CN107734885B - Shell manufacturing method, shell and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses a shell manufacturing method, a shell and electronic equipment, wherein the shell manufacturing method comprises the following steps: firstly, providing a shell, and polishing the outer surface of the shell; then, carrying out oxidation treatment on the outer surface of the polished shell; carrying out physical vapor deposition treatment on the outer surface of the shell after the oxidation treatment, and forming a bonding layer on the outer surface of the shell; and performing at least one paint spraying treatment on the outer surface of the shell after the physical vapor deposition treatment to form at least one paint layer on the outer surface of the shell, wherein the at least one paint layer is formed on the bonding layer. The paint layer is located the outermost layer of casing surface, can make casing surface smooth and flat, difficult finger print that glues, can keep the casing surface clean and tidy.

Description

Shell manufacturing method, shell and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shell manufacturing method, a shell and electronic equipment.

Background

At present, the raw materials for preparing and processing the shell of electronic equipment, such as a mobile phone and a tablet personal computer, are usually aluminum materials, and the commercially available aluminum materials cannot be directly used due to the problems of hardness and the like. The raw aluminum material needs to be processed for multiple times to form the required shell structure. However, after the shell in the prior art is processed, fingerprint marks are easily adhered to the outer surface of the shell.

Disclosure of Invention

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment, which can reduce fingerprint sticking on the outer surface of the shell.

In a first aspect, an embodiment of the present application provides a method for manufacturing a housing, where the housing is applied to an electronic device, and the method for manufacturing the housing includes:

providing a shell;

polishing the outer surface of the shell;

carrying out oxidation treatment on the outer surface of the polished shell;

carrying out physical vapor deposition treatment on the outer surface of the shell after the oxidation treatment to form a bonding layer on the outer surface of the shell;

and performing at least one paint spraying treatment on the outer surface of the shell after the physical vapor deposition treatment to form at least one paint layer on the outer surface of the shell, wherein the at least one paint layer is formed on the bonding layer.

In a second aspect, embodiments of the present application further provide a housing, where the housing is formed by using the housing manufacturing method described above.

In a third aspect, embodiments of the present application further provide a housing, which is applied to an electronic device, and includes an inner surface and an outer surface that are opposite to each other, and the housing includes an oxide layer, a bonding layer, and at least one paint layer, the oxide layer is formed on the outer surface of the housing, the bonding layer is formed on the oxide layer, and the at least one paint layer is formed on the bonding layer.

In a fourth aspect, an embodiment of the present application further provides an electronic device, which includes a housing, where the housing is the housing described above.

The method for manufacturing the shell comprises the following steps of firstly, providing the shell, and polishing the outer surface of the shell; then, carrying out oxidation treatment on the outer surface of the polished shell; carrying out physical vapor deposition treatment on the outer surface of the shell after the oxidation treatment, and forming a bonding layer on the outer surface of the shell; and performing at least one paint spraying treatment on the outer surface of the shell after the physical vapor deposition treatment to form at least one paint layer on the outer surface of the shell, wherein the at least one paint layer is formed on the bonding layer. The bonding layer formed by physical vapor deposition treatment and the paint layer formed by spray painting treatment can increase the bonding force between the paint layer and the oxide layer, and the protection effect on the outer surface of the shell is better. And the paint layer is positioned on the outermost layer of the outer surface of the shell, so that the surface of the shell is smooth and flat, fingerprints are not easy to stick, and the outer surface of the shell can be kept clean.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 4 is a cross-sectional view in the direction a-a of fig. 3.

Fig. 5 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 6 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 7 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 8 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 9 is another cross-sectional view in the direction a-a of fig. 3.

Fig. 10 is another schematic structural diagram of the housing according to the embodiment of the present application.

Fig. 11 is another schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 12 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 13 is a schematic flow chart of a method for manufacturing a rear cover according to an embodiment of the present application.

Fig. 14 is a schematic flow chart of a painting process according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment. The details will be described below separately.

In the present embodiment, the method for manufacturing the rear cover will be described in terms of a method for manufacturing the rear cover, which may form a housing that may be provided in an electronic device, such as a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), and the like.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 1 comprises a housing 10, a display 20, a printed circuit board 30, and a battery 40.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present disclosure. Wherein, the casing 10 may include a cover plate 11, a middle frame 12 and a rear cover 13, the cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the casing 10, and the casing 10 has a closed space formed by the cover plate 11, the middle frame 12 and the rear cover 13 to accommodate the display screen 20, the printed circuit board 30, the battery 40 and the like. In some embodiments, the cover plate 11 is covered on the middle frame 12, the rear cover 13 is covered on the middle frame 12, the cover plate 11 and the rear cover 13 are located on opposite sides of the middle frame 12, the cover plate 11 and the rear cover 13 are oppositely arranged, and the closed space of the housing 10 is located between the cover plate 11 and the rear cover 13.

