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CN108170958B - Method and device for determining current carrying capacity of PCB and computer equipment - Google Patents

Method and device for determining current carrying capacity of PCB and computer equipment Download PDF

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CN108170958B
CN108170958B CN201711461886.XA CN201711461886A CN108170958B CN 108170958 B CN108170958 B CN 108170958B CN 201711461886 A CN201711461886 A CN 201711461886A CN 108170958 B CN108170958 B CN 108170958B
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pcb
carrying capacity
current
copper conductor
thickness
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CN108170958A (en
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陈蓓
靳婷
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South China University of Technology SCUT
Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
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South China University of Technology SCUT
Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
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Publication of CN108170958A publication Critical patent/CN108170958A/en
Priority to PCT/CN2018/093636 priority patent/WO2019128173A1/en
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    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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Abstract

本申请涉及一种PCB的载流能力的确定方法、装置、计算机可读存储介质及计算机设备，所述方法包括：获取目标PCB的载流影响参数，所述载流影响参数包括所述目标PCB的允许温升、铜导体厚度和铜导体线宽；获取第一预定映射关系，所述第一预定映射关系以PCB的允许温升、铜导体厚度和铜导体线宽为自变量，以所述PCB的载流能力为因变量；基于所述第一预定映射关系、所述目标PCB的允许温升、铜导体厚度和铜导体线宽，确定所述目标PCB的载流能力。本申请提供的方案能够有效地提高所确定的PCB的载流能力的准确度。

Figure 201711461886

The present application relates to a method, device, computer-readable storage medium, and computer equipment for determining the current-carrying capacity of a PCB. The method includes: acquiring a current-carrying influence parameter of a target PCB, where the current-carrying influence parameter includes the target PCB. The allowable temperature rise, copper conductor thickness and copper conductor line width of the The current carrying capacity of the PCB is a dependent variable; the current carrying capacity of the target PCB is determined based on the first predetermined mapping relationship, the allowable temperature rise of the target PCB, the copper conductor thickness and the copper conductor line width. The solution provided by the present application can effectively improve the accuracy of the determined current-carrying capacity of the PCB.

Figure 201711461886

Description

Method and device for determining current carrying capacity of PCB and computer equipment
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a method and an apparatus for determining a current carrying value of a PCB conductor, a computer-readable storage medium, and a computer device.
Background
A Printed Circuit Board (PCB) is an important component of electronic equipment, and is used to support components and to electrically connect the components. With the continuous development of electronic technology, electronic devices gradually trend to be light, thin, miniaturized and high-performance, and accordingly, the number of components integrated on a PCB is increasing, the arrangement is more and more compact, and the overall power consumption is larger and more. In this case, in the design process of the PCB, the current carrying capacity of the PCB needs to be determined to prevent the designed PCB from being unable to carry corresponding current, and thus the problems of temperature rise, difficulty in heat dissipation and the like occur, and further the PCB is burnt.
The traditional method is mainly used for determining the current carrying capacity I of the PCB based on the IPC-2221 standard. Utensil for cleaning buttockIn particular, the IPC-2221 standard relates to the following formula, I ═ KT0.44A0.725Wherein K is a correction coefficient (0.024 is taken when the copper-clad wire is arranged at the inner layer, and 0.048 is taken when the copper-clad wire is arranged at the outer layer), A is the copper-clad sectional area, and T is the allowable temperature rise of the PCB. However, the accuracy of the current carrying capability of the PCB obtained based on the conventional method is not high.
Disclosure of Invention
Based on this, it is necessary to provide a method and an apparatus for determining the current-carrying capacity of the PCB, a computer-readable storage medium, and a computer device, for solving the technical problem that the accuracy of the current-carrying capacity calculated in the conventional method is not high.
A method for determining the current carrying capacity of a PCB comprises the following steps:
acquiring current-carrying influence parameters of a target PCB, wherein the current-carrying influence parameters comprise allowable temperature rise of the target PCB, copper conductor thickness and copper conductor line width;
acquiring a first preset mapping relation, wherein the first preset mapping relation takes the allowable temperature rise of a PCB, the thickness of a copper conductor and the line width of the copper conductor as independent variables, and the current carrying capacity of the PCB as a dependent variable;
and determining the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor.
