CN107948882B

CN107948882B - A bone conduction speaker

Info

Publication number: CN107948882B
Application number: CN201810015965.6A
Authority: CN
Inventors: 张磊; 廖风云; 齐心
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2018-01-08
Filing date: 2018-01-08
Publication date: 2025-03-07
Anticipated expiration: 2038-01-08
Also published as: CN107948882A

Abstract

The present application relates to a magnetic circuit assembly of a bone conduction speaker, comprising a first magnetic element, a first magnetic conductive element, and a second magnetic conductive element. The first magnetic element generates a first magnetic field, and the second magnetic conductive element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element. The magnetic circuit assembly also includes at least one second magnetic element. The at least one second magnetic element is placed below the magnetic gap. The at least one second magnetic element generates a second magnetic field, and the second magnetic field increases the magnetic induction intensity of the first magnetic field at the magnetic gap.

Description

Bone conduction loudspeaker

Technical Field

The present application relates to bone conduction speakers, and more particularly, to a magnetic circuit assembly in a bone conduction speaker.

Background

The bone conduction speaker can convert the electric signal into a mechanical vibration signal and conduct the vibration signal into the cochlea through human tissues and bones, so that the user can hear the sound. Compared with an air conduction loudspeaker, the air conduction loudspeaker drives air to vibrate through the vibrating diaphragm to generate sound, and the bone conduction vibration loudspeaker needs to drive soft tissues and bones of a user to vibrate, so that the required mechanical power is high. Increasing the sensitivity of bone conduction speakers can result in higher efficiency in the conversion of electrical energy to mechanical energy and thus greater mechanical power output. Increasing sensitivity is more important for bone conduction speakers with higher power requirements.

Brief description of the drawings

The application relates to a magnetic circuit assembly of a bone conduction loudspeaker. The magnetic circuit assembly may include a first magnetic element that generates a first magnetic field, a first magnetically permeable element, a second magnetically permeable element that surrounds the first magnetic element and forms a magnetic gap with the first magnetic element, and at least one second magnetic element disposed below the magnetic gap that generates a second magnetic field that increases a magnetic induction of the first magnetic field at the magnetic gap.

According to some embodiments of the application, the magnetic circuit assembly further comprises at least one third magnetic element connected to the second magnetic conductive element, the at least one third magnetic element generating a third magnetic field that increases the magnetic field strength of the first magnetic field at the magnetic gap.

According to some embodiments of the application, the magnetic circuit assembly further comprises at least one fourth magnetic element located between the second magnetically permeable element and the at least one third magnetic element.

According to some embodiments of the application, the magnetic circuit assembly further comprises a magnetically permeable cover surrounding the first magnetic element, the first magnetically permeable element, the second magnetically permeable element and the second magnetic element.

According to some embodiments of the application, the magnetic circuit assembly further comprises at least one fifth magnetic element connected to the upper surface of the first magnetically permeable element, the at least one fifth magnetic element generating a fifth magnetic field that increases the magnetic field strength of the first magnetic field at the magnetic gap.

According to some embodiments of the application, the magnetic circuit assembly further comprises a third magnetically permeable element connected to the upper surface of the fifth magnetic element, the third magnetically permeable element being configured to suppress field strength leakage of the first and second magnetic fields.

According to some embodiments of the application, the magnetic circuit assembly further comprises at least one electrically conductive element connecting at least one of the first magnetic element, the first magnetically permeable element, or the second magnetic element.

Additional features of the application will be set forth in part in the description which follows. Additional features of the application will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following description and the accompanying drawings or may be learned from production or operation of the embodiments. The features of the present disclosure may be implemented and realized in the practice or use of the various methods, instrumentalities and combinations of the specific embodiments described below.

Description of the drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. Like reference symbols in the various drawings indicate like elements.

Fig. 1 is a block diagram of a bone conduction speaker according to some embodiments of the application;

Fig. 2 is a schematic longitudinal section of a bone conduction speaker according to some embodiments of the application;

FIG. 3A is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3B is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3C is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3D is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3E is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3F is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3G is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3H is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 3M is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the application;

FIG. 4A is a schematic cross-sectional view of a magnetic element according to some embodiments of the application;

FIG. 4B is a schematic diagram of a magnetic element according to some embodiments of the present application;

FIG. 4C is a schematic illustration of the magnetization direction of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application;

FIG. 4D is a magnetic induction profile of a magnetic element in a magnetic assembly according to some embodiments of the application;

fig. 5 is a schematic diagram of a bone conduction speaker according to some embodiments of the application.

DETAILED DESCRIPTIONS

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present application, and it is apparent to those of ordinary skill in the art that the present application may be applied to other similar situations according to the drawings without inventive effort. It should be understood that these exemplary embodiments are presented merely to enable those skilled in the relevant art to better understand and practice the application and are not intended to limit the scope of the application in any way. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment" and the term "another embodiment" means "at least one other embodiment". Related definitions of other terms will be given in the description below. Hereinafter, without loss of generality, in describing the bone conduction related art in the present application, a description of "bone conduction speaker" or "bone conduction earphone" will be employed. The description is only one form of bone conduction application, and it will be appreciated by those of ordinary skill in the art that the "speaker" or "earpiece" may be replaced by other similar terms, such as "player", "hearing aid", etc. Indeed, various implementations of the application may be readily applied to other non-speaker-like hearing devices. For example, it will be apparent to those skilled in the art that various modifications and changes in form and details of the specific manner and procedure of implementing the bone conduction speaker, and in particular the addition of ambient sound pick-up and processing functions to the bone conduction speaker, may be made without departing from the basic principles of the bone conduction speaker, thereby enabling the speaker to function as a hearing aid. For example, a microphone such as a microphone may pick up sound from the user/wearer's surroundings and, under certain algorithms, transmit the sound processed (or generated electrical signals) to the bone conduction speaker portion. That is, the bone conduction speaker can be modified to have a function of picking up environmental sound, and transmit the sound to the user/wearer through the bone conduction speaker portion after a certain signal processing, thereby realizing the function of the bone conduction hearing aid. By way of example, the algorithms described herein may include one or more combinations of noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise immunity, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, and the like.

The invention provides a bone conduction speaker with high sensitivity. In some embodiments, the bone conduction speaker may include a magnetic circuit assembly. The magnetic circuit assembly may include a first magnetic element, a first magnetically permeable element, a second magnetically permeable element, and one or more second magnetic elements. The first magnetic element can generate a first magnetic field, and the second magnetic conductive element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element. The one or more magnetic elements are disposed below the magnetic gap and generate a second magnetic field. The second magnetic field increases the magnetic induction of the first magnetic field at the magnetic gap. One or more second magnetic elements in the magnetic circuit assembly can reduce the volume and weight of the magnetic circuit assembly, improve the efficiency of the bone conduction speaker and prolong the service life of the bone conduction speaker under the conditions of improving the magnetic field strength of the magnetic gap and improving the sensitivity of the bone conduction speaker.