The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire. The middle frame 12 may be a metal casing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the middle frame 12 can be a ceramic middle frame or a glass middle frame. For another example: the middle frame 12 may be a plastic middle frame. Also for example: the middle frame 12 may be a structure in which metal and plastic are matched with each other, and the plastic part may be formed by injection molding on a metal plate. Wherein the rear cover 13 may be a metal rear cover, such as an aluminum alloy rear cover.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present disclosure. The rear cover 13 may include an inner surface 131 and an outer surface 132 opposite to each other, the inner surface 131 of the rear cover 13 is close to the middle frame 12 and the cover plate 11 to form an inner surface of the housing 10, and the outer surface 132 of the rear cover 13 is far from the middle frame 12 and the cover plate 11 to form an outer surface of the housing 10. The rear cover 13 may further include a crater 133, and the crater 133 may mount a camera.

Referring to fig. 4, fig. 4 is a cross-sectional view taken along a-a direction of fig. 3. The rear cover 13a may include a rear cover substrate 137, an oxide layer 134, and a paint layer 136.

The rear cover substrate 137 may be made of aluminum, such as aluminum alloy. The rear cover substrate 137 includes an inner surface 131 and an outer surface 132, the inner surface of the rear cover substrate 137 may be understood as an inner surface of the rear cover 13, and the outer surface of the rear cover substrate 137 may be understood as an outer surface before the rear cover is not oxidized, painted, or the like.

Wherein an oxide layer 134 is formed on the outer surface 132 of the back cover substrate 137. The oxide layer 134 may be formed by a single oxidation to form an oxide layer 134. Such as: the oxide layer 134 is formed by monochromatic oxidation, and may be formed by coloring after the oxidation process. It should be noted that in some embodiments, a multi-layer oxide layer may also be formed by two or more oxidations.

Such as: referring to fig. 5, fig. 5 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 5 differs from fig. 4 in that: the oxide layer 134 of the back cover 13b includes two layers, i.e., a first oxide layer 1341 and a second oxide layer 1342. A first oxide layer 1341 is formed on the outer surface 132 of the back cover substrate 137 and a second oxide layer 1342 is formed on the first oxide layer 1341, which may cover only a portion of the first oxide layer in some embodiments. The first oxide layer 1341 and the second oxide layer 1342 may increase the bonding force with the paint layer 136. The multi-layer structure of the oxide layer is not illustrated here. In some embodiments, the first oxide layer may be a colored oxide layer, and the second oxide layer may also be a colored oxide layer. The color of the first oxide layer may be different from or the same as the color of the second oxide layer.

Wherein the paint layer 136 is formed on the oxide layer 134, and the oxide layer 134 is located between the paint layer 136 and the back cover substrate 137. In some embodiments, the paint layer 136 may be formed by spraying a layer of paint on the oxide layer 134. The paint layer 136 is located on the outermost layer of the outer surface of the rear cover 13, and the surface of the paint layer is smooth and flat, so that fingerprint is not easy to stick on the paint layer, and the outer surface of the rear cover can be kept clean and smooth.

It is noted that in some embodiments, two or more layers of paint may be sprayed on the oxide layer 134 to form two or more paint layers. Such as: referring to fig. 6, fig. 6 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 6 differs from fig. 4 in that: the paint layers 136 of the rear cover 13c include a first paint layer 1361 and a second paint layer 1362. The first paint layer 1361 is formed on the oxide layer 134 and the second paint layer 1362 is formed on the first paint layer 1361. In some embodiments, the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361, and further, the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as the thickness of the second paint layer 1362 is 10um and the thickness of the first paint layer 1361 is 5 um. It should be noted that there may be some error value in the production process, such as an error value of 0.5um, for example, between the second paint layer 1362 and the first paint layer 1361. The setting of second paint layer and first paint layer thickness can provide better protection to the back lid surface, makes the bonding inseparabler moreover between the two-layer paint layer.