In one embodiment, the current-carrying affecting parameter further includes a board thickness of the target PCB;
after the step of determining the current carrying capacity of the target PCB based on the allowable temperature rise of the target PCB, the thickness of the copper conductor, the line width of the copper conductor and the first predetermined mapping relationship, the method further includes:
acquiring a second preset mapping relation, wherein the second preset mapping relation takes the current-carrying capacity of the PCB and the plate thickness of the PCB as independent variables and takes the optimized current-carrying capacity of the PCB as a dependent variable;
and determining the optimized current-carrying capacity of the target PCB based on the second preset mapping relation, the current-carrying capacity and the board thickness of the target PCB.
In one embodiment, the second predetermined mapping relationship is:
Iaim＝b1*(t-b2)*Ibasis
wherein, IaimFor optimizing the current-carrying capacity of the PCB, IbasisFor the current carrying capacity of the PCB, t is the board thickness of the PCB, b1 is a first predetermined constant, and b2 is a second predetermined constant.
In one embodiment, b1 has a value of 0.08 and b2 has a value of 0.36.
In one embodiment, the first predetermined mapping relationship is:
Ibasis＝a1*△Ta2*ha3*wa4
wherein, IbasisFor the current carrying capacity of the PCB, △ T is the allowable temperature rise of the PCB, h is the copper conductor thickness of the PCB, w is the copper conductor line width of the PCB, a1 is a third predetermined constant, a2 is the first predetermined index, a3 is the second predetermined index, and a4 is the third predetermined index.
In one embodiment, a1 has a value of 2.05, a2 has a value of 0.52, a3 has a value of 0.41, and a4 has a value of 0.56.
An apparatus for determining a current carrying capability of a PCB, comprising:
the current-carrying influence parameter acquisition module is used for acquiring current-carrying influence parameters of a target PCB, wherein the current-carrying influence parameters comprise allowable temperature rise of the target PCB, copper conductor thickness and copper conductor line width;
the first mapping relation obtaining module is used for obtaining a first preset mapping relation, wherein the first preset mapping relation takes the allowable temperature rise of a PCB, the thickness of a copper conductor and the line width of the copper conductor as independent variables, and takes the current carrying capacity of the PCB as a dependent variable;
and the current carrying capacity determining module is used for determining the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor.
In one embodiment, the current-carrying affecting parameter further includes a board thickness of the target PCB;
the determining device further comprises:
the second mapping relation obtaining module is used for obtaining a second preset mapping relation, the second preset mapping relation takes the current-carrying capacity of the PCB and the plate thickness of the PCB as independent variables, and takes the optimized current-carrying capacity of the PCB as a dependent variable;
and the optimized current carrying capacity determining module is used for determining the optimized current carrying capacity of the target PCB based on the second preset mapping relation, the current carrying capacity and the plate thickness of the target PCB.
A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of the method of determining the current carrying capacity of a PCB as described above.
A computer device comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to perform the steps of the method of determining the current carrying capacity of a PCB as described above.
The method, the device, the computer-readable storage medium and the computer equipment for determining the current carrying capacity of the PCB provided by the embodiments of the application acquire the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor, acquire a first predetermined mapping relation which takes the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor as independent variables and the current carrying capacity of the PCB as dependent variables, and determine the current carrying capacity of the target PCB based on the first predetermined mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor. Therefore, in the process of determining the current carrying capacity of the PCB, the influence of the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor is comprehensively considered, and the accuracy of the determined current carrying capacity of the PCB can be effectively improved.
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FIG. 1 is a flow diagram illustrating a method for determining a current carrying capability of a PCB according to one embodiment;
FIG. 2 is a block diagram of an apparatus for determining a current carrying capability of a PCB according to an embodiment;
FIG. 3 is a block diagram of a computer device in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The application environment of the method for determining the current carrying capacity of the PCB provided by the embodiments of the present application may relate to a user terminal or a server. The user terminal may be a desktop terminal or a mobile terminal, and the mobile terminal may specifically include at least one of a mobile phone, a tablet computer, a notebook computer, wearable equipment, and the like. The server may be an independent physical server or a server cluster composed of a plurality of physical servers.