The bone conduction speaker has the characteristics of small size, light weight, high efficiency, high sensitivity, long service life and the like, and is convenient to combine with the wearable intelligent device, so that the multifunctionalization of single device is realized, and the user experience is improved and optimized. The wearable smart devices include, but are not limited to, smart headphones, smart glasses, smart headbands, smart helmets, smart watches, smart gloves, smart shoes, smart cameras, smart video cameras, and the like. The bone conduction speaker may further be combined with smart materials, integrating bone conduction speakers in the manufacturing materials of the user's clothing, gloves, hats, shoes, etc. The bone conduction speaker can be further implanted into a human body, and can realize more personalized functions in cooperation with a human body implanted chip or an external processor.

Fig. 1 is a block diagram of a bone conduction speaker 100 according to some embodiments of the application. As illustrated, bone conduction speaker 100 may include a magnetic circuit assembly 102, a vibration assembly 104, a support assembly 106, and a storage assembly 108.

The magnetic circuit assembly 102 may provide a magnetic field. The magnetic field may be used to convert a signal containing acoustic information into a vibration signal. In some embodiments, the sound information may include video, audio files having a particular data format, or data or files that may be converted to sound by a particular means. The signal containing the audio information may be from the memory component 108 of the bone conduction speaker 100 itself, or from a system other than the bone conduction speaker 100 for generating, storing, or transmitting information. The signal containing the acoustic information may include one or more combinations of electrical signals, optical signals, magnetic signals, mechanical signals, and the like. The signal containing the sound information may come from one signal source or a plurality of signal sources. The plurality of signal sources may or may not be correlated. In some embodiments, bone conduction speaker 100 may acquire the signal containing the acoustic information in a number of different ways, either wired or wireless, and may be real-time or delayed. For example, bone conduction speaker 100 may receive electrical signals containing audio information via wired or wireless means, or may obtain data directly from a storage medium (e.g., storage component 108) to generate an audio signal. As another example, a bone conduction hearing aid may include components with sound collection capabilities that convert mechanical vibrations of sound into electrical signals by picking up the sound in the environment, and then processing the signals with an amplifier to obtain electrical signals that meet specific requirements. In some embodiments, the wired connection may include a metallic cable, an optical cable, or a hybrid metallic and optical cable, such as, for example, a coaxial cable, a communications cable, a flex cable, a spiral cable, a nonmetallic sheath cable, a metallic sheath cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, a telecommunications cable, a twinax cable, parallel twinax wires, twisted pair wires, or the like. The above described examples are for convenience of illustration only, and the medium of the wired connection may be of other types, such as other transmission carriers of electrical or optical signals, etc.

The wireless connection may include radio communication, free space optical communication, acoustic communication, electromagnetic induction, and the like. The radio communication may include IEEE802.11 series standards, IEEE802.15 series standards (such as bluetooth technology and zigbee technology, etc.), first generation mobile communication technologies, second generation mobile communication technologies (such as FDMA, TDMA, SDMA, CDMA, SSMA, etc.), general packet radio service technologies, third generation mobile communication technologies (such as CDMA2000, WCDMA, TD-SCDMA, wiMAX, etc.), fourth generation mobile communication technologies (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), near Field Communication (NFC), and other technologies operating in ISM band (such as 2.4GHz, etc.), free space optical communication may include visible light, infrared signals, etc., acoustic communication may include sound waves, ultrasonic signals, etc., and electromagnetic induction may include near field communication technology, etc. The above described examples are for convenience of illustration only and the medium of the wireless connection may also be of other types, e.g. Z-wave technology, other charged civilian and military radio bands, etc. For example, as some application scenarios of the present technology, bone conduction speaker 100 may obtain signals containing sound information from other devices through bluetooth technology.

The vibration assembly 104 may generate mechanical vibrations. The generation of the vibrations is accompanied by energy conversion, and bone conduction speaker 100 may use specific magnetic circuit assembly 102 and vibration assembly 104 to effect conversion of signals containing acoustic information into mechanical vibrations. The process of conversion may involve the coexistence and conversion of a variety of different types of energy. For example, the electrical signal may be directly converted into mechanical vibrations by a transducer means, producing sound. For another example, sound information may be included in the optical signal and a particular transducer device may perform the conversion from the optical signal to a vibration signal. Other types of energy that may coexist and be converted during operation of the transducer include thermal energy, magnetic field energy, and the like. The energy conversion modes of the energy conversion device can comprise moving coil type, electrostatic type, piezoelectric type, moving iron type, pneumatic type, electromagnetic type and the like. The frequency response range and sound quality of bone conduction speaker 100 may be affected by vibration assembly 104. For example, in the moving coil transducer device, the vibration assembly 104 includes a wound columnar coil and a vibrator (e.g., a vibrating reed), and the columnar coil driven by the signal current drives the vibrator to vibrate in the magnetic field to generate sound, so that the stretching and shrinking of the material of the vibrator, the deformation, the size, the shape and the fixing manner of the wrinkles, the magnetic density of the permanent magnet, etc. have a great influence on the sound quality of the bone conduction speaker 100. The vibration body in the vibration component 104 can be in a mirror symmetry structure, a center symmetry structure or an asymmetric structure, the vibration body can be provided with a discontinuous hole-shaped structure so as to enable the vibration body to generate larger displacement, thereby enabling the bone conduction loudspeaker to achieve higher sensitivity and improving output power of vibration and sound, the vibration body can be in a ring body structure, a plurality of struts which are converged towards the center are arranged in the ring body, and the number of the struts can be two or more.

The support assembly 106 may support the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The support assembly 106 may include one or more housings, one or more connectors. The one or more housings may form an accommodation space for accommodating the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The one or more connectors may connect the housing with the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108.

The storage component 108 can store signals containing audio information. In some embodiments, the storage component 108 may include one or more storage devices. The storage devices may include storage devices on storage systems such as direct attached storage (DIRECTATTACHED STORAGE), network attached storage (Network Attached Storage), and storage area network (Storage Area Network). The storage devices may include various types of storage devices such as solid state storage devices (solid state drives, solid state hybrid drives, etc.), mechanical hard drives, USB flash memory, memory sticks, memory cards (e.g., CF, SD, etc.), other drives (e.g., CD, DVD, HD DVD, blu-ray, etc.), random Access Memory (RAM), and Read Only Memory (ROM). The RAM may include a decimal counter, a selector, a delay line memory, a Williams, a Dynamic Random Access Memory (DRAM), a Static Random Access Memory (SRAM), a thyristor random access memory (T-RAM), a zero capacitance random access memory (Z-RAM), etc., and the ROM may include a bubble memory, a button line memory, a thin film memory, a magnet plated line memory, a core memory, a drum memory, a compact disc drive, a hard disk, a magnetic tape, an early NVRAM (nonvolatile memory), a phase change memory, a magnetoresistive random access memory, a ferroelectric random access memory, a nonvolatile SRAM, a flash memory, an electrically erasable rewritable read-only memory, an erasable programmable read-only memory, a shielded heap read-memory, a floating gate random access memory, a nanometer random access memory, a racetrack memory, a variable resistance memory, a programmable metallization cell, etc. The above-mentioned storage devices/storage units are examples, and storage devices that can be used for the storage devices/storage units are not limited thereto.

