CN107734216A - Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module - Google Patents
Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module Download PDFInfo
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- CN107734216A CN107734216A CN201610669214.7A CN201610669214A CN107734216A CN 107734216 A CN107734216 A CN 107734216A CN 201610669214 A CN201610669214 A CN 201610669214A CN 107734216 A CN107734216 A CN 107734216A
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- wiring board
- chip
- photo
- connecting portion
- sensitive cell
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- 238000000465 moulding Methods 0.000 title claims abstract description 224
- 238000004519 manufacturing process Methods 0.000 title abstract description 48
- 238000000034 method Methods 0.000 title abstract description 38
- 230000003287 optical effect Effects 0.000 claims abstract description 97
- 238000007493 shaping process Methods 0.000 claims abstract description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005253 cladding Methods 0.000 claims description 22
- 238000001914 filtration Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 67
- 238000005516 engineering process Methods 0.000 description 37
- 239000003292 glue Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 239000011265 semifinished product Substances 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000004313 glare Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The present invention provides an array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module, wherein the molding photosensory assembly includes an at least supporting member, at least a wiring board, at least at least two photo-sensitive cells, two groups of leads and a molded base.Each photo-sensitive cell is mounted on the chip attachment region of each wiring board respectively, the both ends of lead described in every group are connected to the chip contacts of each photo-sensitive cell and the wiring board connector of each wiring board respectively, the module pedestal includes a molded body and has at least two optical windows, when the molded body is molded, the supporting member protects the lead, the wiring board and the photo-sensitive cell, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base.
Description
Technical field
The present invention relates to optical imaging field, more particularly to an array camera module and its molding photosensory assembly and manufacturer
Method and the electronic equipment with array camera module.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical field etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts
More and more stricter is required to the size of camera module, harsher especially is required to the height dimension of camera module.In addition, by
The requirement of the function and user of the portable electric appts of camera module for the image quality of camera module is configured also to get over
Come higher, in this case, array camera module starts to occur.Array camera module includes at least two sets of imaging systems, often
Cover imaging system includes a photo-sensitive cell and the optical lens in a photosensitive path for being arranged at photo-sensitive cell respectively, with tool
The single-lens camera module for having identical image quality is compared, and array camera module can have smaller height dimension, therefore,
Configuration array camera module is electronic equipment in development trend important from now on lightening portable electric appts.
Similar with single-lens camera module, the raising of the imaging capability of array camera module is equally built upon takes the photograph for array
As basis of the module configuration with the passive electronic component such as the more photo-sensitive cell of big imaging area and more driving resistance, electric capacity
On, just because of array camera module needs to be configured with the more photo-sensitive cell of big imaging area and greater number of passive electronics
Component, it is desirable to which array camera module is merely able to by way of improving packaging technology further reduce array shooting mould
The size of group.The encapsulation of present array camera module generally uses COB (Chip On Board) packaging technology, that is to say, that battle array
Wiring board, photo-sensitive cell, microscope base, optical lens, driver or microscope base of row camera module etc. are respectively prepared, and then successively will
Optical lens in the circuit board, is assembled in driver or microscope base by passive electronic component, photo-sensitive cell and microscope base encapsulation, and
And driver or mirror seat set are loaded on microscope base, so that optical lens is maintained on the photosensitive path of photo-sensitive cell, so as to
Form array camera module.In order to ensure the image quality of array camera module, it is necessary to fill glue between each two part,
Such as need to fill glue between microscope base and wiring board so that microscope base to be encapsulated in the circuit board, and microscope base is realized by glue
With the leveling of wiring board.This also causes the size of the array camera module encapsulated by COB packaging technologies not subtracted effectively
It is few, and the packaging efficiency of the array camera module of COB packaging technologies is used than relatively low.
In order to solve this problem, moulding technology is introduced into the manufacturing field of camera module, and moulding technology allows array to take the photograph
, can not only be effective by such mode as module makes microscope base integrally formed in the circuit board during being produced
Ground reduces the size of array camera module, but also can reduce the assembly error of array camera module, so as to improve the battle array
The image quality of row camera module.Nevertheless, the manufacturing field that moulding technology is introduced directly into camera module remains
The defects of a lot.
First, each photo-sensitive cell of array camera module is mounted on wiring board and electrically connects photo-sensitive cell by lead
And wiring board, in the case of, lead both ends can be respectively welded in the non-photo-sensing region of photo-sensitive cell and the marginal zone of wiring board
Domain, and be limited to the attribute of routing technique and lead in itself, the both ends of lead after photo-sensitive cell and wiring board is welded in,
Its is upward to be higher by the upper surface of photo-sensitive cell.When carrying out molding process to array camera module by moulding technology,
The stitching surface of the mold of mould can contact with the ledge of lead and cause lead compression situation about deforming occur,
And deformed when lead is carrying out moulding technology, after the mold of mould is removed, lead also is difficult to recover
To original state.Secondly, it is added into the molding space of mould when for forming the moulding material of microscope base and is being molded
When microscope base is formed by curing in space, the lead of deformation is covered by the inside of microscope base and keeps state after deformation, and deforms
Lead the ability of electric signal is transmitted between photo-sensitive cell and wiring board can significantly reduce so as to camera module
Imaging capability and imaging efficiency cause bigger influence.What is more important, when lead is squeezed by the stitching surface of mold
When pressing and being deformed, the deformation direction and deformation extent of lead are uncontrollable, and therefore, adjacent lead after deformation may
Occur and contact with each other and cause short circuit, and then cause the product fraction defective of camera module to increase.In addition, pasted in photo-sensitive cell
After wiring board, gap, in moulding process, the moulding material of flow-like can be produced between photo-sensitive cell and wiring board
The gap formed between photo-sensitive cell and wiring board can be entered, so that causing the attaching relation quilt of photo-sensitive cell and wiring board
Change, and necessarily cause the inclination of photo-sensitive cell if the attaching relation of photo-sensitive cell and wiring board is changed, so that shadow
Ring the image quality of array camera module.
The content of the invention
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the molding photosensory assembly provides a supporting member, to carry out molding work
During skill, the supporting member be used for prevent the mould stitching surface apply pressure to it is described molding photosensory assembly lead, with
Prevent the lead deformation.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein when carrying out moulding technology, the mold of the mould and lower mould
Matched moulds and contact the stitching surface of the mold and the top surface of the supporting member, now, the supporting member props up upwards
The mold is supportted, to avoid the stitching surface of the mold from directly applying pressure to the lead, so as to prevent the lead to be pressurized
And deform.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein when carrying out moulding technology, the mold of the mould and lower mould
Matched moulds and contact the stitching surface of the mold and the top surface of the supporting member, now, the supporting member props up upwards
The mold is supportted, to reserve safe distance between the stitching surface of the lead and the mold, so as to avoid on described
The stitching surface of mould directly contacts the lead.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by flexible material, so that the supporting
The stitching surface that element can absorb the mold contacts impulsive force caused by the top surface of the supporting member, so as to avoid
Photo-sensitive cell, the circuit of the molding photosensory assembly are damaged when the mold of the mould and the lower mould matched moulds
Plate, electronic component and the lead.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by flexible material, with the mould on described
The stitching surface of tool apply pressure to the supporting member top surface when, the top surface of the supporting member can be by producing deformation
Mode avoids producing gap between the top surface of the supporting member and the stitching surface of the mold, so as in the molding
During the molded base shaping of photosensory assembly, the phenomenon for " overlap " occur in an optical window position of the molded base is avoided, is entered
And advantageously ensure that the image quality of yield and the guarantee array camera module of the array camera module when being packaged.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by flexible material, with the mould on described
The stitching surface of tool apply pressure to the supporting member top surface when, the top surface of the supporting member can be by producing deformation
Mode avoids producing gap between the top surface of the supporting member and the stitching surface of the mold, so that the photosensitive member
The photosensitive region of part is in a sealed environment, so as to avoid the moulding material for forming the molded base from entering the sealing
Environment and the photosensitive region for polluting the photo-sensitive cell.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by hard material, when carrying out moulding technology,
The stitching surface of the mold overlappingly sets a cover layer, when the stitching surface of the mold applies pressure to the supporting member
During top surface, the cover layer is between the stitching surface of the mold and the top surface of the supporting member, so as to described
Cover layer can prevent to damage the photo-sensitive cell, the wiring board, the electricity when mold and the lower mould matched moulds
Sub- component and the lead.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by hard material, when carrying out moulding technology,
The stitching surface of the mold overlappingly sets the cover layer, with the stitching surface in the mold apply pressure to it is described supporting member
During the top surface of part, the cover layer makes the photosensitive region of the photo-sensitive cell be in the sealed environment, described so as to avoid
Moulding material enters the sealed environment and pollutes the photosensitive region of the photo-sensitive cell.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is formed by hard material, when carrying out moulding technology,
The stitching surface of the mold overlappingly sets the cover layer, with the stitching surface in the mold apply pressure to it is described supporting member
During the top surface of part, the supporting member will not be deformed, so as to avoid the lead from producing deformation to protect the lead
It is good electrical.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats the non-photo-sensing region of the photo-sensitive cell at least
A part, with when carrying out moulding technology, the supporting member moulding material can be prevented by the supporting member and
The contact position in the non-photo-sensing region of the photo-sensitive cell enters the sealed environment and pollutes the photosensitive area of the photo-sensitive cell
Domain.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats the chip contacts of the photo-sensitive cell and described
The link position of the wiring board connector and the lead of the link position of lead and the wiring board, so as to carry out molding work
During skill, the supporting member isolates each link position and the moulding material, so that each link position is more reliable.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats a part for the fringe region of the wiring board,
So as to which when carrying out moulding technology, the supporting member can stop that the moulding material of flow-like impacts the lead.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats a part for the fringe region of the wiring board,
So that photosensitive region of the supporting member away from the photo-sensitive cell, during being molded in the supporting member, is used
The photosensitive region of the photo-sensitive cell will not be polluted in the material for forming the supporting member, to avoid the photo-sensitive cell from occurring
The situation of dirty bad point.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats one of the fringe region of the wiring board simultaneously
Divide at least a portion with the non-photo-sensing region of the photo-sensitive cell, with the fixation wiring board and the photo-sensitive cell, so that
In the mold and the lower mould matched moulds and the moulding material be added into be formed the mold and it is described under
During a molding space between mould, the supporting member can coat the photo-sensitive cell and the wiring board does not shift.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats one of the fringe region of the wiring board simultaneously
Divide at least a portion with the non-photo-sensing region of the photo-sensitive cell, so that when carrying out moulding technology, the supporting member can
The moulding material is prevented to enter between the photo-sensitive cell and the wiring board.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats at least a portion of the lead, to carry out
During moulding technology, the supporting member makes the lead be maintained at optimum state, to ensure that the lead has well electrical.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats at least a portion of the lead, with follow-up
During using the array camera module, veiling glare can be avoided to be produced in the inside of the array camera module and influence the battle array
The image quality of row camera module.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member have viscosity, with the molded base shaping before,
The supporting member can be adhered to the attachment electronic component in the pollutant such as welding powder caused by the wiring board, to prevent
Only the photosensitive region of photo-sensitive cell described in these contaminants and there is dirty bad point.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the top surface of the supporting member connects higher than the chip of the photo-sensitive cell
Part, so that when carrying out moulding technology, the chip contacts of the photo-sensitive cell will not be damaged.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member coats the chip contacts of the photo-sensitive cell, with
When carrying out moulding technology, the moulding material is avoided to contact the chip contacts of the photo-sensitive cell, it is described photosensitive so as to coat
The chip contacts of element.Similarly, the supporting member can avoid the circuit of the moulding material contact wiring board
Plate connector, so as to protect the wiring board connector of the wiring board.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the supporting member is arranged on the chip contacts of the photo-sensitive cell
Outside, when carrying out moulding technology, to avoid the moulding material from contacting the chip contacts of the photo-sensitive cell, so as to coat
The chip contacts of the photo-sensitive cell.Similarly, the supporting member can avoid the moulding material from contacting the circuit
The wiring board connector of plate, so as to protect the wiring board connector of the wiring board.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the array camera module provides a support, the support has at least two
Installation passage, driver or microscope base for assembling the optical lens are assembled in each peace of the support respectively
Passage is filled, to keep the axiality of each optical lens by the support.
