CN107745226A - Electronic product component and manufacturing method thereof - Google Patents

Abstract

The invention relates to an electronic product component and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: providing a metal substrate, wherein the metal substrate comprises a first metal layer and a second metal layer which are mutually combined, and the hardness of the first metal layer is greater than that of the second metal layer; removing the first metal layer and part of the second metal layer in the first area of the metal substrate, forming a through hole in the second area of the metal substrate, and forming a plurality of protruding parts at intervals on the metal substrate; polishing the surfaces of the plurality of protruding parts to enable the top surface of the first metal layer of each protruding part to show a mirror surface effect; performing numerical control machining on the plurality of polished protrusions; the plurality of protrusions are made to fall off from the metal substrate or the plurality of protrusions are made to fall off from the metal substrate together with the second metal layer of the lower corresponding region. According to the manufacturing method of the electronic product component, the numerical control machining efficiency is greatly improved, and the overall machining cost is greatly reduced.

Description

Electronic product component and manufacturing method thereof

technical field

The invention relates to the technical field of mechanical processing, in particular to an electronic product component and a manufacturing method thereof.

Background technique

Nowadays, more and more electronic product shells use metal materials, such as mobile phone shells made of aluminum alloy and magnesium alloy, and the processing quality requirements of electronic product components are also getting higher and higher. During the manufacturing process of electronic product components using traditional materials, the surface texture and hardness are not good, and the appearance surface is difficult to achieve a mirror effect that meets the requirements, which is easy to cause surface scratches. The existing processing technology has limitations. Sexuality, unable to meet the needs of large quantities of industrial processing.

Contents of the invention

Based on this, it is necessary to provide an electronic product component with high processing efficiency, low cost and good processing effect and a manufacturing method thereof.

A method for manufacturing an electronic product component, comprising the steps of:

A metal substrate is provided, the metal substrate includes a first metal layer and a second metal layer bonded to each other, the first metal layer is located under the second metal layer, and the hardness of the first metal layer is greater than that of the first metal layer The hardness of the second metal layer;

removing the first metal layer and part of the second metal layer in the first region of the metal substrate, forming through holes in the second region of the metal substrate, so that a plurality of protrusions at intervals are formed on the metal substrate;

Polishing the surfaces of the plurality of protrusions, so that the top surface of the first metal layer of each protrusion can present a mirror effect;

Carrying out numerical control machining to the plurality of protrusions after the polishing treatment so that the contours of the plurality of protrusions all conform to the standard;

The plurality of protrusions are detached from the metal substrate or the plurality of protrusions and the second metal layer in the corresponding area below are detached from the metal substrate to obtain a plurality of electronic product components.

In one embodiment, the first metal layer is a stainless steel layer, and the second metal layer is an aluminum layer, an aluminum alloy layer, a magnesium layer or a magnesium alloy layer.

In one embodiment, the first metal layer is a 304 stainless steel layer, and the second metal layer is a 5052 aluminum alloy layer.

In one of the embodiments, the thickness of the first metal layer is smaller than the thickness of the second metal layer.

In one embodiment, the ratio of the thickness of the first metal layer to the thickness of the second metal layer is 1:2˜1:12.

In one of the embodiments, the plurality of protrusions are painted after the polishing treatment, so that the surface of the plurality of protrusions is formed with a UV paint layer; the plurality of protrusions remove the UV on the surface after numerical control machining. paint layer.

In one embodiment, a physical vapor deposition layer is formed on the surfaces of the plurality of protrusions after removal of the UV paint layer by means of physical vapor deposition.

In one of the embodiments, anti-fingerprint treatment is performed on the plurality of protrusions on which the physical vapor deposition layer is formed on the surface.

In one of the embodiments, grooves are formed when the plurality of protrusions are formed on the metal substrate, the plurality of protrusions are located in the grooves, spacers are formed in the grooves, so that the The groove is divided into a plurality of processing areas.

An electronic product component is manufactured by the above-mentioned manufacturing method of the electronic product component, and the electronic product component is an electronic product IO interface or a fingerprint key.

