CN107896461A - Housing, manufacturing method thereof, and mobile terminal - Google Patents
Housing, manufacturing method thereof, and mobile terminal Download PDFInfo
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- CN107896461A CN107896461A CN201711118323.0A CN201711118323A CN107896461A CN 107896461 A CN107896461 A CN 107896461A CN 201711118323 A CN201711118323 A CN 201711118323A CN 107896461 A CN107896461 A CN 107896461A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
本申请提供了一种壳体的制作方法,包括以下的步骤:提供壳体基体;在所述壳体基体上成型基底,所述基底与所述壳体基体层叠设置;加工所述壳体基体及所述基底,形成天线微缝,所述天线微缝底部处的所述基底的截面呈中间凸起及两侧凹陷;在所述天线微缝中填充密封胶水;成型密封层,密封所述天线微缝。本申请还提供了一种壳体及移动终端。本申请可以提高移动终端中壳体的密封质量。
The present application provides a method for manufacturing a shell, comprising the following steps: providing a shell substrate; forming a substrate on the shell substrate, wherein the substrate and the shell substrate are stacked; processing the shell substrate and the substrate to form an antenna micro-slit, wherein the cross section of the substrate at the bottom of the antenna micro-slit is convex in the middle and concave on both sides; filling the antenna micro-slit with sealing glue; forming a sealing layer to seal the antenna micro-slit. The present application also provides a shell and a mobile terminal. The present application can improve the sealing quality of the shell in the mobile terminal.
Description
技术领域technical field
本申请涉及移动终端技术领域,具体涉及一种壳体及其制作方法、具有该壳体的移动终端。The present application relates to the technical field of mobile terminals, in particular to a casing, a manufacturing method thereof, and a mobile terminal having the casing.
背景技术Background technique
目前,壳体上常开设微缝,以安装功能组件或透过光信号、电信号等。基于此结构,为了确保壳体的整体美观和防尘防水性能,需要通过填充介质来密封该微缝。若填充介质的封接工艺不良,将降低壳体的密封性能。At present, micro-slits are often provided on the casing to install functional components or transmit optical signals and electrical signals. Based on this structure, in order to ensure the overall appearance and dustproof and waterproof performance of the shell, it is necessary to seal the micro-slit by filling medium. If the sealing process of the filling medium is poor, the sealing performance of the shell will be reduced.
发明内容Contents of the invention
本申请提供了一种壳体及其制作方法、具有该壳体的移动终端,以提高移动终端中壳体的密封质量。The present application provides a casing, a manufacturing method thereof, and a mobile terminal having the casing, so as to improve the sealing quality of the casing in the mobile terminal.
本申请提供了一种壳体的制作方法,包括以下的步骤:The application provides a method for manufacturing a housing, comprising the following steps:
提供壳体基体;Provide the shell base;
在所述壳体基体上成型基底,所述基底与所述壳体基体层叠设置;forming a base on the housing base, the base and the housing base are laminated;
加工所述壳体基体及所述基底,形成天线微缝,所述天线微缝底部处的所述基底的截面呈中间凸起及两侧凹陷;Processing the housing base and the base to form antenna micro-slits, the cross-section of the base at the bottom of the antenna micro-slits is convex in the middle and concave on both sides;
在所述天线微缝中填充密封胶水;Filling sealing glue in the micro-slit of the antenna;
成型密封层,密封所述天线微缝。A sealing layer is formed to seal the micro-slits of the antenna.
本申请提供了一种壳体,所述壳体包括壳体基体与所述壳体基体层叠设置的基底、贯穿所述壳体基体且延伸至所述基底的天线微缝以及填充于所述天线微缝中的密封层,所述基底具有贴合所述密封层的顶壁,所述顶壁的截面呈中间凸起及两侧凹陷。The present application provides a casing, the casing includes a casing base and a base on which the casing base is laminated, an antenna micro-slit penetrating through the casing base and extending to the base, and filling in the antenna For the sealing layer in the micro-slit, the base has a top wall attached to the sealing layer, and the cross-section of the top wall is convex in the middle and concave on both sides.
本申请还提供了一种移动终端,包括所述的壳体。The present application also provides a mobile terminal, including the casing.