It is an object of the present invention to provide an array camera module and its molding photosensory assembly and manufacture method and
Electronic equipment with array camera module, wherein the array camera module provides an at least filter element, the member that filters
Part is maintained between the photo-sensitive cell and the optical lens, and the filter element is used to filter to enter from the optical lens
Enter the veiling glare of the inside of the array camera module, for improving the image quality of the array camera module.
One side under this invention, the present invention provide a molding photosensory assembly, and it includes：
At least supporting member formed by first medium；
An at least wiring board, wherein each wiring board has an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each photo-sensitive cell is mounted on each institute of each wiring board respectively
State chip attachment region；
At least two groups of leads, wherein the both ends of lead described in every group are connected to the chip of each photo-sensitive cell respectively
The wiring board connector of connector and each wiring board；And
The molded base formed by second medium, wherein the module pedestal includes a molded body and with least two
Optical window, wherein when the molded body is molded, the supporting member protects lead, the wiring board and the photosensitive member
Part, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and
And the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base.
According to one embodiment of present invention, the molding photosensory assembly is including described in two supporting members, one
Lead described in wiring board, two photo-sensitive cells and two groups, and the wiring board has two chip attachment areas
Domain.
According to one embodiment of present invention, the molding photosensory assembly is including described in two supporting members, two
Lead described in wiring board, two photo-sensitive cells and two groups, and each wiring board has a core respectively
Piece pasting area.
According to one embodiment of present invention, the molding photosensory assembly further comprises an at least electronic component, its
Described in wiring board there is a fringe region, the fringe region and the chip attachment region are integrally formed, each described
Electronic component is mounted on the fringe region respectively, wherein the supporting member is located at the appliance component and the sense
Between the photosensitive region of optical element.
According to one embodiment of present invention, the supporting member includes the supporting main body of a frame shape and has a through hole,
The supporting main body is arranged at the outside of the photosensitive region of the photo-sensitive cell, the photosensitive area of the photo-sensitive cell
Domain corresponds to the through hole, wherein a part for the molded body cladding supporting main body.
According to one embodiment of present invention, the supporting main body has a top surface, a medial surface and a lateral surface,
The top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, and the medial surface forms described
Through hole, wherein the lateral surface of the molded body cladding supporting main body.
According to one embodiment of present invention, the supporting main body has a top surface, a medial surface and a lateral surface,
The top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, and the medial surface forms described
Through hole, wherein at least a portion of the lateral surface of the molded body cladding supporting main body and the top surface.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
The chip inside portion at least a portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
The chip connecting portion at least a portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
The chip outside portion at least a portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
At least a portion of the chip inside portion and at least a portion of the chip connecting portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
At least a portion of the chip connecting portion and at least a portion of the chip outside portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the supporting main body coats the photo-sensitive cell
The chip inside portion at least a portion, the chip connecting portion and at least a portion of the chip outside portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat at least a portion of the wiring board inside portion of the wiring board.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat at least a portion of the wiring board connecting portion of the wiring board.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat a part for the wiring board outside portion of the wiring board.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat at least a portion of the wiring board inside portion of the wiring board and at least a portion of the wiring board connecting portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat at least a portion of the wiring board connecting portion of the wiring board and a part for the wiring board outside portion.
According to one embodiment of present invention, the fringe region of the wiring board includes a wiring board inside portion, one
Wiring board connecting portion and a wiring board outside portion, the wiring board connector is arranged at the wiring board connecting portion, described
Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body
Coat on the outside of at least a portion, the wiring board connecting portion and the wiring board of the wiring board inside portion of the wiring board
The part in portion.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the fringe region of the wiring board includes
One wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at described
Wiring board connecting portion, the wiring board inside portion and the wiring board outside portion are located at the two of the wiring board connecting portion respectively
Side, wherein the supporting main body coats at least a portion of the wiring board inside portion of the wiring board and the photosensitive member
At least a portion of the chip outside portion of part.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the fringe region of the wiring board includes
One wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at described
Wiring board connecting portion, the wiring board inside portion and the wiring board outside portion are located at the two of the wiring board connecting portion respectively
Side, wherein the supporting main body coat the wiring board the wiring board inside portion and the wiring board connecting portion at least one
Part and at least a portion of the chip outside portion of the photo-sensitive cell.
According to one embodiment of present invention, the non-photo-sensing region of the photo-sensitive cell includes a chip inside portion, a core
Piece connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, the chip inside portion
It is located at the both sides of the chip connecting portion respectively with the chip outside portion, wherein the fringe region of the wiring board includes
One wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at described
Wiring board connecting portion, the wiring board inside portion and the wiring board outside portion are located at the two of the wiring board connecting portion respectively
Side, wherein the supporting main body coats the wiring board inside portion, the wiring board connecting portion and the line of the wiring board
A part for road plate outside portion and at least a portion of the chip outside portion of the photo-sensitive cell.
According to one embodiment of present invention, the chip that the supporting main body further coats the photo-sensitive cell connects
At least a portion of socket part.
According to one embodiment of present invention, the supporting main body is further coated in the chip of the photo-sensitive cell
At least a portion of sidepiece.
Other side under this invention, the present invention further provides an array camera module, and it includes：
At least two optical lens；And
One molding photosensory assembly, wherein the molding photosensory assembly further comprises：
At least supporting member formed by first medium；
An at least wiring board, wherein each wiring board has an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each photo-sensitive cell is mounted on each institute of each wiring board respectively
State chip attachment region；
At least two groups of leads, wherein the both ends of lead described in every group are connected to the chip of each photo-sensitive cell respectively
The wiring board connector of connector and each wiring board；And
The molded base formed by second medium, wherein the module pedestal includes a molded body and with least two
Optical window, wherein when the molded body is molded, the supporting member protects lead, the wiring board and the photosensitive member
Part, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and
And the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base, each optics
Camera lens is arranged at the photosensitive path of each photo-sensitive cell respectively, using by the optical window as the optical lens and described
Photo-sensitive cell provides a passage of light.
According to one embodiment of present invention, the array camera module further comprises at least two drivers, wherein often
The individual optical lens is assembled in each driver respectively, and each driver is assembled in the molding master respectively
The top surface of body.
According to one embodiment of present invention, the array camera module further comprises an at least driver and at least one
Lens barrel, each optical lens are assembled in each driver and each lens barrel respectively, wherein each drive
Dynamic device and each lens barrel are located at the diverse location of the top surface of the molded body respectively.
According to one embodiment of present invention, the array camera module further comprises at least two lens barrels, wherein each
The lens barrel is integrally formed in the top surface of the molded body respectively, and each optical lens is assembled in each respectively
The lens barrel；Or further comprising at least two lens barrels, lens barrel described in wherein at least one is integrally formed in the molding master
The top surface of body, the other lens barrel are mounted on the top surface of the molded body, each optical lens respectively by
It is assembled in each lens barrel；Or two mirrors of top surface of the array camera module including being mounted on the molded body
Cylinder, each optical lens are assembled in each lens barrel respectively.
According to one embodiment of present invention, the array camera module further comprises an at least filter element, wherein
Each filter element is assembled in the top surface of the molded body respectively, so that each filter element is maintained at
Between each optical lens and each photo-sensitive cell.
According to one embodiment of present invention, the top surface of the molded body has at least two inner surfaces and an outside
Surface, wherein each filter element is assembled in each inner surface of the molded body respectively, it is each described
Driver is assembled in the diverse location of the outer surface of the molded body respectively.
According to one embodiment of present invention, the plane where the inner surface of the molded body is outer less than described
Plane where side surface, to form an at least groove for the molded body, wherein each filter element is located at respectively
Each groove.
According to one embodiment of present invention, the supporting member includes the supporting main body of a frame shape and has a through hole,
The supporting main body is arranged at the outside of the photosensitive region of the photo-sensitive cell, the photosensitive area of the photo-sensitive cell
Domain corresponds to the through hole, wherein a part for the molded body cladding supporting main body.
According to one embodiment of present invention, the supporting main body coats a part for the fringe region of the wiring board.
According to one embodiment of present invention, the supporting main body coats the non-photo-sensing region of the photo-sensitive cell at least
A part.
According to one embodiment of present invention, one for supporting main body and coating the fringe region of the wiring board simultaneously
Divide at least a portion with the non-photo-sensing region of the photo-sensitive cell.
According to one embodiment of present invention, the array camera module further comprises an at least supporter and at least one
Filter element, wherein each filter element is assembled in each supporter, each supporter is assembled respectively
In the top surface of the molded body, so that each filter element is maintained at each optical lens and each described
Between photo-sensitive cell.
Other side under this invention, the present invention further provides an electronic equipment, and it includes：
One electronic equipment body；With
An array camera module, wherein the array camera module is arranged at the electronic equipment body, for obtaining
Image is taken, wherein the array camera module further comprises：
At least two optical lens；And
One molding photosensory assembly, wherein the molding photosensory assembly further comprises：
At least supporting member formed by first medium；
An at least wiring board, wherein each wiring board has an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each photo-sensitive cell is mounted on each institute of each wiring board respectively
State chip attachment region；
At least two groups of leads, wherein the both ends of lead described in every group are connected to the chip of each photo-sensitive cell respectively
The wiring board connector of connector and each wiring board；And
The molded base formed by second medium, wherein the module pedestal includes a molded body and with least two
Optical window, wherein when the molded body is molded, the supporting member protects lead, the wiring board and the photosensitive member
Part, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and
And the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base, each optics
Camera lens is arranged at the photosensitive path of each photo-sensitive cell respectively, using by the optical window as the optical lens and described
Photo-sensitive cell provides a passage of light.
Other side under this invention, the present invention further provides the manufacture method of a molding photosensory assembly, wherein institute
Manufacture method is stated to comprise the following steps：
(a) at least two photo-sensitive cells and an at least wiring board are connected by one group of lead；
(b) each photo-sensitive cell and each wiring board are positioned over to a mold or one for a molding tool
Lower mould；
(c) during the mold and the lower mould matched moulds, institute is supported by an at least supporting member upwards
Mold is stated, to prevent the stitching surface of the mold from applying pressure to lead described in every group；And
(d) forming material of flow-like is added into the molding space formed between the mold and the lower mould
Material, to form a molded base after the mold material cures, wherein the molded base includes a molded body and had
At least two optical windows a, wherein part for the fringe region of each wiring board of molded body cladding and the supporting member
At least a portion, the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window.
Brief description of the drawings
Fig. 1 is that the perspective cross-sectional of one of the manufacturing step of an array camera module of a preferred embodiment under this invention shows
It is intended to, wherein the photo-sensitive cell of the array camera module is mounted on the chip attachment region of wiring board, and the photosensitive member
The chip contacts of part are connected with the wiring board connector of the wiring board by one group of lead, wherein the wiring board is one
Formula wiring board.
Fig. 2 is that two solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein the non-photo-sensing region for coating the photo-sensitive cell is set in a supporting main body of the array camera module
At least partially, photosensory assembly semi-finished product are molded to form one.
Fig. 3 A are three solids of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention
Schematic cross-sectional view, wherein it is described molding photosensory assembly semi-finished product be placed on a molding tool a mold and once mould it
Between, and the stitching surface of the mold contacts with the top surface of the supporting main body.