The manufacturing method of the above-mentioned electronic product components uses two layers of metal materials with different hardness to replace the traditional single material. The top surface of the first metal layer can present a mirror effect after being polished, and the whole has high strength, light weight, easy molding, and processing With stable characteristics, the efficiency of CNC machining is greatly improved, and the overall processing cost is greatly reduced.

Description of drawings

Fig. 1 is a block flow diagram of a manufacturing method of an electronic product component provided by an embodiment;

Fig. 2 is the schematic diagram of the three-dimensional structure of the metal substrate provided by the embodiment;

Fig. 3 is a three-dimensional structural schematic diagram of the metal substrate shown in Fig. 2 after numerical control processing;

Fig. 4 is a side sectional structural schematic diagram of the protrusion after spraying paint;

5 is a schematic diagram of a three-dimensional structure after a plurality of protrusions are detached from the metal substrate;

FIG. 6 is an enlarged schematic diagram of an IO interface;

Fig. 7 is a schematic diagram of the three-dimensional structure of the metal substrate provided by an embodiment after numerical control processing;

FIG. 8 is a schematic diagram of a three-dimensional structure of a plurality of protrusions detached from the metal substrate in FIG. 7;

FIG. 9 is an enlarged schematic view of the fingerprint key.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be intervening elements at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1 to FIG. 6, the method for manufacturing electronic product components according to an embodiment includes the following steps:

Step S100 , providing a metal substrate 10 . As shown in Fig. 2 and Fig. 3, the metal substrate 10 includes a first metal layer 11 and a second metal layer 12 bonded to each other, the first metal layer 11 is located on the second metal layer 12, and the hardness of the first metal layer 11 is greater than the hardness of the second metal layer 12 . The metal substrate 10 is rectangular as a whole, the thickness of the first metal layer 11 is smaller than the thickness of the second metal layer 12, the first metal layer 11 can be but not limited to a stainless steel layer, and the second metal layer 12 is an aluminum layer, an aluminum alloy layer, a magnesium layer or magnesium alloy layer. In one embodiment, the first metal layer 11 is a stainless steel layer, the second metal layer 12 is an aluminum layer, and the thickness ratio of the first metal layer 11 to the second metal layer 12 is 1:2 to 1:12.

Step S200, removing the first metal layer 11 and part of the second metal layer 12 in the first area of the material plate 10, forming through holes 210 in the second area of the material plate, so that a plurality of protrusions at intervals are formed on the metal substrate 10 . A part of the second metal layer 12 is exposed in the protrusions, and the plurality of protrusions are evenly arranged on the metal substrate 10 in a matrix. As shown in FIG. 3, the metal substrate 10 is processed by CNC, and grooves are processed on the metal substrate 10. A protrusion is located in the groove. Initially, after removing the first metal layer 11 and part of the second metal layer 12 in the first area of the material plate 10, a plurality of bosses are formed in the groove 110, and through holes are formed on the bosses along the vertical direction. 210, that is to form a plurality of protrusions, each protrusion has a through hole 210 through the material plate 10 in the middle, and one or more spacers 130 are formed in the groove, so that a plurality of processing areas are formed in the groove, and the The spacers 130 can also play a role in strengthening the structural strength of the metal substrate 10 .

Step S300 , polishing the surfaces of the plurality of protrusions. The top surface (ie appearance surface) of the first metal layer 11 of each protrusion is polished, and a mirror effect can be formed after polishing to meet the appearance requirements. In one embodiment, a plurality of metal substrates 10 are fixed on a plane grinder, and the first metal layer 11 of each protruding part on each metal substrate 10 is finely ground with a scouring pad and a polishing liquid, so that the first metal layer The 11-shaped surface creates a mirror effect.

Step S400 , performing numerical control machining on the plurality of protrusions after polishing, so that the contours of the plurality of protrusions 200 all conform to the standard. The first metal layer 11 of the protrusion can be numerically machined with a cemented carbide tool, and the second metal layer 12 can be machined with a tungsten steel knife, so that the protrusion 200 can form the same profile as the standard product. Because the protruding part has two metal layers with different hardness, the time of CNC machining can be saved by 25%-30% compared with the time of CNC machining of traditional materials, and the service life of the machining tool can be increased by about 40%.