In one embodiment, as shown in fig. 1, a method of determining a current carrying capability of a PCB is provided. The embodiment mainly takes the application of the method to the user terminal as an example for explanation. Referring to fig. 1, the method may specifically include the following steps S102 to S106.
S102, current-carrying influence parameters of the target PCB are obtained, wherein the current-carrying influence parameters comprise the allowable temperature rise of the target PCB, the thickness of a copper conductor and the line width of the copper conductor.
The target PCB refers to a PCB whose current carrying capacity is to be determined. It should be noted that the current carrying capacity may also be referred to as a current carrying value.
In the working process of the PCB, the current can generate heat after passing through the PCB, the temperature on the surface of the PCB continuously rises along with the lapse of time, and continuously outputs heat to the surrounding environment, and when the heat generation and the heat dissipation in unit time reach balance, the temperature on the surface of the PCB reaches a stable state. In the process, the temperature rising on the surface of the PCB is the temperature rise.
In the present embodiment, the allowable temperature rise of the target PCB refers to a maximum temperature rise that the target PCB is allowed to have. The copper conductor thickness of the target PCB refers to the thickness of the copper foil that is formed overlying the PCB. The copper conductor line width of the target PCB refers to the width of the trace on the target PCB.
It will be appreciated that the various parameters (allowable temperature rise, copper conductor thickness, and copper conductor line width) included in the current-carrying impact parameters of the target PCB may be determined based on the actual conditions of the target PCB. In general, the allowable temperature rise may be 10 ℃, 20 ℃ or 30 ℃; the copper conductor thickness may be 18 μm, 35 μm, 55 μm and 70 μm; the copper conductor linewidth is related to the trace type, for example, the power line is generally not lower than 25 mil.
S104, obtaining a first preset mapping relation, wherein the first preset mapping relation takes the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor as independent variables, and the current carrying capacity of the PCB as a dependent variable.
It should be noted that, in the first predetermined mapping relationship, for three independent variables of the allowed temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor, under the condition that any two independent variables are not changed, the remaining one independent variable has a positive correlation with the current carrying capacity of the PCB, that is, under the condition that any two independent variables are not changed, the current carrying capacity of the PCB increases as the remaining one independent variable increases, and decreases as the remaining one independent variable decreases. For example, the current carrying capacity of a PCB increases with increasing copper conductor linewidth and decreases with decreasing copper conductor linewidth, allowing for temperature rise and constant copper conductor thickness.
Furthermore, for the first predetermined mapping relationship, the allowable temperature rise of the PCB, the thickness of the copper conductor, and the line width of the copper conductor may all exhibit a trend of power exponent variation.
And S106, determining the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor.
In this embodiment, after obtaining the allowable temperature rise of the target PCB, the thickness of the copper conductor, and the line width of the copper conductor, the current carrying capacity of the target PCB can be determined by substituting the obtained set of parameter values into the first predetermined mapping relationship. In practical application, PCB designers can design PCBs based on the current-carrying capacity.
The method for determining the current carrying capacity of the PCB obtains the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor, obtains a first preset mapping relation which takes the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor as independent variables and takes the current carrying capacity of the PCB as a dependent variable, and determines the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor. Therefore, in the process of determining the current carrying capacity of the PCB, the influence of the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor is comprehensively considered, and the accuracy of the determined current carrying capacity of the PCB can be effectively improved.
Fig. 1 is a schematic flow chart illustrating a method for determining a current carrying capacity of a PCB in one embodiment. It should be understood that, although the steps in the flowchart of fig. 1 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. For example, step S102 may be executed first, and then step S104 may be executed, or step S102 may be executed first, and then step S104 may be executed.
Moreover, at least a portion of the steps in fig. 1 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
To further illustrate the aspects of the present application in more detail, some preferred embodiments of the present application are specifically described or exemplified below.