Fig. 3 B are one of the three of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention
The perspective cross-sectional schematic diagram of variant embodiment, wherein the stitching surface in the mold sets a cover layer, with described
The stitching surface of mould apply pressure to it is described supporting main body top surface when, the cover layer is located at stitching surface and the institute of the mold
Between the top surface for stating supporting main body.
Fig. 4 is that four solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein moulding material is added into the molding space to be formed between the mold and the lower mould.
Fig. 5 is that five solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein forming a molding photosensory assembly of the array camera module after the mold material cures.
Fig. 6 is that six solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein a filter element of the array camera module is assembled in the top surface of the molded base.
Fig. 7 is that seven solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein an optical lens of the array camera module is assembled in a driver, the driver is assembled in
The top surface of the module pedestal.
Fig. 8 is that eight solid of the manufacturing step of the array camera module of above-mentioned preferred embodiment under this invention is cutd open
Depending on schematic diagram, wherein each installation that each driver is installed in a support of the array camera module respectively is empty
Between, to form the array camera module.
Fig. 9 is the schematic perspective view of the array camera module of above-mentioned preferred embodiment under this invention.
Figure 10 is first variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention
Schematic perspective view.
Figure 11 is second variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention
Perspective cross-sectional schematic diagram.
Figure 12 is the 3rd variant embodiment of the array camera module of above-mentioned preferred embodiment under this invention
Perspective cross-sectional schematic diagram.
Figure 13 A are the 4th variant embodiments of the array camera module of above-mentioned preferred embodiment under this invention
Perspective cross-sectional schematic diagram.
Figure 13 B are the 5th variant embodiments of the array camera module of above-mentioned preferred embodiment under this invention
Perspective cross-sectional schematic diagram.
Figure 14 A are the molding photosensory assemblies half of the array camera module of above-mentioned preferred embodiment under this invention
The schematic perspective view of first variant embodiment of finished product, wherein the supporting main body coats the fringe region of the wiring board
At least a portion and chip outside portion in non-photo-sensing region of the photo-sensitive cell, chip connecting portion and chip inside portion
At least partially.
Figure 14 B are the molding photosensory assemblies half of the array camera module of above-mentioned preferred embodiment under this invention
The schematic perspective view of second variant embodiment of finished product, wherein the supporting main body coats the fringe region of the wiring board
At least a portion and the photo-sensitive cell the chip outside portion in non-photo-sensing region and at least a portion of chip connecting portion.
Figure 14 C are the molding photosensory assemblies half of the array camera module of above-mentioned preferred embodiment under this invention
The schematic perspective view of 3rd variant embodiment of finished product, wherein the supporting main body coats the fringe region of the wiring board
At least a portion and the photo-sensitive cell non-photo-sensing region chip outside portion at least a portion.
Figure 14 D are the molding photosensory assemblies half of the array camera module of above-mentioned preferred embodiment under this invention
The schematic perspective view of 4th variant embodiment of finished product, wherein the supporting main body coats the fringe region of the wiring board
At least a portion.
Figure 14 E are the molding photosensory assemblies half of the array camera module of above-mentioned preferred embodiment under this invention
The schematic perspective view of 5th variant embodiment of finished product, wherein the supporting main body coats the fringe region of the wiring board
At least a portion.
Figure 15 is the molding photosensory assembly of the array camera module of above-mentioned preferred embodiment under this invention
The sectional view of one variant embodiment, wherein the lateral surface of the molded base cladding supporting main body.
Figure 16 is the perspective cross-sectional schematic diagram of an array camera module of another preferred embodiment under this invention.
Figure 17 is the perspective cross-sectional schematic diagram of an array camera module of another preferred embodiment under this invention.
Figure 18 is the perspective cross-sectional schematic diagram of an array camera module of another preferred embodiment under this invention.Figure 19 is
The schematic diagram of the electronic equipment of the array camera module of above-mentioned preferred embodiment with the present invention.
Embodiment
Describe to be used to disclose the present invention below so that those skilled in the art can realize the present invention.It is excellent in describing below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Define in the following description
General principle of the invention can apply to other embodiments, deformation program, improvement project, equivalent and do not carry on the back
From the other technologies scheme of the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", " on ",
" under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close
System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of the description present invention and simplifies description, without referring to
Show or imply that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, therefore above-mentioned art
Language is not considered as limiting the invention.
It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no
It is understood that as the limitation to quantity.
With reference to Fig. 1 to Fig. 9 of the Figure of description of the present invention, the array camera module of a preferred embodiment under this invention
It is elucidated with, wherein the array camera module includes at least two optical lens 10 and a molding photosensory assembly 20, wherein the mould
Modeling photosensory assembly 20 further comprises that at least two photo-sensitive cells 21, a wiring board 22, a molded base 23 and at least two groups draw
Line 24.
Each photo-sensitive cell 21 includes one group of chip contacts 211, a photosensitive region 212 and a non-photo-sensing respectively
Region 213, wherein the photosensitive region 212 and the non-photo-sensing region 213 are integrally formed, and the photosensitive region 212
Positioned at the middle part of the photo-sensitive cell 21, the non-photo-sensing region 213 is located at the outside of the photo-sensitive cell 21, and described non-
Photosensitive region 213 surrounds the photosensitive region 212 1 weeks, and the chip contacts 211 are arranged at the non-photo-sensing region
213。
Correspondingly, the wiring board 22 includes at least two groups of wiring board connectors 221, at least two smooth chip attachment areas
The fringe region 223 of domain 222 and one, wherein the fringe region 223 and each chip attachment region 222 integratedly into
Type, and the fringe region 223 is located at around each chip attachment region 222, the quilt of wiring board connector 221
It is arranged at the fringe region 223.
Each lead 24 has a chip connection end 241 and a wiring board connection end 242 respectively, wherein the lead
24 extend deviously between the chip connection end 241 and the wiring board connection end 242.
Each photo-sensitive cell 21 is mounted on each chip attachment region 222 of the wiring board 22 respectively,
The chip connection end 241 of wherein described lead 24 is connected to the chip contacts 211 of the photo-sensitive cell 21, institute
The wiring board connection end 242 for stating lead 24 is connected to the wiring board connector 221 of the wiring board 22, the mould
Mould the fringe region 223 of the pedestal 23 at least with the wiring board 22 integratedly to be combined, to form the molding photosensory assembly
20, wherein each optical lens 10 is arranged at each photo-sensitive cell 21 of the molding photosensory assembly 20 respectively
Photosensitive path.The light being reflected by the object enters the inside of the array camera module from each optical lens 10, with
Photoelectric conversion is subsequently received and carries out by the photosensitive region 222 of each photo-sensitive cell 21, so as to obtain and object phase
The image of association.
In an example of the array camera module of the present invention, the chip contacts of the photo-sensitive cell 21
211 and the wiring board connector 221 of the wiring board 22 can be terminal pad respectively, i.e. the institute of the photo-sensitive cell 21
The wiring board connector 221 for stating chip contacts 211 and the wiring board 22 can be with disc-shaped, for making the lead
The 24 chip connection end 241 is connected to the chip contacts 211 of the photo-sensitive cell 21 and makes the lead 24
The wiring board connection end 242 be connected to the wiring board connector 221 of the wiring board 22 described in the present invention
In another example of array camera module, the chip contacts 211 of the photo-sensitive cell 21 and the wiring board 22
The wiring board connector 221 can be in spherical respectively, such as by tin cream or other welding material points in the photo-sensitive cell
The 21 non-photo-sensing region 213 and the fringe region 223 of the wiring board 22, to form the photo-sensitive cell 21 respectively
The chip contacts 211 and the wiring board 22 the wiring board connector 221.Nevertheless, the technology of this area
Personnel are it should be understood that the chip contacts 211 of the photo-sensitive cell 21 and the line of the wiring board 22
Road plate connector 221 does not form the limitation to present disclosure and scope, i.e. in other examples, the photosensitive member
The chip contacts 211 of part 21 and the wiring board connector 221 of the wiring board 22 can also have other above-mentioned
The shape not enumerated.
Further there is a chip inside portion 2131, a chip to connect in the non-photo-sensing region 213 of the photo-sensitive cell 21
The chip outside portion 2133 of socket part 2132 and one, wherein the chip contacts 211 are arranged at the chip connecting portion 2132,
The chip inside portion 2131 surrounds the photosensitive region 212 1 weeks, and the both sides of the chip connecting portion 2132 each extend over simultaneously
It is connected to the chip inside portion 2131 and the chip outside portion 2132.That is, in the present invention, by the non-photo-sensing
Region 213 defines from the position that the chip contacts 211 are set to the region of the marginal position of the photosensitive region 212
For the chip inside portion 2131, the region that the chip contacts 211 are set in the non-photo-sensing region 213 is defined as
The chip connecting portion 2132, by the non-photo-sensing region 213 from the positions of the chip contacts 211 is set to described
The region of the outer edge of photo-sensitive cell 21 is defined as the chip outside portion 2133.In other words, bowing from the photo-sensitive cell 21
From the point of view of angle, the photo-sensitive cell 21 is the photosensitive region 212, the chip inside portion 2131, institute successively from inside to outside
State chip connecting portion 2132 and the chip outside portion 2133.
Similarly, the fringe region 223 of the wiring board 22 further has a wiring board inside portion 2231, a line
Road plate connecting portion 2232 and a wiring board outside portion 2233, wherein the wiring board connector 221 is arranged at the circuit
Plate connecting portion 2232, the wiring board inside portion 2231 surround the chip attachment region 222 1 weeks, the wiring board connecting portion
2232 both sides each extend over and are connected to the wiring board inside portion 2231 and the wiring board outside portion 2233.Namely
Say, in the present invention, by the fringe region 223 from the position of the wiring board connector 221 is set to the chip
The marginal position of pasting area 222 is defined as the wiring board inside portion 2231, and being set for the fringe region 223 is described
The region of wiring board connector 221 is defined as the wiring board connecting portion 2232, by the fringe region 223 from being set
The position for stating wiring board connector 221 is defined as the wiring board outside portion to the region of the outer edge of the wiring board 22
2233.It is noted that in this embodiment of the array camera module of the present invention, the wiring board 22 is one
Formula wiring board, it is preferable that each chip attachment region 222 respectively symmetrically is arranged at the both ends of the wiring board 22, from
And the wiring board 22 is set to form symmetrical structure.
In addition, the type of the lead 24 is unrestricted in the array camera module of the present invention, such as at one
In specific example, the lead 24 may be implemented as gold thread, i.e. can be by the photo-sensitive cell 21 by way of beating gold thread
Linked together with the wiring board 22, so as to turn the optical signal in the photosensitive region 212 of the photo-sensitive cell 21
After change after electric signal, the electric signal can be further transmitted to the wiring board 22 by the lead 24.This area
For technical staff it is understood that in other examples of the array camera module of the present invention, the lead 24 can also
It is implemented as that silver wire, copper cash etc. are any can to realize that the electric signal passes between the photo-sensitive cell 21 and the wiring board 22
Defeated material is made.
The array camera module can be one and focus camera module or a zoom camera module, such as
The array camera module can possess the ability of optical zoom on the premise of by control height dimension, to improve the array
The image quality of camera module.Specifically, in this example of the array camera module shown in Figure 7, the battle array
Row camera module further comprises at least two drivers 30, wherein each optical lens 10 is assembled in each institute respectively
Driver 30 is stated, each driver 30 is assembled in the top surface of the molded base 23 respectively, so that each light
On the photosensitive path for learning each photo-sensitive cell 21 that camera lens 10 is respectively held in the molding photosensory assembly 20.Each institute
State driver 30 and be electrically connected to the wiring board 22 respectively, to transmit electric energy and control signal to every in the wiring board 22
After the individual driver 30, each driver 30 can distinguish each optical lens 10 in ancestral east along each sense
The photosensitive path of optical element 21 moves back and forth, so as to adjust the focal length of the array camera module.That is, the optical frames
First 10 can be drivingly disposed in the driver 30.