Step S500 , detaching the plurality of protrusions 200 and the metal layer in the corresponding area below each protrusion 200 from the metal substrate 10 , or detaching the plurality of protrusions 200 from the metal substrate 10 to obtain a plurality of electronic product components 20 . As shown in Fig. 3 and Fig. 5, this operation can be completed in the stamping machine by using a stamping single-punch die, and the blanking of a single metal substrate 10 can be completed in only a dozen seconds, and the punching of multiple finished products can be completed at one time. Cut blanking. The texture of the metal substrate 10 extends along the horizontal direction, so that the metal substrate 10 will not be damaged during numerical control machining.

Since the metal substrate 10 has a structure of two metal layers, and the hardness of the top metal layer is greater than that of the bottom metal layer, the product not only has high strength performance, but also has the advantages of light weight, easy molding, and stable processing. To meet the needs of fast processing and product appearance, the CNC machining time is greatly reduced, the tool life is also greatly improved, and the processing of multiple electronic product components 20 can be completed at one time, and the cost is greatly reduced.

After polishing the protrusions, a step S310 is further included: spraying paint on the plurality of protrusions on the metal substrate 10 , where the UV paint layer 13 is formed on the surfaces of the plurality of protrusions after the painting treatment. Through the painting process, the UV paint is uniformly sprayed onto the polished surface (the surface of the first metal layer 11 of the protrusion), and the UV paint is instantly solidified to form a film under the irradiation of ultraviolet light, and the polished surface is played after the paint spraying process. Protective effects. After performing numerical control machining on the plurality of protrusions, step S410 is further included: removing the UV paint layer 13 on the surface of the plurality of protrusions 200 after numerical control machining on the plurality of protrusions 200 .

After removing the plurality of protrusions from which the UV paint layer 13 is removed, a step S420 is further included: forming a physical vapor deposition layer on the surfaces of the plurality of protrusions by means of physical vapor deposition. Physical vapor deposition, also known as PVD (Physical VaporDeposition), refers to the use of low-voltage, high-current arc discharge technology under vacuum conditions, using gas discharge to evaporate the target material and ionize both the evaporated material and the gas, using the electric field Acceleration, so that the vaporized substance and its reaction product are deposited on the workpiece, and a film can be formed on the surface of the protrusion through physical vapor deposition. The film has high hardness, low friction coefficient, good wear resistance and chemical stability. Advantages, the performance of processed electronic product components has been significantly improved.

After performing the physical vapor deposition layer treatment on the surfaces of the plurality of protrusions, a step S430 is further included: performing anti-fingerprint treatment on the plurality of protrusions, so that the protrusions have good anti-fingerprint performance.

In one embodiment, the first metal layer is a 304 stainless steel layer with a hardness greater than or equal to 250HV, and the second metal layer is a 5052 aluminum alloy layer with a hardness greater than or equal to 50HV. The two metal layers form a steel-aluminum composite material. Metal substrate, the overall yield strength of the metal substrate is greater than or equal to 210Mpa, the tensile strength is greater than or equal to 340Mpa, and the elongation is greater than or equal to 15%. After the steel-aluminum composite metal substrate is treated with PVD, the outer surface of the 304 stainless steel layer has no bad appearance after more than 48 hours of bare salt spray time, or more than 48 hours of bare acid-alkali sweat test. The 5052 aluminum alloy layer has passed the salt spray test for more than 8 hours, or the high temperature and high humidity test for more than 168 hours, and there is no abnormal phenomenon such as corrosion, cracking, desoldering or deformation.

