CN108037789A - Reinforcing method of anti-radiation band gap reference circuit - Google Patents
Reinforcing method of anti-radiation band gap reference circuit Download PDFInfo
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Abstract
本申请提供的一种抗辐射带隙基准电路的加固方法,所述方法包括:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量;还原所述第一三极管发射极与基极的电压差值;将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压为消除所述基极漏电流变化分量的带隙基准电压。解决了现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大的技术问题,达到了能够方便的运用于各种优化的器件工艺中进一步提升抗辐射的技术效果。
The present application provides a method for strengthening a radiation-resistant bandgap reference circuit, the method comprising: generating a first bandgap reference voltage, the first bandgap reference voltage being a bandgap reference voltage having a base leakage current variation component ; eliminate the base leakage current change component, and introduce the first triode emitter and base voltage difference; restore the first triode emitter and base voltage difference; The voltage difference between the emitter and the base generated by the triode is introduced into the bandgap generation circuit to generate a second bandgap reference voltage, wherein the second bandgap reference voltage is a bandgap that eliminates the variation component of the base leakage current The reference voltage. It solves the technical problem that the bandgap reference circuit realized in the standard process without special reinforcement design is still greatly affected by the total dose of radiation, and can be conveniently applied to various optimized device processes for further improvement Anti-radiation technical effect.
Description
技术领域technical field
本发明涉及电子技术领域,特别涉及一种抗辐射带隙基准电路的加固方法。The invention relates to the field of electronic technology, in particular to a method for strengthening a radiation-resistant bandgap reference circuit.
背景技术Background technique
近年来,在辐射环境中工作的高能物理实验电路,其中抗辐射加固能力对装备的可靠性也起着至关重要的作用。In recent years, high-energy physics experimental circuits that work in radiation environments, in which radiation resistance reinforcement capabilities also play a vital role in the reliability of equipment.
互补型金属氧化物半导体(CMOS)工艺已经进入到了纳米时代,基于标准CMOS纳米工艺并结合一些特殊设计技术实现的ASIC电路表现出了较好的抗总剂量和单粒子锁定特性。Complementary metal-oxide-semiconductor (CMOS) technology has entered the nanometer era. ASIC circuits based on standard CMOS nanotechnology combined with some special design techniques have shown good anti-total dose and single-event lock-in characteristics.
但本申请发明人在实现本申请实施例中发明技术方案的过程中,发现上述技术至少存在如下技术问题:However, in the process of realizing the technical solution of the invention in the embodiment of the present application, the inventor of the present application found that the above-mentioned technology has at least the following technical problems:
现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大。In the prior art, the bandgap reference circuit implemented on a standard process without special reinforcement design is still greatly affected by the total dose of radiation.
发明内容Contents of the invention
本申请实施例通过提供一种抗辐射带隙基准电路的加固方法,解决了现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大的技术问题,达到了通过削弱基极电流的影响,降低总剂量辐射影响,从而对带隙基准电路加固的技术效果。The embodiment of the present application provides a method for strengthening the radiation-resistant bandgap reference circuit, which solves the problem that the bandgap reference circuit implemented in the standard process without special reinforcement design is still greatly affected by the total dose of radiation in the prior art The problem is to achieve the technical effect of strengthening the bandgap reference circuit by weakening the influence of the base current and reducing the influence of the total dose of radiation.
鉴于上述问题,提出了本申请实施例以便提供一种抗辐射带隙基准电路的加固方法。In view of the above problems, the embodiments of the present application are proposed to provide a method for strengthening a radiation-resistant bandgap reference circuit.
本申请实施例提供了一种抗辐射带隙基准电路的加固方法,应用于互补金属氧化物半导体工艺,所述方法包括:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量;还原所述第一三极管发射极与基极的电压差值;将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压为消除所述基极漏电流变化分量的带隙基准电压。An embodiment of the present application provides a method for strengthening a radiation-resistant bandgap reference circuit, which is applied to a complementary metal oxide semiconductor process. The method includes: generating a first bandgap reference voltage, the first bandgap reference voltage having The bandgap reference voltage of the base leakage current change component; eliminate the base leakage current change component, and introduce the first triode emitter and base voltage difference; restore the first triode emitter and base Pole voltage difference; introduce the voltage difference between the emitter and the base produced by the first triode into the bandgap generation circuit to generate the second bandgap reference voltage, wherein the second bandgap reference voltage is to eliminate Bandgap reference voltage for the base leakage current variation component.