It is noted that the type of the driver 30 is unrestricted in the array camera module of the present invention,
Such as in a specific example, the driver 30 may be implemented as that voice coil motor etc. is any can to drive the light
The driver that photosensitive path of the camera lens 10 along the photo-sensitive cell 21 produces displacement is learned, wherein the driver 30 can receive
Electric energy and control signal are with running order.
With further reference to accompanying drawing 7, the array camera module further comprises an at least filter element 40.Such as in this hair
In a bright illustrative example, the array camera module can include a filter element 40, wherein the filter
Optical element 40 is assembled in the top surface of the molded base 23, so that the diverse location of the filter element 40 corresponds respectively to
The photosensitive path of each photo-sensitive cell 21.In another illustrative example, the array camera module can include
At least two filter elements 40, wherein each filter element 40 is assembled in the top table of the module pedestal 23 respectively
Face, so that each filter element 40 corresponds respectively to the photosensitive path of each photo-sensitive cell 21, i.e. the array is taken the photograph
Each photo-sensitive cell 21 as module, each filter element 40 and each optical lens 10 are respectively one a pair
The relation answered.
In the array camera module by use, the light being reflected by the object enters the battle array from the optical lens 10
The inside of row camera module, and can receive and carry out light by the photo-sensitive cell 21 after being filtered by the filter element 40
Electricity conversion.That is, the filter element 40, which can be filtered from the optical lens 10, enters the array camera module
Veiling glare in the internal light being reflected by the object, such as the infrared part, by such mode, it can improve described
The image quality of array camera module.
In addition, the filter element 40 be able to can also pass through by direct-assembling in the top surface of the molded base 23
The filter element 40 is first assembled in a supporter, then the supporter is assembled in the top of the molded base 23 again
Surface, by such mode, the size of the filter element 40 can be reduced, to reduce the manufacture of the array camera module
Cost.
It will be appreciated by those skilled in the art that in the different examples of the array camera module, the optical filtering
Element 40 can be implemented as different types, such as the filter element 40 can be implemented as cutoff filter, complete
The combination of saturating spectral filter and other optical filters or multiple optical filters, such as the filter element 40 can be carried out
For the combination of cutoff filter and full impregnated spectral filter, i.e., described cutoff filter and the full impregnated spectral filtering
Piece can be switched to be optionally situated on the photosensitive path of the photo-sensitive cell 21, such as more sufficient in light such as daytimes
In the environment of when using the array camera module, the cutoff filter can be switched to the photo-sensitive cell 21
Photosensitive path, entered with being filtered by the cutoff filter in the light being reflected by the object of the array camera module
Infrared ray, when using the array camera module in the environment of the darks such as night, the full impregnated spectrum can be filtered
Mating plate switches to the photosensitive path of the photo-sensitive cell 21, to allow access into the light being reflected by the object of the array camera module
Infrared part in line passes through.
Refer to the attached drawing 8 and Fig. 9, the array camera module further comprises a support 50, wherein the support 50 has
At least two installing spaces 51, and each installing space 51 is respectively communicated with two sidepieces in the support 50, i.e. it is each
The installing space 51 can form a passage respectively.Each driver 30 is installed in the every of the support 50 respectively
The individual installing space 51, to make each driver 30 be maintained at stable state by the support 50, so as to protect
Card is assembled in the axiality of each optical lens 10 of each driver 30 and improves the array camera module
Intensity, further to improve the image quality of the array camera module.
Preferably, it is installed in each installing space 51 of the support 50 respectively in each driver 30
Afterwards, some fillers are filled between the inwall of support 50 described in the shell in each driver 30, so that each drive
Dynamic device 30 is not in situation about rocking after each installing space 51 of the support 50 is installed in.It is highly preferred that
The filler being filled between the shell of each driver 30 and the inwall of the support 50 can be glue.
The molding photosensory assembly 20 further comprises an at least supporting member 25, with when carrying out moulding technology, by institute
State supporting member 25 and protect the lead 24 and the photo-sensitive cell 21.In this example of the present invention, the supporting member
25 quantity is implemented as minimum two.Preferably, the quantity of the supporting member 25 and the quantity one of the photo-sensitive cell 21
Cause, before the molded base 23 shaping, each photo-sensitive cell 21 of cladding is set in each supporting member 25
The non-photo-sensing region 213, so that after the molded base 23 shaping, the module pedestal 23 coats the institute of the wiring board 22
State fringe region 223, the photo-sensitive cell 21 the non-photo-sensing region 213 a part and one of the supporting member 25
Point, to form the molding photosensory assembly 20.The supporting member 25 can effectively improve the production of the array camera module
Product yield, and improve the image quality of the array camera module.In other examples of the present invention, the supporting member 25
Quantity can also be implemented as one, and it is further described in rear extended meeting.
Each supporting main body 251 includes the supporting main body 251 of a frame shape and has a through hole 252, wherein institute respectively
At least a portion that the non-photo-sensing region 213 for coating the photo-sensitive cell 21 is set in supporting main body 251 is stated, it is described photosensitive
The photosensitive region 212 of element 21 corresponds to the through hole 252 of the supporting main body 25.Preferably, the supporting main body
It is at least a portion of the chip inside portion 2131 in the non-photo-sensing region 213 of the 251 cladding photo-sensitive cells 21, described
Chip connecting portion 2132 and at least a portion of the chip outside portion 2133.Further, the supporting main body 251 has one
Top surface 2501, a medial surface 2502 and a lateral surface 2503, wherein the both sides of the top surface 2501 respectively inwards and to
It is outer to extend to be connected to the medial surface 2502 and the lateral surface 2503.In the present invention, by the court of the supporting main body 251
The medial surface 2502 of the supporting main body 251 is defined as to the side of the photosensitive region 212, by the supporting main body
The side of the fringe region 223 of the 251 direction wiring board 22 is defined as the lateral surface of the supporting main body 251
2503.In this embodiment, the molded base 23 coats the lateral surface 2503 of the supporting main body 251 after shaping
With at least a portion of the top surface 2501.
In addition, the molding photosensory assembly 20 of the array camera module further comprises multiple electronic components 26,
Wherein each electronic component 26 can be mounted on by such as SMT (Surface Mount Technology) technique
The fringe region 223 of the wiring board 22.Preferably, each electronic component 26 is mounted on the fringe region
The 223 wiring board outside portion 2233.The photo-sensitive cell 21 and each electronic component 26 can be mounted on institute
The same side of wiring board 22 or opposite side are stated, such as in a specific example, the photo-sensitive cell 21 and each electricity
Sub- component 26 is mounted on the same side of the wiring board 22, and the photo-sensitive cell 21 is mounted on the wiring board 22
The chip attachment region 222, each electronic component 26 is mounted on the fringe region of the wiring board 22
223.Integrally formed after the fringe region 223 of the wiring board 22, the molded base in the molded base 23
The 23 each electronic components 26 of cladding, with by the molded base 23 isolate the adjacent electronic component 26 and every
From the electronic component 26 and the photo-sensitive cell 21, so as to, in the array camera module of the present invention, even phase
The adjacent electronic component 26 it is closer to the distance when, the molded base 23 can also avoid the adjacent phase of the electronic component 26
Mutually contact or interference, and the molded base 23 coats the mode of the electronic component 26 and can also avoid resulting from institute
The photosensitive region 212 of photo-sensitive cell 21 described in the contaminants on the surface of electronic component 26 is stated, and then described in reduction
The volume of array camera module and the image quality for improving the array camera module.That is, the array of the present invention
Camera module enables the wiring board 22 of small area by way of the molded base 23 coats the electronic component 26
It is enough to be mounted more electronic components 26.It is noted that the type of the electronic component 26 includes but unlimited
In resistance, electric capacity, driving element etc..
With reference to figures 1 through Fig. 9, although being implemented as in following description of the present invention with the array camera module double
Exemplified by camera lens camera module, the feature and advantage for the array camera module that the present invention is furture elucidated, the technology of this area
Personnel it is understood that in a variant embodiment of the array camera module of the invention shown in accompanying drawing 10,
The array camera module can also include more optical lens 10.
The molding photosensory assembly 20 of the array camera module is described into the example shown in Fig. 5 in accompanying drawing 1
Manufacturing process, and the battle array with the molding photosensory assembly 20 is further described into the example shown in Fig. 8 in accompanying drawing 6
The manufacturing process of row camera module.
Refer to the attached drawing 1, two photo-sensitive cells 21 are mounted on two of the wiring board 22 correspondingly respectively
The chip attachment region 222, wherein chip contacts 211 and the wiring board described in one group of each photo-sensitive cell 21
Wiring board connector 222 described in two groups of 22 is connected by lead 24 described in one group respectively.Will each electronic component
26 are mounted on the fringe region 233 of the wiring board 22 respectively.Preferably, each electronic component 26 is pasted respectively
The wiring board outside portion 2233 loaded on the fringe region 223.It is highly preferred that each electronic component 26 is mutual
Interval, after the completion of being produced in the array camera module, each electronic component 26 is not in interfere
Situation.
The routing technique and the lead 24 characteristic of itself of the lead 24 are limited to, in the core of the lead 24
Piece connection end 241 and the wiring board connection end 242 are connected to the chip contacts 211 of the photo-sensitive cell 21 respectively
After the wiring board connector 221 of the wiring board 22, the lead 24 is upward, to be higher by the photo-sensitive cell 21
Upper surface.It will be appreciated by those skilled in the art that during the array camera module is by manufacture and made
During, each lead 24 is maintained at original state and advantageously ensure that the good electrical of the lead 24 and ensure
The image quality of the array camera module.
Refer to the attached drawing 2, each supporting main body 251 is set to the non-photo-sensing of each photo-sensitive cell 21 of cladding
At least a portion in region 213, wherein the photosensitive region 212 of each photo-sensitive cell 21 correspond respectively to it is each described
The through hole 252 of supporting member 25, with by each supporting member 25, each photo-sensitive cell 21, the circuit
Lead 24 described in plate 22 and every group forms a molding photosensory assembly semi-finished product.In this of the array camera module of the present invention
In example, the supporting main body 251 coats at least a portion, described of the chip outside portion 2131 of the photo-sensitive cell 21
Chip connecting portion 2132 and at least a portion of the chip inside portion 2133.That is, the supporting main body 251 can wrap
The link position of the chip connection end 241 of the lead 24 and the chip contacts 211 of the photo-sensitive cell 21 is covered,
With when carrying out moulding technology, the supporting main body 251 can avoid the chip connection end 241 of the lead 24 and described
The link position of the chip contacts 211 of photo-sensitive cell 21 connects with the moulding material for forming the molded base 23
Touch, so as to avoid the chip connection end 241 of the lead 24 de- from the chip contacts 211 of the photo-sensitive cell 21
Fall.
It is understood that the supporting main body 251 coats the chip connection end 241 of the lead 24 and the sense
The link position of the chip contacts 211 of optical element 21, so that the supporting main body 251 can isolate the lead 24
The chip contacts 211 of the chip connection end 241 and the photo-sensitive cell 21 and the moulding material, so as to carry out
During moulding technology, the moulding material is avoided to cause the chip connection end 241 of the lead 24 to deform or the lead 24
The chip connection end 241 come off from the chip contacts 211.
In addition, the supporting main body 251 coats a part for each lead 24, so as to by the supporting main body
251 with pre-fixing each lead 24, described when carrying out moulding technology, to prevent each lead 24 from deforming
Supporting main body 251 enables in particular to prevent the adjacent lead 24 and because of deformation occurred to contact with each other the short circuit of initiation, so as to protect
Demonstrate,prove yield of the array camera module after the completion of by manufacture.