The following takes the processing of specific products as an example. In the following embodiments, the first metal layer of the metal substrate is a stainless steel layer, and the second metal layer is an aluminum layer, that is, the metal substrate is made of steel-aluminum composite material:

Embodiment one:

Referring to Fig. 2 to Fig. 6, the electronic product component is an IO interface 20 with an opening 210 in the middle of the IO interface 20, the metal substrate 10 is rectangular in shape and has a thickness of 0.97mm, and the opposite corners of the metal substrate 10 are respectively provided with positioning holes 120, and the stainless steel layer 11 The thickness is 0.24 mm, and the thickness of the aluminum layer 12 is 0.73 mm.

Prototype processing: a groove 110 is processed on the metal substrate 10, and 35 protrusions evenly arranged in a matrix are formed in the groove, and a through hole 210 penetrating the metal substrate 10 is formed in the middle of each protrusion, and the through hole 210 is ring.

Fine grinding: multiple metal substrates 10 are fixed on a plane grinder, and the stainless steel layer 11 of each protruding part on each metal substrate 10 is finely ground with a scouring pad and a grinding liquid, so that the surface of the stainless steel layer 11 forms a mirror effect.

Paint spraying treatment: the protrusions on each metal substrate 10 are sprayed paint respectively, and the stainless steel surface of each protrusion forms a UV paint layer 13, and the paint spraying treatment on the surface of the stainless steel layer 11 on a metal substrate 10 can be completed in 30 seconds.

CNC machining: set the processing parameters of the CNC machine tool, perform CNC machining on the protrusions on each metal substrate 10, and process the openings 210 through the bottom of the metal substrate 10 on each protrusion 200, so that the outline of the protrusions 200 Meet the requirements of standard products. A coated tungsten steel knife is used to perform numerical control machining on the stainless steel layer 11, and a tungsten steel knife is used to perform numerical control machining on the aluminum layer 12.

Paint removal treatment: remove the UV paint layer 13 on the surface of the stainless steel layer 11 of each protrusion 200 after the numerical control machining is completed.

PVD treatment: form a physical vapor deposition layer on the surface of the stainless steel layer 11 of each protrusion by physical vapor deposition.

Anti-fingerprint treatment: Anti-fingerprint treatment is performed on a plurality of protrusions.

Punching and blanking: place and fix the metal substrate 10 in the punching machine through two positioning holes 120 for punching, and a plurality of protrusions will fall off from the metal substrate 10 together with the aluminum layer 12 in the corresponding area below to obtain a plurality of IOs. Interface 20.

Embodiment two:

Referring to Fig. 2, Fig. 7 to Fig. 9, the electronic product component is a fingerprint key 30, the metal substrate 10 is rectangular in shape, and the thickness is 0.97mm, and the opposite corners of the metal substrate 10 are respectively provided with positioning holes 120, and the thickness of the stainless steel layer 11 is 0.24mm. The aluminum layer 12 has a thickness of 0.73 mm.

Prototype processing: the metal substrate 10 is processed with a groove 110, and two spacers 130 are formed in the groove 110, and the groove 110 is divided into 3 processing areas, and each processing area is processed to form a row with uniform intervals There are 6 protrusions in each processing area, and there are 18 protrusions in the groove 110 in total. A through hole 310 penetrating through the metal substrate 10 is formed in the middle of each protrusion, the through hole 310 is annular, and a step 320 is formed in the through hole 310 .

Fine grinding: multiple metal substrates 10 are fixed on a plane grinder, and the stainless steel layer 11 of each protruding part on each metal substrate 10 is finely ground with a scouring pad and a grinding liquid, so that the surface of the stainless steel layer 11 forms a mirror effect.

Paint spraying treatment: the protrusions on each metal substrate 10 are sprayed paint respectively, and a UV paint layer is formed on the stainless steel surface of each protrusion, and the paint spraying treatment on the surface of the stainless steel layer 11 on a metal substrate 10 can be completed in 30 seconds.

CNC machining: set the processing parameters of the CNC machine tool, perform CNC machining on a plurality of protrusions on each metal substrate 10, and process openings 310 through the bottom of the metal substrate 10 on each protrusion 300, so that the protrusions 300 The outline conforms to the requirements of standard products. A coated tungsten steel knife is used to perform numerical control machining on the stainless steel layer 11, and a tungsten steel knife is used to perform numerical control machining on the aluminum layer 12.