The above description of bone conduction speaker structures is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner and steps of implementing the bone conduction speaker may be made without departing from this principle, but remain within the scope of the above description. For example, bone conduction speaker 100 may include one or more processors that may execute one or more sound signal processing algorithms. The sound signal processing algorithm may modify or enhance the sound signal. Such as noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active noise immunity, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or the like, or any combination thereof, while remaining within the scope of the claimed invention. As another example, bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and the like. The sensor may collect user information or environmental information.

Fig. 2 is a schematic longitudinal section of a bone conduction speaker 200 according to some embodiments of the application. As shown, bone conduction speaker 200 may include a first magnetic element 202, a first magnetically permeable element 204, a second magnetically permeable element 206, a first diaphragm 208, a voice coil 210, a second diaphragm 212, and a vibration panel 214.

The magnetic element described in the present application refers to an element that can generate a magnetic field, such as a magnet or the like. The magnetic element may have a magnetization direction, which refers to a direction of a magnetic field inside the magnetic element. The first magnetic element 202 may include one or more magnets. In some embodiments, the magnets may include metal alloy magnets, ferrites, and the like. The metal alloy magnets may include neodymium iron boron, samarium cobalt, alnico, iron chromium cobalt, alfeb, iron carbon aluminum, or the like, or combinations thereof. The ferrite may include barium ferrite, steel ferrite, manganese ferrite, lithium manganese ferrite, or the like, or various combinations thereof.

The lower surface of the first magnetically permeable element 204 may be coupled to the upper surface of the first magnetic element 202. The second magnetically permeable element 206 may be coupled to the first magnetic element 202. It should be noted that the magnetizer referred to herein may also be referred to as a magnetic field concentrator or core. The magnetizer can adjust the distribution of a magnetic field (e.g., the magnetic field generated by the first magnetic element 202). The magnetic conductor may comprise an element machined from a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, or the like, such as iron, a ferrosilicon-based alloy, a ferroaluminum-based alloy, a nickel-iron-based alloy, a ferrocobalt-based alloy, a low carbon steel, a silicon steel sheet, ferrite, or the like. In some embodiments, the magnetic conductor may be machined by one or more combination of casting, plastic working, cutting, powder metallurgy, and the like. Casting may include sand casting, investment casting, pressure casting, centrifugal casting, etc., plastic working may include one or more combinations of rolling, casting, forging, stamping, extruding, drawing, etc., and cutting may include turning, milling, planing, grinding, etc. In some embodiments, the method of machining the magnetizer may include 3D printing, numerically controlled machine tools, and the like. The connection between the first magnetically permeable element 204, the second magnetically permeable element 206, and the first magnetic element 202 may include one or more of bonding, clamping, welding, riveting, bolting, etc. In some embodiments, the first magnetic element 202, the first magnetic conductive element 204, and the second magnetic conductive element 206 may be disposed in an axisymmetric configuration. The axisymmetric structure may be a ring structure, a column structure, or other structures having axisymmetry.

In some embodiments, a magnetic gap may be formed between the first magnetic element 202 and the second magnetic conductive element 206. Voice coil 210 may be disposed in the magnetic gap. The voice coil 210 may be connected to the first diaphragm 208. The first vibration plate 208 may be connected to the second vibration plate 212, and the second vibration plate 212 may be connected to the vibration panel 214. When a current is applied to the voice coil 210, the voice coil 210 is positioned in a magnetic field formed by the first magnetic element 202, the first magnetic conductive element 214 and the second magnetic conductive element 206, and is subjected to an ampere force, and the ampere force drives the voice coil 210 to vibrate, so that the vibration of the voice coil 210 drives the vibration of the first vibration plate 208, the second vibration plate 212 and the vibration panel 214. The vibration panel 214 transmits the vibrations through tissue and bone to the auditory nerve, thereby allowing the person to hear the sound. The vibration panel 214 may be in direct contact with the skin of the human body or may be in contact with the skin through a vibration transmission layer composed of a specific material.

In some embodiments, for bone conduction speakers with a single magnetic element, the magnetic induction lines through the voice coil are not uniform, diverging. Meanwhile, magnetic leakage can be formed in the magnetic circuit, namely more magnetic induction wires leak out of the magnetic gap and cannot pass through the voice coil, so that the magnetic induction intensity (or magnetic field intensity) at the position of the voice coil is reduced, and the sensitivity of the bone conduction loudspeaker is affected. Accordingly, bone conduction speaker 200 may further include at least one second magnetic element and/or at least one third magnetic conductive element (not shown). The at least one second magnetic element and/or the at least one third magnetic element may inhibit leakage of the magnetic induction lines, restrict the form of the magnetic induction lines passing through the voice coil, so that more magnetic induction lines pass through the voice coil as horizontally and densely as possible, and enhance magnetic induction (or magnetic field strength) at the position of the voice coil, thereby improving sensitivity of the bone conduction speaker 200 and further improving mechanical conversion efficiency of the bone conduction speaker 200 (i.e., efficiency of converting electric energy input into the bone conduction speaker 200 into mechanical energy of vibration of the voice coil). For a further description of the at least one second magnetic element, see fig. 3A-3H and fig. 3M.

The above description of the structure of bone conduction speaker 200 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner and steps of implementing the bone conduction speaker may be made without departing from this principle, but remain within the scope of the above description. For example, bone conduction speaker 200 may include a housing, a connector, and the like. The connector may connect the vibration panel 214 with the housing. For another example, bone conduction speaker 200 may include a second magnetic element that may be coupled to first magnetically permeable element 204. For another example, bone conduction speaker 200 may further include one or more annular magnetic elements that may be coupled to second magnetically permeable element 206.

