side of the heat source device of the computer, and the two ends of the heat-absorbing guide plate The heat-conducting connection posts are respectively connected and provided, and the ends of the heat-conducting connection posts are connected with a heat-absorbing and heat-conducting seat, and the heat-absorbing and heat-conducting seat is extended along the length direction of the computer heat source device. The outer surface is provided with an arc-shaped concave-convex structure.

Further, preferably, the outer surface of the heat-absorbing and heat-conducting seat is a circular arc-shaped concave-convex structure.

Further, preferably, the cross section of the heat-absorbing and heat-conducting seat is a plum-shaped structure.

Further, preferably, the heat-absorbing and heat-conducting seat is a hollow structure.

The beneficial effects of the present invention are:

The invention provides a computer heat dissipation structure, which improves the current simple copper tube surrounding heat dissipation structure and can effectively improve the heat dissipation effect. Three heat dissipation frames with special structural shapes are arranged around the fan. The heat exchange can quickly and efficiently transfer the heat of the computer heat source device to the cooling fan, and the cooling fan can use high-speed rotation to discharge the airflow out of the computer. The heat is absorbed and taken away, and the heat is discharged by the fan. The invention also designs a heat dissipation fan adapted to it, and the heat dissipation blades can assist to quickly absorb and take away the heat, which can ensure the heat dissipation effect.

Description of drawings

1 is a schematic diagram of the installation arrangement of a computer heat dissipation structure of the present invention;

FIG. 2 is a schematic structural diagram of the heat dissipation and air outlet assembly according to the first embodiment of the present invention;

3 is a schematic structural diagram of a heat dissipation air outlet assembly according to Embodiment 2 of the present invention;

4 is a schematic structural diagram of a heat dissipation air outlet assembly according to Embodiment 3 of the present invention;

FIG. 5 is a schematic structural diagram of the heat dissipation and air outlet assembly according to the fourth embodiment of the present invention;

6 is a schematic cross-sectional structural schematic diagram of the front view of the heat absorbing assembly at the heat source device of the present invention;

Among them, 1, heat dissipation and air outlet components, 2, heat pipe, 3, heat absorption components, 4, heat dissipation frame one, 5, heat dissipation frame two, 6, heat dissipation frame three, 7, heat dissipation fan, 8, auxiliary heat dissipation column, 9, Auxiliary heat dissipation ball, 10, heat-absorbing and heat-conducting plate, 11, heat-conducting connecting column, 12, heat-absorbing and heat-conducting seat, 13, heat source device.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings. It should be understood, however, that the accompanying drawings are provided only for a better understanding of the present invention, and they should not be construed to limit the present invention.

As shown in Figures 1-6, the present invention provides a computer heat dissipation structure, which includes a heat dissipation air outlet assembly 1, a heat pipe 2 and a heat absorption assembly 3, wherein the heat absorption assembly 1 is arranged on the side of the heat source device 13 of the computer, The heat dissipation and air outlet assembly 1 is arranged at the heat dissipation hole of the computer, and the heat dissipation air outlet assembly 1 and the heat absorption assembly 3 are connected by a heat pipe 2. It is characterized in that, as shown in FIG. 2, the heat dissipation air outlet assembly is 1 includes a heat dissipation frame 4, a heat dissipation frame two 5 and a heat dissipation frame three 6, the heat dissipation frame one 4, the heat dissipation frame two 5 and the heat dissipation frame three 6 are all U-shaped structures, and the heat dissipation frame one 4 and the heat dissipation frame two 5 Symmetrically arranged on the U-shaped opening side of the third heat dissipation frame 6 , and the open ends of the first heat dissipation frame 4 and the second heat dissipation frame 5 are arranged opposite to the open side of the third heat dissipation frame 6 . The side elevation of the U-shaped structure is facing the middle axis of the bottom surface of the U-shaped structure of the first heat dissipation frame or the second heat dissipation frame 5, and the U-shaped structure of the second heat dissipation frame The side elevations of the side elevations and the side elevations of the U-shaped structure of the heat dissipation frame one 4 are shorter than the side elevations of the other side of the heat dissipation frame three 6. The heat dissipation frame one 4, the heat dissipation frame two 5 and A cooling fan 7 is arranged in the center of the area enclosed between the three cooling frames 6 .

