CN107818291B - Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element - Google Patents
Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element Download PDFInfo
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- CN107818291B CN107818291B CN201610824110.9A CN201610824110A CN107818291B CN 107818291 B CN107818291 B CN 107818291B CN 201610824110 A CN201610824110 A CN 201610824110A CN 107818291 B CN107818291 B CN 107818291B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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Abstract
本发明涉及一种组装指纹辨识模块的方法及指纹辨识感应元件的切削方法，组装指纹辨识模块的方法于裁切感应连板的过程中保留连板薄片，使指纹辨识感应元件的上表面的尺寸接近于预设尺寸。接下来切削连板薄片，而于指纹辨识感应元件的下表面上形成凹陷部，使指纹辨识感应元件的下表面的尺寸小于指纹辨识感应元件的上表面的尺寸。即使指纹辨识感应元件发生切削歪斜的情形，指纹辨识感应元件亦可通过尺寸检验，可提升制造良率。
The invention relates to a method for assembling a fingerprint identification module and a method for cutting a fingerprint identification sensing element. The method for assembling a fingerprint identification module retains the connecting plate sheet during the process of cutting the sensing connecting plate, so that the size of the upper surface of the fingerprint identification sensing element is reduced. close to the preset size. Next, the connecting plate sheet is cut to form a concave portion on the lower surface of the fingerprint identification sensing element, so that the size of the lower surface of the fingerprint identification sensing element is smaller than the size of the upper surface of the fingerprint identification sensing element. Even if the fingerprint recognition sensing element is cut and skewed, the fingerprint recognition sensing element can pass the dimensional inspection, which can improve the manufacturing yield.
Description
Technical Field
The present invention relates to an assembling method, and more particularly, to a method for assembling a fingerprint recognition module and a cutting method for a fingerprint recognition sensor.
Background
In recent years, fingerprint identification technology is applied to various electronic products, so that a user can input his/her fingerprint into the electronic product and store the electronic product, and then the user can input his/her fingerprint through a fingerprint identification module to unlock the electronic product. The electronic product is unlocked by using the fingerprint identification technology more quickly and conveniently than the conventional unlocking method of manually inputting the password, so that the method is favored by users, and the requirement of the fingerprint identification module is greatly increased.
Generally speaking, the fingerprint identification module includes a fingerprint identification sensing element, a protective cover, a metal ring and a circuit board, wherein the fingerprint identification sensing element is disposed on and electrically connected to the circuit board, and functions to sense a finger of a user and capture fingerprint information thereof. The protective cover is coated on the fingerprint identification sensing element to protect the fingerprint identification sensing element, so that the finger of a user can only contact with the protective cover and can not directly contact with the fingerprint identification sensing element, and the fingerprint identification sensing element is prevented from being damaged. The metal ring is sleeved on the protective cover to conduct the electric charge on the finger of the user, so that the operation of the fingerprint identification sensing element is facilitated.
The conventional fingerprint recognition module is assembled as follows. Firstly, a fingerprint identification sensing element is arranged on the circuit board, and the fingerprint identification sensing element is electrically connected with the circuit board. Secondly, the protective cover is overlapped on the fingerprint identification sensing element and is bonded with the fingerprint identification sensing element and the fingerprint identification sensing element. Finally, a metal ring is sleeved on the protective cover to complete the assembly of the existing fingerprint identification module. The fingerprint identification sensing element is formed by cutting a sensing connecting plate, and the generation process of the fingerprint identification sensing element is as follows: the sensing connecting plate is fixed on the seat body by using glue, and the sensing connecting plate is cut according to a preset size to generate a plurality of fingerprint identification sensing elements. The size of the fingerprint sensing elements generated by cutting should be consistent with or close to the preset size, however, the cutting tolerance of the fingerprint sensing elements generated by cutting may occur.