优选的,所述消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量,具体包括:获得第一电路,所述第一电路为产生所述第一带隙基准电压的原始电路;获得第二电路,所述第二电路为产生第一三极管发射极与基极电压差分量的电路,其中,所述第二电路位于所述第一电路中;消除第三电路,所述第三电路为产生基极漏电流变化分量的电路,其中,所述第三电路位于所述第二电路中;获得第四电路,所述第四电路为消除所述基极漏电流变化分量后,所述第一三极管发射极与基极电压差分量的电路;将所述第四电路重新引入所述第一电路。Preferably, the eliminating the variation component of the base leakage current and introducing the voltage difference between the emitter and the base of the first triode specifically includes: obtaining a first circuit for generating the first The original circuit of the bandgap reference voltage; obtain a second circuit, the second circuit is a circuit that generates a first triode emitter and base voltage differential component, wherein the second circuit is located in the first circuit ; Eliminate the third circuit, the third circuit is a circuit that generates the base leakage current variation component, wherein the third circuit is located in the second circuit; obtain a fourth circuit, the fourth circuit is eliminated After the base leakage current change component is removed, the first triode emitter and base voltage difference component circuit; the fourth circuit is reintroduced into the first circuit.
优选的,所述方法还包括:通过设置第一增益放大器,获得所述第一电路;通过设置第二增益放大器,获得所述第二电路。Preferably, the method further includes: obtaining the first circuit by setting a first gain amplifier; obtaining the second circuit by setting a second gain amplifier.
优选的,所述方法还包括:通过设置同相放大器,将所述第四电路重新引入所述第一电路。Preferably, the method further includes: reintroducing the fourth circuit into the first circuit by setting a non-inverting amplifier.
优选的,所述第一增益放大器和所述第二增益放大器的带宽分别大于等于所述第一电路的带宽指标。Preferably, the bandwidths of the first gain amplifier and the second gain amplifier are respectively greater than or equal to the bandwidth index of the first circuit.
优选的,所述同相放大器带宽大于等于所述第一电路的带宽指标。Preferably, the bandwidth of the non-inverting amplifier is greater than or equal to the bandwidth index of the first circuit.
本申请实施例中提供的一个或多个技术方案,至少具有如下技术效果或优点:One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:
本申请实施例提供的一种抗辐射带隙基准电路的加固方法,应用于互补金属氧化物半导体工艺,所述方法包括:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量;还原所述第一三极管发射极与基极的电压差值;将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压为消除所述基极漏电流变化分量的带隙基准电压。解决了现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大的技术问题,达到了通过削弱基极电流的影响提高了带隙基准电压的抗辐射性能,能够方便的运用于各种优化的器件工艺中进一步提升抗辐射的技术效果。A method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application is applied to a complementary metal oxide semiconductor process, and the method includes: generating a first bandgap reference voltage, the first bandgap reference voltage having The bandgap reference voltage of the base leakage current change component; eliminate the base leakage current change component, and introduce the first triode emitter and base voltage difference; restore the first triode emitter and base Pole voltage difference; introduce the voltage difference between the emitter and the base produced by the first triode into the bandgap generation circuit to generate the second bandgap reference voltage, wherein the second bandgap reference voltage is to eliminate Bandgap reference voltage for the base leakage current variation component. It solves the technical problem that the bandgap reference circuit realized in the standard process without special reinforcement design is still greatly affected by the total dose of radiation, and achieves the improvement of the bandgap reference voltage by weakening the influence of the base current The anti-radiation performance can be easily applied to various optimized device processes to further enhance the technical effect of anti-radiation.
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举本发明的具体实施方式。The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the specific embodiments of the present invention are enumerated below.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the embodiments or the description of the prior art. Obviously, the accompanying drawings in the following description are of the present application For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without paying creative efforts.
