CN107644717B - A kind of preparation method and application of anti-oxidant bonding brass wire - Google Patents
A kind of preparation method and application of anti-oxidant bonding brass wire Download PDFInfo
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Abstract
The invention discloses a kind of preparation method and applications of anti-oxidant bonding brass wire; the preparation method of the anti-oxidant bonding brass wire obtains copper liquid after first melting cathode copper; then molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid under the protection of inert gas, then obtain mixing copper liquid through magnetic agitation.Mixing copper liquid is then obtained into bonding copper ingot through crystallisation by cooling, drawing obtains the bonding brass wire that diameter is met the requirements repeatedly after calendering, and anticorrosive liquid finally is added dropwise on copper wire surface under inert gas protection, obtains finished product after dry.There is good antioxygenic property, mechanical strength and corrosion resistance using the anti-oxidant bonding brass wire that this method is prepared, and cost is relatively low, can satisfy the requirement of industry, has a good application prospect.Meanwhile the application the invention also discloses the copper wire obtained by this method in integrated circuits.
Description
Technical field
The present invention relates to metal material processing technical field, in particular to the preparation method of a kind of anti-oxidant bonding brass wire and
Using.
Background technique
Novel research and development material of the bonding brass wire as microelectronics industry, with its excellent mechanical property, electric property and low
Cost factor, successfully substitution bonding gold wire be applied to IC after road encapsulation in IC package bonding technology technology and equipment
Improvement, copper wire apply from low-end product such as DIP, SOP to middle and high end QFP, QFN, multilayer wire, small pitch pad product scope expand
Exhibition.Because the performance requirement of encapsulation procedure para-linkage copper wire steps up, copper wire manufacturer is promoted to copper wire processing performance to becoming
It is bordering on the development of spun gold processing performance, becomes the new material of substitution spun gold encapsulation.But current copper wire on due to itself
The easy to oxidize, reasons such as bonding technology is immature, the application in lsi package are restricted, and pass through micro- conjunction
It is more effective method that aurification, which improves bonding brass wire performance,.
Molybdenum is silvery white non-ferrous metal, and molybdenum atom radius is 0.14nm, atomic volume 235.5px/mol, ligancy 8, crystalline substance
Body is Az type body-centered cubic crystallographic system, and space group is Oh (lm3m).Alloy addition of the molybdenum as iron, contributes to form complete pearly-lustre
The matrix of body can improve the intensity and toughness of cast iron, improve the uniformity of heavy castings tissue, can also improve heat treating castings
Hardenability.The tool of grey cast-iron containing molybdenum has good wearability, and can make brake wheel and brake block of heavy vehicle etc..Molybdenum is mainly used for
Steel and iron industry, major part therein are to be directly used in steel-making or cast iron after industrial molybdenum oxide briquetting, and small part is smelted into molybdenum-iron
It is used further to make steel after molybdenum foil molybdenum foil.Molybdenum content in low-alloy steel is not more than 1%, but the consumption of this respect accounts for molybdenum and always disappears
50% or so of the amount of expense.Molybdenum is added in stainless steel, the corrosion resistance of steel can be improved.Molybdenum is added in cast iron, the strong of iron can be improved
Degree and wear-resisting property.Nickel based super alloy containing molybdenum 18% has fusing point height, density low and the characteristics such as coefficient of thermal expansion is small, for manufacturing
The various high temperature resistant components of aerospace.Metal molybdenum obtains extensively in terms of the electronic devices such as electron tube, transistor and rectifier
General application.
Bismuth is metal of the silvery white to pink, and the crisp easy crushing of matter, the chemical property of bismuth is more stable.Bismuth in nature with
The form of free metal and mineral exists.Mineral have bismuthine, bismite etc..Bismuth metal is by mineral at three oxidations two after calcining
Bismuth, then restore and obtain with carbon heat together, high purity bismuth can be made with pyro-refining and electrorefining.Pure bismuth is soft metal, no
Property is crisp when pure.Stablize under room temperature.Main ore is bismuthine (Bi2S3) and reddish brown bismuth stone (Bi2O5).Liquid bismuth has expansion when solidifying
Phenomenon.The conduction and thermal conductivity of bismuth are all poor.The selenides and tellurides of bismuth have semiconductor property.Bismuth is mainly for the manufacture of easy
Fusion gold, 47~262 DEG C of melting range, the most commonly used is the alloys of the metals such as the same lead of bismuth, tin, antimony, indium composition, fill for fire-fighting
It sets, the flame-arrester vent plug of automatic water sprayer, boiler.Add people's trace bismuth in steel, the processing performance of steel can be improved, malleable cast iron is added micro
Bismuth can make malleable cast iron have the performance of similar stainless steel.
