CN108447811B - Silicon wafer flower basket and controller thereof - Google Patents

Abstract

The invention discloses a silicon wafer flower basket and a controller thereof, comprising a first support plate and a second support plate oppositely arranged, and a plurality of uprights installed between the first support plate and the second support plate, the uprights are on the There are several latching teeth, the latching teeth include a first latching tooth installed on the column and fixedly arranged, and a second latching tooth installed on the column to switch positions, the first latching teeth and the second latching teeth are respectively used for Carrying silicon wafers, wherein the vertical position of the silicon wafer carried on the first locking tooth remains unchanged, and the vertical position of the silicon wafer carried on the second locking tooth changes with the change of the position of the second locking tooth . The silicon wafer flower basket of the present invention has a simple structure, and can realize the position change of the silicon wafer through the position change of the clamping teeth, thereby realizing the functions of assembling and dividing the silicon wafer.

Description

Silicon wafer flower basket and its controller

technical field

The invention relates to the technical field of solar cell manufacturing, in particular to a silicon wafer flower basket capable of realizing silicon wafer slicing and splicing and a controller thereof.

Background technique

Photovoltaic power generation is an important component of new energy and has developed rapidly in recent years. Among the current commercialized solar cell products, crystalline silicon (monocrystalline and polycrystalline) solar cells have the largest market share, maintaining a market share of nearly 90%. At present, in the production process of crystalline silicon solar cells, the purpose of the textured process is to reduce the surface reflectivity of the solar cell, thereby improving the photoelectric conversion efficiency of the solar cell.

In the field of solar cell manufacturing, silicon wafer flower baskets are used to accommodate silicon wafers for texturing, etching, cleaning, conversion, printing and other processes on silicon wafers. As shown in FIG. 1 , the silicon wafer flower basket in the prior art includes a first support plate 11 ′ and a second support plate 12 ′ arranged up and down, and the first support plate 11 ′ and the second support plate 12 ′ pass through four uprights 20 'For fixing, the upright column 20' is provided with two opposite clamping teeth 31', and several clamping grooves 32' are formed between the adjacent clamping teeth 31'. The insertion and installation of the silicon wafer 40' can be realized. After the insertion of the silicon wafer is completed, the silicon wafer flower basket is put into the solution for texturing, etching, cleaning, conversion, printing and other processes.

However, the teeth in the silicon wafer flower basket in the prior art are all fixed structures, and the silicon wafer flower basket is suitable for the double-sided texturing process of the silicon wafer, but the single-sided texturing process of the silicon wafer has been disclosed in the prior art, Wafer separation cannot be achieved during single-sided texturing.

Therefore, in view of the above technical problems, it is necessary to provide a silicon wafer flower basket and a controller thereof.

SUMMARY OF THE INVENTION

In view of this, the purpose of the present invention is to provide a silicon wafer flower basket and a controller thereof, which can realize silicon wafer slicing and splicing.

In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

A silicon wafer flower basket includes a first support plate and a second support plate arranged oppositely, and a plurality of uprights installed between the first support plate and the second support plate, the uprights are provided with a plurality of locking teeth, and the The clamping teeth include a first clamping tooth installed on the column and fixedly arranged, and a second clamping tooth installed on the column with a switchable position. The first clamping tooth and the second clamping tooth are respectively used for carrying silicon wafers, wherein the first The vertical position of the silicon wafer carried on the clamping teeth remains unchanged, and the vertical position of the silicon wafer carried on the second clamping teeth changes with the change of the position of the second clamping teeth.

As a further improvement of the present invention, the change of the position of the second locking teeth includes at least one of horizontal telescopic motion, plane rotating motion, and vertical lifting motion of the second locking teeth.

As a further improvement of the present invention, the silicon wafer flower basket further includes:

a driving mechanism for realizing at least one of the horizontal telescopic movement, the plane rotation movement and the vertical lifting movement of the second clamping teeth;

The control mechanism is used to control at least one of the distance of the horizontal telescopic movement of the second clamping teeth, the angle of plane rotation, and the distance of the vertical lifting movement.

As a further improvement of the present invention, the first locking teeth and the second locking teeth are arranged on the upright column at intervals.

As a further improvement of the present invention, the column includes a first column and a second column, the first locking teeth are mounted on the first column, and the second locking teeth are mounted on the second column.