本申请提供的壳体及其制作方法、移动终端,通过层叠设置的基底和壳体基体上加工天线微缝,并使所述天线微缝底部处的所述基底的截面呈中间凸起及两侧凹陷的形状,在所述天线微缝中填充密封胶水后,所述密封胶水可以优先填充于所述天线微缝与所述基底之间的缝隙,从而减少密封胶水在填满天线微缝后再进入缝隙而造成密封层中产生气泡等,导致密封层密封质量差等问题,从而提高所述密封层的成型质量和密封质量;此外,所述基底的截面呈中间凸起及两侧凹陷的形状,还可以增加所述密封层与所述基底之间的接触面积,从而增大所述密封层与所述基底之间的贴合力度,进而提高所述壳体的密封质量,及提高所述移动终端的可靠性。The shell and its manufacturing method and mobile terminal provided by the present application process the antenna micro-slits on the base and the shell base that are stacked, and make the cross-section of the base at the bottom of the antenna micro-slits have a middle bulge and two sides. The shape of the side depression, after the sealing glue is filled in the antenna micro-slit, the sealing glue can be preferentially filled in the gap between the antenna micro-slit and the base, thereby reducing the amount of sealing glue after filling the antenna micro-slit. Then enter the gap to cause bubbles in the sealing layer, resulting in poor sealing quality of the sealing layer, thereby improving the molding quality and sealing quality of the sealing layer; in addition, the cross section of the base is convex in the middle and concave on both sides The shape can also increase the contact area between the sealing layer and the base, thereby increasing the bonding strength between the sealing layer and the base, thereby improving the sealing quality of the housing, and improving the Describe the reliability of the mobile terminal.
附图说明Description of drawings
为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.
图1是本申请实施例提供的一种移动终端的结构示意图。FIG. 1 is a schematic structural diagram of a mobile terminal provided by an embodiment of the present application.
图2是本申请实施例提供的一种壳体的结构示意图。Fig. 2 is a schematic structural diagram of a casing provided by an embodiment of the present application.
图3是现有技术中一种壳体的局部放大结构示意图。Fig. 3 is a partially enlarged structural schematic diagram of a casing in the prior art.
图4是本申请实施例提供的一种壳体的局部放大结构示意图。Fig. 4 is a partially enlarged structural schematic diagram of a casing provided by an embodiment of the present application.
图5是本申请实施例提供的一种壳体的局部放大结构示意图。Fig. 5 is a partially enlarged structural schematic diagram of a casing provided by an embodiment of the present application.
图6是本申请实施例提供的一种壳体的制作方法流程图。Fig. 6 is a flow chart of a manufacturing method of a housing provided by an embodiment of the present application.
图7是本申请实施例提供的壳体制作方法步骤101的结构示意图。FIG. 7 is a schematic structural diagram of step 101 of the shell manufacturing method provided by the embodiment of the present application.
图8是本申请实施例提供的壳体制作方法步骤102的结构示意图。FIG. 8 is a schematic structural diagram of step 102 of the shell manufacturing method provided by the embodiment of the present application.
图9是本申请实施例提供的壳体制作方法步骤102的结构示意图。FIG. 9 is a schematic structural diagram of step 102 of the shell manufacturing method provided by the embodiment of the present application.
图10是本申请实施例提供的壳体制作方法步骤103的结构示意图。FIG. 10 is a schematic structural diagram of step 103 of the shell manufacturing method provided by the embodiment of the present application.
图11是本申请实施例提供的壳体制作方法步骤103a的结构示意图。Fig. 11 is a schematic structural diagram of step 103a of the shell manufacturing method provided by the embodiment of the present application.
图12是本申请实施例提供的壳体制作方法步骤103b的结构示意图。Fig. 12 is a schematic structural diagram of step 103b of the shell manufacturing method provided by the embodiment of the present application.
图13是本申请实施例提供的壳体制作方法步骤103b的结构示意图。FIG. 13 is a schematic structural diagram of step 103b of the shell manufacturing method provided by the embodiment of the present application.
图14是本申请实施例提供的壳体制作方法步骤1032的结构示意图。FIG. 14 is a schematic structural diagram of step 1032 of the shell manufacturing method provided by the embodiment of the present application.
图15是本申请实施例提供的壳体制作方法步骤104的结构示意图。FIG. 15 is a schematic structural diagram of step 104 of the shell manufacturing method provided by the embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例,都属于本申请保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
此外,以下各实施例的说明是参考附加的图示,用以例示本申请可用以实施的特定实施例。本申请中所提到的方向用语,例如,“顶部”、“底部”、“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等,仅是参考附加图式的方向,因此,使用的方向用语是为了更好、更清楚地说明及理解本申请,而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments that the application can be used to implement. Directional terms mentioned in this application, for example, "top", "bottom", "upper", "lower", "front", "rear", "left", "right", "inner", "outer ", "side" and so on are only referring to the direction of the attached drawings, therefore, the direction terms used are for better and clearer description and understanding of the application, rather than indicating or implying that the device or element referred to must have Certain orientations, constructed and operative in certain orientations, therefore should not be construed as limitations on the present application.
本说明书中用“~”表示的数值范围是指将“~”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中,结构相似或相同的用相同的标号表示。The numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, those with similar or identical structures are denoted by the same reference numerals.