In one embodiment, the supporting main body 251 can be by the way that glue to be arranged on to the institute of the photo-sensitive cell 21
State non-photo-sensing region 213 and formed after glue curing, so that the supporting main body 251 is flexible, wherein in the branch
After holding the formation of main body 251, the medial surface 2502 of the supporting main body 251 forms the through hole of the supporting member 25
252, the photosensitive region 212 of the photo-sensitive cell 21 corresponds to the through hole 252.In addition, the branch formed by glue
Holding main body 251 has viscosity, for pollutants such as adhesion adhesion dusts, so as to prevent sense described in these contaminants
The photosensitive region 212 of optical element 21, to avoid the photosensitive region 212 of the photo-sensitive cell 21 from dirty bad point occur, from
And further ensure that the image quality of the array camera module.For example, the supporting main body 251 is located at the electronics in shaping
Between component 26 and the photosensitive region 212 of the photo-sensitive cell 21, so as to mount the electronic component 26 in institute
Stating the pollutant such as welding powder caused by wiring board 22 can be adhered to by the supporting main body 251, to prevent the pollutants such as these welding powders
Pollute the photosensitive region 212 of the photo-sensitive cell 21.
Preferably, the supporting main body 251 can be by will be coated in the photo-sensitive cell 21 in the glue of deadlocked state
The non-photo-sensing region 213 and formed after glue curing, to avoid glue from being applied to the institute of the photo-sensitive cell 21
The situation for occurring flowing and polluting the photosensitive region 212 of the photo-sensitive cell 21 behind non-photo-sensing region 213 is stated to occur.Change speech
It, glue has good plasticity before the supporting main body 251 is formed by curing, to avoid glue described in be applied to
The non-photo-sensing region 213 of photo-sensitive cell 21 and it is deformed during solidification.Those skilled in the art can be with
Understand, the chip for being connected to the photo-sensitive cell 21 is set in the chip connection end 241 of the lead 24
After connector 211, in the glue of deadlocked state after the non-photo-sensing region 213 of the photo-sensitive cell 21 is coated on,
The chip connection end 241 of the lead 24 can be coated, and the institute for coating the lead 24 is formed after glue curing
Supporting main body 251 is stated, so as to avoid damaging the lead 24 during the supporting main body 251 is molded.
Refer to the attached drawing 3A, when carrying out moulding technology, moulding material shape after hardening is made by a molding tool 100
Into the molded base 23, by such mode, the size of the array camera module can be reduced and reduce the array
The assembly error of camera module, so that the structure of the array camera module is compacter and improves the array camera module
Image quality.
Specifically, the mould 100 includes a mold 101 and once mould 102, wherein the mold
101 and the lower mould 102 at least one mould can be moved so that the mold 101 and the lower mould 102
Interconnected at least two can be formed by carry out die closing operation, and between the mold 101 and the lower mould 102
Molding space 103, wherein the molded base 23 is added into the molding space 103 and after hardening by the moulding material
Formed.
Such as in one embodiment, the lower mould 102 can be fixed, and the mold 101 can be along guide pillar
The movement relative to the lower mould 102 is done, to be closed when the mold 101 is moved towards the lower direction of mould 102
Mould, and the withdrawing pattern when the mold 101 moves away from the lower mould 102, when the mold 101 and the lower mould
102 by carry out die closing operation when, each molding space is formed between the mold 101 and the lower mould 102
103.In another embodiment, the mold 101 can be fixed, and the lower mould 102 can be done relatively along guide pillar
In the movement of the mold 101, with the matched moulds when the lower mould 102 is moved towards the direction of mold 101, and
Withdrawing pattern when the lower mould 101 moves away from the mold 101.
After the molding photosensory assembly semi-finished product are placed on into the mold 101 and/or the lower mould 102, operation
The mold 101 and the lower mould 102 carry out matched moulds, are formed so that the molding photosensory assembly semi-finished product are located at described
Each molding space 103 of mold 101 and the lower mould 102, wherein the stitching surface 1011 of the mold 101 is applied
The top surface 2501 of the supporting main body 251 is pressed on, to support the mold upwards by the supporting main body 251
101, so as to avoid the stitching surface 1011 of the mold 101 from directly applying pressure to the lead 24, to carry out molding work
Protect the lead 24 to be not damaged by during skill, wherein it is described molding photosensory assembly semi-finished product at least described wiring board 22 it is described
Fringe region 223 corresponds to the molding space 103.
It is noted that each molding space 103 is annular in shape respectively, and the adjacent phase of the molding space 103
It is intercommunicated, to be added into the molding space 103 in the moulding material and the mould formed after the mold material cures
Mould pedestal 23.
Preferably, the supporting main body 251 is flexible, so that when the mould 100 is by carry out Mould operation,
The stitching surface 1011 of the mold 101 is applying pressure to the top surface 2501 for supporting main body 251 in a flash
Caused impulsive force is absorbed by the supporting main body 251 and prevents the impulsive force from being further transferred to the photo-sensitive cell 21,
So as to avoid the photo-sensitive cell 21 from being damaged or avoid the photo-sensitive cell 21 to be produced because of stress relative to the line
The displacement of road plate 22.It will be appreciated by those skilled in the art that the impulsive force is absorbed to hinder by the supporting main body 251
Only the impulsive force is further communicated to the mode of the photo-sensitive cell 21, additionally it is possible to ensures that the photo-sensitive cell 21 is mounted on
The flatness of the wiring board 22 is not by image, so as to improve the product yield of the array camera module.
Preferably, in one example, it is described supporting main body 251 height may be implemented as higher than the lead 24 to
The height of upper process, with when the mould 100 is by carry out die closing operation, the stitching surface of the mold 101
1011 can directly apply pressure to it is described supporting main body 251 the top surface 2501, with by it is described supporting main body 251 described in
Top surface 2501 support the mold 101 upwards and prevent the mold 101 the stitching surface 1011 apply pressure to it is described
Lead 24.That is, be reserved between the lead 24 and the stitching surface 1011 of the mold 101 safety away from
From.In another example, the height of the supporting main body 251 is equal to the upward height of the lead 24, with described
When mould 100 is by carry out matched moulds, although the stitching surface 1011 of the mold 101 can connect with the lead 24
Touch, but the stitching surface 1011 of the mold 101 can not apply pressure to the lead 24.
In addition, it is described supporting main body 251 it is flexible, after the mould 101 is by carry out die closing operation, it is described on
The stitching surface 1011 of mould 101 apply pressure to it is described supporting main body 251 the top surface 2501 so that the supporting main body
251 top surface 2501 produces slight deformation, for preventing the He of the stitching surface 1011 in the mold 101
Gap is produced between the top surface 2501 of the supporting main body 251.That is, the pressing of the mold 101
The top surface 2501 of face 1011 and the supporting main body 251 is brought into close contact, so that the institute corresponding to the supporting member 25
The photosensitive region 212 for stating the photo-sensitive cell 21 of through hole 252 is in a sealed environment, so as to carry out moulding technology
When, the moulding material will not enter the sealed environment, to prevent the moulding material from polluting the institute of the photo-sensitive cell 21
State photosensitive region 212.It is noted that the scope of the shore hardness of the supporting main body 251 is A50-A80, modulus of elasticity
Scope is 0.1Gpa-1Gpa.
In addition, when carrying out moulding technology, the stitching surface 1011 of the mold 101 and the supporting main body 251
The top surface 2501 be brought into close contact, to prevent the moulding material from entering the sealed environment, so as in the molding base
The phenomenon of " overlap " can be avoided the occurrence of after the shaping of seat 23, to ensure the product yield of the array camera module.
Accompanying drawing 3B shows the molding photosensory assembly 20 of the array camera module of the present invention in this process
A variant embodiment, wherein it is described supporting main body 251 can also be supported by hard material, that is to say, that on described
The stitching surface 1011 of mould 101 apply pressure to it is described supporting main body 251 the top surface 2501 when, the supporting main body
251 can not also be deformed, and so as to ensure the good electrical of the lead 24, and then ensure the camera module follow-up
Product yield and be further ensured that the image quality of the camera module.It is noted that Shao of the supporting main body 251
Family name's hardness is more than D70, and modulus of elasticity is more than 1Fpa.
The mould 100 further comprises a cover layer 104, wherein the cover layer 104 is overlappingly arranged at
The stitching surface 1011 of the mold 101, so that when the mould 100 is by carry out die closing operation, the covering
Film 104 is located between the stitching surface 1011 of the mold 101 and the top surface 2501 of the supporting main body 251,
So that the photosensitive region 212 of the photo-sensitive cell 21 is in the sealed environment.
It is noted that positioned at described in the stitching surface 1011 of the mold 101 and the supporting main body 251
The cover layer 104 of top surface 2501, on the one hand it can prevent in the stitching surface 1011 of the mold 101 and described
Gap is produced between the top surface 2501 of supporting main body 251, on the other hand the cover layer 104 can absorb the upper mould
Tool 101 the stitching surface 1011 apply pressure to it is described supporting main body 251 the top surface 2501 caused by impulsive force, so as to
The impulsive force is avoided to damage photo-sensitive cell 21, the wiring board 22 and the lead 24.
The mould 100 is entered after the molded base 23 shaping in addition, the setting of the cover layer 104 is convenient
Row comes off.
Refer to the attached drawing 4, the moulding material of flow-like is added to each molding space of the mould 100
After 103, the moulding material can fill the Zone Full of each molding space 103, wherein being formed in the photo-sensitive cell
At least one of supporting main body 251 in the 21 non-photo-sensing region 213 can prevent the moulding material from entering institute
State sealed environment.Specifically, the supporting main body 251 can prevent the moulding material from the supporting main body 251 and institute
The contact position for stating the non-photo-sensing region 213 of photo-sensitive cell 21 enters the sealed environment, but also can prevent described
Moulding material connects from the stitching surface 1011 of the top surface 2501 for supporting main body 251 and the mold 101
Touch position and enter the sealed environment.
It is noted that the moulding material of flow-like of the present invention can be fluent material or solid
Grain material or liquid and solid particle mixing material, it is to be understood that no matter the moulding material is implemented as liquid material
Material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, its be added into it is described into
After the molding space 103 of pattern tool 100, the molded base 23 can be cured to form.Such as the present invention this
In individual specific example, the moulding material of flow-like is implemented as the thermoplastic of such as liquid, wherein the forming material
Expect in the solidify afterwards of the molding space 103 for being added into the mould 100 to form the molded base 23.It is worth mentioning
, after the moulding material of flow-like is added into the molding space 103 of the mould 100, flow-like
The curing mode of the moulding material does not limit present disclosure and scope.
Refer to the attached drawing 5, when the moulding material is added into the molding space 103, the supporting main body 251 prevents institute
The photosensitive region 212 that moulding material enters the photo-sensitive cell 21 is stated, so that in the mold material cures to be formed
After stating molded base 23, the molded base 23 further forms at least two optical windows 231, and each optical window 231 corresponds to respectively
The photosensitive region 212 and each optical lens 10 in each photo-sensitive cell 21, to be institute by the optical window 231
State optical lens 10 and the photo-sensitive cell 21 provides a passage of light.The moulding material forms the molding base after hardening
One molded body 232 of seat 23, in this embodiment, the molded body 232 coats the edge of the wiring board 22
At least a portion of the lateral surface 2503 and the top surface 2501 of region 223 and the supporting main body 251, to be formed
The molding photosensory assembly 20.In other words, the molded base 23 includes a molded body 232 and with least two
The optical window 231, the filter element 40 and the driver 30 are subsequently being assembled in the top of the molded body 232 respectively
Surface, so that the optical lens 10 for being assembled in the driver 30 is maintained at the photosensitive road of the photo-sensitive cell 21
Footpath.