As a further improvement of the present invention, the second column is installed on the inner side and/or the outer side of the first column.

As a further improvement of the present invention, the second locking teeth include a first end disposed on the upright column and a second end away from the upright column, and the thickness of the second locking teeth gradually decreases from the first end to the second end.

As a further improvement of the present invention, the height of the upper surface of the second locking teeth gradually decreases from the first end to the second end.

As a further improvement of the present invention, the height of the lower surface of the second latching teeth gradually increases from the first end to the second end.

As a further improvement of the present invention, the lower surface of the second locking tooth is flat.

The technical solution provided by another embodiment of the present invention is as follows:

A controller for a silicon wafer flower basket, the controller is used to control the change of the position of the second clamping tooth, so as to realize that the vertical position of the silicon wafer carried on the second clamping tooth changes with the change of the position of the second clamping tooth .

As a further improvement of the present invention, the controller controls the position change of the second latching teeth through a wired or wireless control manner.

The beneficial effects of the present invention are:

The silicon wafer flower basket has a simple structure, and can realize the position change of the silicon wafer through the change of the position of the clamping teeth, thereby realizing the functions of combining and dividing the silicon wafer;

It can be used for single-sided texturing of crystalline silicon cells, which greatly increases production capacity and reduces production costs.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a schematic structural diagram of a silicon wafer flower basket in the prior art;

FIG. 2a is a schematic structural diagram of the fragmented state of the silicon wafer flower basket in Embodiment 1 of the present invention;

Fig. 2b is a top-view structural schematic diagram of Fig. 2a;

FIG. 2c is a schematic structural diagram of the state of the silicon wafer flower basket in Embodiment 1 of the present invention;

3a is a schematic structural diagram of a silicon wafer flower basket in a fragmented state in Embodiment 2 of the present invention;

3b is a schematic structural diagram of the state of the silicon wafer flower basket in Embodiment 2 of the present invention;

Fig. 3c is the top-view structure schematic diagram of Fig. 3a;

FIG. 3d is a schematic top view of FIG. 3b;

FIG. 3e is a schematic structural diagram of the silicon wafer in the silicon wafer flower basket according to Embodiment 2 of the present invention being completely separated from the second latching teeth;

FIG. 4a is a schematic structural diagram of the fragmented state of the silicon wafer flower basket in Embodiment 3 of the present invention;

FIG. 4b is a schematic structural diagram of the state of the silicon wafer flower basket in Embodiment 3 of the present invention;

FIG. 4c is a schematic top view of FIG. 4a;

FIG. 4d is a schematic top view of FIG. 4b;

FIG. 4e is a schematic structural diagram of the silicon wafer in the silicon wafer flower basket according to Embodiment 3 of the present invention being completely separated from the second latching teeth;

FIG. 5a is a schematic structural diagram of the fragmented state of the silicon wafer flower basket in Embodiment 4 of the present invention;

5b is a schematic structural diagram of the state of the silicon wafer flower basket in Embodiment 4 of the present invention;

6a is a schematic structural diagram of a silicon wafer flower basket in a fragmented state according to Embodiment 6 of the present invention;

FIG. 6b is a schematic structural diagram of a silicon wafer flower basket combined state in Embodiment 6 of the present invention;

7a is a schematic structural diagram of a silicon wafer flower basket in a fragmented state in Embodiment 7 of the present invention;

FIG. 7b is a schematic top view of the structure of FIG. 7a.

Detailed ways

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The invention discloses a silicon wafer flower basket, comprising a first support plate and a second support plate arranged oppositely, and a plurality of uprights installed between the first support plate and the second support plate, and the uprights are provided with a plurality of locking teeth, The clamping teeth include a first clamping tooth that is fixedly installed on the column and fixedly arranged, and a second clamping tooth that is installed on the column to switch positions. The first clamping teeth and the second clamping teeth are respectively used for carrying silicon chips, wherein the first The vertical position of the silicon wafer carried on one tooth remains unchanged, and the vertical position of the silicon wafer carried on the second tooth changes with the change of the position of the second tooth.

Wherein, the change of the position of the second tooth includes at least one of horizontal telescopic movement, plane rotation, and vertical lifting motion of the second tooth, and the change of the position of the second tooth can control the movement of the silicon wafer carried thereon. The vertical position achieves the purpose of merging or slicing with the silicon wafers carried on the first clamping teeth below.