图1为本申请实施例提供的一种抗辐射带隙基准电路的加固方法的流程示意图;FIG. 1 is a schematic flowchart of a method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application;
图2为本申请实施例提供的消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量的流程示意图;2 is a schematic flow diagram of eliminating the base leakage current variation component and introducing the first triode emitter-base voltage difference component provided by the embodiment of the present application;
图3为本申请实施例提供的第一电路的连接示意图;FIG. 3 is a schematic diagram of the connection of the first circuit provided by the embodiment of the present application;
图4为本申请实施例提供的第五电路的连接示意图;FIG. 4 is a schematic diagram of the connection of the fifth circuit provided by the embodiment of the present application;
图5为本申请实施例提供的第一带隙基准电压和第二带隙基准电压的波形示意图。FIG. 5 is a schematic diagram of waveforms of the first bandgap reference voltage and the second bandgap reference voltage provided by the embodiment of the present application.
附图说明:第一三极管1,第二电路2,第三电路3,第四电路4,第一增益放大器5,第二增益放大器6,同相放大器7。Description of drawings: a first triode 1, a second circuit 2, a third circuit 3, a fourth circuit 4, a first gain amplifier 5, a second gain amplifier 6, and a non-inverting amplifier 7.
具体实施方式Detailed ways
本申请实施例提供的一种抗辐射带隙基准电路的加固方法,本申请实施例提供的一种抗辐射带隙基准电路的加固方法,应用于互补金属氧化物半导体工艺,所述方法包括:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量;还原所述第一三极管发射极与基极的电压差值;将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压为消除所述基极漏电流变化分量的带隙基准电压。解决了现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大的技术问题,达到了通过削弱基极电流的影响提高了带隙基准电压的抗辐射性能,能够方便的运用于各种优化的器件工艺中进一步提升抗辐射的技术效果。A method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application. The method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application is applied to a complementary metal oxide semiconductor process. The method includes: Generate a first bandgap reference voltage, the first bandgap reference voltage is a bandgap reference voltage with a base leakage current variation component; eliminate the base leakage current variation component, and introduce the first triode emitter and Base voltage difference component; restore the voltage difference between the emitter and base of the first triode; introduce the voltage difference between the emitter and base generated by the first triode into the bandgap generation circuit to generate the first triode Two bandgap reference voltages, wherein the second bandgap reference voltage is a bandgap reference voltage that eliminates the variation component of the base leakage current. It solves the technical problem that the bandgap reference circuit realized in the standard process without special reinforcement design is still greatly affected by the total dose of radiation, and achieves the improvement of the bandgap reference voltage by weakening the influence of the base current The anti-radiation performance can be easily applied to various optimized device processes to further enhance the technical effect of anti-radiation.
下面将参照附图更详细地描述本公开的示例性实施例。虽然附图中显示了本公开的示例性实施例,然而应当理解,可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反,提供这些实施例是为了能够更透彻地理解本公开,并且能够将本公开的范围完整的传达给本领域的技术人员。Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
实施例一Embodiment one
图1为本申请实施例提供的一种抗辐射带隙基准电路的加固方法的流程示意图。如图1所示,应用于互补金属氧化物半导体工艺,所述方法包括:FIG. 1 is a schematic flowchart of a method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application. As shown in Figure 1, applied to a complementary metal oxide semiconductor process, the method includes:
步骤110:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;Step 110: Generate a first bandgap reference voltage, the first bandgap reference voltage is a bandgap reference voltage having a base leakage current variation component;
具体而言,互补金属氧化物半导体(CMOS)是电压控制的一种放大器件,是组成CMOS数字集成电路的基本单元,在基于标准CMOS工艺的带隙基准的电路中,由于没有进行特殊加固的电路设计,总剂量辐射会影响常规带隙基准电路中使用的三极管导通特性,导致带隙基准电路受总剂量辐射影响仍然很大。针对之前收到总剂量辐射诱发的PN结导致整体PNP三级管基极漏电流增加,电流增益下降,带隙基准输出电压改变的情况,所以本申请实施例通过削弱基极电流的影响来实现了带隙基准的电路加固。所述第一带隙基准电压即为原始的带隙基准电压,所述原始的带隙基准电压为具有基极漏电流变化分量的带隙基准电压。Specifically, complementary metal-oxide-semiconductor (CMOS) is a voltage-controlled amplifying device, which is the basic unit of CMOS digital integrated circuits. For circuit design, the total dose radiation will affect the conduction characteristics of the triode used in the conventional bandgap reference circuit, so the bandgap reference circuit is still greatly affected by the total dose radiation. In view of the fact that the PN junction induced by the total dose of radiation before causes an increase in the base leakage current of the overall PNP triode, a decrease in the current gain, and a change in the output voltage of the bandgap reference, so the embodiment of the present application achieves this by weakening the influence of the base current Circuit hardening for bandgap references. The first bandgap reference voltage is an original bandgap reference voltage, and the original bandgap reference voltage is a bandgap reference voltage having a base leakage current variation component.