Boron nitride is the crystal being made of nitrogen-atoms and boron atom.The boron and 56.4% that chemical composition is 43.6%
Nitrogen, there are four types of different variants for tool: hexagonal boron nitride (HBN), water chestnut side's boron nitride (RBN), cubic boron nitride (CBN) and buergerite
Boron nitride (WBN).Boron nitride has chemical resistance of concrete property, not by inorganic acid and water erosion.Boron nitrogen key is broken in hot concentrated alkali
It opens.1200 DEG C or more start to aoxidize in air.Fusing point starts to distil when being 3000 DEG C, slightly less than 3000 DEG C.Six side of boron nitride
Crystallographic system crystallization, most commonly graphite lattice, also have amorphous variant, other than hexagonal structure, there are also other crystal forms for boron carbide.
Its application mainly has: (1) lubricant of the release agent and metal wire-drawing of metal forming；(2) the special electrolysis of the condition of high temperature, resistance
Material；(3) high temperature solid lubricant squeezes antiwear additive, produces the additive of ceramic composite, refractory material and antioxygen
Change additive, the especially occasion of resist melt metal erosion, heat enhancing additive, insulating materials resistant to high temperature；(4) heat of transistor
Seal the additive of the polymer such as desiccant and plastic resin；(5) be pressed into boron nitride product of various shapes, can be used as high temperature,
High pressure, insulation, thermal component.
Phenolic resin is also bakelite, also known as phenolic moulding powder.There is particle, powdered.Weak acid resistant and weak base meet strong acid and occur to divide
Solution is met highly basic and is corroded.It is not soluble in water, it is dissolved in the organic solvents such as acetone, alcohol.Phenolic resin is often applied to some high
Warm field, such as refractory material, friction material, binder and casting industry.One, phenolic resin important application is exactly conduct
Binder.Phenolic resin be it is a kind of multi-functional, with various organic and inorganic filler can be compatible substance.Design is correct
Phenolic resin, wetting speed is especially fast.It and after cross-linking can be grinding tool, refractory material, friction material and phenolic moulding powder
Mechanical strength required for providing, heat resistance and electrical property.
Based on this research direction of bonding brass wire performance is improved by microalloying at present, a kind of novel bonded copper is developed
Silk is to enhance its inoxidizability, so that the large-scale application of bonding brass wire in integrated circuits be promoted just to be particularly important.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of preparation method of anti-oxidant bonding brass wire, the anti-oxidant key
The preparation method of conjunction copper wire obtains copper liquid after first melting cathode copper, then by molybdenum, bismuth, nitridation under the protection of protective gas
Boron, phenolic resin are added in copper liquid, then obtain mixing copper liquid through magnetic agitation.Then mixing copper liquid is obtained through crystallisation by cooling
Be bonded copper ingot, drawing obtains the bonding brass wire that diameter is met the requirements repeatedly after calendering, finally protective gas protection under
Anticorrosive liquid is added dropwise in copper wire surface, obtains finished product after dry.Have using the anti-oxidant bonding brass wire that this method is prepared good
Good antioxygenic property, mechanical strength and corrosion resistance, and cost is relatively low, can satisfy the requirement of industry, has good
Application prospect.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of preparation method of anti-oxidant bonding brass wire, comprising the following steps:
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050~1080 DEG C, and heat preservation obtains after being completely melt to cathode copper
To copper liquid, then to being passed through protective gas in copper liquid, while be added the molybdenum, 3.5wt% that account for copper liquid quality 6wt% bismuth,
Furnace temperature is risen to 3150~3180 DEG C immediately after the completion of addition by the phenolic resin of the boron nitride of 1.8wt%, 0.5wt%, is being continued
Magnetic agitation is carried out in the case where being passed through protective gas, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire is passed through in protective gas according to the speed of 2.5~3.5m/s, while with 3ml/min's
Speed drops evenly anticorrosive liquid to copper wire, obtains finished product after dry.