In one embodiment, the first predetermined mapping relationship is:
Ibasis＝a1*△Ta2*ha3*wa4
wherein, IbasisFor the current carrying capacity of the PCB, △ T is the allowable temperature rise of the PCB, h is the thickness of the copper conductor of the PCB, w is the line width of the copper conductor of the PCB, a1Is a third predetermined constant, a2 is the first predetermined exponent, a3 is the second predetermined exponent, and a4 is the third predetermined exponent.
In the above formula, IbasisMay be in amperes, △ T may be in degrees celsius (c), h may be in millimeters (mm), and w may be in millimeters (mm).
In a specific example, the value of a1 is 2.05, the value of a2 is 0.52, the value of a3 is 0.41, and the value of a4 is 0.56.
The actually measured current-carrying capacity, the current-carrying capacity determined based on the present embodiment, the current-carrying capacity determined based on the IPC-2152 standard, and the current-carrying capacity determined based on the IPC-2221 standard are described in comparison with specific test data.
In the case where the target PCB was made of FR-4, had a plate thickness of 0.36mm, a copper conductor thickness of 0.035mm (1oz), and an allowable temperature rise of 10 ℃, the actually measured current-carrying capacity, the current-carrying capacity determined based on the present embodiment, the current-carrying capacity determined based on IPC-2152, and the current-carrying capacity determined based on IPC-2221 were shown in table 1 for different copper conductor line widths.
TABLE 1
Figure BDA0001530450940000061
Based on the data in table 1, the following information can be learned:
(1) compared with the current-carrying capacity of the target PCB determined by the traditional methods (IPC-2152 and IPC-2221), the method for determining the current-carrying capacity of the PCB (i.e. I) provided by the embodimentbasis＝2.05*△T0.52*h0.41*w0.56) The determined current carrying capacity of the target PCB is closer to the actually measured current carrying capacity, namely the accuracy is higher.
(2) The current carrying capacity of the target PCB determined based on the present embodiment is close to the current carrying capacity of the inner conductor of the PCB actually measured or the outer conductor of the PCB actually measured. Therefore, the method for determining the current carrying capacity of the PCB provided by the embodiment can be suitable for determining the current carrying capacity of the outer conductor of the PCB, and can also be suitable for determining the current carrying capacity of the inner conductor of the PCB.
(3) For cross-sectional areas less than 5mil2In this case, the method for determining the current carrying capability of the PCB provided in this embodiment can also be applied.
In one embodiment, the current-carrying affecting parameter further includes a board thickness of the target PCB, and further includes, after the step of determining the current-carrying capacity of the target PCB based on the allowable temperature rise of the target PCB, the thickness of the copper conductor, the line width of the copper conductor, and the first predetermined mapping relationship:
acquiring a second preset mapping relation, wherein the second preset mapping relation takes the current-carrying capacity of the PCB and the plate thickness of the PCB as independent variables and takes the optimized current-carrying capacity of the PCB as a dependent variable;
and determining the optimized current-carrying capacity of the target PCB based on the second preset mapping relation, the current-carrying capacity and the board thickness of the target PCB.
It should be noted that, for a PCB, the thickness of the PCB is the thickness of the dielectric layer, and a conductor (such as a copper foil) is usually attached to the dielectric layer, so the thickness of the PCB also has a certain influence on the current carrying capability of the PCB.
Based on this, in the present embodiment, when determining the current carrying capacity of the PCB, the board thickness is further considered in addition to the three factors of the allowable temperature rise of the PCB, the thickness of the copper conductor, and the line width of the copper conductor mentioned in the above embodiment.
Specifically, the current carrying capacity of the target PCB is determined based on the first predetermined mapping relationship, the allowable temperature rise of the target PCB, the thickness of the copper conductor, and the line width of the copper conductor, and it can be understood that the current carrying capacity obtained here can be regarded as the basic current carrying capacity. In addition, on the basis of the basic current-carrying capacity, the optimized current-carrying capacity (namely the final current-carrying capacity) of the target PCB is further determined based on the second predetermined mapping relation, the current-carrying capacity and the plate thickness of the target PCB. In practical application, PCB designers can design PCBs based on the optimized current-carrying capacity. Further, it is understood that the optimized current carrying capacity is further determined in consideration of the influence of the plate thickness, and thus the accuracy of the optimized current carrying capacity is higher than that of the basic current carrying capacity.