Fig. 3A is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3100 according to some embodiments of the application. As shown in fig. 3A, magnetic circuit assembly 3100 may include a first magnetic element 302, a first magnetic conducting element 304, a first full field altering element 306, and a second magnetic element 308. In some embodiments, the first magnetic element 302 and/or the second magnetic element 308 may comprise any one or more of the magnets described in the present disclosure. The first magnetic element 302 may include a first magnet and the second magnetic element 308 may include a second magnet, which may be the same or different from the first magnet. The first magnetically permeable element 304 may comprise any one or more of the magnetically permeable materials described herein, such as low carbon steel, silicon steel sheet, ferrite, etc. In some embodiments, the first magnetic element 302 and/or the first magnetically permeable element 304 may be disposed in an axisymmetric configuration. The first magnetic element 302 and/or the first magnetically permeable element 304 may be cylindrical. In some embodiments, the first magnetic element 302 and the first magnetically permeable element 304 may be coaxial cylinders, containing the same or different diameters. In some embodiments, the first full magnetic field changing element 306 may be any one of a magnetic element or a magnetically permeable element. The first full magnetic field changing element 306 and/or the second magnetic element 308 may be configured as rings or sheets. In some embodiments, the second magnetic element 308 may be an annular cylinder coaxial with the first magnetic element 302, the first magnetically permeable element 304, and/or the first full field altering element 306, containing inner and/or outer rings of the same or different diameters. The method of processing the first magnetically permeable element 304 and/or the first full field altering element 306 may include any one or more of the processing methods described herein.

The upper surface of the first magnetic element 302 may be coupled to the lower surface of the first magnetic element 304 and the second magnetic element 308 may be coupled to the first magnetic element 302 and the first full field altering element 306. The connection between the first magnetic element 302, the first magnetically permeable element 304, the first full field altering element 306, and/or the second magnetic element 308 may be based on any one or more of the connections described herein. In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, the first full magnetic field altering element 306, and/or the second magnetic element 308 may form a magnetic loop and a magnetic gap.

In some embodiments, magnetic circuit assembly 3100 may generate a first full magnetic field (which may also be referred to as a "total magnetic field of the magnetic circuit assembly"), and first magnetic element 302 may generate a second magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the second magnetic element 308 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap. The first full magnetic field is formed by magnetic fields generated by all components (e.g., first magnetic element 302, first magnetically permeable element 304, first full magnetic field altering element 306, and second magnetic element 308) in the magnetic circuit assembly 3100. The magnetic field strength (which may also be referred to as magnetic induction or magnetic flux density) of the first full magnetic field within the magnetic gap is greater than the magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the second magnetic element 308 may generate a third magnetic field that may increase the magnetic field strength of the first full magnetic field at the magnetic gap. The third magnetic field increasing the magnetic field strength of the first full magnetic field as referred to herein means that the first full magnetic field is greater in the magnetic gap when the third magnetic field is present (i.e., the second magnetic element 308 is present) than when the third magnetic field is absent (i.e., the second magnetic element 308 is absent). In other embodiments in this specification, unless specifically stated otherwise, the magnetic circuit assembly represents a structure including all magnetic elements and magnetically conductive elements, the first full magnetic field represents the magnetic field generated by the magnetic circuit assembly as a whole, and the second magnetic field, the third magnetic field, the first magnetic field, and the nth magnetic field represent the magnetic fields generated by the respective magnetic elements, respectively. In different embodiments, the magnetic elements that generate the second magnetic field (or third magnetic field,..times., nth magnetic field) may be the same or different.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be no greater than 90 degrees.

In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 308 is no more than 90 degrees at the location of the second magnetic element 308. In some embodiments, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the second magnetic element 308 may be less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc., at the location of the second magnetic element 308. For another example, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the second magnetic element 308 is directed from the outer ring of the second magnetic element 308 toward the inner ring (as shown in the direction of c, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction).

The first full field altering element 306 in the magnetic circuit assembly 3100 may increase the total magnetic flux in the magnetic gap and thus increase the magnetic induction in the magnetic gap as compared to a single magnetic element magnetic circuit assembly. Under the action of the first full magnetic field changing element 306, the originally divergent magnetic induction lines converge toward the position of the magnetic gap, and the magnetic induction intensity in the magnetic gap is further increased.

The above description of the structure of magnetic circuit assembly 3100 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3100 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3100 may further include a magnetically permeable cover that may contain first magnetic element 302, first magnetically permeable element 304, first full field altering element 306, and second magnetic element 308.

Fig. 3B is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3200, according to some embodiments of the application. As shown in fig. 3B, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3200 may further include a third magnetic element 310.

The lower surface of the third magnetic element 310 may be connected to the first full field altering element 306. The connection between the third magnetic element 310 and the first full field altering element 306 may be based on any one or more of the connections described in the present disclosure. In some embodiments, a magnetic gap may be formed between the first magnetic element 302, the first magnetically permeable element 304, the first full magnetic field altering element 306, the second magnetic element 308, and/or the third magnetic element 310. In some embodiments, magnetic circuit assembly 3200 may generate a first full magnetic field and first magnetic element 302 may generate a second magnetic field, the first full magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the third magnetic element 310 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the third magnetic element 310 is directed from the inner ring of the third magnetic element 310 to the outer ring (as shown in the direction of b, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 90 degrees in a clockwise direction).

In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 308 is no more than 90 degrees at the location of the third magnetic element 310. In some embodiments, at the location of the third magnetic element 310, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the third magnetic element 310 may be less than or equal to 90 degrees, 0 degrees, 10 degrees, 20 degrees, etc.

Magnetic circuit assembly 3200 further adds third magnetic element 310 as compared to magnetic circuit assembly 3100. Third magnetic element 310 may further increase the total magnetic flux within the magnetic gap in magnetic circuit assembly 3200, thereby increasing the magnetic induction in the magnetic gap. In addition, under the action of the third magnetic element 310, the magnetic induction line further converges toward the position of the magnetic gap, so as to increase the magnetic induction intensity in the magnetic gap.

The above description of the structure of magnetic circuit assembly 3200 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art, having the benefit of this disclosure, that various modifications and changes in form and detail of the specific manner and steps of implementing magnetic circuit assembly 3200 may be made without departing from the basic principles of the bone magnetic circuit assembly, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3200 may further include a magnetically permeable cover that may include first magnetic element 302, first magnetically permeable element 304, first full field altering element 306, second magnetic element 308, and third magnetic element 310.

Fig. 3C is a schematic diagram of a magnetic circuit assembly 3300 according to some embodiments of the application. As shown in fig. 3C, unlike magnetic circuit assembly 3200, magnetic circuit assembly 3300 may further include fourth magnetic element 312.

A lower surface of the fourth magnetic element 312 may be connected to an upper surface of the first full magnetic field changing element 306 and an upper surface of the fourth magnetic element 312 may be connected to a lower surface of the second magnetic element 308. The connection between the fourth magnetic element 312 and the first full field altering element 306 and the second magnetic element 308 may be based on any one or more of the connections described herein. In some embodiments, a magnetic gap may be formed between the first magnetic element 302, the first magnetically permeable element 304, the first full magnetic field altering element 306, the second magnetic element 308, the third magnetic element 310, and/or the fourth magnetic element 312. The magnetization directions of the second magnetic element 308 and the third magnetic element 310 may be referred to in the detailed description of the present application 4A and/or 4B, respectively.