Preferably, in the step (1) and step (4), use protective gas for nitrogen, the flow of gas is 175L/h.
Preferably, in the step (1), the speed of magnetic agitation is 350r/min, mixing time 45min.
Preferably, in the step (4), anticorrosive liquid be polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate with
Manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%.
Preferably, in the step (4), drying process is specifically in vacuum oven in 70 DEG C of dry 12h.
It is a further object to provide the application of copper wire obtained by this preparation method in integrated circuits.
Compared with prior art, the present invention has the advantages that:
(1) molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid that bonding brass wire is prepared by the present invention, pass through
Generated synergistic effect between molybdenum, bismuth, boron nitride, phenolic resin and copper, can greatly improve the inoxidizability of copper wire itself
Can, while also improving the mechanical strength of copper wire.
(2) present invention using polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate be raw material carry out match be prepared into it is anti-
Corrosive liquid is applied behind bonding brass wire surface, and anticorrosion ability can be persistently played, and substantially increases copper wire product
Service life.
(3) simple process used in the preparation method of anti-oxidant bonding brass wire of the invention is suitable for heavy industrialization and uses,
It is practical.
Specific embodiment
The technical solution of invention is described in detail combined with specific embodiments below.
Embodiment 1
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
The bismuth of 3.5wt%, the boron nitride of 1.8wt%, 0.5wt% phenolic resin, addition after the completion of furnace temperature is risen to 3150 DEG C immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 2.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Embodiment 2
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
The bismuth of 3.5wt%, the boron nitride of 1.8wt%, 0.5wt% phenolic resin, addition after the completion of furnace temperature is risen to 3180 DEG C immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 1
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 3.5wt% bismuth,
Furnace temperature is risen to 3150 DEG C immediately after the completion of addition, is being continually fed into nitrogen by the phenolic resin of the boron nitride of 1.8wt%, 0.5wt%
Magnetic agitation is carried out in the case where gas, the speed of magnetic agitation is 350r/min, and mixing time 45min obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 2.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 2
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
Furnace temperature is risen to 3150 DEG C immediately after the completion of addition, is being continually fed into nitrogen by the phenolic resin of the boron nitride of 1.8wt%, 0.5wt%
Magnetic agitation is carried out in the case where gas, the speed of magnetic agitation is 350r/min, and mixing time 45min obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 3
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
Furnace temperature is risen to 3180 DEG C immediately after the completion of addition, is being continually fed into nitrogen by the phenolic resin of the bismuth of 3.5wt%, 0.5wt%
In the case of carry out magnetic agitation, the speed of magnetic agitation is 350r/min, and mixing time 45min obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 4
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
Furnace temperature is risen to 3180 DEG C immediately after the completion of addition, in the feelings for being continually fed into nitrogen by the boron nitride of the bismuth of 3.5wt%, 1.8wt%
Magnetic agitation is carried out under condition, the speed of magnetic agitation is 350r/min, and mixing time 45min obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 5
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
The bismuth of 3.5wt%, the boron nitride of 1.8wt%, 0.5wt% phenolic resin, addition after the completion of furnace temperature is risen to 3150 DEG C immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 2.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polyacrylate, citric acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 6
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
The bismuth of 3.5wt%, the boron nitride of 1.8wt%, 0.5wt% phenolic resin, addition after the completion of furnace temperature is risen to 3180 DEG C immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, and anticorrosive liquid is polytetrafluoroethylene (PTFE), tannic acid, sodium potassium tartrate tetrahydrate, sulphur
Sour indium is with manufactured aqueous solution after the weight ratio mixing of 7:4:3:1, concentration 0.5%, in 70 DEG C of dryings in vacuum oven
Finished product is obtained after 12h.
Comparative example 7
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid, then to nitrogen is passed through in copper liquid, the flow of gas is 175L/h, at the same be added account for copper liquid quality 6wt% molybdenum,
The bismuth of 3.5wt%, the boron nitride of 1.8wt%, 0.5wt% phenolic resin, addition after the completion of furnace temperature is risen to 3180 DEG C immediately,
Carrying out magnetic agitation in the case where being continually fed into nitrogen, the speed of magnetic agitation is 350r/min, mixing time 45min,
Copper liquid must be mixed；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then using cooling water into
Row cooling makes mixing copper liquid crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, works as bonded copper
When silk diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire being passed through in nitrogen according to the speed of 3.5m/s, the flow of gas is 175L/h, while with
The speed of 3ml/min drops evenly anticorrosive liquid to copper wire, anticorrosive liquid be polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate with
Manufactured aqueous solution after the weight ratio mixing of 7:4:3, concentration 0.5% obtain after 70 DEG C of dry 12h in vacuum oven
Finished product.
