CN107953038B - Transparent brittle material processing equipment - Google Patents
Transparent brittle material processing equipment Download PDFInfo
- Publication number
- CN107953038B CN107953038B CN201711448374.XA CN201711448374A CN107953038B CN 107953038 B CN107953038 B CN 107953038B CN 201711448374 A CN201711448374 A CN 201711448374A CN 107953038 B CN107953038 B CN 107953038B
- Authority
- CN
- China
- Prior art keywords
- laser
- focusing
- module
- ultrasonic
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 60
- 238000003698 laser cutting Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000007493 shaping process Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 15
- 238000006073 displacement reaction Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000003044 adaptive effect Effects 0.000 claims 2
- 238000005520 cutting process Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 11
- 239000012634 fragment Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 230000008646 thermal stress Effects 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- VCZFPTGOQQOZGI-UHFFFAOYSA-N lithium bis(oxoboranyloxy)borinate Chemical compound [Li+].[O-]B(OB=O)OB=O VCZFPTGOQQOZGI-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides transparent brittle material processing equipment, which comprises a control module, a laser cutting module, an ultrasonic focusing module and a processing platform, wherein the laser cutting module comprises a laser generator, and a laser shaping unit, a laser pointing transmission unit, a laser scanning unit and a laser focusing unit which are sequentially arranged along the laser path direction, the sample processing platform is arranged below the laser focusing unit, the ultrasonic focusing module and the laser focusing unit are coaxially arranged, the processing platform can move freely in multiple axes, and the control module is used for controlling the cooperative work of all parts. The invention has the beneficial effects that: the processing equipment adopts the focused laser beam to process the transparent brittle material, simultaneously adopts the ultrasonic focusing system to generate focused ultrasonic waves to separate material fragments generated by laser processing from a material body, and adopts the material cutting wall processed by the equipment to be smooth and free from cracking and taper, thereby greatly improving the success rate of processing the transparent brittle material.
Description
Technical Field
The invention relates to the technical field of cutting processes, in particular to transparent brittle material processing equipment.
Background
With the development of industry, in the current industrial production, especially in the processing of core components of some electronic components and optoelectronic products, a series of operations such as cutting, punching, polishing and the like are generally required for some transparent materials, such as glass, lithium triborate crystals (LBO), potassium dihydrogen phosphate (KDP) crystals and the like. At present, the following processing modes are mainly adopted:
1. in the traditional machining mode, a hard metal wheel or diamond is adopted to mechanically break after scribing on the surface of a material, however, due to the characteristics of a brittle material, the situation that the surface is broken and even the material is broken is extremely easy to occur, and the yield cannot be ensured. With the increasing demand for products of such transparent brittle materials, traditional processing methods are also facing new challenges;
2. the laser processing mode adopts high-density energy generated by laser beams to melt or even gasify materials in a short time, then auxiliary gas is used for blowing slag away, and kerfs are formed along with the movement of the laser beams, however, the problem generated by the method is that a recondensing layer and micro cracks are easy to generate on the kerf end surface of the brittle materials, so that the surface roughness is increased, and the kerf edge breakage and splashes pollute the materials;
3. the laser thermal stress cutting method realizes the separation of brittle materials by a method of generating thermal stress, inducing and controlling crack growth by scanning the materials by laser, and does not need high-power laser irradiation, so that the materials are not softened and melted; the cutting powder or slag is not needed, the cutting surface is smooth, and the material is not lost, but the processing material such as sapphire which is used in the method needs to be immersed in a highly corrosive solution such as hydrofluoric acid for a plurality of hours, which is not beneficial to environmental protection and takes a long time.
Therefore, there is a need for innovations in the art.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the transparent brittle material processing equipment is simple in working procedure, environment-friendly and reliable.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a transparent brittle material processing equipment, includes control module, laser cutting module, ultrasonic focusing module and processing platform, laser cutting module includes laser generator, and laser shaping unit, laser directional transmission unit, laser scanning unit and the laser focusing unit that sets gradually along laser light path direction, processing platform sets up in the below of laser focusing unit, ultrasonic focusing module with the coaxial setting of laser focusing unit, but processing platform multiaxis free movement, control module is used for controlling laser cutting module and ultrasonic focusing module operating condition and processing platform's displacement.
Further, the ultrasonic focusing module coincides with the focus of the laser focusing unit.