In some embodiments, magnetic circuit assembly 3300 may generate a first full magnetic field and first magnetic element 302 may generate a second magnetic field, the first full magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the fourth magnetic element 312 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the fourth magnetic element 312 is directed from the upper surface of the fourth magnetic element 312 to the lower surface (as shown in the direction d, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 180 degrees in a clockwise direction).

In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the fourth magnetic element 312 is no more than 90 degrees at the location of the fourth magnetic element 312. In some embodiments, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc., at the location of the fourth magnetic element 312.

Magnetic circuit assembly 3300 further adds fourth magnetic element 312 as compared to magnetic circuit assembly 3200. Fourth magnetic element 312 may further increase the total magnetic flux within the magnetic gap in magnetic circuit assembly 3300, thereby increasing the magnetic induction in the magnetic gap. In addition, under the action of the fourth magnetic element 312, the magnetic induction line further converges toward the position of the magnetic gap, so as to increase the magnetic induction intensity in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 3300 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3300 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3200 may further include one or more electrically conductive elements that may connect at least one of first magnetic element 302, first magnetically permeable element 304, second magnetic element 308, third magnetic element 310, and fourth magnetic element 312.

Fig. 3D is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3400 according to some embodiments of the application. As shown in fig. 3D, unlike magnetic circuit assembly 3300, magnetic circuit assembly 3400 may further include a magnetically permeable cover 314.

The magnetic shield 314 may comprise any one or more of the magnetic conductive materials described herein, such as mild steel, silicon steel sheet, ferrite, etc. The magnetic shield 314 may be coupled to the first full field altering element 306, the second magnetic element 308, the third magnetic element 310, and the fourth magnetic element 312 by any one or more of the coupling means described herein. The processing of the magnetic shield 314 may include any of the processing methods described herein, such as one or more combinations of casting, plastic processing, cutting, powder metallurgy, etc. In some embodiments, the magnetic shield 314 may include a bottom plate and side walls that are annular in configuration. In some embodiments, the floor and side walls may be integrally formed. In some embodiments, the bottom panel may be connected to the side walls by any one or more of the connections described in this disclosure.

The magnetic circuit assembly 3400 further adds a magnetically permeable cover 314 as compared to the magnetic circuit assembly 3300. The magnetic shield 314 can inhibit magnetic leakage of the magnetic circuit assembly 3300, and effectively reduce the magnetic circuit length and magnetic resistance, so that more magnetic induction wires can pass through the magnetic gap, and the magnetic induction intensity in the magnetic gap is improved.

The above description of the structure of the magnetic circuit assembly 3400 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3400 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, the magnetic circuit assembly 3400 may further include one or more electrically conductive elements that may connect at least one of the first magnetic element 302, the first magnetically permeable element 304, the second magnetic element 308, the third magnetic element 310, and the fourth magnetic element 312. For another example, magnetic circuit assembly 3200 may further include a fifth magnetic element having a lower surface coupled to an upper surface of first magnetically permeable element 304, the fifth magnetic element having a magnetization direction opposite to the magnetization direction of first magnetic element 302.

Fig. 3E is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3500, according to some embodiments of the application. As shown in fig. 3E, unlike magnetic circuit assembly 3200, the interface of first full field altering element 306 and second magnetic element 308 of magnetic circuit assembly 3500 may be wedge-shaped in cross-section.

Compared to magnetic circuit assembly 3100, the connection surface of first full magnetic field changing element 306 and second magnetic element 308 of magnetic circuit assembly 3500 is configured with a wedge-shaped cross section, so that the magnetic induction line can be smoothly turned. At the same time, the wedge-shaped cross-section may facilitate assembly of the first full magnetic field changing element 306 and the second magnetic element 308 and may reduce the number of assembly components and reduce the weight of the bone conduction speaker.

The above description of the structure of magnetic circuit assembly 3500 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3500 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3500 may further include one or more electrically conductive elements that may connect at least one of first magnetic element 302, first magnetically permeable element 304, second magnetic element 308, and third magnetic element 310. For another example, the magnetic circuit assembly 3500 may further include a fifth magnetic element, a lower surface of which is connected to an upper surface of the first magnetic conductive element 304, and a magnetization direction of which is opposite to that of the first magnetic element 302. In some embodiments, magnetic circuit assembly 3500 may further include a magnetically permeable cover, which may include first magnetic element 302, first magnetically permeable element 304, first full field altering element 306, second magnetic element 308, and third magnetic element 310.

Fig. 3F is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3600, according to some embodiments of the application. As shown in fig. 3F, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3600 can further include a fifth magnetic element 316. In some embodiments, fifth magnetic element 316 may include one or more magnets. The magnets may comprise any one or more of the magnet materials described herein. In some embodiments, the fifth magnetic element 316 may include a first magnet and the first magnetic element 302 may include a second magnet, which may be the same or different magnet materials than the second magnet. In some embodiments, the fifth magnetic element 316, the first magnetic element 302, and the first magnetically permeable element 304 may be disposed in an axisymmetric structure, e.g., the fifth magnetic element 316, the first magnetic element 302, and the first magnetically permeable element 304 may be cylinders. In some embodiments, the fifth magnetic element 316, the first magnetic element 302, and the first magnetically permeable element 304 may be coaxial cylinders containing the same or different diameters in some embodiments. For example, the first magnetically permeable element 304 may have a larger diameter than the first magnetic element 302 and/or the fifth magnetic element 316, and the sidewalls of the first magnetic element 302 and/or the fifth magnetic element 316 may form a first recess and/or a second recess. In some embodiments, the ratio of the thickness of the second magnetic element 316 to the sum of the thicknesses of the first magnetic element 302, the second magnetic element 316, and the first magnetically permeable element 304 is in the range of 0.4-0.6. The ratio of the first magnetically permeable element 304 to the sum of the thicknesses of the first magnetic element 302, the second magnetic element 316, and the first magnetically permeable element 304 is in the range of 0.5-1.5.

In some embodiments, the included angle between the magnetization direction of the fifth magnetic element 316 and the magnetization direction of the first magnetic element 302 is between 150 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the fifth magnetic element 316 and the magnetization direction of the first magnetic element 302 is between 90 degrees and 180 degrees. For example, the magnetization direction of the fifth magnetic element 316 is opposite to the magnetization direction of the first magnetic element 302 (as shown, the a-direction and the e-direction).