Please refer to fig. 1, which is a schematic structural diagram of a conventional fingerprint sensor. Fig. 1 shows a fingerprint sensor 10, wherein the size of the upper surface 101 of the fingerprint sensor 10 is close to a predetermined size (i.e. approximately equal to the predetermined size), but the fingerprint sensor 10 is prone to being cut and tilted, so that the size of the lower surface 102 is larger than the predetermined size. Although the size of the upper surface of the fingerprint sensor 10 matches the predetermined size, the size of the lower surface is too large to be classified as defective through the dimensional test. In addition, because the sensing connecting plate must be fixed on the base body by using the adhesive in the production process of the fingerprint identification sensing element, after the cutting operation is completed, the situation of adhesive residue is easy to occur on the fingerprint identification sensing element, and in order to avoid the influence of the adhesive residue on the operation of the fingerprint identification sensing element, the work of removing the adhesive residue must be additionally carried out, so the processing time can be prolonged, and the manufacturing efficiency is reduced.
Therefore, a method for assembling a fingerprint identification module is needed to improve the manufacturing yield and efficiency.
Disclosure of Invention
The invention aims to provide a cutting method of a fingerprint identification sensing element, which can improve the manufacturing yield and the manufacturing efficiency.
Another objective of the present invention is to provide a method for assembling a fingerprint identification module, which can improve the manufacturing yield and efficiency.
In a preferred embodiment, the present invention provides a cutting method for a fingerprint identification sensor, comprising the following steps:
(A) cutting an induction connecting plate according to a preset size to form a plurality of fingerprint identification induction elements; wherein, every two fingerprint identification sensing elements are connected through a connecting plate sheet, and the connecting plate sheet is close to a lower surface of the plurality of fingerprint identification sensing elements.
(B) Fixing the cut sensing connecting plate on a fixing seat in an inverted manner to expose the lower surfaces of the fingerprint identification sensing elements.
(C) Cutting the connecting plate sheet to form a recessed part on the lower surfaces of the fingerprint identification sensing elements so as to form the fingerprint identification sensing elements which are respectively independent; wherein, the size of the lower surface of the fingerprint identification sensing element is smaller than the preset size.
In a preferred embodiment, the present invention further provides a method for assembling a fingerprint recognition module, comprising the steps of:
(A) cutting an induction connecting plate according to a preset size to form a plurality of fingerprint identification induction elements; wherein, every two fingerprint identification sensing elements are connected through a connecting plate sheet, and the connecting plate sheet is close to a lower surface of the plurality of fingerprint identification sensing elements.
(B) Fixing the cut sensing connecting plate on a fixing seat in an inverted manner to expose the lower surfaces of the fingerprint identification sensing elements.
(C) Cutting the connecting plate sheet to form a recessed part on the lower surfaces of the fingerprint identification sensing elements so as to form the fingerprint identification sensing elements which are respectively independent; wherein, the size of the lower surface of the fingerprint identification sensing element is smaller than the preset size.
(D) The fingerprint identification sensing module is formed by combining the fingerprint identification sensing element and a circuit board.
In brief, the method of the present invention is to keep the connecting plate sheet during the process of cutting the sensing connecting plate, so that the size of the upper surface of the fingerprint sensing element is close to the preset size or consistent with the preset size. Then, the connecting plate sheet is cut, and a concave part is formed on the lower surface of the fingerprint identification sensing element, so that the size of the lower surface of the fingerprint identification sensing element is smaller than that of the upper surface of the fingerprint identification sensing element. In other words, as long as the size of the upper surface of the fingerprint sensing device is close to the predetermined size, the fingerprint sensing device can pass the size inspection, and the manufacturing yield can be improved. In addition, because the method of the invention does not need to use viscose, the residual glue removing work is not needed, and the manufacturing efficiency can be improved.
Drawings
FIG. 1 is a schematic diagram of a conventional fingerprint sensor.
FIG. 2 is a schematic diagram of a fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 3 is a flow chart of a method for assembling a fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 4 is a schematic diagram of a sensing board of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 5 is a schematic structural diagram of a cut sensing connecting plate of the fingerprint recognition module according to a preferred embodiment of the present invention.
FIG. 6 is a schematic view of a cut sensing connecting plate of the fingerprint recognition module of the present invention being fixed on a fixing base in a preferred embodiment.
FIG. 7 is a schematic structural diagram of a fingerprint sensing device of the fingerprint sensing module according to a preferred embodiment of the present invention.