The vertical direction mentioned in the present invention is the direction perpendicular to the first support plate and the second support plate (ie the extending direction of the column), and the horizontal direction is the direction parallel to the first support plate and the second support plate (ie the vertical direction). in the direction of the column).

The silicon wafer flower basket of the present invention will be further described below with reference to specific embodiments.

Example 1:

2a and 2b, the silicon wafer flower basket in this embodiment includes a first support plate 11 and a second support plate 12 arranged oppositely, and is installed between the first support plate 11 and the second support plate 12. There are four uprights 20, the uprights 20 are provided with a number of latching teeth, the latching teeth include a first latching tooth 31 mounted on the upright and fixedly arranged, and a second latching tooth 32 mounted on the upright column in a switchable position. The teeth 31 and the second locking teeth 32 are distributed at intervals on the same column. A slot 33 is formed between the first tooth 31 and the second tooth 32 . The slot 33 is used to carry the silicon wafer, and the silicon wafer is inserted and carried on the corresponding first tooth 31 or the second tooth 32 .

Wherein, the first locking tooth 31 in this embodiment includes a first end disposed on the upright column and a second end away from the upright column, and the thickness of the first locking tooth gradually decreases from the first end to the second end. The upper surface and the lower surface of the first locking teeth 31 are both inclined. The height of the upper surface gradually decreases along the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

Similarly, the shape of the second teeth 32 is the same as the shape of the first teeth 31 , the second teeth 32 include a first end disposed on the upright column and a second end away from the column, and the thickness of the second locking teeth is along the first The end gradually decreases towards the second end. The upper and lower surfaces of the second latching teeth 32 are both inclined, the height of the upper surface gradually decreases from the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

In this embodiment, the upright column 20 is fixedly installed with the first clamping teeth 31, the second clamping teeth 32 can perform horizontal telescopic movement, and the horizontal telescopic movement of the second clamping teeth 32 can be realized by a control mechanism and a driving mechanism, and the driving mechanism can include a drive motor , linkage rod, etc. The linkage rod is set inside the column 20, and the control mechanism controls the rotation of the drive motor to drive the linkage mechanism to move in the horizontal direction, thereby driving the second tooth 32 to achieve horizontal telescopic movement.

Referring to Figures 2a and 2c, the usage method of the silicon wafer flower basket in this embodiment is as follows:

Insert the silicon wafers 40 into the card slots 33 of the silicon wafer flower basket in sequence, and the silicon wafers 40 are respectively supported on the first locking teeth 31 and the second locking teeth 32, as shown in FIG. 2a;

Then, the control mechanism and the driving mechanism are used to control the second clamping teeth 32 to perform horizontal telescopic movement at the same time, so that the second clamping teeth 32 can be telescopically moved in the direction away from the silicon wafer 40. Since the upper surface of the second clamping teeth 32 is inclined, the When the teeth 32 move in the direction away from the silicon wafer 40, the vertical position of the silicon wafer 40 carried on the second locking teeth 32 will gradually decrease, so the silicon wafer carried on the second locking teeth 32 and the first locking teeth below it will gradually decrease. The distance between the silicon wafers carried on the 31 gradually decreases to realize the joining of the two silicon wafers, as shown in FIG. 2c for details.

It should be noted that, in the process of joining the pieces, the second locking teeth 32 are never separated from the silicon wafers carried thereon, and the tooth tips of the second locking teeth 32 are always located between the two silicon wafers.

When the second tooth 32 and the silicon wafer 40 reach the position shown in FIG. 2c, the silicon wafer flower basket can be put into the texturing solution for single-sided texturing of the silicon wafer. When the distance is reduced, the two silicon wafers can be considered to be basically attached. During texturing, only the upper surface of the upper silicon wafer and the lower surface of the lower silicon wafer are processed, and chemical reactions will not occur on the surfaces of the two silicon wafers attached in the middle. .

After the texturing is completed, the second clamping teeth 32 are controlled to perform horizontal telescopic movement at the same time by the control mechanism and the driving mechanism, so that the second clamping teeth 32 are telescopically moved in the direction close to the silicon wafer 40. Since the upper surface of the second clamping teeth 32 is inclined, When the second tooth 32 moves in a direction close to the silicon wafer 40, the vertical position of the silicon wafer 40 carried on the second tooth 32 will gradually increase, so the silicon wafer carried on the second tooth 32 and its The distance between the silicon wafers carried on the lower first clamping teeth 31 gradually increases to realize the splitting of the two silicon wafers, as shown in FIG. 2a.