The magnetic circuit assembly 3600 further adds a fifth magnetic element 316 as compared to the magnetic circuit assembly 3100. The fifth magnetic element 326 can inhibit the magnetic leakage of the first magnetic element 302 in the magnetic circuit assembly 3600 in the magnetization direction, so that the magnetic field generated by the first magnetic element 302 can be more compressed into the magnetic gap, thereby improving the magnetic induction intensity in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 3600 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3600 may be made without departing from this principle, while still remaining within the scope of the foregoing description. In some embodiments, the magnetic circuit assembly 3600 may further include one or more electrically conductive elements that may connect at least one of the first magnetic element 302, the first magnetically permeable element 304, the second magnetic element 308, and the fifth magnetic element 316, e.g., the one or more electrically conductive elements may be disposed in the first recess and/or the second recess. In some embodiments, the magnetic circuit assembly 3600 may further add at least one magnetic element that may be coupled to the first full field altering element 306. In some embodiments, magnetic circuit assembly 3600 may further include a magnetically permeable cover that includes first magnetic element 302, first magnetically permeable element 304, first full field altering element 306, second magnetic element 308, and fifth magnetic element 316.

Fig. 3G is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3700, according to some embodiments of the application. Magnetic circuit assembly 3700 can include first magnetic element 302, first magnetically permeable element 304, first full magnetic field altering element 306, second magnetic element 308, third magnetic element 310, fourth magnetic element 312, fifth magnetic element 316, sixth magnetic element 318, seventh magnetic element 320, and second annular element 322. The first magnetic element 302, the first magnetically permeable element 304, the first full magnetic field altering element 306, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, and the fifth magnetic element 316 may be referred to in the detailed description of fig. 3A, 3B, 3C, 3D, 3E, and/or 3F of the present application. In some embodiments, the first full magnetic field altering element 306 and/or the second annular element 322 may comprise an annular magnetic element or an annular magnetically permeable element. The annular magnetic element may comprise any one or more of the magnet materials described herein, and the annular magnetically permeable element may comprise any one or more of the magnetically permeable materials described herein.

In some embodiments, the sixth magnetic element 318 may connect the fifth magnetic element 316 with the second annular element 322, and the seventh magnetic element 320 may connect the third magnetic element 310 with the second annular element 322. In some embodiments, the first magnetic element 302, the fifth magnetic element 316, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the sixth magnetic element 318, and/or the seventh magnetic element 320 may form a magnetic circuit with the first magnetic permeable element 304, the first full magnetic field altering element 306, and the second annular element 322.

The magnetization direction of the second magnetic element 308 may be described in detail with reference to fig. 3A of the present application, and the magnetization directions of the third magnetic element 310, the fourth magnetic element 312, and the fifth magnetic element 316 may be described in detail with reference to fig. 3B, 3C, and 3F of the present application, respectively.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the sixth magnetic element 318 is directed from the outer ring of the sixth magnetic element 318 toward the inner ring (as shown in the direction f, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction). In some embodiments, the magnetization direction of the sixth magnetic element 318 may be the same as the magnetization direction of the second magnetic element 308 in the same vertical direction. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the seventh magnetic element 320 is directed from the lower surface of the seventh magnetic element 320 to the upper surface (as shown in the direction of e, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 360 degrees in a clockwise direction). In some embodiments, the magnetization direction of the seventh magnetic element 320 may be the same as the magnetization direction of the third magnetic element 312.

In some embodiments, at the location of sixth magnetic element 318, the angle between the direction of the magnetic field generated by magnetic circuit assembly 3700 and the magnetization direction of sixth magnetic element 318 is no greater than 90 degrees. In some embodiments, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the sixth magnetic element 318 may be less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc., at the location of the sixth magnetic element 318.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 320 is no greater than 90 degrees.

In some embodiments, at the location of the seventh magnetic element 320, the angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the seventh magnetic element 320 is no more than 90 degrees. In some embodiments, at the location of the seventh magnetic element 320, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the seventh magnetic element 320 may be less than or equal to 90 degrees, 0 degrees, 10 degrees, 20 degrees, etc.

In some embodiments, the first full magnetic field changing element 306 may be a toroidal magnetic element. In this case, the magnetization direction of the first full magnetic field changing element 306 may be the same as the magnetization direction of the second magnetic element 308 or the fourth magnetic element 312. For example, on the right side of the first magnetic element 302, the magnetization direction of the first full field changing element 306 may be directed from the outer ring of the first full field changing element 306 to the inner ring. In some embodiments, the second ring element 322 may be a ring-shaped magnetic element. In this case, the magnetization direction of the second ring-shaped element 322 may be the same as the magnetization direction of the sixth magnetic element 318 or the seventh magnetic element 320. For example, on the right side of the first magnetic element 302, the magnetization direction of the second annular element 322 may be directed from the outer ring of the second annular element 322 to the inner ring.

In magnetic circuit assembly 3700, multiple magnetic elements can increase the total magnetic flux, different magnetic elements interact, magnetic induction line leakage can be suppressed, magnetic induction at the magnetic gap is increased, and sensitivity of the bone conduction speaker is improved.

The above description of the structure of the magnetic circuit assembly 3700 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3700 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. In some embodiments, magnetic circuit assembly 3700 may further include one or more electrically conductive elements that may connect at least one of first magnetic element 302, first magnetically permeable element 304, second magnetic element 308, third magnetic element 310, fourth magnetic element 312, fifth magnetic element 316, sixth magnetic element 318, and seventh magnetic element 320.

Fig. 3H is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3800, according to some embodiments of the application. As shown in fig. 3H, unlike magnetic circuit assembly 3700, magnetic circuit assembly 3800 may further include a magnetically permeable cover 314.

The magnetic shield 314 may comprise any one or more of the magnetic conductive materials described herein, such as mild steel, silicon steel sheet, ferrite, etc. The magnetic shield 314 may be coupled to the first magnetic element 302, the first full field altering element 306, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 316, the sixth magnetic element 318, the seventh magnetic element 320, and the second annular element 322 by any one or more of the coupling means described herein. The processing of the magnetic shield 314 may include any of the processing methods described herein, such as one or more combinations of casting, plastic processing, cutting, powder metallurgy, etc. In some embodiments, the magnetically permeable cover may include at least one bottom plate and a sidewall, the sidewall being of annular configuration. In some embodiments, the floor and side walls may be integrally formed. In some embodiments, the bottom panel may be connected to the side walls by any one or more of the connections described in this disclosure. For example, the magnetic shield 314 may include a first bottom plate, a second bottom plate, and a side wall, where the first bottom plate and the side wall may be integrally formed, and the second bottom plate may be connected to the side wall by any one or more of the connections described herein.

In the magnetic circuit assembly 3800, the magnetic circuit generated by the magnetic circuit assembly 3800 can be closed by the magnetic conductive cover 314, so that more magnetic induction lines are concentrated in the magnetic gap in the magnetic circuit assembly 3800, and the effects of inhibiting magnetic leakage, increasing the magnetic induction intensity at the magnetic gap and improving the sensitivity of the bone conduction speaker are achieved.

The above description of the structure of the magnetic circuit assembly 3800 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3800 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3800 may further include one or more electrically conductive elements that may connect at least one of first magnetic element 302, first magnetically permeable element 304, second magnetic element 308, third magnetic element 310, fourth magnetic element 312, fifth magnetic element 316, sixth magnetic element 318, and seventh magnetic element 320.

Fig. 3M is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3900, according to some embodiments of the application. As shown in fig. 3M, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3900 can further include one or more conductive elements (e.g., first conductive element 324, second conductive element 326, and third conductive element 328).

The description of the conductive elements is similar to conductive element 318, conductive element 320, and conductive element 322, and the relevant description thereof is not repeated here.

The above description of the structure of magnetic circuit assembly 3900 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art, having the benefit of this disclosure, that various modifications and changes in form and detail of the specific manner and steps of implementing magnetic circuit assembly 3900 may be made without departing from the basic principles of the bone magnetic circuit assembly, but such modifications and changes remain within the scope of the foregoing description. For example, magnetic circuit assembly 3900 may further include at least one magnetic element and/or magnetically permeable element.

Fig. 4A is a schematic cross-sectional view of a magnetic element structure according to some embodiments of the application. The magnetic element 400 may be adapted for use in any of the magnetic circuit assemblies of the present application (e.g., the magnetic circuit assemblies shown in fig. 3A-3H and 3M). As shown, the magnetic element 400 may be annular. The magnetic element 400 may include an inner ring 402 and an outer ring 404. In some embodiments, the shape of the inner ring 402 and/or the outer ring 404 may be circular, elliptical, triangular, quadrilateral, or any other polygon.

Fig. 4B is a schematic diagram of a magnetic element structure according to some embodiments of the application. The magnetic element may be adapted for use in any of the magnetic circuit assemblies of the present application (e.g., the magnetic circuit assemblies shown in fig. 3A-3H and 3M). As shown, the magnetic element may be comprised of a plurality of magnet arrangements. The two ends of any one of the magnets may be connected to the two ends of the adjacent magnets or may have a certain distance. The spacing between the plurality of magnets may be the same or different. In some embodiments, the magnetic element may be comprised of 2 or 3 plate-like magnets (e.g., magnets 408-2,408-4, and 408-6) arranged equidistantly. The shape of the sheet-like magnet may be a sector, a quadrangle, or the like.

Fig. 4C is a schematic diagram illustrating the magnetization direction of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As illustrated, the magnetic circuit assembly may include a first magnetic element 401, a second magnetic element 403, and a third magnetic element 405. The magnetization direction of the first magnetic element 401 may be directed from the lower surface of the first magnetic element 401 to the upper surface (i.e., a direction out of the page perpendicular to the page). The second magnetic element 403 may be disposed around the first magnetic element 401. A magnetic gap may be formed between the inner ring of the second magnetic element 403 and the inner ring of the first magnetic element 401. The magnetization direction of the second magnetic element 403 may be directed from the inner ring to the outer ring of the second magnetic element 403. The inner ring of the third magnetic element 405 may be connected to the outer ring of the first magnetic element 401 and the outer ring of the third magnetic element 405 may be connected to the inner ring of the second magnetic element 403. The magnetization direction of the third magnetic element 405 may be directed from the outer ring of the third magnetic element 403 to the inner ring.

Fig. 4D is a schematic diagram of magnetic induction lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As shown, the magnetic circuit assembly 400 (e.g., as shown in fig. 3A-3H and 3M) may include a first magnetic element 402 and a second magnetic element 404. The magnetization direction of the first magnetic element 402 may be such that the lower surface of the first magnetic element 402 is directed toward the upper surface (as indicated by arrow a). The first magnetic element 402 may generate a second magnetic field, which may be represented by lines of magnetic induction (solid lines in the figure represent the distribution of the second magnetic field in the absence of the second magnetic element 404), the magnetic field direction of the second magnetic field at a point being the tangential direction of the point on the lines of magnetic induction. The magnetization direction of the second magnetic element 404 may be such that the inner ring of the second magnetic element 404 points toward the outer ring (as indicated by arrow b). The second magnetic element 404 may generate a third magnetic field. The third magnetic field may also be represented by lines of magnetic induction (the dashed lines in the figure represent the distribution of the third magnetic field in the absence of the first magnetic element 402), the magnetic field direction of the third magnetic field at a point being the tangential direction of the point on the third lines of magnetic induction. The magnetic circuit assembly 400 may generate a first full magnetic field under the interaction of the second magnetic field and the third magnetic field. The magnetic field strength of the first full magnetic field at voice coil 406 is greater than the magnetic field strength of the second magnetic field or the third magnetic field at voice coil 406. As shown, the angle between the direction of the magnetic field of the second magnetic field at the voice coil 406 and the magnetization direction of the second magnetic element 404 is less than or equal to 90 degrees.

Fig. 5 is a schematic diagram of a bone conduction speaker 5000 according to some embodiments of the application. As shown, bone conduction speaker 5000 may include first magnetic element 502, first magnetic conductive element 510, second magnetic element 504, third magnetic element 506, second magnetic conductive element 508, gasket 514, voice coil 512, first vibration plate 516, bracket 518, second vibration plate 520, and vibration panel 522. The lower surface of the first magnetic element 502 is connected to the inner wall of the second magnetic element 508. The upper surface of the first magnetic element 502 is connected to the lower surface of the first magnetic element 510. The outer sidewall of the second magnetic element 504 is connected to the inner sidewall of the second magnetic conductive element 508. The third magnetic element 506 is below the second magnetic element 504, meanwhile, the outer side wall of the third magnetic element 506 is connected with the inner side wall of the second magnetic element 508, the inner side wall of the third magnetic element 506 is connected with the outer side wall of the first magnetic element 502, the lower surface of the third magnetic element 506 is connected with the inner wall of the second magnetic element 508, and magnetic gaps can be formed between the first magnetic element 502 and the first magnetic element 510 and between the second magnetic element 504 and the third magnetic element 506. Voice coil 512 may be placed in the magnetic gap. In some embodiments, voice coil 512 may be racetrack shaped as shown in fig. 5, or may be of other geometric shapes, such as triangular, rectangular, square, oval, pentagonal, or other irregular shapes. The voice coil 512 is connected to a bracket 518, the bracket 518 is connected to a first diaphragm 516, and the first diaphragm 516 is connected to the second magnetic conductive element 508 through a gasket 514. The lower surface of the second vibration plate 520 is connected to the frame 518, and the upper surface of the second vibration plate 520 is connected to the vibration panel 522. In some embodiments, the second magnetic element 504 may be comprised of multiple pieces of magnetic elements, which may be comprised of 4 pieces of magnetic elements 541,542,543,544 as shown in fig. 5. The shape enclosed by the plurality of magnetic elements may be racetrack-shaped as shown in fig. 5, or may be other geometric shapes, such as triangular, rectangular, square, oval, pentagonal, or other irregular shapes. The third magnetic element 506 may be comprised of multiple pieces of magnetic elements, which may be comprised of 4 pieces of magnetic elements 561,562,563,564 as shown in fig. 5. The shape enclosed by the plurality of magnetic elements may be racetrack-shaped as shown in fig. 5, or may be other geometric shapes, such as triangular, rectangular, square, oval, pentagonal, or other irregular shapes. As described in other embodiments of the present application, the second magnetic element 504 or the third magnetic element 506 may be replaced with a plurality of interconnected magnetic elements having different magnetization directions that may increase the magnetic field strength at the magnetic gap in the bone conduction speaker 500, thereby increasing the sensitivity of the bone conduction speaker 500.

In some embodiments, the first magnetic element 502, the first magnetic conductive element 510, the second magnetic element 504, the third magnetic element 506, the second magnetic conductive element 508, the gasket 514, the voice coil 512, the first diaphragm 516, the bracket 518, the second diaphragm 520, and/or the diaphragm 522 may be connected by any one or more of the connection methods described herein. For example, the first magnetic element 502, the second magnetic element 504, and the third magnetic element 506 may be adhesively coupled to the first magnetic element 510 and/or the second magnetic element 508. For another example, the washer 514 may be coupled to the second magnetically permeable element 508 by a back-off structure, and further, the washer 514 may be coupled to the second magnetically permeable element 508 and/or the second magnetic element 504 by a back-off structure with an adhesive. In some embodiments, the first vibration plate 516 and/or the second vibration plate 520 may be provided as one or more coaxial rings in which a plurality of struts converging toward the center are provided, the convergence center of which coincides with the center of the first vibration plate 516 and/or the second vibration plate 520. The support rods are staggered. The plurality of struts are straight bars or bent bars or part of the struts are straight bars, preferably the plurality of struts are bent bars. In some embodiments, the outer surface of the vibration panel 522 may be planar or curved. For example, the outer surface of the vibration panel 522 is a convex arc surface as shown in fig. 5.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within the present disclosure, and therefore, such modifications, improvements, and adaptations are intended to be within the spirit and scope of the exemplary embodiments of the present disclosure.

Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the application may be combined as suitable.

Furthermore, those skilled in the art will appreciate that the various aspects of the application are illustrated and described in terms of several patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the application may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.) or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the application may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.

Furthermore, the order in which the elements and sequences are presented, the use of numerical letters, or other designations are used in the application is not intended to limit the sequence of the processes and methods unless specifically recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of example, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the application. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in order to simplify the description of the present disclosure and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure does not imply that the subject application requires more features than are set forth in the claims. Indeed, less than all of the features of a single embodiment disclosed above.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments, in some examples, are modified with the modifier "about," "approximately," or "substantially," etc. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical data used in the specification and claims is approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and data used to identify the breadth of their ranges are approximations in some embodiments of the application, in particular embodiments, the settings of such numerical values are as precise as possible.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the application may be considered in keeping with the teachings of the application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly described and depicted herein.

Claims

1. The bone conduction speaker is characterized by comprising a vibration assembly, a magnetic circuit assembly and a support assembly, wherein the support assembly accommodates the magnetic circuit assembly and the vibration assembly and is connected with the magnetic circuit assembly and the vibration assembly, and the magnetic circuit assembly comprises:

a first magnetic element that generates a first magnetic field;

The lower surface of the first magnetic conduction element is connected with the upper surface of the first magnetic element;

A second magnetic conductive element surrounding the first magnetic element to form a magnetic gap between an inner peripheral surface of the second magnetic conductive element and an outer peripheral surface of the first magnetic element, and

At least one second magnetic element disposed within the magnetic gap and below the voice coil, the at least one second magnetic element generating a second magnetic field that increases the magnetic induction of the first magnetic field at the magnetic gap, and

The inner peripheral surface of the second magnetic element is connected with the outer peripheral surface of the first magnetic element, the outer peripheral surface of the second magnetic element is connected with the inner peripheral surface of the second magnetic element, and the upper surface of the second magnetic element and the lower surface of the voice coil are integrally located between the upper surface and the lower surface of the first magnetic element and are arranged at intervals in the interval direction of the upper surface and the lower surface of the first magnetic element.

2. The bone conduction speaker of claim 1, wherein an angle between a magnetization direction of the at least one second magnetic element and a magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.

3. The bone conduction speaker according to claim 1, further comprising:

At least one third magnetic element, wherein a lower surface of the third magnetic element is connected to the second magnetic conductive element, the at least one third magnetic element generates a third magnetic field that increases a magnetic field strength of the first magnetic field at the magnetic gap, the third magnetic element surrounds the first magnetic element, and further forms the magnetic gap between an inner peripheral surface of the third magnetic element and an outer peripheral surface of the first magnetic element, and in the spacing direction, a lower surface of the third magnetic element is located between an upper surface and a lower surface of the first magnetic element, and an upper surface of the third magnetic element is located above the upper surface of the first magnetic conductive element.

4. The bone conduction speaker according to claim 3, wherein an angle between a magnetization direction of the at least one third magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.

5. The bone conduction speaker according to claim 1, further comprising:

At least one fourth magnetic element located between the second magnetically permeable element and the at least one third magnetic element.

6. The bone conduction speaker of claim 5, wherein an angle between a magnetization direction of the at least one fourth magnetic element and a magnetization direction of the first magnetic element is not less than 90 degrees.

7. The bone conduction speaker according to any one of claims 1-6, further comprising:

The magnetic conduction cover surrounds the first magnetic element, the first magnetic conduction element, the second magnetic conduction element and the second magnetic element.

8. The bone conduction speaker according to claim 1, further comprising:

at least one fifth magnetic element, wherein the at least one fifth magnetic element is connected to the upper surface of the first magnetically permeable element, the at least one fifth magnetic element generating a fifth magnetic field that increases the magnetic field strength of the first magnetic field at the magnetic gap.

9. The bone conduction speaker of claim 8, wherein the angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is between 150 degrees and 180 degrees.

10. The bone conduction speaker of claim 8, wherein a ratio of a thickness of the at least one fifth magnetic element to a sum of thicknesses of the first magnetic element, the at least one fifth magnetic element, and the first magnetically permeable element is in a range of 0.4-0.6.

11. The bone conduction speaker of claim 8, wherein the thickness of the fifth magnetic element is less than or equal to the thickness of the first magnetic element.

12. The bone conduction speaker of claim 8, further comprising:

And a third magnetically permeable element, wherein the third magnetically permeable element is connected to an upper surface of the fifth magnetic element, the third magnetically permeable element configured to inhibit leakage of field strengths of the first and second magnetic fields.

13. The bone conduction speaker according to claim 1, further comprising:

At least one electrically conductive element, wherein the electrically conductive element connects at least one of the first magnetic element, the first magnetically permeable element, or the second magnetic element.

14. The bone conduction speaker of claim 1, wherein the vibration assembly comprises the voice coil and at least one vibration plate.