请参阅图1,图1是本申请实施例提供的一种移动终端100,所述移动终端 100可以是任何具备通信和存储功能的设备,例如:平板电脑、手机、电子阅读器、遥控器、个人计算机(PersonalComputer,PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。Please refer to FIG. 1. FIG. 1 is a mobile terminal 100 provided by the embodiment of the present application. The mobile terminal 100 can be any device with communication and storage functions, such as a tablet computer, mobile phone, e-reader, remote control, Intelligent devices with network functions such as personal computers (PersonalComputers, PCs), notebook computers, vehicle-mounted devices, Internet TVs, and wearable devices.
请参阅图1,所述移动终端100包括壳体110,壳体110用于封装功能器件 130。所述功能器件130包括天线。所述壳体110为金属材质,而金属壳体110 对于天线所辐射的电磁波有屏蔽作用,使得移动终端100的内置天线无法接收和发送电信号。为了解决移动终端100的金属壳体110对电磁波的屏蔽问题,通过在金属壳体110上加工天线微缝120,再向天线微缝120中填充绝缘介质,以密封金属壳体110,以使移动终端100的内置天线通过天线微缝120来辐射信号。然而,在形成天线微缝120过程中,填充介质与所述天线微缝120的内壁结合不良,可能会造成密封不实或产生气泡等问题,从而影响壳体110的整体强度和防水性能。Referring to FIG. 1 , the mobile terminal 100 includes a housing 110 for encapsulating a functional device 130 . The functional device 130 includes an antenna. The housing 110 is made of metal, and the metal housing 110 has a shielding effect on electromagnetic waves radiated by the antenna, so that the built-in antenna of the mobile terminal 100 cannot receive and send electrical signals. In order to solve the electromagnetic wave shielding problem of the metal shell 110 of the mobile terminal 100, the antenna micro-slit 120 is processed on the metal shell 110, and then an insulating medium is filled into the antenna micro-slit 120 to seal the metal shell 110, so that the mobile The built-in antenna of the terminal 100 radiates signals through the antenna slit 120 . However, in the process of forming the antenna micro-slit 120 , the filling medium is poorly combined with the inner wall of the antenna micro-slit 120 , which may cause problems such as poor sealing or generation of air bubbles, thereby affecting the overall strength and waterproof performance of the casing 110 .
请参阅图2,图2为本申请实施例提供的一种壳体110,可以用作移动终端 100的电池后壳。所述壳体110包括壳体基体111与所述壳体基体111层叠设置的基底112、贯穿所述壳体基体111且延伸至所述基底112的天线微缝120以及填充于所述天线微缝120中的密封层113。所述基底112具有贴合所述密封层113 的顶壁1121。所述顶壁1121的截面呈中间凸起及两侧凹陷。Please refer to FIG. 2 . FIG. 2 is a casing 110 provided by an embodiment of the present application, which can be used as a battery rear casing of the mobile terminal 100 . The housing 110 includes a housing base 111 and a base 112 laminated with the housing base 111, an antenna micro-slit 120 penetrating through the housing base 111 and extending to the base 112, and filling the antenna micro-slit. Sealing layer 113 in 120. The base 112 has a top wall 1121 attached to the sealing layer 113 . The section of the top wall 1121 is convex in the middle and concave on both sides.
本实施例中,所述密封层113的形成过程是在所述天线微缝120中填充密封胶水,并固化所述密封胶水,从而形成所述密封层113。In this embodiment, the sealing layer 113 is formed by filling the antenna micro-slit 120 with sealing glue and curing the sealing glue, thereby forming the sealing layer 113 .
本实施例中,请参阅图3,所述壳体基体111为金属材质,所述基底112为注塑成型的塑胶。由于塑胶和金属的结合不稳定,所述壳体基体111与所述基底 112之间极可能会存在缝隙114。在密封胶水填满所述天线微缝120后,会停止填充密封胶水,并进行固化,在停止填充密封胶水后,所述密封胶水可能会进入所述壳体基体111与所述基底112之间的缝隙114中,从而在密封层113中形成气泡等缺陷。In this embodiment, please refer to FIG. 3 , the housing base 111 is made of metal, and the base 112 is made of injection molded plastic. Due to the unstable combination of plastic and metal, there may be a gap 114 between the housing base 111 and the base 112. After the sealing glue fills the antenna micro-slit 120, the filling of the sealing glue will be stopped and cured. After the filling of the sealing glue is stopped, the sealing glue may enter between the housing base 111 and the base 112 In the gap 114 of the sealing layer 113, defects such as air bubbles are formed.