Wherein the reference numerals are as follows:
2 fingerprint identification module
3 clamping tool
4 fixed seat
5 cutting tool
10. 21 fingerprint identification sensing element
20 induction connecting plate
22 circuit board
23 sheet with plates
41 storage groove
42 vacuum pump
101. 212 fingerprint recognition sensor element
102. 211 fingerprint recognition sensor element
213 concave part
Thickness of T1 Link plate sheet
T2 thickness cut by induction connecting plate
Length of T3 recess
Height of T4 recess
26 second circuit board
A to J, C1, C2 step
Detailed Description
The invention provides a method for assembling a fingerprint identification module and a cutting method of a fingerprint identification sensing element, which aim to solve the problems in the prior art. Please refer to fig. 2, which is a schematic structural diagram of a fingerprint recognition module according to a preferred embodiment of the present invention. The fingerprint identification module 2 includes a fingerprint identification sensing element 21 and a circuit board 22, and the fingerprint identification sensing element 21 is fixed on the circuit board 22. In the preferred embodiment, the fingerprint sensor device 21 is packaged in a Land Grid Array (LGA) manner, and the circuit board 22 can be a Flexible Printed Circuit (FPC) or a flexible printed circuit board (FPC).
Please refer to fig. 3, which is a flowchart illustrating a method for assembling a fingerprint recognition module according to a preferred embodiment of the present invention. The method for assembling the fingerprint identification module comprises the following steps:
step A: the induction connection plate is fixed by using a clamping tool.
And B: and cutting the sensing connecting plate according to the preset size to form a plurality of unseparated fingerprint identification sensing elements.
And C: fixing the cut sensing connecting plate on a fixing seat in an inverted manner to expose the lower surfaces of the fingerprint identification sensing elements.
Step D: and cutting the connecting plate sheet to form a concave part on the lower surface of the fingerprint identification sensing element so as to form the fingerprint identification sensing elements which are respectively independent.
Step E: and measuring the sizes of the upper surfaces of the fingerprint identification sensing elements which are respectively independent, and judging whether the fingerprint identification sensing elements pass the size inspection according to the preset sizes.
Step F: and judging that the fingerprint identification sensing element passes the size inspection.
Step G: and judging that the fingerprint identification sensing element does not pass the size inspection.
Step H: the fingerprint identification sensing module is formed by combining the fingerprint identification sensing element and the circuit board.
Wherein, step C includes:
step C1: the cut sensing connecting plate is placed on the fixed seat in an inverted mode, so that the fingerprint identification sensing elements extend into the accommodating grooves of the fixed seat.
Step C2: the vacuum pump of the fixing seat is started to generate suction force to fix the fingerprint identification sensing elements in the accommodating grooves.
And in the step E, when the fingerprint identification sensing element is judged to pass the size inspection, the step G is carried out, otherwise, the step H is carried out.
The following describes an implementation of the method for assembling the fingerprint recognition module. Referring to fig. 2 to 7, fig. 4 is a schematic structural view of a sensing connecting plate of a fingerprint recognition module according to a preferred embodiment of the present invention, fig. 5 is a schematic structural view of a cut sensing connecting plate of a fingerprint recognition module according to a preferred embodiment of the present invention, fig. 6 is a schematic structural view of a cut sensing connecting plate of a fingerprint recognition module according to a preferred embodiment of the present invention fixed to a fixing base, and fig. 7 is a schematic structural view of a fingerprint recognition sensing element of a fingerprint recognition module according to a preferred embodiment of the present invention. When the production line starts to carry out the method for assembling the fingerprint identification module, firstly, the step A is carried out: the induction link plate 20 is fixed using the clamping tool 3, as shown in fig. 4. The holding tool 3 may be operated manually or mechanically, and preferably, the holding tool 3 is operated mechanically, so as to perform a fine and stable operation. After the fixing of the induction connection plate 20 is completed, the step B is performed: the sensing link 20 is cut according to a predetermined size to form a plurality of sensing elements 21, wherein the plurality of sensing elements 21 are defined as two sensing elements 21 connected by a link sheet 23, and the link sheet 23 is close to the lower surface 211 of the sensing elements 21, as shown in fig. 5.