It is noted that the molded body 232 joined integrally with the fringe region 223 of the wiring board 22
The further each electronic component 26 of cladding, so as to isolate the adjacent electronic component by the molded body 232
26 and isolate the electronic component 26 and the photo-sensitive cell 21 by the molded body 232, by such mode, i.e.,
Be the adjacent electronic component 26 it is closer to the distance when, the molded body 232 can also prevent adjacent electronics member
Device 26 is contacted with each other or disturbed, and the molded body 232 can also prevent dirt caused by the electronic component 26
The photosensitive region 212 that thing pollutes the photo-sensitive cell 21 is contaminated, further to improve the image quality of the camera module.
In addition, by the molded body 232 to coat each electronic component 26 adjacent described to avoid by the present invention
The mode that electronic component 26 interferes so that the distance of the adjacent electronic component 26 can further reduce, so as to
Can also the greater number of electronic component 26 be attached even on the less wiring board 22 of area, with to the greatest extent
The image quality of the array camera module is improved on the premise of the size that the array camera module may be reduced.Also, this
Invention is by way of the molded body 232 coats each electronic component 26 to isolate the He of electronic component 26
The photo-sensitive cell 21, so that when even described photo-sensitive cell 21 and the electronic component 26 closer to the distance, it is described photosensitive
Element 21 and the electronic component 26 are also not in the phenomenon interfered, so as in the less wiring board 22 of area
On can attach the photo-sensitive cell 21 with the bigger photosensitive region 212, to improve the array camera module
Image quality.
Preferably, the molded body 232 has good thermal insulation, so as to what is used in the array camera module
During, the photo-sensitive cell 21 is not transferred to the electronic component 26 in heat caused by progress photoelectric conversion, with
Ensure the reliability of the array camera module when in use.
Refer to the attached drawing 6 and Fig. 7, the filter element 40 is assembled in the top surface of the molded base 23, so that described
Filter element 40 closes the optical window 231 of the molded base 23, so as to subsequently from described in the optical lens 10 entrance
The light of the inside of array camera module can be filtered further by the filter element 40 to improve the array camera module
Image quality.As introducing as discussed above, although in figure 6 to the present invention's by taking two filter elements 40 as an example
The feature and advantage of the array camera module illustrate, it will be appreciated by those skilled in the art that, the array is taken the photograph
Picture module can also include a filter element 40, and the top of the molded base 23 is assembled in the filter element 40
After surface, each optical window 231 is closed simultaneously by a filter element 40, so that each photo-sensitive cell 21
The photosensitive region 212 correspond respectively to the diverse location of the filter element 40.
Further, the top surface of the molded base 23 includes at least two inner surfaces 233 and an outer surface 234,
Wherein in one example, each inner surface 233 and the outer surface 234 are in approximately the same plane, so that institute
The top surface for stating molded base 23 forms a complete plane, wherein described in each the filter element 40 is assembled in respectively
Each inner surface 233 of module pedestal 23, to close off each optical window by each filter element 40
231, each driver 40 is assembled in the diverse location of the outer surface 234 of the module pedestal 23 respectively, with
The filter element 40 is set to be located at the institute of the optical lens 10 and the photo-sensitive cell 21 that are assembled in the driver 30
State between photosensitive region 212.In another example, the plane where each inner surface 233 is less than the outside table
Plane where face 234, to form at least two grooves 235 of the molded base 23, i.e. the top surface of the molded base 23
In step-like, wherein being assembled in the filter element 40 of the inner surface 233 of the molded base 23 positioned at described
In the groove 235 of molded base 23.
Refer to the attached drawing 8, each driver 30 of the array camera module are installed in the support 50 respectively
Each installing space 51, is then filled in the shell of each driver 30 and the support by fillers such as glue
Between 50 inwall, to ensure to be mounted in the array camera module or by use, each driver 30 will not
Rock, so as to ensure to be assembled in each optical lens of each driver 30 respectively by the support 50
10 axiality, and the support 50 can also strengthen the structure of the array camera module, be imaged with improving the array
The stability of module.It is noted that in one embodiment, the driver 30 only can be arranged at the support 50
The installing space 51 so that the support 50 coats at least a portion of the driver 30, in another embodiment,
The support 50 can also be made further to coat at least a portion of the molded base 23, the present invention is not limited in this respect
System.
Accompanying drawing 11 shows second variant embodiment of the array camera module, above-mentioned preferably real with the present invention
The embodiment difference of example is applied, the array camera module includes two wiring boards 22, wherein each wiring board 22
Include a chip attachment region 222 and a fringe region 223 respectively, wherein each photo-sensitive cell 21 divides
The chip attachment region 222 of each wiring board 22 is not mounted on, wherein described to be formed carrying out moulding technology
During molded base 23, the molded body 232 of the molded base 23 and the fringe region of each wiring board 22
223 at least a portion is joined integrally.That is, in this embodiment of the array camera module of the present invention, institute
It is split type wiring board to state wiring board 22.
Accompanying drawing 12 shows the 3rd variant embodiment of the array camera module, wherein the array camera module
Including an at least lens barrel 60 and at least one driver 30, wherein the lens barrel 60 integratedly extends the molded base
23 top surface, the driver 30 are assembled in the top surface of the molded base 23, and the lens barrel 60 and the drive
Dynamic device 30 is respectively used to assemble the optical lens 10, it is preferable that the lens barrel 60 and the molded base 23 are by molding
Technique is integratedly molded.Such as when the array camera module is implemented as twin-lens camera module, the array is taken the photograph
As module includes a driver 30 and a lens barrel 60.
Accompanying drawing 13A shows the 4th variant embodiment of the array camera module, wherein the array images mould
Group includes at least two lens barrels 60, wherein each lens barrel 60 integratedly extends the top of the pedestal pedestal 23 respectively
Surface, each optical lens 10 are assembled in each lens barrel 60 respectively, it is preferable that each lens barrel 60 respectively and
The molded base 23 is integratedly molded by moulding technology.
Accompanying drawing 13B shows the 5th variant embodiment of the array camera module, wherein the array images mould
Group includes at least two lens barrels 60, wherein after the molding photosensory assembly 20 is molded, each lens barrel 60 is distinguished
The diverse location of the top surface of the molded base 23 is assembled in, each optical lens 10 is assembled in each institute respectively
Lens barrel 60 is stated, so that each optical lens 10 is respectively held in the photosensitive path of each photo-sensitive cell 10.It is worth
One is mentioned that, the lens barrel 60 can be threaded lens barrel or non-threaded lens barrel, and the present invention facilitates unrestricted at this
System.
In addition, two being only for example property of embodiment of the array camera module that accompanying drawing 13A and accompanying drawing 13B are shown respectively
Description, in other examples, at least one lens barrel 60 can with the molded base 23 by moulding technology one
Ground is molded, and the other lens barrel 60 can be assembled in the top surface of the molded base 23.Such as when the array images
When module is implemented as twin-lens camera module, a lens barrel 60 can pass through moulding technology one with the molded base 23
It is molded, another lens barrel 60 can be assembled in the top surface of the molded base 23, in order to be focused body.
Accompanying drawing 14A shows first deformation implementation side of the molding photosensory assembly 20 of the array camera module
Formula, wherein it is described supporting main body 251 coat the wiring board 22 the fringe region 223 a part every and it is described photosensitive
In the chip outside portion 2133 in the non-photo-sensing region 213 of element 21, the chip connecting portion 2132 and the chip
At least a portion of sidepiece 2131, with the molded base 23 shaping after, the molded body bag of the molded base 23
Cover a part for the fringe region 223 of the wiring board 22 and the lateral surface 2503 and the institute of the supporting main body 251
State at least a portion of top surface 2501.
It is noted that the supporting main body 251 can coat the whole of the lead 24, with the molded base
Before 23 form, the fixation of each lead 24 is realized, so that during moulding technology is carried out, the supporting main body
251 can prevent the lead 24 from being contacted with the moulding material, so as to avoid being added into the molding space 103 it is described into
Impulsive force caused by section bar material causes the lead 24 to be deformed.In addition, the supporting main body 251 can also have well
Heat-proof quality, it is hot during the mold material cures with after the moulding material is added into the molding space 103
Amount will not be delivered to the lead 24 by the supporting main body 251, to be further ensured that the good electrical of the lead 24.
In addition, it is described supporting main body 251 simultaneously formed the wiring board 22 the fringe region 223 a part and
At least a portion in the non-photo-sensing region 213 of the photo-sensitive cell 21, to realize the photo-sensitive cell 21 and the circuit
The fixation of plate 22, so as to which during moulding technology is carried out, the supporting main body 251 can be prevented in the mould
The photo-sensitive cell 21 and the wiring board 22 shift during 100 matched moulds, to ensure the flat of the photo-sensitive cell 21
Whole degree.
In addition, it is described supporting main body 251 simultaneously formed the wiring board 22 the fringe region 223 a part and
At least a portion in the non-photo-sensing region 213 of the photo-sensitive cell 21, to be prevented by the supporting main body 251 described
Gap is produced between the mounting position of photo-sensitive cell 21 and the wiring board 22, so that during moulding technology is carried out, institute
Stating supporting main body 251 can prevent the moulding material from entering between the photo-sensitive cell 21 and the wiring board 22, to ensure
The flatness that the photo-sensitive cell 21 is mounted, so as to further improve the image quality of the array camera module.
Accompanying drawing 14B shows second deformation of the molding photosensory assembly 20 of the array camera module of the present invention
Embodiment, wherein the supporting main body 251 coats the part of the fringe region 223 of the wiring board 22 and described
The chip outside portion 2133 in the non-photo-sensing region 213 of photo-sensitive cell 21 and at least the one of the chip connecting portion 2132
Part, so that after the molded base 23 shaping, the molded body 232 of the molded base 23 coats the wiring board 22
A part for the fringe region 223 and the lateral surface 2503 and the top surface 2501 of the supporting main body 251
At least partially.
Similarly, accompanying drawing 14C shows the of the molding photosensory assembly 20 of the array camera module of the present invention
Three variant embodiments, wherein the supporting main body 251 coats a part for the fringe region 223 of the wiring board 22
And at least a portion of the chip outside portion 2133 in the non-photo-sensing region 213 of the photo-sensitive cell 21, with institute
After stating the shaping of molded base 23, the molded body 232 of the molded base 23 coats the edge of the wiring board 22
At least a portion of the lateral surface 2503 and the top surface 2501 of the part in region 223 and the supporting main body 251.
It will be appreciated by those skilled in the art that in the molding photosensory assembly shown in accompanying drawing 14B and accompanying drawing 14C
In 20 the two embodiments, the supporting main body 251 can not coat the non-photo-sensing region 213 of the photo-sensitive cell 21
The chip inside portion 2131 so that what the size of the chip inside portion 2131 of the photo-sensitive cell 21 can be done
It is smaller, so that the photo-sensitive cell 21 of identical size there can be the bigger photosensitive region 212, pass through such side
Formula, the image quality of the array camera module on the premise of the size of the array camera module is controlled, can be improved.
In addition, the supporting main body 251 can not coat the chip inside portion 2131 of the photo-sensitive cell 21, so as to
Tu is applied in the part in the non-photo-sensing region 213 of the photo-sensitive cell 21 in glue, and forms institute in glue curing
Before stating supporting main body 251, glue is because the photosensitive region 212 away from the photo-sensitive cell 21, so as to even in glue
In the case that flowing occurs in water, glue also can only flow to the chip inside portion 2131 of the photo-sensitive cell 21, without
The photosensitive region 212 of the photo-sensitive cell 21 is flow to, so as to prevent the photosensitive region 212 of the photo-sensitive cell 21
It is contaminated.That is, the chip inside portion 2131 can be described in the supporting main body 251 and the photo-sensitive cell 21
Safe distance is reserved between photosensitive region 212.