It should be noted that, in the second predetermined mapping relationship, for two independent variables, namely the current carrying capacity of the PCB and the plate thickness of the PCB, under the condition that any one independent variable is not changed, the other independent variable has a positive correlation with the optimized current carrying capacity of the PCB, that is, under the condition that any one independent variable is not changed, the optimized current carrying capacity of the PCB increases with the increase of the other independent variable and decreases with the decrease of the other independent variable. For example, in the case of a PCB with a constant current carrying capacity, the optimal current carrying capacity of the PCB increases with increasing board thickness and decreases with decreasing board thickness.
Further, in the second predetermined mapping relationship, the influence of the board thickness of the PCB on the optimized current carrying capacity of the PCB may exhibit a linear variation tendency.
In one embodiment, the second predetermined mapping relationship is:
Iaim＝b1*(t-b2)*Ibasis
wherein, IaimFor optimizing the current-carrying capacity of the PCB, IbasisFor the current carrying capacity of the PCB, t is the board thickness of the PCB, b1 is a first predetermined constant, and b2 is a second predetermined constant.
In a specific example, the value of b1 is 0.08 and the value of b2 is 0.36.
In the second predetermined mapping relationship, the unit of the plate thickness t may be millimeters (mm).
Furthermore, based on Iaim＝0.08*(t-0.36)*IbasisAccording to the formula, under the condition that the current carrying capacity of the PCB is not changed, the optimized current carrying capacity of the PCB is increased by 0.08A when the thickness of the PCB is increased by 1 mm.
Based on the same idea as the method, in an embodiment, there is further provided a device 200 for determining the current carrying capacity of a PCB, as shown in fig. 2, the device 200 may include:
a current-carrying influence parameter obtaining module 202, configured to obtain current-carrying influence parameters of a target PCB, where the current-carrying influence parameters include an allowable temperature rise of the target PCB, a thickness of a copper conductor, and a line width of the copper conductor;
a first mapping relation obtaining module 204, configured to obtain a first predetermined mapping relation, where the first predetermined mapping relation takes an allowable temperature rise of a PCB, a thickness of a copper conductor, and a line width of the copper conductor as independent variables, and takes a current carrying capacity of the PCB as a dependent variable;
a current carrying capacity determining module 206, configured to determine a current carrying capacity of the target PCB based on the first predetermined mapping relationship, the allowable temperature rise of the target PCB, the thickness of the copper conductor, and the line width of the copper conductor.
The device for determining the current carrying capacity of the PCB obtains the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor, obtains a first preset mapping relation which takes the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor as independent variables and takes the current carrying capacity of the PCB as a dependent variable, and determines the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor. Therefore, in the process of determining the current carrying capacity of the PCB, the influence of the allowable temperature rise of the PCB, the thickness of the copper conductor and the line width of the copper conductor is comprehensively considered, and the accuracy of the determined current carrying capacity of the PCB can be effectively improved.
In an embodiment, the current-carrying influence parameter further includes a board thickness of the target PCB, and based on this, the determining apparatus 200 may further include:
the second mapping relation obtaining module is used for obtaining a second preset mapping relation, the second preset mapping relation takes the current-carrying capacity of the PCB and the plate thickness of the PCB as independent variables, and takes the optimized current-carrying capacity of the PCB as a dependent variable;
and the optimized current carrying capacity determining module is used for determining the optimized current carrying capacity of the target PCB based on the second preset mapping relation, the current carrying capacity and the plate thickness of the target PCB.
In one embodiment, the second predetermined mapping relationship is:
Iaim＝b1*(t-b2)*Ibasis
wherein, IaimOptimized current carrying for the PCBAbility, IbasisFor the current carrying capacity of the PCB, t is the board thickness of the PCB, b1 is a first predetermined constant, and b2 is a second predetermined constant.