In step B, the setting tool 5 (see fig. 6) cuts the sensing link plate 20 into a plurality of fingerprint sensing elements 21 with a size close to a predetermined size. The dimension of the fingerprint sensor 21 is close to the predetermined dimension based on the dimension of the upper surface 212 of the fingerprint sensor 21, that is, the first length of the upper surface 212 of the fingerprint sensor 21 is close to the first predetermined length of the predetermined dimension, and the first width of the upper surface 212 of the fingerprint sensor 21 is close to the first predetermined width of the predetermined dimension. Preferably, the sensing link plate 20 is cut into a plurality of fingerprint sensing elements 21 having a predetermined size. In the preferred embodiment, the thickness T1 of the connecting sheet 23 is about 0.15 millimeters (mm), and the thickness from the top surface 212 of the fingerprint sensor device 21 to the top surface of the connecting sheet 23 (i.e., the thickness T2 cut into the sensor connecting sheet 20) is about 0.635 mm.
After step B is completed, go to step C1: the cut sensing connecting plate 20 (or the plurality of unseparated fingerprint identification sensing elements 21) is placed on the fixing base 4 in an inverted manner, so that the plurality of fingerprint identification sensing elements 21 respectively extend into the plurality of receiving grooves 41 of the fixing base 4. Step C2 is next performed: the vacuum pump 42 of the fixing base 4 is activated to generate a suction force to suck the fingerprint sensing components 21 toward the inside of the receiving slots 41, so as to fix the fingerprint sensing components 21 in the receiving slots 41, thereby exposing the lower surfaces 211 of the fingerprint sensing components 21 outside the fixing base 4, as shown in fig. 6. It should be noted that, in the preferred embodiment, the vacuum pump 42 is used to fix the fingerprint sensing devices 21 in the receiving slot 41, which is only for illustration purpose, but not limited thereto. In other words, the method of the present invention can utilize various fixing means to fix the cut sensing connection plate 20 without limiting the means and the related fixing structure.
Step D is then performed: the connecting sheet 23 is cut to form a plurality of recesses 213 on the bottom surface 211 of the corresponding fingerprint sensor 21, so as to form a plurality of independent fingerprint sensor 21, and the size of the bottom surface 211 of the fingerprint sensor 21 is smaller than a predetermined size. That is, the second length of the lower surface 211 of the fingerprint sensor 21 is smaller than the first predetermined length of the predetermined dimension. In the preferred embodiment, the length T3 of the recess 213 shown in FIG. 7 is about 0-0.1 mm, and the height T4 of the recess 213 is about 0.12-0.18 mm. Preferably, the length T3 of the recess 213 is 0, so that the length of the upper surface 211 of the fingerprint sensor 21 is equal to the length of the lower surface 211 of the fingerprint sensor 21, and is equal to the predetermined dimension.
After step D is completed, step E is performed: the size of the upper surface 212 of the fingerprint sensing element 21 is measured independently, and whether the fingerprint sensing element 21 passes the size inspection is determined according to a predetermined size. In short, step D checks whether the cut fingerprint sensor device 21 is close to a predetermined size. When the difference between the dimension of the upper surface 212 of the fingerprint sensing device 21 and the predetermined dimension is smaller than or equal to the tolerance, it is determined that the fingerprint sensing device 21 passes the dimension verification, i.e., step F is performed. On the contrary, it is determined that the fingerprint sensing device 21 fails the dimension inspection, i.e. step G is performed, and the fingerprint sensing device 21 determined as failing the dimension inspection is determined as a defective product. Wherein, the operations of step A to step F (or step G) belong to the steps of the cutting method of the fingerprint identification sensing element of the invention.
Finally, step H is performed: the fingerprint sensor module 2 is formed by combining the fingerprint sensor device 21 and the circuit board 22, wherein the fingerprint sensor device 21 is fixed on the circuit board 22 by a Surface Mount Technology (SMT), as shown in fig. 2.
First, electrical connectors such as gold balls and solder balls are disposed on the lower surface 211 of the fingerprint sensor device 21 to fill up the height difference between the recess 213 and the lower surface 211. Second, since the fingerprint sensor 21 and the circuit board 22 are bonded by a Surface Mount Technology (SMT), no adhesive is required and no adhesive residue occurs. The method of the invention can improve the manufacturing efficiency because the work of removing the residual glue is not needed. Third, according to the past manufacturing experience, in the process of cutting the sensing connection plate, the fingerprint sensing element formed by cutting is most frequently subjected to cutting skew, for example: the size of the lower surface of the fingerprint identification sensing element is larger than that of the upper surface of the fingerprint identification sensing element, the size of the upper surface of the fingerprint identification sensing element is close to a preset size, and the fingerprint identification sensing element cannot pass size detection due to the fact that the size of the lower surface of the fingerprint identification sensing element is too large. Therefore, the present invention forms the recess 213 on the lower surface 211 of the fingerprint sensor 21, so that the size of the lower surface 211 of the fingerprint sensor 21 is smaller than the size of the upper surface 212 of the fingerprint sensor 21, and the size of the upper surface 212 of the fingerprint sensor 21 is close to the predetermined size. In this way, even if the cutting skew occurs during the cutting process, the generated fingerprint sensing element 21 can pass the dimension verification.