For another example: referring to fig. 7, fig. 7 is another cross-sectional view taken along a-a direction of fig. 3. Fig. 7 differs from fig. 4 in that: the paint layers 136 of the rear cover 13d include a first paint layer 1361, a second paint layer 1362 and a third paint layer 1363. The first paint layer 1361 is formed on the oxide layer 134, the second paint layer 1362 is formed on the first paint layer 1361, and the third paint layer 1363 is formed on the second paint layer 1362. Forming two or three paint layers on the oxide layer 134 may increase the bonding force between the oxide layer and the paint layer, and may provide better protection for the rear cover. In some embodiments, the thickness of the third paint layer 1363 is greater than the thickness of the second paint layer 1362, and the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361. Further, the thickness of the third paint layer 1363 is twice the thickness of the second paint layer 1362, the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, for example, the thickness of the third paint layer 1363 is 8um, the thickness of the second paint layer 1362 is 4um, and the thickness of the first paint layer 1361 is 2 um.

In some embodiments, the thicknesses of the third paint layer 1363, the second paint layer 1362, and the first paint layer 1361 are sequentially reduced by equal thickness, such as the thickness of the third paint layer 1363 is 9um, the thickness of the second paint layer 1362 is 6um, and the thickness of the first paint layer 1361 is 3 um. The setting of third paint layer, second paint layer and first paint layer thickness can provide better protection to the back lid surface, makes bonding more inseparabler between the three-layer paint layer moreover.

In some embodiments, the paint layer may be provided transparently. It should be noted that when the paint layers are at least two layers, at least one of the paint layers may be disposed to be transparent. Further, all paint layers are arranged in a transparent mode. The back cover oxide layer is the color of the outer surface of the back cover.

To increase the bonding force between the paint layer 136 and the oxide layer 134, in some embodiments, please refer to fig. 8, which is another cross-sectional view of fig. 4 along the direction a-a. Fig. 8 differs from fig. 4 in that: the rear cover 13e may further include a bonding layer 135. The bonding layer 135 is formed on the oxide layer 134, and the paint layer 136 is formed on the bonding layer 135. In some embodiments, the bonding layer 135 may be formed on the oxide layer 134 by PVD (Physical Vapor Deposition). The bonding layer 135 is positioned between the oxide layer 134 and the paint layer 136, and may increase the bonding force between the oxide layer 134 and the paint layer 136. It should be noted that, in the embodiments of the present application, the bonding layer may also be formed on the oxide layer in other manners to increase the bonding force between the oxide layer and the paint layer.

In some embodiments, referring to fig. 9, fig. 9 is another cross-sectional view of fig. 4 in the direction of a-a, where fig. 9 differs from fig. 4 in that: the concave-convex structure 1371 is formed on the outer surface of the rear cover 13f and the rear cover substrate 137, and the concave-convex structure 1371 can be formed by a sand blasting machine in a sand blasting mode, so that the outer surface of the rear cover substrate 137 is clean and rough, and the bonding force between the oxide layer 134 and the paint layer 136 formed on the concave-convex structure 1371 can be increased.

It should be noted that the structure of the rear cover is not limited to this, for example: the rear cover may include two or more oxide layers, two or more paint layers. For another example: the rear cover may include two or more oxide layers, two or more paint layers, and an anchor layer. For another example: the rear cover may include two or more oxide layers, two or more paint layers, and an anchor layer. It should be noted that the number of layers of the oxide layer, the bonding layer, and the paint layer is not illustrated, and all of them are within the protection scope of the embodiments of the present application.

It should be noted that the structure of the housing according to the embodiment of the present application is not limited to this, for example, please refer to fig. 10, and fig. 10 is a schematic view of another structure of the housing according to the embodiment of the present application. Among them, a case 10a shown in fig. 10 includes a cover plate 16 and a rear cover 17. In some embodiments, the cover plate 16 is directly covered on the rear cover 17, the cover plate 16 and the rear cover 17 are combined with each other to form the housing 10a, and the housing 10a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate the display 20, the printed circuit board 30, the battery 40, and the like. Compared with the housing 10 shown in fig. 2, the housing 10a does not include the middle frame, or the middle frame 12 and the rear cover 13 in fig. 2 are integrally formed to form a rear cover 17 structure (of course, the middle frame structure may be named herein). Specifically, please refer to fig. 11, fig. 11 is another schematic structural diagram of the rear cover according to the embodiment of the present application. In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172, with the inner surface 171 and the outer surface 172 being oppositely disposed to form the entire surface of the rear cover 17. The various layers of the rear cover 17 can be referred to as the rear cover 13, and are not described in detail here.