对所述带隙基准电路进一步进行解释说明,电流模式的带隙基准电路主要是通过把电路产生的与绝对温度成正比(PTAT)的电流IR和与绝对温度成反比(CTAT)的电流IR2按照一定的比例进行叠加,产生一个不随温度和电源电压变化的恒定电流ID,后通过把这个基准电流加载到参考电阻上得到一个不随温度和电源电压变化的基准电压。如图3所示,假设M1,M2和M3的尺寸相同R1=R2,得到IDM1=IDM2=IDM3,由于运放负反馈的作用,VX=VY,双极管发射结面积Q2是Q1的n倍,因此得第一带隙基准电压:The bandgap reference circuit is further explained. The bandgap reference circuit of the current mode is mainly through the current I R which is proportional to the absolute temperature (PTAT) and the current I R which is inversely proportional to the absolute temperature (CTAT). R2 is superimposed according to a certain ratio to generate a constant current ID that does not change with temperature and power supply voltage, and then loads this reference current to the reference resistor to obtain a reference voltage that does not change with temperature and power supply voltage. As shown in Figure 3, assuming that M 1 , M 2 and M 3 have the same size R 1 =R 2 , get I DM1 =I DM2 =I DM3 , due to the negative feedback of the operational amplifier, V X =V Y , bipolar The tube emitter junction area Q 2 is n times of Q 1 , so the first bandgap reference voltage is obtained:
其中,RREF1即RREF,仅为对照后面图4中的RREF2用;Among them, R REF1 is R REF , which is only used for comparing R REF2 in Figure 4 below;
VX与VY为对应电路图中X,Y点处的电压;V X and V Y are the voltages at points X and Y in the corresponding circuit diagram;
VREF1为经典带隙基准输出电压;V REF1 is the classic bandgap reference output voltage;
VEBQ1为Q1三极管发射极与基极电压差;V EBQ1 is the voltage difference between the emitter and the base of Q 1 triode;
VEBQ2为Q2三极管发射极与基极电压差;V EBQ2 is the voltage difference between the emitter and the base of Q 2 triode;
N为Q2与Q1三极管的发射极面积比;N is the emitter area ratio of Q2 and Q1 transistor;
VT为电学中常用的热电压;V T is the thermal voltage commonly used in electricity;
IDM3为M3的漏极电流。I DM3 is the drain current of M3 .
步骤120:消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量,如图2所示:Step 120: Eliminate the change component of the base leakage current, and introduce the voltage difference between the emitter and the base of the first triode, as shown in FIG. 2:
具体而言,考虑总剂量辐射引起的三极管基极漏电,辐射引起三极管发射极-基极漏电流ΔIB增加,但由于两条支路上三极管的数量不同,两条支路上发射极电流增加的数值也不同。假设经过辐射后三极管发射极电流IC保持不变,则两条支路三极管的发射极-基极电压VEB=VT×ln(IC/ISS)同样应该保持不变,但实际上由于发射极电流IR=(VEBQ1-VEBQ2)/R的变化会影响VEBQ2,M2所在支路上三极管数量是M1所在支路的n倍,所以辐射后M2所在支路上的漏电流会明显增加,导致IR上升,VEBQ2降低,但VEBQ1相对保持不变,因此ICQ2会降低直到新的平衡点建立。因此有:Specifically, considering the base leakage of the triode caused by the total dose radiation, the emitter-base leakage current ΔIB of the triode increases due to radiation, but because the number of triodes on the two branches is different, the value of the increase of the emitter current on the two branches is also the same. different. Assuming that the triode emitter current IC remains unchanged after radiation, the emitter-base voltage V EB =V T ×ln(IC/ISS) of the two branch transistors should also remain unchanged, but in fact due to the fact that the emitter The change of current I R =(V EBQ1 -V EBQ2 )/R will affect V EBQ2 , the number of triodes on the branch where M 2 is located is n times that of the branch where M 1 is located, so the leakage current on the branch where M 2 is located will be obvious after radiation increases, causing I R to rise and V EBQ2 to decrease, but V EBQ1 remains relatively unchanged, so I CQ2 will decrease until a new equilibrium point is established. So there are:
VREF0为辐射前带隙基准的输出电压(理想值):V REF0 is the output voltage of the bandgap reference before radiation (ideal value):
令:make:
△IB,Q2-△IC,Q2=n·△IB △I B,Q2 -△I C,Q2 =n·△I B
n·ΔIB仅代表n倍IB带来的影响不代表实际值。n· ΔIB only represents the impact brought by n times I B and does not represent the actual value.