According to the above, the method of the present invention is to keep the connecting sheet in the process of cutting the sensing connecting plate, so that the size of the upper surface of the fingerprint sensing element is close to the preset size or consistent with the preset size. Then, the connecting plate sheet is cut, and a concave part is formed on the lower surface of the fingerprint identification sensing element, so that the size of the lower surface of the fingerprint identification sensing element is smaller than that of the upper surface of the fingerprint identification sensing element. In other words, as long as the size of the upper surface of the fingerprint sensing device is close to the predetermined size, the fingerprint sensing device can pass the size inspection, and the manufacturing yield can be improved. In addition, because the method of the invention does not need to use viscose, the residual glue removing work is not needed, and the manufacturing efficiency can be improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that other equivalent changes or modifications without departing from the spirit of the present invention are intended to be included within the scope of the appended claims.
Claims (11)
1. A cutting method of a fingerprint identification sensing element comprises the following steps:
(A) cutting an induction connecting plate according to a preset size to form a plurality of fingerprint identification induction elements; wherein, every two fingerprint identification sensing elements are connected through a connecting plate sheet which is close to a lower surface of the plurality of fingerprint identification sensing elements;
(B) fixing the cut sensing connecting plate on a fixed seat in an inverted manner to expose the lower surfaces of the fingerprint identification sensing elements; and
(C) cutting the connecting plate sheet to form a recessed part on the lower surfaces of the fingerprint identification sensing elements so as to form the fingerprint identification sensing elements which are respectively independent; wherein the size of the lower surface of the fingerprint identification sensing element is smaller than the preset size; wherein the step (B) comprises the steps of:
(B1) placing the cut sensing connecting plate on the fixed seat in an inverted manner, so that the fingerprint identification sensing elements extend into the accommodating grooves of the fixed seat; and
(B2) starting a vacuum pump of the fixed seat to generate suction force to fix the fingerprint identification sensing elements in the accommodating grooves.
2. The method of claim 1, wherein in the step (A), a first length of an upper surface of at least one fingerprint sensor device is close to a first predetermined length of the predetermined dimension, and a first width of the upper surface of the at least one fingerprint sensor device is close to a first predetermined width of the predetermined dimension.
3. The method for cutting fingerprint sensor according to claim 1, wherein before said step (A), further comprising the step (D): the inductive connecting plate is fixed by a clamping tool.
4. The method of claim 1, wherein in the step (C), a second length of the lower surface of at least one fingerprint sensor is less than a first predetermined length of the predetermined dimension.
5. The method of claim 1, further comprising the following steps after the step (C):
(E) measuring the sizes of the upper surfaces of the fingerprint identification sensing elements which are respectively independent, and judging whether the fingerprint identification sensing elements pass the size inspection according to the preset sizes;
(F) judging that the fingerprint identification sensing element passes the size inspection; and
(G) determining that the fingerprint identification sensor fails the size test.
6. A method of assembling a fingerprint sensing module, comprising the steps of:
(A) cutting an induction connecting plate according to a preset size to form a plurality of fingerprint identification induction elements; wherein, every two fingerprint identification sensing elements are connected through a connecting plate sheet which is close to a lower surface of the plurality of fingerprint identification sensing elements;
(B) fixing the cut sensing connecting plate on a fixed seat in an inverted manner to expose the lower surfaces of the fingerprint identification sensing elements; and
(C) cutting the connecting plate sheet to form a recessed part on the lower surfaces of the fingerprint identification sensing elements so as to form the fingerprint identification sensing elements which are respectively independent; wherein the size of the lower surface of the fingerprint identification sensing element is smaller than the preset size; and
(D) combining the fingerprint identification sensing element and a circuit board to form the fingerprint identification sensing module; wherein the step (B) comprises the steps of:
(B1) placing the cut sensing connecting plate on the fixed seat in an inverted manner, so that the fingerprint identification sensing elements extend into the accommodating grooves of the fixed seat; and
(B2) starting a vacuum pump of the fixed seat to generate suction force to fix the fingerprint identification sensing elements in the accommodating grooves.