Paint removal treatment: remove the UV paint layer on the surface of the stainless steel layer 11 of each protrusion 300 after the numerical control machining is completed.

PVD treatment: form a physical vapor deposition layer on the surface of the stainless steel layer 11 of each protrusion by physical vapor deposition.

Anti-fingerprint treatment: Anti-fingerprint treatment is performed on a plurality of protrusions.

Punching and blanking: place and fix each metal substrate 10 in the punching machine through two positioning holes 120 for punching, multiple protrusions and the aluminum layer 12 in the corresponding area below will fall off from the metal substrate 10, and multiple fingerprints will be obtained key 30.

An embodiment of the present invention also provides an electronic product component, which is manufactured by using the manufacturing method of the electronic product component in the above embodiment, and the electronic product component is one of an electronic product IO interface and a fingerprint key.

The manufacturing method of the above-mentioned electronic product components uses two layers of metal materials with different hardness to replace the traditional single material. The top surface of the first metal layer can present a mirror effect after being polished, and the whole has high strength, light weight, easy molding, and processing With stable characteristics, the efficiency of CNC machining is greatly improved, and the overall processing cost is greatly reduced.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A method for making an electronic product component, comprising the steps of: A metal substrate is provided, the metal substrate includes a first metal layer and a second metal layer bonded to each other, the first metal layer is located under the second metal layer, and the hardness of the first metal layer is greater than that of the first metal layer The hardness of the second metal layer; removing the first metal layer and part of the second metal layer in the first region of the metal substrate, forming through holes in the second region of the metal substrate, so that a plurality of protrusions at intervals are formed on the metal substrate; Polishing the surfaces of the plurality of protrusions, so that the top surface of the first metal layer of each protrusion can present a mirror effect; Carrying out numerical control machining to the plurality of protrusions after the polishing treatment so that the contours of the plurality of protrusions all conform to the standard; The plurality of protrusions are detached from the metal substrate or the plurality of protrusions and the second metal layer in the corresponding area below are detached from the metal substrate to obtain a plurality of electronic product components. 2. The manufacturing method of electronic product components according to claim 1, wherein the first metal layer is a stainless steel layer, and the second metal layer is an aluminum layer, an aluminum alloy layer, a magnesium layer or a magnesium alloy layer . 3. The manufacturing method of electronic product components according to claim 2, wherein the first metal layer is a 304 stainless steel layer, and the second metal layer is a 5052 aluminum alloy layer. 4. The method for manufacturing electronic product components according to claim 1, wherein the thickness of the first metal layer is smaller than the thickness of the second metal layer. 5 . The method for manufacturing electronic product components according to claim 4 , wherein the ratio of the thickness of the first metal layer to the thickness of the second metal layer is 1:2˜1:12. 6. The manufacturing method of electronic product parts according to claim 1, characterized in that, the plurality of protrusions are painted after the polishing treatment, so that the surfaces of the plurality of protrusions are formed with a UV paint layer; The UV paint layer on the surface of the plurality of protrusions is removed after numerical control machining. 7. The manufacture method of electronic product parts according to claim 6, is characterized in that, form physical vapor deposition layer on the surface of described multiple protrusions by physical vapor deposition to the plurality of protrusions after removing the UV paint layer . 8 . The method for manufacturing electronic product components according to claim 7 , wherein an anti-fingerprint treatment is performed on the plurality of protrusions on which physical vapor deposition layers are formed on the surface. 9. The method for manufacturing electronic product components according to claim 1, wherein grooves are formed at the same time as the plurality of protrusions are formed on the metal substrate, and the plurality of protrusions are located in the grooves , a spacer is formed in the groove, so that the groove is divided into a plurality of processing areas. 10. An electronic product component, characterized in that it is produced by the method for manufacturing an electronic product component according to any one of claims 1 to 9, and the electronic product component is an IO interface or a fingerprint key.