After the slicing of the silicon wafers is achieved, the silicon wafers can be cleaned, dried and other processes. After the process of all the silicon wafers is completed, all the silicon wafers can be taken out from the silicon wafer flower basket.

It should be understood that, in other embodiments, the upper and lower surfaces of the first and second clamping teeth can also be set as arc surfaces, or a combination of inclined surfaces and arc surfaces, etc., as long as the second clamping teeth are horizontally telescopically moved When the position of the silicon wafer carried on the second clamping teeth in the vertical direction changes correspondingly, all technical solutions belong to the scope of protection of the present invention, and will not be described one by one here.

Example 2:

Referring to FIGS. 3 a and 3 c , the silicon wafer flower basket in this embodiment includes a first support plate 11 and a second support plate 12 arranged oppositely, and is installed between the first support plate 11 and the second support plate 12 . There are eight columns 20, the column 20 includes a first column 21 and a second column 22, the second column 22 is located on the inner side of the first column 21, the column 20 is provided with a number of locking teeth, and the locking teeth are installed on the first column 21 and The fixed first locking teeth 31 and the second locking teeth 32 installed on the second column 22 in a switchable position, the first locking teeth 31 and the second locking teeth 32 are spaced apart on adjacent columns. A slot 33 is formed between the first tooth 31 and the second tooth 32 . The slot 33 is used to carry the silicon wafer, and the silicon wafer is inserted and carried on the corresponding first tooth 31 or the second tooth 32 .

Wherein, the first locking tooth 31 in this embodiment includes a first end disposed on the upright column and a second end away from the upright column, and the thickness of the first locking tooth gradually decreases from the first end to the second end. The upper surface and the lower surface of the first locking teeth 31 are both inclined. The height of the upper surface gradually decreases along the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

Similarly, the shape of the second teeth 32 is the same as the shape of the first teeth 31 , the second teeth 32 include a first end disposed on the upright column and a second end away from the column, and the thickness of the second locking teeth is along the first The end gradually decreases towards the second end. The upper and lower surfaces of the second latching teeth 32 are both inclined, the height of the upper surface gradually decreases from the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

In this embodiment, the first column 21 is fixedly installed with the first locking teeth 31 , the second column 22 drives the second locking teeth 32 to perform horizontal telescopic movement, and the second column 22 can realize the second locking teeth 32 through the control mechanism and the driving mechanism The drive mechanism may include a drive motor, etc. Correspondingly, a corresponding horizontal chute is set on the first support plate 11 and the second support plate 12, and the control mechanism controls the drive motor to rotate to drive the second column 22 to horizontally It moves along the horizontal chute in the direction, thereby driving the second teeth 32 to realize horizontal telescopic movement.

Referring to Figures 3a-3d, the usage method of the silicon wafer flower basket in this embodiment is as follows:

Insert the silicon wafers 40 into the card slots 33 of the silicon wafer flower basket in sequence, and the silicon wafers 40 are respectively carried on the first locking teeth 31 and the second locking teeth 32, as shown in FIG. 3a and FIG. 3c ;

Then, the control mechanism and the driving mechanism are used to control the second clamping teeth 32 to perform horizontal telescopic movement at the same time, so that the second clamping teeth 32 can be telescopically moved in the direction away from the silicon wafer 40. Since the upper surface of the second clamping teeth 32 is inclined, the When the teeth 32 move in the direction away from the silicon wafer 40, the vertical position of the silicon wafer 40 carried on the second locking teeth 32 will gradually decrease, so the silicon wafer carried on the second locking teeth 32 and the first locking teeth below it will gradually decrease. The distance between the silicon wafers carried on the 31 gradually decreases to realize the joining of the two silicon wafers, as shown in Figures 3b and 3d for details.

It should be noted that, in the process of joining the pieces, the second locking teeth 32 are never separated from the silicon wafers carried thereon, and the tooth tips of the second locking teeth 32 are always located between the two silicon wafers.

When the second tooth 32 and the silicon wafer 40 reach the position shown in FIG. 3b, the silicon wafer flower basket can be put into the texturing liquid to perform single-sided texturing of the silicon wafer. When the distance is reduced, the two silicon wafers can be considered to be basically attached. During texturing, only the upper surface of the upper silicon wafer and the lower surface of the lower silicon wafer are processed, and chemical reactions will not occur on the surfaces of the two silicon wafers attached in the middle. .