7. The method of claim 6, wherein in the step (A), a first length of an upper surface of at least one fingerprint sensor device is close to a first predetermined length of the predetermined dimension, and a first width of the upper surface of the at least one fingerprint sensor device is close to a first predetermined width of the predetermined dimension.
8. The method of claim 6, further comprising, before the step (A), a step (E): the inductive connecting plate is fixed by a clamping tool.
9. The method of claim 6, wherein in the step (C), a second length of the bottom surface of at least one fingerprint sensor device is smaller than a first predetermined length of the predetermined dimension.
10. The method of claim 6, wherein in the step (D), the fingerprint sensor device and the circuit board are bonded by surface mount technology to form the fingerprint sensor module.
11. The method of claim 6, wherein after the step (C), further comprising the steps of:
(F) measuring the sizes of the upper surfaces of the fingerprint identification sensing elements which are respectively independent, and judging whether the fingerprint identification sensing elements pass the size inspection according to the preset sizes;
(G) judging that the fingerprint identification sensing element passes the size inspection; and (H) judging that the fingerprint identification sensing element does not pass the size inspection.
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| CN201610824110.9A CN107818291B (en) | 2016-09-14 | 2016-09-14 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
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| CN201610824110.9A CN107818291B (en) | 2016-09-14 | 2016-09-14 | Method for assembling fingerprint identification module and cutting method of fingerprint identification sensing element |
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| CN110298215B (en) * | 2018-03-23 | 2023-01-03 | 致伸科技股份有限公司 | Method for assembling fingerprint identification module |
| CN111221688A (en) * | 2018-11-27 | 2020-06-02 | Oppo（重庆）智能科技有限公司 | Method and device for detecting functional component, storage medium and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142672A (en) * | 2005-03-16 | 2008-03-12 | 雅马哈株式会社 | Semiconductor device, method for manufacturing semiconductor device, and case frame |
| CN102354692A (en) * | 2007-11-12 | 2012-02-15 | 英飞凌科技股份公司 | Wafer and a method of dicing a wafer |
| CN103793698A (en) * | 2014-02-21 | 2014-05-14 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor capable of removing residual fingerprints |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN104680126A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying device and manufacturing method thereof |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
| CN205486163U (en) * | 2015-06-08 | 2016-08-17 | 指纹卡有限公司 | Fingerprint sensing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010050416A (en) * | 2008-08-25 | 2010-03-04 | Toshiba Corp | Method of manufacturing semiconductor device |
| CN103119630B (en) * | 2010-07-19 | 2016-11-23 | 里斯特有限公司 | Fingerprint sensor and system including fingerprint sensor |
-
2016
- 2016-09-14 CN CN201610824110.9A patent/CN107818291B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142672A (en) * | 2005-03-16 | 2008-03-12 | 雅马哈株式会社 | Semiconductor device, method for manufacturing semiconductor device, and case frame |
| CN102354692A (en) * | 2007-11-12 | 2012-02-15 | 英飞凌科技股份公司 | Wafer and a method of dicing a wafer |
| CN103793698A (en) * | 2014-02-21 | 2014-05-14 | 江苏恒成高科信息科技有限公司 | Fingerprint reading sensor capable of removing residual fingerprints |
| CN104201115A (en) * | 2014-09-12 | 2014-12-10 | 苏州晶方半导体科技股份有限公司 | Wafer-level fingerprint recognition chip packaging structure and method |
| CN104680126A (en) * | 2014-11-24 | 2015-06-03 | 麦克思智慧资本股份有限公司 | Fingerprint identifying device and manufacturing method thereof |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN205486163U (en) * | 2015-06-08 | 2016-08-17 | 指纹卡有限公司 | Fingerprint sensing device |
| CN105069443A (en) * | 2015-08-31 | 2015-11-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and fingerprint recognition module preparation method |
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