Accompanying drawing 14D shows the 4th deformation of the molding photosensory assembly 20 of the array camera module of the present invention
Embodiment, wherein the supporting main body 251 coats a part for the fringe region 223 of the wiring board 22, with institute
After stating the shaping of molded base 23, the molded body 232 of the molded base 23 coats the edge of the wiring board 22
At least one of the lateral surface 2503 and the top surface 2501 of the another part in region 223 and the supporting main body 251
Point.
Accompanying drawing 14E shows the 5th deformation of the molding photosensory assembly 20 of the array camera module of the present invention
Embodiment, wherein the quantity of the supporting member 25 can be one, and the supporting main body of the supporting member 25
A part for the fringe region 223 of the 251 cladding wiring boards 22, so that each photo-sensitive cell 21 is described photosensitive
Region 212 simultaneously corresponding to the supporting member 25 the through hole 252, with the molded base 23 shaping after, the mould
The molded body 232 of modeling pedestal 23 coats another part of the fringe region 223 of the wiring board 22 and the branch
Hold the lateral surface 2503 of main body 251 and at least a portion of the top surface 2501.
In the molding photosensory assembly 20 of the array camera module of the invention shown in accompanying drawing 14D and Figure 14 E
In the two embodiments, the supporting main body 251 can be without the non-photo-sensing region 213 for coating the photo-sensitive cell 21
Any position, so that the supporting photosensitive region 212 of the main body 251 away from the photo-sensitive cell 21, so as to described
Supporting main body 251 is avoided during being molded described in glue or other materials pollution for forming the supporting main body 251
The photosensitive region 212 of photo-sensitive cell 21.Preferably, in the array shooting of the invention shown in accompanying drawing 14D and Figure 14 E
In the two embodiments of the molding photosensory assembly 20 of module, the supporting main body 251 can coat the He of lead 24
The link position of the wiring board connector 221 of the wiring board 22, so that when carrying out moulding technology, the supporting main body
251 can avoid the company of the wiring board connector 221 of the moulding material contact lead 24 and the wiring board 22
Position is connect, to prevent the lead 24 from deforming and dropping off.
It will be appreciated by those skilled in the art that although in the array shooting shown in accompanying drawing 14A to accompanying drawing 14E
The numerous embodiments of the molding photosensory assembly 20 of module, but it only illustrates the feature and excellent of the present invention as an example
Gesture, as needed, the supporting main body 251 can coat the wiring board outside portion 2233 of the wiring board 22, the line
Road plate connecting portion 2232 and the wiring board inside portion 2231 and the chip outside portion 2133 of the photo-sensitive cell 21, institute
State at least one at least a portion in chip connecting portion 2132 and the chip inside portion 2131.Such as the supporting main body
251 can coat a part for the wiring board connecting portion 2232 of the wiring board 22, can also coat the wiring board and connect
The whole of socket part 2232.Therefore, it is set although repeating no more the supporting main body 251 in the following description of the present invention
The position of cladding, it will be appreciated by those skilled in the art that, the scope of the array camera module of the invention can wrap
It is set containing the supporting main body 251 and coats the fringe region 223 of the wiring board 22 and the institute of the photo-sensitive cell 21
State the combination of any position and any position in non-photo-sensing region 213.
In addition, accompanying drawing 15 shows another of the molding photosensory assembly 20 of the array camera module of the present invention
Variant embodiment, wherein the stitching surface 1011 of the mold 101 and the top surface of the supporting main body 251
2501 at least a portion releases, so that after the molded base 23 shaping, the molded body 232 can further coat institute
State at least a portion of the top surface 2501 of supporting main body 251.
It is noted that one embodiment under this invention, the array camera module includes at least two light
Camera lens 10 and a molding photosensory assembly 20 are learned, wherein each optical lens 10 is arranged at the molding sense respectively
On the photosensitive path of each photo-sensitive cell 21 of optical assembly 20, as the present invention it is foregoing it is described as.And another
In one embodiment, shown in refer to the attached drawing 16, the array camera module can also include at least two optical lens 10, one
The molding photosensory assembly 20 and at least one additional photo-sensitive cell 21A, each additional photo-sensitive cell 21A are assembled in institute
The wiring board 22 of molding photosensory assembly 20 is stated, each optical lens 10 is arranged at the molding photosensory assembly respectively
The photosensitive path of 20 each photo-sensitive cell 21 and each additional photo-sensitive cell 21A, imaged with forming the array
Module.In addition, the array camera module further comprise an at least additional body 27 and an at least additional actuators 30A or
At least one additional lens barrel 60A, wherein each additional body 27 is assembled in the described of the molding photosensory assembly 20 respectively
Wiring board 22, each additional actuators 30A or each additional lens barrel 60A are assembled in the wiring board respectively
22, each optical lens 10 is assembled in the driver 30 either lens barrel 60 or the additional actuators respectively
The 30A or additional lens barrel 60A, so that each optical lens 10 is respectively held in the molding photosensory assembly 20
The photosensitive path of each photo-sensitive cell 21 and each additional photo-sensitive cell 21A.In addition, the additional photo-sensitive cell
21A can also not be mounted on the wiring board 22 of the molding photosensory assembly 20, but by the array camera module
An extension wire plate 22A is provided, for being mounted on each additional photo-sensitive cell 21A.
Accompanying drawing 17 shows another variant embodiment of the array camera module, wherein the filter element 40 does not have
By direct-assembling in the molded body 232 of the molded base 23, but further provided for by the array camera module
An at least supporter 70, each filter element 40 can be assembled in each supporter 70 respectively, then will be each
The supporter 70 is assembled in the top surface of the molded body 232 respectively, so that each filter element 40 is maintained at
Between each optical lens 10 and each photo-sensitive cell 21, by such mode, the member that filters can be reduced
The size of part 40, to reduce the cost of manufacture of the array camera module.
It is noted that in one embodiment, the quantity of the supporter 70 and the number of the filter element 40
Amount is consistent, i.e. the supporter 70 and the filter element 40 match one by one.Such as when the quantity of the filter element 40 is one
When individual, the quantity of the supporter 70 is also one.In another embodiment, the quantity of the supporter 70, the optical filtering
The quantity of element 40 is consistent with the quantity of the optical lens 10, such as in this example shown in accompanying drawing 7, the supporter
The quantity of 70 quantity, the quantity of the filter element 40 and the optical lens 10 is two.
In another embodiment, the quantity of the supporter 70 can also differ with the quantity of the filter element 40
Cause, such as the quantity of the supporter 70 can only have one, the quantity of the filter element 40 can have more than one, wherein
Each filter element 40 can be assembled in the diverse location of the supporter 70.
With further reference to accompanying drawing 17, the top surface of the molded body 232 of the molded base 23 is a plane, from
And after the molded base 23 shaping, the supporter 70 is first assembled in the top surface of the molded body 232, Ran Houzai
The driver 30 or the lens barrel 60 are assembled in the supporter 70.That is, the driver 30 or described
Lens barrel 60 can be by direct-assembling in the top surface of the molded body 232, but is assembled on the supporter 70.
Accompanying drawing 18 shows another variant embodiment of the array camera module, wherein the molded body 232
Top surface forms at least one groove 235, is assembled in the quilt of the supporter 70 of the top surface of the molded base 232
It is contained in the groove 235, further to reduce the height dimension of the array camera module, now, the driver 30
Or the lens barrel 60 can be by direct-assembling in the top surface of the molded body 232.
Nevertheless, it will be appreciated by those skilled in the art that, in its of the array camera module of the present invention
In his example, the optical lens 10 can also be by direct-assembling in the top surface of the molded body 232 or by directly group
Top surface loaded on the supporter 70.
Other side under this invention, refer to the attached drawing 19, the present invention further provides one to carry array camera module
Electronic equipment, wherein the electronic equipment with array camera module includes an electronic equipment body 200 and at least an array
Camera module, wherein each array camera module is arranged at the electronic equipment body 200 respectively, scheme for obtaining
Shape.Other side under this invention, the present invention further provides the manufacture method of a molding photosensory assembly 20, wherein the system
The method of making comprises the following steps：
(a) at least two photo-sensitive cells 21 and an at least wiring board 22 are connected by one group of lead 24；
(b) each photo-sensitive cell 21 and each wiring board 22 are positioned over mould on the one of a molding tool 100
Tool 101 or once mould 102；
(c) during the mold 101 and the matched moulds of lower mould 102, by an at least supporting member 25 to
The upper support mold 101, to prevent the stitching surface 1011 of the mold 101 from applying pressure to lead 24 described in every group；And
(d) fluid is added into the molding space 103 formed between the mold 101 and the lower mould 102
The moulding material of shape, to form a molded base 23 after the mold material cures, wherein the molded base 23 includes one
Molded body 232 and there are at least two optical windows 231, wherein the molded body 232 coats the edge of each wiring board 22
At least a portion of the part in region 223 and the supporting member 25, the photosensitive region 212 of each photo-sensitive cell 21 divide
Dui Yingyu not each optical window 231.
It will be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing be only used as citing and
It is not intended to limit the present invention.
The purpose of the present invention completely and effectively realizes.The function and structural principle of the present invention is opened up in embodiment
Show and illustrate, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (41)
- A 1. molding photosensory assembly, it is characterised in that including：At least supporting member formed by first medium；An at least wiring board, wherein each wiring board has an at least chip attachment region respectively；At least two photo-sensitive cells, wherein each photo-sensitive cell is mounted on each core of each wiring board respectively Piece pasting area；At least two groups of leads, wherein the both ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；AndThe molded base formed by second medium, wherein the module pedestal includes a molded body and has at least two light Window, wherein when the molded body is molded, the supporting member protects lead, the wiring board and the photosensitive member Part, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and And the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base.
- 2. molding photosensory assembly according to claim 1, wherein the molding photosensory assembly includes two supporting members Part, a wiring board, lead described in two photo-sensitive cells and two groups, and the wiring board has described in two Chip attachment region.
- 3. molding photosensory assembly according to claim 1, wherein the molding photosensory assembly includes two supporting members Part, two wiring boards, lead described in two photo-sensitive cells and two groups, and each wiring board has respectively One chip attachment region.
- 4. molding photosensory assembly according to claim 1, further comprise an at least electronic component, wherein the circuit Plate has a fringe region, and the fringe region and the chip attachment region are integrally formed, each electronic component The fringe region is mounted on respectively, wherein the supporting member is located at the institute of the appliance component and the photo-sensitive cell State between photosensitive region.
- 5. according to any described molding photosensory assembly in Claims 1-4, wherein the supporting member includes the branch of a frame shape Hold main body and there is a through hole, the supporting main body is arranged at the outside of the photosensitive region of the photo-sensitive cell, described The photosensitive region of photo-sensitive cell corresponds to the through hole, wherein one of the molded body cladding supporting main body Point.
- 6. molding photosensory assembly according to claim 5, wherein the supporting main body have a top surface, a medial surface with And a lateral surface, the top surface respectively inwards and stretch out to be connected to the medial surface and the lateral surface, it is described in Side forms the through hole, wherein the molded body at least coats the lateral surface of the supporting main body.
- 7. molding photosensory assembly according to claim 5, wherein the supporting main body have a top surface, a medial surface with And a lateral surface, the top surface respectively inwards and stretch out to be connected to the medial surface and the lateral surface, it is described in Side forms the through hole, wherein the lateral surface and the top surface of the molded body cladding supporting main body are extremely A few part.
- 8. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least a portion of the chip inside portion of photo-sensitive cell.
- 9. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least a portion of the chip connecting portion of photo-sensitive cell.
- 10. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least a portion of the chip outside portion of photo-sensitive cell.
- 11. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least a portion of the chip inside portion of photo-sensitive cell and at least a portion of the chip connecting portion.
- 12. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least a portion of the chip connecting portion of photo-sensitive cell and at least a portion of the chip outside portion.
- 13. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the supporting main body cladding institute State at least the one of at least a portion of the chip inside portion of photo-sensitive cell, the chip connecting portion and the chip outside portion Part.