通过层叠设置的基底112和壳体基体111上加工天线微缝120,并使所述天线微缝120底部处的所述基底112的截面呈中间凸起及两侧凹陷的形状,在所述天线微缝120中填充密封胶水后,所述密封胶水可以优先填充于所述天线微缝 120与所述基底112之间的缝隙114,从而减少密封胶水在填满天线微缝120后再进入缝隙114而造成密封层113中产生气泡等,导致密封层113密封质量差等问题,从而提高所述密封层113的成型质量和密封质量;此外,所述基底112 的截面呈中间凸起及两侧凹陷的形状,还可以增加所述密封层113与所述基底 112之间的接触面积,从而增大所述密封层113与所述基底112之间的贴合力度,进而提高所述壳体110的密封质量,及提高所述移动终端100的可靠性。The antenna micro-slit 120 is processed on the substrate 112 and the housing base 111 that are stacked, and the cross-section of the substrate 112 at the bottom of the antenna micro-slit 120 is in the shape of a middle convex and concave on both sides. After filling the sealing glue in the micro-slit 120, the sealing glue can be preferentially filled in the gap 114 between the antenna micro-slit 120 and the base 112, thereby reducing the sealing glue entering the gap 114 after filling the antenna micro-slit 120 And cause bubbles etc. to be produced in the sealing layer 113, cause problems such as poor sealing quality of the sealing layer 113, thereby improve the forming quality and sealing quality of the sealing layer 113; The shape can also increase the contact area between the sealing layer 113 and the base 112, thereby increasing the bonding force between the sealing layer 113 and the base 112, thereby improving the strength of the housing 110. Seal quality, and improve the reliability of the mobile terminal 100.
一种可能的实施例中,请参阅图4及图5,所述基底112包括第一凹槽1122 和第二凹槽1123以及所述第一凹槽1122与所述第二凹槽1123之间形成的凸起 1124。所述天线微缝120包括相对设置的第一侧壁1201和第二侧壁1202。所述第一凹槽1122与所述第一侧壁1201平滑连接,及所述第二凹槽1123与所述第二侧壁1202平滑连接。由于所述第一凹槽1122与所述第一侧壁1201平滑连接,以使所述壳体基体111与所述基底112之间的缝隙114暴露于所述天线微缝120 的内壁,在填充所述密封胶水时,所述密封胶水很容易进入所述缝隙114中,从而减少所述密封层113中出现气泡等缺陷,提高所述壳体110的密封质量。In a possible embodiment, please refer to FIG. 4 and FIG. 5 , the base 112 includes a first groove 1122 and a second groove 1123 and a gap between the first groove 1122 and the second groove 1123 Protrusions 1124 are formed. The antenna microslit 120 includes a first side wall 1201 and a second side wall 1202 oppositely disposed. The first groove 1122 is smoothly connected with the first sidewall 1201 , and the second groove 1123 is smoothly connected with the second sidewall 1202 . Since the first groove 1122 is smoothly connected with the first side wall 1201, so that the gap 114 between the housing base 111 and the base 112 is exposed to the inner wall of the antenna micro-slit 120, when filling When the sealing glue is used, the sealing glue can easily enter the gap 114 , thereby reducing defects such as air bubbles in the sealing layer 113 and improving the sealing quality of the housing 110 .
请参阅图6-图7,图6是本申请实施例提供的一种壳体110的制作方法10。所述壳体制作方法包括以下的步骤。Please refer to FIG. 6-FIG. 7. FIG. 6 is a manufacturing method 10 of a casing 110 provided by an embodiment of the present application. The manufacturing method of the casing includes the following steps.
步骤101、提供壳体基体111。Step 101 , providing a housing base 111 .
本实施方式中,请参阅图7,所述壳体基体111先由壳体110原材进行切割、多次模具冲压,形成厚度均匀的壳体110板料,然后使用计算机数字控制机床(Computernumericalcontrol,CNC)对壳体110板料进行车、铣、磨、削等,以形成壳体基体111。所述壳体基体111大致呈矩形板件状。所述壳体基体111具有第一表面1111及与所述第一表面1111相对设置的第二表面1112。所述第一表面1111和所述第二表面1112可以是平整面或是弧形面。其中,所述第一表面 1111朝向所述壳体110内的功能器件130,所述第二表面1112朝向外界环境。In this embodiment, please refer to FIG. 7 , the housing base 111 is first cut from the raw material of the housing 110 and stamped multiple times to form a sheet of the housing 110 with a uniform thickness, and then using a computer numerical control machine tool (Computernumericalcontrol, CNC) performs turning, milling, grinding, cutting, etc. on the sheet material of the shell 110 to form the shell base 111 . The housing base 111 is substantially in the shape of a rectangular plate. The casing base 111 has a first surface 1111 and a second surface 1112 opposite to the first surface 1111 . The first surface 1111 and the second surface 1112 can be flat surfaces or curved surfaces. Wherein, the first surface 1111 faces the functional device 130 inside the casing 110, and the second surface 1112 faces the external environment.
步骤102、请参阅图8及图9,在所述壳体基体111上成型基底112,所述基底112与所述壳体基体111层叠设置。Step 102 , referring to FIG. 8 and FIG. 9 , forming a base 112 on the housing base 111 , and the base 112 and the housing base 111 are stacked.