IR为R上流过的电流;I R is the current flowing through R;
IR2为R2上流过的电流;I R2 is the current flowing on R2 ;
此处的VREF1为经典带隙基准的输出电压,即所述第一电路的输出电压;V REF1 here is the output voltage of the classical bandgap reference, that is, the output voltage of the first circuit;
IB,Q2为Q2三极管基极电流;I B, Q2 is the base current of Q 2 triode;
IC,Q2为Q2三极管集电极电流;I C, Q2 is Q 2 transistor collector current;
ΔIB,Q2为Q2三极管辐射后基极电流增加量;ΔI B,Q2 is the increase of the base current after Q 2 triode radiation;
ΔIC,Q2为Q2三极管辐射后集电极电流增加量。ΔI C,Q2 is the amount of collector current increase after Q2 triode radiation.
上述公式可以看出,辐射后的带隙基准电压与辐射前的带隙基准电压之间的关系,由于所述第一三极管基极漏电流的增加,导致辐射后的带隙基准电压比辐射前的带隙基准电压高。It can be seen from the above formula that the relationship between the bandgap reference voltage after radiation and the bandgap reference voltage before radiation, due to the increase of the base leakage current of the first transistor, the ratio of the bandgap reference voltage after radiation to The bandgap reference voltage before radiation is high.
步骤121:获得第一电路,所述第一电路为产生所述第一带隙基准电压的原始电路,通过设置第一增益放大器5,获得所述第一电路;Step 121: Obtain a first circuit, the first circuit is an original circuit for generating the first bandgap reference voltage, and obtain the first circuit by setting a first gain amplifier 5;
具体而言,通过在所述第一电路VREF1处设置所述第一增益放大器5,使所述第一电路隔离出来,从而获得所述第一电路,所述第一电路即为传统的电流模式的带隙基准电路,没有进行电路加固,受到总剂量辐射的影响还很大。Specifically, by setting the first gain amplifier 5 at the first circuit V REF1 to isolate the first circuit, the first circuit is obtained, and the first circuit is a traditional current The bandgap reference circuit of the mode, without circuit reinforcement, is still greatly affected by the total dose of radiation.
步骤122:获得第二电路2,所述第二电路2为产生所述第一三极管1发射极与基极电压差分量的电路,其中,所述第二电路2位于所述第一电路中,通过设置第二增益放大器6,获得所述第二电路2,所述第一增益放大器5和所述第二增益放大器6的带宽分别大于等于所述第一电路的带宽指标。Step 122: Obtain the second circuit 2, the second circuit 2 is a circuit that generates the voltage difference between the emitter and the base of the first triode 1, wherein the second circuit 2 is located in the first circuit Among them, the second circuit 2 is obtained by setting the second gain amplifier 6, and the bandwidths of the first gain amplifier 5 and the second gain amplifier 6 are respectively greater than or equal to the bandwidth index of the first circuit.
具体而言,所述第二电路2为产生所述第一三极管1发射极与基极电压差分量的电路,其中,所述第二电路2中具有产生基极漏电流的电路,所述第二电路2属于所述第一电路的一部分,将所述第二电路2从所述第一电路中分离出来是通过在所述第二电路2的VEB,Q2处设置所述第二增益放大器来实现的,并且,所述第一增益放大器5和所述第二增益放大器6的带宽分别大于等于所述第一电路的带宽指标。Specifically, the second circuit 2 is a circuit that generates the voltage difference between the emitter and the base of the first triode 1, wherein the second circuit 2 has a circuit that generates a base leakage current, so The second circuit 2 is a part of the first circuit, and the second circuit 2 is separated from the first circuit by setting the second circuit at V EB, Q2 of the second circuit 2 gain amplifier, and the bandwidths of the first gain amplifier 5 and the second gain amplifier 6 are respectively greater than or equal to the bandwidth index of the first circuit.