In one embodiment, b1 has a value of 0.08 and b2 has a value of 0.36.
In one embodiment, the first predetermined mapping relationship is:
Ibasis＝a1*△Ta2*ha3*wa4
wherein, IbasisFor the current carrying capacity of the PCB, △ T is the allowable temperature rise of the PCB, h is the copper conductor thickness of the PCB, w is the copper conductor line width of the PCB, a1 is a third predetermined constant, a2 is the first predetermined index, a3 is the second predetermined index, and a4 is the third predetermined index.
In one embodiment, a1 has a value of 2.05, a2 has a value of 0.52, a3 has a value of 0.41, and a4 has a value of 0.56.
FIG. 3 is a diagram illustrating an internal structure of a computer device in one embodiment. The computer device may specifically be a user terminal or a server. Taking the computer device as a user terminal as an example, as shown in fig. 3, the computer device includes a processor, a memory, a network interface, an input device, and a display screen, which are connected through a system bus. Wherein the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program which, when executed by the processor, causes the processor to implement the method of determining the current carrying capability of the PCB. The internal memory may also have stored therein a computer program that, when executed by the processor, causes the processor to perform a method of determining a current carrying capability of a PCB. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 3 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
Accordingly, an embodiment further provides a computer device, including a memory and a processor, where the memory stores a computer program, and the computer program, when executed by the processor, causes the processor to execute the steps of the method for determining the current carrying capacity of the PCB provided in the embodiments of the present application.
In one embodiment, the apparatus for determining the current carrying capacity of the PCB provided by the present application may be implemented in the form of a computer program, and the computer program may be run on a computer device as shown in fig. 3. The memory of the computer device may store various program modules constituting the determination apparatus of the current carrying capacity of the PCB, such as the current carrying influence parameter acquisition module 202, the first mapping relation acquisition module 204, and the current carrying capacity determination module 206 shown in fig. 2. The computer program constituted by the program modules causes the processor to execute the steps of the method for determining the current carrying capacity of the PCB of the various embodiments of the present application described in the present specification.
For example, the computer apparatus shown in fig. 3 may execute step S102 by the current-carrying influence parameter acquiring module 202 in the apparatus for determining the current-carrying capacity of the PCB shown in fig. 2, execute step S104 by the first mapping relation acquiring module 204, and execute step S106 by the current-carrying capacity determining module 206.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a non-volatile computer-readable storage medium, and can include the processes of the embodiments of the methods described above when the program is executed. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
Accordingly, an embodiment further provides a computer readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the method for determining the current carrying capacity of the PCB provided in the embodiments of the present application.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. A method for determining the current carrying capacity of a PCB is characterized by comprising the following steps:
acquiring current-carrying influence parameters of a target PCB, wherein the current-carrying influence parameters comprise allowable temperature rise of the target PCB, copper conductor thickness and copper conductor line width;
acquiring a first preset mapping relation, wherein the first preset mapping relation takes the allowable temperature rise of a PCB, the thickness of a copper conductor and the line width of the copper conductor as independent variables, and the current carrying capacity of the PCB as a dependent variable;
determining the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of the copper conductor and the line width of the copper conductor;
the current-carrying influence parameters further comprise the plate thickness of the target PCB, and the plate thickness refers to the thickness of the dielectric layer;
after the step of determining the current carrying capacity of the target PCB based on the allowable temperature rise of the target PCB, the thickness of the copper conductor, the line width of the copper conductor and the first predetermined mapping relationship, the method further includes:
acquiring a second preset mapping relation, wherein the second preset mapping relation takes the current carrying capacity of the PCB and the plate thickness of the PCB as independent variables, takes the optimized current carrying capacity of the PCB as dependent variables, and is as follows:
Iaim＝b1*(t-b2)*Ibasis
wherein, IaimFor optimizing the current-carrying capacity of the PCB, IbasisThe current carrying capacity of the PCB is t, the plate thickness of the PCB is t, b1 is a first preset constant, and b2 is a second preset constant;
and determining the optimized current-carrying capacity of the target PCB based on the second preset mapping relation, the current-carrying capacity and the board thickness of the target PCB.