The anti-oxidant bonding brass wire as made from the preparation method of embodiment 1-2 and comparative example 1-7 is aoxidized respectively
Thickness degree (being tested after placing 120h in the environment of 25 DEG C of Yu Wendu, humidity 70%), tensile property, hydrochloric acid, polysulfide test
This several performance tests, resulting test result are shown in Table 1, it is seen that each raw material used in the present invention has not copper wire overall performance
The influence that can or lack.
Table 1
The preparation method of anti-oxidant bonding brass wire according to the present invention obtains copper liquid after first melting cathode copper, then exists
Molybdenum, bismuth, boron nitride, phenolic resin are added in copper liquid under the protection of protective gas, then obtain mixed copper through magnetic agitation
Liquid.Mixing copper liquid is then obtained into bonding copper ingot through crystallisation by cooling, drawing obtains what diameter was met the requirements repeatedly after calendering
Bonding brass wire is finally added dropwise anticorrosive liquid on copper wire surface under protective gas protection, obtains finished product after dry.Utilize this method
The anti-oxidant bonding brass wire being prepared have good antioxygenic property, mechanical strength and corrosion resistance, and cost compared with
It is low, it can satisfy the requirement of industry, have a good application prospect.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of preparation method of anti-oxidant bonding brass wire, which comprises the following steps:
(1) cathode copper is placed in smelting furnace, furnace temperature rises to 1050~1080 DEG C, and heat preservation obtains copper after being completely melt to cathode copper
Liquid then to being passed through protective gas in copper liquid, while being added and accounting for the molybdenum of copper liquid quality 6wt%, the bismuth of 3.5wt%, 1.8wt%
Furnace temperature is risen to 3150~3180 DEG C immediately after the completion of addition by the phenolic resin of boron nitride, 0.5wt%, is being continually fed into protection
Magnetic agitation is carried out in the case where gas, obtains mixing copper liquid；
(2) mixing copper liquid is released by melting outlet of still, flows into crystallization groove by diversion trench, then carried out using cooling water cold
But, mixing copper liquid is made to crystallize into bonding copper ingot；
(3) bonding copper ingot is subjected to after rolling drawing repeatedly, gradually reduces gained bonding brass wire diameter, when bonding brass wire is straight
When diameter is less than 0.05mm, stop drawing；
(4) gained bonding brass wire is passed through in protective gas according to the speed of 2.5~3.5m/s, while with the speed of 3ml/min
Anticorrosive liquid is dropped evenly to copper wire, obtains finished product after dry.
2. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that: the step (1) and step
In (4), use protective gas for nitrogen, the flow of gas is 175L/h suddenly.
3. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that: in the step (1), magnetic
The speed of power stirring is 350r/min, mixing time 45min.
4. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that: in the step (4), resist
Corrosive liquid is polyacrylate, tannic acid, sodium potassium tartrate tetrahydrate, indium sulfate with manufactured water-soluble after the weight ratio mixing of 7:4:3:1
Liquid, concentration 0.5%.
5. the preparation method of anti-oxidant bonding brass wire according to claim 1, it is characterised in that: in the step (4), do
Dry operation is specifically in vacuum oven in 70 DEG C of dry 12h.
6. the application of copper wire in integrated circuits obtained by the described in any item preparation methods of Claims 1 to 5.
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| DE102005028951B4 (en) * | 2005-06-22 | 2018-05-30 | Infineon Technologies Ag | Arrangement for the electrical connection of a semiconductor circuit arrangement with an external contact device |
| CN100421246C (en) * | 2006-11-03 | 2008-09-24 | 宁波康强电子股份有限公司 | Bonding copper wire and its preparation method |
| CN104818404A (en) * | 2015-04-22 | 2015-08-05 | 苏州劲元油压机械有限公司 | Corrosion-resistant copper wire for oil filter screen and manufacturing process thereof |
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2017
- 2017-09-18 CN CN201710840045.3A patent/CN107644717B/en active Active
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