步骤123:消除第三电路3,所述第三电路3为产生基极漏电流变化分量的电路,其中,所述第三电路3位于所述第二电路中;Step 123: Eliminate the third circuit 3, the third circuit 3 is a circuit that generates a base leakage current variation component, wherein the third circuit 3 is located in the second circuit;
具体而言,所述第三电路3即为产生基极漏电流变化分量的电路部分,所述第三电路3属于所述第二电路2中的一部分,需要将所述第二电路2中的产生基极漏电流变化分量的电路部分消除,从而消除所述基极漏电流对带隙基准电压的影响。Specifically, the third circuit 3 is the circuit part that generates the base leakage current variation component, the third circuit 3 belongs to a part of the second circuit 2, and the second circuit 2 needs to be The portion of the circuit that produces the varying component of the base leakage current is eliminated, thereby eliminating the influence of the base leakage current on the bandgap reference voltage.
具体量化关系如下:The specific quantitative relationship is as follows:
设:VEB20为辐照前三极管的发射极—基极电压差;Let: V EB20 be the emitter-base voltage difference of the triode before irradiation;
VREF0为辐照前带隙基准的输出电压(理想值);V REF0 is the output voltage (ideal value) of the bandgap reference before irradiation;
Vx1为图4中处VX1电位。V x1 is the potential of V x1 in FIG. 4 .
令:make:
由于:because:
V1=VEB2≈VEB20-n·△IB×RV 1 =V EB2 ≈V EB20 -n·△I B ×R
V2=VREF1=VREF0+RREF1×n·△IB V 2 =V REF1 =V REF0 +R REF1 ×n·△I B
∴ ∴
∴ ∴
步骤124:获得第四电路4,所述第四电路4为消除所述基极漏电流变化分量后,所述第一三极管5发射极与基极电压差分量的电路;Step 124: Obtain a fourth circuit 4, which is a circuit for the voltage difference between the emitter and the base of the first triode 5 after eliminating the variation component of the base leakage current;
步骤125:将所述第四电路重新引入所述第一电路,形成第五电路,通过设置同相放大器7,将所述第四电路4重新引入所述第一电路,所述同相放大器带宽大于等于所述第一电路的带宽指标。Step 125: Reintroduce the fourth circuit into the first circuit to form a fifth circuit, reintroduce the fourth circuit 4 into the first circuit by setting a non-inverting amplifier 7, and the bandwidth of the non-inverting amplifier is greater than or equal to A bandwidth index of the first circuit.
具体而言,所述第四电路4即为消除所述基极漏电流变化分量后,所述第一三极管5发射极与基极电压差分量的电路,然后将所述第四电路4重新引入所述第一电路,即可形成抗总剂量效应的带隙基准电路的整体电路,也就是所述第五电路,通过在所述第四电路与所述第一电路之间即VX1、Vx2之间设置同相放大器7,实现将所述第四电路引入所述第一电路中,从而得到所述第五电路。Specifically, the fourth circuit 4 is a circuit for eliminating the change component of the base leakage current, and the voltage difference between the emitter and the base of the first triode 5, and then the fourth circuit 4 Reintroducing the first circuit, that is, the overall circuit of the bandgap reference circuit that is resistant to the total dose effect, that is, the fifth circuit, passes between the fourth circuit and the first circuit, that is, V X1 A non-inverting amplifier 7 is set between , V x2 , so as to introduce the fourth circuit into the first circuit, thereby obtaining the fifth circuit.
步骤130:还原所述第一三极管发射极与基极的电压差值;Step 130: restore the voltage difference between the emitter and the base of the first triode;
步骤140:将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压VREF2为消除所述基极漏电流变化分量的带隙基准电压。Step 140: introduce the voltage difference between the emitter and the base generated by the first triode into a bandgap generating circuit to generate a second bandgap reference voltage, wherein the second bandgap reference voltage V REF2 is Bandgap reference voltage for the base leakage current variation component.
具体而言,图3为重新导入新产生的消除n·ΔIB的VEB产生无n·ΔIB的第五电路,如图3所示,所述第五电路中的三极管采取与所述第一三极管完全相同的接法与配置,同时需保证各个三极管完全对称。Specifically, Fig. 3 re-introduces the newly generated V EB that eliminates n·ΔI B to generate the fifth circuit without n·ΔI B , as shown in Fig. 3 , the triode in the fifth circuit adopts the same The connection and configuration of the triodes are exactly the same, and it is necessary to ensure that each triode is completely symmetrical.