After the texturing is completed, the second clamping teeth 32 are controlled to perform horizontal telescopic movement at the same time by the control mechanism and the driving mechanism, so that the second clamping teeth 32 are telescopically moved in the direction close to the silicon wafer 40. Since the upper surface of the second clamping teeth 32 is inclined, When the second tooth 32 moves in a direction close to the silicon wafer 40, the vertical position of the silicon wafer 40 carried on the second tooth 32 will gradually increase, so the silicon wafer carried on the second tooth 32 and its The distance between the silicon wafers carried on the lower first clamping teeth 31 gradually increases to realize the splitting of the two silicon wafers, as shown in FIG. 3 a and FIG. 3 c .

After the slicing of the silicon wafers is achieved, the silicon wafers can be cleaned, dried and other processes. After the process of all the silicon wafers is completed, all the silicon wafers can be taken out from the silicon wafer flower basket.

It should be understood that, in other embodiments, the upper and lower surfaces of the first and second clamping teeth can also be set as arc surfaces, or a combination of inclined surfaces and arc surfaces, etc., as long as the second clamping teeth are horizontally telescopically moved When the position of the silicon wafer carried on the second clamping teeth in the vertical direction changes correspondingly, all technical solutions belong to the scope of protection of the present invention, and will not be described one by one here.

Further, when the two silicon wafers need to be taken out, the second column 22 and the second clamping tooth 32 are controlled to move in a horizontal direction away from the silicon wafer by the control structure and the driving mechanism until the second clamping tooth is completely separated from the silicon wafer. At this time, the silicon wafer carried on the second tooth is basically attached to the silicon wafer carried by the first tooth below, as shown in FIG. 3e for details.

Example 3:

Referring to FIGS. 4a and 4c , the silicon wafer flower basket in this embodiment includes a first support plate 11 and a second support plate 12 arranged opposite to each other, and is installed between the first support plate 11 and the second support plate 12 . There are eight columns 20, the column 20 includes a first column 21 and a second column 22, a number of clamping teeth are provided on the column 20, and the clamping teeth include a first clamping tooth 31 installed on the first column 21 and fixedly arranged, and the installation The second locking teeth 32 , the first locking teeth 31 and the second locking teeth 32 , which can switch positions on the second column 22 , are spaced apart on adjacent columns. A slot 33 is formed between the first tooth 31 and the second tooth 32 . The slot 33 is used to carry the silicon wafer, and the silicon wafer is inserted and carried on the corresponding first tooth 31 or the second tooth 32 .

Wherein, the first locking tooth 31 in this embodiment includes a first end disposed on the upright column and a second end away from the upright column, and the thickness of the first locking tooth gradually decreases from the first end to the second end. The upper surface and the lower surface of the first locking teeth 31 are both inclined. The height of the upper surface gradually decreases along the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

Similarly, the shape of the second teeth 32 is the same as the shape of the first teeth 31 , the second teeth 32 include a first end disposed on the upright column and a second end away from the column, and the thickness of the second locking teeth is along the first The end gradually decreases towards the second end. The upper and lower surfaces of the second latching teeth 32 are both inclined, the height of the upper surface gradually decreases from the first end to the second end, and the height of the lower surface gradually increases along the first end to the second end.

In this embodiment, the first column 21 is fixedly installed with the first locking tooth 31 , the second column 22 drives the second locking tooth 32 to perform plane rotation movement, and the second column 22 can realize the second locking tooth 32 through the control mechanism and the driving mechanism The driving mechanism may include a driving motor, etc., and the control mechanism controls the rotation of the driving motor to drive the second column 22 to rotate in the plane, thereby driving the second tooth 32 to realize the plane rotation.

Referring to Figures 4a-4d, the usage method of the silicon wafer flower basket in this embodiment is as follows:

Insert the silicon wafers 40 into the card slots 33 of the silicon wafer flower basket in sequence, and the silicon wafers 40 are respectively carried above the first locking teeth 31 and the second locking teeth 32, as shown in FIG. 4a and FIG. 4c ;

Then, the second column 22 is controlled by the control mechanism and the driving mechanism to perform plane rotation movement, preferably, the rotation angle is 45°˜60°, so that the second latch 32 rotates toward the center position, because the upper surface of the second latch 32 It is an inclined plane. When the second tooth 32 rotates toward the center position, the vertical position of the silicon wafer 40 carried on the second tooth 32 will gradually decrease. Therefore, the silicon wafer carried on the second tooth 32 and its The distance between the silicon wafers carried on the lower first clamping teeth 31 is gradually reduced to realize the joining of the two silicon wafers, as shown in FIGS. 4b and 4d for details.