Among them, in the first embodiment, in order to improve the heat dissipation effect of the cooling fan, the blades of the cooling fan are densely arranged, and the gap between two adjacent blades is smaller than the width of the blades, and the blades are made of copper. Made of alloy material, in this way, the heat conduction and heat dissipation effect of the heat dissipation blade can be enhanced, and the heat can be quickly dissipated.

As shown in FIG. 3 , as a second preferred embodiment, a plurality of auxiliary heat dissipation columns are provided on the outer side of the bottom surface opposite to the U-shaped opening of the U-shaped structure of the cooling frame 1 4 , the cooling frame 2 5 or the cooling frame 3 6 . 8. The end surface of the auxiliary heat dissipation column 8 is provided with an auxiliary heat dissipation ball 9. The diameter of the auxiliary heat dissipation ball 9 is larger than the diameter of the auxiliary heat dissipation column 8. The auxiliary heat dissipation ball 9 and the auxiliary heat dissipation column 8 are made of copper materials. The heat dissipation column and the heat dissipation ball can enhance the auxiliary heat dissipation and heat conduction effect and increase the area of the heat dissipation area.

As another more preferred embodiment 3, in order to further enhance the heat dissipation area, as shown in FIG. A column 8, the end surface of the auxiliary heat dissipation column 8 is provided with an auxiliary heat dissipation ball 9.

As another preferred fourth embodiment, in order to further enhance the heat dissipation area, as shown in FIG. 5 , the outer side of the side elevation of the U-shaped structure of the heat dissipation frame 3 6 is also provided with a plurality of auxiliary heat dissipation columns 8 , the end surface of the auxiliary heat dissipation column 8 is provided with an auxiliary heat dissipation ball 9 .

In this embodiment, in order to ensure the absorption, transfer, and heat dissipation of the heat of the computer heat source device, the heat-absorbing component includes a heat-absorbing and heat-conducting plate 10 , a heat-conducting connecting column 11 and a heat-absorbing and heat-conducting seat 12 , wherein the heat-absorbing and heat-conducting plate 10 It is arranged on one side of the heat source device 13 of the computer, the two ends of the heat-absorbing guide plate 10 are respectively connected with the heat-conducting connection posts 11, and the ends of the heat-conducting connection posts 11 are connected with heat-absorbing and heat-conducting bases 12, so The heat-absorbing and heat-conducting seat 12 is extended along the length direction of the computer heat source device 13 , and the outer surface of the heat-absorbing and heat-conducting seat is provided with an arc-shaped concave-convex structure.

In order to ensure the absorption and dissipation of the heat generated by the heat source device, the outer surface of the heat-absorbing and heat-conducting seat is a circular arc-shaped concave-convex structure so as to increase the heat-absorbing area. The cross section is a plum-shaped structure, of course, other shapes are also possible. In addition, in order to ensure the surface area and reduce the weight of the heat dissipation structure, the heat-absorbing and heat-conducting seat is a hollow structure.

The invention provides a computer heat dissipation structure, which improves the current simple copper tube surrounding heat dissipation structure and can effectively improve the heat dissipation effect. Three heat dissipation frames with special structural shapes are arranged around the fan. The heat exchange can quickly and efficiently transfer the heat of the computer heat source device to the cooling fan, and the cooling fan can use high-speed rotation to discharge the airflow out of the computer. The heat is absorbed and taken away, and the heat is discharged by the fan. The invention also designs a heat dissipation fan adapted to it, and the heat dissipation blades can assist to quickly absorb and take away the heat, which can ensure the heat dissipation effect.