The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 may be a main board of the electronic device 1, and functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, and a processor may be integrated on the printed circuit board 30. In some embodiments, the printed circuit board 30 is secured within the housing 10. Specifically, the printed circuit board 30 may be screwed to the middle frame 12 by screws, or may be snapped to the middle frame 12 by a snap-fit manner. It should be noted that the way of fixing the printed circuit board 30 to the middle frame 12 is not limited to this, and other ways, such as a way of fixing by a snap and a screw, may also be used.

Wherein the battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic device 1. The case 10 may serve as a battery cover of the battery 40. The case 10 covers the battery 40 to protect the battery 40, and particularly, the rear cover 13 covers the battery 40 to protect the battery 40, reducing damage to the battery 40 due to a collision, a fall, or the like of the electronic apparatus 1.

Wherein the display screen 20 is installed in the housing 10, and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1. The display screen 20 includes a display area 14 and a non-display area 15. The display area 14 may be used to display a screen of the electronic device 1 or provide a user with touch control. The top area of the non-display area 15 is provided with an opening for transmitting sound and light, and the bottom of the non-display area 15 can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20, and forms the same display area and non-display area as the display screen 20, which can be referred to specifically as the display area and the non-display area of the display screen 20.

The structure of the display screen 20 is not limited to this. For example, the display screen may be a full-screen or an opposite-type screen, specifically, please refer to fig. 12, and fig. 12 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device in fig. 12 differs from the electronic device in fig. 1 in that: the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is provided with a transparent structure so that an optical signal can pass through, or the non-display area of the display screen 20a is directly provided with an opening or a notch for light conduction, and the like, and a front camera, a photoelectric sensor, and the like can be arranged at the position of the non-display area so that the front camera can take a picture and the photoelectric sensor can detect. The display area 14a is spread over the entire surface of the electronic apparatus 1 a. It should be noted that the components of the housing 10, the printed circuit board 30, the battery 40, and the like in the electronic device 1a can refer to the above contents, and are not described herein again.

In order to further describe the housing structure of the embodiments of the present application, a housing manufacturing method is taken as an example and described in detail below. The manufacturing method of the housing may specifically include a rear cover manufacturing method and a middle frame manufacturing method. The following description will be made by taking a method for manufacturing a case and a method for manufacturing a rear cover as an example, and it is to be understood that the method for manufacturing a case in the embodiment of the present application is not limited to the rear cover.

Referring to fig. 13, fig. 13 is a schematic flow chart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure. The manufacturing method of the rear cover comprises the following steps:

in step 101, a back cover is provided. The rear cover may be a metal material, such as aluminum, and further, such as aluminum alloy. The rear cover may be purchased directly or may be obtained by processing a plate material, for example, forging an aluminum alloy plate material, and performing aging treatment.

The rear cover may include an inner surface and an outer surface which are oppositely disposed, and the rear cover and the inner surface and the outer surface thereof may refer to the above contents, which are not described herein again.

In step 102, the outer surface of the back cover is polished. So that the outer surface of the rear cover is flat.

In some embodiments, the outer surface of the back cover may be polished mechanically, chemically, electrochemically, ultrasonically, or the like. So that the roughness of the surface of the rear cover is reduced to obtain a bright and flat surface of the outer surface of the rear cover. Wherein, the chemical polishing mode is to regularly dissolve the outer surface of the rear cover to achieve smoothness and flatness. The electrochemical polishing mode is that the outer surface of the back cover is used as an anode, insoluble metal is used as a cathode, the two electrodes are immersed into an electrolytic tank at the same time, and direct current is conducted to generate selective anode solution, so that the brightness of the outer surface of the back cover is increased. The mechanical polishing mode is that the outer surface of the back cover is cut to make the outer surface of the back cover plastically deform to remove the polished convex part and obtain a smooth surface. The ultrasonic polishing mode is that the back cover is put into the abrasive suspension and put into the ultrasonic field together, and the abrasive is ground and polished on the surface of the workpiece by means of the oscillation action of the ultrasonic wave.

In some embodiments, before polishing the outer surface of the rear cover, the outer surface of the rear cover may be polished, and then the outer surface of the rear cover after polishing is polished, so that the polishing effect is better, and the outer surface of the rear cover is smoother. Here, it should be noted that the grinding process is understood as a rough process before the polishing process. Namely, the outer surface of the rear cover can be subjected to rough grinding and then fine grinding to finish polishing treatment.

In step 103, the outer surface of the rear cover after the polishing process is subjected to an oxidation process.