Further, a processing groove is formed in the processing platform, and a material fixing mechanism is arranged in the processing groove.
Further, the processing tank is filled with liquid, and the liquid is water or oil.
Further, the laser cutting device also comprises a self-adaptive platform, wherein the laser focusing unit of the laser cutting module and the ultrasonic focusing module are both arranged on the self-adaptive platform, and the self-adaptive platform is controlled by the control module to move along the vertical direction.
Further, the laser generator generates laser with a wavelength of 0.2-11.4 μm.
Further, the pulse width of the laser generated by the laser generator is in the picosecond level or the femtosecond level.
Further, the ultrasonic focusing module is a high-intensity focusing ultrasonic system, and the ultrasonic frequency generated by the high-intensity focusing ultrasonic system is 18KHz-10MHz.
Further, the ultrasonic frequency generated by the high-intensity focused ultrasonic system is matched with the resonance frequency of the transparent brittle material.
The invention has the beneficial effects that: the processing equipment adopts the focused laser beam to process the transparent brittle material, simultaneously adopts the ultrasonic focusing system to generate focused ultrasonic waves to separate material fragments generated by laser processing from a material body, and adopts the material cutting wall processed by the equipment to be smooth and free from cracking and taper, thereby greatly improving the success rate of processing the transparent brittle material.
Drawings
The specific structure of the present invention is described in detail below with reference to the accompanying drawings:
fig. 1 is a schematic block diagram of a brittle material processing apparatus according to the present invention.
Detailed Description
In order to describe the technical content, the constructional features, the achieved objects and effects of the present invention in detail, the following description is made in connection with the embodiments and the accompanying drawings.
Example 1
Referring to fig. 1, a brittle material processing device includes a control module, a laser cutting module, an ultrasonic focusing module and a processing platform, wherein the laser cutting module includes a laser generator, and a laser shaping unit, a laser directional transmission unit, a laser scanning unit and a laser focusing unit which are sequentially arranged along the laser path direction, the processing platform is arranged below the laser focusing unit, the ultrasonic focusing module and the laser focusing unit are coaxially arranged, the processing platform can move freely in multiple axes, and the control module is used for controlling the working states of the laser cutting module and the ultrasonic focusing module and the displacement of the processing platform.
In this embodiment, the control module generates laser by using a laser generator, where the laser generator is an optical fiber laser or a solid laser, the wavelength of the generated laser is 0.2-11.4 μm, the pulse width of the generated laser is picosecond or femtosecond pulse laser, the laser passes through a laser shaping unit to adjust the spot size, shape, optical density distribution, and the like of the laser, and is transmitted to a laser focusing unit to perform focusing processing by passing through a laser pointing transmission unit and a laser scanning unit, and the transparent and brittle material is fixed on a processing platform by a material fixing mechanism, and the control module adjusts the focus of the laser by the laser focusing unit to make the laser act on the cutting point of the material, and then adjusts the cutting path of the processing device by controlling the horizontal movement of the processing platform to the X axis and the Y axis.
And the ultrasonic focusing module is arranged coaxially and confocal with the laser focusing module to start working, the focused laser beam enables the material to generate controllable thermal stress cracks, the focused ultrasonic wave is overlapped with the laser focus, the strong vibration can enable the material generating the thermal stress cracks to crack along the cutting direction after laser irradiation, in order to enable fragments of the material to be separated from the material more easily under the action of the focused ultrasonic wave, the processing groove of the processing platform is injected with liquid, the liquid can be water or oil, the liquid is selected to be suitable for the laser wavelength, the influence on the processing effect caused by the absorption of laser energy by the liquid is avoided, and the transparent brittle material immersed in the liquid can accelerate the separation process of the fragments under the tension of the liquid, wherein the working frequency of the focused ultrasonic wave is matched with the vibration frequency of the liquid.
The laser focusing module focuses laser in various modes, such as a multi-point focusing beam, a Bessel focusing beam, a laser wire-forming beam and the like.
Brittle materials include glass, sapphire, quartz, corundum, and the like.
Laser processing includes cutting, drilling through holes, drilling blind holes, and the like.
Here, upper, lower, left, right, front, and rear represent only their relative positions and do not represent their absolute positions.