具体量化关系如下:The specific quantitative relationship is as follows:
由于because
再把步骤123中的输出Vx2带入Bring the output V x2 in step 123 into
VREF20与VREF10一样都为理想的带隙基准电压V REF20 is an ideal bandgap reference voltage like V REF10
只是对应的RREF2、R7、R6的取值与RREF1、R、R2不一样Only the corresponding values of RREF2, R 7 and R 6 are different from R REF1 , R and R 2
在所述第五电路中,通过配置RREF2、R7、R6的取值与RREF1、R、R2的取值就可以方便的配置这种抗辐射总剂量的带隙基准电压,达到了通过削弱基极电流的影响提高了带隙基准电压的抗辐射性能,能够方便的运用于各种优化的器件工艺中进一步提升抗辐射的技术效果。In the fifth circuit, by configuring the values of R REF2 , R 7 , and R 6 and the values of R REF1 , R, and R 2 , the bandgap reference voltage for the total dose of radiation resistance can be conveniently configured to achieve In order to improve the anti-radiation performance of the bandgap reference voltage by weakening the influence of the base current, it can be conveniently applied to various optimized device processes to further enhance the technical effect of anti-radiation.
实施例2Example 2
本申请提供了一种抗辐射带隙基准电路的加固方法的优选实施例,如图4所示,图4为加固后的抗辐射带隙基准电路,也就是所述第五电路。The present application provides a preferred embodiment of a method for strengthening a radiation-resistant bandgap reference circuit, as shown in FIG. 4 , which is the strengthened radiation-resistant bandgap reference circuit, that is, the fifth circuit.
其中,第一电路产生第一带隙基准电压Vref和三极管Q2的发射极-基极电压VEBQ2,Vref和VEBQ2分别连接到第一增益放大器5和第二增益放大器6的正输入端;第一增益放大器5和第二增益放大器6的输出V1和V2分别反馈至其负输入端,并通过电阻RA和RB与同相放大器7的正输入端相连,同相放大器7输出Vx2并通过电阻R反馈至其负输入端;将Vx2引入第一电路中,得到第二带隙基准电压Vref2。Wherein, the first circuit generates the first bandgap reference voltage V ref and the emitter-base voltage V EBQ2 of the transistor Q 2 , V ref and V EBQ2 are respectively connected to the positive input of the first gain amplifier 5 and the second gain amplifier 6 end; the output V1 and V2 of the first gain amplifier 5 and the second gain amplifier 6 are fed back to their negative input terminals respectively, and are connected with the positive input terminal of the non-inverting amplifier 7 through resistors RA and R B , and the non-inverting amplifier 7 outputs V x2 And fed back to its negative input terminal through the resistor R; V x2 is introduced into the first circuit to obtain the second bandgap reference voltage V ref2 .
本实施例中,第一增益放大器5和第二增益放大器6在直流下的放大倍数为1e6,RA阻值为10k,RB阻值为87k,R阻值为10k。此基准电路在不受辐射情况下,即三极管Q2的发射极与基极间无电流源相连时,第二带隙基准电压Vref2与第一带隙基准电压Vref均为理想的带隙基准电压。当电路受到总剂量辐射,三极管发射极-基极电流会增加,即三极管Q2的发射极与基极间有电流源存在时,此时Vref会比辐射前的基准电压高,而Vref2不受辐射影响。In this embodiment, the amplification factor of the first gain amplifier 5 and the second gain amplifier 6 under direct current is 1e6, the resistance value of RA is 10k, the resistance value of RB is 87k, and the resistance value of R is 10k. When this reference circuit is free from radiation, that is, when there is no current source connected between the emitter and the base of the transistor Q2 , the second bandgap reference voltage V ref2 and the first bandgap reference voltage V ref are both ideal bandgap The reference voltage. When the circuit is subjected to total dose radiation, the emitter-base current of the triode will increase, that is, when there is a current source between the emitter and the base of the triode Q2 , V ref will be higher than the reference voltage before radiation, and V ref2 Not affected by radiation.