The above embodiments are only used to illustrate the present invention, but not to limit the present invention. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all Equivalent technical solutions also belong to the scope of the present invention, and the patent protection scope of the present invention should be defined by the claims.

Claims (7)

1. A computer heat dissipation structure, which comprises a heat dissipation air outlet assembly, a heat pipe and a heat absorption assembly, wherein the heat absorption assembly is arranged on the heat source device side of the computer, and the heat dissipation air outlet assembly is arranged at the heat dissipation hole of the computer, so The heat-dissipating air-out assembly and the heat-absorbing assembly are connected by a heat-conducting pipe. The third frame is a U-shaped structure, the first and second heat dissipation frames are symmetrically arranged on the U-shaped opening side of the third heat dissipation frame, and the open ends of the first and second heat dissipation frames are connected with the third heat dissipation frame. The open sides of the heat dissipation frame 3 are opposite to each other, and the side elevation of the U-shaped structure of the heat dissipation frame 3 is facing the middle axis of the bottom surface of the U-shaped structure of the heat dissipation frame 1 or the heat dissipation frame 2. The U-shaped structure of the heat dissipation frame 2 The side elevation on the side close to the heat dissipation frame 3 and the side elevation on the side close to the heat dissipation frame 3 of the U-shaped structure of the heat dissipation frame 1 are both shorter than the side elevation on the other side of the heat dissipation frame 1. , A cooling fan is arranged in the center of the area enclosed between the second cooling frame and the third cooling frame; the blades of the cooling fan are densely arranged, and the gap between two adjacent blades is smaller than the width of the blades, so The blades are made of copper alloy material; a plurality of auxiliary heat dissipation columns are arranged on the outer side of the bottom surface of the U-shaped structure of the first heat dissipation frame, the second heat dissipation frame or the third heat dissipation frame, which is opposite to the U-shaped opening. The end surface is provided with an auxiliary heat dissipation ball, the diameter of the auxiliary heat dissipation ball is larger than that of the auxiliary heat dissipation column, and the auxiliary heat dissipation ball and the auxiliary heat dissipation column are both made of copper materials. 2 . The computer heat dissipation structure according to claim 1 , wherein the outer sides of the side elevations of the U-shaped structures of the first heat dissipation frame and the second heat dissipation frame are provided with a plurality of auxiliary heat dissipation columns. 3 . The end surfaces of the heat dissipation columns are provided with auxiliary heat dissipation balls. 3 . The computer heat dissipation structure according to claim 2 , wherein the outer side of the side elevation of the U-shaped structure of the heat dissipation frame 3 is also provided with a plurality of auxiliary heat dissipation columns, and the auxiliary heat dissipation The end face of the column is provided with auxiliary heat dissipation balls. 4 . The computer heat dissipation structure according to claim 1 , wherein the heat-absorbing component comprises a heat-absorbing and heat-conducting plate, a heat-conducting connecting column and a heat-absorbing and heat-conducting seat, wherein the heat-absorbing and heat-conducting plate is disposed on the computer. 5 . On one side of the heat source device, the two ends of the heat-absorbing conductive plate are respectively connected with the heat-conducting connection posts, and the ends of the heat-conducting connection posts are connected with heat-absorbing and heat-conducting seats, and the heat-absorbing and heat-conducting seats are arranged along the computer heat source. The device is extended in the length direction, and the outer surface of the heat-absorbing and heat-conducting seat is provided with an arc-shaped concave-convex structure. 5 . The computer heat dissipation structure according to claim 4 , wherein the outer surface of the heat-absorbing and heat-conducting seat is a circular arc-shaped concave-convex structure. 6 . 6 . The computer heat dissipation structure according to claim 5 , wherein the cross-section of the heat-absorbing and heat-conducting seat is a plum-shaped structure. 7 . 7 . The computer heat dissipation structure according to claim 6 , wherein the heat-absorbing and heat-conducting seat is a hollow structure. 8 .