In some embodiments, the polished outer surface of the back cover may be subjected to at least one oxidation process to form an oxide layer, or oxide film. Each oxidation may be colored during the oxidation process to provide the desired appearance color. Such as: the outer surface of the polished back cover may be subjected to a primary oxidation process to form an oxide layer, and a coloring process after the oxidation process to form a desired color, such as red, blue, etc.

In some embodiments, the outer surface of the polished back cover may be oxidized twice or more to form at least two oxide layers, and the oxide layers may be colored during the oxidation process to form a desired appearance color. The protection effect on the outer surface of the rear cover is better through two or more times of oxidation treatment, and the bonding force between at least two layers formed after two or more times of oxidation and the paint layer is better.

In step 104, the outer surface of the back cover after the oxidation treatment is subjected to a physical vapor deposition treatment to form a bonding layer on the outer surface of the back cover.

After the oxidation treatment, in order to increase the bonding force between the paint layer and the oxide layer, a bonding layer may be formed on the oxide layer by physical vapor deposition, and then a paint spraying treatment may be performed on the bonding layer to form the paint layer. The bonding layer can increase the bonding force of the oxide layer and the paint layer, and the protection effect on the outer surface of the shell is better.

In step 105, at least one paint spraying process is performed on the outer surface of the rear cover after the pvd process, so as to form at least one paint layer on the outer surface of the rear cover. The at least one paint layer is formed on the oxide layer, and in particular on the bonding layer, which is located between the oxide layer and the paint layer. The at least one paint layer is positioned on the outermost layer of the outer surface of the rear cover, the surface of the paint layer is smooth and flat, fingerprints are not easy to stick, and the outer surface of the rear cover can be kept clean and smooth.

In some embodiments, a single painting process may be performed on the bonding layer to form a single paint layer, or two or more painting processes may be performed on the bonding layer to form two or more paint layers. When the oxide layer has only one layer or two or more layers, a paint layer may be formed by directly performing a painting process on the bonding layer once, or two or more paint layers may be formed by performing a painting process on the bonding layer twice or more.

In some embodiments, after the physical vapor deposition process is performed on the outer surface of the rear cover at least once, the outer surface of the rear cover may be baked at least once, and a high temperature baking may be used to dry the paint sprayed on the outer surface of the rear cover to form a paint layer. For example, the baking temperature is 80 ℃ and the baking time is 1 hour, and the outer surface of the rear cover is baked. It should be noted that, after each paint spraying treatment, a baking treatment may be performed. Referring to fig. 14, fig. 14 is a schematic flow chart of a painting process according to an embodiment of the present application. The process of the paint spraying treatment comprises the following steps:

in step 1051, a first painting process is performed on the exterior surface of the physical vapor deposition-treated back cover. And spraying paint for the first time on the outer surface of the rear cover after physical vapor deposition treatment, and spraying transparent paint.

In step 1052, a first baking process is performed on the outer surface of the rear cover after the first paint spraying process, so as to form a first paint layer on the outer surface of the rear cover. The first painting process and the baking process may increase the bonding force of the oxide layer and the first paint.

In step 1053, a second painting process is performed on the outer surface of the rear cover after the first baking process. And performing secondary paint spraying treatment on the outer surface of the rear cover after the primary baking treatment, and spraying transparent paint.

In step 1054, a second baking process is performed on the outer surface of the rear cover after the second paint spraying process, so that a second paint layer is formed on the outer surface of the rear cover, and the second paint layer is formed on the first paint layer.

In some embodiments, the first and second paint layers are both formed of clear paint. It should be noted that one of the first and second paint layers may be a transparent paint layer.

It should be noted that three paint spraying treatments and three baking treatments may also be performed, and are not described herein again. The thickness relationship among the paint layers can be referred to above, and is not described herein again.

In some embodiments, the outer surface of the rear cover after the polishing process may be subjected to a sand blasting process to form an uneven structure on the outer surface of the rear cover. Then, the outer surface of the back cover with the concave-convex structure is subjected to oxidation treatment. The concave-convex structure can increase the binding force between the oxide layer and the paint layer.

To sum up, the back lid manufacturing method that this application embodiment provided can form at least one deck oxide layer, anchor coat, one deck or two-layer or multilayer paint layer in proper order at the back lid surface, and the anchor coat can increase the cohesion with the paint layer, and the paint layer forms the outmost at back lid surface, and its surface is highlight, penetrating for its surface is smooth level and smooth, difficult sticky fingerprint, can keep back lid surface clean and tidy.

