CN108500467A - Laser marking device - Google Patents
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- CN108500467A CN108500467A CN201810488264.4A CN201810488264A CN108500467A CN 108500467 A CN108500467 A CN 108500467A CN 201810488264 A CN201810488264 A CN 201810488264A CN 108500467 A CN108500467 A CN 108500467A
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- 238000010330 laser marking Methods 0.000 title claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 52
- 238000012546 transfer Methods 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 7
- 238000005070 sampling Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 230000008450 motivation Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 8
- 238000005086 pumping Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
一种激光打标设备,包括工作台、安装在所述工作台上的物料进给装置、设置在所述物料进给装置上的激光器、及设置在所述物料进给装置上的检测机构;所述物料进给装置包括X轴驱动机构、连接所述X轴驱动机构的Y轴驱动机构、及连接所述Y轴驱动机构的承载板;所述检测机构包括设置在所述物料进给装置上的初定位相机及设置在所述物料进给装置上的精定位相机;所述初定位相机、所述精定位相机与所述激光器对应设置;所述精定位相机的摄像口靠近所述激光器的输出端设置。通过初定位相机对载片的位置进行初步检测,及激光器及精定位相机对相邻微小元器件分别同步进行激光打标及定位,从而提高了激光打标设备对微小元器件的激光打标效率。
A laser marking device, comprising a workbench, a material feeding device installed on the workbench, a laser arranged on the material feeding device, and a detection mechanism arranged on the material feeding device; The material feeding device includes an X-axis driving mechanism, a Y-axis driving mechanism connected to the X-axis driving mechanism, and a bearing plate connected to the Y-axis driving mechanism; the detection mechanism includes a The initial positioning camera on the top and the fine positioning camera arranged on the material feeding device; the initial positioning camera, the fine positioning camera and the laser are set correspondingly; the camera port of the fine positioning camera is close to the laser output settings. Preliminary detection of the position of the carrier through the initial positioning camera, and the laser marking and positioning of the adjacent micro components are carried out synchronously by the laser and the fine positioning camera, thereby improving the laser marking efficiency of the laser marking equipment for micro components .
Description
技术领域technical field
本发明涉及激光打标控制技术,特别是涉及一种激光打标设备。The invention relates to laser marking control technology, in particular to a laser marking device.
背景技术Background technique
随着对电子产品的质量可靠性要求提高,要求对于电子产品中的微小元器件实行单独品质管理,需要对每一个元器件实行单独编号作为其身份认证,从而确保每一个元器件的产生、检测信息记录在案,达到品质跟踪的目的。这是一个之前没有的来自高端电子产品的需求。然而,现有的激光打标设备一般对同一被打标的产品同时进行定位及激光打标,导致效率低下,不适宜进行电子产品中的微小元器件的激光打标。With the increasing requirements for the quality and reliability of electronic products, it is required to implement individual quality management for tiny components in electronic products, and it is necessary to implement a separate number for each component as its identity authentication, so as to ensure the production and testing of each component The information is recorded to achieve the purpose of quality tracking. This is a demand from high-end electronic products that did not exist before. However, the existing laser marking equipment generally performs positioning and laser marking on the same marked product at the same time, resulting in low efficiency, and is not suitable for laser marking of tiny components in electronic products.
发明内容Contents of the invention
基于此,有必要针对现有的激光打标设备效率较低的问题,提供一种可对不同微小元器件同步进行定位及打标的激光打标设备。Based on this, it is necessary to provide a laser marking device that can simultaneously position and mark different tiny components to solve the problem of low efficiency of existing laser marking devices.
一种激光打标设备,包括工作台、安装在所述工作台上的物料进给装置、设置在所述物料进给装置上的激光器、及设置在所述物料进给装置上的检测机构;所述物料进给装置包括X轴驱动机构、连接所述X轴驱动机构的Y轴驱动机构、及连接所述Y轴驱动机构的承载板;所述检测机构包括设置在所述物料进给装置上的初定位相机及设置在所述物料进给装置上的精定位相机;所述初定位相机、所述精定位相机与所述激光器对应设置;所述精定位相机的摄像口靠近所述激光器的输出端设置。A laser marking device, comprising a workbench, a material feeding device installed on the workbench, a laser arranged on the material feeding device, and a detection mechanism arranged on the material feeding device; The material feeding device includes an X-axis driving mechanism, a Y-axis driving mechanism connected to the X-axis driving mechanism, and a bearing plate connected to the Y-axis driving mechanism; the detection mechanism includes a The initial positioning camera on the top and the fine positioning camera arranged on the material feeding device; the initial positioning camera, the fine positioning camera and the laser are set correspondingly; the camera port of the fine positioning camera is close to the laser output settings.
上述激光打标设备,通过初定位相机对载片的位置进行初步检测,及激光器及精定位相机对相邻微小元器件分别同步进行激光打标及定位,从而提高了激光打标设备对微小元器件的激光打标效率。The above-mentioned laser marking equipment performs preliminary detection of the position of the carrier through the initial positioning camera, and the laser and the fine positioning camera perform laser marking and positioning on adjacent tiny components simultaneously, thereby improving the accuracy of the laser marking equipment for tiny components. Device laser marking efficiency.
在其中一个实施例中,所述检测机构还包括反射镜;所述精定位相机水平设置,所述反射镜连接所述精定位相机设有摄像口的一端。In one embodiment, the detection mechanism further includes a mirror; the fine positioning camera is arranged horizontally, and the mirror is connected to one end of the fine positioning camera provided with an imaging port.
在其中一个实施例中,所述检测机构还包括抽检相机,所述抽检相机设置在所述初定位相机与所述激光器之间。In one of the embodiments, the detection mechanism further includes a random inspection camera, and the random inspection camera is arranged between the preliminary positioning camera and the laser.
在其中一个实施例中,所述X轴驱动机构包括X轴丝杆组件、连接所述X 轴丝杆组件的X轴电机、连接所述X轴丝杆组件的X轴滑块、及连接所述X轴滑块的第一转接板;所述X轴电机通过所述X轴丝杆组件驱动所述X轴滑块进行直线移动,同时,所述第一转接板跟随所述X轴滑块移动;所述Y轴驱动机构包括Y轴丝杆组件、连接所述Y轴丝杆组件的Y轴电机、连接所述Y轴丝杆组件的Y轴滑块、及连接所述Y轴滑块的第二转接板;所述Y轴电机通过所述Y 轴丝杆组件驱动所述Y轴滑块进行直线移动,同时,所述第二转接板跟随所述Y 轴滑块移动。In one of the embodiments, the X-axis drive mechanism includes an X-axis screw assembly, an X-axis motor connected to the X-axis screw assembly, an X-axis slider connected to the X-axis screw assembly, and the X-axis slider connected to the X-axis screw assembly. The first adapter plate of the X-axis slider; the X-axis motor drives the X-axis slider to move linearly through the X-axis screw assembly, and at the same time, the first adapter plate follows the X-axis The slider moves; the Y-axis drive mechanism includes a Y-axis screw assembly, a Y-axis motor connected to the Y-axis screw assembly, a Y-axis slider connected to the Y-axis screw assembly, and a Y-axis The second adapter plate of the slider; the Y-axis motor drives the Y-axis slider to move linearly through the Y-axis screw assembly, and at the same time, the second adapter plate moves with the Y-axis slider .
在其中一个实施例中,所述物料转移装置还包括转动机构,所述转动机构包括安装在所述第二转接板上的基座、及转动设置在所述基座上的转盘;所述承载板安装在所述转盘上。In one of the embodiments, the material transfer device further includes a rotating mechanism, the rotating mechanism includes a base installed on the second adapter plate, and a turntable mounted on the base; The carrying plate is mounted on the turntable.
在其中一个实施例中,还包括立架,所述激光器、所述检测机构通过所述立架安装在所述工作台上;所述立架上连接有横向条,所述横向条的一端延伸至所述物料进给装置上方;所述初定位相机安装在所述横向条上。In one of the embodiments, a stand is also included, and the laser and the detection mechanism are installed on the workbench through the stand; a transverse bar is connected to the stand, and one end of the transverse bar extends above the material feeding device; the initial positioning camera is installed on the transverse bar.
在其中一个实施例中,还包括安装在所述立架一侧的Z轴驱动机构,所述Z 轴驱动机构包括连接所述立架的Z轴丝杆组件、连接所述Z轴丝杆组件的Z轴电机、连接所述Z轴丝杠组件的Z轴滑块、及连接所述Z轴滑块的支撑台;所述Z轴电机通过所述Z轴丝杆组件驱动所述Z轴滑块进行直线移动,同时,所述支撑台跟随所述Z轴滑块移动;所述激光器及所述精定位相机安装在所述支撑台上。In one of the embodiments, it also includes a Z-axis driving mechanism installed on one side of the stand, and the Z-axis driving mechanism includes a Z-axis screw assembly connected to the stand, a Z-axis screw assembly connected to the The Z-axis motor, the Z-axis slider connected to the Z-axis screw assembly, and the support table connected to the Z-axis slider; the Z-axis motor drives the Z-axis slider through the Z-axis screw assembly The block moves linearly, and at the same time, the support table moves along with the Z-axis slider; the laser and the fine positioning camera are installed on the support table.
在其中一个实施例中,还包括供料机构,所述供料机构包括安装在所述工作台上的机械手及连接所述机械手的活动端的吸附夹具。In one of the embodiments, a feeding mechanism is further included, and the feeding mechanism includes a manipulator installed on the workbench and an adsorption clamp connected to the movable end of the manipulator.
在其中一个实施例中,还包括安装在所述工作台上的物料转移装置,所述物料转移装置包括安装在所述工作台上的承料底板、安装所述承料底板上的升举机构、及设置在所述升举机构一侧的下接机构。In one of the embodiments, it also includes a material transfer device installed on the workbench, the material transfer device includes a material receiving base installed on the workbench, a lifting mechanism installed on the material receiving base , and a lower connecting mechanism arranged on one side of the lifting mechanism.
在其中一个实施例中,还包括抽气机构,所述抽气机构的抽气入口与所述激光器的输出口对应设置。In one of the embodiments, a pumping mechanism is further included, and the pumping inlet of the pumping mechanism is arranged correspondingly to the output port of the laser.
附图说明Description of drawings
图1为本发明的一较佳实施例的激光打标设备的立体示意图;Fig. 1 is the three-dimensional schematic diagram of the laser marking equipment of a preferred embodiment of the present invention;
图2为图1所示的激光打标设备在另一角度的立体示意图;Fig. 2 is a three-dimensional schematic diagram of the laser marking device shown in Fig. 1 at another angle;
图3为图1中的物料进给装置的立体示意图;Fig. 3 is a three-dimensional schematic diagram of the material feeding device in Fig. 1;
图4为图1中的物料进给装置的分解示意图;Fig. 4 is an exploded schematic view of the material feeding device in Fig. 1;
图5为图1中的激光器及检测机构的立体示意图;Fig. 5 is a three-dimensional schematic diagram of the laser and the detection mechanism in Fig. 1;
图6为图1中的激光器及检测机构在另一角度的立体示意图;Fig. 6 is a three-dimensional schematic diagram of the laser and the detection mechanism in Fig. 1 at another angle;
图7为图1中的供料机构的立体示意图;Fig. 7 is a three-dimensional schematic diagram of the feeding mechanism in Fig. 1;
图8为图1中的供料机构在另一角度的立体示意图;Fig. 8 is a three-dimensional schematic diagram of the feeding mechanism in Fig. 1 at another angle;
图9为图1所示的激光打标设备的工作示意图。FIG. 9 is a working diagram of the laser marking equipment shown in FIG. 1 .
具体实施方式Detailed ways
为了便于理解本发明,下面将对本发明进行更全面的描述。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
请参阅图1及图2为本发明一较佳实施方式的激光打标设备100,用于电子产品中的微小元器件进行激光打标,其中微小元器件排列在载片上。该激光打标设备100包括工作台10、安装在工作台10上的物料进给装置20、设置在物料进给装置20上的激光器30、及设置在物料进给装置20上的检测机构40;物料进给装置20包括X轴驱动机构21、连接X轴驱动机构21的Y轴驱动机构22、及连接Y轴驱动机构22的承载板23;检测机构40包括设置在物料进给装置20 上的初定位相机41及设置在物料进给装置20上的精定位相机42;初定位相机41、精定位相机42与激光器30对应设置;精定位相机42的摄像口靠近激光器 30的输出端设置。进行激光打标加工时,载片放置在承载板23上,物料进给装置20对微小元器件及载片进行移动及位置调整;初定位相机41对载片的位置进行初步检测,以方便物料进给装置20将载片移动至与精定位相机42及激光器30对应的位置;激光器30及精定位相机42对相邻微小元器件分别同步进行激光打标及定位,从而提高了激光打标设备100对微小元器件的激光打标效率。Please refer to FIG. 1 and FIG. 2 , which shows a laser marking device 100 according to a preferred embodiment of the present invention, which is used for laser marking tiny components in electronic products, wherein the tiny components are arranged on a carrier. The laser marking equipment 100 includes a workbench 10, a material feeding device 20 installed on the workbench 10, a laser 30 arranged on the material feeding device 20, and a detection mechanism 40 arranged on the material feeding device 20; The material feeding device 20 includes an X-axis driving mechanism 21, a Y-axis driving mechanism 22 connected to the X-axis driving mechanism 21, and a bearing plate 23 connected to the Y-axis driving mechanism 22; The initial positioning camera 41 and the fine positioning camera 42 arranged on the material feeding device 20; the preliminary positioning camera 41, the fine positioning camera 42 are arranged correspondingly to the laser 30; the camera port of the fine positioning camera 42 is arranged near the output end of the laser 30. When performing laser marking processing, the carrier is placed on the carrier plate 23, and the material feeding device 20 moves and adjusts the position of the tiny components and the carrier; the initial positioning camera 41 conducts a preliminary detection of the position of the carrier to facilitate the material The feeding device 20 moves the slide to the position corresponding to the fine positioning camera 42 and the laser 30; the laser 30 and the fine positioning camera 42 perform laser marking and positioning on adjacent tiny components synchronously, thereby improving the laser marking equipment. 100 pairs of laser marking efficiency for tiny components.
请参阅图5及图6,为避免精定位相机42与激光器30在竖直方向上重叠,使精定位相机42可尽量靠近激光器30的输出口,以适应排列较为密集的微小器件,检测机构40还包括反射镜43;精定位相机42水平设置,反射镜43连接精定位相机42设有摄像口的一端。Please refer to Fig. 5 and Fig. 6, in order to avoid fine positioning camera 42 and laser device 30 to overlap on the vertical direction, make fine positioning camera 42 can be close to the output port of laser device 30 as far as possible, to adapt to the relatively dense arrangement of tiny devices, detection mechanism 40 It also includes a mirror 43; the fine positioning camera 42 is arranged horizontally, and the mirror 43 is connected to one end of the fine positioning camera 42 provided with a camera port.
处于精定位相机42下方的微小电子元件的反射光线经反射镜43反射后进入精定位相机42的摄像口;由于精定位相机42一般呈圆柱状,摄像口设置在其中一端,通过反射镜43调整入射光线的角度,从而避免因激光器30外壳的限制而影响精定位相机42的摄像口与激光器30的输出口之间的距离。The reflected light of the tiny electronic components below the fine positioning camera 42 enters the camera port of the fine positioning camera 42 after being reflected by the reflector 43; The angle of the incident light, so as to avoid affecting the distance between the imaging port of the precise positioning camera 42 and the output port of the laser 30 due to the limitation of the housing of the laser 30 .
进一步地,为确保激光器30的打标质量,实现对完成激光打标的微小元器件的抽查,检测机构40还包括抽检相机44,抽检相机44设置在初定位相机41 与激光器30之间。Further, in order to ensure the marking quality of the laser 30 and realize random inspection of the tiny components that have been marked by laser, the detection mechanism 40 also includes a random inspection camera 44 , which is arranged between the initial positioning camera 41 and the laser 30 .
当同一载片上的微小元器件全部完成激光标识码刻写后,物料进给装置20 将载片移动到抽检相机44下方,然后对载片上的部分微小元器件的标识码效果进行检测,从而确保激光器30的打标质量。After all the tiny components on the same slide have been written with laser identification codes, the material feeding device 20 moves the slide to the bottom of the sampling camera 44, and then detects the effect of the identification codes of some tiny components on the slide to ensure that the laser 30 marking quality.
为确保初定位相机41、精定位相机42、及抽检相机44的摄录效果清晰,检测机构40还包括与初定位相机41对应设置的第一光源发生器45、与精定位相机42对应设置的第二光源发生器46、及与抽检相机44对应设置的第三光源发生器47;第一光源发生器45、第二光源发生器46、及第三光源发生器47分别产生照射到微小元器件上的光线,从而保证初定位相机41、精定位相机42、及抽检相机44的摄录效果清晰,确保定位及检测效果。In order to ensure that the recording effects of the initial positioning camera 41, the fine positioning camera 42, and the sampling camera 44 are clear, the detection mechanism 40 also includes a first light source generator 45 corresponding to the initial positioning camera 41, and a first light source generator 45 corresponding to the fine positioning camera 42. The second light source generator 46 and the third light source generator 47 correspondingly arranged with the sampling camera 44; The above light, thereby ensuring the clear recording effect of the preliminary positioning camera 41, the fine positioning camera 42, and the random inspection camera 44, and ensuring the positioning and detection effect.
请参阅图3及图4,具体地,X轴驱动机构21包括X轴丝杆组件211、连接 X轴丝杆组件211的X轴电机212、连接X轴丝杆组件211的X轴滑块213、及连接X轴滑块213的第一转接板214;X轴电机212通过X轴丝杆组件211驱动 X轴滑块213进行直线移动,同时,第一转接板214跟随X轴滑块213移动;Y 轴驱动机构22包括Y轴丝杆组件221、连接Y轴丝杆组件221的Y轴电机222、连接Y轴丝杆组件221的Y轴滑块223、及连接Y轴滑块223的第二转接板224;Y轴电机222通过Y轴丝杆组件221驱动Y轴滑块223进行直线移动,同时,第二转接板224跟随Y轴滑块223移动。3 and 4, specifically, the X-axis drive mechanism 21 includes an X-axis screw assembly 211, an X-axis motor 212 connected to the X-axis screw assembly 211, and an X-axis slider 213 connected to the X-axis screw assembly 211. , and the first adapter plate 214 connected to the X-axis slider 213; the X-axis motor 212 drives the X-axis slider 213 to move linearly through the X-axis screw assembly 211, and at the same time, the first adapter plate 214 follows the X-axis slider 213 moves; the Y-axis driving mechanism 22 includes a Y-axis screw assembly 221, a Y-axis motor 222 connected to the Y-axis screw assembly 221, a Y-axis slider 223 connected to the Y-axis screw assembly 221, and a Y-axis slider 223 connected The second adapter plate 224; the Y-axis motor 222 drives the Y-axis slider 223 to move linearly through the Y-axis screw assembly 221, and at the same time, the second adapter plate 224 moves with the Y-axis slider 223.
在其中一种实施方式中,Y轴丝杆组件221安装在第一转接板214上,承载板23安装在第二转接板224上,从而可实现承载板23上平面上的精确移动。为避免载片在进行激光打标时,相对承载板23发生滑动,承载板23上设有吸附孔231,从而通过真空气源使载片可靠地贴合在承载板23上。在其中一种实施方式中,为方便调节承载板23的高度,X轴驱动机构21通过运载底板25安装在工作台10上。In one embodiment, the Y-axis screw assembly 221 is installed on the first adapter plate 214 , and the bearing plate 23 is installed on the second adapter plate 224 , so that precise movement on the plane of the bearing plate 23 can be realized. In order to prevent the carrier sheet from sliding relative to the carrier plate 23 during laser marking, the carrier plate 23 is provided with an adsorption hole 231 , so that the carrier sheet can be reliably attached to the carrier plate 23 through a vacuum air source. In one embodiment, in order to adjust the height of the carrying plate 23 conveniently, the X-axis driving mechanism 21 is installed on the workbench 10 through the carrying base 25 .
在另一实施方式中,为实现承载板23的角度调节,以避免因载片放到承载板23上时存在角度偏差,导致微小元器件上刻写的标识码偏斜,物料转移装置 80还包括转动机构24,转动机构24包括安装在第二转接板224上的基座241、及转动设置在基座241上的转盘242;承载板23安装在转盘242上,从而可通过转动机构24内部电机的驱动,实现承载板23及载片的角度调整。In another embodiment, in order to realize the angle adjustment of the carrier plate 23, so as to avoid the angle deviation when the carrier is placed on the carrier plate 23, resulting in deflection of the identification code written on the tiny components, the material transfer device 80 also includes The rotating mechanism 24, the rotating mechanism 24 includes a base 241 installed on the second adapter plate 224, and a rotating disk 242 arranged on the base 241; The drive of the motor realizes the angle adjustment of the carrier plate 23 and the carrier sheet.
请参阅图5及图6,具体地,激光打标设备100还包括立架50,激光器30、检测机构40通过立架50安装在工作台10上。立架50上连接有横向条51,横向条51的一端延伸至物料进给装置20上方,初定位相机41、抽检相机44安装在横向条51上。Please refer to FIG. 5 and FIG. 6 , specifically, the laser marking equipment 100 further includes a stand 50 through which the laser 30 and the detection mechanism 40 are installed on the workbench 10 . A horizontal bar 51 is connected to the stand 50 , and one end of the horizontal bar 51 extends above the material feeding device 20 . The initial positioning camera 41 and the random inspection camera 44 are installed on the horizontal bar 51 .
进一步地,为方便调节激光器30相对物料进给装置20的距离,以确保激光器30的打标光线能适应不同的微小元器件的高度,激光打标设备100还包括安装在立架50一侧的Z轴驱动机构60,Z轴驱动机构60包括连接立架50的Z 轴丝杆组件61、连接Z轴丝杆组件61的Z轴电机62、连接Z轴丝杠组件的Z 轴滑块63、及连接Z轴滑块63的支撑台64;Z轴电机62通过Z轴丝杆组件61 驱动Z轴滑块63进行直线移动,同时,支撑台64跟随Z轴滑块63移动;激光器30及精定位相机42安装在支撑台64上,从而通过Z轴驱动机构60机构可调整激光器30及精定位相机42相对物料进给组件的高度。Further, in order to facilitate the adjustment of the distance of the laser 30 relative to the material feeding device 20, to ensure that the marking light of the laser 30 can adapt to the heights of different tiny components, the laser marking equipment 100 also includes a The Z-axis drive mechanism 60, the Z-axis drive mechanism 60 includes a Z-axis screw assembly 61 connected to the stand 50, a Z-axis motor 62 connected to the Z-axis screw assembly 61, a Z-axis slide block 63 connected to the Z-axis screw assembly, and the support table 64 connected to the Z-axis slider 63; the Z-axis motor 62 drives the Z-axis slider 63 to move linearly through the Z-axis screw assembly 61, and at the same time, the support table 64 moves with the Z-axis slider 63; the laser 30 and precision The positioning camera 42 is installed on the support platform 64, so that the height of the laser 30 and the fine positioning camera 42 relative to the material feeding assembly can be adjusted through the Z-axis driving mechanism 60 mechanism.
具体地,为适应排列间距不同的微小元器件,检测机构40还包括微调组件 48,精定位相机42通过微调组件48连接支撑台64;微调组件48可通过螺纹件调节精定位相机42相对激光器30输出端的远近,同时,微调组件48还可通过螺纹件调节相对支撑台64的远近。Specifically, in order to adapt to the tiny components with different arrangement pitches, the detection mechanism 40 also includes a fine-tuning assembly 48, and the fine-positioning camera 42 is connected to the support table 64 through the fine-tuning assembly 48; At the same time, the fine adjustment assembly 48 can also adjust the distance relative to the supporting platform 64 through the screw.
请再次参阅图1及图2,为实现载片自动地放到承载板23上及起动地从承载板23上取出,激光打标设备100还包括供料机构70,供料机构70包括安装在工作台10上的机械手71及连接机械手71活动端的吸附夹具72,吸附夹具 72包括若干吸嘴,从而可对排列有微小元器件载片产生吸附作用。Please refer to Fig. 1 and Fig. 2 again, in order to realize that the carrier sheet is automatically placed on the carrier plate 23 and taken out from the carrier plate 23 in a start-up manner, the laser marking equipment 100 also includes a feeding mechanism 70, and the feeding mechanism 70 includes a The manipulator 71 on the workbench 10 and the adsorption jig 72 connected to the movable end of the manipulator 71, the adsorption jig 72 includes a number of suction nozzles, so as to generate adsorption effect on the carrier chips arranged with tiny components.
在放入载片前,承载板23通过X轴驱动机构21及Y轴驱动机构22移动到靠近机械手71的位置,通过机械手71活动端的移动、升降、以及吸附夹具72 的吸持作用,供料机构70将载片放置到承载板23上,然后承载板23移动到初定位相机41下方,进行初始定位及初步位置调整;当载片上的微小元器件完成激光打标后,承载板23再次移动到靠近机械手71的位置,通过机械手71活动端的移动、升降、以及吸附夹具72的吸持作用,供料机构70将载片放置到承载板23取走。Before putting in the slides, the carrier plate 23 moves to a position close to the manipulator 71 through the X-axis drive mechanism 21 and the Y-axis drive mechanism 22, and the material is fed through the movement, lifting, and the suction of the suction clamp 72 at the movable end of the manipulator 71. The mechanism 70 places the slide on the carrier plate 23, and then the carrier plate 23 moves below the initial positioning camera 41 for initial positioning and preliminary position adjustment; when the tiny components on the carrier sheet are laser marked, the carrier plate 23 moves again To a position close to the manipulator 71 , through the movement, lifting, and suction of the suction fixture 72 at the movable end of the manipulator 71 , the feeding mechanism 70 places the slides on the carrier plate 23 and takes them away.
请参阅图1、图2、图7及图8,为避免人手触碰到载片,在生产过程中,载片一般放置到专用的料盘中;为节约空间,料盘一般重叠设置;为自动化地将重叠的料盘中的载片放置到承载板23上,激光打标设备100还包括安装在工作台10上的物料转移装置80,物料转移装置80包括安装在工作台10上的承料底板81、安装承料底板81上的升举机构82、及设置在升举机构82一侧的下接机构83。Please refer to Figure 1, Figure 2, Figure 7 and Figure 8. In order to avoid touching the slides with human hands, the slides are generally placed in special trays during the production process; in order to save space, the trays are generally stacked; for Automatically place the slides in the overlapping trays on the carrier plate 23, the laser marking device 100 also includes a material transfer device 80 installed on the workbench 10, the material transfer device 80 includes a bearing installed on the workbench 10 The material bottom plate 81, the lifting mechanism 82 installed on the material receiving bottom plate 81, and the lower connection mechanism 83 arranged on one side of the lifting mechanism 82.
具体地,升举机构82包括连接连接承料底板81的第一移盘丝杆组件821、连接第一移盘丝杆组件821的第一移盘电机822、连接第一移盘丝杆组件821的第一移盘滑块823、连接第一移盘滑块823的第一上顶杆824、连接第一上顶杆 824上端的第一托板825,设置在承料底板81上的第一限位架826、设置在第一限位架826上侧的第一内推气缸827、及连接第一内推气缸827的第一分隔片 828;下接机构83包括连接连接承料底板81的第二移盘丝杆组件831、连接第二移盘丝杆组件831的第二移盘电机832、连接第二移盘丝杆组件831的第二移盘滑块833、连接第二移盘滑块833的第二上顶杆834、连接第二上顶杆834上端的第二托板835,设置在承料底板81上的第二限位架836、设置在第二限位架836上侧的第二内推气缸837、及连接第二内推气缸837的第二分隔片838。Specifically, the lifting mechanism 82 includes a first moving screw assembly 821 connected to the material receiving base 81 , a first moving motor 822 connected to the first moving screw assembly 821 , a first moving screw assembly 821 connected to the first moving screw assembly 821 The first tray slider 823, the first upper ejector pin 824 connected to the first tray slider 823, the first supporting plate 825 connected to the upper end of the first upper ejector pin 824, and the first tray 825 arranged on the receiving bottom plate 81 Limiting frame 826, the first inner push cylinder 827 that is arranged on the first limit frame 826 upper side, and the first spacer 828 that connects the first inner push cylinder 827; The second pan screw assembly 831, the second pan motor 832 connected to the second pan screw assembly 831, the second pan slider 833 connected to the second pan screw assembly 831, the second pan slider connected to The second upper push rod 834 of the block 833, the second supporting plate 835 connected to the upper end of the second upper push rod 834, the second limit frame 836 arranged on the material receiving base plate 81, and the second limit frame 836 upper side The second push-in cylinder 837 and the second separator 838 connected to the second push-in cylinder 837.
装载有待进行激光打标的微小元器件的重叠料盘放置在第一托板825上,同时在初始时在第二托板835上放置一空料盘;通过第一移盘电机822、第一移盘丝杆组件821、第一移盘滑块823及第一上顶杆824,第一托板825将重叠料盘的顶层上升到适当位置,然后供料机构70依次将升举机构82中的顶层料盘中的载片取出,并放置到承载板23上进行打标加工,完成打标的载片放置到下接机构83上的料盘中;升举机构82中的顶层料盘空出后,供料机构70通过吸附夹具72将顶层料盘转移到下接机构83上,第一分隔片828对次顶层的料盘进行限制,从而避免次顶层的料跟随顶层料盘升起。The stacked trays loaded with tiny components to be laser marked are placed on the first pallet 825, and an empty tray is initially placed on the second pallet 835; Disc screw rod assembly 821, the first moving disc slider 823 and the first upper ejector rod 824, the first supporting plate 825 will raise the top layer of the overlapping material disc to a proper position, and then the feeding mechanism 70 will successively lift the top layer of the lifting mechanism 82 The carrier in the top layer tray is taken out, and placed on the carrying plate 23 for marking processing, and the marked carrier sheet is placed in the tray on the lower connection mechanism 83; the top layer tray in the lifting mechanism 82 is emptied Finally, the feeding mechanism 70 transfers the top layer tray to the lower connection mechanism 83 through the adsorption fixture 72, and the first separator 828 restricts the second top layer tray, thereby preventing the second top layer material from following the top layer tray to rise.
请再次参阅图5及图6,进一步为,为消除激光器30对微小元器件打标时所产生的气体,激光打标设备100还包括抽气机构90,抽气机构90的抽气入口与激光器30的输出口对应设置。Please refer to Fig. 5 and Fig. 6 again, further, in order to eliminate the gas generated when the laser 30 marks tiny components, the laser marking equipment 100 also includes an air pumping mechanism 90, the air pumping inlet of the air pumping mechanism 90 is connected with the laser The output port of 30 corresponds to the setting.
抽气机构90通过内部电机及活塞运动以实现对抽气入口附近气体的吸入。The pumping mechanism 90 realizes the suction of the gas near the pumping inlet through the movement of the internal motor and the piston.
请参阅图9,具体地,激光器30的输出端与精定位相机42的摄像口之间的距离与载片上相邻的微小元器件之间的距离对应;精定位相机42通过图像录取获得位于其下方的微小电子元件的实际位置;同时,激光器30输出打标光线,对位于激光器30输出口下方的微小电子元件的表面刻写标识码,在本实施方式中,激光器30对位于激光器30输出口下方的微小电子元件的表面刻写二维码;在精定位相机42下方完成定位后的微小电子元件通过物料进给装置20移动到激光器30输出口下方,且在移动过程中物料进给装置20根据精定位相机42所获得的微小电子元件的实际位置而调整在X轴方向及Y轴方向上的移动距离,从而使激光器30可准确对微小电子元件的表面进行标识码刻写;在精定位相机 42下方的微小电子元件移动到激光器30输出口下方过程中,另一微小电子元件同步移动到精定位相机42下方,从而使激光打标设备100的定位及激光打标工序对载片上的相邻微小电子元件同步进行,从而提高了激光打标设备100微小元器件的激光打标效率,有助于实现微小元器件的激光打标的单独品质管理。Please refer to Fig. 9, specifically, the distance between the output end of the laser 30 and the imaging port of the fine positioning camera 42 corresponds to the distance between the adjacent tiny components on the slide; The actual position of the tiny electronic components below; Simultaneously, the laser 30 outputs the marking light, and the surface of the tiny electronic components located below the output port of the laser 30 is engraved with an identification code. In this embodiment, the laser 30 is located below the output port of the laser 30 Two-dimensional codes are written on the surface of the tiny electronic components; after the positioning is completed under the fine positioning camera 42, the tiny electronic components are moved to the bottom of the output port of the laser 30 through the material feeding device 20, and during the movement, the material feeding device 20 according to the precision Position the actual position of the tiny electronic component obtained by the camera 42 to adjust the moving distance in the X-axis direction and the Y-axis direction, so that the laser 30 can accurately write the identification code on the surface of the tiny electronic component; under the fine positioning camera 42 During the process of moving one of the tiny electronic components below the output port of the laser 30, another tiny electronic component synchronously moves below the fine positioning camera 42, so that the positioning of the laser marking equipment 100 and the laser marking process are accurate to the adjacent tiny electronic components on the slide. The components are carried out synchronously, thereby improving the laser marking efficiency of the tiny components of the laser marking equipment 100, and helping to realize the independent quality management of the laser marking of the tiny components.
具体地,检测机构40还包括控制器49,控制器49根据精定位相机42的摄录图像而确定精定位相机42的摄像口下的微小元器件的实际位置,并根据微小元器件的实际位置而计算出X轴驱动机构21及Y轴驱动机构22所需的移动量,以确保精定位相机42下方的微小电子元件准确地移动到激光器30输出口下方,相对于一般方法,本实施方式在将微小元器件移动到激光器30输出口下方的同时进行位置的调整,从而提高了激光打标设备100的运行效率。Specifically, the detection mechanism 40 also includes a controller 49, and the controller 49 determines the actual position of the tiny component under the camera port of the fine positioning camera 42 according to the captured image of the fine positioning camera 42, and determines the actual position of the tiny component according to the actual position of the tiny component And calculate the amount of movement required by the X-axis drive mechanism 21 and the Y-axis drive mechanism 22, to ensure that the tiny electronic components below the fine positioning camera 42 are accurately moved below the output port of the laser 30. Compared with the general method, this embodiment is The position is adjusted while the tiny component is moved below the output port of the laser 30 , thereby improving the operating efficiency of the laser marking device 100 .
本实施例中,通过初定位相机对载片的位置进行初步检测,及激光器及精定位相机对相邻微小元器件分别同步进行激光打标及定位,从而提高了激光打标设备对微小元器件的激光打标效率。In this embodiment, the initial positioning camera is used to initially detect the position of the slide, and the laser and the fine positioning camera are used to perform laser marking and positioning of adjacent tiny components simultaneously, thereby improving the accuracy of the laser marking equipment for tiny components. laser marking efficiency.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.
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| CN109332905A (en) * | 2018-11-06 | 2019-02-15 | 广东鼎泰机器人科技有限公司 | A kind of laser marking component |
| CN109703222A (en) * | 2018-12-14 | 2019-05-03 | 杭州新松机器人自动化有限公司 | A kind of safety door intelligence automatic code marking device and its code printing method |
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