本实施方式中,在所述壳体基体111的第一表面1111上成型基底112。所述基底112与所述壳体基体111层叠设置。所述基底112用于在所述壳体基体 111上切割天线微缝120时,提供支撑作用力,以免所述壳体基体111发生弯曲和形变。In this embodiment, the base 112 is molded on the first surface 1111 of the housing base 111 . The base 112 is stacked with the casing base 111 . The base 112 is used to provide a supporting force when the antenna micro-slit 120 is cut on the housing base 111, so as to prevent the housing base 111 from being bent and deformed.
一种实施方式中,所述基底112采用注塑工艺成型。所述基底112的成型工艺包括以下的步骤。In one embodiment, the base 112 is formed by injection molding. The molding process of the base 112 includes the following steps.
步骤1021、提供模具。请参阅图8,所述模具包括上模151和下模152。所述上模151和下模152分别对应于所述第二表面1112和第一表面1111。Step 1021, providing a mold. Please refer to FIG. 8 , the mold includes an upper mold 151 and a lower mold 152 . The upper mold 151 and the lower mold 152 correspond to the second surface 1112 and the first surface 1111 respectively.
步骤1022、将所述壳体基体111放入所述模具中。所述壳体基体111的第一表面1111设于所述下模152上,所述第二表面1112朝向所述上模151,且所述第一表面1111与所述下模152之间预留较小的空隙153。Step 1022, putting the housing base 111 into the mould. The first surface 1111 of the housing base 111 is disposed on the lower mold 152, the second surface 1112 faces the upper mold 151, and a space is reserved between the first surface 1111 and the lower mold 152. Smaller gap 153 .
步骤1023、向所述模具中注入基底112原材料。所述基底112原材料呈液态。将所述基底112原材料注入所述第一表面1111与所述上模151之间的空隙 153中。Step 1023 , inject the raw material of the base 112 into the mould. The raw material of the base 112 is in a liquid state. The raw material of the base 112 is injected into the gap 153 between the first surface 1111 and the upper mold 151.
步骤1024、请参阅图9,成型基底112。将上模151与下模152相互压合,挤压所述基底112原材料以成型所述基底112,并将所述基底112成型于所述壳体基体111的第一表面1111。Step 1024 , please refer to FIG. 9 , forming the base 112 . The upper mold 151 and the lower mold 152 are pressed against each other, extruding the raw material of the base 112 to form the base 112 , and forming the base 112 on the first surface 1111 of the shell base 111 .
步骤103、请参阅图10-图14,加工所述壳体基体111及所述基底112,形成天线微缝120。所述天线微缝120底部处的所述基底112的截面呈中间凸起1124 及两侧凹陷。Step 103 , please refer to FIGS. 10-14 , process the casing base 111 and the base 112 to form antenna micro-slits 120 . The cross-section of the base 112 at the bottom of the antenna micro-slit 120 has a central protrusion 1124 and depressions on both sides.
本实施方式中,所述壳体基体111为金属材质,用于制备移动终端100的电池后盖。而金属壳体110对于电磁波有屏蔽作用,使得移动终端100的内置天线无法接收和发送电信号。为了解决移动终端100的金属壳体110对电磁波的屏蔽问题,通过在金属壳体110上形成天线微缝120,以使移动终端100的内置天线通过天线微缝120来辐射信号。In this embodiment, the housing base 111 is made of metal, which is used to prepare the battery back cover of the mobile terminal 100 . However, the metal shell 110 has a shielding effect on electromagnetic waves, so that the built-in antenna of the mobile terminal 100 cannot receive and send electrical signals. In order to solve the electromagnetic wave shielding problem of the metal shell 110 of the mobile terminal 100 , an antenna micro-slit 120 is formed on the metal shell 110 so that the built-in antenna of the mobile terminal 100 radiates signals through the antenna micro-slit 120 .
本实施方式中,请参阅图10,将所述壳体基体111水平(请参考附图)放在计算机数字控制机床上,用CNC的铣刀155在壳体基体111上切割天线微缝 120。所述铣刀从所述第二表面1112开始朝向所述第一表面1111切割,由于所述基底112贴合于所述第一表面1111,所述铣刀155可以切断壳体基体111,然后切入所述基底112,以成型贯穿于所述壳体基体111及伸入所述基底112中的天线微缝120。可以理解地,本实施方式中,铣刀155切断所述壳体基体111是指从所述第一表面1111朝向所述第二表面1112贯穿切割,而不是将壳体基体111切割成分离的两段。在切割多条天线微缝120时,所述基底112可以用于支撑所述壳体基体111,所述基底112保持相邻的天线微缝120之间的切割过程不发生弯曲和形变。In this embodiment, referring to FIG. 10 , the housing base 111 is placed horizontally (please refer to the accompanying drawings) on a computer numerical control machine tool, and the antenna micro-slit 120 is cut on the housing base 111 with a CNC milling cutter 155 . The milling cutter cuts from the second surface 1112 toward the first surface 1111, and since the base 112 is attached to the first surface 1111, the milling cutter 155 can cut off the housing base 111, and then cut into The base 112 is configured to form an antenna micro-slit 120 penetrating through the casing base 111 and protruding into the base 112 . It can be understood that, in this embodiment, cutting the housing base 111 by the milling cutter 155 refers to cutting through the first surface 1111 toward the second surface 1112 , rather than cutting the housing base 111 into two separate parts. part. When cutting a plurality of antenna micro-slits 120 , the base 112 can be used to support the housing base 111 , and the base 112 keeps adjacent antenna micro-slits 120 from bending and deformation during the cutting process.