- 14. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats at least a portion of the wiring board inside portion of the wiring board.
- 15. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats at least a portion of the wiring board connecting portion of the wiring board.
- 16. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats a part for the wiring board outside portion of the wiring board.
- 17. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats at least a portion of the wiring board inside portion of the wiring board and the wiring board connecting portion At least partially.
- 18. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats at least a portion of the wiring board connecting portion of the wiring board and the wiring board outside portion A part.
- 19. molding photosensory assembly according to claim 7, wherein the fringe region of the wiring board includes a circuit Plate inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board Connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein The supporting main body coats at least a portion, the wiring board connecting portion and the institute of the wiring board inside portion of the wiring board State a part for wiring board outside portion.
- 20. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the side of the wiring board Edge region includes a wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector quilt The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively The both sides of socket part, wherein the supporting main body coats at least a portion and the institute of the wiring board inside portion of the wiring board State at least a portion of the chip outside portion of photo-sensitive cell.
- 21. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the side of the wiring board Edge region includes a wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector quilt The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively The both sides of socket part, wherein the supporting main body coats the wiring board inside portion of the wiring board and the wiring board connecting portion At least a portion and the photo-sensitive cell the chip outside portion at least a portion.
- 22. molding photosensory assembly according to claim 7, wherein the non-photo-sensing region of the photo-sensitive cell includes a chip Inside portion, a chip connecting portion and a chip outside portion, the chip contacts are arranged at the chip connecting portion, described Chip inside portion and the chip outside portion are located at the both sides of the chip connecting portion respectively, wherein the side of the wiring board Edge region includes a wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector quilt The wiring board connecting portion is arranged at, the wiring board inside portion and the wiring board outside portion connect positioned at the wiring board respectively The both sides of socket part, wherein the supporting main body coats the wiring board inside portion of the wiring board, the wiring board connecting portion With the part of the wiring board outside portion and at least a portion of the chip outside portion of the photo-sensitive cell.
- 23. molding photosensory assembly according to claim 20, wherein the supporting main body further coats the photosensitive member At least a portion of the chip connecting portion of part.
- 24. molding photosensory assembly according to claim 21, wherein the supporting main body further coats the photosensitive member At least a portion of the chip connecting portion of part.
- 25. molding photosensory assembly according to claim 22, wherein the supporting main body further coats the photosensitive member At least a portion of the chip connecting portion of part.
- 26. molding photosensory assembly according to claim 23, wherein the supporting main body further coats the photosensitive member At least a portion of the chip inside portion of part.
- 27. molding photosensory assembly according to claim 24, wherein the supporting main body further coats the photosensitive member At least a portion of the chip inside portion of part.
- 28. molding photosensory assembly according to claim 25, wherein the supporting main body further coats the photosensitive member At least a portion of the chip inside portion of part.
- 29. an array camera module, it is characterised in that including：At least two optical lens；AndOne molding photosensory assembly, wherein the molding photosensory assembly further comprises：At least supporting member formed by first medium；An at least wiring board, wherein each wiring board has an at least chip attachment region respectively；At least two photo-sensitive cells, wherein each photo-sensitive cell is mounted on each core of each wiring board respectively Piece pasting area；At least two groups of leads, wherein the both ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；AndThe molded base formed by second medium, wherein the module pedestal includes a molded body and has at least two light Window, wherein when the molded body is molded, the supporting member protects lead, the wiring board and the photosensitive member Part, after molded body shaping, a part of the molded body at least with each wiring board is integratedly combined, and And the photosensitive region of each photo-sensitive cell corresponds respectively to each optical window of the molded base, each optics Camera lens is arranged at the photosensitive path of each photo-sensitive cell respectively, using by the optical window as the optical lens and described Photo-sensitive cell provides a passage of light.
- 30. array camera module according to claim 29, further comprise at least two drivers, wherein each light Learn camera lens and be assembled in each driver respectively, each driver is assembled in the top table of the molded body respectively Face.
- 31. array camera module according to claim 29, further comprise an at least driver and an at least lens barrel, often The individual optical lens is assembled in each driver and each lens barrel respectively, wherein each driver and every The individual lens barrel is located at the diverse location of the top surface of the molded body respectively.
- 32. array camera module according to claim 29, further comprise at least two lens barrels, wherein each lens barrel The top surface of the molded body is integrally formed in respectively, and each optical lens is assembled in each mirror respectively Cylinder；Or further comprising at least two lens barrels, lens barrel described in wherein at least one is integrally formed in the top of the molded body Surface, the other lens barrel are mounted on the top surface of the molded body, and each optical lens is assembled in respectively Each lens barrel；Or two lens barrels of top surface of the array camera module including being mounted on the molded body, often The individual optical lens is assembled in each lens barrel respectively.
- 33. array camera module according to claim 30, further comprise an at least filter element, wherein each described Filter element is assembled in the top surface of the molded body respectively so that each filter element be maintained at it is each described Between optical lens and each photo-sensitive cell.
- 34. array camera module according to claim 33, wherein the top surface of the molded body has at least two Side surface and an outer surface, wherein each filter element is assembled in each inner side of the molded body respectively Surface, each driver are assembled in the diverse location of the outer surface of the molded body respectively.
- 35. array camera module according to claim 34, wherein where the inner surface of the molded body Plane is less than the plane where the outer surface, to form an at least groove for the molded body, wherein each filter Optical element is respectively positioned at each groove.
- 36. according to any described array camera module in claim 29 to 35, wherein the supporting member includes a frame shape Supporting main body and there is a through hole, it is described supporting main body be arranged at the photo-sensitive cell the photosensitive region outside, The photosensitive region of the photo-sensitive cell corresponds to the through hole, wherein the one of the molded body cladding supporting main body Part.
- 37. array camera module according to claim 36, wherein the supporting main body coats the edge of the wiring board The part in region.
- 38. array camera module according to claim 36, wherein the supporting main body coats the non-of the photo-sensitive cell At least a portion of photosensitive region.
- 39. array camera module according to claim 36, wherein the supporting main body coats the wiring board simultaneously At least a portion in the non-photo-sensing region of a part for fringe region and the photo-sensitive cell.
- 40. array camera module according to claim 29, further comprise an at least supporter and at least one optical filtering member Part, wherein each filter element is assembled in each supporter, each supporter is assembled in described respectively The top surface of molded body, so that each filter element is maintained at each optical lens and each photosensitive member Between part.
- A 41. electronic equipment, it is characterised in that including：One electronic equipment body；WithAccording to any described array camera module in claim 29 to 40, wherein the array camera module quilt The electronic equipment body is arranged at, for obtaining image.
Priority Applications (38)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610669214.7A CN107734216B (en) | 2016-08-12 | 2016-08-12 | Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module |
| EP16896568.9A EP3468165B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018550699A JP7025345B2 (en) | 2016-03-28 | 2016-10-25 | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices |
| KR1020187031125A KR102152516B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| PCT/CN2016/103247 WO2017166798A1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| EP23176877.1A EP4231653A3 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020187029337A KR102193819B1 (en) | 2016-03-12 | 2016-10-28 | Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device |
| US15/317,117 US10908324B2 (en) | 2016-03-12 | 2016-10-28 | Molded photosensitive assembly of array imaging module |
| PCT/CN2016/103736 WO2017157015A1 (en) | 2016-03-12 | 2016-10-28 | Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020207036129A KR102335306B1 (en) | 2016-03-12 | 2016-10-28 | Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device |
| EP16894174.8A EP3429181B1 (en) | 2016-03-12 | 2016-10-28 | Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018547880A JP2019519087A (en) | 2016-03-12 | 2016-10-28 | Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices |
| TW106108124A TWI703715B (en) | 2016-03-12 | 2017-03-13 | Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment |
| TW106203473U TWM565451U (en) | 2016-03-12 | 2017-03-13 | Array camera module, its molded photosensitive element and electronic equipment |
| TW106110048A TWI661258B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW108117229A TWI706213B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
| TW108117228A TWI706212B (en) | 2016-03-28 | 2017-03-25 | Camera module and manufacturing method of moulded photosensitive component |
| TW106204228U TWM555960U (en) | 2016-03-28 | 2017-03-26 | Camera module and its molded photosensitive component and electronic device |
| US15/473,573 US9781325B1 (en) | 2016-03-12 | 2017-03-29 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| US15/473,605 US10033913B2 (en) | 2016-03-12 | 2017-03-30 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| US15/473,607 US9826132B2 (en) | 2016-03-12 | 2017-03-30 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| US15/473,609 US9906700B2 (en) | 2016-03-12 | 2017-03-30 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| JP2018556877A JP6865232B2 (en) | 2016-04-28 | 2017-04-26 | Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices. |
| KR1020207019834A KR102281383B1 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| PCT/CN2017/082000 WO2017186120A2 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020187034256A KR102147896B1 (en) | 2016-04-28 | 2017-04-26 | Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device |
| EP17788772.6A EP3481046B1 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020217022035A KR20210091363A (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| US15/679,146 US10274694B2 (en) | 2016-03-12 | 2017-08-16 | Manufacturing method of a molded photosensitive assembly of an array imaging module |
| US15/705,232 US10126519B2 (en) | 2016-03-12 | 2017-09-14 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| US15/705,225 US10175447B2 (en) | 2016-03-12 | 2017-09-14 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| US15/784,167 US10578837B2 (en) | 2016-03-12 | 2017-10-15 | Molded photosensitive assembly for array imaging module for electronic device |
| US16/737,863 US20200218034A1 (en) | 2016-03-12 | 2020-01-08 | Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof |
| US17/114,466 US11822099B2 (en) | 2016-03-12 | 2020-12-07 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device |
| JP2021060338A JP7344924B2 (en) | 2016-04-28 | 2021-03-31 | Imaging module manufacturing method |
| US17/678,347 US11824071B2 (en) | 2016-03-28 | 2022-02-23 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device |
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610669214.7A CN107734216B (en) | 2016-08-12 | 2016-08-12 | Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module |
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| Publication Number | Publication Date |
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| CN107734216A true CN107734216A (en) | 2018-02-23 |
| CN107734216B CN107734216B (en) | 2023-12-26 |
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| CN110634960A (en) * | 2018-06-21 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Photosensitive component, camera module, corresponding terminal equipment and manufacturing method |
| CN110636186A (en) * | 2018-06-22 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Molded photosensitive component and camera module, manufacturing method thereof, and electronic device |
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| CN110364540A (en) * | 2018-04-09 | 2019-10-22 | 宁波舜宇光电信息有限公司 | Photosensitive component, camera module and manufacturing method thereof |
| CN110634960A (en) * | 2018-06-21 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Photosensitive component, camera module, corresponding terminal equipment and manufacturing method |
| CN110634960B (en) * | 2018-06-21 | 2024-02-02 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, corresponding terminal equipment and manufacturing method |
| CN110636186A (en) * | 2018-06-22 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Molded photosensitive component and camera module, manufacturing method thereof, and electronic device |
| CN112272943A (en) * | 2018-06-22 | 2021-01-26 | 宁波舜宇光电信息有限公司 | Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment |
| CN112272943B (en) * | 2018-06-22 | 2022-03-22 | 宁波舜宇光电信息有限公司 | Molded photosensitive component and camera module, manufacturing method thereof, and electronic device |
| CN110636186B (en) * | 2018-06-22 | 2024-12-31 | 宁波舜宇光电信息有限公司 | Molded photosensitive component and camera module and manufacturing method thereof and electronic device |
| CN110719385A (en) * | 2018-07-11 | 2020-01-21 | 三星电机株式会社 | Camera module |
| US11356582B2 (en) | 2018-07-11 | 2022-06-07 | Samsung Electro-Mechanics Co., Ltd. | Camera module with gap maintaining member |
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