From the above description, the beneficial effects of the invention are as follows: the processing equipment adopts the focused laser beam to process the transparent brittle material, simultaneously adopts the ultrasonic focusing system to generate focused ultrasonic waves to separate material fragments generated by laser processing from a material body, and adopts the material cutting wall processed by the equipment to be smooth and free from cracking and taper, thereby greatly improving the success rate of processing the transparent brittle material.
Example 2
On the basis of embodiment 1, the processing equipment further comprises a self-adaptive platform, wherein the laser scanning unit, the laser focusing unit and the ultrasonic focusing module of the laser cutting module are arranged on the self-adaptive platform, and the self-adaptive platform is controlled by the control module to move along the vertical direction.
In this embodiment, when the material is thicker, the control module can control the self-adaptive platform to adjust the position of the focus of laser focusing in the vertical direction, namely the Z axis, so that the focus moves towards the inside of the material, thereby realizing three-dimensional processing of the material and greatly improving the processing efficiency.
The X axis, the Y axis and the Z axis are mutually perpendicular, wherein the X axis and the Y axis represent displacement in the horizontal direction, and the Z axis represents displacement in the vertical direction.
Example 3
Based on the embodiment 2, the ultrasonic focusing module is a high-intensity focusing ultrasonic system, and the ultrasonic frequency generated by the high-intensity focusing ultrasonic system is 18KHz-10MHz.
In this embodiment, the high-intensity focused ultrasound system is composed of a plurality of ultrasonic wave generating sources, each ultrasonic wave generating source can generate an ultrasonic wave beam, and when focusing the plurality of ultrasonic wave beams on a point, focused ultrasonic waves can be obtained, and the process of separating material fragments from materials can be accelerated by matching with the laser cutting module.
The ultrasonic frequency generated by the high-intensity focused ultrasonic system is matched with the resonance frequency of the transparent brittle material, and the ultrasonic frequency matched with the resonance frequency is adopted to process the material, so that the processing efficiency can be improved.
When the transparent brittle material is soaked in liquid for processing, the ultrasonic frequency generated by the high-intensity focused ultrasonic system is matched with the resonance frequency of the liquid.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (4)
1. A transparent brittle material processing device is characterized in that: the laser cutting device comprises a control module, a laser cutting module, an ultrasonic focusing module and a processing platform, wherein the laser cutting module comprises a laser generator, a laser shaping unit, a laser pointing transmission unit, a laser scanning unit and a laser focusing unit which are sequentially arranged along the direction of a laser path, the processing platform is arranged below the laser focusing unit, the ultrasonic focusing module and the laser focusing unit are coaxially arranged, the ultrasonic focusing module is coincident with the focus of the laser focusing unit, the processing platform can freely move in multiple axes, and the control module is used for controlling the working states of the laser cutting module and the ultrasonic focusing module and the displacement of the processing platform;
the laser generator emits laser, and the ultrasonic focusing module coaxially and confocal arranged with the laser focusing module starts to work;
a processing groove is formed in the processing platform, and a material fixing mechanism is arranged in the processing groove; the processing tank is filled with liquid, the liquid is water or oil, the liquid is adaptive to the laser wavelength, and the working frequency of the focused ultrasonic wave is adaptive to the vibration frequency of the liquid;
the ultrasonic focusing module is a high-intensity focusing ultrasonic system, and the ultrasonic frequency generated by the high-intensity focusing ultrasonic system is 18KHz-10MHz;
the ultrasonic frequency generated by the high-intensity focused ultrasonic system is matched with the resonance frequency of the transparent brittle material.
2. The transparent brittle material processing apparatus according to claim 1, wherein: the laser cutting device comprises a laser cutting module, a laser focusing unit and an ultrasonic focusing module, and is characterized by further comprising a self-adaptive platform, wherein the laser focusing unit of the laser cutting module and the ultrasonic focusing module are both arranged on the self-adaptive platform, and the self-adaptive platform is controlled by the control module to move along the vertical direction.
3. The transparent brittle material processing apparatus according to claim 2, wherein: the laser generator generates laser with wavelength of 0.2-11.4 μm.