本实施方式中,在成型所述天线微缝120后,所述天线微缝120底部对应所述基底112处会呈中间凸起1124和两侧凹陷的形状。In this embodiment, after the antenna micro-slit 120 is formed, the bottom part of the antenna micro-slit 120 corresponding to the base 112 will be in the shape of a central protrusion 1124 and depressions on both sides.
在第一种实施方式中,请参阅图11-图13,加工所述壳体基体111及所述基底112的过程中,可以通过多次切割的方式形成天线微缝120,具体包括一下的步骤。In the first embodiment, please refer to FIG. 11-FIG. 13. During the process of processing the housing base 111 and the base 112, the antenna micro-slit 120 can be formed by cutting multiple times, which specifically includes the following steps .
步骤103a、请参阅图11,使用铣刀156切割所述壳体基体111,形成初始微缝121。所述初始微缝121贯穿所述壳体基体111。通过设置切割程序,在所述壳体基体111被切断后,停止切割所述壳体基体111,在所述壳体基体111上形成初始微缝121。所述初始微缝121仅仅贯穿所述壳体基体111,但不会贯穿所述基底112。Step 103 a , referring to FIG. 11 , cutting the shell base 111 with a milling cutter 156 to form initial micro-slits 121 . The initial micro-slit 121 runs through the shell base 111 . By setting the cutting program, after the shell base 111 is cut, the cutting of the shell base 111 is stopped, and the initial micro-slits 121 are formed on the shell base 111 . The initial micro-slit 121 only penetrates the shell base 111 , but does not penetrate the base 112 .
步骤103b、请参阅图12及图13,穿过所述初始微缝121切割所述基底112。在所述基底112上加工出第一凹槽1122和第二凹槽1123,所述第一凹槽1122 和所述第二凹槽1123之间形成凸起1124。本步骤中,更换刀头尺寸较小的铣刀 157,铣刀穿过所述初始微缝121加工所述基底112,并在所述基底112上切割出第一凹槽1122,然后控制所述铣刀在基底112的另一侧加工出第二凹槽1123,所述第一凹槽1122和所述第二凹槽1123之间形成凸起1124。Step 103b , please refer to FIG. 12 and FIG. 13 , cut the substrate 112 through the initial micro-slit 121 . A first groove 1122 and a second groove 1123 are processed on the base 112 , and a protrusion 1124 is formed between the first groove 1122 and the second groove 1123 . In this step, the milling cutter 157 with a smaller cutter head size is replaced, the milling cutter passes through the initial micro-slit 121 to process the substrate 112, and cuts a first groove 1122 on the substrate 112, and then controls the The milling cutter processes a second groove 1123 on the other side of the base 112 , and a protrusion 1124 is formed between the first groove 1122 and the second groove 1123 .
在第二种实施方式中,加工所述壳体基体111及所述基底112的过程中,可以通过一次切割的方式形成天线微缝120,具体包括一下的步骤。In the second implementation manner, during the process of processing the housing base 111 and the base 112 , the antenna micro-slit 120 may be formed by cutting once, which specifically includes the following steps.
步骤1030、请参阅图14,使用刀具切割所述壳体基体111和所述基底112,在所述基底112上形成第一凹槽1122和第二凹槽1123及位于所述第一凹槽1122 与所述第二凹槽1123之间的凸起1124。Step 1030, please refer to FIG. 14 , use a cutter to cut the housing base 111 and the base 112 to form a first groove 1122 and a second groove 1123 on the base 112 and a groove located in the first groove 1122. and the protrusion 1124 between the second groove 1123 .
一种实施方式中,步骤1030包括以下的步骤。In one implementation manner, step 1030 includes the following steps.
步骤1031、提供刀具158,所述刀具158为圆形刀片,且所述刀具158的刀尖截面呈两侧凸起及中间凹陷的形状。Step 1031 , providing a knife 158, which is a circular blade, and the section of the knife tip of the knife 158 is in the shape of convex sides and a concave middle.
步骤1032、将所述刀具158与所述壳体基体111垂直放置,控制所述刀具 158高速旋转并切割壳体基体111和基底112。所述刀具158先切断所述壳体基体111,再切入所述基底112中。Step 1032, place the cutter 158 perpendicular to the shell base 111, control the cutter 158 to rotate at a high speed and cut the shell base 111 and the base 112. The cutter 158 cuts off the shell base 111 first, and then cuts into the base 112 .