It should be noted that, in the process of joining the pieces, the second locking teeth 32 are never separated from the silicon wafers carried thereon, and the tooth tips of the second locking teeth 32 are always located between the two silicon wafers.

When the second tooth 32 and the silicon wafer 40 reach the position shown in Fig. 4b, the silicon wafer flower basket can be put into the texturing solution for single-sided texturing of the silicon wafer. When the distance is reduced, the two silicon wafers can be considered to be basically attached. During texturing, only the upper surface of the upper silicon wafer and the lower surface of the lower silicon wafer are processed, and chemical reactions will not occur on the surfaces of the two silicon wafers attached in the middle. .

After the texturing is completed, the control mechanism and the drive mechanism are used to control the second tooth 32 to rotate away from the center at the same time. Since the upper surface of the second tooth 32 is an inclined plane, when the second tooth 32 moves in the direction close to the silicon wafer 40 , the vertical position of the silicon wafer 40 carried on the second tooth 32 will gradually increase, so the distance between the silicon wafer carried on the second tooth 32 and the silicon wafer carried on the first tooth 31 below it Gradually increase to realize the slicing of two silicon wafers, as shown in Figure 4a and Figure 4c.

After the slicing of the silicon wafers is achieved, the silicon wafers can be cleaned, dried and other processes. After the process of all the silicon wafers is completed, all the silicon wafers can be taken out from the silicon wafer flower basket.

It should be understood that, in other embodiments, the upper and lower surfaces of the first and second clamping teeth can also be set as arc surfaces, or a combination of inclined surfaces and arc surfaces, etc., as long as the second clamping teeth are horizontally telescopically moved When the position of the silicon wafer carried on the second clamping teeth in the vertical direction changes correspondingly, all technical solutions belong to the scope of protection of the present invention, and will not be described one by one here.

Further, when the two silicon wafers need to be taken out, the second column 22 and the second locking tooth 32 are controlled to rotate 90° toward the center position through the control structure and the driving mechanism, and the second locking tooth is completely separated from the silicon wafer, At this time, the silicon wafer carried on the second tooth is basically attached to the silicon wafer carried by the first tooth below, as shown in FIG. 4e for details.

In addition, in this embodiment, the second column is set on the inside of the first column as an example for description. In other embodiments, the second column can also be set on the outside of the first column, or on the outside and the inside at the same time. The direction of rotation is also Corresponding changes can be made, and detailed descriptions are omitted here.

Example 4:

Referring to FIGS. 5a and 5b , similar to Embodiment 2, the silicon wafer flower basket in this embodiment includes a first support plate 11 and a second support plate 12 that are oppositely arranged, and is mounted on the first support plate 11 . The eight uprights 20 between the second support plate 12 and the uprights 20 include a first upright 21 and a second upright 22. The uprights 20 are provided with a number of locking teeth, and the locking teeth include The first latching teeth 31 and the second latching teeth 32 installed on the second column 22 in a switchable position are spaced apart from the first latching teeth 31 and the second latching teeth 32 on adjacent columns. A slot 33 is formed between the first tooth 31 and the second tooth 32 . The slot 33 is used to carry the silicon wafer, and the silicon wafer is inserted and carried on the corresponding first tooth 31 or the second tooth 32 .

Different from Embodiment 2, the shape of the second locking teeth 32 in this embodiment is changed. The second locking teeth 32 include a first end disposed on the upright column and a second end away from the upright column. The thickness gradually decreases along the first end toward the second end. The upper surface of the second locking teeth 32 is inclined and the lower surface is flat. The height of the upper surface gradually decreases from the first end to the second end, and the height of the lower surface remains unchanged from the first end to the second end.

The control manner of the second locking teeth 32 in this embodiment is exactly the same as that in Embodiment 2, and will not be repeated here. After the lower surface of the second locking teeth 32 is set to be flat, the distance between the silicon wafers supported by the second locking teeth 32 and the silicon wafers supported on the first locking teeth 31 can be further reduced, and the bonding of the two silicon wafers can be improved. slice effect.

Example 5:

The settings of the column, the first clamping teeth and the second clamping teeth in this embodiment are exactly the same as those in the second embodiment, the difference is that the second clamping teeth in this embodiment realize vertical lifting movement on the second column. The vertical lifting motion directly controls the vertical position of the silicon wafer carried on the second tooth, so as to realize the joining and splitting between the silicon wafer carried by the second tooth and the silicon wafer carried on the first tooth below. .

Example 6:

In the present invention, the control is not limited to one of the horizontal telescopic movement, the plane rotation movement and the vertical lifting movement of the second clamping teeth, and the movement of the second clamping teeth can also be realized in a variety of ways to improve the bonding of the silicon wafers. Slice and slice effects.

As in this embodiment, the structure of the silicon wafer flower basket is basically the same as that of the second embodiment. The structure is the same as that of Embodiment 2, and will not be repeated here.

The difference from Embodiment 2 is that in this embodiment, the second column 22 drives the second locking teeth 32 to perform horizontal telescopic movement and vertical lifting movement, and the second column 22 can realize the second locking teeth through the control mechanism and the driving mechanism. For the horizontal telescopic movement and vertical lifting movement of 32, the driving mechanism may include a driving motor and the like.

The usage method of the silicon wafer flower basket in this embodiment is as follows:

Insert the silicon wafers 40 into the card slots 33 of the silicon wafer flower basket in sequence, and the silicon wafers 40 are respectively carried on the first locking teeth 31 and the second locking teeth 32, as shown in FIG. 6a;

Then, the second clamping teeth 32 are controlled by the control mechanism and the driving mechanism to perform horizontal telescopic movement and vertical lifting movement, so that the second clamping teeth 32 are telescopically moved in the direction away from the silicon wafer 40, and the vertical height of the second clamping teeth 32 is gradually reduced. , the vertical position of the silicon wafer 40 carried on the second tooth 32 will gradually decrease, and the distance between the silicon wafer carried on the second tooth 32 and the silicon wafer carried on the first tooth 31 below it will gradually decrease Small, realizes the combination of two silicon wafers, as shown in Figure 6b.

It should be noted that, in the process of joining the pieces, the second locking teeth 32 are never separated from the silicon wafers carried thereon, and the tooth tips of the second locking teeth 32 are always located between the two silicon wafers.

When the second tooth 32 and the silicon wafer 40 reach the position shown in FIG. 6b, the silicon wafer flower basket can be put into the texturing solution for single-sided texturing of the silicon wafer. The distance is reduced, and the two silicon wafers can be considered to be completely attached. During texturing, only the upper surface of the upper silicon wafer and the lower surface of the lower silicon wafer are processed, and chemical reactions will not occur on the surfaces of the two silicon wafers attached in the middle. .

After the texturing is completed, the second clamping teeth 32 are controlled by the control mechanism and the driving mechanism to perform horizontal telescopic motion and vertical lifting motion to realize the slicing of two silicon wafers, as shown in FIG. 6a.

After the slicing of the silicon wafers is achieved, the silicon wafers can be cleaned, dried and other processes. After the process of all the silicon wafers is completed, all the silicon wafers can be taken out from the silicon wafer flower basket.

Wherein, the horizontal telescopic movement and the vertical lifting movement in this embodiment may be performed simultaneously, or may be performed sequentially, or may be performed sequentially at intervals, which will not be described one by one here.

Of course, in other embodiments, the control can also be performed by the combination of the plane rotation movement and the vertical lifting movement of the second clamping teeth, or the combination of the horizontal telescopic movement, the plane rotation movement and the vertical lifting movement of the second clamping teeth. Control, etc., will not be described one by one in the present invention.

Example 7:

7a and 7b, the silicon wafer flower basket in this embodiment includes a first support plate 11 and a second support plate 12 arranged oppositely, and a Eight columns 20, the column 20 includes a first column 21 and a second column 22, the second column 22 is staggered with the first column 21, the two second columns 22 are located outside the first column 21, and the two second columns 22 is located inside the first column 21 . The upright column 20 is provided with a plurality of latching teeth. The latching teeth include a first latching tooth 31 mounted on the first upright post 21 and fixedly arranged, and a second latching tooth 32 mounted on the second upright post 22 and switchable. The teeth 31 and the second locking teeth 32 are distributed at intervals on the adjacent columns. A slot 33 is formed between the first tooth 31 and the second tooth 32 . The slot 33 is used to carry the silicon wafer, and the silicon wafer is inserted and carried on the corresponding first tooth 31 or the second tooth 32 .

In this embodiment, the first column 21 and the second column 22 are arranged in a staggered manner, which can ensure that the area surrounded by the four clamping teeth for carrying the silicon wafer is equal, and further improves the stability of the silicon wafer bearing.

In this embodiment, the second column 22 drives the second teeth 32 to perform horizontal telescopic movement and vertical lifting movement, and the second column 22 can realize the horizontal telescopic movement and vertical lifting of the second teeth 32 through the control mechanism and the driving mechanism Movement, the drive mechanism may include a drive motor and the like. The specific control mode is exactly the same as that of Embodiment 5, and will not be repeated here.

Example 8:

This embodiment discloses a controller for a silicon wafer flower basket. The controller is used to control the change of the position of the second clamping teeth, so that the vertical position of the silicon wafer carried on the second clamping teeth follows the position of the second clamping teeth. changes with the change.

Preferably, the controller in this embodiment can be a remote control device, and the remote control device controls the position change of the second tooth by means of wireless control, and the position change of the second tooth can be any of the methods mentioned above, Here, the examples are not described one by one.

Certainly, in other embodiments, the remote control device can also control the position change of the second tooth in the silicon wafer flower basket by means of wired control.

The controller in this embodiment can realize the automatic control of the silicon wafer flower basket, the control method is simple, and the industrial automatic production can be realized.

It should be understood that Figures 2c, 3b, 4b, 5b, and 6b of the present invention are only schematic diagrams of the principle of the silicon wafers in the silicon wafer flower basket in each specific embodiment. The position change can make the upper and lower silicon wafers stick to each other, and a water film is formed between the silicon wafers, so as to realize the single-sided texturing of the silicon wafers. the scope of protection.

As can be seen from the above technical solutions, compared with the prior art, the present invention has the following beneficial effects:

The silicon wafer flower basket has a simple structure, and can realize the position change of the silicon wafer through the change of the position of the clamping teeth, thereby realizing the functions of combining and dividing the silicon wafer;

It can be used for single-sided texturing of crystalline silicon cells, which greatly increases production capacity and reduces production costs.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (10)

1. A silicon wafer basket of flowers comprises a first supporting plate and a second supporting plate which are arranged oppositely, and a plurality of stand columns which are arranged between the first supporting plate and the second supporting plate, wherein a plurality of clamping teeth are arranged on the stand columns;

the change of the position of the second latch comprises at least one of horizontal telescopic motion, plane rotation motion and vertical lifting motion of the second latch;

the silicon wafer basket of flowers still includes:

the driving mechanism is used for realizing at least one of horizontal telescopic motion, plane rotation motion and vertical lifting motion of the second latch;

and the control mechanism is used for controlling at least one of the distance of the horizontal telescopic motion, the angle of plane rotation and the distance of vertical lifting motion of the second latch.

2. The silicon wafer basket according to claim 1, wherein the first latch and the second latch are spaced apart from each other on the post.

3. The silicon wafer basket according to claim 1, wherein the posts comprise a first post and a second post, the first latch being mounted on the first post and the second latch being mounted on the second post.

4. The silicon wafer basket according to claim 3, wherein the second vertical post is mounted inside and/or outside the first vertical post.

5. The silicon wafer basket according to claim 1, wherein the second latch comprises a first end disposed on the post and a second end distal from the post, and wherein the second latch has a thickness that decreases from the first end to the second end.

6. The silicon wafer basket according to claim 5, wherein the height of the upper surface of the second latch decreases from the first end to the second end.

7. The silicon wafer basket according to claim 6, wherein the height of the lower surface of the second latch gradually increases from the first end to the second end.

8. The silicon wafer basket according to claim 6, wherein the lower surface of the second latch is planar.

9. The controller for the silicon wafer basket according to any one of claims 1 to 8, wherein the controller is configured to control the change of the position of the second latch, so that the position of the silicon wafer carried on the second latch in the vertical direction changes along with the change of the position of the second latch.

10. The controller of claim 9, wherein the controller controls the change in the position of the second latch through wired or wireless control.

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