4. The transparent brittle material processing apparatus according to claim 3, wherein: the pulse width of the laser generated by the laser generator is in the picosecond level or the femtosecond level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448374.XA CN107953038B (en) | 2017-12-27 | 2017-12-27 | Transparent brittle material processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448374.XA CN107953038B (en) | 2017-12-27 | 2017-12-27 | Transparent brittle material processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107953038A CN107953038A (en) | 2018-04-24 |
| CN107953038B true CN107953038B (en) | 2023-10-20 |
Family
ID=61955697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711448374.XA Active CN107953038B (en) | 2017-12-27 | 2017-12-27 | Transparent brittle material processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107953038B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109604837B (en) * | 2018-12-12 | 2020-06-16 | 中国科学院西安光学精密机械研究所 | Non-taper laser processing method |
| CN109759722B (en) * | 2019-02-27 | 2021-08-31 | 大族激光科技产业集团股份有限公司 | Double-process combined LED chip processing system and method |
| CN111116033A (en) * | 2020-01-09 | 2020-05-08 | 苏州德龙激光股份有限公司 | Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass |
| CN120460941A (en) * | 2024-02-07 | 2025-08-12 | 深圳市大族半导体装备科技有限公司 | Processing method, device, device, equipment and storage medium |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6376786A (en) * | 1986-09-19 | 1988-04-07 | Hitachi Ltd | Laser beam machining device |
| JP2006114786A (en) * | 2004-10-15 | 2006-04-27 | Laser System:Kk | Laser processing method |
| CN102092931A (en) * | 2010-11-26 | 2011-06-15 | 华中科技大学 | Method and device for preparing microchannel in glass material |
| CN102123818A (en) * | 2008-06-28 | 2011-07-13 | 通快机床两合公司 | Method for eccentrically orienting a laser cutting beam in relation to a nozzle axis and for cutting at an angle, corresponding laser machining head and laser machining tool |
| JP2013128974A (en) * | 2011-12-22 | 2013-07-04 | Ihi Inspection & Instrumentation Co Ltd | Method and apparatus for laser processing by addition of ultrasonic wave |
| JP2014054668A (en) * | 2012-09-13 | 2014-03-27 | Leo:Kk | Laser processing method and laser processing apparatus |
| CN104942442A (en) * | 2015-06-11 | 2015-09-30 | 温州大学 | Laser micro-processing device and method thereof |
| CN104959735A (en) * | 2015-07-13 | 2015-10-07 | 金陵科技学院 | Z-axis floating control device for high-power numerical control laser cutting machine and control method |
| CN104968620A (en) * | 2012-11-20 | 2015-10-07 | Uab阿尔特克纳研究与开发所 | High Speed Laser Processing of Transparent Materials |
| JP2015178125A (en) * | 2014-03-19 | 2015-10-08 | 三菱重工業株式会社 | Laser cutting device and method |
| CN105682850A (en) * | 2013-08-29 | 2016-06-15 | 康宁股份有限公司 | Method for forming channels in glass substrates |
| CN105772955A (en) * | 2016-05-25 | 2016-07-20 | 广东工业大学 | Device and method for improving taper of through hole through liquid scattering |
| CN105945429A (en) * | 2016-06-30 | 2016-09-21 | 哈尔滨工业大学（威海） | Ultrasonic auxiliary underwater laser cutting device and method |
| CN106238918A (en) * | 2016-09-27 | 2016-12-21 | 广东工业大学 | The ceramic etching system of a kind of ultrasonic wave added laser and method |
| CN206014669U (en) * | 2016-09-05 | 2017-03-15 | 合肥鑫晟光电科技有限公司 | A kind of cutting equipment |
| CN207873412U (en) * | 2017-12-27 | 2018-09-18 | 常州英诺激光科技有限公司 | Transparent fragile material process equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020006765A1 (en) * | 2000-05-11 | 2002-01-17 | Thomas Michel | System for cutting brittle materials |
| RU2206525C2 (en) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Method of cutting friable non-metallic materials |
| WO2013013685A1 (en) * | 2011-07-27 | 2013-01-31 | Potemkin Alexander | Method for applying a data marking to the surface of a diamond or brilliant and for determining the authenticity thereof |
| US9649722B2 (en) * | 2013-03-15 | 2017-05-16 | Illinois Institute Of Technology | Ultrasound-assisted water-confined laser micromachining |
-
2017
- 2017-12-27 CN CN201711448374.XA patent/CN107953038B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6376786A (en) * | 1986-09-19 | 1988-04-07 | Hitachi Ltd | Laser beam machining device |