步骤1033、在所述刀具158的刀尖切入所述基底112中后,控制所述刀具 158停止切割。由于所述刀具158的刀尖截面呈两侧凸起及中间凹陷的形状,所述刀具158在所述基底112上会形成两条凹槽,即第一凹槽1122和第二凹槽 1123。Step 1033, after the tip of the knife 158 cuts into the substrate 112, control the knife 158 to stop cutting. Since the tip section of the cutter 158 is convex on both sides and concave in the middle, the cutter 158 forms two grooves on the base 112 , that is, a first groove 1122 and a second groove 1123 .
本实施方式通过使用刀尖截面呈两侧凸起1124及中间凹陷的刀具158,一次即可完成天线微缝120的切割过程,简化工序,提高科壳体110制备效率。In this embodiment, the cutting process of the antenna micro-slit 120 can be completed at one time by using a knife 158 with a knife-tip cross-section with protrusions 1124 on both sides and a depression in the middle, which simplifies the process and improves the production efficiency of the housing 110 .
一种实施方式中,在加工所述壳体基体111及所述基底112,形成天线微缝 120的步骤103之后,所述第一凹槽1122与所述初始微缝121一侧的内壁之间平滑连接,所述第二凹槽1123与所述初始微缝121另一侧的内壁之间平滑连接。In one embodiment, after the step 103 of processing the housing base 111 and the base 112 and forming the antenna micro-slit 120 , between the first groove 1122 and the inner wall on one side of the initial micro-slit 121 Smooth connection, smooth connection between the second groove 1123 and the inner wall on the other side of the initial micro-slit 121 .
步骤104、在所述天线微缝120中填充密封胶水。Step 104 , filling the antenna micro-slit 120 with sealing glue.
一种实施方式中,请参阅图2,在所述天线微缝120中填充密封胶水的步骤 104包括:In one embodiment, referring to Fig. 2, the step 104 of filling the sealing glue in the antenna micro-slit 120 includes:
步骤1041、在所述天线微缝120中填充第一密封胶水。所述第一密封胶水填充于所述第一凹槽1122和所述第二凹槽1123。Step 1041 , filling the first sealing glue in the antenna micro-slit 120 . The first sealing glue is filled in the first groove 1122 and the second groove 1123 .
步骤1042、固化所述第一密封胶水,成型第一密封层1131。所述第一密封层1131覆盖所述基底112。Step 1042 , curing the first sealing glue to form the first sealing layer 1131 . The first sealing layer 1131 covers the base 112 .
本实施方式中,在所述天线微缝120中填充密封胶水后,所述密封胶水可以优先填充于所述天线微缝120与所述基底112之间的缝隙114,从而减少密封胶水在填满天线微缝120后再进入缝隙114而造成密封层113中产生气泡等,导致密封层113密封质量差等问题,从而提高所述密封层113的成型质量,进而提高所述壳体110的密封质量,及提高所述移动终端100的可靠性。In this embodiment, after the sealing glue is filled in the antenna micro-slit 120, the sealing glue can be preferentially filled in the gap 114 between the antenna micro-slit 120 and the base 112, thereby reducing the amount of sealing glue filling up. The antenna micro-slit 120 then enters the gap 114 to cause air bubbles in the sealing layer 113, resulting in poor sealing quality of the sealing layer 113, thereby improving the molding quality of the sealing layer 113, thereby improving the sealing quality of the housing 110 , and improve the reliability of the mobile terminal 100 .
一种实施方式中,请参阅图15,在所述天线微缝120中填充第一密封胶水的步骤104还包括:In one embodiment, please refer to FIG. 15 , the step 104 of filling the first sealing glue in the antenna micro-slit 120 further includes:
步骤1043、在所述第一密封层1131上填充第二密封胶水。Step 1043 , filling the second sealing glue on the first sealing layer 1131 .
步骤1044、固化所述第二密封胶水,成型第二密封层1132,以填满所述天线微缝120。Step 1044 , curing the second sealing glue, forming the second sealing layer 1132 to fill the antenna micro-slit 120 .
本实施方式中,通过在所述天线微缝120中填充第一密封胶水后,所述第一密封胶水填充于所述天线微缝120与所述基底112之间的缝隙114,成型的第一密封层1131可以密封所述天线微缝120与所述基底112之间的缝隙114,再在所述第一密封层1131上填充第二密封胶水,形成第二密封层1132,所述第二密封层1132填满所述天线微缝120。可以减少密封胶水在填满天线微缝120后再进入缝隙114而造成密封层113中产生气泡等,导致密封层113密封质量差等问题,从而提高所述密封层113的成型质量,进而提高所述壳体110的密封质量,及提高所述移动终端100的可靠性。In this embodiment, after filling the first sealing glue in the antenna micro-slit 120, the first sealing glue is filled in the gap 114 between the antenna micro-slit 120 and the base 112, and the formed first The sealing layer 1131 can seal the gap 114 between the antenna micro-slit 120 and the substrate 112, and then fill the second sealing glue on the first sealing layer 1131 to form a second sealing layer 1132. The second sealing Layer 1132 fills the antenna microslit 120 . It can reduce the problem that the sealing glue enters the gap 114 after filling the antenna micro-slit 120 to cause air bubbles in the sealing layer 113, resulting in poor sealing quality of the sealing layer 113, thereby improving the molding quality of the sealing layer 113, and then improving the sealing layer 113. The sealing quality of the casing 110 is improved, and the reliability of the mobile terminal 100 is improved.
本实施方式中,所述第一密封胶水可以与所述第二密封胶水为相同或不同的材质。In this embodiment, the first sealing glue and the second sealing glue may be of the same or different material.
可选的,所述第一密封胶水的粘度可以小于所述第二密封胶水的粘度。所述第一密封胶水具有较好的流动性,从而所述第一密封胶水在填充于所述天线微缝120后,可以流动至所述壳体基体111与所述基底112之间的缝隙114中,以减少密封层113中形成气泡、密封不良及漏胶等缺陷。Optionally, the viscosity of the first sealing glue may be smaller than the viscosity of the second sealing glue. The first sealing glue has better fluidity, so that the first sealing glue can flow to the gap 114 between the housing base 111 and the base 112 after being filled in the antenna micro-slit 120 In order to reduce defects such as air bubbles, poor sealing and glue leakage in the sealing layer 113 .
在其他的实施方式中,还可以在形成第二密封层1132后,再经过多次填充密封胶水和多次固化密封胶水后,填满所述天线微缝120。In other implementation manners, after the second sealing layer 1132 is formed, the antenna micro-slit 120 may be filled up after filling the sealing glue and curing the sealing glue multiple times.
可选的,所述第二密封胶水包括有色料,所述有色料以使所述第二密封胶水呈现白色、金色、银色等,在形成所述第二密封层1132后,所述第二密封层 1132形成有色的封装带,可以起到标记和装饰的作用。Optionally, the second sealing glue includes a colored material, and the colored material makes the second sealing glue appear white, gold, silver, etc. After the second sealing layer 1132 is formed, the second sealing Layer 1132 forms a colored encapsulation tape that can be used for marking and decoration.
步骤105、成型密封层113,密封所述天线微缝120。Step 105 , forming the sealing layer 113 to seal the antenna micro-slit 120 .
可选的,在步骤105中,可以通过加热固化工艺或紫外光固化工艺固化所述第一密封胶水。在通过加热固化工艺固化所述第一密封胶水的过程中,热固化的温度可以为80-100℃,尽量选适于固化且较低的温度,以避免固化温度过高,所述第一密封胶水发生开裂或收缩变形或与所述天线微缝120的内侧壁分离。可选的,所以热固化的时间可以为0.5-2h。Optionally, in step 105, the first sealing glue may be cured through a heat curing process or an ultraviolet light curing process. In the process of curing the first sealing glue through a heat curing process, the temperature of heat curing can be 80-100°C, and a lower temperature suitable for curing should be selected as far as possible to avoid excessive curing temperature. The glue cracks or shrinks and deforms or is separated from the inner sidewall of the antenna micro-slit 120 . Optional, so the heat curing time can be 0.5-2h.
步骤106、打磨所述壳体基体111,去除溢出的密封胶水,以使所述密封层 113与所述壳体基体111的表面齐平。Step 106, grinding the housing base 111, removing the overflowing sealing glue, so that the sealing layer 113 is flush with the surface of the housing base 111.
综上所述,虽然本申请已以较佳实施例揭露如上,但该较佳实施例并非用以限制本申请,该领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。In summary, although the present application has disclosed the above with a preferred embodiment, the preferred embodiment is not intended to limit the present application, and those of ordinary skill in the art may, without departing from the spirit and scope of the present application, Various changes and modifications are made, so the scope of protection of the present application is subject to the scope defined by the claims.
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| WO2019015585A1 (en) * | 2017-07-21 | 2019-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing rear cover, rear cover and electronic device having the same |
| US12204374B2 (en) | 2021-12-27 | 2025-01-21 | Samsung Electronics Co., Ltd. | Electronic device including flexible display |
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| WO2019015585A1 (en) * | 2017-07-21 | 2019-01-24 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing rear cover, rear cover and electronic device having the same |
| US11233313B2 (en) | 2017-07-21 | 2022-01-25 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing rear cover, rear cover and electronic device having the same |
| US12204374B2 (en) | 2021-12-27 | 2025-01-21 | Samsung Electronics Co., Ltd. | Electronic device including flexible display |
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| CN107896461B (en) | 2020-09-08 |
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