2. The method of claim 1, wherein the allowable temperature rise of the target PCB refers to a maximum temperature rise allowed for the target PCB, the copper conductor thickness of the target PCB refers to a thickness formed by copper foil covered on the PCB, and the copper conductor line width of the target PCB refers to a trace width on the target PCB.
3. The method of claim 1, wherein b1 is 0.08 and b2 is 0.36.
4. A method according to any one of claims 1 to 3, wherein the first predetermined mapping relationship is:
Ibasis＝a1*ΔTa2*ha3*wa4
wherein, IbasisIn order to obtain the current carrying capacity of the PCB, delta T is the allowable temperature rise of the PCB, h is the thickness of a copper conductor of the PCB, w is the line width of the copper conductor of the PCB, a1 is a third preset constant, a2 is a first preset index, a3 is a second preset index, and a4 is a third preset index.
5. The method of claim 4, wherein a1 is 2.05, a2 is 0.52, a3 is 0.41, and a4 is 0.56.
6. An apparatus for determining a current carrying capability of a PCB, comprising:
the current-carrying influence parameter acquisition module is used for acquiring current-carrying influence parameters of a target PCB, wherein the current-carrying influence parameters comprise allowable temperature rise of the target PCB, copper conductor thickness and copper conductor line width;
the first mapping relation obtaining module is used for obtaining a first preset mapping relation, wherein the first preset mapping relation takes the allowable temperature rise of a PCB, the thickness of a copper conductor and the line width of the copper conductor as independent variables, and takes the current carrying capacity of the PCB as a dependent variable;
the current carrying capacity determining module is used for determining the current carrying capacity of the target PCB based on the first preset mapping relation, the allowable temperature rise of the target PCB, the thickness of a copper conductor and the line width of the copper conductor;
the current-carrying influence parameters further comprise the plate thickness of the target PCB, and the plate thickness refers to the thickness of the dielectric layer;
the determining device further comprises:
a second mapping relation obtaining module, configured to obtain a second predetermined mapping relation, where the second predetermined mapping relation takes the current-carrying capacity of the PCB and the board thickness of the PCB as independent variables, takes the optimized current-carrying capacity of the PCB as a dependent variable, and the second predetermined mapping relation is:
Iaim＝b1*(t-b2)*Ibasis
wherein, IaimFor optimizing the current-carrying capacity of the PCB, IbasisThe current carrying capacity of the PCB is t, the plate thickness of the PCB is t, b1 is a first preset constant, and b2 is a second preset constant;
and the optimized current carrying capacity determining module is used for determining the optimized current carrying capacity of the target PCB based on the second preset mapping relation, the current carrying capacity and the plate thickness of the target PCB.
7. The apparatus of claim 6, wherein the second predetermined mapping relationship is: i isaim＝b1*(t-b2)*IbasisWherein, IaimFor optimizing the current-carrying capacity of the PCB, IbasisIn terms of the current carrying capacity of the PCB, t is the board thickness of the PCB, b1 is a first predetermined constant, b2 is a second predetermined constant, and the first predetermined mapping relationship is as follows: i isbasis＝a1*ΔTa2*ha3*wa4Wherein, IbasisIn order to obtain the current carrying capacity of the PCB, delta T is the allowable temperature rise of the PCB, h is the thickness of a copper conductor of the PCB, w is the line width of the copper conductor of the PCB, a1 is a third preset constant, a2 is a first preset index, a3 is a second preset index, and a4 is a third preset index.
8. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, causes the processor to carry out the steps of the method according to any one of claims 1 to 5.
9. A computer device comprising a memory and a processor, characterized in that the memory stores a computer program which, when executed by the processor, causes the processor to carry out the steps of the method according to any one of claims 1 to 5.
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CN108170958B (en) * 2017-12-28 2020-04-10 华南理工大学 Method and device for determining current carrying capacity of PCB and computer equipment
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