通过仿真,我们得到了图5所示波形。其中,图5(b)为第一电路的仿真,其中,虚线为辐射前电压的变化趋势,实线为辐射后电压的变化趋势,可以看出,在使用第一电路时,由于受到总剂量辐射的影响,辐射前和辐射后的带隙基准电压相差很大;图5(a)为通过本实施例加固后电路的仿真,在图5(a)中,在使用所述第五电路时,辐射前和辐射后的第二带隙基准电压Vref2波形重合,说明使用本申请加固后的所述第五电路能够消除辐射对带隙基准电压的影响。由图5可以看出,本实施例所述的第五电路可以很好的消除基极漏电流对带隙基准电压的影响,从而实现抗辐射的效果。Through simulation, we got the waveform shown in Figure 5. Among them, Fig. 5(b) is the simulation of the first circuit, wherein, the dotted line is the change trend of the voltage before radiation, and the solid line is the change trend of the voltage after radiation. It can be seen that when using the first circuit, due to the total dose The impact of radiation, the bandgap reference voltage before radiation and after radiation is very different; Fig. 5 (a) is the emulation of the circuit reinforced by this embodiment, in Fig. 5 (a), when using the fifth circuit , the waveforms of the second bandgap reference voltage V ref2 before and after radiation coincide, indicating that the fifth circuit reinforced by the present application can eliminate the influence of radiation on the bandgap reference voltage. It can be seen from FIG. 5 that the fifth circuit described in this embodiment can well eliminate the influence of the base leakage current on the bandgap reference voltage, thereby achieving the effect of anti-radiation.
本申请实施例中提供的一个或多个技术方案,至少具有如下技术效果或优点:One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:
本申请实施例提供的一种抗辐射带隙基准电路的加固方法,应用于互补金属氧化物半导体工艺,所述方法包括:生成第一带隙基准电压,所述第一带隙基准电压为具有基极漏电流变化分量的带隙基准电压;消除所述基极漏电流变化分量,并引入第一三极管发射极与基极电压差分量;还原所述第一三极管发射极与基极的电压差值;将所述第一三极管产生的发射极与基极的电压差分量引入带隙产生电路产生第二带隙基准电压,其中,所述第二带隙基准电压为消除所述基极漏电流变化分量的带隙基准电压。解决了现有技术中在标准工艺上实现的未进行特殊加固设计的带隙基准电路受总剂量辐射影响仍然很大的技术问题,达到了通过削弱基极电流的影响提高了带隙基准电压的抗辐射性能,能够方便的运用于各种优化的器件工艺中进一步提升抗辐射的技术效果。A method for strengthening a radiation-resistant bandgap reference circuit provided in an embodiment of the present application is applied to a complementary metal oxide semiconductor process, and the method includes: generating a first bandgap reference voltage, the first bandgap reference voltage having The bandgap reference voltage of the base leakage current change component; eliminate the base leakage current change component, and introduce the first triode emitter and base voltage difference; restore the first triode emitter and base Pole voltage difference; introduce the voltage difference between the emitter and the base produced by the first triode into the bandgap generation circuit to generate the second bandgap reference voltage, wherein the second bandgap reference voltage is to eliminate Bandgap reference voltage for the base leakage current variation component. It solves the technical problem that the bandgap reference circuit realized in the standard process without special reinforcement design is still greatly affected by the total dose of radiation, and achieves the improvement of the bandgap reference voltage by weakening the influence of the base current The anti-radiation performance can be easily applied to various optimized device processes to further enhance the technical effect of anti-radiation.
尽管已描述了本发明的优选实施例,但本领域内的技术人员一旦得知了基本创造性概念,则可对这些实施例作出另外的变更和修改。所以,所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。While preferred embodiments of the invention have been described, additional changes and modifications to these embodiments can be made by those skilled in the art once the basic inventive concept is appreciated. Therefore, it is intended that the appended claims be construed to cover the preferred embodiment as well as all changes and modifications which fall within the scope of the invention.
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.
最后所应说明的是,以上具体实施方式仅用以说明本发明的技术方案而非限制,尽管参照实例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的精神和范围,其均应涵盖在本发明的权利要求范围当中。Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention without limitation, although the present invention has been described in detail with reference to examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be carried out Modifications or equivalent replacements without departing from the spirit and scope of the technical solution of the present invention shall be covered by the claims of the present invention.
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| CN110471485A (en) * | 2019-08-30 | 2019-11-19 | 电子科技大学 | A kind of total dose effect reinforcing circuit based on segmented current compensation |
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| CN108037789B (en) | 2020-07-07 |
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