Those skilled in the art will appreciate that the structure of the electronic device 1 shown in fig. 1 does not constitute a limitation of the electronic device 1. The electronic device 1 may comprise more or fewer components than shown, or some components may be combined, or a different arrangement of components. The electronic device 1 may further include a memory, a bluetooth module, etc., which will not be described herein.

The above detailed description is provided for the housing manufacturing method, the housing and the electronic device provided in the embodiments of the present application, and the principle and the implementation of the present application are described in this document by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (11)

1. A method for making a casing, the casing being applied in an electronic device, wherein the method for making a casing comprises: provide a housing; polishing the outer surface of the shell; Oxidation treatment is performed on the outer surface of the shell after the polishing treatment; performing physical vapor deposition on the outer surface of the shell after the oxidation treatment, and forming a bonding layer on the outer surface of the shell; The outer surface of the casing after the physical vapor deposition treatment is sprayed for at least three times, and at least three paint layers are formed on the outer surface of the casing, including a first paint layer, a second paint layer and a third paint layer. A paint layer is formed on the bonding layer, the second paint layer is formed on the first paint layer, and the third paint layer is formed on the second paint layer; Wherein, the thicknesses of the third paint layer, the second paint layer and the first paint layer are successively decreasing in thickness; or The thickness of the third paint layer is twice the thickness of the second paint layer, and the thickness of the second paint layer is twice the thickness of the first paint layer to prevent the outer surface of the casing from sticking. Fingerprints. 2 . The method for manufacturing a casing according to claim 1 , wherein the step of performing at least three paint spraying treatments on the outer surface of the casing after the physical vapor deposition treatment comprises: 2 . Carrying out the first painting treatment on the outer surface of the casing after the physical vapor deposition treatment; performing a first baking treatment on the outer surface of the casing after the first spraying treatment, to form a first paint layer on the outer surface of the casing, and the first paint layer is formed on the bonding layer; Carrying out a second painting treatment on the outer surface of the shell after the first baking treatment; performing a second baking treatment on the outer surface of the casing after the second spraying treatment, to form a second paint layer on the outer surface of the casing, and the second paint layer is formed on the first paint layer; Carrying out a third painting treatment on the outer surface of the shell after the second baking treatment; A third baking treatment is performed on the outer surface of the casing after the third spraying treatment to form a third paint layer on the outer surface of the casing. 3 . The method for manufacturing a casing according to claim 2 , wherein at least one transparent paint layer is included in the first paint layer, the second paint layer and the third paint layer. 4 . 4. The shell manufacturing method according to claim 3, wherein the thickness of the third paint layer is 8um, the thickness of the second paint layer is 4um, and the thickness of the first paint layer is 2um . 5 . The method of claim 3 , wherein the thickness of the third paint layer is 9um, the thickness of the second paint layer is 6um, and the thickness of the first paint layer is 3um. 6 . 6. The method for manufacturing a casing according to any one of claims 1 to 5, wherein before the step of polishing the outer surface of the casing, the method further comprises: grinding the outer surface of the shell; The step of polishing the outer surface of the casing specifically includes: Polishing is performed on the outer surface of the casing after the grinding treatment. 7. A casing, used in electronic equipment, characterized in that the casing comprises an inner surface and an outer surface arranged oppositely, and the casing comprises an oxide layer, a bonding layer, a first paint layer, a second paint layer layer and a third paint layer, the oxide layer is formed on the outer surface of the housing, the bonding layer is formed on the oxide layer, the first paint layer is formed on the bonding layer, the second a paint layer is formed on the first paint layer, and the third paint layer is formed on the second paint layer; Wherein, the thicknesses of the third paint layer, the second paint layer and the first paint layer are successively decreasing in thickness; or The thickness of the third paint layer is twice the thickness of the second paint layer, and the thickness of the second paint layer is twice the thickness of the first paint layer to prevent the outer surface of the casing from sticking. Fingerprints. 8. The casing according to claim 7, wherein at least one of the first paint layer, the second paint layer and the third paint layer is transparent. 9. The casing according to claim 8, wherein the thickness of the third paint layer is 8um, the thickness of the second paint layer is 4um, and the thickness of the first paint layer is 2um. 10. The housing according to claim 8, wherein the thickness of the third paint layer is 9um, the thickness of the second paint layer is 6um, and the thickness of the first paint layer is 3um. 11 . An electronic device, characterized by comprising a casing, the casing being the casing according to any one of claims 7 to 10 .

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