| JP2006114786A (en) * | 2004-10-15 | 2006-04-27 | Laser System:Kk | Laser processing method |
| CN102123818A (en) * | 2008-06-28 | 2011-07-13 | 通快机床两合公司 | Method for eccentrically orienting a laser cutting beam in relation to a nozzle axis and for cutting at an angle, corresponding laser machining head and laser machining tool |
| CN102092931A (en) * | 2010-11-26 | 2011-06-15 | 华中科技大学 | Method and device for preparing microchannel in glass material |
| JP2013128974A (en) * | 2011-12-22 | 2013-07-04 | Ihi Inspection & Instrumentation Co Ltd | Method and apparatus for laser processing by addition of ultrasonic wave |
| JP2014054668A (en) * | 2012-09-13 | 2014-03-27 | Leo:Kk | Laser processing method and laser processing apparatus |
| CN104968620A (en) * | 2012-11-20 | 2015-10-07 | Uab阿尔特克纳研究与开发所 | High Speed Laser Processing of Transparent Materials |
| CN105682850A (en) * | 2013-08-29 | 2016-06-15 | 康宁股份有限公司 | Method for forming channels in glass substrates |
| JP2015178125A (en) * | 2014-03-19 | 2015-10-08 | 三菱重工業株式会社 | Laser cutting device and method |
| CN104942442A (en) * | 2015-06-11 | 2015-09-30 | 温州大学 | Laser micro-processing device and method thereof |
| CN104959735A (en) * | 2015-07-13 | 2015-10-07 | 金陵科技学院 | Z-axis floating control device for high-power numerical control laser cutting machine and control method |
| CN105772955A (en) * | 2016-05-25 | 2016-07-20 | 广东工业大学 | Device and method for improving taper of through hole through liquid scattering |
| CN105945429A (en) * | 2016-06-30 | 2016-09-21 | 哈尔滨工业大学（威海） | Ultrasonic auxiliary underwater laser cutting device and method |
| CN206014669U (en) * | 2016-09-05 | 2017-03-15 | 合肥鑫晟光电科技有限公司 | A kind of cutting equipment |
| CN106238918A (en) * | 2016-09-27 | 2016-12-21 | 广东工业大学 | The ceramic etching system of a kind of ultrasonic wave added laser and method |
| CN207873412U (en) * | 2017-12-27 | 2018-09-18 | 常州英诺激光科技有限公司 | Transparent fragile material process equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107953038A (en) | 2018-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107953038B (en) | Transparent brittle material processing equipment | |
| US20180161918A1 (en) | Shaping of brittle materials with controlled surface and bulk properties | |
| US8943855B2 (en) | Methods for laser cutting articles from ion exchanged glass substrates | |
| CN103572341B (en) | The electrochemical copolymerization deposition method for preparing of laser light pipe electrode and device | |
| CN102649199B (en) | Substrate processing device and substrate processing method | |
| US9302346B2 (en) | Precision laser scoring | |
| CN103831527B (en) | A kind of laser quick separating optical crystal method and device | |
| JP2009072829A (en) | Substrate cutting apparatus using ultra-short pulse laser beam and cutting method therefor | |
| CN105081564A (en) | Processing method and device for inner hole of tempered glass | |
| CN103042310B (en) | Method for manufacturing frosted glass | |
| CN102092931B (en) | Method and device for preparing microchannel in glass material | |
| CN115159828B (en) | Laser cutting method and system for frosted glass | |
| WO2014022356A1 (en) | Cutting of brittle materials with tailored edge shape and roughness | |
| EP2628564A1 (en) | Laser cutting device and laser cutting method | |
| CN104972226A (en) | Double-head laser machining device and machining method | |
| CN101508054A (en) | Large-breadth jointless splicing precise laser drilling device | |
| CN207873412U (en) | Transparent fragile material process equipment | |
| JP2009084089A (en) | Method and apparatus for cutting glass | |
| US10596663B2 (en) | High-precision laser machining method for sapphire submicron-order section | |
| CN102229466A (en) | Method and device for nanosecond laser cutting glass | |
| CN111151895A (en) | Process and system for cutting transparent material by utilizing filamentation effect | |
| GB2430640A (en) | Method for microstructuring surfaces of a workpiece and use thereof | |
| CN119794552B (en) | Method and equipment for stripping wafer by laser | |
| CN102319958A (en) | Pulse laser cutting method for fragile materials | |
| Park et al. | Damage-free cutting of chemically strengthened glass by creation of sub-surface cracks using femtosecond laser pulses |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |